WO2021189491A1 - 显示模组及显示装置 - Google Patents

显示模组及显示装置 Download PDF

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Publication number
WO2021189491A1
WO2021189491A1 PCT/CN2020/081874 CN2020081874W WO2021189491A1 WO 2021189491 A1 WO2021189491 A1 WO 2021189491A1 CN 2020081874 W CN2020081874 W CN 2020081874W WO 2021189491 A1 WO2021189491 A1 WO 2021189491A1
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WO
WIPO (PCT)
Prior art keywords
pad
substrate
reinforcing plate
display
area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2020/081874
Other languages
English (en)
French (fr)
Inventor
白枭
杨盛际
卢鹏程
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to CN202080000406.3A priority Critical patent/CN113906831B/zh
Priority to PCT/CN2020/081874 priority patent/WO2021189491A1/zh
Priority to EP20900711.1A priority patent/EP4132230A4/en
Priority to US17/260,250 priority patent/US11980069B2/en
Publication of WO2021189491A1 publication Critical patent/WO2021189491A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of flexible or folded printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
    • H10K77/10—Substrates, e.g. flexible substrates
    • H10K77/111—Flexible substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy
    • Y02E10/549—Organic PV cells

Definitions

  • the embodiments of the present disclosure relate to the field of display technology, and in particular, to a display module and a display device.
  • the embodiments of the present disclosure provide a display module and a display device, which have good signal transmission performance.
  • a display module which includes:
  • the display substrate includes a silicon substrate, a driving circuit, and a first pad. At least part of the driving circuit is embedded on the silicon substrate.
  • the driving circuit includes a transistor. The transistor has a semiconductor layer. Inside the silicon substrate, the first pad is electrically connected to the driving circuit;
  • a flexible circuit board the flexible circuit board includes a flexible substrate, a first wiring layer, and a first reinforcement board, the first wiring layer is formed on the flexible substrate, and the first wiring layer includes a main wiring portion And a second pad, the second pad is electrically connected to the main wiring portion and extends in a direction away from the main wiring portion, and the second pad and the first pad are passed through conductive glue Electrical connection;
  • the first reinforcing plate is formed on the side of the first wiring layer away from the flexible substrate;
  • the orthographic projection of the first reinforcing plate on the flexible substrate covers the main wiring portion The orthographic projection on the flexible substrate does not overlap with the orthographic projection of the second pad on the flexible substrate;
  • the first reinforcing plate is located outside the display substrate and has a non-zero distance between it and the display substrate.
  • the distance between the first reinforcing plate and the display substrate is not less than 200 ⁇ m.
  • the flexible circuit board further includes a second reinforcing plate located on a side of the flexible base away from the first wiring layer, and
  • the second reinforcing plate has at least a first reinforcing area, and the orthographic projection of the first reinforcing area on the flexible substrate overlaps the orthographic projection of the second pad on the flexible substrate.
  • the second reinforcing plate further has a second reinforcing area, and the second reinforcing area and the first reinforcing area are located between the second pad They are arranged and connected in sequence in the extending direction, and the orthographic projection of the second reinforcing area on the flexible substrate is located within the orthographic projection of the first reinforcing plate on the flexible substrate.
  • the size of the second reinforcement region in the extension direction of the second pad is not less than 500 ⁇ m.
  • the first reinforcement area and the second reinforcement area are integrally formed.
  • the flexible circuit board further includes a second wiring layer and a third reinforcing plate, and the second wiring layer is located on a side of the flexible substrate away from the first wiring layer.
  • the third reinforcing plate is formed on the side of the second wiring layer away from the flexible substrate, and is electrically connected to the main wiring portion through a via;
  • the orthographic projection of the second wiring layer on the flexible substrate is located within the orthographic projection of the first reinforcing plate on the flexible substrate, and is positioned on the third reinforcing plate on the flexible substrate. In orthographic projection.
  • a plurality of the via holes are provided.
  • the third reinforcing plate covers a side of the second wiring layer facing the second reinforcing area.
  • the conductive adhesive is anisotropic conductive adhesive.
  • the display substrate has a display area and a binding area located on at least one side of the display area, and the first pad is located in the binding area;
  • the display substrate further includes a light-emitting element located in the display area, and the light-emitting element is formed on a side of the driving circuit away from the base substrate and electrically connected to the driving circuit.
  • a display module which includes:
  • the display substrate includes a silicon substrate, a driving circuit, and a first pad. At least part of the driving circuit is embedded on the silicon substrate.
  • the driving circuit includes a transistor. The transistor has a semiconductor layer. Inside the silicon substrate, the first pad is electrically connected to the driving circuit;
  • a flexible circuit board includes a flexible substrate and a first wiring layer formed on the flexible substrate.
  • the first wiring layer includes a main wiring portion and a second pad.
  • the second pad is connected to the main wiring
  • the portion is electrically connected and extends in a direction away from the main wiring portion, and the second pad and the first pad are electrically connected by conductive glue;
  • the conductive adhesive covers the first pad and the edge area of the display substrate close to the main wiring portion.
  • the conductive adhesive extends in a direction close to the main wiring portion and extends beyond the border of the display substrate, and the conductive adhesive extends beyond the border of the display substrate.
  • the part is not less than 200 ⁇ m.
  • the flexible circuit board further includes a first reinforcing plate and a second reinforcing plate,
  • the first reinforcing plate is formed on a side of the first wiring layer away from the flexible substrate, and the orthographic projection of the first reinforcing plate on the flexible substrate covers the main wiring part in the The orthographic projection on the flexible substrate, and does not overlap with the orthographic projection of the second pad on the flexible substrate;
  • the second reinforcing plate is located on a side of the flexible base away from the first wiring layer, the second reinforcing plate has a first reinforcing area and a second reinforcing area, the first reinforcing area
  • the orthographic projection on the flexible substrate overlaps the orthographic projection of the second pad on the flexible substrate; the second reinforcing area and the first reinforcing area are on the second pad They are arranged and connected in sequence in the extending direction, and the orthographic projection of the second reinforcing area on the flexible substrate is located within the orthographic projection of the first reinforcing plate on the flexible substrate.
  • the size of the second reinforcement region in the extension direction of the second pad is not less than 500 ⁇ m.
  • a display device which includes any of the above-mentioned display modules.
  • FIG. 1a is a schematic diagram of assembling a display substrate and a flexible circuit board according to an embodiment of the disclosure
  • FIG. 1b is a schematic top view of a display substrate shown in an embodiment of the disclosure.
  • Fig. 1c is a schematic bottom view of a flexible circuit board shown in an embodiment of the disclosure.
  • FIG. 2 is a schematic partial side view of a display module shown in the related art
  • 3a and 3b are schematic cross-sectional views of the display module shown in the embodiment of the disclosure.
  • FIG. 4 is a schematic partial cross-sectional view of a display substrate shown in an embodiment of the disclosure.
  • on can mean that one layer is directly formed or disposed on another layer, or can mean a layer A layer is formed indirectly or arranged on another layer, that is, there are other layers between the two layers.
  • an embodiment of the present disclosure provides a display module, which may include a display substrate 10 and a flexible circuit board 20, specifically:
  • the display substrate 10 has a display area 10a and a bonding area 10b located on at least one side of the display area 10a, and the bonding area 10b is provided with a first pad 101.
  • the first pad 101 may be a single-layer or multi-layer structure, and the first pad 101 may be made of materials such as metal or alloy, for example: a single-layer or multi-layer metal formed of copper, molybdenum, aluminum, titanium, etc.
  • the structure, but not limited to this, the first pad 101 can also be made of other conductive materials.
  • the first pad 101 is usually used for bonding with external components (such as the flexible circuit board 20) after the device is fabricated in the display area 10a to provide the display substrate 10 with signals, such as power supply voltage signals.
  • the first pad 101 can be arranged in the same layer as the conductive structure in the display area 10a to save process.
  • the first pad 101 can be arranged in the same layer as the conductive layer 107 of the top layer (farthest from the base substrate) below the light-emitting element 104 in the display area 10a to facilitate the subsequent bonding process.
  • the "same layer arrangement" in the embodiments of the present disclosure means that multiple structures are formed from the same material film through the same or different patterning processes, and thus have the same material.
  • the thickness of the display substrate 10 may be 0.5 mm to 1 mm, such as 0.5 mm, 0.75 mm, 0.1 mm, etc., but not limited to this, the thickness of the display substrate 10 may also be other values, depending on the specific situation.
  • the width of the first pad 101 may be 60 ⁇ m to 80 ⁇ m, such as 60 ⁇ m, 70 ⁇ m, 80 ⁇ m, etc., and the length of the first pad 101 may be 480 ⁇ m to 520 ⁇ m, such as 480 ⁇ m, 500 ⁇ m, 520 ⁇ m, etc., but not limited thereto
  • the width and length of the first pad 101 can also be other values, depending on the specific situation.
  • the distance between the first pad 101 and the boundary of the first pad 101 far away from the center of the display substrate 10 in the display substrate 10 is 50 ⁇ m to 70 ⁇ m, such as 50 ⁇ m, 60 ⁇ m, 70 ⁇ m, etc., but is not limited to this, and can also be Other values depend on specific circumstances.
  • the thickness refers to the dimension in the first direction Z as shown in Figure 1a, Figure 3a, and Figure 3b
  • the length refers to the dimension in Figure 1b, Figure 3b
  • the dimensions in the second direction X shown in 1c, FIGS. 3a, and 3b, and the width refers to the dimensions in the third direction Y as shown in FIGS. 1b and 1c.
  • the flexible circuit board 20 includes a flexible substrate 201, a first wiring layer, and a first reinforcing plate 203; the first wiring layer is formed on the flexible substrate 201, and the first wiring layer may include a main wiring portion 202b And the second pad 202a, the first reinforcing plate 203 is formed on the side of the first wiring layer away from the flexible substrate 201.
  • the orthographic projection of the main wiring portion 202b on the flexible substrate 201 is located within the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201.
  • the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201 covers the main The orthographic projection of the wiring portion 202b on the flexible substrate 201; the first reinforcing plate 203 can protect the main wiring portion 202b on the flexible circuit board 20, and in addition, it can also ensure the structural stability of the flexible circuit board 20 It is convenient for the overall assembly of the product.
  • the second pad 202a is electrically connected to the main wiring portion 202b and extends in a direction away from the main wiring portion 202b; wherein, the second pad 202a is used for electrically connecting with the first pad 101 in the display substrate 10, Specifically, it can be electrically connected through the conductive glue 3; since the second pad 202a needs to be electrically connected to the second pad 202a through the conductive glue 3, the orthographic projection of the second pad 202a on the flexible substrate 201 and the first reinforcement The orthographic projection of the board 203 on the flexible substrate 201 does not overlap, that is, the second pad 202a is exposed relative to the first reinforcing board 203, so as to achieve the binding between the second pad 202a and the first pad 101, thereby The flexible circuit board 20 and the display substrate 10 are electrically connected.
  • the orthographic projection on the flexible substrate 201 mentioned in the embodiments of the present disclosure specifically refers to the orthographic projection on the central horizontal plane of the flexible substrate 201
  • the central horizontal plane refers to the horizontal placement on the flexible circuit board.
  • a plane located at the center of the flexible substrate 201 when there is no bending, and the central horizontal plane is a plane perpendicular to the first direction Z.
  • the bonding area 10b of the display substrate 10 may be provided with a plurality of first pads 101 arranged at intervals in the third direction Y.
  • the directions Z are perpendicular to each other; and the first wiring layer of the flexible circuit board 20 may also have a plurality of second pads 202a arranged at intervals in the third direction Y.
  • the length direction of the first pad 101 and the second pad 202a is the second direction X shown in FIG. 1b and FIG. 1c; the second direction X is perpendicular to the third direction Y and the first direction Z; and each One second pad 202a corresponds to one first pad 101 for bonding.
  • the flexible substrate 201 and the first reinforcing plate 203 in the flexible circuit board 20 may be a single-layer structure or a multilayer structure; and the flexible substrate 201 and the first reinforcing plate 203 may adopt PI (polyimide Amine) and other materials.
  • the first wiring layer can be made of materials such as Al (aluminum) or Cu (copper).
  • the conductive adhesive 3 may be an anisotropic conductive film (ACF).
  • the anisotropic conductive film uses conductive particles 30 to connect the second pad 202a of the flexible circuit board 20 with the first pad 202a of the display substrate 10.
  • the bonding pad 101 is bound to electrically conduct the flexible circuit board 20 and the display substrate 10.
  • the flexible substrate 201 Since the anisotropic conductive adhesive 3 is only conductive in the thickness direction of the flexible substrate 201, the flexible substrate 201 The thickness direction is the first direction Z shown in FIGS. 3a and 3b; therefore, it is possible to avoid conduction and short circuits between adjacent pads in the horizontal direction, so as to ensure the electrical connection between the flexible circuit board 20 and the display substrate 10. Sexual connection stability.
  • the anisotropic conductive adhesive only conducts in the thickness direction of the flexible substrate 201, in the process of realizing the binding of multiple pairs of the first pad 101 and the second pad 202a, the anisotropy can be set on the entire surface. Conductive glue to reduce the difficulty of binding.
  • the first wiring layer is usually made of materials such as Al (aluminum) or Cu (copper)
  • the part not covered by the first reinforcing plate 203 (for example, the second pad 202a) is prone to oxidation.
  • the second pad 202a has good conductivity, and an anti-oxidation film layer with good conductivity, such as a gold (Au) material film, can be coated on the second pad 202a. Since the second pad 202a is coated with an anti-oxidation film layer, the thickness of the second pad 202a is greater than the thickness of the main wiring portion 202b, as shown in FIG. 3a.
  • the main wiring portion 202b and the second pad 202a can be connected by a transition portion 202c.
  • the transition portion 202c and the second pad 202a have the same structure, which can be understood as the transition portion 202c and the second pad 202a.
  • the two pads 202a are integrally formed.
  • the first reinforcing plate 203 can be made to cover the transition portion 202c to ensure the first The reinforcing plate 203 can completely cover the main wiring portion 202b to prevent the main wiring portion 202b from being exposed.
  • the thickness of the first reinforcing plate 203 may be greater than the thickness of the second pad 202a.
  • the second pad 202a will be close to the first pad.
  • the part of the reinforcing plate 203 warps, as shown in FIG.
  • the contact impedance between the pads 101 becomes larger, which makes the electrical connection between the flexible circuit board 20 and the display substrate 10 less stable.
  • the first reinforcing plate 203 is overlapped with the edge of the display substrate 10, the first reinforcing plate 203 can be used as a retaining wall, so that part of the conductive particles 30 of the conductive adhesive 3 cannot be smoothly discharged after being squeezed. It accumulates in the dangling place, thereby deteriorating the reliability of the flexible circuit board 20.
  • the first reinforcing plate 203 is on the second pad 202a.
  • the extension direction can be located outside the display substrate 10, that is, the first reinforcing plate 203 is not overlapped at the edge of the display substrate 10, so as to avoid warpage of the second pad 202a to ensure that the second pad 202a is warped.
  • the connection area between 202a and the first pad 101 improves the bonding yield between the flexible circuit board 20 and the display substrate 10, thereby ensuring the stability of the connection between the flexible circuit board 20 and the display substrate 10, so that the display module Has good signal transmission performance.
  • the extension direction of the second pad 202a in the extension direction of the second pad 202a, it can also be understood that in the second direction X shown in FIGS. 3a and 3b, there should be a gap between the first reinforcing plate 203 and the display substrate 10.
  • Non-zero pitch that is, the edge of the first reinforcing plate 203 does not contact the edge of the display substrate 10, which can prevent the first reinforcing plate 203 from blocking the discharge of the conductive glue 3, that is, this design can ensure Part of the conductive glue 3 can be smoothly discharged during the extrusion and bonding process of the first pad 101 and the second pad 202a, so as to alleviate the accumulation of conductive particles 30 in the conductive glue 3, and ensure that the conductive particles 30 can be evenly distributed. The reliability of the flexible circuit board 20 is ensured.
  • the distance H1 between the first reinforcing plate 203 and the display substrate 10 is not less than 200 ⁇ m, so as to avoid the accumulation of conductive particles 30 in the conductive glue 3, thereby further ensuring The reliability of the flexible circuit board 20.
  • the conductive adhesive 3 covers the first pad 101 and the edge area of the display substrate 10 close to the main wiring portion 202b.
  • the conductive adhesive 3 extends in the direction close to the main wiring portion 202b and extends beyond the border of the display substrate 10.
  • the part of the conductive adhesive 3 that extends beyond the border of the display substrate 10 is not less than 200 ⁇ m, that is, the conductive adhesive 3 is close to the main
  • the distance H1 between the end surface of the wiring portion 202b and the boundary of the display substrate is not less than 200 ⁇ m; to avoid the accumulation of conductive particles 30 in the conductive glue 3, thereby further ensuring the reliability of the flexible circuit board 20.
  • the flexible circuit board 20 further includes a second reinforcing plate 204, which can be made of materials such as PI (polyimide).
  • the second reinforcing plate 204 is located on the side of the flexible substrate 201 away from the first wiring layer.
  • the second reinforcing plate 204 has at least a first reinforcing area 204a.
  • the orthographic projection of the first reinforcing area 204a on the flexible substrate 201 is The orthographic projections of the second pad 202a on the flexible substrate 201 overlap, and this design can increase the structural strength of the area where the second pad 202a is provided in the flexible circuit board 20.
  • the second reinforcing plate 204 may also have a second reinforcing area 204b, and the second reinforcing area 204b and the first reinforcing area 204a are sequentially arranged and connected in the extending direction of the second pad 202a, and
  • the orthographic projection of the second reinforcing area 204b on the flexible substrate 201 is located within the orthographic projection of the first reinforcing plate 203 on the flexible substrate 201, that is, a part of the second reinforcing plate 204 can also extend to the flexible circuit board
  • the area of the main wiring portion 202b is provided in the flexible circuit board 20 to avoid a sudden change in rigidity at the boundary between the area where the second pad 202a is located and the area where the main wiring portion 202b is located in the flexible circuit board 20, which may cause a sudden change in rigidity between the second pad 202a and the second pad 202a.
  • the junction is easily damaged, that is, the problem that the connection between the second bonding pad 202a and the second bonding pad 202a and the main wiring portion 202b is easily broken is avoided to ensure flexibility
  • the structural stability of the circuit board 20 during the bonding process is easily damaged.
  • the second reinforcing area 204b and the first reinforcing area 204a of the second reinforcing plate 204 can be integrally formed, so that the second reinforcing plate 204 is an integrated structure, ensuring the quality of the second reinforcing plate 204 Structural strength.
  • the dimension H2 of the second reinforcement region 204b in the extending direction of the second pad 202a is not less than 500 ⁇ m, which can also be understood as the second reinforcement region 204b in the second direction X shown in FIGS. 3a and 3b.
  • the upper dimension H2 is not less than 500 ⁇ m; it can also be understood that the length of the overlapping portion of the second reinforcing plate 204 and the first reinforcing plate 203 in the first direction Z is not less than 500 ⁇ m, so as to further prevent the second pad 202a and the first
  • the connection between the two pads 202a and the main wiring portion 202b is prone to breakage, which ensures the structural stability of the flexible circuit board 20 during the bonding process.
  • the flexible circuit board 20 may further include a second wiring layer 205 and a third reinforcing plate 206.
  • the second wiring layer 205 is located on the side of the flexible substrate 201 away from the first wiring layer, and is connected to each other through the via 207
  • the main wiring portion 202b is electrically connected.
  • the second wiring layer 205 can be made of materials such as Al (aluminum) or Cu (copper); the third reinforcing plate 206 is formed on a side of the second wiring layer 205 away from the flexible substrate 201
  • the third reinforcing plate 206 can be made of PI (polyimide) and other materials; wherein, the orthographic projection of the second wiring layer 205 on the flexible substrate 201 is located on the first reinforcing plate 203 on the flexible substrate 201 In the orthographic projection, and located in the orthographic projection of the third reinforcing plate 206 on the flexible substrate 201.
  • the flexible circuit board 20 is provided with two wiring layers to facilitate wiring, and the third reinforcing plate 206 can protect the second wiring layer 205 on the one hand, and can strengthen it on the other hand. The structural strength of the flexible circuit board 20.
  • the flexible circuit board 20 can not only be provided with two wiring layers, but also can be provided with more layers, such as three layers, four layers, etc., depending on the specific situation.
  • multiple via holes 207 for connecting the first wiring layer and the second wiring layer 205 may be provided to ensure the stability of the connection between the first wiring layer and the second wiring layer 205.
  • the flexible circuit board 20 can be bent at the fracture 208 to improve the bending ability of the flexible circuit board 20.
  • the third reinforcing plate 206 is also formed on the side of the second wiring layer 205 facing the second reinforcing region 204b to prevent the second wiring layer 205 from being exposed toward the side of the second reinforcing region 204b.
  • the oxidation of the second wiring layer 205 can be avoided, so as to ensure that the second wiring layer 205 has good conductivity; on the other hand, it can also prevent the second wiring layer 205 from accidentally touching other conductive components at the fracture 208.
  • a full-face film layer can be made on the side of the flexible substrate 201 away from the first circuit layer, and then a full-face film layer A fracture 208 is cut or etched into the layer to form a second reinforcing plate 204 and a third reinforcing plate 206 that are disconnected from each other, but not limited to this, the second reinforcing plate 204 and the third reinforcing plate 206 are also Can be formed independently, depending on the specific situation.
  • the overall thickness of the flexible circuit board 20 is less than the thickness of the display substrate 10; the thickness of the flexible circuit board is 0.1mm to 0.2mm, such as: 0.1mm, 0.15mm, 0.2mm, etc., but not limited to this
  • the thickness of the flexible circuit board 20 can also be other values, depending on the specific circumstances.
  • the length of the second pad 202a in the flexible circuit board is greater than the length of the first pad 101 in the display substrate 10; the length of the second pad 202a is 1mm to 1.5mm, such as: 1mm, 1.1mm, 1.2mm, 1.3mm , 1.4mm, 1.5mm, etc.; the width of the second pad 202a may be greater than or equal to the width of the first pad 101, the width of the second pad 202a may be 60 ⁇ m to 80 ⁇ m, such as: 60 ⁇ m, 70 ⁇ m, 80 ⁇ m And so on; but not limited to this, the length and width of the second pad 202a can also be other values, depending on the specific situation; it should be understood that the orthographic projection of the second pad 202a on the display substrate 10 can completely cover
  • the first pad 101 is used to ensure the bonding stability between the second pad 202a and the first pad 101.
  • the length of the fracture 208 between the third reinforcement plate 206 and the second reinforcement area 204b of the second reinforcement plate 204 can be 7mm to 9mm, such as 7mm, 8mm, 9mm, etc., but not Limited to this, the length of the fracture 208 can be determined according to the specific bending.
  • the display substrate 10 specifically includes a base substrate and a driving circuit; wherein:
  • the base substrate may be a silicon substrate 102, and the silicon substrate 102 is, for example, single crystal silicon or high-purity silicon.
  • the driving circuit may include a circuit structure located in the display area 10a, and may also include a circuit structure located in the binding area 10b.
  • the driving circuit may include a transistor, which has a semiconductor layer, and the semiconductor layer is located inside the silicon substrate 102.
  • the number of transistors in the driving circuit is multiple, and the transistors can be distributed not only in the display area 10a, but also in the bonding area. 10b, or distributed in other non-display areas.
  • the driving circuit of the embodiment of the present disclosure may be electrically connected to the first pad 101 of the bonding area 10b, and the first pad 101 is bonded to the second pad 202a of the flexible circuit board 20 to provide a signal to the display substrate 10, for example
  • the power supply voltage signal that is, the driving circuit may include a power supply voltage signal line (not shown in the figure), and the power supply voltage signal line may be electrically connected to the first pad 101, that is, the power supply voltage signal line may pass through the first welding
  • the disk 101 and the flexible circuit board 20 are electrically connected to the driving terminal to obtain a power supply voltage signal from the driving terminal.
  • the driving circuit may include a pixel circuit located in the display area 10a, and the pixel circuit may be formed on the silicon substrate 102 by a semiconductor process, for example: the semiconductor layer 1031 of the driving transistor 103 is formed on the silicon substrate 102 by a doping process. That is, the active layer), the source electrode 1032 and the drain electrode 1033, and the insulating layer 1034 is formed by a silicon oxidation process, and the gate electrode 1035 and the plurality of conductive layers 106, 107 are formed by a sputtering process or other processes.
  • the semiconductor layer 1031 of the driving transistor 103 is located inside the base substrate; that is, the semiconductor layer 1031 may belong to a part of the silicon substrate 102.
  • the driving circuit may also include a gate driving circuit, a data driving circuit, a data signal line, and a scanning signal line.
  • the data driving circuit and the gate driving circuit respectively pass through the data signal line and the scanning signal line and the pixel of the light-emitting element 104. Circuits are connected to provide electrical signals.
  • the data driving circuit is used to provide data signals
  • the gate driving circuit is used to provide scanning signals, and can also be further used to provide various control signals, power signals, and the like.
  • the gate driving circuit and the data driving circuit may also be integrated in the silicon substrate 102 through the aforementioned semiconductor process. That is to say, the silicon substrate 102 is used as the base substrate in the display substrate 10, and the pixel circuit, the gate driving circuit, and the data driving circuit can all be integrated on the silicon substrate 102. In this case, since the silicon-based circuit can achieve higher accuracy, the gate drive circuit and the data drive circuit can also be formed in the area corresponding to the display area 10a of the display substrate 10, and not necessarily located in the non- Display area. Among them, the gate driving circuit and the data driving circuit can adopt conventional circuit structures in the art, which are not limited in the embodiments of the present disclosure.
  • the display substrate 10 may further include a light-emitting element 104, which is formed on the side of the driving circuit away from the silicon substrate 102 and located in the display area 10a.
  • the light-emitting element 104 may be connected to the driving circuit. Electric connection.
  • the light-emitting element 104 may include an anode 1041, a light-emitting layer 1042, and a cathode 1043 sequentially formed on the driving substrate 105.
  • the anode 1041 may pass through a contact hole 108 filled with a conductive material (such as metal tungsten, etc.) and a plurality of conductive materials.
  • the layers 106 and 107 are electrically connected to the drain electrode 1033 in the driving transistor 103; as shown in FIG. 4, an insulating layer 1034 and two conductive layers 106 and 107 are shown. The number of layers is not limited.
  • multiple light-emitting elements 104 may be provided, the anodes 1041 of the multiple light-emitting elements 104 are disconnected from each other, and the cathodes 1043 of the multiple light-emitting elements 104 may be provided as a whole layer.
  • a spacer PDL may or may not be provided between adjacent anodes 1041, depending on the specific situation.
  • the topmost conductive layer 107 in the driving substrate 105 is reflective, for example, a laminated structure of titanium/titanium nitride/aluminum.
  • the conductive layer 107 includes a plurality of sub-layers arranged at intervals, which are respectively arranged in a one-to-one correspondence with the anode 1041 of each light-emitting element 104.
  • the conductive layer 107 can be configured as a reflective layer for reflecting the light emitted by the light emitting element 104 and improving the light extraction efficiency.
  • the orthographic projection of the anode 1041 of each light-emitting element 104 on the silicon substrate 102 falls within the orthographic projection of the portion of the corresponding conductive layer on the silicon substrate 102.
  • the anode 1041 may use a transparent conductive oxide material with a high work function, such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), and the like.
  • the display substrate 10 further includes an encapsulation layer 109, a color film layer 110, a cover plate 111, and the like on the side of the light-emitting element 104 away from the silicon substrate 102.
  • the first encapsulation layer 109 is configured to seal the light-emitting element 104 to prevent external moisture and oxygen from penetrating into the light-emitting element 104 and the pixel circuit and causing damage to the device.
  • the first encapsulation layer 109 includes an inorganic thin film or a structure in which organic thin films and inorganic thin films are alternately stacked.
  • the color film layer 110 may include color blocks such as R (red), G (green), and B (blue).
  • the cover 111 is, for example, a glass cover. Wherein, an encapsulation layer 109 may also be provided between the color filter layer 110 and the cover plate 111 to encapsulate the color filter layer 110.
  • the display substrate 10 is an organic light emitting diode (OLED) display substrate 10 or a micro OLED (Micro OLED) display substrate 10.
  • OLED organic light emitting diode
  • Micro OLED Micro OLED
  • An embodiment of the present disclosure also provides a display device, which includes the display module described in any of the above embodiments.
  • the specific type of the display device is not particularly limited, and the types of display devices commonly used in the field can be used, such as display screens, mobile devices such as mobile phones and notebook computers, wearable devices such as watches, and VR devices. And so on, a person skilled in the art can make a corresponding selection according to the specific purpose of the display device, which will not be repeated here.
  • the display device also includes other necessary components and components. Taking the display as an example, it may also include a housing, a main circuit board, a power cord, etc. The specific usage requirements of the display device shall be supplemented accordingly, which will not be repeated here.
  • This application is intended to cover any variations, uses, or adaptive changes of the present disclosure. These variations, uses, or adaptive changes follow the general principles of the present disclosure and include common knowledge or conventional technical means in the technical field that are not disclosed in the present disclosure. .
  • the description and the embodiments are only regarded as exemplary, and the true scope and spirit of the present disclosure are pointed out by the claims.

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Abstract

一种显示模组及显示装置，显示模组包括显示基板（10）和柔性电路板（20），显示基板（10）包括硅基板（102）、至少部分嵌在硅基板（102）上的驱动电路及与驱动电路电连接的第一焊盘（101），驱动电路包括具有半导体层（1031）的晶体管（103），半导体层（1031）位于硅基板（102）的内部；柔性电路板（20）包括柔性基底（201）、形成在柔性基底（201）上的第一布线层及形成在第一布线层背离柔性基底（201）一侧的第一补强板（203），第一布线层包括主走线部（202b）和与主走线部（202b）电连接并向远离主走线部（202b）的方向延伸的第二焊盘（202a），第二焊盘（202a）与第一焊盘（101）通过导电胶（3）电连接；第一补强板（203）覆盖主走线部（202b），且不覆盖第二焊盘（202a）；其中，在第二焊盘（202a）的延伸方向上，第一补强板（203）位于显示基板（10）的外侧，并与显示基板（10）之间具有非零间距。本方案具有良好的信号传输性能。

Description

显示模组及显示装置 技术领域
本公开实施例涉及显示技术领域，特别涉及一种显示模组及显示装置。
背景技术
近年，随着虚拟现实(Virtual Reality,简称VR)技术和增强现实(Augmented Reality，简称AR)技术的日益进步，适用于VR/AR领域的显示装置也正在向微型化、高像素密度(Pixel Per Inch,简称PPI)、快速响应和高色域的方向发展。硅基微显示OLED(Organic Light-Emitting Diode，有机电激光显示)面板正是其中突出的一个方向。虽然硅基微显示OLED起步较晚，但凭借着其微型化和高PPI的优势，也正在成为显示领域的新的关注焦点。
由于主要应用于AR/VR领域，为了方便模组组装，柔性电路板(Flexible Printed Circuit；简称：FPC)成为硅基OLED与驱动端连接的主要方式，因此，对柔性电路板的设计及柔性电路板与硅基OLED的贴合工艺提出了更高的要求。
发明内容
本公开实施例提供一种显示模组及显示装置，具有良好的信号传输性能。
在本公开的一种实施例中，提供了一种显示模组，其中，包括：
显示基板，包括硅基板、驱动电路及第一焊盘，所述驱动电路的至少部分嵌在所述硅基板上，所述驱动电路包括晶体管，所述晶体管具有半导体层，所述半导体层位于所述硅基板的内部，所述第一焊盘与所述驱动电路电连接；
柔性电路板，所述柔性电路板包括柔性基底、第一布线层及第一 补强板，所述第一布线层形成在所述柔性基底上，且所述第一布线层包括主走线部和第二焊盘，所述第二焊盘与所述主走线部电连接并向远离所述主走线部的方向延伸，所述第二焊盘与所述第一焊盘通过导电胶电连接；所述第一补强板形成在所述第一布线层背离所述柔性基底的一侧；所述第一补强板在所述柔性基底上的正投影覆盖所述主走线部在所述柔性基底上的正投影，且与所述第二焊盘在所述柔性基底上的正投影不重叠；其中，
在所述第二焊盘的延伸方向上，所述第一补强板位于所述显示基板的外侧，并与所述显示基板之间具有非零间距。
在本公开的一种示例性实施例中，在所述第二焊盘的延伸方向上，所述第一补强板与所述显示基板之间的间距不小于200μm。
在本公开的一种示例性实施例中，所述柔性电路板还包括第二补强板，所述第二补强板位于所述柔性基底背离所述第一布线层的一侧，所述第二补强板至少具有第一补强区，所述第一补强区在所述柔性基底上的正投影与所述第二焊盘在所述柔性基底上的正投影重叠。
在本公开的一种示例性实施例中，所述第二补强板还具有第二补强区，所述第二补强区与所述第一补强区在所述第二焊盘的延伸方向上依次排布并相接，且所述第二补强区在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内。
在本公开的一种示例性实施例中，所述第二补强区在所述第二焊盘的延伸方向上的尺寸不小于500μm。
在本公开的一种示例性实施例中，所述第一补强区和所述第二补强区一体成型。
在本公开的一种示例性实施例中，所述柔性电路板还包括第二布线层和第三补强板，所述第二布线层位于所述柔性基底背离所述第一布线层的一侧，并通过过孔与所述主走线部电连接；所述第三补强板形成在所述第二布线层背离所述柔性基底的一侧；
其中，所述第二布线层在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底的正投影内，且位于所述第三补强板在所述柔性基底的正投影内。
在本公开的一种示例性实施例中，所述过孔设置有多个。
在本公开的一种示例性实施例中，所述第三补强板与所述第二补强区之间具有断口。
在本公开的一种示例性实施例中，所述第三补强板覆盖所述第二布线层朝向所述第二补强区的一侧。
在本公开的一种示例性实施例中，所述导电胶为异方性导电胶。
在本公开的一种示例性实施例中，所述显示基板具有显示区和位于所述显示区至少一侧的绑定区，所述第一焊盘位于所述绑定区；
所述显示基板还包括位于所述显示区的发光元件，所述发光元件形成在所述驱动电路背离衬底基板的一侧并与所述驱动电路电连接。
在本公开的一种实施例中，提供了一种显示模组，其中，包括：
显示基板，包括硅基板、驱动电路及第一焊盘，所述驱动电路的至少部分嵌在所述硅基板上，所述驱动电路包括晶体管，所述晶体管具有半导体层，所述半导体层位于所述硅基板的内部，所述第一焊盘与所述驱动电路电连接；
柔性电路板，包括柔性基底及形成在所述柔性基底上的第一布线层，所述第一布线层包括主走线部和第二焊盘，所述第二焊盘与所述主走线部电连接并向远离所述主走线部的方向延伸，所述第二焊盘与所述第一焊盘通过导电胶电连接；其中，
所述导电胶覆盖所述第一焊盘及所述显示基板中靠近所述主走线部的边缘区域。
在本公开的一种示例性实施例中，所述导电胶向靠近所述主走线部的方向延伸并伸出所述显示基板的边界，所述导电胶中伸出所述显示基板边界的部分不小于200μm。
在本公开的一种示例性实施例中，所述柔性电路板还包括第一补强板和第二补强板，
所述第一补强板形成在所述第一布线层背离所述柔性基底的一侧，所述第一补强板在所述柔性基底上的正投影覆盖所述主走线部在所述柔性基底上的正投影，且与所述第二焊盘在所述柔性基底上的正投影不重叠；
所述第二补强板位于所述柔性基底背离所述第一布线层的一侧，所述第二补强板具有第一补强区和第二补强区，所述第一补强区在所述柔性基底上的正投影与所述第二焊盘在所述柔性基底上的正投影重叠；所述第二补强区与所述第一补强区在所述第二焊盘的延伸方向上依次排布并相接，且所述第二补强区在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内。
在本公开的一种示例性实施例中，所述第二补强区在所述第二焊盘的延伸方向上的尺寸不小于500μm。
在本公开的一种实施例中，提供了一种显示装置，其中，包括上述任一项所述的显示模组。
附图说明
附图用来提供对本公开实施例的进一步理解，并且构成说明书的一部分，与本公开实施例一起用于解释本公开，并不构成对本公开的限制。通过参考附图对详细示例实施例进行描述，以上和其它特征和优点对本领域技术人员将变得更加显而易见，在附图中：
图1a为本公开的实施例所示出的显示基板与柔性电路板的组装示意图；
图1b为本公开的实施例所示出的显示基板的俯视示意图；
图1c为本公开的实施例所示出的柔性电路板的仰视示意图；
图2为相关技术中所示出的显示模组的局部侧视示意图；
图3a和图3b为本公开的实施例所示出的显示模组的截面示意图；
图4为本公开的实施例所示出的显示基板的局部剖视示意图。
附图说明：
10、显示基板；10a、显示区；10b、绑定区；101、第一焊盘；102、硅基板；103、驱动晶体管；1031、半导体层；1032、源电极；1033、漏电极；1034、绝缘层；1035、栅极；104、发光元件；1041、阳极、1042、发光层；1043、阴极；105、驱动基板；106、导电层； 107、导电层；108、接触孔；109、封装层；110、彩膜层；111、盖板；
20、柔性电路板；201、柔性基底；202a、第二焊盘；202b、主走线部；202c、过渡部；203、第一补强板；204、第二补强板；204a、第一补强区；204b、第二补强区；205、第二布线层；206、第三补强板；207、过孔；208、断口；
3、导电胶；30、导电粒子。
具体实施方式
下面通过实施例，并结合附图，对本公开的技术方案作进一步具体的说明。在说明书中，相同或相似的附图标号指示相同或相似的部件。下述参照附图对本公开实施方式的说明旨在对本公开的总体发明构思进行解释，而不应当理解为对本公开的一种限制。
另外，在下面的详细描述中，为便于解释，阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地，一个或多个实施例在没有这些具体细节的情况下也可以被实施。
需要说明的是，本文中所述的“在……上”、“在……上形成”和“设置在……上”可以表示一层直接形成或设置在另一层上，也可以表示一层间接形成或设置在另一层上，即两层之间还存在其它的层。
用语“一个”、“一”、“该”、“所述”和“至少一个”用以表示存在一个或多个要素/组成部分/等；用语“包括”和“具有”用以表示开放式的包括在内的意思并且是指除了列出的要素/组成部分/等之外还可存在另外的要素/组成部分/等。
需要说明的是，虽然术语“第一”、“第二”、“第三”等可以在此用于描述各种部件、构件、元件、区域、层和/或部分，但是这些部件、构件、元件、区域、层和/或部分不应受到这些术语限制。而是，这些术语用于将一个部件、构件、元件、区域、层和/或部分与另一个相区分。
如图1a至图1c所示，在本公开实施例提供了一种显示模组，该显示模组可包括显示基板10和柔性电路板20，具体地：
如图3a、图3b和图4所示，显示基板10具有显示区10a及位于显示区10a至少一侧的绑定区10b，绑定区10b设置有第一焊盘101。第一焊盘101可为单层或多层结构，且第一焊盘101可采用金属或合金等材料制作而成，例如：由铜、钼、铝及钛等形成的金属单层或多层结构，但不限于此，第一焊盘101也可采用其他导电材料制作而成。
第一焊盘101通常用于在显示区10a器件制作完成后，与外部元件(例如：柔性电路板20)进行绑定(Bonding)以为显示基板10提供信号，例如电源电压信号等。该第一焊盘101可以和显示区10a中的导电结构同层设置以节省工艺。例如，第一焊盘101可以与显示区10a中发光元件104以下的最顶层(最远离衬底基板)的导电层107同层设置以方便后续的绑定工艺。
需要说明的是，本公开实施例中的“同层设置”是指多个结构由同一材料膜经相同或不同的构图工艺形成，因而具有相同的材料。
在一些实施例中，显示基板10的厚度可为0.5mm至1mm，比如：0.5mm、0.75mm、0.1mm等等，但不限于此，显示基板10的厚度也可为其他数值，视具体情况而定。第一焊盘101的宽度可为60μm至80μm，比如：60μm、70μm、80μm等等，第一焊盘101的长度可为480μm至520μm，比如：480μm、500μm、520μm等等，但不限于此，第一焊盘101的宽度和长度也可为其他数值，视具体情况而定。第一焊盘101与显示基板10中位于第一焊盘101远离显示基板10中心的边界之间的间距为50μm至70μm，比如：50μm、60μm、70μm等等，但不限于此，也可为其他数值，视具体情况而定。
需要说明的是，本公开的一些实施例中，厚度指的是在如图1a、图3a、图3b中所示出的第一方向Z上的尺寸，长度指的是在如图1b、图1c、图3a、图3b中所示出的第二方向X上的尺寸，宽度指的是如图1b、图1c中所示出的第三方向Y上的尺寸。
如图3a所示，柔性电路板20包括柔性基底201、第一布线层及第一补强板203；第一布线层形成在柔性基底201上，此第一布线层可包括主走线部202b和第二焊盘202a，第一补强板203形成在第一布线层背离柔性基底201的一侧。
详细说明，主走线部202b在柔性基底201上的正投影位于第一补强板203在柔性基底201的正投影内，换言之，第一补强板203在柔性基底201上的正投影覆盖主走线部202b在柔性基底201上的正投影；该第一补强板203可对柔性电路板20上的主走线部202b起到保护作用，另外，还可保证柔性电路板20的结构稳定性，方便产品的整体组装。
第二焊盘202a与主走线部202b电连接，并向远离主走线部202b的方向延伸；其中，第二焊盘202a用于与显示基板10中的第一焊盘101电性连接，具体可通过导电胶3电性连接；由于第二焊盘202a需与第二焊盘202a通过导电胶3电连接，因此，第二焊盘202a在柔性基底201上的正投影与第一补强板203在柔性基底201上的正投影不重叠，即：第二焊盘202a相对第一补强板203露出，以能够实现第二焊盘202a与第一焊盘101之间的绑定，从而使得柔性电路板20与显示基板10实现电性连接。
需要说明的是，本公开实施例中提到的在柔性基底201上的正投影具体指的是在柔性基底201的中心水平面上的正投影，此中心水平面指的是在柔性电路板呈水平放置并未发生弯折时位于柔性基底201中心的平面，且中心水平面为与第一方向Z相垂直的平面。
此外，应当理解的是，如图1b所示，显示基板10的绑定区10b上可设置多个在第三方向Y上间隔排布的第一焊盘101，此第三方向Y与第一方向Z相互垂直；且柔性电路板20的第一布线层也可具有多个在第三方向Y上间隔排布的第二焊盘202a。其中，第一焊盘101和第二焊盘202a的长度方向为图1b和图1c所示的第二方向X；此第二方向X与第三方向Y和第一方向Z相互垂直；且每一个第二焊盘202a对应与一个第一焊盘101进行绑定。
举例而言，柔性电路板20中柔性基底201、第一补强板203可为单层结构，也可为多层结构；且柔性基底201、第一补强板203可采用PI(聚酰亚胺)等材料制作而成。第一布线层可采用Al(铝)或Cu(铜)等材料制作而成。导电胶3可为异方性导电胶膜(Anisotropic Conductive Film，简称：ACF)，此异方性导电胶膜利用导电粒子30将柔性电路板20的第二焊盘202a与显示基板10的第一焊盘101进行绑定，以使柔性电路板20与显示基板10之间电性导通，同时，由于异方性导电胶3只在柔性基底201的厚度方向上导通，此柔性基底201的厚度方向为图3a和图3b所示出的第一方向Z；因此，可避免在水平方向上相邻焊盘间出现导通短路的情况，以保证柔性电路板20与显示基板10之间电性连接稳定性。
此外，由于异方性导电胶只在柔性基底201的厚度方向上导通，因此，在实现多对第一焊盘101与第二焊盘202a绑定的过程中，可整面设置异方性导电胶，以降低绑定难度。
由于第一布线层通常采用Al(铝)或Cu(铜)等材料制作而成，因此，未被第一补强板203覆盖的部分(例如第二焊盘202a)容易出现氧化，为了保证第二焊盘202a具有良好的导电性能，可在第二焊盘202a上涂覆具有良好导电性的抗氧化膜层，例如：金(Au)材料薄膜等。由于第二焊盘202a上涂覆有抗氧化膜层，因此，第二焊盘202a的厚度大于主走线部202b的厚度，如图3a所示。
此外，如图3b所示，主走线部202b与第二焊盘202a之间可通过过渡部202c连接，此过渡部202c与第二焊盘202a的结构相同，可以理解为过渡部202c与第二焊盘202a一体成型。其中，为了避免主走线部202b中与第二焊盘202a相接的部位被氧化，在制作柔性电路板20的过程中，可使第一补强板203覆盖过渡部202c，以保证第一补强板203能完全覆盖主走线部202b，避免主走线部202b露出。
应当理解的是，为了保证柔性电路板20的结构稳定性，该第一补强板203的厚度可大于第二焊盘202a的厚度。但这样在将第二焊盘202a与第一焊盘101进行连接的过程中，若将第一补强板203搭 接到显示基板10的边缘，则会使第二焊盘202a中靠近第一补强板203的部位发生翘曲，如图2所示，此时，会导致第二焊盘202a与第一焊盘101之间的接触面积减小，从而使得第二焊盘202a与第一焊盘101之间的接触阻抗变大，使得柔性电路板20与显示基板10之间电性连接稳定性较差。此外，由于第一补强板203搭接到显示基板10的边缘处，因此，第一补强板203可作为挡墙，使得部分导电胶3的导电粒子30在挤压后无法顺利排出，便堆积在悬空处，从而使得柔性电路板20的信赖性变差。
因此，为了避免此情况的出现，在一些实施例中，在将第二焊盘202a与第一焊盘101通过导电胶3电性连接后，第一补强板203在第二焊盘202a的延伸方向上可位于显示基板10的外侧，即：第一补强板203未搭接在显示基板10的边缘处，这样可避免第二焊盘202a出现翘曲的情况，以保证第二焊盘202a与第一焊盘101的连接面积，提高柔性电路板20与显示基板10之间的贴合良率，从而保证柔性电路板20与显示基板10之间的连接稳定性，使得该显示模组具有良好的信号传输性能。
在一些实施例中，在第二焊盘202a的延伸方向上，也可理解为在图3a和图3b所示的第二方向X上，第一补强板203与显示基板10之间应具有非零间距，也就是说，第一补强板203的边缘不与显示基板10的边缘处相接触，这样可避免第一补强板203阻挡导电胶3排出的情况，即：这样设计可保证部分导电胶3在第一焊盘101与第二焊盘202a挤压贴合的过程中能够顺利排出，以缓解导电胶3中导电粒子30出现堆积的情况，保证导电粒子30能够均匀分布，从而保证柔性电路板20的信赖性。
进一步地，在第二焊盘202a的延伸方向上，第一补强板203与显示基板10之间的间距H1不小于200μm，以避免导电胶3中导电粒子30出现堆积的情况，从而进一步保证柔性电路板20的信赖性。
在一些实施例中，如图3a和图3b所示，导电胶3覆盖第一焊盘101及显示基板10中靠近主走线部202b的边缘区域。
可选地，导电胶3向靠近主走线部202b的方向延伸并伸出显示基板10的边界，导电胶3中伸出显示基板10边界的部分不小于200μm，即：导电胶3中靠近主走线部202b的端面与显示基板的边界之间的间距H1不小于200μm；以避免导电胶3中导电粒子30出现堆积的情况，从而进一步保证柔性电路板20的信赖性。
在一些实施例中，柔性电路板20还包括第二补强板204，此第二补强板204可采用PI(聚酰亚胺)等材料制作而成。此第二补强板204位于柔性基底201背离第一布线层的一侧，第二补强板204至少具有第一补强区204a，第一补强区204a在柔性基底201上的正投影与第二焊盘202a在柔性基底201上的正投影重叠，这样设计可增加柔性电路板20中设置第二焊盘202a的区域的结构强度。
其中，第二补强板204还可具有第二补强区204b，此第二补强区204b与第一补强区204a在第二焊盘202a的延伸方向上依次排布并相接，且第二补强区204b在柔性基底201上的正投影位于第一补强板203在柔性基底201上的正投影内，也就是说，第二补强板204的一部分还可延伸至柔性电路板20中设置主走线部202b的区域，以避免柔性电路板20中第二焊盘202a所在区域与主走线部202b所在区域的交界处出现刚性突变，从而导致在第二焊盘202a与第一焊盘101压合绑定过程中，交界处容易损坏的情况，即：避免第二焊盘202a及第二焊盘202a与主走线部202b的连接处容易发生断裂的问题，以保证柔性电路板20在绑定过程中的结构稳定性。
需要说明的是，第二补强板204的第二补强区204b与第一补强区204a可一体成型，以使得第二补强板204为一体式结构，保证第二补强板204的结构强度。
可选地，第二补强区204b在第二焊盘202a的延伸方向上的尺寸H2不小于500μm，也可理解为第二补强区204b在图3a和图3b所示的第二方向X上尺寸H2不小于500μm；还可理解为，第二补强板204与第一补强板203在第一方向Z上交叠部分的长度不小于500μm，以进一步防止第二焊盘202a及第二焊盘202a与主走线部202b 的连接处容易发生断裂的问题，保证柔性电路板20在绑定过程中的结构稳定性。
在一些实施例中，柔性电路板20还可包括第二布线层205及第三补强板206，第二布线层205位于柔性基底201背离第一布线层的一侧，并通过过孔207与主走线部202b电连接，此第二布线层205可采用Al(铝)或Cu(铜)等材料制作而成；第三补强板206形成在第二布线层205背离柔性基底201的一侧，第三补强板206可采用PI(聚酰亚胺)等材料制作而成；其中，第二布线层205在柔性基底201上的正投影位于第一补强板203在柔性基底201的正投影内，且位于第三补强板206在柔性基底201的正投影内。本实施例中，通过将柔性电路板20设置两层走线层可方便布线，且通过设置第三补强板206一方面可对第二布线层205起到保护的作用，另一方面可加强柔性电路板20的结构强度。
应当理解的是，该柔性电路板20不仅可以设置两层走线层，还可设置更多层，例如：三层、四层等等，视具体情况而定。
可选地，用于连接第一布线层和第二布线层205的过孔207可设置有多个，以保证第一布线层和第二布线层205之间的连接稳定性。
其中，第三补强板206与第二补强区204b之间具有断口208，也就是说，第二补强板204与第三补强板206之间呈断开状，且在第二方向X上之间具有间距。本实施中柔性电路板20可在断口208处进行弯折，以提高柔性电路板20的弯折能力。
可选地，第三补强板206还形成在第二布线层205朝向第二补强区204b的一侧，以避免第二布线层205朝向第二补强区204b的一侧露出，一方面可避免第二布线层205氧化，从而保证第二布线层205具有良好导电性的同时；另一方面还可避免第二布线层205在断口208处与其他导电部件发生误触的情况。
在一些实施例中，在制作第二补强板204和第三补强板206的过程中，可先在柔性基底201背离第一电路层的一侧制作一整面膜层，然后再在整面膜层上切割出或刻蚀出断口208，以形成相互断开的第 二补强板204和第三补强板206，但不限于此，第二补强板204与第三补强板206也可分别独立形成，视具体情况而定。
在一些实施例中，柔性电路板20整体的厚度小于显示基板10的厚度；此柔性电路板的厚度为0.1mm至0.2mm，比如：0.1mm、0.15mm、0.2mm等等，但不限于此，柔性电路板20的厚度也可为其他数值，视具体情况而定。柔性电路板中第二焊盘202a的长度大于显示基板10中第一焊盘101的长度；此第二焊盘202a的长度为1mm至1.5mm，比如：1mm、1.1mm、1.2mm、1.3mm、1.4mm、1.5mm等等；此第二焊盘202a的宽度可大于或等于第一焊盘101的宽度，此第二焊盘202a的宽度可为60μm至80μm，比如：60μm、70μm、80μm等等；但不限于此，第二焊盘202a的长度、宽度也可为其他数值，视具体情况而定；应当理解的是，第二焊盘202a在显示基板10上的正投影可完全覆盖第一焊盘101，以保证第二焊盘202a与第一焊盘101之间的绑定稳定性。
在一些实施例中，第三补强板206与第二补强板204的第二补强区204b之间断口208的长度可为7mm至9mm，比如：7mm、8mm、9mm等等，但不限于此，断口208的长度可根据具体弯折而定。
在一些实施例中，如图4所示，显示基板10具体包括衬底基板和驱动电路；其中：
衬底基板可为硅基板102，该硅基板102例如为单晶硅或高纯度硅。
驱动电路的至少部分嵌在衬底基板上，以使其整体形成为驱动基板105。应当理解的是，驱动电路可包括位于显示区10a的电路结构，也可包括位于绑定区10b的电路结构。驱动电路可包括晶体管，此晶体管具有半导体层，半导体层位于硅基板102的内部，其中，驱动电路中晶体管的数量为多个，且晶体管不仅可分布在显示区10a，还可分布在绑定区10b，或分布在其他非显示区。
本公开实施例的驱动电路可与绑定区10b的第一焊盘101电连接，该第一焊盘101与柔性电路板20的第二焊盘202a进行绑定以为显示 基板10提供信号，例如电源电压信号；即：驱动电路可包括电源电压信号线(图中未示出)，此电源电压信号线可与第一焊盘101电连接，也就是说，电源电压信号线可通过第一焊盘101和柔性电路板20与驱动端电连接，以从驱动端获取电源电压信号。
具体地，该驱动电路可包括位于显示区10a的像素电路，此像素电路可通过半导体工艺形成于硅基板102上，例如：通过掺杂工艺在硅基板102上形成驱动晶体管103的半导体层1031(即：有源层)、源电极1032和漏电极1033，并通过硅氧化工艺形成绝缘层1034，以及通过溅射工艺或其他工艺形成栅极1035和多个导电层106、107等。驱动晶体管103的半导体层1031位于衬底基板的内部；即：半导体层1031可属于硅基板102的部分。
需要说明的是，驱动电路还可包括栅极驱动电路、数据驱动电路、数据信号线及扫描信号线，数据驱动电路和栅极驱动电路分别通过数据信号线和扫描信号线与发光元件104的像素电路连接以提供电信号。该数据驱动电路用于提供数据信号，该栅极驱动电路用于提供扫描信号，还可以进一步用于提供各种控制信号、电源信号等。
在一些实施例中，栅极驱动电路和数据驱动电路也可以通过上述半导体工艺集成在硅基板102中。也就是说，在显示基板10采用硅基板102作为衬底基板，该像素电路、该栅极驱动电路和数据驱动电路都可以集成于该硅基板102上。在此情形下，由于硅基电路可以实现较高的精度，该栅极驱动电路和数据驱动电路例如也可以形成于对应于该显示基板10的显示区10a的区域中，而并不一定位于非显示区。其中，栅极驱动电路和数据驱动电路可以采用本领域内的常规电路结构，本公开的实施例对此不作限制。
在一些实施例中，如图4所示，显示基板10还可包括发光元件104，发光元件104形成在驱动电路背离硅基板102的一侧并位于显示区10a，此发光元件104可与驱动电路电连接。详细说明，发光元件104可包括依次形成在驱动基板105上的阳极1041、发光层1042及阴极1043，此阳极1041可通过填充有导电材料(例如：金属钨等) 的接触孔108及多个导电层106、107与驱动晶体管103中的漏电极1033实现电连接；如图4所示，示出了一层绝缘层1034和两层导电层106、107，然而本公开实施例对于绝缘层和导电层的层数不作限制。
其中，发光元件104可设置有多个，多个发光元件104的阳极1041相互断开，且多个发光元件104的阴极1043可整层设置。需要说明的是，相邻阳极1041之间可以设置间隔部(PDL)，也可不设置间隔部(PDL)，视具体情况而定。
在一些实施例中，驱动基板105中的最顶层导电层107具有反射性，例如为钛/氮化钛/铝的层叠结构。例如，该导电层107包括间隔设置的多个子层，分别与各发光元件104的阳极1041一一对应设置。在顶发射结构中，该导电层107可以设置为反射层，用于反射发光元件104发出的光线，提高出光效率。例如，每个发光元件104的阳极1041在硅基板102上的正投影落入其对应的导电层的部分在该硅基板102上的正投影内。在这种情形，阳极1041可以采用具有高功函数的透明导电氧化物材料，例如ITO(氧化铟锡)、IZO(氧化铟锌)等。
在一些实施例中，该显示基板10还包括位于发光元件104远离硅基板102一侧的封装层109、彩膜层110以及盖板111等。例如，第一封装层109配置为对发光元件104进行密封以防止外界的湿气和氧向该发光元件104及像素电路的渗透而造成对器件的损坏。例如，第一封装层109包括无机薄膜或者包括有机薄膜及无机薄膜交替层叠的结构。彩膜层110可包括R(红)、G(绿)、B(蓝)等色块。盖板111例如为玻璃盖板。其中，在彩膜层110以及盖板111之间也可设置封装层109，以对彩膜层110进行封装。
在一些实施例中，显示基板10为有机发光二极管(OLED)显示基板10或微型OLED(Micro OLED)显示基板10。
本公开的实施例还提供了一种显示装置，其包括上述任一实施例所描述的显示模组。
根据本公开的实施例，该显示装置的具体类型不受特别的限制，本领域常用的显示装置类型均可，具体例如显示屏、手机、笔记本电脑等移动装置、手表等可穿戴设备、VR装置等等，本领域技术人员可根据该显示设备的具体用途进行相应地选择，在此不再赘述。
需要说明的是，该显示装置除了阵列基板以外，还包括其他必要的部件和组成，以显示器为例，还可包括外壳、主电路板、电源线，等等，本领域善解人意可根据该显示装置的具体使用要求进行相应地补充，在此不再赘述。本领域技术人员在考虑说明书及实践这里公开的内容后，将容易想到本公开的其他实施例。本申请旨在涵盖本公开的任何变型、用途或者适应性变化，这些变型、用途或者适应性变化遵循本公开的一般性原理并包括本公开未公开的本技术领域中的公知常识或惯用技术手段。说明书和实施例仅被视为示例性的，本公开的真正范围和精神由权利要求指出。

Claims (17)

  1. 一种显示模组，其中，包括：
    显示基板，包括硅基板、驱动电路及第一焊盘，所述驱动电路的至少部分嵌在所述硅基板上，所述驱动电路包括晶体管，所述晶体管具有半导体层，所述半导体层位于所述硅基板的内部，所述第一焊盘与所述驱动电路电连接；
    柔性电路板，所述柔性电路板包括柔性基底、第一布线层及第一补强板，所述第一布线层形成在所述柔性基底上，且所述第一布线层包括主走线部和第二焊盘，所述第二焊盘与所述主走线部电连接并向远离所述主走线部的方向延伸，所述第二焊盘与所述第一焊盘通过导电胶电连接；所述第一补强板形成在所述第一布线层背离所述柔性基底的一侧；所述第一补强板在所述柔性基底上的正投影覆盖所述主走线部在所述柔性基底上的正投影，且与所述第二焊盘在所述柔性基底上的正投影不重叠；其中，
    在所述第二焊盘的延伸方向上，所述第一补强板位于所述显示基板的外侧，并与所述显示基板之间具有非零间距。
  2. 根据权利要求1所述的显示模组，其中，在所述第二焊盘的延伸方向上，所述第一补强板与所述显示基板之间的间距不小于200μm。
  3. 根据权利要求2所述的显示模组，其中，
    所述柔性电路板还包括第二补强板，所述第二补强板位于所述柔性基底背离所述第一布线层的一侧，所述第二补强板至少具有第一补强区，所述第一补强区在所述柔性基底上的正投影与所述第二焊盘在所述柔性基底上的正投影重叠。
  4. 根据权利要求3所述的显示模组，其中，所述第二补强板还具有第二补强区，所述第二补强区与所述第一补强区在所述第二焊盘的延伸方向上依次排布并相接，且所述第二补强区在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内。
  5. 根据权利要求4所述的显示模组，其中，
    所述第二补强区在所述第二焊盘的延伸方向上的尺寸不小于500μm。
  6. 根据权利要求4所述的显示模组，其中，所述第一补强区和所述第二补强区一体成型。
  7. 根据权利要求4所述的显示模组，其中，所述柔性电路板还包括第二布线层和第三补强板，所述第二布线层位于所述柔性基底背离所述第一布线层的一侧，并通过过孔与所述主走线部电连接；所述第三补强板形成在所述第二布线层背离所述柔性基底的一侧；
    其中，所述第二布线层在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底的正投影内，且位于所述第三补强板在所述柔性基底的正投影内。
  8. 根据权利要求7所述的显示模组，其中，所述过孔设置有多个。
  9. 根据权利要求7所述的显示模组，其中，所述第三补强板与所述第二补强区之间具有断口。
  10. 根据权利要求9所述的显示模组，其中，所述第三补强板覆盖所述第二布线层朝向所述第二补强区的一侧。
  11. 根据权利要求1所述的显示模组，其中，所述导电胶为异方性导电胶。
  12. 根据权利要求1所述的显示模组，其中，所述显示基板具有显示区和位于所述显示区至少一侧的绑定区，所述第一焊盘位于所述绑定区；
    所述显示基板还包括位于所述显示区的发光元件，所述发光元件形成在所述驱动电路背离衬底基板的一侧并与所述驱动电路电连接。
  13. 一种显示模组，其中，包括：
    显示基板，包括硅基板、驱动电路及第一焊盘，所述驱动电路的至少部分嵌在所述硅基板上，所述驱动电路包括晶体管，所述晶体管具有半导体层，所述半导体层位于所述硅基板的内部，所述第一焊盘与所述驱动电路电连接；
    柔性电路板，包括柔性基底及形成在所述柔性基底上的第一布线层，所述第一布线层包括主走线部和第二焊盘，所述第二焊盘与所述主走线部电连接并向远离所述主走线部的方向延伸，所述第二焊盘与所述第一焊盘通过导电胶电连接；其中，
    所述导电胶覆盖所述第一焊盘及所述显示基板中靠近所述主走线部的边缘区域。
  14. 根据权利要求13所述的显示模组，其中，所述导电胶向靠近所述主走线部的方向延伸并伸出所述显示基板的边界，所述导电胶中伸出所述显示基板边界的部分不小于200μm。
  15. 根据权利要求14所述的显示模组，其中，所述柔性电路板还包括第一补强板和第二补强板，
    所述第一补强板形成在所述第一布线层背离所述柔性基底的一侧，所述第一补强板在所述柔性基底上的正投影覆盖所述主走线部在所述柔性基底上的正投影，且与所述第二焊盘在所述柔性基底上的正投影不重叠；
    所述第二补强板位于所述柔性基底背离所述第一布线层的一侧，所述第二补强板具有第一补强区和第二补强区，所述第一补强区在所述柔性基底上的正投影与所述第二焊盘在所述柔性基底上的正投影重叠；所述第二补强区与所述第一补强区在所述第二焊盘的延伸方向上依次排布并相接，且所述第二补强区在所述柔性基底上的正投影位于所述第一补强板在所述柔性基底上的正投影内。
  16. 根据权利要求15所述的显示模组，其中，
    所述第二补强区在所述第二焊盘的延伸方向上的尺寸不小于500μm。
  17. 一种显示装置，其中，包括权利要求1至16中任一项所述的显示模组。
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