WO2021190245A1 - 显示基板及其制备方法、显示装置 - Google Patents

显示基板及其制备方法、显示装置 Download PDF

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Publication number
WO2021190245A1
WO2021190245A1 PCT/CN2021/078256 CN2021078256W WO2021190245A1 WO 2021190245 A1 WO2021190245 A1 WO 2021190245A1 CN 2021078256 W CN2021078256 W CN 2021078256W WO 2021190245 A1 WO2021190245 A1 WO 2021190245A1
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WIPO (PCT)
Prior art keywords
light
substrate
sub
adjusting layer
emitting devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/078256
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English (en)
French (fr)
Inventor
李健
陈振彰
王世鹏
李沛
曹鹏军
李金鹏
王志远
张腾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Display Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
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Application filed by BOE Technology Group Co Ltd, Beijing BOE Display Technology Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to KR1020227002123A priority Critical patent/KR102886569B1/ko
Priority to US17/618,031 priority patent/US12402456B2/en
Priority to EP21775135.3A priority patent/EP4131435A4/en
Priority to JP2022502266A priority patent/JP7686616B2/ja
Publication of WO2021190245A1 publication Critical patent/WO2021190245A1/zh
Anticipated expiration legal-status Critical
Priority to JP2025084597A priority patent/JP2025134699A/ja
Priority to US19/222,175 priority patent/US20250294934A1/en
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D86/00—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates
    • H10D86/40—Integrated devices formed in or on insulating or conducting substrates, e.g. formed in silicon-on-insulator [SOI] substrates or on stainless steel or glass substrates characterised by multiple TFTs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/853—Encapsulations characterised by their shape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
    • H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
    • H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
    • H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0361—Manufacture or treatment of packages of wavelength conversion means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means

Definitions

  • the present disclosure relates to the field of display technology, and in particular to a display substrate, a preparation method thereof, and a display device.
  • Mini Light Emitting Diode Mini LED
  • Micro Light Emitting Diode Micro LED
  • the advantages are applied to fields such as medium-size displays such as micro-displays and mobile TVs to large-screen displays in theaters.
  • a display substrate includes: a first substrate, a plurality of light emitting devices, a light adjusting layer, and a second substrate.
  • the plurality of light emitting devices are arranged on one side of the first substrate, and the plurality of light emitting devices are arranged at intervals from each other.
  • the light adjustment layer is located in the gap between the plurality of light-emitting devices and on a side surface of the plurality of light-emitting devices away from the first substrate, so that at least one light-emitting device is covered by the light adjustment layer.
  • the material of the light adjustment layer includes a light-absorbing material, and is configured to absorb at least a part of the light directed to the light adjustment layer.
  • the second substrate covers the light adjusting layer.
  • the light adjustment layer includes: a first sub-light adjustment layer and a second sub-light adjustment layer.
  • the first sub-light adjusting layer is located in the gap between the plurality of light emitting devices. With respect to the first substrate, the first sub-light adjusting layer is far from the surface of the first substrate, and is flat, or higher than, or higher than the surface of the plurality of light-emitting devices away from the first substrate. Lower than the surface of the plurality of light emitting devices away from the first substrate.
  • the material of the first sub-light adjusting layer includes a light-absorbing material, and is configured to absorb at least a part of the light directed to the first sub-light adjusting layer.
  • the second sub-light adjusting layer is arranged on a side of the first sub-light adjusting layer away from the first substrate. Relative to the first substrate, the second sub-light adjusting layer is away from the surface of the first substrate, and is higher than the surface of the plurality of light-emitting devices away from the first substrate.
  • the second sub-light adjusting layer is a transparent film.
  • the first sub-light adjusting layer is far from the surface of the first substrate, which is lower than the surface of the plurality of light-emitting devices away from the first substrate.
  • the second sub-light adjusting layer includes a first part and a second part.
  • the orthographic projection of the first part on the first substrate coincides with the orthographic projection of the plurality of light-emitting devices on the first substrate, and the orthographic projection of the second part on the first substrate The projection coincides with the orthographic projection of the first sub-light adjusting layer on the first substrate.
  • the thickness of the first part ranges from 20 ⁇ m to 100 ⁇ m.
  • the thickness of the second part ranges from 50 ⁇ m to 100 ⁇ m.
  • the refractive index of the second sub-light adjusting layer is greater than the refractive index of the second substrate.
  • the distance between the surface of the first sub-light adjusting layer away from the first substrate and the first substrate is 80% to 120% of the thickness of the plurality of light emitting devices .
  • the light adjustment layer further includes: a third light adjustment layer located in the gap between the plurality of light-emitting devices and disposed between the first sub-light adjustment layer and the first substrate.
  • Sub-light adjustment layer Relative to the first substrate, the third sub-light adjusting layer is far from the surface of the first substrate, and is level with the surface of the plurality of light-emitting devices away from the first substrate, or lower than the surface of the first substrate.
  • the plurality of light emitting devices are away from the surface of the first substrate.
  • the material of the third sub-light adjustment layer includes a light-reflecting material, and is configured to reflect light incident into the third sub-light adjustment layer from the plurality of light-emitting devices back into the plurality of light-emitting devices.
  • the light adjustment layer includes: a first sub-light adjustment layer and a third sub-light adjustment layer.
  • the third sub-light adjusting layer is located in the gap between the plurality of light emitting devices. Relative to the first substrate, the third sub-light adjusting layer is far from the surface of the first substrate, and is level with the surface of the plurality of light-emitting devices away from the first substrate, or lower than the surface of the first substrate. The plurality of light emitting devices are away from the surface of the first substrate.
  • the material of the third sub-light adjustment layer includes a light-reflecting material, and is configured to reflect light incident into the third sub-light adjustment layer from the plurality of light-emitting devices back into the plurality of light-emitting devices.
  • the first sub-light adjusting layer is arranged on a side of the third sub-light adjusting layer away from the first substrate. Relative to the first substrate, the first sub-light adjusting layer is away from the surface of the first substrate, and is higher than the surface of the plurality of light-emitting devices away from the first substrate.
  • the material of the first sub-light adjusting layer includes a light-absorbing material, and is configured to absorb at least a part of the light directed to the first sub-light adjusting layer.
  • the reflectivity of the third sub-light adjusting layer is greater than or equal to 70%.
  • each light emitting device includes: a third substrate; and, a light emitting layer provided on one side of the third substrate.
  • the light-emitting layer is close to the first substrate with respect to the third substrate.
  • the refractive index of the third substrate is greater than the refractive index of the second sub-light adjustment layer.
  • the third sub-light adjusting layer when the light adjusting layer includes a third sub-light adjusting layer, relative to the first substrate, the third sub-light adjusting layer is away from the surface of the first substrate, Higher than the surface of the plurality of light emitting devices away from the first substrate.
  • the material of the first sub-light adjusting layer when the light adjusting layer includes the first sub-light adjusting layer, includes acrylic glue doped with a light-absorbing material. In the case where the light adjustment layer includes a second sub-light adjustment layer, the material of the second sub-light adjustment layer includes acrylic glue. In the case where the light adjusting layer includes a third sub-light adjusting layer, the material of the third sub-light adjusting layer includes acrylic glue doped with a reflective material.
  • a plurality of microstructures are provided on the surface of the second substrate on one side away from the first substrate.
  • the plurality of microstructures are configured to change the propagation direction of at least a part of the light from the plurality of light-emitting devices and passing through the second substrate.
  • the surface shape of the plurality of microstructures includes at least one of a pyramid, a wedge, an arc surface, and a spherical surface.
  • a method for preparing a display substrate includes: providing a first substrate, and arranging a plurality of light-emitting devices spaced apart on one side of the first substrate.
  • a second substrate is provided, a light-absorbing material is used, and a light adjusting layer is formed on one side of the second substrate.
  • the first substrate on which the plurality of light emitting devices are formed and the second substrate on which the light adjusting layer is formed are pressed, so that the multiple light emitting devices are embedded in the light adjusting layer , And make a part of the light adjusting layer sink into the gap between the plurality of light-emitting devices, and the other part is located on a side surface of the plurality of light-emitting devices away from the first substrate.
  • the pressing process includes a vacuum pressing process or a rolling process.
  • a display device in another aspect, includes: the display substrate as described in any of the above embodiments.
  • FIG. 1 is a method for preparing a display substrate according to related technologies
  • Fig. 2 is a top view of a display substrate according to some embodiments of the present disclosure
  • FIG. 3 is a cross-sectional view of the display substrate shown in FIG. 2 along the A-A' direction;
  • FIG. 4 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 2;
  • FIG. 5 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 2;
  • FIG. 6 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 2;
  • FIG. 7 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 2;
  • FIG. 8 is another cross-sectional view along the A-A' direction of the display substrate shown in FIG. 2;
  • FIG. 9 is another cross-sectional view of the display substrate shown in FIG. 2 along the A-A' direction;
  • Fig. 10 is another cross-sectional view along the A-A' direction of the display substrate shown in Fig. 2;
  • Fig. 11 is a structural diagram of a Mini LED according to some embodiments of the present disclosure.
  • FIG. 12 is a structural diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 13 is a partial structure diagram of a display substrate according to some embodiments of the present disclosure.
  • FIG. 14 is a partial structure diagram of another display substrate according to some embodiments of the present disclosure.
  • FIG. 15 is a partial structure diagram of still another display substrate according to some embodiments of the present disclosure.
  • FIG. 16 is a flowchart of a method for manufacturing a display substrate according to some embodiments of the present disclosure.
  • FIG. 17 is a diagram of the preparation steps of a display substrate according to some embodiments of the present disclosure.
  • FIG. 18 is a diagram of the preparation steps of another display substrate according to some embodiments of the present disclosure.
  • FIG. 19 is a structural diagram of a display device according to some embodiments of the present disclosure.
  • first and second are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of indicated technical features. Thus, the features defined with “first” and “second” may explicitly or implicitly include one or more of these features. In the description of the embodiments of the present disclosure, unless otherwise specified, “plurality” means two or more.
  • connection and its extensions may be used.
  • the term “connected” may be used when describing some embodiments to indicate that two or more components are in direct physical or electrical contact with each other.
  • At least one of A, B, and C has the same meaning as “at least one of A, B, or C", and both include the following combinations of A, B, and C: only A, only B, only C, A and B The combination of A and C, the combination of B and C, and the combination of A, B and C.
  • a and/or B includes the following three combinations: A only, B only, and the combination of A and B.
  • the exemplary embodiments are described herein with reference to cross-sectional views and/or plan views as idealized exemplary drawings.
  • the thickness of layers and regions are exaggerated for clarity. Therefore, variations in the shape with respect to the drawings due to, for example, manufacturing technology and/or tolerances can be envisaged. Therefore, the exemplary embodiments should not be construed as being limited to the shape of the area shown herein, but include shape deviations due to, for example, manufacturing.
  • an etched area shown as a rectangle will generally have curved features. Therefore, the areas shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shape of the area of the device, and are not intended to limit the scope of the exemplary embodiments.
  • Mini LED or Micro LED can emit light of multiple colors, such as red, green, blue, or yellow. Mini LED or Micro LED can be used as pixels and applied to the display substrate for display.
  • the gaps between the multiple Mini LEDs and the surfaces of the multiple Mini LEDs are usually coated with black glue, and the black glue is ground by a grinding process, so that the black glue is located in the multiple Mini LEDs.
  • the thickness of the part of the surface of the LED is the required thickness.
  • the polished vinyl can be used to improve the contrast of the display device.
  • due to the limitation of the polishing process currently only the thickness of the part of the vinyl on the surface of multiple Mini LEDs can be polished to 40 ⁇ m-50 ⁇ m.
  • the thickness of the black glue is greater than that of the MiniLED, if the brightness displayed by the display substrate is the same as the brightness when the black glue is not provided, a larger driving voltage needs to be provided, which will increase the power consumption of the display substrate.
  • the material of the vinyl is silica gel doped with black particles, during the process of grinding the vinyl, the black particles may disintegrate from the silica gel, causing the surface of the vinyl to be uneven after grinding. The appearance of the substrate may have an impact.
  • the display substrate 100 includes a first substrate 1, a plurality of light-emitting devices 2 arranged on one side of the first substrate 1, a light adjusting layer 3, and a second substrate 4.
  • the display substrate 100 has a plurality of sub-pixel regions S arranged in an array.
  • each sub-pixel area S is provided with a light-emitting device 2.
  • the one light-emitting device 2 is used to display the sub-pixels in the corresponding sub-pixel area S.
  • a plurality of light-emitting devices 2 are provided in each sub-pixel area S, which are used for displaying together.
  • a light emitting device 2 is provided in each sub-pixel region S as an example to schematically illustrate the structure of the display substrate 100.
  • the above-mentioned first substrate 1 includes a base substrate 11, a plurality of pixel driving circuits, a plurality of gate lines, a plurality of data lines Data, a plurality of electrode leads 13, and a plurality of solders. point.
  • the plurality of solder joints includes a plurality of anode solder joints 15 and a plurality of cathode solder joints 14.
  • the plurality of gate lines Gate may extend in the first direction X
  • the plurality of data lines Data may extend in the second direction Y, where the first direction X and the second direction Y intersect.
  • the type of the base substrate 11 may include multiple types.
  • the base substrate 11 may be a rigid base substrate, such as a glass base substrate or a PMMA (Polymethyl methacrylate, polymethyl methacrylate) base substrate.
  • a rigid base substrate such as a glass base substrate or a PMMA (Polymethyl methacrylate, polymethyl methacrylate) base substrate.
  • the base substrate 1 adopts a glass base substrate, it is beneficial to improve the accuracy of the wiring (for example, a plurality of pixel driving circuits and a plurality of electrode leads 13) provided on one side thereof.
  • the base substrate 11 may be a flexible base substrate, such as a PET (Polyethylene terephthalate, polyethylene terephthalate) base substrate, PEN (Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate) Glycol ester) substrate or PI (Polyimide, polyimide) substrate.
  • PET Polyethylene terephthalate, polyethylene terephthalate
  • PEN Polyethylene naphthalate two formic acid glycol ester, polyethylene naphthalate) Glycol ester
  • PI Polyimide, polyimide
  • the arrangement of the multiple pixel driving circuits described above is related to the arrangement of the light-emitting device 2.
  • the plurality of pixel driving circuits are respectively located in the plurality of sub-pixel areas S.
  • a plurality of pixel driving circuits arranged in a row along the first direction X may be electrically connected to a gate line Gate
  • a plurality of pixel driving circuits arranged in a row along the second direction Y may be electrically connected to a data line Data.
  • the structure of the pixel driving circuit may include multiple types.
  • the structure of the pixel driving circuit may include structures such as “2T1C”, “6T1C”, “7T1C”, “6T2C” or “7T2C”.
  • T represents a thin film transistor
  • the number before “T” represents the number of thin film transistors
  • C represents a storage capacitor
  • the number before “C” represents the number of storage capacitors.
  • one thin film transistor is a driving transistor.
  • the plurality of electrode leads 13 and the plurality of pixel driving circuits are located on the same side of the base substrate 11.
  • the arrangement of the plurality of electrode leads 13 is related to the arrangement of the light emitting device 2.
  • each electrode lead 13 may be arranged in a row of sub-pixel regions S, and its extending direction may be parallel (or approximately parallel) to the extending direction of the row of sub-pixel regions S (that is, the first direction X).
  • each electrode lead 13 may be arranged in a column of sub-pixel regions S, and its extension direction may also be parallel (or approximately parallel) to the extension direction of the column of sub-pixel regions S (that is, the first One direction Y).
  • the number of electrode leads 13 provided in each row of sub-pixel regions S or each column of sub-pixel regions S is related to the number of light-emitting devices provided in each sub-pixel region S in the row of sub-pixel regions S or the column of sub-pixel regions S
  • the number of 2 is the same.
  • the above-mentioned multiple solder joints are arranged on the side of the multiple pixel driving circuits and the multiple electrode leads 13 away from the base substrate 11.
  • the arrangement of the multiple solder joints is related to the arrangement and structure of the light emitting device 2.
  • each light-emitting device 2 may be, for example, a Mini LED or a Micro LED, and each of the Mini LED or the Micro LED has two electrode pins (for example, a cathode electrode pin and an anode electrode pin).
  • each sub-pixel area S one cathode solder joint 14 and one anode solder joint 15 may be provided.
  • the anode solder joint 15 may be electrically connected to the pixel driving circuit (for example, electrically connected to the driving transistor 12 shown in FIG. 12 ), and the cathode solder joint 14 may be electrically connected to the electrode lead 13.
  • the cathode electrode pin of the light-emitting device 2 can be inserted into the cathode solder joint 14 in the same sub-pixel area S, and the anode electrode pin can be inserted into the anode solder joint 15 in the same sub-pixel area S to realize the light-emitting device 2 and the pixel drive.
  • the pixel driving circuit is configured to provide a driving voltage for the light-emitting device 2; the electrode lead 13 is configured to provide a common voltage for the light-emitting device 2. In this way, under the cooperation between the pixel driving circuit and the electrode lead 13, the light-emitting state of the light-emitting device 2 can be controlled, so that the display substrate 100 can realize gray-scale display.
  • the embodiment of the present disclosure in addition to driving the plurality of light-emitting devices 2 in the above-mentioned driving manner, other driving manners may also be adopted.
  • the embodiment of the present disclosure may also adopt a passive driving method or an IC (Integrated Circuit, integrated circuit) driving method to drive a plurality of light emitting devices 2.
  • the above-mentioned first substrate 1 may include a base substrate 11, a plurality of integrated circuits 16, a plurality of power supply voltage signal lines Vcc, a plurality of first voltage signal lines VR, and a plurality of second voltage signal lines. Voltage signal line VGB and multiple data lines Data.
  • the plurality of power supply voltage signal lines Vcc may extend in the first direction X
  • the plurality of first voltage signal lines VR, the plurality of second voltage signal lines VGB, and the plurality of data lines Data may extend in the second direction Y.
  • An integrated circuit 16 can be electrically connected to at least one light emitting device 2.
  • one driving chip 81 may be electrically connected to three light emitting devices 2.
  • the three light-emitting devices 2 include, for example, a red light-emitting device, a green light-emitting device, and a blue light-emitting device.
  • the anode electrode pin of each red light-emitting device can be electrically connected to a first voltage signal line VR through the anode solder joint 15, and the anode electrode pin of each green light-emitting device can be electrically connected to a first voltage signal line VR through the anode solder joint 11.
  • the second voltage signal line VGB is electrically connected, and the anode electrode pin of each blue light-emitting device can be electrically connected to a second voltage signal line VGB through an anode solder joint.
  • the integrated circuit 16 may have six pins, of which three pins are electrically connected to the cathode electrode pins of the three light-emitting devices 2 through the cathode solder joints 14 respectively.
  • one pin can be electrically connected to a data line Data
  • one pin can be electrically connected to a power supply voltage signal line Vcc
  • the other pin can be grounded.
  • the multiple light-emitting devices 2 are spaced apart from each other, so that there is a gap between the multiple light-emitting devices 2.
  • the light adjusting layer 3 is located in the gap between the plurality of light-emitting devices 2 and on the side surface of the plurality of light-emitting devices 2 away from the first substrate 1, so that at least one The light emitting device 2 is surrounded by the light adjusting layer 3.
  • the light adjusting layer 3 "encloses" the at least one light emitting device 2, that is, the light adjusting layer is relatively close to the side surface of the at least one light emitting device 2 and the surface on the side away from the first substrate 1. In contact, the light adjusting layer forms a relatively complete coverage of the side surface of the at least one light-emitting device 2 and the surface of the side away from the first substrate 1.
  • the at least one light-emitting device 2 can be relatively stably fixed on the first substrate 1 to avoid the light-emitting device 2 It is difficult to make a good electrical connection with the first substrate 1 due to looseness, thereby ensuring a good display effect of the display substrate 100.
  • the material of the light adjusting layer 3 includes a light-absorbing material, which is configured to absorb at least a part of the light directed to the light adjusting layer 3.
  • the light directed to the light adjusting layer 3 includes: light directed to the light adjusting layer 3 from the outside, and light emitted by a plurality of light emitting devices 2.
  • the area of the light emitted from the outside to the light adjustment layer 3 is basically the same as the area of the surface of the light adjustment layer 3 on the side away from the first substrate 1, the light emitted from the outside to the light adjustment layer 3 is basically the same The upper surface can be completely absorbed by the light adjusting layer 3.
  • the light adjusting layer 3 can be used to reduce the amount of light emitted from the outside to the display substrate 100 and emitted by the first substrate 1 and/or the plurality of light-emitting devices 2, so as to display
  • the substrate 100 is in a dark state (that is, the light-emitting device does not emit light)
  • the display surface of the display substrate 100 can be in a darker state, and the contrast of the display substrate 100 can be effectively improved.
  • the material of the light adjustment layer 3 including the light-absorbing material can conduct light Absorption, excluding the part of the light-absorbing material can make the light pass through more smoothly.
  • the light adjusting layer 3 absorbs only a part of the light emitted by the light emitting device 2, which reduces the amount of light absorbed by the light adjusting layer 3 to the light emitted by the light emitting device 2 compared with the related art, which is beneficial to reduce the display substrate 100 Power consumption.
  • the second substrate 4 covers the light adjusting layer 3.
  • the second substrate 4 may be a PET substrate.
  • the PET substrate has better plasticity and higher transparency, which can ensure that the PET substrate has a good light transmittance and reduce or avoid loss of light passing through the PET substrate.
  • the light adjustment layer 3 is formed on one side of the second substrate 4, and then the light adjustment layer 3 and the second substrate 4 are laminated on the first substrate where the plurality of light emitting devices 2 are formed by, for example, a pressing process.
  • the substrate 1 Compared with the related art, it can not only avoid grinding the light adjusting layer 3, so that the surface of the light adjusting layer 3 away from the first substrate 1 is a relatively flat surface, but also can use the second substrate 4 to grind the light adjusting layer. 3 Form protection to prevent damage to the surface of the light adjustment layer 3 away from the first substrate 1 and make the surface chromaticity of the display substrate 100 have a highly consistent surface.
  • a light adjusting layer is provided in the gap between the plurality of light-emitting devices 2 and on the side surface of the plurality of light-emitting devices 2 away from the first substrate 1. 3, and cover the second substrate 4 on the side of the light adjustment layer 3 away from the first substrate 1, so that not only the light adjustment layer 3 can be used to protect the multiple light-emitting devices 2, and the second substrate 4 can be used to adjust the light
  • the layer 3 is protected, and the light adjusting layer 3 can also be used to absorb at least a part of the light directed to the light adjusting layer 3, which improves the contrast of the display substrate 100 and reduces the power consumption of the display substrate 100 compared with the related art.
  • the light adjustment layer 3 and the second substrate 4 are laminated on the first substrate 1 on which a plurality of light-emitting devices 2 are formed by using, for example, a pressing process, the light adjustment layer 3 can be avoided compared with the related art. Grinding saves process, and at the same time can make the surface of the display substrate 100 have a higher consistency.
  • the structure of the light adjustment layer 3 includes multiple types, and the type of the structure of the light adjustment layer 3 used in the display substrate 100 can be selected and set according to actual needs.
  • the structure of the light adjusting layer 3 is schematically described below.
  • the light adjustment layer 3 includes: a first sub-light adjustment layer 31 located in the gap between the plurality of light-emitting devices 2; A second sub-light adjusting layer 32 on one side of the substrate 1.
  • the positional relationship between the first sub-light adjusting layer 31 and the plurality of light emitting devices 2 includes multiple types, which are related to the structure of the plurality of light emitting devices 2.
  • the multiple light emitting devices 2 include Mini LEDs.
  • the positional relationship between the first sub-light adjusting layer 31 and the plurality of light-emitting devices 2 may be: relative to the first substrate 1, the first sub-light adjusting layer 31 is away from the surface of the first substrate 1, and is connected to the plurality of light-emitting devices. 2
  • the surface away from the first substrate 1 is flat, or, as shown in FIG. 4, is lower than the surface of the plurality of light-emitting devices 2 away from the first substrate 1.
  • the first sub-light adjusting layer 31 is all located in the gap between the multiple light-emitting devices 2, and the first sub-light adjusting layer 31 also covers at least a part of the side surfaces of the multiple light-emitting devices 2.
  • the first sub-light adjusting layer 31 is all located in the gap between the plurality of light emitting devices 2, the first sub-light adjusting layer 31 is away from the distance between the surface of the first substrate 1 and the first substrate 1, That is, the thickness of the first sub-light adjusting layer 31.
  • the thickness of the first sub-light adjusting layer 31 may be 80%-100% of the thickness of the multiple light-emitting devices 2 (that is, the size of the multiple light-emitting devices 2 in the direction perpendicular to the first substrate 1).
  • the thickness of the plurality of light emitting devices 2 may be 100 ⁇ m
  • the thickness of the first sub-light adjusting layer 31 may be 80 ⁇ m-100 ⁇ m.
  • the thickness of the plurality of light emitting devices 2 may be 150 ⁇ m
  • the thickness of the first sub-light adjusting layer 31 may be 120 ⁇ m to 150 ⁇ m.
  • the specific thickness of the first sub-light adjusting layer 31 can be selected and set according to actual needs.
  • the multiple light-emitting devices 2 include Mini LEDs or Micro LEDs.
  • the positional relationship between the first sub-light adjusting layer 31 and the plurality of light-emitting devices 2 may also be: relative to the first substrate 1, the first sub-light adjusting layer 31 is far from the surface of the first substrate 1 and is higher than the first substrate 1.
  • the light emitting device 2 is away from the surface of the first substrate 1.
  • a part of the first sub-light adjusting layer 31 is located in the gap between the plurality of light-emitting devices 2, and the other part is located on the side surface of the plurality of light-emitting devices 2 away from the first substrate 1.
  • the first sub-light adjusting layer 31 The layer 31 also covers the exposed surfaces of the multiple light-emitting devices 2 (including the side surfaces of the multiple light-emitting devices 2 and the side surface away from the first substrate 1).
  • the distance between the surface of the first sub-light adjusting layer 31 away from the first substrate 1 and the first substrate 1 may be greater than the thickness of the plurality of light-emitting devices 2 and less than or equal to the thickness of the plurality of light-emitting devices 2 120% of it.
  • the multiple light-emitting devices 2 including Micro LEDs are taken as an example.
  • the thickness of Micro LED is generally relatively small, for example, the thickness can be less than 10 ⁇ m.
  • the thickness of the prepared first sub-light adjusting layer 31 may be about 10 ⁇ m. In this way, relative to the first substrate 1, the first sub-light adjusting layer 31 is far away from the surface of the first substrate 1 and is higher than the surface of the plurality of light-emitting devices 2 away from the first substrate 1.
  • the thickness of the light emitting device 2 may be 10 ⁇ m, and the distance between the surface of the first sub-light adjusting layer 31 away from the first substrate 1 and the first substrate 1 may be greater than 10 ⁇ m and less than or equal to 12 ⁇ m.
  • the specific thickness of the first sub-light adjusting layer 31 can be selected and set according to actual needs.
  • the first sub-light adjusting layer 31 also covers the part of the first substrate 1 in the gap between the plurality of light-emitting devices 2, and there is a gap between the first sub-light adjusting layer 31 and the first substrate 1.
  • the first sub-light adjusting layer 31 can be used to enhance the connectivity between the multiple light-emitting devices 2 and the first substrate 1, so that the multiple light-emitting devices 2 can be more firmly fixed on the first substrate. Bottom 1 on.
  • the material of the first sub-light adjusting layer 31 includes a light-absorbing material, and is configured to absorb at least a part of the light directed to the first sub-light adjusting layer 31.
  • the first sub-light adjusting layer 31 can be used to absorb the light emitted from the outside to the first sub-light adjusting layer 31, weaken or even prevent the light from being reflected by the first substrate 1 and/or the plurality of light-emitting devices 2.
  • the display substrate 100 is in a dark state (that is, the light emitting device does not emit light)
  • the display surface of the display substrate 100 can be made to be in a darker state, which is beneficial to improve the contrast of the display substrate 100.
  • the first sub-light adjusting layer 31 is far away from the surface of the first substrate 1 and is higher than the surface of the plurality of light emitting devices 2 away from the first substrate 1.
  • the distance between the surface of the first sub-light adjusting layer 31 away from the first substrate 1 and the first substrate 1 is at most 120% of the thickness of the light-emitting device 2, which greatly reduces the
  • the size of the first sub-light adjusting layer 31 on the surface of the multiple light-emitting devices 2 away from the first substrate 1 is beneficial to reduce the absorption of the light emitted by the multiple light-emitting devices 2 by the first sub-light adjusting layer 31.
  • the power consumption of the substrate 100 is displayed.
  • the second sub-light-conditioning layer 32 included in the light-conditioning layer 3 is farther from the surface of the first substrate 1 than the first substrate 1, and is higher than the surface of the first substrate 1.
  • the device 2 is far away from the surface of the first substrate 1. That is, a part of the second sub-light adjusting layer 32 will be located between the plurality of light-emitting devices 2 and the second substrate 4, so that it is formed on the first substrate 1 having the plurality of light-emitting devices 2 by using, for example, a pressing process.
  • the part of the second sub-light adjustment layer 32 between the multiple light-emitting devices 2 and the second substrate 4 can be used to protect the multiple light-emitting devices 2 to avoid excessive Each light-emitting device 2 is damaged during the pressing process.
  • the thickness of the second sub-light adjusting layer 32 is related to the positional relationship between the first sub-light adjusting layer 31 and the plurality of light emitting devices 2.
  • the surface of the first sub-light adjusting layer 31 away from the first substrate 1 is level with the surface of the plurality of light-emitting devices 2 away from the first substrate 1, or is higher than the surface of the first substrate 1.
  • the surface of the second sub-light adjusting layer 32 close to the first substrate 1 is a relatively flat surface, so that each part of the second sub-light adjusting layer 32 The thickness will be more uniform.
  • the thickness of the second sub-light adjusting layer 32 can be selected and set according to actual needs. For example, the thickness of the second sub-light adjusting layer 32 may range from 50 ⁇ m to 100 ⁇ m; or, the thickness of the second sub-light adjusting layer 32 may range from 10 ⁇ m. ⁇ 40 ⁇ m.
  • the first sub-light adjusting layer 31 is far from the surface of the first substrate 1, which is lower than the surface of the plurality of light-emitting devices 2 away from the first substrate 1.
  • the surface of the second sub-light adjusting layer 32 close to the first substrate 1 is an uneven surface.
  • the second sub-light adjusting layer 32 includes a first portion 321 and a second portion 322, wherein the orthographic projection of the first portion 321 on the first substrate 1 is the same as the orthographic projection of the plurality of light emitting devices 2 on the first substrate 1.
  • the projections coincide, and the orthographic projection of the second portion 322 on the first substrate 1 coincides with the orthographic projection of the first sub-light adjusting layer 31 on the first substrate 1.
  • the thickness of the first part 321 may range from 20 ⁇ m to 100 ⁇ m.
  • the thickness of the second portion 322 ranges from 50 ⁇ m to 100 ⁇ m.
  • the thickness range of the first portion 321 and the thickness range of the second portion 322 can also be other numerical ranges, which can be selected and set according to actual needs.
  • the above-mentioned second sub-light adjusting layer 32 is a transparent film.
  • the transparent film has a high light transmittance (for example, the light transmittance can be greater than or equal to 90%).
  • the light emitted by the multiple light-emitting devices 2 can pass through the second sub-light adjusting layer 32 to the outside more smoothly, so that the second sub-light adjusting layer 32 can prevent the second sub-light adjusting layer 32 from causing adverse effects on the propagation of the light emitted by the multiple light-emitting devices 2 Influence.
  • the refractive index of the second sub-light adjusting layer 32 is greater than the refractive index of the second substrate 4.
  • the refractive index of the second sub-light adjusting layer 32 may be about 1.5, for example, the refractive index may be 1.49, 1.5, 1.51, or 1.52, etc.; the refractive index of the second substrate 4 may be about 1.4, for example, the refractive index may be It is 1.39, 1.4, 1.41 or 1.42, etc.
  • the refractive index of light from the outside atmosphere is about 1.0
  • the refractive index of the second sub-light adjusting layer 32 is made larger than that of the second substrate 4.
  • the refractive index can make the light emitted by the multiple light-emitting devices 2 radiate from the optically dense medium to the optically thin medium step by step in the process of being emitted to the outside. Compared with the light emitted by a plurality of light-emitting devices 2 directly into the external atmosphere, it is beneficial to guide the emission of light, weaken or even avoid the situation of total reflection.
  • the light adjustment layer 3 includes the first sub-light adjustment layer 31 and the second sub-light adjustment layer 32, and further includes: a third sub-light adjustment layer 33.
  • the third sub-light adjusting layer 33 is located in the gap between the plurality of light-emitting devices 2 and disposed between the first sub-light adjusting layer 31 and the first substrate 1. That is, the third sub-light adjusting layer 33, the first sub-light adjusting layer 31, and the second sub-light adjusting layer 32 are sequentially stacked along the direction of the first substrate 1.
  • the positional relationship between the first sub-light adjusting layer 31 and the plurality of light emitting devices 2 may be: relative to the first substrate 1, the third sub-light adjusting layer 31 is far away from the surface of the first substrate 1, and It is flat with the surface of the plurality of light emitting devices 2 away from the first substrate 1 or, as shown in FIG. 6, is lower than the surface of the plurality of light emitting devices 2 away from the first substrate 1.
  • the third sub-light adjusting layer 33 is all located in the gap between the plurality of light-emitting devices 2, and the third sub-light adjusting layer 33 also covers at least a part of the side surfaces of the plurality of light-emitting devices 2.
  • the material of the third sub-light adjustment layer 33 includes a light-reflecting material, and is configured to reflect the light incident into the third sub-light adjustment layer 33 from the plurality of light-emitting devices 2 back into the plurality of light-emitting devices 2. In this way, when the light emitted by the plurality of light-emitting devices 2 is directed to the side surface of the plurality of light-emitting devices 2 covered by the third sub-light adjusting layer 33, it can be reflected at least once under the action of the third sub-light adjusting layer 33.
  • the reflected light can be emitted from the surface of the multiple light-emitting devices 2 away from the first substrate 1 to the outside, which is beneficial to improve the utilization rate of the light emitted by the multiple light-emitting devices 2 and improve the light efficiency of the display substrate 100 , To reduce the power consumption of the display substrate 100.
  • the third sub-light adjusting layer 33 only covers at least a part of the side surfaces of the multiple light-emitting devices 2, which can ensure that the light emitted by the multiple light-emitting devices 2 can be emitted from the surface away from the first substrate 1 and avoid the light from appearing. After the light-emitting devices 2 are directed away from the surface of the first substrate 1, the light-emitting devices 2 are reflected back into the multiple light-emitting devices 2 and are difficult to be projected to the outside.
  • the reflectivity of the third sub-light adjusting layer 33 is greater than or equal to 70%. This can effectively ensure that the third sub-light adjustment layer 33 has a good reflection effect on the light emitted by each light-emitting device 2 and directed to the third sub-light adjustment layer 33, and ensures that the display substrate 100 has a higher light efficiency and a lower light effect. Power consumption.
  • the reflectivity of the third sub-light adjusting layer 33 may be 70%, 80%, 90%, 95%, or the like.
  • the positional relationship between the first sub-light adjusting layer 31 and the plurality of light emitting devices 2 may be: relative to the first substrate 1.
  • the first sub-light adjusting layer 31 is far away from the surface of the first substrate 1, and is level with the surface of the plurality of light-emitting devices 2 away from the first substrate 1, or is higher or lower than the surface of the plurality of light-emitting devices 2 away from the first substrate.
  • the distance between the surface of the first sub-light adjusting layer 31 away from the first substrate 1 and the first substrate 1 is 80% to 120% of the thickness of the plurality of light emitting devices 2.
  • first sub-light adjusting layer 31 and the second sub-light adjusting layer 32 For other descriptions of the first sub-light adjusting layer 31 and the second sub-light adjusting layer 32, reference may be made to the descriptions of the first sub-light adjusting layer 31 and the second sub-light adjusting layer 32 in some of the above examples, which will not be repeated here.
  • the light adjustment layer 3 may include: a third sub-light adjustment layer 33 and a first sub-light adjustment layer 31.
  • the material of the third sub-light adjusting layer 33 includes a light-reflecting material, and is configured to reflect the light incident from the plurality of light-emitting devices 2 into the third sub-light adjusting layer 33 back into the plurality of light-emitting devices 2.
  • the material of the first sub-light adjusting layer 31 includes a light-absorbing material, and is configured to absorb at least a part of the light directed to the first sub-light adjusting layer 31.
  • the third sub-light adjusting layer 33 is located in the gap between the plurality of light emitting devices 2. Relative to the first substrate 1, the third sub-light adjusting layer 33 is far away from the surface of the first substrate 1, and is level with the surface of the plurality of light-emitting devices 2 away from the first substrate 1, or is lower than the surface of the plurality of light-emitting devices 2 away from the first substrate 1. The surface of the first substrate 1. At this time, the third sub-light adjusting layer 33 is all located in the gap between the multiple light-emitting devices 2, and the third sub-light adjusting layer 33 also covers at least a part of the side surfaces of the multiple light-emitting devices 2.
  • the first sub-light adjusting layer 31 is disposed on the side of the third sub-light adjusting layer 33 away from the first substrate 1. Compared with the first substrate 1, the first sub-light adjusting layer 31 is far away from the surface of the first substrate 1, and is higher than the surface of the plurality of light-emitting devices 2 away from the first substrate 1.
  • the first sub-light adjusting layer 31 is opposite to The plurality of light-emitting devices 2 and the third sub-light adjusting layer 33 form a covering, and a part of the first sub-light adjusting layer 31 is located on the surface of the plurality of light-emitting devices 2 away from the first substrate 1 to form a covering for the plurality of light-emitting devices 2 protect.
  • the third sub-light adjusting layer 33 can be utilized under the cooperation between the third sub-light adjusting layer 33 and the first sub-light adjusting layer 31.
  • the utilization rate of the light emitted by the multiple light-emitting devices 2 is improved, the light efficiency of the display substrate 100 is improved, the power consumption of the display substrate 100 is reduced, and the first sub-light adjustment layer 31 is used to improve the contrast of the display substrate 100.
  • the thickness of the first sub-light adjustment layer 31 can be adjusted to adjust the first sub-light adjustment layer 31 on the surface of the plurality of light-emitting devices 2 away from the first substrate 1.
  • the thickness is 10 ⁇ m
  • the first sub-light adjusting layer 31 can be used to improve the contrast of the display substrate 100 while reducing the emission of the first sub-light adjusting layer 31 to the plurality of light-emitting devices 2
  • the absorption of light reduces the power consumption of the display substrate 100.
  • the materials of each film included in the light adjusting layer 3 include multiple types.
  • the material of the first sub-light adjusting layer 31 includes acrylic glue doped with a light-absorbing material.
  • the light-absorbing material may include carbon black particles, for example.
  • the material of the second sub-light adjusting layer 32 includes acrylic glue.
  • the material of the third sub-light adjusting layer 33 includes acrylic glue doped with a reflective material.
  • the reflective material may include titanium dioxide particles, for example.
  • the above-mentioned acrylic adhesive has the advantages of colorless and transparent, high light transmittance (for example, the light transmittance can be greater than or equal to 90%), and good bonding strength.
  • This can make the light adjustment layer 3 have the advantages of Good adhesion, so that the light adjustment layer 3 and the first substrate 1, each light-emitting device 2, and the second substrate 4 have good adhesion, which can strengthen each light-emitting device 2 and the first substrate. At the same time, it avoids the second substrate 4 or the light adjusting layer 3 from falling off.
  • each light-emitting device 2 includes: a third substrate 22, and a light-emitting device disposed on one side of the third substrate 22 Layer 21.
  • the light-emitting layer 21 is close to the first substrate 1 relative to the third substrate 22.
  • the structure of the light-emitting device 2 is schematically described.
  • the above-mentioned Mini LED includes a third substrate 22, an N-type semiconductor layer 23, a light-emitting layer 21, a P-type semiconductor layer 24, a current blocking layer 25, a conductive layer 26, a Bragg reflective layer 27,
  • the cathode electrode pin 28 may be connected to the electrode lead 13 through the cathode solder joint 14, and the anode electrode pin 29 may be connected through the anode solder joint 15. Connected to the driving transistor 12.
  • the light-emitting layer 21 can emit light, so that the light emitted by each light-emitting layer 21 can pass through the third substrate 22, the light adjusting layer 3, and the second substrate 4 in sequence before being emitted to the outside.
  • the refractive index of the third substrate 22 is greater than the refractive index of the second sub-light adjusting layer 32.
  • the refractive index of the second sub-light adjusting layer 32 is greater than the refractive index of the second substrate 4, and the refractive index of the second substrate 4 is greater than the refractive index of the external atmosphere, the refractive index of the third substrate 22 is set to be greater than the refractive index of the second substrate 4.
  • the refractive index of the two sub-light adjusting layer 32 can make the refractive index of each medium that the light emitted by the light-emitting layer 21 passes through to the outside world gradually decrease according to a certain gradient. Compared with the light directly into the outside atmosphere, it is beneficial to guide the emission of light, weaken or even avoid the situation of total reflection, and improve the efficiency of light emission.
  • the material of the third substrate 22 may include a sapphire material, and the refractive index of the third substrate 22 may be about 1.77.
  • the refractive index may be 1.76, 1.77, 1.78, or the like.
  • the third sub-light adjusting layer 33 is away from the surface of the first substrate 1, and the positional relationship between the third sub-light adjusting layer 33 and the plurality of light emitting devices 2, It may also include: relative to the first substrate 1, the third sub-light adjusting layer 33 is away from the surface of the first substrate 1, and is higher than the surface of the plurality of light-emitting devices 2 away from the first substrate 1. In this way, it can be ensured that the light directed to the third sub-light adjusting layer 33 can basically be reflected back into the light-emitting device 2 to avoid the phenomenon that the reflected light is directed to the adjacent light-emitting device 2 and causes color mixing.
  • the display substrate 100 further includes a reflective layer 5 disposed in the gap between the cathode solder joint 14 and the anode solder joint 15. One side of the substrate 1.
  • the reflective layer 5 By providing the reflective layer 5 on the side of the multiple light-emitting devices 2 close to the first substrate 1, the reflective layer 5 can be used to reflect the light emitted to the reflective layer 5 into the multiple light-emitting devices 2 and pass through the multiple light-emitting devices. 2A side surface away from the first substrate 1 is shot to the outside. This is beneficial to increase the utilization rate of the light emitted by the multiple light-emitting devices 2, improve the light efficiency of the display substrate 100, and reduce the power consumption of the display substrate 100.
  • the material of the reflective layer 5 may be white ink with higher reflectivity.
  • the surface of the side of the second substrate 4 away from the first substrate 1 may be a flat surface.
  • a plurality of microstructures 41 may also be provided on the surface of the second substrate 4 away from the first substrate 1.
  • the plurality of microstructures 41 are configured to change the propagation direction of at least a part of the light from the plurality of light-emitting devices 2 and passing through the second substrate 4.
  • the shape of the plurality of microstructures 41 is related to the change of the propagation direction of at least a part of the light passing through the second substrate 4.
  • the surface shape of the plurality of microstructures 41 includes at least one of a pyramid and a wedge.
  • the tip of the pyramid or wedge is located on the side away from the second substrate 41.
  • the above-mentioned multiple microstructures 41 can collect at least a part of the light from the multiple light-emitting devices 2 and passing through the second substrate 4, which is beneficial to improve the display brightness of the display substrate 100.
  • the size of the microstructure 41 can be selected and set according to actual needs.
  • the height of the microstructure 41 (that is, the size of the microstructure 41 in a direction perpendicular to the first substrate 1) may be about 12 ⁇ m
  • the width of the microstructure 41 (that is, the microstructure 41 as shown in FIG. 9
  • the size of the connection between the structure 41 and the second substrate 4 may be about 24 ⁇ m.
  • the height of the microstructure 41 may be 11 ⁇ m, 12 ⁇ m, or 13 ⁇ m, etc.
  • the width of the micro structure 41 may be 23 ⁇ m, 24 ⁇ m, or 25 ⁇ m, etc.
  • the surface shape of the plurality of microstructures 41 includes at least one of a curved surface and a spherical surface.
  • the plurality of microstructures 41 can diffuse at least part of the light from the plurality of light-emitting devices 2 passing through the second substrate 4, improve the uniformity of light output of the display substrate 100, and avoid glare on the surface of the display substrate 100 .
  • the size of the microstructure 41 can be selected and set according to actual needs.
  • the diameter of the microstructure 41 may be 20 ⁇ m-30 ⁇ m
  • the height of the microstructure 41 (that is, the size of the microstructure 41 in a direction perpendicular to the first substrate 1) may be about 10 ⁇ m.
  • the diameter of the microstructure 41 may be 20 ⁇ m, 23 ⁇ m, 27 ⁇ m, or 30 ⁇ m
  • the height of the micro structure 41 may be 9 ⁇ m, 10 ⁇ m, or 11 ⁇ m.
  • the above-mentioned multiple microstructures and the second substrate 4 are an integral structure. This is beneficial to simplify the structure of the display substrate 100.
  • an etching process may be used to etch the surface of the second substrate 4 away from the first substrate 1 to form the multiple microstructures 41 described above. Since the second substrate 4 has a certain hardness, the structure of the multiple microstructures 41 formed by the etching process is extremely stable and can avoid deformation.
  • the display substrate 100 may be applied to a liquid crystal display device as a light source in a backlight module in the liquid crystal display device.
  • the light adjustment layer 3 may include: a third sub-light adjustment layer 33 located in the gap between the plurality of light-emitting devices 2, and a third sub-light adjustment layer 33 disposed far away from the first liner.
  • the second sub-light adjusting layer 32 on the side of the bottom 1.
  • the third sub-light adjusting layer 33 is far away from the surface of the first substrate 1, and is lower than the light-emitting layer 21 in the plurality of light-emitting devices 2 and is far from the surface of the first substrate 1;
  • the light adjusting layer 32 is far away from the surface of the first substrate 1 and is higher than the surface of the plurality of light emitting devices 2 away from the first substrate 1.
  • the third sub-light adjusting layer 33 can be used to more comprehensively reflect the light emitted from the multiple light-emitting devices 2 from various directions, and the second sub-light adjusting layer 32 and the second substrate 4 can be used to guide the light to avoid The phenomenon of total reflection occurs, and thus, the brightness that can be displayed by the display substrate 100 can be effectively increased.
  • the display substrate 100 further includes a quantum dot film disposed on a side of the second substrate 4 away from the first substrate 1 and respectively located in a plurality of sub-pixel regions.
  • the multiple light-emitting devices 2 all emit blue light, and the blue light will be converted into light of multiple colors, such as red light or green light, after passing through the quantum dot film in the multiple sub-pixel regions.
  • Some embodiments of the present disclosure provide a method for preparing a display substrate. As shown in FIG. 16, the preparation method of the display substrate includes S100-S300.
  • the above-mentioned multiple light emitting devices 2 may include Mini LEDs, or may also include Micro LEDs.
  • Mass Transfer Technology Mass Transfer Technology
  • Mass Transfer Technology may be used to transfer the multiple light-emitting devices 2 to one side of the first substrate 1.
  • the structure of the first substrate 1 the structure of the plurality of light-emitting devices 2, and the connection between the first substrate 1 and the plurality of light-emitting devices 2, reference may be made to the description in some of the above-mentioned embodiments, which will not be repeated here. .
  • a second substrate 4 is provided, and a light-absorbing material is used to form a light adjusting layer 3 on one side of the second substrate 4.
  • the second substrate 4 may be a PET substrate, that is, the second substrate 4 may be a thin film structure made of PET.
  • forming the light adjusting layer 3 on one side of the second substrate 4 includes: coating a material for forming the light adjusting layer 3 on one side of the second substrate 4, and curing the material to form the light adjusting layer 3 Layer 3.
  • the light adjusting layer 3 includes a first sub-light adjusting layer 31 and a second sub-light adjusting layer 32 that are stacked.
  • forming the light adjusting layer 3 on one side of the second substrate 4 may include: coating a material for forming the second sub-light adjusting layer 32 on one side of the second substrate 4 and curing it, Forming the second sub-light adjusting layer 32; coating another thin film (such as a release film) with the material used to form the first sub-light adjusting layer 31 and curing it to form the first sub-light adjusting layer 31; The first sub-light adjusting layer 31 and the second sub-light adjusting layer 32 are laminated, and the film attached to the side of the first sub-light adjusting layer 31 is removed to obtain the light formed on the side of the second substrate 4 Adjustment layer 3.
  • the material of the light adjusting layer 3 further includes acrylic glue.
  • acrylic adhesive has the advantage of curing at room temperature or medium temperature
  • the material for forming the light adjusting layer 3 can be made at room temperature or medium temperature. Curing, so that additional curing operations can be avoided, which is beneficial to simplify the preparation process of the display substrate 100 and save the cost of preparing the display substrate 100.
  • the multiple light-emitting devices 2 can gradually extend into the light adjusting layer 3 until the multiple light-emitting devices 2 are completely embedded in the light adjusting layer 3; Filling is performed until the gaps between the plurality of light-emitting devices 2 are filled.
  • the other part of the light adjustment layer 3 is located on the surface of the plurality of light-emitting devices 2 away from the first substrate 1, that is, between the plurality of light-emitting devices 2 and the second substrate 4, so that the light adjustment layer 3 can be used.
  • the other part protects the multiple light-emitting devices 2 to prevent the second substrate 4 from directly contacting the multiple light-emitting devices 2 and damage the light-emitting devices 2.
  • the light adjusting layer 3 is formed on one side of the second substrate 4, and then a lamination process is used to treat the second substrate with a plurality of light emitting devices 2 formed thereon.
  • a substrate 1 and a second substrate 4 formed with a light adjusting layer 3 are pressed together so that a plurality of light emitting devices 2 are embedded in the light adjusting layer 3, and a part of the light adjusting layer 3 is trapped between the plurality of light emitting devices 2 The other part is located on the side surface of the plurality of light-emitting devices 2 away from the first substrate 1.
  • the light adjustment layer 3 can be used to absorb at least a part of the light directed to the light adjustment layer 3 to improve the display substrate 100 At the same time, the power consumption of the display substrate 100 will not be increased.
  • the preparation method of the display substrate 100 provided by some embodiments of the present disclosure is simple in process and easy to operate, which avoids grinding the light adjustment layer 3, thereby avoiding the surface whitening of the display substrate 100. And make the surface of the display substrate 100 have a higher consistency.
  • the above-mentioned pressing process may include a vacuum pressing process.
  • the second substrate 4 on which the light adjusting layer 3 is formed can be pressed together while vacuuming, so that the light adjusting layer 3 is close to the surface of the multiple light-emitting devices 2 and can be substantially simultaneously with the multiple light-emitting devices 2
  • the contact allows a plurality of light emitting devices 2 to extend into and be embedded in the light adjusting layer 3 at the same time. Moreover, the formation of bubbles between the light adjusting layer 3 and the first substrate 1 is also avoided.
  • the above-mentioned pressing process may include a rolling process.
  • the device 2 is sequentially embedded in the light adjusting layer 3 from one end of the first substrate 1 to the opposite end, and then the temperature rise and defoaming operation is performed. This can reduce or even eliminate bubbles that may occur between the light adjustment layer 3 and the first substrate 1.
  • the hardness of the film on the side close to the plurality of light emitting devices 2 is smaller than the hardness of the film on the side far from the plurality of light emitting devices 2.
  • the light adjustment layer 3 includes a first sub-light adjustment layer 31 and a second sub-light adjustment layer 32 that are stacked.
  • the hardness of the first sub-light adjusting layer 31 is less than the hardness of the second sub-light adjusting layer 32.
  • the first sub-light adjusting layer 31 Relative to the first substrate 1, when the first sub-light adjusting layer 31 is far from the first substrate 1, and is lower than the surface of the plurality of light-emitting devices 2 far away from the first substrate 1, it can be slowed down. And it is convenient to control the speed at which the multiple light-emitting devices 2 extend into the second sub-light adjusting layer 32, so as to prevent the multiple light-emitting devices 2 from penetrating the second sub-light adjusting layer 32 and contacting the second substrate 2, thereby causing It is beneficial to avoid a situation in which multiple light-emitting devices 2 are damaged.
  • some embodiments of the present disclosure may also control the thickness of the second sub-light adjusting layer 32 to control the speed at which the multiple light-emitting devices 2 extend into the light adjusting layer 3.
  • the display device 200 includes the display substrate 100 as provided in some of the above embodiments.
  • the display substrate 100 included in the above-mentioned display device 200 has the same structure and beneficial effects as the display substrate 100 provided in some of the above-mentioned embodiments, and will not be repeated here.
  • the above-mentioned display device 200 further includes: a housing for installing the above-mentioned display substrate 100, and/or a camera installed on the display substrate 100, and the like.
  • the above-mentioned display device 200 is any product or component with a display function, such as electronic paper, mobile phone, tablet computer, television, monitor, notebook computer, digital photo frame, navigator, and so on.

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  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)

Abstract

一种显示基板，包括：第一衬底、多个发光器件、光线调节层以及第二衬底。所述多个发光器件设置在所述第一衬底的一侧，所述多个发光器件相互间隔设置。所述光线调节层位于所述多个发光器件之间的间隙内、以及所述多个发光器件远离所述衬底的一侧表面上，以使至少一个发光器件被所述光线调节层包围。所述光线调节层的材料包括吸光材料，被配置为对射向至所述光线调节层的至少一部分光线进行吸收。所述第二衬底覆盖所述光线调节层。

Description

显示基板及其制备方法、显示装置
本申请要求于2020年03月27日提交的、申请号为202010232324.3的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本公开涉及显示技术领域，尤其涉及一种显示基板及其制备方法、显示装置。
背景技术
次毫米发光二极管(Mini Light Emitting Diode，简称Mini LED)和微型发光二极管(Micro Light Emitting Diode，简称Micro LED)因具有自发光、高效率、高亮度、高可靠度、节能及反应速度快等诸多优点，被应用至微显示、手机电视等中等尺寸显示到影院大屏幕显示等领域中。
发明内容
一方面，提供一种显示基板。所述显示基板包括：第一衬底、多个发光器件、光线调节层以及第二衬底。所述多个发光器件设置在所述第一衬底的一侧，所述多个发光器件相互间隔设置。所述光线调节层位于所述多个发光器件之间的间隙内、以及所述多个发光器件远离所述第一衬底的一侧表面上，以使至少一个发光器件被所述光线调节层包围。所述光线调节层的材料包括吸光材料，被配置为对射向至所述光线调节层的至少一部分光线进行吸收。所述第二衬底覆盖所述光线调节层。
在一些实施例中，所述光线调节层包括：第一子光线调节层和第二子光线调节层。所述第一子光线调节层位于所述多个发光器件之间的间隙内。相对于所述第一衬底，所述第一子光线调节层远离所述第一衬底的表面，与所述多个发光器件远离所述第一衬底的表面持平，或者，高于或低于所述多个发光器件远离所述第一衬底的表面。所述第一子光线调节层的材料包括吸光材料，被配置为对射向至所述第一子光线调节层的至少一部分光线进行吸收。所述第二子光线调节层设置在所述第一子光线调节层远离所述第一衬底的一侧。相对于所述第一衬底，所述第二子光线调节层远离所述第一衬底的表面，高于所述多个发光器件远离所述第一衬底的表面。所述第二子光线调节层为透明薄膜。
在一些实施例中，在相对于所述第一衬底，所述第一子光线调节层远离所述第一衬底的表面，低于所述多个发光器件远离所述第一衬底的表面的情况下，所述第二子光线调节层包括第一部分和第二部分。所述第一部分在所 述第一衬底上的正投影与所述多个发光器件在所述第一衬底上的正投影重合，所述第二部分在所述第一衬底上的正投影与所述第一子光线调节层在所述第一衬底上的正投影重合。所述第一部分的厚度范围为20μm～100μm。所述第二部分的厚度范围为50μm～100μm。
在一些实施例中，所述第二子光线调节层的折射率大于所述第二衬底的折射率。
在一些实施例中，所述第一子光线调节层远离所述第一衬底的表面与所述第一衬底之间的间距，为所述多个发光器件的厚度的80％～120％。
在一些实施例中，所述光线调节层还包括：位于所述多个发光器件之间的间隙内、且设置在所述第一子光线调节层与所述第一衬底之间的第三子光线调节层。相对于所述第一衬底，所述第三子光线调节层远离所述第一衬底的表面，与所述多个发光器件远离所述第一衬底的表面持平，或者，低于所述多个发光器件远离所述第一衬底的表面。所述第三子光线调节层的材料包括反光材料，被配置为将由所述多个发光器件入射至所述第三子光线调节层中的光线反射回所述多个发光器件中。
在一些实施例中，所述光线调节层包括：第一子光线调节层和第三子光线调节层。所述第三子光线调节层位于所述多个发光器件之间的间隙内。相对于所述第一衬底，所述第三子光线调节层远离所述第一衬底的表面，与所述多个发光器件远离所述第一衬底的表面持平，或者，低于所述多个发光器件远离所述第一衬底的表面。所述第三子光线调节层的材料包括反光材料，被配置为将由所述多个发光器件入射至所述第三子光线调节层中的光线反射回所述多个发光器件中。所述第一子光线调节层设置在所述第三子光线调节层远离所述第一衬底的一侧。相对于所述第一衬底，所述第一子光线调节层远离所述第一衬底的表面，高于所述多个发光器件远离所述第一衬底的表面。所述第一子光线调节层的材料包括吸光材料，被配置为对射向至所述第一子光线调节层的至少一部分光线进行吸收。
在一些实施例中，所述第三子光线调节层的反射率大于或等于70％。
在一些实施例中，每个发光器件包括：第三衬底；以及，设置在所述第三衬底一侧的发光层。所述发光层相对于所述第三衬底靠近所述第一衬底。
在一些实施例中，在所述光线调节层包括第二子光线调节层的情况下，所述第三衬底的折射率大于所述第二子光线调节层的折射率。
在一些实施例中，在所述光线调节层包括第三子光线调节层的情况下，相对于所述第一衬底，所述第三子光线调节层远离所述第一衬底的表面，高 于所述多个发光器件远离所述第一衬底的表面。
在一些实施例中，在所述光线调节层包括所述第一子光线调节层的情况下，所述第一子光线调节层的材料包括掺杂有吸光材料的亚克力胶。在所述光线调节层包括第二子光线调节层的情况下，所述第二子光线调节层的材料包括亚克力胶。在所述光线调节层包括第三子光线调节层的情况下，所述第三子光线调节层的材料包括掺杂有反光材料的亚克力胶。
在一些实施例中，所述第二衬底远离所述第一衬底的一侧表面设置有多个微结构。所述多个微结构被配置为，使来自所述多个发光器件并穿过所述第二衬底的至少一部分光线的传播方向发生改变。
在一些实施例中，所述多个微结构的表面形状包括棱锥、楔形、弧面和球面中的至少一种。
另一方面，提供一种显示基板的制备方法。所述显示基板的制备方法包括：提供第一衬底，在所述第一衬底的一侧设置相互间隔的多个发光器件。提供第二衬底，采用吸光材料，在所述第二衬底的一侧形成光线调节层。采用压合工艺，对形成有所述多个发光器件的第一衬底和形成有所述光线调节层的第二衬底进行压合，使所述多个发光器件嵌入所述光线调节层内，并使所述光线调节层的一部分陷入所述多个发光器件之间的间隙内，另一部分位于所述多个发光器件远离所述第一衬底的一侧表面上。
在一些实施例中，所述压合工艺包括真空压合工艺或滚压工艺。
又一方面，提供一种显示装置。所述显示装置，包括：如上述任一实施例中所述的显示基板。
附图说明
为了更清楚地说明本公开中的技术方案，下面将对本公开一些实施例中所需要使用的附图作简单地介绍，显而易见地，下面描述中的附图仅仅是本公开的一些实施例的附图，对于本领域普通技术人员来讲，还可以根据这些附图获得其他的附图。此外，以下描述中的附图可以视作示意图，并非对本公开实施例所涉及的产品的实际尺寸、方法的实际流程等的限制。
图1为根据相关技术中的一种显示基板的制备方法；
图2为根据本公开一些实施例中的一种显示基板的俯视图；
图3为图2所示显示基板的一种沿A-A＇向的剖视图；
图4为图2所示显示基板的另一种沿A-A＇向的剖视图；
图5为图2所示显示基板的又一种沿A-A＇向的剖视图；
图6为图2所示显示基板的又一种沿A-A＇向的剖视图；
图7为图2所示显示基板的又一种沿A-A＇向的剖视图；
图8为图2所示显示基板的又一种沿A-A＇向的剖视图；
图9为图2所示显示基板的又一种沿A-A＇向的剖视图；
图10为图2所示显示基板的又一种沿A-A＇向的剖视图；
图11为根据本公开一些实施例中的一种Mini LED的结构图；
图12为根据本公开一些实施例中的一种显示基板的结构图；
图13为根据本公开一些实施例中的一种显示基板的局部结构图；
图14为根据本公开一些实施例中的另一种显示基板的局部结构图；
图15为根据本公开一些实施例中的又一种显示基板的局部结构图；
图16为根据本公开一些实施例中的一种显示基板的制备方法的流程图；
图17为根据本公开一些实施例中的一种显示基板的制备步骤图；
图18为根据本公开一些实施例中的另一种显示基板的制备步骤图；
图19为根据本公开一些实施例中的一种显示装置的结构图。
具体实施方式
下面将结合附图，对本公开一些实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本公开一部分实施例，而不是全部的实施例。基于本公开所提供的实施例，本领域普通技术人员所获得的所有其他实施例，都属于本公开保护的范围。
除非上下文另有要求，否则，在整个说明书和权利要求书中，术语“包括(comprise)”及其其他形式例如第三人称单数形式“包括(comprises)”和现在分词形式“包括(comprising)”被解释为开放、包含的意思，即为“包含，但不限于”。在说明书的描述中，术语“一个实施例(one embodiment)”、“一些实施例(some embodiments)”、“示例性实施例(exemplary embodiments)”、“示例(example)”或“一些示例(some examples)”等旨在表明与该实施例或示例相关的特定特征、结构、材料或特性包括在本公开的至少一个实施例或示例中。上述术语的示意性表示不一定是指同一实施例或示例。此外，所述的特定特征、结构、材料或特点可以以任何适当方式包括在任何一个或多个实施例或示例中。
以下，术语“第一”、“第二”仅用于描述目的，而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此，限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个该特征。在 本公开实施例的描述中，除非另有说明，“多个”的含义是两个或两个以上。
在描述一些实施例时，可能使用了“连接”及其衍伸的表达。例如，描述一些实施例时可能使用了术语“连接”以表明两个或两个以上部件彼此间有直接物理接触或电接触。
“A、B和C中的至少一个”与“A、B或C中的至少一个”具有相同含义，均包括以下A、B和C的组合：仅A，仅B，仅C，A和B的组合，A和C的组合，B和C的组合，及A、B和C的组合。
“A和/或B”，包括以下三种组合：仅A，仅B，及A和B的组合。
本文中“被配置为”的使用意味着开放和包容性的语言，其不排除适用于或被配置为执行额外任务或步骤的设备。
另外，“基于”的使用意味着开放和包容性，因为“基于”一个或多个所述条件或值的过程、步骤、计算或其他动作在实践中可以基于额外条件或超出所述的值。
如本文所使用的那样，“约”或“近似”包括所阐述的值以及处于特定值的可接受偏差范围内的平均值，其中所述可接受偏差范围如由本领域普通技术人员考虑到正在讨论的测量以及与特定量的测量相关的误差(即，测量系统的局限性)所确定。
本文参照作为理想化示例性附图的剖视图和/或平面图描述了示例性实施方式。在附图中，为了清楚，放大了层和区域的厚度。因此，可设想到由于例如制造技术和/或公差引起的相对于附图的形状的变动。因此，示例性实施方式不应解释为局限于本文示出的区域的形状，而是包括因例如制造而引起的形状偏差。例如，示为矩形的蚀刻区域通常将具有弯曲的特征。因此，附图中所示的区域本质上是示意性的，且它们的形状并非旨在示出设备的区域的实际形状，并且并非旨在限制示例性实施方式的范围。
在相关技术中，Mini LED或Micro LED能够发出多种颜色的光，例如红色、绿色、蓝色或黄色等。Mini LED或Micro LED可以作为像素，应用到显示基板中进行显示。
如图1所示，以应用有多个Mini LED的显示基板为例。在相关技术中，通常会在该多个Mini LED之间的间隙内以及该多个Mini LED的表面涂覆黑胶，并采用研磨工艺对该黑胶进行研磨，使得黑胶中位于多个Mini LED表面的部分的厚度为所需厚度。这样可以利用研磨后的黑胶提高显示装置的对比度。此处，受研磨工艺的限制，目前仅能将黑胶中位于多个Mini LED表面的部分的厚度研磨至40μm～50μm。
如黑胶的厚度大于MiniLED的厚度，在显示基板所显示的亮度与未设置黑胶时的亮度相同的情况下，需要提供更大的驱动电压，会使得显示基板的功耗增大。此外，当黑胶的材质为掺杂有黑色颗粒的硅胶，在对黑胶进行研磨的过程中，黑色颗粒可能会从硅胶中崩离脱落，导致研磨后的黑胶的表面凹凸不平，对显示基板的外观效果可能会产生影响。
如图2所示，本公开的一些实施例提供了一种显示基板100。如图3～图9所示，该显示基板100包括：第一衬底1、设置在第一衬底1一侧的多个发光器件2、光线调节层3以及第二衬底4。
在一些示例中，如图13和图14所示，显示基板100具有呈阵列状排布的多个子像素区域S。
上述多个发光器件2的设置方式包括多种。例如，每个子像素区域S中设置有一个发光器件2，此时，该一个发光器件2用于进行相应子像素区域S中子像素的显示。又如，每个子像素区域S内设置有多个发光器件2，共同用于进行显示。
下面本公开的一些实施例以每个子像素区域S中设置有一个发光器件2为例，对显示基板100的结构进行示意性说明。
在一些示例中，如图12所示，上述第一衬底1包括衬底基板11、多个像素驱动电路、多条栅线Gate、多条数据线Data、多条电极引线13以及多个焊点。其中，该多个焊点包括多个阳极焊点15和多个阴极焊点14。该多条栅线Gate可以沿第一方向X延伸，多条数据线Data可以沿第二方向Y延伸，第一方向X和第二方向Y相交叉。
此处，衬底基板11的类型可以包括多种。
示例性的，衬底基板11可以为刚性衬底基板，例如玻璃衬底基板或PMMA(Polymethyl methacrylate，聚甲基丙烯酸甲酯)衬底基板。在衬底基板1采用玻璃衬底基板的情况下，有利于提高设置在其一侧的线路(例如多个像素驱动电路和多条电极引线13)的精度。
示例性的，衬底基板11可以为柔性衬底基板，例如PET(Polyethylene terephthalate，聚对苯二甲酸乙二醇酯)衬底基板、PEN(Polyethylene naphthalate two formic acid glycol ester，聚萘二甲酸乙二醇酯)衬底基板或PI(Polyimide，聚酰亚胺)衬底基板。
上述多个像素驱动电路的设置方式与发光器件2的设置方式相关。例如，该多个像素驱动电路设置在衬底基板11一侧，在每个子像素区域S中设置有一个发光器件2的情况下，多个像素驱动电路分别位于上述多个子像素区域S 内。其中，沿第一方向X排列成一排的多个像素驱动电路可以与一条栅线Gate电连接，沿第二方向Y排列成一排的多个像素驱动电路可以与一条数据线Data电连接。
此处，像素驱动电路的结构可以包括多种。示例性的，像素驱动电路的结构可以包括“2T1C”、“6T1C”、“7T1C”、“6T2C”或“7T2C”等结构。此处，“T”表示为薄膜晶体管，位于“T”前面的数字表示为薄膜晶体管的数量，“C”表示为存储电容器，位于“C”前面的数字表示为存储电容器的数量。每种结构的像素驱动电路所包括的多个薄膜晶体管中，有一个薄膜晶体管为驱动晶体管。
上述多条电极引线13与上述多个像素驱动电路位于衬底基板11的同一侧。该多条电极引线13的设置方式与发光器件2的设置方式相关。
示例性的，每条电极引线13可以设置在一行子像素区域S中，其延伸方向可以平行(或大约平行)于该行子像素区域S的延伸方向(也即第一方向X)。或者，如图13和图14所示，每条电极引线13可以设置在一列子像素区域S中，其延伸方向也可以平行(或大约平行)于该列子像素区域S的延伸方向(也即第一方向Y)。也即，每行子像素区域S或每列子像素区域S中所设置的电极引线13的数量，与该行子像素区域S或该列子像素区域S中各子像素区域S中所设置的发光器件2的数量相同。
如图12所示，上述多个焊点设置在多个像素驱动电路和多条电极引线13远离衬底基板11一侧。
多个焊点的设置方式与发光器件2的设置方式及结构相关。
示例性的，每个发光器件2例如可以为Mini LED或Micro LED，该Mini LED或Micro LED均具有两个电极引脚(例如阴极电极引脚以及阳极电极引脚)。此时，如图13和图14所示，在每个子像素区域S中，可以设置有一个阴极焊点14和一个阳极焊点15。同一子像素区域S中，阳极焊点15可以与像素驱动电路电连接(例如与图12中所示的驱动晶体管12电连接)，阴极焊点14可以与电极引线13电连接。这样发光器件2的阴极电极引脚可以插入同一个子像素区域S中的阴极焊点14内，阳极电极引脚可以插入同一个子像素区域S中的阳极焊点15内，实现发光器件2与像素驱动电路和电极引线14之间的电连接。
此处，像素驱动电路被配置为，为发光器件2提供驱动电压；电极引线13被配置为，为发光器件2提供公共电压。这样，在像素驱动电路和电极引线13之间的配合下，便可以控制发光器件2的发光状态，进而使得显示基板 100实现灰阶显示。
当然，本公开实施例除了采用上述驱动方式对多个发光器件2进行驱动以外，还可以采用其他的驱动方式。例如，本公开实施例还可以采用无源驱动的方式或IC(Integrated Circuit，集成电路)驱动的方式对多个发光器件2进行驱动。
示例性的，如图15所示，上述第一衬底1可以包括衬底基板11、多个集成电路16、多条供电电压信号线Vcc、多条第一电压信号线VR、多条第二电压信号线VGB和多条数据线Data。其中，该多条供电电压信号线Vcc可以沿第一方向X延伸，该多条第一电压信号线VR、多条第二电压信号线VGB和多条数据线Data可以沿第二方向Y延伸。
一个集成电路16可以和至少一个发光器件2电连接。例如，如图15所示，一个驱动芯片81可以与三个发光器件2电连接。该三个发光器件2例如包括一个红色发光器件、一个绿色发光器件和一个蓝色发光器件。
在此情况下，每个红色发光器件的阳极电极引脚可以通过阳极焊点15与一条第一电压信号线VR电连接，每个绿色发光器件的阳极电极引脚可以通过阳极焊点11与一条第二电压信号线VGB电连接，每个蓝色发光器件的阳极电极引脚可以通过阳极焊点与一条第二电压信号线VGB电连接。
例如，如图15所示，集成电路16可以有六个引脚，其中三个引脚分别通过阴极焊点14与三个发光器件2的阴极电极引脚一一对应地电连接。另外三个引脚中，一个引脚可以与一条数据线Data电连接，一个引脚可以与一条供电电压信号线Vcc电连接，另一个引脚可以接地。
在一些示例中，如图2所示，上述多个发光器件2相互间隔设置，也就使得多个发光器件2之间具有间隙。如图3～图9所示，上述光线调节层3位于该多个发光器件2之间的间隙内、以及该多个发光器件2远离第一衬底1的一侧表面上，以使至少一个发光器件2被光线调节层3包围。
此处，光线调节层3对至少一个发光器件2形成“包围”，也即，光线调节层与至少一个发光器件2的侧面、以及远离第一衬底1的一侧的表面之间较为紧密地接触，光线调节层对至少一个发光器件2的侧面、以及远离第一衬底1的一侧的表面形成了较为完全地覆盖。这样不仅可以对该至少一个发光器件2的表面形成保护，确保该至少一个发光器件2的品质，还可以将该至少一个发光器件2较为稳定的固定在第一衬底1上，避免发光器件2产生松动难以与第一衬底1良好电连接，进而确保显示基板100的良好显示效果。
在一些示例中，光线调节层3的材料包括吸光材料，被配置为对射向至光线调节层3的至少一部分光线进行吸收。
此处，射向至光线调节层3的光线包括：由外界射向至光线调节层3的光线，以及多个发光器件2所发出的光线。
由于由外界射向至光线调节层3的光线的面积，与光线调节层3的远离第一衬底1一侧的表面的面积基本相同，因此，由外界射向至光线调节层3的光线基本上能够全部被光线调节层3吸收。这样在显示基板100进行显示的过程中，可以利用光线调节层3减少由外界射向至显示基板100并被第一衬底1和/或多个发光器件2所射的光线的量，在显示基板100表现为暗态(即发光器件不出光)的情况下，可以使得显示基板100的显示面处于更黑的状态，有效提高显示基板100的对比度。
由于发光器件2所发出的光线的传播反向基本为任意方向，这样在发光器件2所发出的光线射向至光线调节层3时，光线调节层3的材料包括吸光材料的部分可以对光线进行吸收，而不包括吸光材料的部分则可以使得光线较为顺利的穿过。这样使得光线调节层3仅对发光器件2所发出的光线的一部分进行吸收，相比相关技术，减少了光线调节层3对发光器件2所发出光线的吸收的量，有利于降低显示基板100的功耗。
在一些示例中，如图3～图9所示，第二衬底4覆盖光线调节层3。
示例性的，第二衬底4可以为PET衬底。该PET衬底具有较好的塑性以及较高的透明度，这样可以确保该PET衬底具有良好的光线透过率，减少或避免对穿过PET衬底的光线产生损耗。
在本示例中，光线调节层3形成在第二衬底4的一侧，然后采用例如压合工艺将光线调节层3和第二衬底4压合在形成有多个发光器件2的第一衬底1上。这样相比相关技术，不仅可以避免对光线调节层3进行研磨，使得光线调节层3远离第一衬底1的一侧表面为较为平整的表面，还可以利用第二衬底4对光线调节层3形成保护，避免光线调节层3远离第一衬底1的一侧表面受到损伤，并使得显示基板100的表面色度具有较高一致性的表面。
由此，本公开的一些实施例所提供的显示基板100，通过在多个发光器件2之间的间隙内、及多个发光器件2远离第一衬底1的一侧表面上设置光线调节层3，并在光线调节层3远离第一衬底1的一侧覆盖第二衬底4，这样不仅可以利用光线调节层3对多个发光器件2形成保护，利用第二衬底4对光线调节层3进行保护，还可以利用光线调节层3对射向至光线调节层3的至少一部分光线进行吸收，在提高显示基板100的对比度的同时，相比相关技术 降低显示基板100的功耗。此外，由于光线调节层3和第二衬底4是采用例如压合工艺压合在形成有多个发光器件2的第一衬底1上的，相比相关技术可以避免对光线调节层3进行研磨，节省工艺，同时能够使得显示基板100的表面具有较高一致性。
本公开的一些实施例中，光线调节层3的结构包括多种，显示基板100中所采用的光线调节层3的结构的种类，可以根据实际需要选择设置。下面对光线调节层3的结构进行示意性说明。
在一些实施例中，如图4所示，光线调节层3包括：位于多个发光器件2之间的间隙内的第一子光线调节层31，以及设置在第一子光线调节层31远离第一衬底1一侧的第二子光线调节层32。
在一些示例中，第一子光线调节层31与多个发光器件2之间的位置关系包括多种，其与多个发光器件2的结构相关。
示例性的，多个发光器件2包括Mini LED。第一子光线调节层31与多个发光器件2之间的位置关系可以为：相对于第一衬底1，第一子光线调节层31远离第一衬底1的表面，与多个发光器件2远离第一衬底1的表面持平，或者，如图4所示，低于多个发光器件2远离第一衬底1的表面。此时，第一子光线调节层31全部位于多个发光器件2之间的间隙内，第一子光线调节层31也便覆盖了多个发光器件2的侧面的至少一部分。
此处，由于第一子光线调节层31全部位于多个发光器件2之间的间隙内，第一子光线调节层31远离第一衬底1的表面与第一衬底1之间的间距，即为第一子光线调节层31的厚度。第一子光线调节层31的厚度，可以为多个发光器件2的厚度(也即多个发光器件2在垂直于第一衬底1的方向上的尺寸)的80％～100％。例如，多个发光器件2的厚度可以为100μm，则第一子光线调节层31的厚度可以为80μm～100μm。例如，多个发光器件2的厚度可以为150μm，则第一子光线调节层31的厚度可以为120μm～150μm。第一子光线调节层31的具体厚度可以根据实际需要选择设置。
示例性的，多个发光器件2包括Mini LED或Micro LED。第一子光线调节层31与多个发光器件2之间的位置关系还可以为：相对于第一衬底1，第一子光线调节层31远离第一衬底1的表面，高于多个发光器件2远离第一衬底1的表面。此时，第一子光线调节层31的一部分位于多个发光器件2之间的间隙内，另一部分位于多个发光器件2的远离第一衬底1的一侧表面上，第一子光线调节层31也便覆盖了多个发光器件2的裸露的表面(包括多个发光器件2的侧面、及远离第一衬底1的一侧表面)。
此处，第一子光线调节层31远离第一衬底1的表面与第一衬底1之间的间距，可以大于多个发光器件2的厚度，并小于或等于多个发光器件2的厚度的120％。
本示例以多个发光器件2包括Micro LED为例。其中，Micro LED的厚度一般比较小，例如厚度可以在10μm以下。考虑到第一子光线调节层31的制备工艺，在第一子光线调节层31的厚度较薄的情况下，制备形成的第一子光线调节层31的厚度可以约为10μm左右。这样相对于第一衬底1，第一子光线调节层31远离第一衬底1的表面，则会高于多个发光器件2远离第一衬底1的表面。例如，发光器件2的厚度可以为10μm，则第一子光线调节层31远离第一衬底1的表面与第一衬底1之间的间距可以大于10μm，并小于或等于12μm。第一子光线调节层31的具体厚度可以根据实际需要选择设置。
需要说明的是，第一子光线调节层31还覆盖了第一衬底1位于多个发光器件2之间的间隙的部分，在第一子光线调节层31和第一衬底1之间具有较大附着力的情况下，可以利用第一子光线调节层31增强多个发光器件2与第一衬底1之间的连接性，使得多个发光器件2能够更为牢固地固定在第一衬底1上。
在一些示例中，第一子光线调节层31的材料包括吸光材料，被配置为对射向至第一子光线调节层31的至少一部分光线进行吸收。这样可以利用第一子光线调节层31对由外界射向至第一子光线调节层31的光线进行吸收，削弱甚至避免该光线被第一衬底1和/或多个发光器件2反射，在显示基板100表现为暗态(即发光器件不出光)的情况下，可以使得显示基板100的显示面处于更黑的状态，这样有利于提高显示基板100的对比度。
此外，在上述示例中，在相对于第一衬底1，第一子光线调节层31远离第一衬底1的表面，高于多个发光器件2远离第一衬底1的表面的情况下，第一子光线调节层31远离第一衬底1的表面与第一衬底1之间的间距，最大为发光器件2的厚度的120％，这样相比于相关技术，大大减小了位于多个发光器件2远离第一衬底1一侧表面上的第一子光线调节层31的尺寸，有利于减少第一子光线调节层31对多个发光器件2所发出的光线的吸收，降低显示基板100的功耗。
在另一些示例中，如图4所示，光线调节层3所包括的第二子光线调节层32，相对于第一衬底1，其远离第一衬底1的表面，高于多个发光器件2远离第一衬底1的表面。也即，第二子光线调节层32的一部分会位于多个发光器件2和第二衬底4之间，这样在采用例如压合工艺在具有多个发光器件2 的第一衬底1上形成光线调节层3和第二衬底4时，可以利用第二子光线调节层32的位于多个发光器件2和第二衬底4之间的部分，对多个发光器件2进行保护，避免多个发光器件2在压合的过程中受到损伤。
此处，第二子光线调节层32的厚度，和第一子光线调节层31与多个发光器件2之间的位置关系相关。
示例性的，在相对于第一衬底1，第一子光线调节层31远离第一衬底1的表面，与多个发光器件2远离第一衬底1的表面持平，或者，高于多个发光器件2远离第一衬底1的表面的情况下，第二子光线调节层32靠近第一衬底1的一侧表面为较为平坦的表面，使得第二子光线调节层32的各个部分的厚度会较为均一。第二子光线调节层32的厚度可以根据实际需要选择设置，例如，第二子光线调节层32的厚度的范围可以为50μm～100μm；或者，第二子光线调节层32的厚度的范围可以10μm～40μm。
示例性的，如图4所示，在相对于第一衬底1，第一子光线调节层31远离第一衬底1的表面，低于多个发光器件2远离第一衬底1的表面的情况下，第二子光线调节层32靠近第一衬底1的一侧表面为凹凸不平的表面。此时，第二子光线调节层32包括第一部分321和第二部分322，其中，第一部分321在第一衬底1上的正投影与多个发光器件2在第一衬底1上的正投影重合，第二部分322在第一衬底1上的正投影与第一子光线调节层31在第一衬底1上的正投影重合。第一部分321的厚度范围可以为20μm～100μm。第二部分322的厚度范围为50μm～100μm。
当然，第一部分321的厚度范围和第二部分322的厚度范围也可以为其他的数值范围，可以根据实际需要选择设置。
在一些示例中，上述第二子光线调节层32为透明薄膜。该透明薄膜具有较高的光线透过率(例如光线透过率可以大于或等于90％)。多个发光器件2所发出的光线可以较为顺利的穿过第二子光线调节层32射到外界，这样可以避免第二子光线调节层32对多个发光器件2所发出的光线的传播产生不良影响。
在一些示例中，第二子光线调节层32的折射率大于第二衬底4的折射率。示例性的，第二子光线调节层32的折射率可以为1.5左右，例如折射率可以为1.49、1.5、1.51或1.52等；第二衬底4的折射率可以为1.4左右，例如折射率可以为1.39、1.4、1.41或1.42等。
由于外界大气的光线的折射率为1.0左右，通过设置第二子光线调节层32和第二衬底4的折射率，并使得第二子光线调节层32的折射率大于第二衬 底4的折射率，可以使得多个发光器件2所发出的光线在射向外界的过程中中，从光密介质逐级射向光疏介质。这样相比多个发光器件2所发出的光线直接射向外界大气中，有利于引导光线的射出，削弱甚至避免出现全反射的情况。
在另一些实施例中，如图6所示，光线调节层3在包括第一子光线调节层31和第二子光线调节层32的基础上，还包括：第三子光线调节层33。该第三子光线调节层33位于多个发光器件2之间的间隙内、且设置在第一子光线调节层31与第一衬底1之间。也即，第三子光线调节层33、第一子光线调节层31和第二子光线调节层32沿第一衬底1的方向，依次层叠设置。
在一些示例中，第一子光线调节层31与多个发光器件2之间的位置关系可以为：相对于第一衬底1，第三子光线调节层31远离第一衬底1的表面，与多个发光器件2远离第一衬底1的表面持平，或者，如图6所示，低于多个发光器件2远离第一衬底1的表面。此时，第三子光线调节层33全部位于多个发光器件2之间的间隙内，第三子光线调节层33也便对多个发光器件2的侧面的至少一部分形成了覆盖。
在一些示例中，第三子光线调节层33的材料包括反光材料，被配置为将由多个发光器件2入射至第三子光线调节层33中的光线反射回多个发光器件2中。这样多个发光器件2所发出的光线在射向被第三子光线调节层33覆盖的多个发光器件2的侧面时，便可以在第三子光线调节层33的作用下发生之少一次反射，使得反射后的光线可以从多个发光器件2的远离第一衬底1的表面射向至外界，有利于提高多个发光器件2所发出的光线的利用率，提高显示基板100的光效，降低显示基板100的功耗。
第三子光线调节层33仅对多个发光器件2的侧面的至少一部分形成覆盖，可以确保多个发光器件2所发出的光线能够从其远离第一衬底1的表面射出，避免出现该光线在射向多个发光器件2远离第一衬底1的表面后，被反射回多个发光器件2内而难以射向外界的情况。
在一些示例中，第三子光线调节层33的反射率大于或等于70％。这样可以有效确保第三子光线调节层33对各发光器件2所发出的并射向第三子光线调节层33的光线具有良好的反射效果，确保显示基板100具有较高的光效，较低的功耗。示例性的，第三子光线调节层33的反射率可以为70％、80％、90％或95％等。
此处，在光线调节层3还包括第三子光线调节层33的情况下，关于第一子光线调节层31与多个发光器件2之间的位置关系，可以为：相对于第一衬 底1，第一子光线调节层31远离第一衬底1的表面，与多个发光器件2远离第一衬底1的表面持平，或者，高于或低于多个发光器件2远离第一衬底1的表面。例如，第一子光线调节层31远离第一衬底1的表面与第一衬底1之间的间距，为多个发光器件2的厚度的80％～120％。关于第一子光线调节层31和第二子光线调节层32的其他说明，可以参照上述一些示例中对第一子光线调节层31和第二子光线调节层32的说明，此处不在赘述。
在又一些实施例中，如图5所示，光线调节层3可以包括：第三子光线调节层33和第一子光线调节层31。其中，第三子光线调节层33的材料包括反光材料，被配置为将由多个发光器件2入射至第三子光线调节层33中的光线反射回多个发光器件2中。第一子光线调节层31的材料包括吸光材料，被配置为对射向至第一子光线调节层31的至少一部分光线进行吸收。
在一些示例中，如图5所示，第三子光线调节层33位于多个发光器件2之间的间隙内。相对于第一衬底1，第三子光线调节层33远离第一衬底1的表面，与多个发光器件2远离第一衬底1的表面持平，或者，低于多个发光器件2远离第一衬底1的表面。此时，第三子光线调节层33全部位于多个发光器件2之间的间隙内，第三子光线调节层33也便对多个发光器件2的侧面的至少一部分形成了覆盖。
在一些示例中，如图5所示，第一子光线调节层31设置在第三子光线调节层33远离第一衬底1的一侧。相对于第一衬底1，第一子光线调节层31远离第一衬底1的表面，高于多个发光器件2远离第一衬底1的表面。也即，无论第三子光线调节层33远离第一衬底1的表面，与多个发光器件2远离第一衬底1的表面之间的位置关系如何，第一子光线调节层31均对多个发光器件2和第三子光线调节层33形成了覆盖，且第一子光线调节层31的一部分位于多个发光器件2远离第一衬底1的表面上，对多个发光器件2形成保护。
通过设置第三子光线调节层33和第一子光线调节层31，能够在第三子光线调节层33和第一子光线调节层31之间的配合作用下，利用第三子光线调节层33提高多个发光器件2所发出的光线的利用率，提高显示基板100的光效，降低显示基板100的功耗，并利用第一子光线调节层31，提高显示基板100的对比度。
此外，在制备形成光线调节层3的过程中，可以通过调整第一子光线调节层31的厚度，调整第一子光线调节层31的位于多个发光器件2远离第一衬底1的表面上的一部分的厚度(例如该厚度为10μm)，以便于能够在利用第一子光线调节层31提高显示基板100的对比度的同时，减少第一子光线调 节层31对多个发光器件2所发出的光线的吸收，降低显示基板100的功耗。
此处，对于第三子光线调节层33和第一子光线调节层31的其他说明，可以参照上述一些示例中对第三子光线调节层33和第一子光线调节层31的说明，此处不在赘述。
在上述一些实施例中，光线调节层3所包括的各个薄膜的材料包括多种。
在一些示例中，在光线调节层3包括第一子光线调节层31的情况下，第一子光线调节层31的材料包括掺杂有吸光材料的亚克力胶。该吸光材料例如可以包括炭黑颗粒。
在一些示例中，在光线调节层3包括第二子光线调节层32的情况下，第二子光线调节层32的材料包括亚克力胶。
在一些示例中，在光线调节层3包括第三子光线调节层33的情况下，第三子光线调节层33的材料包括掺杂有反光材料的亚克力胶。该反光材料例如可以包括钛白颗粒。
上述亚克力胶具有无色透明、较高的光线透过率(例如光线透过率可以大于或等于90％)和胶接强度良好等优点，这样可以使得光线调节层3中的各个薄膜之间具有良好的粘接性，使得光线调节层3和第一衬底1、各发光器件2、第二衬底4之间均具有良好的粘接性，能够在增强各发光器件2与第一衬底1之间的连接性的同时，避免出现第二衬底4或光线调节层3脱落的情况。
在一些实施例中，如图7所示，显示基板100所包括的多个发光器件2中，每个发光器件2包括：第三衬底22，以及设置在第三衬底22一侧的发光层21。该发光层21相对于第三衬底22靠近所述第一衬底1。
下面，如图11所示，以发光器件2为Mini LED为例，对发光器件2的结构进行示意性说明。
如图11所示，上述Mini LED包括依次层叠设置的第三衬底22、N型半导体层23、发光层21、P型半导体层24、电流阻隔层25、导电层26、布拉格反射层27、阴极电极引脚28以及阳极电极引脚29，其中，阴极电极引脚28与N型半导体层23连接，阳极电极引脚29与导电层26连接。
在将图11中所示的结构应用于图12中所示的结构的情况下，阴极电极引脚28可以通过阴极焊点14与电极引线13连接，阳极电极引脚29可以通过阳极焊点15与驱动晶体管12连接。
本实施例中，发光层21能够发出光线，这样每个发光层21所发出的光线，可以在依次穿过第三衬底22、光线调节层3和第二衬底4之后，射向外 界。
在一些示例中，在光线调节层3包括第二子光线调节层32的情况下，第三衬底22的折射率大于第二子光线调节层32的折射率。
由于第二子光线调节层32的折射率大于第二衬底4的折射率，第二衬底4的折射率大于外界大气的折射率，通过将第三衬底22的折射率设置为大于第二子光线调节层32的折射率，可以使得发光层21所发出的光线在射向外界的过程中，所需穿过的各介质的折射率按照一定的梯度逐渐降低。这样相比光线直接射向外界大气中，有利于引导光线的射出，削弱甚至避免出现全反射的情况，提高出光效率。
示例性的，第三衬底22的材料可以包括蓝宝石材料，第三衬底22的折射率可以为1.77左右。例如，该折射率可以为1.76、1.77或1.78等。
在一些示例中，在光线调节层3包括第三子光线调节层33的情况下，第三子光线调节层33远离第一衬底1的表面，与多个发光器件2之间的位置关系，还可以包括：相对于第一衬底1，第三子光线调节层33远离第一衬底1的表面，高于多个发光器件2远离第一衬底1的表面。这样可以确保射向至第三子光线调节层33的光线能够基本上都被反射回发光器件2中，避免出现被反射的光线射向相邻发光器件2并引起混色的现象。
在一些实施例中，如图12所示，显示基板100还包括设置在阴极焊点14和阳极焊点15之间的间隙内的反射层5，该反射层5位于多个发光器件2靠近第一衬底1的一侧。
通过在多个发光器件2靠近第一衬底1的一侧设置反射层5，可以利用该反射层5将射向反射层5的光线反射会多个发光器件2内，并经多个发光器件2远离第一衬底1的一侧表面射向外界。这样有利于提高多个发光器件2所发出的光线的利用率，提高显示基板100的光效，降低显示基板100的功耗。
示例性的，反射层5的材料可以为具有较高反射率的白色油墨。
在一些实施例中，第二衬底4远离第一衬底1的一侧表面可以为平整的表面。当然，如图8和图9所示，第二衬底4远离第一衬底1的一侧表面还可以设置有多个微结构41。该多个微结构41被配置为，使来自多个发光器件2并穿过第二衬底4的至少一部分光线的传播方向发生改变。
此处，上述多个微结构41的形状，与对穿过第二衬底4的至少一部分光线的传播方向的改变状况相关。
在一些示例中，如图8所示，上述多个微结构41的表面形状包括棱锥和 楔形中的至少一种。棱锥或楔形的尖端位于远离第二衬底41的一侧。此时，上述多个微结构41能够使来自多个发光器件2并穿过第二衬底4的至少一部分光线发生聚集，有利于提高显示基板100的显示亮度。
此处，微结构41的尺寸可以根据实际需要选择设置。示例性的，微结构41的高度(也即微结构41在沿垂直于第一衬底1的方向上的尺寸)可以为12μm左右，微结构41的宽度(也即如图9中所示微结构41与第二衬底4连接处的尺寸)可以为24μm左右。例如，微结构41的高度可以为11μm、12μm或13μm等，微结构41的宽度可以为23μm、24μm或25μm等。
在另一些示例中，如图9所示，上述多个微结构41的表面形状包括弧面和球面中的至少一种。此时，上述多个微结构41能够使来自多个发光器件2并穿过第二衬底4的至少一部分光线发生扩散，提高显示基板100的出光均匀性，避免显示基板100的表面出现眩光现象。
此处，微结构41的尺寸可以根据实际需要选择设置。示例性的，微结构41的直径可以为20μm～30μm，微结构41的高度(也即微结构41在沿垂直于第一衬底1的方向上的尺寸)可以为10μm左右。例如，微结构41的直径可以为20μm、23μm、27μm或30μm等，微结构41的高度可以为9μm、10μm或11μm等。
在一些示例中，上述多个微结构与第二衬底4为一体结构。这样有利于简化显示基板100的结构。
示例性的，可以采用刻蚀工艺对第二衬底4远离第一衬底1的一侧表面进行刻蚀，形成上述多个微结构41。由于第二衬底4具有一定的硬度，因此采用刻蚀工艺形成的多个微结构41结构极为稳定，能够避免发生变形。
此外，在一些实施例中，显示基板100可以应用于液晶显示装置中，作为该液晶显示装置中的背光模组中的光源。
此时，如图10所示，光线调节层3可以包括：位于多个发光器件2之间的间隙内的第三子光线调节层33，以及设置在第三子光线调节层33远离第一衬底1一侧的第二子光线调节层32。其中，相对于第一衬底1，第三子光线调节层33远离第一衬底1的表面，低于多个发光器件2中的发光层21远离第一衬底1的表面；第二子光线调节层32远离第一衬底1的表面，高于多个发光器件2远离第一衬底1的表面。这样可以利用第三子光线调节层33对多个发光器件2从各方向射出的光线，进行较为全面的反射，并利用第二子光线调节层32和第二衬底4对光线进行引导，避免出现全反射的现象，由此，可以有效增大显示基板100所能显示的亮度。
在此基础上，显示基板100还包括设置在第二衬底4远离第一衬底1一侧的、且分别位于多个子像素区域的量子点薄膜。示例性的，多个发光器件2均发出蓝色光，该蓝色光在穿过多个子像素区域内的量子点薄膜后，会转化为多种颜色的光，例如红光色或绿色光。
本公开的一些实施例提供了一种显示基板的制备方法。如图16所示，该显示基板的制备方法包括S100～S300。
S100，如图17中(a)和(b)以及图18中(a)和(b)所示，提供第一衬底1，在第一衬底1的一侧设置相互间隔的多个发光器件2。
在一些示例中，上述多个发光器件2可以包括Mini LED，或者也可以包括Micro LED。在第一衬底1的一侧设置多个发光器件2时，例如可以采用巨量转移技术(Mass Transfer Technology)将多个发光器件2转移至第一衬底1的一侧。
此处，关于第一衬底1的结构、多个发光器件2的结构以及第一衬底1和多个发光器件2之间的连接可以参照上述一些实施例中的说明，此处不再赘述。
S200，如图17中(c)以及图18中(c)所示，提供第二衬底4，采用吸光材料，在第二衬底4的一侧形成光线调节层3。
示例性的，第二衬底4可以为PET衬底，也即，第二衬底4可以为采用PET制成的薄膜结构。
在一些示例中，在第二衬底4的一侧形成光线调节层3，包括：在第二衬底4的一侧涂覆用于形成光线调节层3的材料，并进行固化，形成光线调节层3。
在一些示例中，如图17中(c)以及图18中(c)所示，光线调节层3包括层叠设置的第一子光线调节层31和第二子光线调节层32。
此时，在第二衬底4的一侧形成光线调节层3，例如可以包括：在第二衬底4的一侧涂覆用于形成第二子光线调节层32的材料，并进行固化，形成第二子光线调节层32；在另一薄膜(例如离型膜)上涂覆用于形成第一子光线调节层31的材料，并进行固化，形成第一子光线调节层31；之后将第一子光线调节层31和第二子光线调节层32进行覆合，并去除贴合在第一子光线调节层31一侧的薄膜，便可以得到形成在第二衬底4一侧的光线调节层3。
S300，如图17中(d)和(e)以及图18中(d)和(e)所示，采用压合工艺，对形成有上述多个发光器件2的第一衬底1和形成有光线调节层3的第二衬底4进行压合，使上述多个发光器件2嵌入光线调节层3内，并使 光线调节层3的一部分陷入上述多个发光器件2之间的间隙内，另一部分位于上述多个发光器件2远离第一衬底1的一侧表面上。
在一些示例中，光线调节层3的材料还包括亚克力胶。
由于亚克力胶具有在室温或中温下固化的优点，这样在上述S200中，在第二衬底4的一侧形成光线调节层3时，便可以在室温或中温下使得形成光线调节层3的材料固化，这样可以避免额外再进行固化的操作，有利于简化显示基板100的制备工艺，节约制备显示基板100的成本。
由于亚克力胶具有一定的弹性以及填补断差的功能，这样在对形成有上述多个发光器件2的第一衬底1和形成有光线调节层3的第二衬底4进行压合的过程中，多个发光器件2能够逐渐伸入光线调节层3中，直至多个发光器件2完全嵌入光线调节层3的内部；光线调节层3中的一部分能够向多个发光器件2之间的间隙内进行填补，直至多个发光器件2之间的间隙被填满。
光线调节层3的另一部分位于多个发光器件2远离第一衬底1的一侧表面上，也即该多个发光器件2与第二衬底4之间，这样可以利用光线调节层3的另一部分对多个发光器件2形成保护，避免第二衬底4与多个发光器件2直接接触，对发光器件2造成损伤。
本公开的一些实施例所提供的显示基板100的制备方法，通过先将光线调节层3形成在第二衬底4的一侧，再采用压合工艺，对形成有多个发光器件2的第一衬底1和形成有光线调节层3的第二衬底4进行压合，使得多个发光器件2嵌入光线调节层3内，并使光线调节层3的一部分陷入多个发光器件2之间的间隙内，另一部分位于多个发光器件2远离第一衬底1的一侧表面上，可以利用光线调节层3对射向至光线调节层3的至少一部分光线进行吸收，在提高显示基板100的对比度的同时，不会提高显示基板100的功耗。而且，相比相关技术，本公开的一些实施例所提供的显示基板100的制备方法工艺简单、易操作，避免了对光线调节层3进行研磨，进而避免显示基板100出现表面泛白的情况，并使得显示基板100的表面具有较高一致性。
在一些实施例中，上述压合工艺的类型包括多种。
示例性的，上述压合工艺可以包括真空压合工艺。
如图17中(d)所示，在采用真空压合工艺，对形成有多个发光器件2的第一衬底1和形成有光线调节层3的第二衬底4进行压合的过程中，可以一边进行抽真空操作，一边对形成有光线调节层3的第二衬底4整体进行压合，这样光线调节层3靠近多个发光器件2的表面，可以与多个发光器件2基本同时接触，使得多个发光器件2能够基本同时伸入并嵌入光线调节层3 的内部。并且，还避免在光线调节层3和第一衬底1之间形成气泡。
示例性的，上述压合工艺可以包括滚压工艺。
如图18中(d)所示，在采用滚压工艺，对形成有多个发光器件2的第一衬底1和形成有光线调节层3的第二衬底4进行压合的过程中，可以先对形成有多个发光器件2的第一衬底1的一端(例如图18中所示的右端)，与形成有光线调节层3的第二衬底4的一端(例如图18中所示的右端)进行压合，使得该端的发光器件2完全嵌入光线调节层3的内部，然后将压合位置逐渐向相对的另一端(例如图18中所示的左端)移动，使得多个发光器件2自第一衬底1的一端向相对的另一端依次嵌入光线调节层3的内部，之后进行升温脱泡操作。这样可以减少甚至消除在光线调节层3和第一衬底1之间可能出现的气泡。
在一些实施例中，在光线调节层3包括多层薄膜的情况下，靠近多个发光器件2的一侧的薄膜的硬度，小于远离多个发光器件2的一侧的薄膜的硬度。
例如，光线调节层3包括层叠设置的第一子光线调节层31和第二子光线调节层32。此时，第一子光线调节层31的硬度，小于第二子光线调节层32的硬度。这样在对形成有多个发光器件2的第一衬底1和形成有光线调节层3的第二衬底4进行压合的过程中，可以易于多个发光器件2伸入并嵌入第一子光线调节层31内部。在相对于第一衬底1，第一子光线调节层31远离第一衬底1的一侧表面，低于多个发光器件2远离第一衬底1的一侧表面的情况下，可以减缓并便于控制多个发光器件2伸入第二子光线调节层32的速度，避免出现多个发光器件2穿透第二子光线调节层32、与第二衬底2相接触的情况，进而有利于避免出现多个发光器件2被损伤的情况。
此外，本公开的一些实施例还可以通过控制第二子光线调节层32的厚度，控制多个发光器件2伸入光线调节层3的速度。
本公开的一些实施例提供了一种显示装置200。如图19所示，该显示装置200包括如上述一些实施例中提供的显示基板100。
上述显示装置200所包括的显示基板100，具有与上述一些实施例中提供的显示基板100相同的结构和有益效果，此处不再赘述。
在一些示例中，上述显示装置200还包括：用于安装上述显示基板100的外壳，和/或，安装在显示基板100上的摄像头等。
在一些实施例中，上述显示装置200为电子纸、手机、平板电脑、电视机、显示器、笔记本电脑、数码相框、导航仪等任何具有显示功能的产品或 部件。
以上所述，仅为本公开的具体实施方式，但本公开的保护范围并不局限于此，任何熟悉本技术领域的技术人员在本公开揭露的技术范围内，想到变化或替换，都应涵盖在本公开的保护范围之内。因此，本公开的保护范围应以所述权利要求的保护范围为准。

Claims (17)

  1. 一种显示基板，包括：
    第一衬底；
    设置在所述第一衬底一侧的多个发光器件，所述多个发光器件相互间隔设置；
    光线调节层，所述光线调节层位于所述多个发光器件之间的间隙内、以及所述多个发光器件远离所述第一衬底的一侧表面上，以使至少一个发光器件被所述光线调节层包围；所述光线调节层的材料包括吸光材料，被配置为对射向至所述光线调节层的至少一部分光线进行吸收；以及，
    覆盖所述光线调节层的第二衬底。
  2. 根据权利要求1所述的显示基板，其中，所述光线调节层包括：
    位于所述多个发光器件之间的间隙内的第一子光线调节层；相对于所述第一衬底，所述第一子光线调节层远离所述第一衬底的表面，与所述多个发光器件远离所述第一衬底的表面持平，或者，高于或低于所述多个发光器件远离所述第一衬底的表面；所述第一子光线调节层的材料包括吸光材料，被配置为对射向至所述第一子光线调节层的至少一部分光线进行吸收；以及，
    设置在所述第一子光线调节层远离所述第一衬底一侧的第二子光线调节层；相对于所述第一衬底，所述第二子光线调节层远离所述第一衬底的表面，高于所述多个发光器件远离所述第一衬底的表面；所述第二子光线调节层为透明薄膜。
  3. 根据权利要求2所述的显示基板，其中，在相对于所述第一衬底，所述第一子光线调节层远离所述第一衬底的表面，低于所述多个发光器件远离所述第一衬底的表面的情况下，
    所述第二子光线调节层包括第一部分和第二部分，所述第一部分在所述第一衬底上的正投影与所述多个发光器件在所述第一衬底上的正投影重合，所述第二部分在所述第一衬底上的正投影与所述第一子光线调节层在所述第一衬底上的正投影重合，所述第一部分的厚度范围为20μm～100μm，所述第二部分的厚度范围为50μm～100μm。
  4. 根据权利要求2或3所述的显示基板，其中，所述第二子光线调节层的折射率大于所述第二衬底的折射率。
  5. 根据权利要求2～4中任一项所述的显示基板，其中，所述第一子光线调节层远离所述第一衬底的表面与所述第一衬底之间的间距，为所述多个发光器件的厚度的80％～120％。
  6. 根据权利要求2～5中任一项所述的显示基板，其中，所述光线调节层还包括：
    位于所述多个发光器件之间的间隙内、且设置在所述第一子光线调节层与所述第一衬底之间的第三子光线调节层；相对于所述第一衬底，所述第三子光线调节层远离所述第一衬底的表面，与所述多个发光器件远离所述第一衬底的表面持平，或者，低于所述多个发光器件远离所述第一衬底的表面；
    所述第三子光线调节层的材料包括反光材料，被配置为将由所述多个发光器件入射至所述第三子光线调节层中的光线反射回所述多个发光器件中。
  7. 根据权利要求1所述的显示基板，其中，所述光线调节层包括：
    位于所述多个发光器件之间的间隙内的第三子光线调节层；相对于所述第一衬底，所述第三子光线调节层远离所述第一衬底的表面，与所述多个发光器件远离所述第一衬底的表面持平，或者，低于所述多个发光器件远离所述第一衬底的表面；所述第三子光线调节层的材料包括反光材料，被配置为将由所述多个发光器件入射至所述第三子光线调节层中的光线反射回所述多个发光器件中；以及，
    设置在所述第三子光线调节层远离所述第一衬底一侧的第一子光线调节层；相对于所述第一衬底，所述第一子光线调节层远离所述第一衬底的表面，高于所述多个发光器件远离所述第一衬底的表面；所述第一子光线调节层的材料包括吸光材料，被配置为对射向至所述第一子光线调节层的至少一部分光线进行吸收。
  8. 根据权利要求6或7所述的显示基板，其中，所述第三子光线调节层的反射率大于或等于70％。
  9. 根据权利要求2～7中任一项所述的显示基板，其中，每个发光器件包括：
    第三衬底；以及，
    设置在所述第三衬底一侧的发光层；所述发光层相对于所述第三衬底靠近所述第一衬底。
  10. 根据权利要求9所述的显示基板，其中，在所述光线调节层包括第二子光线调节层的情况下，所述第三衬底的折射率大于所述第二子光线调节层的折射率。
  11. 根据权利要求9或10所述的显示基板，其中，在所述光线调节层包括第三子光线调节层的情况下，相对于所述第一衬底，所述第三子光线调节层远离所述第一衬底的表面，高于所述多个发光器件远离所述第一衬底的表 面。
  12. 根据权利要求2～11中任一项所述的显示基板，其中，
    在所述光线调节层包括所述第一子光线调节层的情况下，所述第一子光线调节层的材料包括掺杂有吸光材料的亚克力胶；
    在所述光线调节层包括第二子光线调节层的情况下，所述第二子光线调节层的材料包括亚克力胶；
    在所述光线调节层包括第三子光线调节层的情况下，所述第三子光线调节层的材料包括掺杂有反光材料的亚克力胶。
  13. 根据权利要求1～12中任一项所述的显示基板，其中，所述第二衬底远离所述第一衬底的一侧表面设置有多个微结构；
    所述多个微结构被配置为，使来自所述多个发光器件并穿过所述第二衬底的至少一部分光线的传播方向发生改变。
  14. 根据权利要求13所述的显示基板，其中，所述多个微结构的表面形状包括棱锥、楔形、弧面和球面中的至少一种。
  15. 一种显示基板的制备方法，包括：
    提供第一衬底，在所述第一衬底的一侧设置相互间隔的多个发光器件；
    提供第二衬底，采用吸光材料，在所述第二衬底的一侧形成光线调节层；
    采用压合工艺，对形成有所述多个发光器件的第一衬底和形成有所述光线调节层的第二衬底进行压合，使所述多个发光器件嵌入所述光线调节层内，并使所述光线调节层的一部分陷入所述多个发光器件之间的间隙内，另一部分位于所述多个发光器件远离所述第一衬底的一侧表面上。
  16. 根据权利要求15所述的显示基板的制备方法，其中，所述压合工艺包括真空压合工艺或滚压工艺。
  17. 一种显示装置，包括：如权利要求1～14中任一项所述的显示基板。
PCT/CN2021/078256 2020-03-27 2021-02-26 显示基板及其制备方法、显示装置 Ceased WO2021190245A1 (zh)

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