WO2022016204A2 - Procédé de fabrication d'un élément de palier lisse multicouche - Google Patents

Procédé de fabrication d'un élément de palier lisse multicouche Download PDF

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Publication number
WO2022016204A2
WO2022016204A2 PCT/AT2021/060255 AT2021060255W WO2022016204A2 WO 2022016204 A2 WO2022016204 A2 WO 2022016204A2 AT 2021060255 W AT2021060255 W AT 2021060255W WO 2022016204 A2 WO2022016204 A2 WO 2022016204A2
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WIPO (PCT)
Prior art keywords
overlay
layer
bearing element
plain bearing
carrier layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
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PCT/AT2021/060255
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German (de)
English (en)
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WO2022016204A3 (fr
Inventor
Christoph Held
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Miba Gleitlager Austria GmbH
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Miba Gleitlager Austria GmbH
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Publication of WO2022016204A2 publication Critical patent/WO2022016204A2/fr
Publication of WO2022016204A3 publication Critical patent/WO2022016204A3/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C21/00—Alloys based on aluminium
    • C22C21/003—Alloys based on aluminium containing at least 2.6% of one or more of the elements: tin, lead, antimony, bismuth, cadmium, and titanium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02—Pretreatment of the material to be coated
    • C23C14/024—Deposition of sublayers, e.g. to promote adhesion of the coating
    • C23C14/025—Metallic sublayers
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/046—Coating cavities or hollow spaces, e.g. interior of tubes; Infiltration of porous substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3435—Applying energy to the substrate during sputtering
    • C23C14/345—Applying energy to the substrate during sputtering using substrate bias
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3485—Sputtering using pulsed power to the target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/021—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material including at least one metal alloy layer
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
    • C23C28/028—Including graded layers in composition or in physical properties, e.g. density, porosity, grain size
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
    • C23C28/40—Coatings including alternating layers following a pattern, a periodic or defined repetition
    • C23C28/42—Coatings including alternating layers following a pattern, a periodic or defined repetition characterized by the composition of the alternating layers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
    • F16C33/02—Parts of sliding-contact bearings
    • F16C33/04—Brasses; Bushes; Linings
    • F16C33/06—Sliding surface mainly made of metal
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
    • F16C33/02—Parts of sliding-contact bearings
    • F16C33/04—Brasses; Bushes; Linings
    • F16C33/06—Sliding surface mainly made of metal
    • F16C33/12—Structural composition; Use of special materials or surface treatments, e.g. for rust-proofing
    • F16C33/122—Multilayer structures of sleeves, washers or liners
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C33/00—Parts of bearings; Special methods for making bearings or parts thereof
    • F16C33/02—Parts of sliding-contact bearings
    • F16C33/04—Brasses; Bushes; Linings
    • F16C33/06—Sliding surface mainly made of metal
    • F16C33/14—Special methods of manufacture; Running-in
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2202/00—Solid materials defined by their properties
    • F16C2202/02—Mechanical properties
    • F16C2202/04—Hardness
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2204/00—Metallic materials; Alloys
    • F16C2204/10—Alloys based on copper
    • F16C2204/12—Alloys based on copper with tin as the next major constituent
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2223/00—Surface treatments; Hardening; Coating
    • F16C2223/30—Coating surfaces
    • F16C2223/60—Coating surfaces by vapour deposition, e.g. PVD, CVD
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C2240/00—Specified values or numerical ranges of parameters; Relations between them
    • F16C2240/40—Linear dimensions, e.g. length, radius, thickness, gap
    • F16C2240/54—Surface roughness

Definitions

  • the invention relates to a method for producing a multi-layer plain bearing element, comprising the steps: providing a substrate comprising a carrier layer, depositing an overlay on the substrate by means of magnetron sputtering.
  • the invention further relates to a plain bearing element comprising a carrier layer and an overlay, which comprises or consists of metallic particles, and optionally a bearing metal layer between the carrier layer and the overlay.
  • AT 414 128 B describes a method for producing a plain bearing made of at least one carrier and an edge layer made of an aluminum alloy arranged thereon.
  • the edge layer is produced using a sputtering method, in particular a direct-current magnetron sputtering method.
  • AT 517 717 B1 also describes a method for depositing a layer on a plain bearing element blank from the gas phase in a process gas, after which the layer consists of at least one target, which comprises or consists of a metal combination with a metallic base element, by at least partial sputtering of the target and then depositing the sputtered target components on the plain bearing element blank.
  • the present invention is based on the object of improving plain bearing elements with sputter overlays and their production.
  • the object of the invention is achieved with the method mentioned at the outset, according to which it is provided that the overlay is deposited by means of high-performance pulse magnetron sputtering.
  • the object is also achieved with the plain bearing element mentioned at the outset in that the overlay has a surface roughness Ra according to DIN EN ISO 4287:1984 of a maximum of 10 ⁇ m.
  • the advantage here is that a very smooth surface can be produced by the charged particles produced from the at least one target using high-power pulse magnetron sputtering.
  • the friction between the plain bearing element and the component that is tribologically related or the component supported by the plain bearing element can be reduced so that the plain bearing element can be used over a longer period of time.
  • very dense running layers can be produced with it. This in turn reduces the diffusion of corrosive media into the plain bearing element, so that a layer of the plain bearing element arranged below the overlay, such as a bearing metal layer, is better protected against corrosive attacks, which in turn can also increase the service life of the plain bearing element.
  • the overlay is deposited directly on the carrier layer.
  • a simplified layer structure can thus be achieved.
  • improved adhesion of the running layer on the carrier layer can be achieved because high-energy particles from the target penetrate the carrier layer at least partially, i.e. are implanted in the carrier layer, creating a kind of clawing or a type of Lorm gleich between the running layer and the Support layer can be achieved.
  • particles of the overlay are arranged so as to have penetrated at least partially into the substrate.
  • the carrier layer is cleaned in situ during the deposition of the overlay.
  • the term “during” should not necessarily be understood to mean that the surface of the substrate or the carrier layer is cleaned at the same time as the overlay is deposited.
  • the deposition can also be carried out (immediately) after the cleaning will.
  • the substrate to be coated ie in particular the carrier layer, is cleaned with the particles evaporated from the target. It is therefore not necessary to change the target or to clean it in another system, which means that the production of the plain bearing element can be simplified by saving process steps.
  • a bearing metal layer is applied to the carrier layer before the overlay is deposited.
  • the multi-layer plain bearing element thus has corresponding emergency running properties if the overlay starts to wear out, and until then the overlay can better protect the bearing metal layer arranged underneath from corrosion, as was explained above.
  • the substrate is moved, in particular rotated, during the deposition of the overlay, with which a more uniform layer thickness of the overlay can be achieved.
  • the overlay can be built up from a plurality of partial overlays with different compositions and for the plurality of partial overlays to be deposited alternately if necessary.
  • the overlay can thus be better adapted to the requirements in the running of the plain bearing, in particular a partial overlay can thus have an adhesion-promoting role between the actual overlay and the carrier layer, with this partial overlay having particles that can be better implanted in the underlying substrate.
  • diffusion paths can be further reduced, with which an improvement in the corrosion protection of the substrate can be achieved, ie for example the bearing metal layer and/or the carrier layer.
  • At least one of the following variants of the invention can be provided: that at least one target is used to produce the overlay, with the
  • Target is operated with a pulse frequency selected from a range from 100 Hz to 1500 Hz or from a range from 500 Hz to 2500 Hz, and/or that pulses with a pulse length between 10 m8 and 100 m8 are used for the deposition, and/or that the targets are operated with a power that is selected from a range of 2 W/cm 2 to 50 W/cm 2 ; and/or that a duty cycle between 0.01 and 0.5 is applied.
  • the running layer has a columnar structure with columns, the columns form an angle to a surface of the substrate on which the overlay is arranged to take, that being selected is in a range from 80 0 up to 110°.
  • the load-bearing capacity of the overlay can be improved by the longitudinal extension of the columns in the loading direction.
  • loads can be introduced more directly into the layer arranged under the overlay if at least some of the columns extend continuously through the entire thickness of the overlay.
  • the pillars have a maximum diameter in a plan view of the running layer, which is selected from a range of 0.5 nm to 300 nm
  • the running layer has a layer thickness of between 10 mhi and 100 mhi.
  • the overlay has a hardness of between 10 HV 0.01 and 800 HV 0.1.
  • the overlay is designed as a gradient layer with a concentration gradient of at least one component of the overlay, or that the overlay is designed as a sequence is formed from several sub-course layers with different compositions. Faster running-in of the overlay can be achieved if, according to a further embodiment of the invention, it is provided that the overlay has a layer thickness tolerance of between ⁇ 1 mhi and ⁇ 10 mhi.
  • FIG. 2 shows a schematic structure of a coating device
  • FIG. 3 shows a detail from an embodiment variant of a sliding bearing element
  • alloy composition should be understood to include the usual impurities that occur in raw materials used on an industrial scale. However, there is the possibility within the scope of the invention that pure or ultra-pure metals or pure or ultra-pure substances are used.
  • compositions are to be understood as % by weight, unless something else is expressly stated.
  • Fig. 1 shows a plain bearing element 1 (also referred to as a multi-layer plain bearing element) in the form of a half-shell plain bearing. Shown is a two-layer variant of Gleitla gerelements 1, consisting of a carrier layer 2 (also called a support layer) and an overlay 3, which is arranged on a front side 4 (radially inner side) of the sliding bearing element 1, which can be turned toward a component to be mounted.
  • a carrier layer 2 also called a support layer
  • an overlay 3 which is arranged on a front side 4 (radially inner side) of the sliding bearing element 1, which can be turned toward a component to be mounted.
  • a bearing metal layer 5 can be arranged between the overlay 3 and the carrier layer 2, as indicated by dashed lines in FIG.
  • the multi-layer plain bearing 1 can also be designed differently, for example as a bearing bush, as indicated by dashed lines in FIG. Likewise, other embodiments of multi-layer plain bearings 1 are possible.
  • the carrier layer 2 is made of a metallic material. In particular, it can consist of steel. But you can also be made of another material that gives the element 1 Gleitlagerele the required structural strength exist. Such materials are known from the prior art.
  • the carrier layer 2 can consist of a copper bronze.
  • the bearing metal layer 5 can consist of a (lead-free) copper or aluminum or silver or bismuth or tin-based alloy. Examples for this are:
  • Aluminum-based whitemetal alloys (according to DIN ISO 4381 or 4383):
  • Copper-based bearing metals according to DIN ISO 4383:
  • AgSnl0-40 AgCuSn, AgSn20, AgBil5, AgCu20;
  • a bearing metal layer 5 In the event that a bearing metal layer 5 is arranged, this can be arranged or deposited on the carrier layer 2 using conventional methods. For example, it can be roll-bonded or deposited by fusion metallurgy or electroplating.
  • the overlay 3 preferably consists of a base alloy which has an element from an element group comprising Al, Cu, Ag, Sn, Bi, Sb as the main alloy element.
  • the base element (as also generally in the description) - compared to the other alloying elements - represents the largest proportion in terms of quantity be formed on a bismuth basis or on a silver basis or by a layer of pure silver with the impurities resulting from the melting and/or deposition or of pure copper or of CuSn or CuAl.
  • the composition of the overlay 3 is in any case different from that of the bearing metal layer 5, if this is present.
  • the diffusion barrier layer and/or binding layer can be made, for example, by Al, Mn, Ni, Fe, Cr, Co,
  • Cu, Ag, Mo, Pd and NiSn or NiCr or CuSn alloys can be formed.
  • Other known metals and metallic alloys are also conceivable.
  • This further layer can have the function of a running-in layer.
  • this further layer can be tin or a bonded coating layer or generally a polymer layer with solid lubricant particles.
  • the overlay 3 is deposited on the substrate, ie, according to embodiment variants of the invention, in particular either directly on the carrier layer 2 or the bearing metal layer 5, by means of high-performance pulse magnetron sputtering (HiPIMS). Short voltage pulses are applied to the target (cathode) during the sputtering process and high electron impact ionization rates are obtained with a high plasma electron density, which leads to a high proportion of ionization of the sputtered species.
  • HiPIMS high-performance pulse magnetron sputtering
  • Fig. 2 shows a schematic structure of a sputtering system 6.
  • charged metallic particles 7 are accelerated in a field of a corresponding magnetic source 3 and directed onto a target electrode or at least one target 9 .
  • the target 9 is also the cathode.
  • An ionized inert gas or a plasma 10 is used as the source of the particles 7.
  • the accelerated particles 7 knock out atoms 11 from the surface of the target material when they hit the target 9. Furthermore, due to the high degree of ionization in the deposition chamber of the sputtering system 6, metal particles (atoms 11) are also ionized. The atoms 11 move towards the substrate 12 with high speed and high energy density and are deposited there as a running layer 3 .
  • the target 9 is subjected to high-energy pulses.
  • the substrate 12 should not be limited to the plate shape shown in FIG. 2, but, according to the invention, shapes deviating therefrom, for example bearing half shells, can also be used.
  • the process gas ie in particular the inert gas such as argon, can be supplied via at least one inlet 13 .
  • the target 9 can have the desired composition of the overlay 3 .
  • the evaporation rates of the targets 9 can be designed differently according to the desired composition of the overlay 3 .
  • Process pressure 30xl0 2 mbar to lxlO 3 mbar
  • Process temperature 50 °C to 200 °C
  • Pulse current 10 A and 100
  • Pulse frequency 500 Hz and 2500 Hz
  • Pulse length 10 ps - 100 ps.
  • Target power 2 W/cm 2 - 50W/cm 2
  • the carrier layer 2 as the substrate 12 for direct coating with the overlay 3 is cleaned in situ during the deposition of the overlay 3 .
  • the carrier layer 2 which has been pre-cleaned if necessary, is arranged in the coating chamber 14, for example on a suitable substrate carrier (as also in the method variant mentioned above), and cleaned in situ after the creation of the suitable atmosphere.
  • suitable substrate carrier as also in the method variant mentioned above
  • Process pressure 90xl0 2 mbar to lxlO 3 mbar
  • Process temperature 25 °C to 150 °C
  • Peak current 50 A to 1000
  • Pulse frequency 100 Hz and 1000 Hz
  • Pulse length 10 ps to 100 ps
  • Target power 0.1 W/cm 2 to 10 W / cm 2
  • a bias voltage of between 100 V and 1500 V can be applied to the substrate 12 in support of the target 9 .
  • the overlay 3 can then be deposited immediately after this cleaning with the parameters mentioned above.
  • the process step “deposition of the overlay 2” is divided into several sub-steps.
  • the statement “during the deposition of overlay 3” is to be understood in this sense.
  • the substrate carrier can remain stationary during the treatment or deposition. According to one embodiment of the method, however, it can also be provided that the substrate is moved, in particular rotated.
  • the substrate holder can therefore be a turntable, for example. Other movements during the deposition of the overlay 3 are also conceivable.
  • FIG. 3 shows a section of a variant of the plain bearing element 1.
  • the overlay 3 has a structure made up of several partial overlays 15 , 16 .
  • the partial overlay 15 has a different composition to the composition of the partial overlay 16 .
  • the partial running layer 15 can be made of a copper-based alloy or an aluminum-based alloy or made of silver
  • the partial running layer 16 can be made of one of the elements nickel, cobalt, chromium, molybdenum, titanium, stainless steel, copper, aluminum or their alloys, the mentioned Element forms the base element (element with the highest proportion), be formed.
  • the running layer 3 is formed only from a partial running layer 15 and a partial running layer 16 .
  • the sub-run layers 15, 16 are preferably in direct contact with each other. There is also the possibility that the overlay 3 is made up of more than two different partial overlays 15 , 16 .
  • a number of different targets 9 corresponding to the number of different sub-layers 15, 16 can be used to produce the multi-layer barrel layer structure.
  • the overlay 3 is deposited in such a way that particles of the overlay 3 penetrate at least partially into the substrate 12, for example the carrier layer 2 or the bearing metal layer 5, i.e. are implanted.
  • the following process parameters can be used for this variant:
  • Process pressure 30xl0 2 mbar to lxlO 3 mbar
  • Process temperature 50 °C to 150 °C
  • Pulse current 10 A to 500
  • Pulse frequency 100 Hz to 1500 Hz
  • Pulse length 10 ps to 100 ps
  • Target power 2 W/cm 2 to 20 W/ cm 2
  • a bias voltage of between 10 V and 500 V can be applied to the substrate to support the target 9 .
  • a pulse duty factor between 0.01 and 0.5 is used.
  • the pulse duty factor describes the on-off ratio of the pulses.
  • a sliding bearing element 1 with a sliding layer 3 can be produced, which has a surface 17 with a surface roughness Ra according to DIN EN ISO 4287:1984 of a maximum of 8 ⁇ m.
  • the surface roughness Ra can be between 1 pm and 8 pm.
  • the mean peak-to-valley height Rz according to DIN EN ISO 4287:1984 can be between 1 ⁇ m and 10 ⁇ m.
  • the overlay 3 can have a layer thickness tolerance of between 10 ⁇ m and 100 ⁇ m.
  • the overlay 3 has a columnar structure with columns 18, the columns 18 being at an angle to a surface 19 of the substrate, e.g. the carrier layer 3, on which the overlay 3 is arranged, which is selected from a range of 80 0 to 110 °.
  • the columns 18 can be arranged at least approximately at right angles to this surface 19 .
  • the angle is formed between the height of the columns 18 and the surface 19.
  • the height of the columns 18 is preferably (significantly) greater than a diameter 20 of the columns 18.
  • this diameter 20 of the columns 18 can have a value that is selected from a range of 0.5 nm to 300 nm
  • the diameter 20 is the maximum diameter as the diameter of an enveloping circle that just surrounds the respective column 18 on the surface 19 .
  • the overlay 3 can generally have a layer thickness 21 of between 10 ⁇ m and 100 ⁇ m.
  • the overlay 3 can have a hardness between 10 HV 0.01 and 800 HV 0.1.
  • the overlay 3 is formed as a sequence of several partial overlays 15, 16 with different compositions.
  • the overlay 3 is designed as a gradient layer with a concentration gradient of at least one component of the overlay 3 .
  • the concentration of this component can increase or decrease in the direction of the carrier layer 2 .
  • the partial overlay 15 can be made of a copper-based alloy or an aluminum-based alloy or of silver
  • the partial overlay 16 can be made of one of the elements nickel, cobalt, chromium, molybdenum, titanium, stainless steel, copper, aluminum or their alloys, with said element being the base element (Element with the highest proportion) forms.
  • a running layer 3 made of AlSn20Cul was deposited on conventional lead bronze carrier layer 2 in the form of bearing shells with and without bearing metal layer 5 as substrate 12 in such a way that particles of running layer 3 at least partially penetrated substrate 12, i.e the carrier layer 2 or a bearing metal layer 5 penetrate, so be implanted.
  • the following process parameters were used for this variant:
  • Process pressure 1.5x10-2 mbar to 9.5x10-3 mbar
  • Process temperature 25 °C to 80 °C
  • Pulse current 50 A to 70
  • Pulse frequency 1200 Hz to 1500 Hz
  • Pulse length 25 ps to 35 ps
  • Target power 3 W/ cm 2 to 4 W / cm 2
  • the substrate 12 was subjected to a bias voltage of between 600 V and 700 V.
  • the bias voltage was switched off from the substrate 12 and the pulse current was reduced to 40 A to 50 A and the pulse frequency to 600 Hz to 800 Hz in order to achieve a good coating rate with increased target power, which was between 8 W/cm 2 and 12 W/cm 2 was to be achieved.
  • the coated bearing shells were subjected to a corrosion test in order to be able to test the tightness of the overlay 3.
  • the plain bearing elements 1 according to the invention showed better values than plain bearing elements conventionally coated by means of a conventional sputtering process according to AT 414 128 B.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Engineering & Computer Science (AREA)
  • Sliding-Contact Bearings (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

L'invention concerne un procédé de fabrication d'un élément de palier lisse multicouche (1) comprenant les étapes consistant à préparer un substrat (12) comprenant une couche de support (2) et à déposer une couche antifriction (3) sur le substrat (12) par pulvérisation cathodique magnétron en régime d'impulsions de haute puissance.
PCT/AT2021/060255 2020-07-21 2021-07-20 Procédé de fabrication d'un élément de palier lisse multicouche Ceased WO2022016204A2 (fr)

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ATA50629/2020A AT524071B1 (de) 2020-07-21 2020-07-21 Verfahren zur Herstellung eines mehrschichtigen Gleitlagerelementes
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AT517717B1 (de) 2016-01-28 2017-04-15 Miba Gleitlager Austria Gmbh Verfahren zur Abscheidung einer Schicht auf einem Gleitlagerelementrohling

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AT501722B1 (de) * 2005-07-12 2006-11-15 Miba Gleitlager Gmbh Beschichtungsverfahren
US20120114971A1 (en) * 2007-01-05 2012-05-10 Gerd Andler Wear resistant lead free alloy sliding element method of making
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AT508962A1 (de) * 2009-11-05 2011-05-15 Miba Gleitlager Gmbh Verfahren zum herstellen eines gleitlagerelementes
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EP2653583B1 (fr) * 2012-04-20 2021-03-10 Oerlikon Surface Solutions AG, Pfäffikon Procédé de revêtement destiné à la séparation d'un système de couche sur un substrat
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CN115007967B (zh) * 2022-04-19 2024-04-09 东南大学 一种高性能轴瓦双金属材料的增材制备方法及其应用

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