WO2022089032A1 - Module de haut-parleur et dispositif électronique - Google Patents

Module de haut-parleur et dispositif électronique Download PDF

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Publication number
WO2022089032A1
WO2022089032A1 PCT/CN2021/117516 CN2021117516W WO2022089032A1 WO 2022089032 A1 WO2022089032 A1 WO 2022089032A1 CN 2021117516 W CN2021117516 W CN 2021117516W WO 2022089032 A1 WO2022089032 A1 WO 2022089032A1
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WO
WIPO (PCT)
Prior art keywords
speaker module
diaphragm
sound
middle frame
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/117516
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English (en)
Chinese (zh)
Inventor
周俊
郭李
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Publication of WO2022089032A1 publication Critical patent/WO2022089032A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/03—Constructional features of telephone transmitters or receivers, e.g. telephone hand-sets
    • H04M1/035—Improving the acoustic characteristics by means of constructional features of the housing, e.g. ribs, walls, resonating chambers or cavities
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's

Definitions

  • the present application relates to the technical field of electronic devices, and in particular, to a speaker module and an electronic device.
  • Speaker modules are used to restore audio electrical signals such as music and voice into sound, and they are more and more widely used in electronic devices such as mobile phones, tablet computers, and notebook computers because they support the function of audio playback.
  • the volume of speaker modules in electronic devices is getting smaller and smaller.
  • the area of the diaphragm in the module core is also reduced accordingly, thereby reducing the sensitivity of the speaker module.
  • the embodiments of the present application provide a speaker module and an electronic device, which can increase the area of the diaphragm, increase the space of the back cavity, and improve the sensitivity of the speaker under the premise that the external dimensions of the speaker module remain unchanged.
  • some embodiments of the present application provide a speaker module, the speaker module includes a speaker module main body, the speaker module main body includes a first casing and a diaphragm, and the first casing is provided with a accommodating cavity; the diaphragm; The accommodating cavity is located in the accommodating cavity and the edge of the vibrating membrane is fixed to the first shell.
  • the accommodating cavity is divided into a front acoustic cavity and a rear acoustic cavity which are independent of each other by the vibrating membrane.
  • the first shell is provided with a sound outlet channel that communicates with the front acoustic cavity;
  • the device is located in the rear acoustic cavity, and the drive device includes a stator and a mover.
  • the drive device is fixed to the first housing through the stator of the drive device.
  • the drive device is only fixed to the diaphragm through the mover of the drive device.
  • the drive device is used to drive The diaphragm vibrates to push the air in the front acoustic cavity to vibrate to form sound waves, and the orthographic projection area of the driving device on the plane where the diaphragm is located is smaller than the area of the diaphragm.
  • the edge of the diaphragm is fixed to the first casing around the circumference
  • the driving device is fixed to the first casing through the stator of the driving device
  • the driving device is only connected to the diaphragm by the mover of the driving device and the diaphragm.
  • the diaphragm is only connected with the mover of the driving device to be driven to realize vibration, and is not limited by the size of the entire driving device, and the area of the diaphragm is designed to be larger than the driving device on the plane where the diaphragm is located.
  • the diaphragm can increase the area of the diaphragm and improve the sensitivity of the speaker on the premise that the external dimensions of the speaker module and the external dimensions of the driving device remain unchanged.
  • the edge of the diaphragm is fixed to the first shell around the circumference. Since the diaphragm is made of soft material, it is easy to fit and seal with the first shell, while There is no need to add a retaining wall structure to increase the sealing width, so there is no retaining wall to occupy the space of the rear acoustic cavity, which is beneficial to increase the volume of the rear cavity of the speaker module and improve the low frequency sensitivity of the speaker.
  • the first housing includes a first middle frame, a first front cover, a first rear cover and an annular support boss;
  • the first middle frame includes opposite first surfaces and On the second surface, the accommodating cavity is formed in the first middle frame, and the accommodating cavity penetrates the first surface of the middle frame and the second surface of the middle frame;
  • the opening of the surface is fixed with the first middle frame;
  • the first rear cover is covered at the opening of the accommodating cavity through the second surface of the first middle frame and fixed with the first middle frame;
  • the support boss is arranged on the first middle frame
  • the inner wall of the frame is round, and the edge of the diaphragm is fixed on the surface of the support boss facing the first front cover.
  • the front acoustic cavity is formed between the diaphragm and the first front cover, and the rear acoustic cavity is formed between the diaphragm and the first back cover.
  • the stator of the driving device is fixed between the surface of the support boss facing the first rear cover and the first rear cover.
  • the first housing includes a sandwich structure composed of a first front cover, a first middle frame, a first rear cover and a support boss, and the edge of the diaphragm is fixed on the surface of the support boss facing the first front cover around the circumference to drive the
  • the stator of the device is fixed between the surface of the support boss facing the first rear cover and the first rear cover, so the installation operation of the diaphragm and the driving device in the first casing is simple and the assembling efficiency is high.
  • the speaker module further includes a rear cavity expansion device, and the rear cavity expansion device includes a second casing, the second casing is fixed to the first casing, and the second casing is internally provided There is a rear cavity expansion space communicated with the rear acoustic cavity.
  • the rear cavity expansion space and the rear acoustic cavity together form the rear cavity of the speaker module, thereby increasing the volume of the rear cavity of the speaker module and improving the sound quality of the entire speaker.
  • the arrangement direction of the first casing and the second casing is perpendicular to the arrangement direction of the first front cover, the first middle frame, and the first rear cover of the first casing.
  • the size of the speaker module in the arrangement direction of the first front cover, the first middle frame, and the first rear cover can be made smaller, which is beneficial for the speaker module of the embodiment of the present application in applications such as It can be installed in thin electronic devices such as phablets and tablet computers.
  • the second housing includes a second middle frame, a second front cover and a second rear cover; the second middle frame is fixed to the first middle frame, and the second middle frame is along the The two end faces in the arrangement direction of the first front cover, the first middle frame and the first rear cover of the first casing are the third surface and the fourth surface respectively, and the rear cavity expansion space is formed in the second middle frame, and the rear The cavity expansion space runs through the third surface and the fourth surface; the second front cover is covered at one end opening of the rear cavity expansion space that penetrates through the third surface and is fixed with the second middle frame; the second rear cover is set on the rear cavity expansion space One end of the space passing through the fourth surface is open and fixed with the second middle frame.
  • This structure is simple and easy to implement.
  • the second middle frame and the first middle frame are formed into a whole through an integral molding process, so that the structural complexity of the speaker module can be reduced and the assembly of the speaker module can be improved. efficiency.
  • the second frame and the first back cover are integrally formed, so that the structural complexity of the speaker module can be reduced and the assembly efficiency of the speaker module can be improved.
  • the rear cavity expansion device further includes a sound absorbing block, which is located in the rear cavity expansion space and is bonded to the inner wall of the rear cavity expansion space through a glue material.
  • the F0 index refers to the frequency corresponding to the first maximum value of the speaker impedance curve, and a smaller F0 will bring better low-frequency sensitivity
  • the sound-absorbing block has a block-like structure, and the sound-absorbing block is bonded to the inner wall of the rear cavity expansion space through glue, it is not necessary to Inside the rear cavity expansion space or between the rear cavity expansion space and the rear acoustic cavity, a screen such as gauze, metal mesh, etc.
  • the speaker module is set to act as a barrier to prevent the sound-absorbing material from entering the driving device and interfering with the mover of the driving device. Therefore, on the premise that the external dimension of the speaker module remains unchanged, the space of the rear cavity of the speaker module can be enlarged, and the sound quality of the speaker can be further improved.
  • the rear cavity expansion space includes a first space area and a second space area; the first space area is communicated with the rear acoustic cavity, and the first space area is filled with air; the sound absorbing block is filled in the first space area.
  • the second space area is adhered to the part of the inner wall of the rear cavity expansion space enclosing the second space area through the glue material. In this way, through the transition of the first space area, the sound absorbing block has a larger air contact area, so the sound absorbing effect is better, and the sound quality of the speaker can be further improved.
  • a surface of the sound-absorbing block facing the first space region is provided with at least one vent hole, the at least one vent hole extending toward the surface of the sound-absorbing block facing away from the first space region and passing through the sound-absorbing block yuan.
  • the area of the sound-absorbing block in contact with the air can be further increased, so as to further improve the sound-absorbing effect of the sound-absorbing block and improve the sound quality of the speaker.
  • the arrangement direction of the first space area and the second space area is parallel to the arrangement direction of the first front cover, the first middle frame, and the first rear cover of the first housing.
  • the surface of the sound-absorbing block connected between the surface facing the first space area and the surface facing away from the first space area is the side surface of the sound-absorbing block
  • the inner wall of the rear cavity expansion space is The part enclosing the second space area includes a first area and a second area; the first area is opposite to the surface of the sound-absorbing block facing away from the first space area, and between the first area and the surface of the sound-absorbing block facing away from the first space area There is a gap; the second area is opposite to the side surface of the sound-absorbing block, and the side surface of the sound-absorbing block is bonded to the second area through an adhesive material.
  • the sound-absorbing block can have a certain shock absorption and buffering effect in the direction Z, so as to avoid the sound-absorbing block from being broken when the speaker module is installed in a flat-shaped electronic device such as a mobile phone and a tablet computer and falls with the electronic device.
  • a surface of the support boss facing the first front cover is an inclined surface inclined in a direction close to the sound outlet channel.
  • the diaphragm installed on the inclined surface is inclined towards the direction close to the sound outlet channel, which is conducive to the smooth export of the airflow generated when the diaphragm vibrates from the sound outlet channel, thereby improving the airflow sound of the speaker and improving the sound quality of the speaker.
  • the mover of the driving device is a voice coil, and the voice coil and the diaphragm are arranged on the same center axis;
  • the stator of the driving device is a magnetic circuit system, and the magnetic field generated by the magnetic circuit system has a north pole to The direction of the south pole is the same as the direction in which the central axis of the voice coil extends, and at least part of the voice coil is located in the magnetic circuit system.
  • the voice coil is formed by winding the voice coil wire in four or more layers along the radial direction of the voice coil from the inside to the outside.
  • the speaker module further includes a positive terminal and a negative terminal; the positive terminal and the driving device are electrically connected through a first enameled wire; the negative terminal and the driving device are electrically connected through a second enameled wire connect.
  • the plasticity of the enameled wire is better, which is convenient for bending and routing, and the radial width of the enameled wire is narrow, which can reduce the positioning structure and the volume of the glue used to fix and support the first enameled wire and the second enameled wire.
  • the external dimensions remain unchanged, it is beneficial to increase the volume of the rear cavity of the speaker module, thereby further improving the sound quality of the speaker.
  • the speaker module further includes a filter structure, the filter structure is disposed at the outlet of the sound outlet channel, and the filter structure allows airflow to pass through and prevents dust and water vapor from passing through.
  • the filter structure can prevent dust and water vapor in the external environment from entering the interior of the speaker module through the sound outlet channel, thereby avoiding affecting the performance of the speaker module.
  • some embodiments of the present application provide an electronic device, the electronic device includes a casing, a circuit board and the speaker module described in any of the above technical solutions, the circuit board and the speaker module are arranged in the casing; the circuit board and the The driving device of the loudspeaker module is electrically connected, and the outer casing is provided with a sound outlet, and the sound outlet communicates with the sound outlet channel of the loudspeaker module.
  • the electronic device provided by the embodiment of the present application includes the speaker module described in any of the above technical solutions, the two can solve the same technical problem and achieve the same technical effect.
  • FIG. 1 is a perspective view of a speaker module according to an embodiment of the application.
  • Fig. 2 is the top view of the speaker module shown in Fig. 1;
  • FIG. 3 is a schematic cross-sectional structure diagram of the speaker module shown in FIG. 2 along the direction A 0 -A 0 ;
  • FIG. 4 is a schematic structural diagram of a kernel involved in an embodiment of the application.
  • FIG. 5 is a perspective view of a speaker module provided by some embodiments of the present application.
  • FIG. 6 is an exploded view of the speaker module shown in FIG. 5;
  • FIG. 7 is a top view of the speaker module shown in FIG. 5;
  • FIG. 8 is a schematic cross-sectional structure diagram of the speaker module shown in FIG. 7 along the A-A direction;
  • FIG. 9 is a schematic cross-sectional structure diagram of the speaker module shown in FIG. 7 along the B-B direction;
  • FIG. 10 is a schematic cross-sectional structure diagram of the speaker module shown in FIG. 7 along the C-C direction;
  • FIG. 11 is another schematic cross-sectional structure diagram of the speaker module shown in FIG. 7 along the C-C direction;
  • FIG. 12 is a schematic structural diagram of an electronic device provided by some embodiments of the present application.
  • 00-speaker module 01-front cover; 02-core; 03-back cover; 011-front cover; 012-side frame; 04-front acoustic cavity; 05-rear acoustic cavity; 06-sound channel; 021-vibration Membrane; 022-drive device; 0221-voice coil; 0222-magnetic circuit system; 0223-frame; 1-speaker module; 11-speaker module body; 111-first shell; 1111-first front cover; 1112 -1st middle frame; 1113-first back cover; 100-first surface; 200-second surface; 300-accommodating cavity; 1111a-first middle plate; 1111b-first frame; 112-diaphragm; 113- Drive device; 115-front acoustic cavity; 116-rear acoustic cavity; 117-sound channel; 114-support boss; 1132-stator; 1131-mover; 1113a-hollow opening; 12-rear cavity expansion device; 121-second Shell;
  • first”, “second”, “third” and “fourth” are only used for description purposes, and cannot be understood as indicating or implying relative importance or implying the indicated Number of technical features.
  • a feature defined as “first”, “second”, “third”, “fourth” may expressly or implicitly include one or more of that feature.
  • Electronic equipment refers to the equipment composed of electronic components such as integrated circuits, transistors, and electronic tubes, and the application of electronic technology (including) software to play a role.
  • the electronic devices include but are not limited to mobile phones, tablet computers, notebook computers, and in-vehicle monitors.
  • FIG. 1 is a perspective view of a speaker module 00 according to an embodiment of the application
  • FIG. 2 is a top view of the speaker module 00 shown in FIG. 1
  • FIG. 3 is the speaker module shown in FIG. 2.
  • 00 is a schematic diagram of a cross-sectional structure along the direction A 0 -A 0 .
  • the speaker module 00 includes a front cover 01 , an inner core 02 and a rear cover 03 .
  • the front cover 01 includes a front cover 011 and a side frame 012 arranged around the edge of the front cover 011.
  • the front cover 011 and the side frame 012 enclose a receiving cavity, and one end of the receiving cavity away from the front cover 011 is open.
  • the rear cover 03 is covered at the opening.
  • the inner core 02 is accommodated in the accommodating cavity.
  • the inner core 02 is the core element used to generate sound in the speaker module, and a front acoustic cavity 04 is formed between the inner core 02 and the front cover 011, and the inner core 02 and the rear cover 03 form a closed rear acoustic cavity 05.
  • the side frame 012 is provided with a sound outlet channel 06 that communicates with the front acoustic cavity 04. When the inner core 02 works, the air in the front acoustic cavity 04 is pushed to form a sound wave, and the sound wave is derived from the sound outlet channel 06.
  • FIG. 4 is a schematic structural diagram of a core according to an embodiment of the application.
  • the core 02 includes a diaphragm 021 and a driving device 022 disposed on one side of the diaphragm 021 , and the driving device 022 is used to drive the diaphragm.
  • 021 vibrates to push the air in front of the diaphragm 021 to form sound waves.
  • the drive device 022 includes, but is not limited to, an electric (ie, moving coil) drive device, an electrostatic (ie, capacitive) drive device, an electromagnetic (ie, reed) drive device, or a piezoelectric (ie, crystal) drive device.
  • the driving device 022 is a moving coil type driving device.
  • the driving device 022 includes a voice coil 0221 connected to the diaphragm 021 , and a magnetic circuit system 0222 disposed on one side of the diaphragm 021 . , and the frame 0223 for installing the diaphragm 021 and the magnetic circuit system 0222.
  • the voice coil 0221 is energized, an induced magnetic field is generated, and is displaced by the magnetic force of the magnetic circuit system 0222 to drive the diaphragm 021 to vibrate.
  • the inner core 02 is applied to the speaker module 00 shown in FIG. 1 to FIG.
  • the diaphragm 021 is stacked with the front cover 011 and the rear cover 03 and arranged at intervals.
  • One surface of the diaphragm 021 faces the front acoustic cavity 04, and the other The surface faces the rear acoustic cavity 05 , and the driving device 022 is located in the rear acoustic cavity 05 .
  • Stator of the drive refers to the stationary part of the drive.
  • the mover of the drive device refers to the moving part of the drive device. Since the mover of the drive device and the stator of the drive device are in a relative motion relationship, the stator of the drive device can also be used as the mover of the drive device. The mover can also be used as the stator of the drive.
  • the stator is the magnetic circuit system 0222, and the mover is the voice coil 0221.
  • the stator can also be the voice coil 0221, and the mover is the magnetic circuit system 0222.
  • an X 0 Y 0 Z 0 coordinate system is established, and the Z 0 direction is parallel to the stacking direction of the front cover plate 011, the diaphragm 021 and the rear cover 03,
  • the X 0 Y 0 plane is perpendicular to the Z 0 direction.
  • a certain width of ventilation gap needs to be reserved between the side wall of the part of the inner core 02 located in the rear acoustic cavity 05 and the inner wall of the side frame 012, so the inner core 02 is in the X 0 Y 0 plane.
  • the occupied area is limited.
  • the diaphragm 021 needs to be connected with the mover of the driving device 022 (that is, the voice coil 0221) to be driven to realize the vibration movement, and the edge of the diaphragm 021 also needs to be connected. It is fixed on the frame 0223 of the driving device 022 to realize the support of the diaphragm 021. Therefore, the area of the diaphragm 021 will inevitably be limited by the occupied area of the driving device 022 on the X 0 Y 0 plane.
  • the speaker module 00 realizes the isolation between the front acoustic cavity 04 and the rear acoustic cavity 05 through the inner core 02.
  • the inner surface is provided with a stepped surface A for installing the inner core 02, and a retaining wall B is arranged around the outer edge of the stepped surface A.
  • the edge of the inner core 02 close to one end face of the front cover 011 is bonded to the stepped surface A, and the inner core 02 is bonded to the stepped surface A.
  • the side of the end of 02 close to the front cover 011 is bonded to the retaining wall B, thereby increasing the effective bonding width between the edge of one end of the inner core 02 close to the front cover 011 and the front cover 011, ensuring that the inner core 02
  • the front acoustic cavity 04 and the rear acoustic cavity 05 can be effectively isolated.
  • the retaining wall B and the glue overflowing from the gap between the retaining wall B and the side wall of the inner core 02 are located in the rear acoustic cavity 05, the retaining wall B and this part of the glue occupy part of the space of the rear acoustic cavity 05, so the speaker module Under the premise that the volume of 00 remains unchanged, the volume of the rear acoustic cavity 05 is smaller, and the low frequency sensitivity of the speaker is lower.
  • the present application provides a loudspeaker module, which is used for combining music, Audio electrical signals such as voice are converted into sound, and the function of audio playback is supported.
  • FIG. 5 is a perspective view of a speaker module 1 according to some embodiments of the application.
  • the speaker module 1 includes a speaker module body 11 , and the speaker module body 11 is the main part for realizing the function of the speaker module. .
  • the speaker module main body 11 includes a first casing 111 .
  • the outline shape of the first casing 111 may be a cube, a rectangular parallelepiped, a cylinder, etc., which is not specifically limited herein.
  • the first housing 111 may be an integral housing structure, or may be a housing structure formed by assembling a plurality of parts, which is not specifically limited herein.
  • a receiving cavity 300 is provided in the first housing 111 .
  • FIG. 6 is an exploded view of the speaker module 1 shown in FIG. 5 .
  • the first housing 111 includes a first front cover 1111 , a first middle frame 1112 and a first rear cover 1113 .
  • the material of the first middle frame 1112 includes but is not limited to metal and plastic. In the embodiment shown in FIG. 6 , the material of the first middle frame 1112 is plastic.
  • the first middle frame 1112 includes a first surface 100 and a second surface 200 opposite to each other.
  • the first surface 100 and the second surface 200 may be flat, curved, or stepped, which are not specifically limited herein. In the embodiment shown in FIG. 6 , both the first surface 100 and the second surface 200 are stepped surfaces.
  • the accommodating cavity 300 is formed in the first middle frame 1112 , and the accommodating cavity 300 penetrates the first surface 100 and the second surface 200 .
  • the first front cover 1111 is covered on the opening of the accommodating cavity 300 passing through the first surface 100 and fixed with the first middle frame 1112 .
  • the first front cover 1111 may be fixed to the first middle frame 1112 through processes such as gluing, snap-fitting, screw connection, ultrasonic welding, etc., which is not specifically limited herein.
  • the material of the first front cover 1111 includes, but is not limited to, metal and plastic.
  • the first front cover 1111 includes a first middle plate 1111 a and a first middle plate 1111 a fixed on the edge of the first middle plate 1111 a.
  • the material of the first middle plate 1111a is metal, such as stainless steel, aluminum alloy, magnesium-aluminum alloy, etc. The hardness of the metal is relatively high, which is beneficial to reduce the thickness of the middle portion of the first front cover 1111 .
  • the material of the first frame 1111b is plastic, so that the first frame 1111b can be directly pressed together with the first middle frame 1112 through an ultrasonic welding process to avoid using glue or other consumables for connection.
  • the first middle plate 1111a and the first frame 1111b may be fixed together by processes such as gluing, clamping, screw connection, in-mold decoration (IMD), etc., which are not specifically limited herein.
  • the first middle board 1111a is fixed with the first frame 1111b through an IMD process, so that the use of glue or other consumables for connection can be avoided.
  • the first rear cover 1113 is covered on the opening of the accommodating cavity 300 passing through the second surface 200 and fixed with the first middle frame 1112 .
  • the first back cover 1113 can be fixed to the first middle frame 1112 by a process such as gluing, clamping, screw connection, ultrasonic welding, etc., which is not specifically limited herein.
  • the speaker module body 11 further includes a diaphragm 112 and a driving device 113 .
  • FIG. 7 is a top view of the speaker module 1 shown in FIG. 5
  • FIG. 8 is a schematic cross-sectional structure diagram of the speaker module 1 shown in FIG.
  • the edge of the diaphragm 112 is fixed with the first casing 111 around the circumference.
  • the accommodating cavity 300 is divided by the diaphragm 112 into a front acoustic cavity 115 and a rear acoustic cavity 116 that are independent of each other.
  • the first casing 111 is provided with a sound outlet that communicates with the front acoustic cavity 115 Channel 117.
  • the first housing 111 further includes an annular support boss 114 .
  • the support boss 114 is disposed around the inner wall of the first middle frame 1112 .
  • the support boss 114 and the first middle frame 1112 are integrally formed.
  • the edge of the diaphragm 112 is fixed on the support boss 114 around the circumference. Specifically, the edge of the diaphragm 112 can be fixed on the surface of the support boss 114 facing the first front cover 1111 or on the surface of the support boss 114 facing the first rear cover 1113 , which is not specifically limited here.
  • the edge of the diaphragm 112 is fixed to the surface of the support boss 114 facing the first front cover 1111 around the circumference.
  • the edge of the vibration membrane 112 is bonded to the support boss 114 through an adhesive material.
  • the surface of the support boss 114 facing the first front cover 1111 may be parallel to the plane where the first front cover 1111 is located, or may be inclined relative to the plane where the first front cover 1111 is located. Make specific restrictions.
  • the surface of the support boss 114 facing the first front cover 1111 is an inclined surface inclined toward the direction close to the sound outlet channel 117 . In this way, the vibrating membrane 112 installed on the inclined plane is inclined in the direction close to the sound outlet channel 117, which is beneficial to smoothly export the air flow generated when the vibrating membrane 112 vibrates from the sound outlet channel 117, thereby helping to improve the airflow sound of the speaker. Improve the sound quality of your speakers.
  • the front acoustic cavity 115 is formed between the diaphragm 112 and the first front cover 1111
  • the rear acoustic cavity 116 is formed between the diaphragm 112 and the first rear cover 1113 .
  • the sound channel 117 is disposed on the first middle frame 1112 .
  • the driving device 113 is located in the rear acoustic cavity 116 , and the driving device 113 includes a stator 1132 and a mover 1131 . part of the movement.
  • the stator 1132 and the mover 1131 are in a relative motion relationship, the stator 1132 can also serve as a mover, and the mover 1131 can also serve as a stator.
  • the stator 1132 is a magnetic circuit system
  • the mover 1131 is a voice coil.
  • the stator 1132 can also be a voice coil
  • the mover 1131 is a magnetic circuit system.
  • the driving device 113 is fixed to the first housing 111 by the stator 1132 of the driving device 113 .
  • the stator 1132 of the driving device 113 is fixed to the surface of the support boss 114 facing the first back cover 1113 and the first back cover between 1113 and 1113, specifically, the stator 1132 of the driving device 113 can be fixed only on the surface of the support boss 114 facing the first back cover 1113, or only on the first back cover 1113, or can be fixed on the support at the same time.
  • the surface of the boss 114 facing the first rear cover 1113 and the first rear cover 1113 are not specifically limited herein.
  • the stator 1132 of the driving device 113 is fixed to the surface of the support boss 114 facing the first rear cover 1113 and the first rear cover 1113 at the same time. In this way, the positional stability of the stator 1132 of the driving device 113 in the rear acoustic cavity 116 can be ensured.
  • the driving device 113 is only fixed to the diaphragm 112 by the mover 1131 of the driving device 113 , that is, the stator 1132 of the driving device 113 is not fixed to the diaphragm 112 .
  • the driving device 113 is used to drive the diaphragm 114 to vibrate, so as to push the air in the front acoustic cavity 115 to vibrate to form a sound wave, and the sound wave is output from the sound outlet channel 117 to form a sound.
  • the driving device 113 may be an electric (ie, moving coil) driving device, an electrostatic (ie, capacitive) driving device, an electromagnetic (ie, reed) driving device, or a piezoelectric (ie, crystal) driving device, and here There is no specific limitation, as long as the diaphragm 112 can be driven to vibrate, so as to push the air in the front acoustic cavity 115 to vibrate to form sound waves.
  • the driving device 113 is an example of a moving coil type driving device for description, which should not be considered as a special limitation of the present application.
  • the stator 1132 of the driving device is a magnetic circuit system
  • the mover 1131 of the driving device is a voice coil.
  • the voice coil is fixed to the diaphragm 112.
  • the voice coil is fixed to the diaphragm 112 by means of gluing.
  • the voice coil and the diaphragm 112 are arranged on the same central axis, that is, the central axis of the voice coil and the central axis of the diaphragm 112 are collinear, and the central axis of the diaphragm 112 passes through the center of the diaphragm 112 and is located with the diaphragm 112 A straight line perpendicular to the plane.
  • the voice coil is wound from the voice coil wire.
  • the voice coil is formed by winding the voice coil wire with more than 4 layers (that is, more than or equal to 4 layers) from the inside to the outside along the radial direction of the voice coil.
  • the voice coil is formed by the voice coil wire along the The radial direction of the voice coil is formed by winding 6 layers from the inside to the outside. In this way, the required length of the voice coil wire is longer, and the quality of the voice coil is larger.
  • F0 refers to the frequency corresponding to the first maximum value of the speaker impedance curve.
  • F0 the better the low-frequency sensitivity is
  • Mm the vibration mass
  • Mm the sum of the mass of the voice coil and the mass of the diaphragm 112
  • C m represents the compliance of the diaphragm 112 , and it can be known that the F0 of the speaker is negatively correlated with the quality of the voice coil. Therefore, the F0 of the speaker can be reduced, thereby improving the low-frequency sensitivity of the speaker.
  • the magnetic circuit system is used to generate a magnetic field, and the north and south directions of the magnetic field generated by the magnetic circuit system are the same as the extending direction of the central axis of the voice coil, and at least part of the voice coil is located in the magnetic circuit system.
  • the magnetic circuit system is the same as the magnetic circuit system in the commonly used voice coil drive device, so the internal structure thereof will not be described in detail.
  • the first rear cover 1113 may be a closed cover body or a cover body with a hollowed-out center, which is not specifically limited herein.
  • the first rear cover 1113 is a cover body with a hollow center, that is, a hollow opening 1113a is formed in the middle of the first rear cover 1113, and the hollow opening 1113a can avoid part of the magnetic field.
  • the circuit system is used to reduce the thickness of the speaker module body 11 in the arrangement direction of the first front cover 1111 , the first middle frame 1112 , and the first rear cover 1113 (ie, the direction Z).
  • the surface of the magnetic circuit system facing away from the first front cover 1111 and the edge of the first rear cover at the hollow opening 1113a are located between the circumferences. Sealed and bonded by adhesive.
  • the orthographic projection area of the driving device 113 on the plane where the diaphragm 112 is located is smaller than the area of the diaphragm 112 .
  • the edge of the diaphragm 112 is fixed to the first housing 111 around the circumference, and the driving device 113 passes through the driving device 113 .
  • the stator 1132 is fixed to the first housing 111, and the driving device 113 is only fixed to the diaphragm 112 through the mover 1131 of the driving device 113.
  • the diaphragm 112 is only connected to the mover 1131 of the driving device 113 to be driven to vibrate, while It will not be limited by the size of the entire driving device 113, and at the same time, the area of the diaphragm 112 is designed to be larger than the orthographic projection area of the driving device 113 on the plane where the diaphragm 112 is located. On the premise that the external dimension of 113 remains unchanged, the area of the diaphragm 112 is increased to improve the sensitivity of the speaker.
  • the edge of the diaphragm 112 is fixed to the first casing 111 around the circumference. Since the diaphragm 112 is made of soft material, it is convenient to be connected with the first casing The body 111 is attached and sealed and fixed without adding a retaining wall structure to increase the sealing width. Therefore, there is no retaining wall to occupy the space of the rear acoustic cavity 116, which is beneficial to increase the volume of the rear cavity of the speaker module 1 and improve the sound quality of the speaker. Low frequency sensitivity.
  • the first housing 111 includes a sandwich structure composed of a first front cover 1111 , a first middle frame 1112 , a first rear cover 1113 and a support boss 114 , and the edge of the diaphragm 112 is fixed around the The surface of the support boss 114 facing the first front cover 1111, the stator 1132 of the driving device 113 is fixed between the surface of the support boss 114 facing the first rear cover 1113 and the first rear cover 1113, so the diaphragm 112 and the drive
  • the installation operation of the device 113 in the first casing 111 is simple, and the assembly efficiency is high.
  • the speaker module 1 further includes a rear cavity expansion device 12 , and the rear cavity expansion device 12 is used to expand the rear cavity of the speaker module 1 .
  • the rear cavity expansion device 12 includes a second casing 121 .
  • the contour shape of the second housing 121 may be a cube, a rectangular parallelepiped, a cylinder, etc., which is not specifically limited herein.
  • the second casing 121 is fixed to the first casing 111.
  • FIG. 9 is a schematic cross-sectional structural diagram of the speaker module 1 shown in FIG. 7 along the B-B direction.
  • the rear cavity expansion space 400 communicated with the rear acoustic cavity 116 in the main body 11 .
  • the rear cavity expansion space 400 and the rear acoustic cavity 116 together form the rear cavity of the speaker module 1, thereby increasing the volume of the rear cavity of the speaker module 1 and improving the sound quality of the entire speaker.
  • the relative positional relationship between the first casing 111 and the second casing 121 can be various, for example, along the arrangement direction of the first front cover 1111 , the first middle frame 1112 and the first rear cover 1113 of the first casing 111 (that is, in the direction Z), for example, in the direction X perpendicular to the direction Z, which is not specifically limited here.
  • the arrangement direction of the first casing 111 and the second casing 121 ie, the direction X in FIG. 5
  • the arrangement direction of the first middle frame 1112 and the first back cover 1113 ie, the direction Z in FIG. 5
  • the size of the speaker module 1 in the direction Z can be made smaller, which facilitates the installation of the speaker module 1 in the embodiments of the present application in thin electronic devices such as phablet phones and tablet computers.
  • the width w1 of the rear cavity expansion device 12 in the direction Y may be greater than the width w2 of the speaker module main body 11 in the direction Y, or equal to the width w2 of the speaker module main body 11 in the direction Y, and may also be smaller than the speaker module main body.
  • the width w2 of 11 in the direction Y is not specifically limited here. In the embodiment shown in FIG. 5 , the width w1 of the rear cavity expansion device 12 in the direction Y is smaller than the width w2 of the speaker module main body 11 in the direction Y.
  • the direction Y is perpendicular to the direction X, and the direction Y is also perpendicular to the direction Z.
  • the second casing 121 may be an integral casing structure, or a casing structure formed by assembling a plurality of parts, which is not specifically limited herein.
  • the second housing 121 includes a second front cover 1211 , a second middle frame 1212 and a second rear cover 1213 .
  • the second middle frame 1212 is fixed to the first middle frame 1112 .
  • the second middle frame 1212 and the first middle frame 1112 are formed into a single body through an integral molding process.
  • the two end faces of the second middle frame 1212 along the arrangement direction of the first front cover 1111 , the first middle frame 1112 and the first rear cover 1113 of the first casing 111 are respectively the first There are three surfaces 500 and a fourth surface 600 .
  • the third surface 500 is connected to the first surface 100
  • the fourth surface 600 is connected to the second surface 200 .
  • the third surface 500 and the fourth surface 600 may be flat surfaces, curved surfaces, or stepped surfaces, which are not specifically limited herein. In the embodiment shown in FIG. 6 , both the third surface 500 and the fourth surface 600 are stepped surfaces.
  • the rear cavity expansion space 400 is formed in the second middle frame 1212 , and the rear cavity expansion space 400 penetrates the third surface 500 and the fourth surface 600 .
  • the second front cover 1211 is covered on the opening at one end of the rear cavity expansion space 400 that penetrates through the third surface 500 and is fixed with the second middle frame 1212 .
  • the second front cover 1211 and the second middle frame 1212 pass through Fixed by glue.
  • each part of the second front cover 1211 may be the same or different, which are not specifically limited herein. In the embodiment shown in FIG. 6 , the materials of each part of the second front cover 1211 are the same. On this basis, the material of the second front cover 1211 can be metal, plastic, or other materials. This is not specifically limited. In the embodiment of the present application, the material of the second front cover 1211 is metal, and the hardness of the metal is relatively high, which is beneficial to reduce the thickness of the second front cover 1211 .
  • the second rear cover 1213 is covered on the opening at one end of the rear cavity expansion space 400 which penetrates through the fourth surface 600 and is fixed to the second middle frame 1212 .
  • each part of the second back cover 1213 may be the same or different, which are not specifically limited herein.
  • the second rear cover 1213 includes a second middle plate 1213 a and a second frame 1213 b fixed to the edge of the second middle plate 1213 a.
  • the material of the second middle plate 1213a is metal, such as stainless steel, aluminum alloy, magnesium-aluminum alloy, etc. The hardness of the metal is relatively high, which is beneficial to reduce the thickness of the middle portion of the second rear cover 1213 .
  • the material of the second frame 1213b is plastic, so that when the material of the second middle frame 1212 is also plastic, the second frame 1213b can be pressed together with the second middle frame 1212 through an ultrasonic welding process to avoid Use glue or other consumables to make the connection.
  • the second frame 1213b and the first back cover 1113 may be two independent structures, or may be integrally formed with the first back cover 1113, which is not specifically limited herein.
  • the second frame 1213b and the first back cover 1113 are integrally formed, so that the structural complexity of the speaker module 1 can be reduced and the assembly efficiency of the speaker module 1 can be improved.
  • the rear cavity expansion device 12 further includes a sound-absorbing block 122, the sound-absorbing block 122 is made of melamine, zeolite particles, glass fiber, activated carbon, etc. (including A single material or a combination of two or more materials) a block-like structure made of sound-absorbing material, and the sound-absorbing block 122 is located in the rear cavity expansion space 400 and is bonded to the inner wall of the rear cavity expansion space 400 through glue.
  • the sound-absorbing block 122 is made of melamine, zeolite particles, glass fiber, activated carbon, etc. (including A single material or a combination of two or more materials) a block-like structure made of sound-absorbing material, and the sound-absorbing block 122 is located in the rear cavity expansion space 400 and is bonded to the inner wall of the rear cavity expansion space 400 through glue.
  • the F0 index under the same cavity can be reduced by the sound-absorbing block 122 (the F0 index refers to the frequency corresponding to the first maximum value of the speaker impedance curve, and a smaller F0 will bring better low-frequency sensitivity), whereby, better sound quality, frequency response and reduction degree are brought to improve the sound quality of the loudspeaker; on the other hand, since the sound-absorbing block 122 has a block-like structure, and the sound-absorbing block 122 is bonded to the inner wall of the rear cavity expansion space 400 through the glue material Therefore, there is no need to set up a net such as gauze, metal mesh, etc.
  • the sound absorbing block 122 may fill the entire rear cavity expansion space 400, or may only fill a part of the rear cavity expansion space 400, which is not specifically limited herein. Since the area of the rear cavity expansion space 400 that communicates with the rear acoustic cavity 116 is generally small, if the sound absorbing block 122 fills the entire rear cavity expansion space 400, the area of the contact area between the sound absorbing block 122 and the air in the rear acoustic cavity 16 is small. The sound absorbing effect of the sound absorbing block 122 is limited. In order to avoid the above problems, in some embodiments, please refer to FIG. 10 .
  • FIG. 10 is a schematic cross-sectional structure diagram of the speaker module 1 shown in FIG. 7 along the C-C direction.
  • the rear cavity expansion space 400 includes a first space area 401 and a second space area 401 . Two spatial regions 402 .
  • the first space area 401 communicates with the rear acoustic cavity 116, and the first space area 401 is an air space.
  • the sound-absorbing block 122 is filled in the second space area 402 and is bonded to the part of the inner wall of the rear cavity expansion space 400 that surrounds the second space area 402 by adhesive material. In this way, through the transition of the first space area 401, the sound absorbing block 122 has a larger air contact area, so the sound absorbing effect is better, and the sound quality of the speaker can be further improved.
  • the surface a of the sound absorbing block 122 facing the first space area 401 is provided with at least one ventilation hole 1221 , and the at least one ventilation hole 1221 faces the sound absorbing block.
  • the surface b of the 122 facing away from the first space region 401 extends.
  • the at least one ventilation hole 1221 penetrates the sound absorbing block 122 . In this way, the area of the sound absorbing block 122 in contact with the air can be further increased, so as to further improve the sound absorbing effect of the sound absorbing block 122 and improve the sound quality of the speaker.
  • the arrangement direction of the first space area 401 and the second space area 402 may be the same as the arrangement direction of the first front cover 1111 , the first middle frame 1112 , and the first rear cover 1113 of the first housing 111 (that is, in FIG. 5 ).
  • the direction Z) is parallel, and can also be perpendicular to the direction Z, and can also be in other orientations, which are not specifically limited here.
  • the arrangement direction of the first space region 401 and the second space region 402 is parallel to the direction Z.
  • the structure is simple, and the installation of the sound absorbing block 122 is convenient.
  • the surface of the sound absorbing block 122 connected between the surface a facing the first space region 401 and the surface b facing away from the first space region 401 is the side c of the sound absorbing block 122 .
  • the part of the inner wall of the rear cavity expansion space 400 that encloses the second space area 402 includes a first area B and a second area C.
  • the first area B is opposite to the surface b of the sound absorbing block 122 that faces away from the first space area 401.
  • the area C is opposite to the side surface c of the sound absorbing block 122 .
  • the sound-absorbing block 122 may be bonded to the first area B by an adhesive material, or may be bonded to the second area C by an adhesive material, which is not specifically limited herein.
  • the sound-absorbing block 122 is adhered to the first area B through an adhesive material, so that the sound-absorbing block 122 can be assembled to form the second shell after being adhered to the second front cover 1211
  • the body 121 is installed in the second space area 402 during the process, so that the difficulty of bonding the sound absorbing block 122 can be reduced.
  • the Z direction of the speaker module 1 is consistent with the thickness direction of the electronic device, and the second housing wall where the second region C is located is in line with the thickness direction of the electronic device.
  • the front screen or the battery cover are in direct contact, so when the sound-absorbing block 122 is adhered to the second area C, when the speaker module 1 is installed in the flat-shaped electronic device and falls with the electronic device, the impact force will be directly transmitted to the on the sound-absorbing block 122, thereby causing the sound-absorbing block 122 to be broken.
  • FIG. 11 is another cross-sectional structural diagram of the speaker module 1 shown in FIG. 7 along the C-C direction.
  • the sound-absorbing block 122 can have a certain shock absorption and buffering effect in the direction Z, so as to avoid the sound-absorbing block 122 when the speaker module 1 is installed in a flat-shaped electronic device such as a mobile phone and a tablet computer and falls with the electronic device. produce fragmentation.
  • the speaker module 1 further includes a positive terminal 13 and a negative terminal 14 .
  • the positive terminal 13 and the negative terminal 14 are used for external power supply, and inside the speaker module 1 , the positive terminal 13 and the negative terminal 14 are respectively It is electrically connected to the positive and negative electrodes of the driving device 113 , so that power is supplied to the driving device 113 in the speaker module 1 through the positive terminal 13 and the negative terminal 14 .
  • the positive terminal 13 and the driving device 113 are electrically connected through a first enameled wire 16, and the first enameled wire 16 passes through the rear cavity of the speaker module 1.
  • the plasticity of the enameled wire is better, which is convenient for bending and routing, and the radial width of the enameled wire is narrow, which can reduce the positioning structure for fixing and supporting the first enameled wire 16 and the volume of the glue material, so that the external dimension of the speaker module 1 can be reduced. Under the same premise, it is beneficial to increase the volume of the rear cavity of the speaker module, thereby further improving the sound quality of the speaker.
  • the negative terminal 14 and the driving device 113 are electrically connected through a second enameled wire 17 , and the second enameled wire 17 also passes through the rear cavity of the speaker module 1 .
  • the plasticity of the enameled wire is better, which is convenient for bending and routing, and the radial width of the enameled wire is narrow, which can reduce the positioning structure for fixing and supporting the second enameled wire 17 and the volume of the glue material, so that the external dimension of the speaker module 1 can be reduced. Under the same premise, it is beneficial to increase the volume of the rear cavity of the speaker module, thereby further improving the sound quality of the speaker.
  • the speaker module 1 further includes a filter structure 15 , the filter structure 15 is disposed at the outlet of the sound outlet channel 117 , and the filter structure 15 allows airflow and prevents dust and water vapor from passing through. In this way, the filter structure 15 can prevent the dust and water vapor in the external environment from entering the interior of the speaker module 1 through the sound outlet channel 117 , so as to avoid affecting the performance of the speaker module 1 .
  • the present application also provides an electronic device, which includes but is not limited to a mobile phone, a tablet computer, a notebook computer, and a vehicle-mounted display.
  • FIG. 12 is a schematic structural diagram of an electronic device provided by some embodiments of the present application, and the electronic device is a mobile phone.
  • the electronic device includes a housing 2 , a circuit board 3 and the speaker module 1 described in any of the above embodiments.
  • the casing 2 is used to protect the electronic devices inside the electronic device.
  • the casing 2 includes a front cover 21 , a back cover (not shown in the figure) and a frame 22 .
  • the casing 2 is provided with a sound outlet 4 .
  • the sound outlet 4 is arranged on the lower frame section of the frame 22 .
  • the circuit board 3 and the speaker module 1 are arranged in the casing 2 , the circuit board 2 is electrically connected with the driving device of the speaker module 1 , and the sound outlet channel of the speaker module 1 is opposite to the sound outlet hole 4 . In this way, the sound generated by the speaker module 1 is emitted from the sound outlet 4 .
  • the electronic device provided by the embodiment of the present application includes the speaker module 1 described in any of the above embodiments, the two can solve the same technical problem and achieve the same technical effect.

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Audible-Bandwidth Dynamoelectric Transducers Other Than Pickups (AREA)

Abstract

La présente invention concerne un module de haut-parleur et un dispositif électronique, relatifs au domaine technique des dispositifs électroniques, qui peuvent, tout en maintenant inchangées les dimensions extérieures du module de haut-parleur, augmenter la surface de la membrane, augmenter l'espace de la chambre arrière et augmenter la sensibilité du haut-parleur. Le module de haut-parleur comprend un corps de module de haut-parleur, ledit corps de module de haut-parleur comprenant un premier boîtier, un cône et un appareil d'entraînement, le premier boîtier étant pourvu intérieurement d'une chambre de logement ; la membrane est située dans la chambre de logement et le bord de la membrane est fixé au premier boîtier, la chambre de logement est séparée par la membrane en une cavité acoustique avant et une cavité acoustique arrière, et le premier boîtier est pourvu d'un passage de sortie du son en communication avec la cavité acoustique avant ; le dispositif d'entraînement est situé dans la cavité acoustique arrière, le dispositif d'entraînement comprend un stator et un moteur, le dispositif d'entraînement est fixé au premier boîtier au moyen du stator, le dispositif d'entraînement est fixé à la membrane uniquement au moyen du moteur, et la surface de la projection positive du dispositif d'entraînement dans le plan de la membrane est inférieure à la surface de la membrane. Le module de haut-parleur fourni par les modes de réalisation de la présente invention est appliqué à un dispositif électronique.
PCT/CN2021/117516 2020-10-28 2021-09-09 Module de haut-parleur et dispositif électronique Ceased WO2022089032A1 (fr)

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CN202011177270.1A CN114501258A (zh) 2020-10-28 2020-10-28 一种扬声器模组和电子设备

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CN117135540A (zh) * 2023-04-28 2023-11-28 荣耀终端有限公司 电子设备
CN117135245A (zh) * 2023-04-28 2023-11-28 荣耀终端有限公司 一种电子设备
WO2023246573A1 (fr) * 2022-06-20 2023-12-28 维沃移动通信有限公司 Module de production sonore et dispositif électronique
CN117440072A (zh) * 2022-07-12 2024-01-23 荣耀终端有限公司 一种电子设备
CN118540641A (zh) * 2024-07-24 2024-08-23 瑞声光电科技(常州)有限公司 电子设备
CN119300270A (zh) * 2024-02-29 2025-01-10 荣耀终端有限公司 壳体和电子设备
CN119697306A (zh) * 2023-09-18 2025-03-25 荣耀终端股份有限公司 电子设备
CN120261996A (zh) * 2024-04-22 2025-07-04 华为技术有限公司 谐振腔天线及电子设备

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CN116684507B (zh) * 2022-09-29 2024-03-15 荣耀终端有限公司 电子设备
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CN115022435A (zh) * 2022-05-30 2022-09-06 Oppo广东移动通信有限公司 一种电子设备
WO2023246573A1 (fr) * 2022-06-20 2023-12-28 维沃移动通信有限公司 Module de production sonore et dispositif électronique
CN117440072A (zh) * 2022-07-12 2024-01-23 荣耀终端有限公司 一种电子设备
CN115967900A (zh) * 2023-01-31 2023-04-14 维沃移动通信有限公司 电子设备
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CN116600037B (zh) * 2023-06-09 2024-01-12 湖南捷力泰科技有限公司 一种高声压手机喇叭及手机
CN116600037A (zh) * 2023-06-09 2023-08-15 湖南捷力泰科技有限公司 一种高声压手机喇叭及手机
CN119697306A (zh) * 2023-09-18 2025-03-25 荣耀终端股份有限公司 电子设备
CN119300270A (zh) * 2024-02-29 2025-01-10 荣耀终端有限公司 壳体和电子设备
CN120261996A (zh) * 2024-04-22 2025-07-04 华为技术有限公司 谐振腔天线及电子设备
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