WO2022227498A1 - Structure d'emballage de dispositif électronique de puissance appropriée pour un environnement de brouillard salin lourd - Google Patents

Structure d'emballage de dispositif électronique de puissance appropriée pour un environnement de brouillard salin lourd Download PDF

Info

Publication number
WO2022227498A1
WO2022227498A1 PCT/CN2021/130462 CN2021130462W WO2022227498A1 WO 2022227498 A1 WO2022227498 A1 WO 2022227498A1 CN 2021130462 W CN2021130462 W CN 2021130462W WO 2022227498 A1 WO2022227498 A1 WO 2022227498A1
Authority
WO
WIPO (PCT)
Prior art keywords
unit
heat dissipation
power electronic
cavity structure
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2021/130462
Other languages
English (en)
Chinese (zh)
Inventor
孙盼
张筱琛
吴旭升
汪小娜
熊义勇
孙军
王蕾
梁彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Naval University of Engineering PLA
Original Assignee
Naval University of Engineering PLA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naval University of Engineering PLA filed Critical Naval University of Engineering PLA
Publication of WO2022227498A1 publication Critical patent/WO2022227498A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20909—Forced ventilation, e.g. on heat dissipaters coupled to components
    • H—ELECTRICITY
    • H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
    • H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
    • H05K7/20418—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing the radiating structures being additional and fastened onto the housing

Definitions

  • the invention relates to the field of packaging of power electronic equipment, in particular to a packaging structure of power electronic equipment suitable for a high salt fog environment.
  • the first method is to increase the volume of the power electronic device itself, and increase the contact area with the outside by increasing the volume of the power electronic device, and By dispersing the electronic components, the problem of mutual interference between the components is reduced, but this will greatly increase the manufacturing cost and maintenance cost of the power electronic equipment, and it is not convenient to use; another way is to set the heat dissipation
  • this method can quickly dissipate heat from power electronic equipment, its electronic components usually come into contact with the outside air in a large area. In the high salt fog environment such as ships, electronic components will be quickly eroded in the salt fog atmosphere, resulting in power electronic equipment not working properly. Therefore, the existing technologies cannot solve the problem of effective protection of the existing power electronic equipment in harsh environments
  • the present invention provides a power electronic device packaging structure suitable for a high salt spray environment, so as to solve the problem of the existing power electronic device in a high salt spray environment. cooling problem.
  • the present invention provides a power electronic device packaging structure suitable for high salt fog environment, including:
  • the first unit is used to stabilize the direct current and convert it into alternating current, which includes a power circuit board and a first heat dissipation element and a second heat dissipation element arranged on the power circuit board, and the first unit is located
  • a heat-conducting plastic sealing material is arranged in the cavity structure, and the power circuit board and the first heat dissipation element are wrapped in the heat-conducting plastic sealing material;
  • the third unit is used to control the operation of the first unit and the second unit.
  • the operating calorific value of the first unit, the second unit and the third unit is sequentially reduced.
  • the first unit and the second unit are packaged in the cavity structure with a cover plate.
  • the power circuit board and the first heat dissipation element are disposed on the side of the cavity structure close to the heat dissipation fins, and the thermally conductive plastic sealing material is close to the inside of the cavity structure away from the heat dissipation fins wall.
  • the second heat dissipation element is attached to the inner wall of the cavity structure on the side away from the power circuit board, and a thermal pad is provided between the second heat dissipation element and the inner wall surface of the cavity structure.
  • each cavity structure is respectively provided with a plurality of plugs for corresponding electrical connection between cavity structures and input and output of current signals.
  • a cooling fan is provided corresponding to the cooling fins.
  • the power electronic device packaging structure of the present invention suitable for high salt fog environment, by separately encapsulating the heating components with different stable heating temperatures in different cavity structures, so that the heating components with different heating values are respectively Operating in different cavity structures, encapsulating the heating components separately in different cavities can increase the contact heat dissipation area between each component and the outside, and improve the heat dissipation efficiency of power electronic equipment; Avoid mutual interference between components with different calorific values, so that the temperature of all components in the power electronic equipment rises, resulting in the heating components with relatively low stable heating temperature always working at a higher temperature, which eventually leads to power electronic equipment. The operation efficiency of some components in the equipment is reduced or the operation is blocked, which affects the use of power electronic equipment.
  • the power electronic device packaging structure of the present invention suitable for high salt fog environment, which encapsulates the power circuit board and the first heat dissipation element in a thermally conductive plastic sealing material, and closes the power circuit board and the first heat dissipation element.
  • the heat dissipation fins are attached to the wall, and the heat on the power circuit board and the first heat dissipation element is transferred to the side wall of the cavity structure through the thermally conductive plastic sealing material, and the heat dissipation fins are used for rapid heat dissipation, so as to avoid the power circuit board and the first heat dissipation element.
  • the temperature on the first heat dissipation element is too high to ensure stable operation of the power electronic device.
  • the power electronic device packaging structure of the present invention is suitable for high salt fog environment.
  • the end face of the second heat dissipation element in the cavity structure is abutted on the inner wall of the side away from the power circuit board, and the thermal pad is used to carry out Heat transfer, on the one hand, it can avoid direct contact between the second heat dissipation element and the cover plate, causing damage to the second heat dissipation element, and on the other hand, the heat generated on the second heat dissipation element can be directly transferred to the cavity structure through the thermal pad on the side walls and dissipate to the outside, increasing the rate of heat dissipation from the second heat dissipation element.
  • the power electronic device packaging structure of the present invention is suitable for high salt fog environment.
  • a cooling fan outside the cavity structure By connecting a cooling fan outside the cavity structure, and making the air outlet of the cooling fan face the cooling fin, the first heating element and the second heating element After the internal heat of the heating element is transferred to the heat dissipation fins through the side wall of the cavity structure, the heat dissipation rate on the heat dissipation fins is accelerated by the heat dissipation fan, so as to prevent the operating temperature of the first unit and the second unit from being too high and affecting the work efficiency.
  • the power electronic device packaging structure of the present invention is suitable for high salt fog environment.
  • the second unit is mainly a current conversion device, it will generate high voltage during operation.
  • the magnetic field generated by the second unit can be prevented from affecting the work of other heating components, and the working state of the power electronic device can be stabilized.
  • the encapsulation structure of the power electronic device of the present invention suitable for the high salt fog environment is sealed by arranging a cover plate structure on the cavity structure corresponding to the first unit and the second unit.
  • the corresponding cavity structure can be quickly opened by removing the cover plate, and the electronic components in the power electronic equipment can be quickly repaired or replaced within 1 minute, so as to reduce the failure of the power electronic equipment. Loss.
  • the packaging structure of power electronic equipment suitable for high salt fog environment of the present invention by encapsulating the first unit, the second unit and the third unit in different cavity structures, to avoid the space between the heating components interfere with each other, and by encapsulating the power circuit board and the first heat dissipation element in the first cavity structure in a thermally conductive plastic sealing material, the heat generated by them can be quickly transferred to the heat dissipation fins through the sidewall of the first cavity structure, The heat dissipation efficiency of the power circuit board and the first heat dissipation element is accelerated; the second heat dissipation element is directly arranged in the first cavity structure, and the anti-erosion performance of the second heat dissipation element itself is used to reduce the thermal conductive plastic sealing material in the first cavity structure
  • the use amount of the power electronic device reduces the overall weight of the power electronic device; and the second heat dissipation element can directly transfer the generated heat to the cover plate through the thermal pad and dissipate it to the outside, which
  • FIG. 2 is a schematic diagram of the internal structure of the first cavity structure in the embodiment of the present invention.
  • FIG. 3 is a schematic diagram of the internal structure of the second cavity structure in the embodiment of the present invention.
  • FIG. 4 is a schematic diagram of the internal structure of the third cavity structure in the embodiment of the present invention.
  • first and second are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature delimited with “first”, “second” may expressly or implicitly include at least one of that feature.
  • plurality means at least two, such as two, three, etc., unless expressly and specifically defined otherwise.
  • the terms “installed”, “connected”, “connected”, “fixed” and other terms should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between the two elements, unless otherwise specified limit.
  • installed may be a fixed connection or a detachable connection , or integrated; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between the two elements, unless otherwise specified limit.
  • a first feature "on” or “under” a second feature may be in direct contact between the first and second features, or the first and second features indirectly through an intermediary touch.
  • the first feature being “above”, “over” and “above” the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is level higher than the second feature.
  • the first feature being “below”, “below” and “below” the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature has a lower level than the second feature.
  • the packaging structure of a power electronic device suitable for a high-salt fog environment includes a first unit, a second unit 201 and a third unit 301 that are electrically connected, and the first unit, the second unit 201 and the third unit 301 are electrically connected.
  • the three units 301 are individually packaged in different cavity structures due to their different working calorific values and stable heating temperatures; the first unit is mainly used for stabilizing current and converting current, and then converting DC to AC and transmitting it after DC-DC conversion To the second unit, it includes a power circuit board 101 and a first heat dissipation element and a second heat dissipation element arranged on the power circuit board 101, and a thermally conductive plastic sealing material is provided in the cavity structure where the first unit is located, and the power circuit The board and the first heat-dissipating element are correspondingly wrapped in the heat-conducting plastic sealing material; the second unit 201 is used for secondary transformation of the alternating current transmitted from the first unit, so as to meet the normal use requirements of external electrical appliances and transmit it to external electrical devices; The third unit 301 is mainly used to control the operation of the first unit and the second unit 201 .
  • the first unit, the second unit 201 and the third unit 301 of the electronic packaging device are separately packaged in three different cavity structures, so that the heat dissipation efficiency inside the electronic packaging device can be greatly improved; 101 and the first heat dissipation element are encapsulated in a thermally conductive plastic encapsulation material, which ensures good heat dissipation efficiency of the power circuit board 101 and the first heat dissipation element, and reduces the efficiency of the power circuit board 101 being eroded by the high salt mist environment in the external environment, and the cavity
  • the body structure enables its internal electronic components to be opened for quick maintenance work when the internal electronic components fail, which greatly improves the maintenance efficiency of power electronic equipment. Further, in the high salt spray environment, the electrical clearance and creepage distance of each electronic component alone cannot guarantee the insulation strength between the electronic components. Effectively solve the problem of creepage between electronic components and avoid mutual interference between electronic components.
  • thermally conductive plastic packaging materials are used for potting to improve the heat dissipation effect and reliability. Balance the heat generation of the components at the hot spot, which will also cause the temperature of some other components to be higher than their own heat generation.
  • heat dissipation has become a major problem of power electronic equipment is mainly because some electronic devices with control functions cannot guarantee normal efficiency when the temperature is high, which will lead to the instability of the entire system, and some heating elements often Insensitive to temperature, it will still operate normally when the temperature is too high, causing damage to other components of the power electronic equipment.
  • the first unit, the second unit 201 and the third unit 301 of the power electronic device are packaged in the first cavity structure 1, the second cavity structure 2 and the third cavity structure 3 respectively. It can not only greatly reduce the problem of mutual heat conduction between different electronic components in each unit structure, but also avoid the damage or failure of temperature-sensitive components, and by separating each electronic component, it can avoid all kinds of electronic components.
  • the devices generate heat with each other in a cavity, causing the temperature in the cavity to rise sharply.
  • the total heat dissipation surface area of the power electronic device can also be greatly increased, which is more conducive to the heat dissipation of the internal electronic components.
  • the current conversion device in the second cavity structure 2 adopts all potting forms, and the cover plate 5 is used for heat transfer;
  • the unit 301 is a control device, which basically does not generate heat during operation, and the operation is relatively stable, and there is basically no multi-frequency maintenance problem. Therefore, the control device in the third cavity structure 3 is preferably in the form of integral sealing, which can effectively avoid high salt fog. environmental erosion.
  • the heat-dissipating element is encapsulated with a thermally conductive plastic sealing material, which reserves space in the first cavity while ensuring good corrosion resistance of the power circuit board 101 and the first heat-dissipating element, while the sealing form of the cover plate 5 itself will leave a certain gap , to ensure a certain air convection, greatly improve the heat dissipation speed in the first cavity, and prevent the power circuit board 101 and the first heat dissipation element from being overheated.
  • the heat-conducting plastic sealing material here is one of epoxy resin, silicone material or polyurethane, wherein silicone resin is preferably used for encapsulation.
  • silicone resin is preferably used for encapsulation.
  • epoxy resin, silicone material or polyurethane are good encapsulation materials, but the three have their own characteristics and are suitable for different environments.
  • the silicone-based plastic sealing material not only has better modification ability and electrical insulation ability than epoxy resin and polyurethane, but also has excellent thermal shock resistance. Thermal shock, does not crack and retains elasticity, and can improve the moisture resistance of electronic components. And the silicone-based plastic sealing material also has good impact resistance, outdoor UV resistance and atmospheric aging performance after curing.
  • the power electronic device packaging structure of the present invention is mainly used in a high salt fog environment such as islands and reefs, and it needs to have excellent corrosion resistance, good outdoor ultraviolet resistance and atmospheric aging performance, and be in extreme high salt fog.
  • the first cavity structure 1 in the preferred embodiment of the present invention is mainly used for placing the power circuit board 101 , and the power circuit board 101 is located on the bottom surface of one end away from the opening of the first cavity structure 1
  • a first heat dissipation element is attached to the side of the power circuit board 101 away from the open end of the first cavity structure 1 , and the first heat dissipation element includes a rectifier bridge 102 , a power diode 103 and a field effect transistor 104 .
  • the insulating plastic sealing material is used here for the power circuit board 101, the rectifier bridge 102, the power diode 103, the field effect tube 104 and the field effect tube.
  • the effect tube 104 is plastic-sealed, and while avoiding corrosion, the heat generated by the above-mentioned electronic components is transferred to the shell of the first cavity structure 1 by using the good heat transfer performance of the plastic sealing material, and the heat is transferred to the shell of the first cavity structure 1 through other heat-dissipating components. to dissipate heat.
  • the field effect transistor 104 on the power circuit board 101 can be replaced by an insulated gate bipolar transistor.
  • a second heat dissipation element is further provided on the power circuit board 101 in the first cavity structure 1, and the second heat dissipation element includes an electrolytic capacitor 105 and a dummy load 106.
  • the electrolytic capacitor 105 mainly plays the role of power supply filtering, decoupling, signal coupling, time constant setting, DC blocking, etc.
  • the setting of the dummy load 106 is mainly because there are often large-capacity DC capacitors inside the high-power equipment. In order to avoid damage to electronic components caused by the instantaneous inrush current when the electrolytic capacitor 105 is charged at the moment of electricity, a dummy load 106 is provided to avoid this situation.
  • a thermal pad is also provided on the contact end faces of the cover plate 5 and the electrolytic capacitors 105 and the dummy loads 106. 107. Since the size of the electrolytic capacitor 105 and the dummy load 106 may be different, in the actual installation process, it is difficult to ensure that after the electrolytic capacitor 105 and the dummy load 106 are loaded on the power circuit board 101, they can just abut on the cover plate 5. superior.
  • a thermal pad 107 is provided to transfer the heat on the electrolytic capacitor 105 and the dummy load 106 to the cover plate 5 .
  • the thermal conductive pad 107 has a certain impact resistance, which can prevent the electrolytic capacitor 105 and the dummy load 106 from colliding with the cover plate 5 , causing damage to the electrolytic capacitor 105 and the dummy load 106 .
  • the thermally conductive pad 107 here is preferably a thermally conductive silicone pad.
  • the thermally conductive silicone pad has good heat conduction effect and elasticity, which can effectively transfer the heat generated when the electrolytic capacitor 105 and the dummy load 106 operate to the cover plate 5 and pass through The cover plate 5 escapes to the outside.
  • the second unit 201 in the preferred embodiment of the present invention is packaged in the second cavity structure 2 , and the second unit 201 is preferably a power inductor or a transformer. Since the second unit 201 is individually packaged by the second cavity structure 2 , the size and form of the second cavity structure 2 can be selected and replaced according to the size of the second unit 201 . After the second unit 201 is encapsulated in the second cavity structure 2 , encapsulation is performed by using a thermally conductive molding material. Since only the second unit 201 is set in the second cavity structure 2, there is no situation that multiple unit devices work together, and the second unit 201 does not generate heat when it operates, so a second cavity with an appropriate size is selected.
  • a positioning frame can be provided on the outer surface of the second unit 201 for clamping, so as to prevent the second unit 201 from contacting the inner wall of the second cavity structure 2 and causing the surface of the second unit 201 to touch. Wear occurs.
  • the winding enameled wires of power inductors or transformers have additional insulating layers such as heat-shrinkable insulating materials, polyimide films, Teflon, etc. instead of just one insulating paint film, which can directly connect the power inductors or transformers.
  • a positioning skeleton can be provided to prevent the enameled wire from directly adhering to the inner wall of the cavity structure.
  • the third unit 301 for controlling the operation of electronic components in the power electronic device is packaged in the third cavity structure 3
  • the third unit 301 is a control circuit board.
  • the power consumption of the control circuit board itself is relatively low, and there is no significant heating element, the heat generation is low, the operating failure frequency is low, and there is no high-voltage part, it can be directly sealed in the third cavity.
  • the third cavity structure 3 is made of materials with better thermal insulation properties, so as to avoid the heat generated by the external first unit and the second unit 201 from affecting the operation of the third unit 301 . Therefore, preferably, the third cavity structure 3 does not use the cover plate 5 for sealing, and directly sets the third cavity structure 3 in an integral closed form, so as to reduce the possibility of the third unit 301 being corroded by high salt mist air.
  • the surface finish of the attaching surfaces of the first cavity structure 1 and the second cavity structure 2 and the heat dissipation fins 4 is higher than 10 microns, and a thermal conductive silicone grease coating is applied on their contact surfaces to improve the heat dissipation fins.
  • the heat transfer efficiency between the sheet 4 and the electronic components in the first cavity structure 1 and the second cavity structure 2 is higher than 10 microns, and a thermal conductive silicone grease coating is applied on their contact surfaces to improve the heat dissipation fins.
  • the first cavity structure 1 in the preferred embodiment of the present invention is externally connected with a cooling fan 6 , which is connected to the power circuit board 101 , and the air outlet of the cooling fan 6 faces the cooling fins 4 ,
  • the heat dissipation on the heat dissipation fins 4 can be accelerated by means of forced air cooling.
  • the first cavity structure 1, the second cavity structure 2 and the third cavity structure 3 are all provided with plugs 7, and between the cavity structures and between the cavity structures and the The external power source and the load are connected to each other through the wire harness 8 and the plug 7 .
  • the form of the plug 7 and the wire harness 8 can ensure the interconnection and operation of the various electronic components without affecting the sealing performance of each cavity.
  • the plug 7 is an aviation plug, and the protection level of the aviation plug is not lower than IP65, which can be completely dustproof and can prevent jetting Water intrusion, and the wiring harness 8 also needs to use the aerial plug wiring harness with a higher protection level.
  • the first cavity structure 1, the second cavity structure 2 and the cover plate 5 are sealed by bolts, which not only has a good sealing effect, but also has a good sealing effect.
  • the first cavity structure 1 and the second cavity structure 2 are encapsulated by the cover plate 5 instead of being completely sealed.
  • the power electronic equipment is required to fail, the maintenance personnel need to complete the equipment maintenance within 1 minute.
  • the first unit and the second unit 201 belong to the components with large heat generation, and the frequency of failure is relatively high. Only The power electronic equipment can be quickly disassembled and repaired during maintenance through the packaging form of the cover plate 5 and the organic silicon material packaging, so as to ensure the maintenance efficiency of the power electronic equipment and reduce the maintenance work time.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

La présente invention concerne le domaine de l'emballage de dispositif électronique de puissance. L'invention concerne une structure d'emballage de dispositif électronique de puissance appropriée pour un environnement de brouillard salin lourd. La structure d'emballage de dispositif électronique de puissance comprend une première unité, une deuxième unité et une troisième unité. Les composants chauffants sont en communication l'un avec l'autre au moyen de connexions électriques ; et la première unité, la deuxième unité et la troisième unité sont conditionnées séparément dans différentes structures de cavité en fonction des différentes quantités de chaleur de travail ainsi produites et les différentes températures de chauffage stables de celles-ci. Au moyen de la structure d'emballage du dispositif électronique de puissance conçue dans la présente invention et adaptée à un environnement de brouillard salin lourd, différentes unités sont emballées séparément, et en effectuant la dissipation de chaleur en utilisant des ailettes de dissipation de chaleur et en effectuant l'emballage en utilisant des plateaux de couverture, les dispositifs électroniques dans les unités ne peuvent pas s'affecter mutuellement, tandis que l'efficacité de la dissipation de chaleur des dispositifs électroniques dans les unités est assurée, et les dispositifs électroniques de puissance sont assurés d'avoir une performance de résistance à l'érosion relativement bonne dans un environnement de brouillard salin et d'avoir une efficacité de démontage rapide.
PCT/CN2021/130462 2021-04-25 2021-11-12 Structure d'emballage de dispositif électronique de puissance appropriée pour un environnement de brouillard salin lourd Ceased WO2022227498A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202110446506.5A CN112996370B (zh) 2021-04-25 2021-04-25 一种适用于高盐雾环境的功率电子设备封装结构
CN202110446506.5 2021-04-25

Publications (1)

Publication Number Publication Date
WO2022227498A1 true WO2022227498A1 (fr) 2022-11-03

Family

ID=76340106

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2021/130462 Ceased WO2022227498A1 (fr) 2021-04-25 2021-11-12 Structure d'emballage de dispositif électronique de puissance appropriée pour un environnement de brouillard salin lourd

Country Status (2)

Country Link
CN (1) CN112996370B (fr)
WO (1) WO2022227498A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113928530B (zh) * 2021-10-14 2022-10-11 盐城神海机械有限公司 一种附带防护功能的低噪音式船用冷水机组
CN115835608A (zh) * 2023-02-16 2023-03-21 深圳市中旭新能源有限公司 分布式散热规划的封装结构及光伏功率优化器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104579226A (zh) * 2014-12-30 2015-04-29 广东大普通信技术有限公司 提高晶体振荡器温度精度的方法、振荡器及其封装方法
CN106997875A (zh) * 2016-01-23 2017-08-01 重庆三峡学院 一种PoP堆叠封装结构及其制造方法
CN208016152U (zh) * 2018-02-24 2018-10-26 丰郅(上海)新能源科技有限公司 填充有导热塑封材料的电子装置
CN109361240A (zh) * 2018-12-10 2019-02-19 阳光电源股份有限公司 功率柜、光伏并网系统和集装箱
US20190320555A1 (en) * 2018-04-12 2019-10-17 Stored Energy Systems, a Limited Liability Company Enclosure and cooling system for electronic equipment

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4545029B2 (ja) * 2005-03-30 2010-09-15 京セラ株式会社 電子部品収納用パッケージ
CN100589245C (zh) * 2006-07-20 2010-02-10 日月光封装测试(上海)有限公司 一种多芯片封装结构的封装方法
KR101204746B1 (ko) * 2010-10-20 2012-11-26 하나 마이크론(주) 발광 다이오드 패키지 제조방법
CN102368484A (zh) * 2011-10-11 2012-03-07 常熟市广大电器有限公司 一种多芯片集成电路封装结构
CN102364683A (zh) * 2011-10-21 2012-02-29 华为终端有限公司 封装结构、方法、及电子设备
CN103413790B (zh) * 2013-08-16 2016-03-02 中国科学院深圳先进技术研究院 一种集成功率控制单元的封装结构
CN203827682U (zh) * 2014-04-24 2014-09-10 中兴通讯股份有限公司 一种移动通信终端
CN104064551B (zh) * 2014-06-05 2018-01-16 华为技术有限公司 一种芯片堆叠封装结构和电子设备
CN204271924U (zh) * 2014-12-26 2015-04-15 安徽华祝电气技术有限公司 基于模块式的功率单元阀体结构
US10284106B1 (en) * 2015-06-05 2019-05-07 Vlt, Inc. Power adapter
CN107180801A (zh) * 2016-03-11 2017-09-19 联芯科技有限公司 堆叠装配封装结构及芯片、芯片级封装芯片、电子设备
CN206743565U (zh) * 2017-05-27 2017-12-12 南京泛和电力自动化有限公司 无线基站
CN109427759A (zh) * 2017-08-29 2019-03-05 华为技术有限公司 一种芯片封装结构及其制作方法、电子设备
CN209882448U (zh) * 2019-03-18 2019-12-31 石家庄德堃电子科技有限公司 一种简便紧凑电力调整器
CN212573229U (zh) * 2020-07-28 2021-02-19 天津通盛科技有限公司 一种电力电子元件封装装置

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104579226A (zh) * 2014-12-30 2015-04-29 广东大普通信技术有限公司 提高晶体振荡器温度精度的方法、振荡器及其封装方法
CN106997875A (zh) * 2016-01-23 2017-08-01 重庆三峡学院 一种PoP堆叠封装结构及其制造方法
CN208016152U (zh) * 2018-02-24 2018-10-26 丰郅(上海)新能源科技有限公司 填充有导热塑封材料的电子装置
US20190320555A1 (en) * 2018-04-12 2019-10-17 Stored Energy Systems, a Limited Liability Company Enclosure and cooling system for electronic equipment
CN109361240A (zh) * 2018-12-10 2019-02-19 阳光电源股份有限公司 功率柜、光伏并网系统和集装箱

Also Published As

Publication number Publication date
CN112996370A (zh) 2021-06-18
CN112996370B (zh) 2021-08-06

Similar Documents

Publication Publication Date Title
TWI657547B (zh) 功率模組及其製造方法
WO2022227498A1 (fr) Structure d'emballage de dispositif électronique de puissance appropriée pour un environnement de brouillard salin lourd
EP4280241A1 (fr) Module intégré de condensateur électrolytique en aluminium
EP4322212A1 (fr) Module de puissance, onduleur et véhicule
JP2017212774A (ja) 電力変換器
CN209063913U (zh) 一种用于直流充电桩的直流充电模块的结构
CN108122871A (zh) 一种h桥臂双面散热功率模块
CN220066600U (zh) 高压配电盒及新能源汽车高压系统
CN213780903U (zh) 一种集成电源模块的芯片及板卡
CN221687359U (zh) 一种叠层片式陶瓷电感器
CN104659878A (zh) 一种电动汽车充电器
CN203827030U (zh) 散热器及充电机
CN221352750U (zh) 功率模块及车辆
CN207743846U (zh) 变频器
CN103440984B (zh) 一种新型组合式独立单元冷却电容器装置
CN210956347U (zh) 电抗器装置
CN201194373Y (zh) 变频发电机逆变电源模块
CN209199924U (zh) 高压功率模块封装结构
CN111082641A (zh) 电源箱及无人机电源的装配方法
CN221551873U (zh) 一种功率模块结构及电子设备
CN221763816U (zh) 一种高防护ptc液体加热器
CN222637069U (zh) 一种散热片式有机薄膜电容器
CN207284033U (zh) 一种高效散热的高频开关电源
CN108122866B (zh) 一种集成化功率模块
CN115884554A (zh) 一种适用于等离子体高压高频电源的防爆装置和方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 21938958

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 21938958

Country of ref document: EP

Kind code of ref document: A1

32PN Ep: public notification in the ep bulletin as address of the adressee cannot be established

Free format text: NOTING OF LOSS OF RIGHTS PURSUANT TO RULE 112(1) EPC (EPO FORM 1205 DATED 16.08.2024)

122 Ep: pct application non-entry in european phase

Ref document number: 21938958

Country of ref document: EP

Kind code of ref document: A1