WO2023001071A1 - 具有半导体冷却装置的连接器及汽车 - Google Patents

具有半导体冷却装置的连接器及汽车 Download PDF

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Publication number
WO2023001071A1
WO2023001071A1 PCT/CN2022/105980 CN2022105980W WO2023001071A1 WO 2023001071 A1 WO2023001071 A1 WO 2023001071A1 CN 2022105980 W CN2022105980 W CN 2022105980W WO 2023001071 A1 WO2023001071 A1 WO 2023001071A1
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WO
WIPO (PCT)
Prior art keywords
terminal
connector
cooling
connector according
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/105980
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English (en)
French (fr)
Inventor
王超
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changchun Jetty Automotive Parts Co Ltd
Original Assignee
Changchun Jetty Automotive Parts Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changchun Jetty Automotive Parts Co Ltd filed Critical Changchun Jetty Automotive Parts Co Ltd
Priority to US18/290,723 priority Critical patent/US20250096490A1/en
Priority to BR112024001183A priority patent/BR112024001183A2/pt
Priority to JP2024502529A priority patent/JP7705545B2/ja
Priority to EP22845236.3A priority patent/EP4376564A4/en
Priority to MX2024001041A priority patent/MX2024001041A/es
Publication of WO2023001071A1 publication Critical patent/WO2023001071A1/zh
Anticipated expiration legal-status Critical
Priority to ZA2024/01318A priority patent/ZA202401318B/en
Ceased legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/30—Constructional details of charging stations
    • B60L53/302—Cooling of charging equipment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/11—End pieces or tapping pieces for wires, supported by the wire and for facilitating electrical connection to some other wire, terminal or conductive member
    • H01R11/12—End pieces terminating in an eye, hook, or fork
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/10—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles characterised by the energy transfer between the charging station and the vehicle
    • B60L53/11—DC charging controlled by the charging station, e.g. mode 4
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/10—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles characterised by the energy transfer between the charging station and the vehicle
    • B60L53/14—Conductive energy transfer
    • B60L53/16—Connectors, e.g. plugs or sockets, specially adapted for charging electric vehicles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B60—VEHICLES IN GENERAL
    • B60L—PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES; SUPPLYING ELECTRIC POWER FOR AUXILIARY EQUIPMENT OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRODYNAMIC BRAKE SYSTEMS FOR VEHICLES IN GENERAL; MAGNETIC SUSPENSION OR LEVITATION FOR VEHICLES; MONITORING OPERATING VARIABLES OF ELECTRICALLY-PROPELLED VEHICLES; ELECTRIC SAFETY DEVICES FOR ELECTRICALLY-PROPELLED VEHICLES
    • B60L53/00—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles
    • B60L53/10—Methods of charging batteries, specially adapted for electric vehicles; Charging stations or on-board charging equipment therefor; Exchange of energy storage elements in electric vehicles characterised by the energy transfer between the charging station and the vehicle
    • B60L53/14—Conductive energy transfer
    • B60L53/18—Cables specially adapted for charging electric vehicles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/28—Arrangements for cooling comprising Peltier coolers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/025—Contact members formed by the conductors of a cable end
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6675—Structural association with built-in electrical component with built-in electronic circuit with built-in power supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/66—Structural association with built-in electrical component
    • H01R13/665—Structural association with built-in electrical component with built-in electronic circuit
    • H01R13/6683—Structural association with built-in electrical component with built-in electronic circuit with built-in sensor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R2201/00—Connectors or connections adapted for particular applications
    • H01R2201/26—Connectors or connections adapted for particular applications for vehicles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/70—Energy storage systems for electromobility, e.g. batteries
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00—Road transport of goods or passengers
    • Y02T10/60—Other road transportation technologies with climate change mitigation effect
    • Y02T10/7072—Electromobility specific charging systems or methods for batteries, ultracapacitors, supercapacitors or double-layer capacitors
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T90/00—Enabling technologies or technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02T90/10—Technologies relating to charging of electric vehicles
    • Y02T90/14—Plug-in electric vehicles

Definitions

  • the invention relates to the technical field of electrical devices, in particular to a connector with a semiconductor cooling device and an automobile.
  • the starting current when the car starts is relatively large, which can reach 150A to 250A, and has relatively high requirements for the carrying capacity of wires and connectors; the working and charging current of electric vehicles is also relatively large, and has relatively high requirements for the carrying capacity of wires and connectors.
  • the wire has a set rated current, and the calorific value is relatively stable. Using a wire whose rated current meets the requirements can realize the transmission of current.
  • connection point between the wire and the terminal due to the high contact resistance at the connection point between the wire and the terminal, there is a large voltage drop between the terminal and the wire. Therefore, at the connection point between the wire and the terminal, the heat is generally large, causing the connection point to burn out. , may lead to major safety accidents.
  • the purpose of the present invention is to provide a connector and an automobile with a semiconductor cooling device, so as to alleviate the technical problems that the connection point of the wire and the terminal generates a lot of heat and the connection point is often blown.
  • the invention provides a connector with a semiconductor cooling device.
  • the connector includes: a wire, a terminal and a semiconductor cooling device. Connection; the semiconductor cooling device has a cooling part and a heat dissipation part, and the cooling part absorbs the heat of the terminal.
  • the present invention provides an automobile, comprising: the above-mentioned connector with a semiconductor cooling device.
  • the external electrical structure is connected to the connector with the semiconductor cooling device through the terminal, and is electrically connected to the wire to realize the transmission of electric energy. There is usually a large contact resistance between the external electrical structure and the terminal, and the connection process will continue to generate heat.
  • the semiconductor cooling device is electrically connected to the wire, and electric energy can be obtained from the wire.
  • the semiconductor cooling device starts to operate, and the heat is transferred from the cooling part to the cooling part.
  • the heat of the cooling part is lost to the outside, and the temperature of the cooling part gradually decreases. Therefore, , the refrigeration unit will absorb the heat of the terminals, so that the terminals and the external electrical structure maintain a safe and stable temperature, realize stable temperature control, and reduce safety accidents such as connection point burnout.
  • Using this connector can solve the problem of high temperature at the connection point when the charging current of electric vehicles is large, and helps to realize fast charging of large currents in the charging harness of electric vehicles.
  • a semiconductor cooling device is used to cool the terminals, no refrigerant is used, and no moving mechanism is included, which can avoid causing additional vibration and noise, is safe and stable, and has a long service life.
  • the current shunt in the wire can be used to provide electric energy for the semiconductor cooling device, no additional power supply device is required, no need to install and replace the battery box, it is convenient and durable, it is convenient to realize continuous work, and reduce maintenance man-hours.
  • FIG. 1 is a schematic structural view of an embodiment of a connector with a semiconductor cooling device provided by the present invention
  • Fig. 2 is a structural schematic diagram of another embodiment of a connector with a semiconductor cooling device provided by the present invention.
  • Fig. 3 and Fig. 4 are the sectional views of the connector with semiconductor cooling device provided by the present invention.
  • FIGS. 5-8 are structural schematic diagrams of yet another embodiment of a connector with a semiconductor cooling device provided by the present invention.
  • 9-17 are schematic diagrams of terminals and wires in a connector with a semiconductor cooling device provided by the present invention.
  • 18-20 are structural schematic diagrams of yet another embodiment of a connector with a semiconductor cooling device provided by the present invention.
  • Fig. 21 is a structural diagram of the semiconductor cooling device in the connector provided by the present invention.
  • the present invention provides a connector with a semiconductor cooling device, as shown in Figure 1, the connector includes: a wire 22, a terminal 23 and a semiconductor cooling device 30, the wire 22 is connected to the terminal 23, and the terminal 23 is configured for It is connected to the external electrical structure; the semiconductor cooling device 30 has a cooling part 31 and a heat dissipation part 32 , and the cooling part 31 absorbs the heat of the terminal 23 ; and the semiconductor cooling device 30 is electrically connected to the wire 22 .
  • the semiconductor cooling device 30 is a tool for heat transfer.
  • a current flows through a thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends, and the heat will be transferred from one end to the other end, thereby generating a temperature difference to form cold and heat. end.
  • the semiconductor cooling device 30 described herein also includes a hot end, which is arranged opposite to the cooling end.
  • the semiconductor cooling device 30 can be a semiconductor cooling device in the prior art, and can also be customized according to the size of the conductor.
  • the external electrical structure is connected to the connector through the terminal 23, and is electrically connected to the wire 22 to realize the transmission of electric energy. There is generally a large contact resistance between the external electrical structure and the terminal 23, and the connection process will continue to generate heat.
  • the semiconductor cooling device 30 is electrically connected to the wire 22, and electric energy can be obtained from the wire 22.
  • the semiconductor cooling device 30 starts to operate, and the heat is transferred from the cooling part 31 to the heat dissipation part 32, and the heat of the heat dissipation part 32 is dissipated to the outside, and the cooling The temperature of the part 31 decreases gradually.
  • the cooling part 31 will absorb the heat of the terminal 23, so that the terminal 23 and the external electrical structure maintain a safe and stable temperature, realize stable temperature control, and reduce safety accidents such as connection point burnout.
  • Using this connector can solve the problem of high temperature at the connection point when the charging current of electric vehicles is large, and helps to realize fast charging of large currents in the charging harness of electric vehicles.
  • the semiconductor cooling device 30 is used to cool down the temperature of the terminal 23, no refrigerant is used, and no moving mechanism is included, which can avoid extra vibration and noise, and is safe, stable and has a long service life.
  • the current shunt in the wire 22 can be used to provide electric energy for the semiconductor cooling device 30, no additional power supply device is required, no need to install and replace the battery box, it is convenient and durable, it is convenient to realize continuous work, and reduce maintenance man-hours .
  • the connector further includes a protective structure device 10 , as shown in FIG. 2 , the terminal 23 is disposed in the protective structure device 10 .
  • the terminal 23 needs to be insulated and protected.
  • the protective structure device 10 is arranged on the periphery of the terminal 23 to realize the insulation of the terminal 23 from the external environment; , the terminals 23 need to be connected one by one, the operation is complicated and time-consuming, and multiple terminals 23 are placed in the protective structure device 10 at intervals, and the internal terminals 23 are realized through the mating of the protective structure device 10 and the external electrical structure.
  • One-to-one insertion, the operation is simple, and it is not easy to insert wrong terminals, which can ensure the correctness and safety of the circuit.
  • Protective structure device 10 may be a sheath.
  • the connector includes a rectifying device 51, one end of the rectifying device 51 is electrically connected to the semiconductor cooling device 30 through a connecting wire 54, and the other end of the rectifying device 51 is electrically connected to the wire 22 through a connecting wire 54; the rectifying device 51
  • the electrical connection with the wire 22 can be realized by electrically connecting the connection part 21 with the connection wire 54 .
  • the current of the wire 22 is shunted to supply power to the semiconductor cooling device 30 , and the current and voltage are adjusted to match the working current and voltage of the semiconductor cooling device 30 through the rectifier 51 to ensure the semiconductor cooling device 30 works stably.
  • control unit 50 of the connector includes a control device 52 connected to the rectification device 51 , and the control device 52 is used to regulate the current flowing to the semiconductor cooling device 30 through the rectification device 51 .
  • the control device 52 adjusts the current of the semiconductor cooling device 30 , thereby adjusting the temperature of the cooling part 31 of the semiconductor cooling device 30 , and adjusting the temperature of the connection part 21 .
  • one end of the rectifying device 51 is electrically connected to the wire 22
  • the other end of the rectifying device 51 is electrically connected to the control device 52 and the semiconductor cooling device 30 , so as to provide power for the control device 52 and the semiconductor cooling device 30 .
  • the connector includes a temperature sensor 53 connected to the control device 52 , the temperature sensor 53 is in contact with the terminal 23 , and/or the temperature sensor 53 is in contact with the refrigeration unit 31 .
  • the temperature of the connector is detected by the temperature sensor 53, and the temperature signal is transmitted to the control device 52, and the control device 52 controls the rectifier 51 to adjust the power supply current of the semiconductor cooling device 30 according to the detected temperature, thereby adjusting the temperature of the semiconductor cooling device 30.
  • the temperature of the refrigerating part 31 can be controlled to ensure a stable working temperature of the connecting part 21 .
  • the control device 52 controls the rectification device 51 to increase the power supply current to speed up the cooling efficiency of the semiconductor cooling device 30; A small supply current slows down the heat dissipation efficiency of the semiconductor cooling device 30 .
  • the temperature sensor 53, the control device 52 cooperate with the rectifying device 51 to adjust the current of the semiconductor cooling device 30, so as to realize the constant temperature of the connector and avoid the temperature change of the connector due to the change of the current of the wire 22.
  • the temperature sensor 53 is connected in contact with the connection part 21 , and the temperature sensor 53 is used to detect the temperature of the connection part 21 .
  • the control device 52 can adopt a mechanical control device, the mechanical control device includes at least two alloy sheets with different temperature expansion coefficients, the alloy sheets will bend and deform after the temperature changes, and push the contacts to close and disconnect, so as to realize the mechanical Power on and off of the control unit.
  • the control device 52 can be an electronic control device, which controls the power on and off of the semiconductor cooling device 30 by receiving the electrical signal from the temperature sensor 53 and analyzing it through the chip.
  • the rectifier 51 integrates the unstable large current in the wire 22 into a stable small current that can be used by the control device 52 and the temperature sensor 53 through a combination of resistors, diodes and other electronic components, so as to realize continuous and stable power supply.
  • the temperature sensor 53 can be a contact temperature sensor, specifically a bimetallic thermometer, a pressure thermometer, a resistance thermometer, a thermistor or a thermocouple. The signal is transmitted to the control device 52.
  • the semiconductor cooling device 30 includes multiple semiconductor cooling devices 30. In order to accurately control the temperature of each semiconductor cooling device 30, multiple semiconductor cooling devices 30 are electrically connected to the rectifier 51 in parallel, so that each semiconductor cooling device 30 can be individually controlled. The supply current of the cooling device 30 .
  • the multiple semiconductor cooling devices 30 are electrically connected to the rectifier 51 in series, so that the power supply current of each semiconductor cooling device 30 is consistent.
  • the semiconductor cooling device 30 is embedded in the side wall of the protective structure device 10, and the cooling part 31 is located inside the side wall of the protective structure device 10, and at least part of the surface of the heat dissipation part 32 is exposed outside the protective structure device 10 to facilitate
  • the cooling part 31 of the semiconductor cooling device 30 absorbs heat from the terminals 23 and dissipates heat through the heat dissipation part 32 .
  • the heat of the terminal 23 is transferred to the refrigeration unit 31 through radiation.
  • the refrigeration unit 31 is connected to the terminal 23 to absorb heat from the terminal.
  • the cooling part 31 is in contact with the terminal 23, which is conducive to the rapid transfer of heat on the terminal 23 to the cooling part 31, so that the heat can be dissipated in time, and the heat generated by the terminal 23 can be fully taken away. Lower the temperature to achieve the purpose of rapid cooling.
  • the refrigeration unit 31 is provided with a receiving groove 311, and the terminal 23 is at least partially embedded in the receiving groove 311, and the shape of the receiving groove 311 is adapted to the shape of the outer contour of the terminal 23, and the terminal 23 and the The inner walls of the accommodating groove 311 are in contact, so that the cooling part 31 and the terminal 23 are kept in close contact, which increases the contact area, and facilitates the transfer of heat from the terminal 23 to the cooling part 31 .
  • the accommodating groove 311 is in a semi-cylindrical shape.
  • the connector includes a heat conduction part 41, the heat conduction part 41 is in contact with the terminal 23, the cooling part 31 is in contact with the heat conduction part 41, and the heat on the connection part 21 is transferred through the heat conduction part 41 To the refrigeration unit 31.
  • the heat conduction part 41 it is beneficial to keep the terminal 23, the heat conduction part 41 and the cooling part 31 in close contact, so that the heat generated by the terminal 23 is quickly transferred to the cooling part 31, the temperature is lowered, the heat dissipation performance is improved, and the purpose of rapid cooling is achieved, ensuring that the terminal The temperature of 23 is constant.
  • the heat conduction part 41 can be made of thermally conductive and non-conductive material; the heat conduction part 41 can be formed by filling a heat conduction and non-conductive material between the terminal 23 and the cooling part 31 .
  • the material of the heat conduction part 41 can be one or a combination of heat conduction silicone grease, heat conduction mica sheet, heat conduction ceramic sheet and heat conduction silicone film.
  • the heat conduction part 41 surrounds the terminal 23 , and the cooling part 31 contacts the terminal 23 through the heat conduction part 41 , and the heat conduction part 41 can be set in a cylindrical shape to facilitate the absorption of heat generated at different positions of the terminal 23 .
  • the connector includes a plurality of terminals 23, and a plurality of heat conduction parts 41 can be provided respectively.
  • the heat conduction parts 41 and the terminals 23 are sleeved outside the terminals 23 in one-to-one correspondence, and the plurality of heat conduction parts 41 are all connected to a semiconductor cooling
  • the cooling part 31 of the device 30 is connected in contact; it may also be that a heat conducting part 41 surrounds multiple terminals 23 , and the heat of the multiple terminals 23 is transferred to the cooling part 31 through the heat conducting part 41 .
  • the connector includes at least two semiconductor cooling devices 30, at least two semiconductor cooling devices 30 are distributed on both sides of the terminal 23, and the two semiconductor cooling devices 30 absorb heat from both sides of the terminal 23 , improving the cooling efficiency. As shown in FIGS. 5 and 7 , two semiconductor cooling devices 30 may be distributed on opposite sides of the terminal 23 .
  • the connector includes a plurality of terminals 23 , and the connecting portions 21 of each terminal 23 are respectively connected with wires 22 .
  • the connector includes multiple semiconductor cooling devices 30, and the multiple semiconductor cooling devices 30 include a first cooling device 301 and a second cooling device 302, and the first cooling device 301, the plurality of connecting parts 21 and the second cooling device 302 are distributed sequentially.
  • a plurality of terminals 23 are distributed sequentially along the left and right directions, the first cooling device 301 is arranged at the left end, and the second cooling device 302 is arranged at the right end; further, the upper and lower sides of the terminals 23 are respectively provided with semiconductor cooling device 30.
  • the cooling unit 31 is provided with a receiving hole 312 , and the terminals 23 pass through the receiving hole 312 .
  • the terminal 23 is accommodated through the accommodating hole 312, so that the contact connection between the cooling unit 31 and the terminal 23 is realized, the spatial arrangement of the terminal 23 and the wire 22 is improved, the contact area is increased, and the heat transfer from the terminal 23 to the cooling unit 31 is facilitated.
  • the connector includes a plurality of terminals 23 and wires 22 , it is convenient to arrange in a small space and ensure the heat dissipation of each terminal 23 .
  • the semiconductor cooling device 30 includes a plurality of heat dissipation parts 32, and the plurality of heat dissipation parts 32 are distributed around the cooling part 31, which is conducive to the outward dissipation of heat.
  • the cooling part 31 is provided with a plurality of accommodating holes 312;
  • the connector includes a plurality of terminals 23 , and the terminals 23 pass through the accommodating holes 312 one by one.
  • the cooling part 31 is in a square shape as a whole, and the heat dissipation parts 32 are distributed on four sides of the cooling part 31 .
  • the refrigerating unit 31 is provided with a plurality of accommodating holes 312; the connector includes a plurality of terminals 23, and the terminals 23 are inserted in the accommodating holes 312 in one-to-one correspondence, as shown in FIG.
  • the cooling part 32 is sleeved outside the cooling part 31, which is beneficial to the full contact between the cooling part 31 and the terminal 23, and promotes the heat on the terminal 23 to be transferred to the cooling part 32 through the cooling part 31 with high efficiency, improving This improves the compactness of the structure and facilitates the arrangement of multiple terminals 23 and semiconductor cooling devices 30 .
  • both the refrigeration unit 31 and the heat dissipation unit 32 are cylindrical, as shown in FIG. Both the cylindrical cooling part 31 and the heat dissipation part 32 are easy to process, and have a large contact area, which makes it easier to transfer the heat of the terminal 23 to the heat dissipation part. Further, both the refrigeration part 31 and the heat dissipation part 32 are cylindrical.
  • the terminal 23 is provided with a terminal portion 231 and a connecting portion 21, the terminal portion 231 is configured to be connected to an external electrical structure, and the connecting portion 21 is used to be connected to the wire 22.
  • the shape of the connection part 21 is not limited to one, for example: as shown in Figure 9, the initial shape of the connection part 21 is U-shaped, which has a U-shaped groove, and the wire 22 is arranged in the U-shaped groove, as shown in Figure 10, The side wall of the U-shaped groove is bent inward, which can realize the compression of the wire 22, thereby connecting the terminal 23 and the wire 22 together; as shown in Figures 11-14, the connecting part 21 can be a cylinder, and the wire 22 In the hole of the barrel; as shown in Figures 15-17, the connecting part 21 can be in the shape of a plate, and the wire 22 is arranged on one side of the connecting part 21.
  • connection between the wire 22 and the connection part 21 can be achieved by welding or crimping.
  • the terminal part 231 and the connecting part 21 can be of an integral structure, or can be of a separate structure, and the two can be fixed together by welding.
  • the position where the terminal 23 is connected to the cooling part 31 is the connecting part 21 , which is beneficial for the cooling part 31 to absorb the heat of the terminal 23 .
  • the contact area between the cooling part 31 and the connecting part 21 accounts for at least 3% of the surface area of the connecting part 21 to ensure the efficiency of heat absorption.
  • the inventor selected 11 groups of wires 22 with the same cross-sectional area, the same material, and the same length, and the same
  • the terminal 23 of the terminal 23 is connected with the same current, and the ratio of the contact area between the cooling part 31 and the connecting part 21 to the surface area of the connecting part 21 is used, and the corresponding temperature rise value is read and recorded in Table 1.
  • the experimental method is to conduct the same current in connectors with different ratios of the contact area between the cooling part 31 and the connecting part 21 to the surface area of the connecting part 21 in a closed environment, and record the temperature before power-on and when the temperature is stable after power-on. temperature, and make a difference to take the absolute value.
  • a temperature rise of less than 50K is a qualified value.
  • Table 1 The influence of the contact area between the cooling part 31 and the connecting part 21 and the proportion of the surface area of the connecting part 21 on the temperature rise of the connector
  • the wire 22 includes an inner conductor 221 and an insulating layer 222 covering the conductor 221 , and a terminal of the conductor 221 is connected to the terminal 23 .
  • the semiconductor cooling device 30 is fixed to the protective structure device 10 , the cooling part 31 faces inward, and the heat dissipation part 32 faces outward, and the surface of the cooling part 31 is arranged on the surface of the protective structure device 10 or outside the protective structure device 10 .
  • the external electrical structure may be a harness cable or a terminal adapted to the terminal 23 .
  • the semiconductor cooling device 30 includes: an alumina substrate 1011 , a waterproof protection layer 1012 , a semiconductor P/N layer 1013 , and a power interface 1014 .
  • An alumina substrate 1011, a waterproof protection layer 1012, and a semiconductor P/N layer 1013 are arranged in sequence.
  • the power interface 1014 is electrically connected to the semiconductor P/N layer 1013 .
  • the alumina substrate 1011 constitutes the hot end of the semiconductor cooling device 30 , that is, the heat dissipation portion 32 .
  • the semiconductor P/N layer 1013 constitutes the cooling end of the semiconductor cooling device 30 , that is, the cooling part 31 .
  • the aluminum oxide substrate 1011 is used as the surface of the semiconductor cooling device 30, which can improve the thermal conductivity, make the heat transfer speed faster, the cooling time shorter, the bearable strength is high, and it can be connected flexibly, which can be better pasted. On the conductor, it can effectively absorb the surface stress at the bend of the conductor, and it is not easy to break during installation and use.
  • the core of the semiconductor cooling device 30 adopts a P-N junction made of special semiconductor materials. When a current flows through the thermocouple pair formed by connecting an N-type semiconductor material and a P-type semiconductor material, heat transfer will occur between the two ends. It will be transferred from one end to the other end, thereby generating a temperature difference to form a hot and cold end, that is, cooling control can be realized by controlling the DC current.
  • the cooling rate of the semiconductor cooling device 30 is 0.05K/s-5K/s.
  • the inventor selected 10 wires 22 with the same cross-sectional area, the same material, and the same length, and the same terminals 23, and passed the same current.
  • the semiconductor cooling devices 30 with different cooling rates cool the connectors, and read the corresponding temperature rise values, which are recorded in Table 2.
  • Table 2 The effect of semiconductor cooling device 30 with different cooling rates on the temperature rise of the connector
  • the experimental method is to conduct the same current on the connectors with different cooling rates of the semiconductor cooling device 30 in a closed environment, record the temperature before power-on and the temperature when the temperature is stable after power-on, and make a difference to obtain the absolute value.
  • a temperature rise of less than 50K is a qualified value.
  • the connector includes a heat sink 42 connected to the heat sink 32 to improve the heat dissipation effect and facilitate the heat dissipation of the heat sink 32 of the semiconductor cooling device 30 to ensure rapid cooling.
  • the cooling device 42 can be a fan or a heat exchanger or a liquid cooling device; as shown in FIG. 3 and FIG. 4 , the cooling device 42 can also be a cooling fin 421, and the cooling fin 421 is preferably made of metal.
  • the connector has the following advantages: (1) the cooling time is short, and when the temperature of the connecting portion 21 rises, the temperature of the connecting portion 21 can be lowered in a short period of time; (2) the temperature of the connector can be controlled relatively stably, Prevent the connection point from being blown due to overload and reduce safety accidents; (3) By reducing the temperature of the connection point, it is not necessary to design the cable to increase the wire diameter, and the wire at the rated heating curve can be used when designing the cable diameter, it is not necessary to consider increasing the wire diameter of the cable in order to reduce the resistance of the connecting part in the design, thereby reducing the wire diameter of the cable and reducing the cost of the cable; (4) By using this connector, the electric vehicle can be solved.
  • the temperature of the connection point is too high, which helps to realize the fast charging of the electric vehicle charging harness with a large current; (5) the heat dissipation part 32 of the semiconductor cooling device 30 can be connected to other parts that need to be heated, and the utilization rate of energy is improved. .
  • the present invention provides an automobile, including the above-mentioned connector with a semiconductor cooling device.
  • the connector in the automobile has the above-mentioned structure, function and beneficial effect, which will not be repeated here.

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  • Details Of Connecting Devices For Male And Female Coupling (AREA)
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Abstract

本发明提供了一种具有半导体冷却装置的连接器及汽车，该连接器包括：导线（22）、端子（23）和半导体冷却装置（30），端子（23）被构造成其一端与导线（22）连接，其另一端用于与外部电结构连接；半导体冷却装置（30）具有制冷部（31）和散热部（32），制冷部（31）吸收端子的热量。通过本发明，缓解了导线和端子的连接点发热量较大，连接点烧断的情况较多的技术问题。

Description

具有半导体冷却装置的连接器及汽车
相关申请
本申请要求专利申请号为CN202110821575.X、申请日为2021年07月20日、发明名称为“具有半导体冷却装置的连接器及汽车”的中国发明专利的优先权。
技术领域
本发明涉及电器件技术领域，尤其是一种具有半导体冷却装置的连接器及汽车。
背景技术
汽车启动时的启动电流比较大，可达到150A到250A，对导线和接头的载流量有比较高的要求；电动汽车的工作和充电电流也比较大，对导线和接头的载流量也有比较高的要求。通常情况下，导线具有设定的额定电流，发热量比较稳定，使用额定电流满足要求的导线，可以实现对电流的输送。
但是，导线和端子的连接点，由于接触电阻较高，端子与导线之间存在较大电压降，因此在导线和端子连接点处，一般发热量较大，造成连接点烧断的情况较多，可能导致重大的安全事故。
因此，电器件技术领域急需一种能够缓解导线和端子的连接点发热量较大，连接点烧断的情况较多的技术问题的连接器。
发明内容
本发明的目的是提供一种具有半导体冷却装置的连接器及汽车，以缓解导线和端子的连接点发热量较大，连接点烧断的情况较多的技术问题。
本发明的上述目的可采用下列技术方案来实现：
本发明提供一种具有半导体冷却装置的连接器，所述连接器包括：导线、端子和半导体冷却装置，所述端子被构造成其一端与所述导线连接，其另一端用于与外部电结构连接；所述半导体冷却装置具有制冷部和散热部，所述制冷部吸收所述端子的热量。
本发明提供一种汽车，包括：上述的具有半导体冷却装置的连接器。
本发明的特点及优点是：
外部电结构通过端子，来与该具有半导体冷却装置的连接器连接，并与导线实现电连接，实现电能的输送。外部电结构与端子之间通常存在较大的接触电阻，连接过程会持续发热。该连接器中，半导体冷却装置与导线电连接，可以从导线获取电能，半导体冷却装置开始运行，热量从制冷部向散热部传递，散热部的热量向外部散失，制冷部的温度逐渐降低，因此，制冷部会吸收端子的热量，使端子以及外部电结构保持安全稳定的温度，实现稳定控温，减少连接点烧断等安全事故。使用该连接器，能够解决电动汽车充电电流较大时连接点温度过高的问题，有助于实现电动汽车充电线束大电流快速充电。
该连接器中，采用半导体冷却装置来对端子降温，未使用制冷剂，也未包含运动机构，可以避免造成额外的振动和噪声，安全稳定，使用寿命长。该连接器中，可以使用导线中的电流分流，来为半导体冷却装置提供电能，不需要额外的供电装置，不需要设置和更换蓄电盒，方便耐久，便于实现持续工作，减少维修工时。
附图说明
以下附图仅旨在于对本发明做示意性说明和解释，并不限定本发明的范围。其中：
图1为本发明提供的具有半导体冷却装置的连接器一实施方式的结构示意图；
图2为本发明提供的具有半导体冷却装置的连接器又一实施方式的结构示意图；
图3和图4为本发明提供的具有半导体冷却装置的连接器的剖视图；
图5-图8为本发明提供的具有半导体冷却装置的连接器又一实施方式的结构示意图；
图9-图17为本发明提供的具有半导体冷却装置的连接器中端子与导线的示意图；
图18-图20为本发明提供的具有半导体冷却装置的连接器又一实施方式的结构示意图；
图21为本发明提供的具有半导体冷却装置的连接器中的半导体冷却装置的结构图。
具体实施方式
为了对本发明的技术特征、目的和效果有更加清楚的理解，现对照附图说明本发明的具体实施方式。在本发明的描述中，除非另有说明，“多个”的含义是两个或两个以上。
实施例一
本发明提供了一种具有半导体冷却装置的连接器，如图1所示，该连接器包括：导 线22、端子23和半导体冷却装置30，导线22与端子23连接，端子23被构造成用于与外部电结构连接；半导体冷却装置30具有制冷部31和散热部32，制冷部31吸收端子23的热量；并且，半导体冷却装置30与导线22电连接。
详细的说，在原理上，半导体冷却装置30是一个热传递的工具。当一块N型半导体材料和一块P型半导体材料联结成的热电偶对中有电流通过时，两端之间就会产生热量转移，热量就会从一端转移到另一端，从而产生温差形成冷热端。本文所述的半导体冷却装置30除了包括冷却端外，还包括热端，与冷却端相对设置，半导体冷却装置30可采用现有技术已有的半导体冷却装置，还可根据导体的尺寸进行定制。
外部电结构通过端子23，来与该连接器连接，并与导线22实现电连接，实现电能的输送。外部电结构与端子23之间通常存在较大的接触电阻，连接过程会持续发热。该连接器中，半导体冷却装置30与导线22电连接，可以从导线22获取电能，半导体冷却装置30开始运行，热量从制冷部31向散热部32传递，散热部32的热量向外部散失，制冷部31的温度逐渐降低，因此，制冷部31会吸收端子23的热量，使端子23以及外部电结构保持安全稳定的温度，实现稳定控温，减少连接点烧断等安全事故。使用该连接器，能够解决电动汽车充电电流较大时连接点温度过高的问题，有助于实现电动汽车充电线束大电流快速充电。
该连接器中，采用半导体冷却装置30来对端子23降温，未使用制冷剂，也未包含运动机构，可以避免造成额外的振动和噪声，安全稳定，使用寿命长。该连接器中，可以使用导线22中的电流分流，来为半导体冷却装置30提供电能，不需要额外的供电装置，不需要设置和更换蓄电盒，方便耐久，便于实现持续工作，减少维修工时。
在一实施方式中，该连接器还包括保护结构装置10，如图2所示，端子23设置于保护结构装置10内。在某些大电流的环境中，端子23需要进行绝缘保护，保护结构装置10设置在端子23外围，实现端子23对外界环境的绝缘；另外，当端子23数量较多时，与外部电结构连接时，需要将端子23一一对插连接，操作复杂而且浪费时间，将多个端子23间隔放置在保护结构装置10中，通过保护结构装置10与外部电结构的对插，实现内部的端子23的一一对插，操作简单，并且不容易出现插错端子的情况，能够保证电路的正确性和安全性。保护结构装置10可以为护套。
在一实施方式中，该连接器包括整流装置51，整流装置51的一端通过连接线54与半导体冷却装置30电连接，整流装置51的另一端通过连接线54与导线22电连接；整流装置51可以通过连接线54与连接部21电连接，来实现与导线22电连接。导线22 的电流产生分流，为半导体冷却装置30供电，通过整流装置51，将电流、电压调整到与半导体冷却装置30的工作电流和电压相适配，保证半导体冷却装置30的工作稳定。
进一步地，该连接器的控制单元50包括控制装置52，控制装置52与整流装置51连接，控制装置52用于对经整流装置51流向半导体冷却装置30的电流进行调控。通过控制装置52，调节半导体冷却装置30的电流，从而调节半导体冷却装置30的制冷部31的温度，对连接部21的温度进行调节。具体地，整流装置51一端与导线22电连接，整流装置51的另一端分别与控制装置52和半导体冷却装置30电连接，为控制装置52和半导体冷却装置30进行供电。
如图3所示，该连接器包括与控制装置52连接的温度传感器53，温度传感器53与端子23接触连接，和/或，温度传感器53与制冷部31接触连接。通过温度传感器53来检测该连接器的温度，并将温度信号传递给控制装置52，控制装置52根据检测的温度来控制整流装置51调整半导体冷却装置30的供电电流，从而调整半导体冷却装置30的制冷部31的温度，从而保障连接部21的稳定工作温度。例如，当检测到温度升高时，控制装置52则控制整流装置51增大供电电流，加快半导体冷却装置30向外散热的效率；当检测到温度降低时，控制装置52则控制整流装置51减小供电电流，减慢半导体冷却装置30向外散热的效率。温度传感器53、控制装置52与整流装置51相配合，调节半导体冷却装置30的电流，可以实现该连接器的恒温，避免因导线22的电流变化导致该连接器温度变化。优选地，温度传感器53与连接部21接触连接，温度传感器53用于对连接部21的温度进行检测。
控制装置52可以采用机械式控制装置，机械式控制装置包括至少两片不同温度膨胀系数的合金片，合金片在温度变化后会发生弯曲变形，推动触点的闭合和断开，以实现机械式控制装置的通电和断电。控制装置52可以采用电子式控制装置，电子式控制装置通过接收温度传感器53的电信号，通过芯片分析后，控制半导体冷却装置30的通电和断电。
整流装置51通过电阻和二极管及其他电子元件的组合，将导线22中的不稳定大电流整合为控制装置52和温度传感器53可使用的稳定小电流，能够实现持续稳定的供电。
温度传感器53可以采用接触式温度传感器，具体可以为双金属温度计、压力式温度计、电阻温度计、热敏电阻或者温差电偶，温度传感器53能够将连接部21或制冷部31的实时温度转化为电信号，传递给控制装置52。
在一实施方式中，半导体冷却装置30包括多个，为了能够精确控制每个半导体冷 却装置30的温度，多个半导体冷却装置30采用并联的方式电连接整流装置51，从而能够单独控制每个半导体冷却装置30的供电电流。
进一步的，当多个半导体冷却装置30的型号、功率完全一致时，多个半导体冷却装置30以串联的方式电连接整流装置51，从而使每个半导体冷却装置30的供电电流一致。
进一步地，半导体冷却装置30嵌设于保护结构装置10的侧壁，并且制冷部31位于保护结构装置10的侧壁内部，散热部32至少部分表面裸露于保护结构装置10的外部，以有利于半导体冷却装置30的制冷部31从端子23吸收热量，并经散热部32向外散发热量。
在一实施方式中，端子23的热量通过辐射传热到制冷部31。在另一实施方式中，制冷部31与端子23连接以吸收端子的热量。
如图2-图5所示，制冷部31与端子23接触连接，有利于端子23上的热量快速地传递给制冷部31，使热量及时向外散发，能够充分地带走端子23产生的热量，降低温度，实现快速降温的目的。
进一步地，制冷部31设有容置凹槽311，端子23至少部分嵌设于容置凹槽311内，容置凹槽311的形状与端子23的外轮廓的形状相适配，端子23与容置凹槽311的内壁相接触，使制冷部31和端子23保持紧贴，增大了接触面积，有利于端子23的热量向制冷部31传递。优选地，如图4所示，容置凹槽311呈半圆柱状。
如图6、图7和图18所示，该连接器包括导热部41，导热部41与端子23接触连接，制冷部31与导热部41接触连接，连接部21上的热量通过导热部41传递给制冷部31。通过导热部41，有利于端子23、导热部41与制冷部31保持紧贴，便于端子23产生的热量快速地传递给制冷部31，降低温度，提高散热性能，实现快速降温的目的，保证端子23的温度恒定。导热部41可以采用导热且不导电的材料；导热部41可以采用在端子23与制冷部31之间填充导热且不导电的材料的方式成型。导热部41的材质可以为导热硅脂、导热云母片、导热陶瓷片和导热矽胶片中的一种或几种的组合。
进一步地，导热部41包围端子23，制冷部31通过导热部41来与端子23接触，导热部41可以设置为筒状，以方便吸收端子23的不同位置产生的热量。在一些情况下，该连接器包括多个端子23，可以分别设置多个导热部41，导热部41与端子23一一对应地套设于端子23外，多个导热部41均与一个半导体冷却装置30的制冷部31接触连接；也可以为一个导热部41包围多个端子23，多个端子23的热量经过该导热部41传 递给制冷部31。
在本发明的一实施方式中，该连接器包括至少两个半导体冷却装置30，至少两个半导体冷却装置30分布于端子23的两侧，两个半导体冷却装置30从端子23的两侧吸收热量，提高了降温的效率。如图5和图7所示，两个半导体冷却装置30可分布于端子23的相对的两侧。
如图8所示，该连接器包括多个端子23，各个端子23的连接部21分别连接有导线22。该连接器包括多个半导体冷却装置30，多个半导体冷却装置30包括第一冷却装置301和第二冷却装置302，第一冷却装置301、多个连接部21和第二冷却装置302依次分布。在一实施方式中，多个端子23沿左右方向依次分布，第一冷却装置301设置于左端，第二冷却装置302设置于右端；进一步地，端子23的上侧和下侧分别设有半导体冷却装置30。
在一实施方式中，制冷部31设有容置孔312，端子23穿设于容置孔312。通过容置孔312来容置端子23，实现制冷部31与端子23接触连接，改善了端子23与导线22的空间布置方式，增大了接触面积，有利于端子23向制冷部31传热，尤其是在该连接器包括多个端子23与导线22的情况下，便于在较小的空间中进行布置，保障各个端子23的散热。
进一步地，半导体冷却装置30包括多个散热部32，多个散热部32围绕制冷部31分布，有利于热量向外散发，如图19所示，制冷部31设有多个容置孔312；该连接器包括多个端子23，端子23一一对应地穿设于容置孔312。优选地，制冷部31整体呈方形，散热部32分布于制冷部31的4个侧面。
在一实施方式中，制冷部31设有多个容置孔312；连接器包括多个端子23，端子23一一对应地穿设于容置孔312，如图19所示，端子23穿设于制冷部31内，散热部32套设于制冷部31外，有利于制冷部31与端子23充分接触，促使端子23上的热量以较高的效率经制冷部31向散热部32传递，提高了结构的紧凑性，方便布置多个端子23和半导体冷却装置30。
在一实施方式中，制冷部31和散热部32均呈筒状，如图20所示，端子23穿设于制冷部31内，散热部32套设于制冷部31外。筒状的制冷部31和散热部32都方便加工，而且接触面积大，更容易将端子23的热量转移到散热部。进一步地，制冷部31和散热部32均呈圆筒状。
在一实施方式中，端子23设有端子部231和连接部21，端子部231被构造成用于 与外部电结构连接，连接部21用于与导线22相连接。连接部21的形状不限于一种，例如：如图9所示，连接部21的初始形状呈U形，其具有U形槽，导线22设置于该U形槽中，如图10所示，U形槽的侧壁向内弯折，可以实现将导线22压紧，从而将端子23与导线22连接到一起；如图11-图14所示，连接部21可以为筒体，导线22设置于该筒体的孔内；如图15-图17所示，连接部21可以呈板状，导线22设置于连接部21的一侧。导线22与连接部21之间可以采用焊接或者压接的方式实现固接。端子部231与连接部21可以一体结构，也可以为分体结构，两者可以采用焊接的方式固定到一起。优选地，端子23与制冷部31连接的位置为连接部21，有利于制冷部31吸收端子23的热量。
进一步地，制冷部31与连接部21的接触面积，占连接部21表面积的至少3％，以保障吸热的效率。
发明人为了验证制冷部31与连接部21的接触面积，占连接部21表面积的比例范围，对端子23温升的影响，选用11组相同截面积、相同材质、相同长度的导线22，以及相同的端子23，并通相同的电流，采用不同的制冷部31与连接部21的接触面积占连接部21表面积的比例，并读取对应的的温升值，记录在表1中。
实验方法是在封闭的环境中，将制冷部31与连接部21的接触面积占连接部21表面积的比例不同的连接器，导通相同的电流，记录通电前的温度和通电后温度稳定时的温度，并作差取绝对值。在本实施例中，温升小于50K为合格值。
表1：不同制冷部31与连接部21的接触面积，占连接部21表面积的比例对连接器温升的影响
Figure PCTCN2022105980-appb-000001
从表1中可以看出，当制冷部31与连接部21的接触面积占连接部21表面积的比例小于3％时，连接器的温升值小于合格值。覆盖面积的比例越大，温升值越小，因此，发明人将制冷部31与连接部21的接触面积占连接部21表面积的比例设定为至少3％。
导线22包括内部的导体221和包裹导体221的绝缘层222，导体221的终端与端子23连接。半导体冷却装置30固定于保护结构装置10，制冷部31朝内，散热部32朝外，并且制冷部31的表面设置在保护结构装置10表面或保护结构装置10外部。外部电结构可以是与端子23相适配的线束线缆或者端子。
在本发明的一实施方式中，如图21所示，半导体冷却装置30包括：氧化铝基板1011、防水保护层1012、半导体P/N层1013、电源接口1014。
氧化铝基板1011、防水保护层1012、半导体P/N层1013依次设置。电源接口1014电连接半导体P/N层1013。
氧化铝基板1011构成半导体冷却装置30的热端，即散热部32。半导体P/N层1013构成半导体冷却装置30的冷却端，即制冷部31。
本实施例通过氧化铝基板1011作为半导体冷却装置30的表面，能够提导热率，使得传热速度更快，制冷时间更短，可承受的强度大，且可柔性连接，能够更好地贴覆在导体上，有效吸导体弯折处的表面应力，在安装和使用过程中不易破碎。半导体冷却装置30芯部采用特种半导体材料构成的P-N结，当一块N型半导体材料和一块P型半导体材料联结成的热电偶对中有电流通过时，两端之间就会产生热量转移，热量就会从一端转移到另一端，从而产生温差形成冷热端，即通过控制直流电流就可以实现制冷控制。
在本发明的一实施方式中，半导体冷却装置30的冷却速率为0.05K/s-5K/s。
发明人为了验证半导体冷却装置30的冷却速率对该连接器的温升的影响，选用10根相同截面积、相同材质、相同长度的导线22，以及相同的端子23，并通相同的电流，采用不同冷却速率的半导体冷却装置30，对连接器进行冷却，并读取对应的温升值，记录在表2中。
表2：不同冷却速率的半导体冷却装置30对连接器温升的影响
Figure PCTCN2022105980-appb-000002
实验方法是在封闭的环境中，将半导体冷却装置30的冷却速率不同的连接器，导通相同的电流，记录通电前的温度和通电后温度稳定时的温度，并作差取绝对值。在本实施例中，温升小于50K为合格值。
从表2中可以看出，当半导体冷却装置30的冷却速率小于0.05K/s时，连接器的温升值小于合格值，半导体冷却装置30的冷却速率越大，温升值越小。但是当半导体冷却装置30的冷却速率大于5K/s时，受连接器本身发热量及半导体冷却装置30自身功率的影响，温升值降低不明显，但是半导体冷却装置30功率却增大，不符合经济性。因此，发明人将半导体冷却装置30的冷却速率设定为0.05K/s-5K/s。
在本发明的一实施方式中，该连接器包括与散热部32连接的散热装置42，以提高散热效果，有利于半导体冷却装置30的散热部32的热量向外散发，保证快速降温。具体地，散热装置42可以为风扇或热交换器或液冷装置；如图3和图4所示，散热装置42还可以是散热翼片421，散热翼片421优选采用金属制作。
该连接器包括以下优点：(1)制冷时间短，连接部21的温度升高时，能够在较短时间内对连接部21进行降温；(2)能够比较稳定地控制该连接器的温度，防止过载引起的连接点烧断，减少安全事故；(3)通过降低连接点的温度，实现可以不用对线缆进行增大线径的设计，设计线缆时可以使用在额定发热曲线时的线径，不必在设计时考虑为减小连接部的电阻而增大线缆的线径，从而缩小线缆线径，降低了线缆的成本；(4)通过使用该连接器，能够解决电动汽车充电电流较大时连接点温度过高的问题，有助于实现电动汽车充电线束大电流快速充电；(5)半导体冷却装置30的散热部32可以连接其它需要加热的部件，提高能量的利用率。
实施例二
本发明提供一种汽车，包括上述的具有半导体冷却装置的连接器，该汽车中的连接器具有上述的结构、功能和有益效果，在此不再赘述。
以上所述仅为本发明示意性的具体实施方式，并非用以限定本发明的范围。任何本领域的技术人员，在不脱离本发明的构思和原则的前提下所作的等同变化与修改，均应属于本发明保护的范围。

Claims (25)

  1. 一种具有半导体冷却装置的连接器，其中，所述连接器包括：导线、端子和半导体冷却装置，所述端子被构造成其一端与所述导线连接，其另一端用于与外部电结构连接；
    所述半导体冷却装置具有制冷部和散热部，所述制冷部吸收所述端子的热量。
  2. 如权利要求1所述的连接器，其中，所述半导体冷却装置与所述导线电连接。
  3. 如权利要求1所述的连接器，其中，包括：保护结构装置，所述端子设置于所述保护结构装置内。
  4. 如权利要求1所述的连接器，其中，所述连接器包括整流装置，所述整流装置的一端与所述半导体冷却装置电连接，所述整流装置的另一端与所述导线电连接。
  5. 如权利要求4所述的连接器，其中，所述连接器包括与所述整流装置连接的控制装置，所述控制装置用于对经所述整流装置流向所述半导体冷却装置的电流进行调控。
  6. 如权利要求5所述的连接器，其中，所述连接器包括与所述控制装置连接的温度传感器，所述温度传感器与所述端子接触连接，和/或，所述温度传感器与所述制冷部接触连接。
  7. 如权利要求4所述的连接器，其中，所述半导体冷却装置包括多个，且多个所述半导体冷却装置电连接所述整流装置。
  8. 如权利要求3所述的连接器，其中，所述半导体冷却装置嵌设于所述保护结构装置的侧壁，并且所述制冷部位于所述保护结构装置的侧壁内部，所述散热部至少部分表面裸露于所述保护结构装置的外部。
  9. 如权利要求1所述的连接器，其中，所述制冷部与所述端子接触连接。
  10. 如权利要求1所述的连接器，其中，所述端子的热量通过辐射传热到所述制冷部。
  11. 如权利要求9所述的连接器，其中，所述制冷部设有容置凹槽，所述端子至少部分嵌设于所述容置凹槽内。
  12. 如权利要求1所述的连接器，其中，所述连接器包括导热部，所述导热部与所述端子接触连接，所述制冷部与所述导热部接触连接；所述导热部的材质为导热硅脂、导热云母片、导热陶瓷片和导热矽胶片中的一种或几种的组合。
  13. 如权利要求12所述的连接器，其中，所述导热部包围所述端子。
  14. 如权利要求1所述的连接器，其中，所述连接器包括至少两个所述半导体冷却 装置，至少两个所述半导体冷却装置分布于所述端子的两侧。
  15. 如权利要求1所述的连接器，其中，所述制冷部设有容置孔，所述端子穿设于所述容置孔。
  16. 如权利要求1所述的连接器，其中，所述半导体冷却装置包括多个所述散热部，多个所述散热部围绕所述制冷部分布。
  17. 如权利要求15所述的连接器，其中，所述制冷部设有多个所述容置孔；所述连接器包括多个所述端子，所述端子一一对应地穿设于所述容置孔。
  18. 如权利要求1所述的连接器，其中，所述制冷部和所述散热部均呈筒状，所述端子穿设于所述制冷部内，所述散热部套设于所述制冷部外。
  19. 如权利要求18所述的连接器，其中，所述制冷部和所述散热部均呈圆筒状。
  20. 如权利要求1所述的连接器，其中，所述端子设有端子部、和用于与所述导线相连接的连接部，所述制冷部与所述连接部连接。
  21. 如权利要求20所述的连接器，其中，所述制冷部与所述连接部的接触面积，占所述连接部表面积的至少3％。
  22. 如权利要求1所述的连接器，其中，所述半导体冷却装置包括：氧化铝基板、防水保护层、半导体P/N层和电源接口；
    所述氧化铝基板、防水保护层、半导体P/N层依次设置；
    所述电源接口电连接半导体P/N层。
  23. 如权利要求22所述的连接器，其中，所述半导体冷却装置的冷却速率为0.05K/s-5K/s。
  24. 如权利要求1所述的连接器，其中，所述连接器包括与所述散热部连接的散热装置。
  25. 一种汽车，其中，包括：权利要求1-24中任一项所述的具有半导体冷却装置的连接器。
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CN113490397A (zh) * 2021-07-20 2021-10-08 长春捷翼汽车零部件有限公司 具有半导体冷却装置的连接器及汽车
CN114709680A (zh) * 2022-03-14 2022-07-05 吉林省中赢高科技有限公司 一种具有固态冷却介质的连接器总成及一种车辆
CN114709683A (zh) * 2022-03-14 2022-07-05 吉林省中赢高科技有限公司 一种固态冷却的连接器总成及一种车辆
CN116761383A (zh) * 2023-05-11 2023-09-15 长春捷翼汽车科技股份有限公司 一种新型自冷却连接器
CN119545754B (zh) * 2024-12-03 2025-10-31 嘉兴市普鑫电子有限公司 一种用电设备智能控制器
CN120356733B (zh) * 2025-06-24 2025-08-26 安徽伟光电缆股份有限公司 一种熔盐塔式光热发电专用电缆结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106410493A (zh) * 2016-11-18 2017-02-15 深圳市沃尔核材股份有限公司 充电枪散热结构
CN107554319A (zh) * 2017-07-18 2018-01-09 芜湖赛宝信息产业技术研究院有限公司 一种新能源汽车传导充电用连接装置
CN208134123U (zh) * 2018-04-02 2018-11-23 东莞市趣电智能科技有限公司 一种半导体导热散热的充电枪
CN212579636U (zh) * 2020-04-13 2021-02-23 中国电器科学研究院股份有限公司 半导体制冷式电动汽车直流充电插头
CN113490397A (zh) * 2021-07-20 2021-10-08 长春捷翼汽车零部件有限公司 具有半导体冷却装置的连接器及汽车

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3676504B2 (ja) * 1996-07-26 2005-07-27 本田技研工業株式会社 熱電モジュール
JP2005114298A (ja) * 2003-10-10 2005-04-28 Citizen Watch Co Ltd 温度調節装置
JP4412542B2 (ja) * 2004-09-15 2010-02-10 セイコーインスツル株式会社 封止型電子部品、回路基板及び電子機器
JP2007103904A (ja) * 2005-09-07 2007-04-19 Denso Corp 熱電変換装置
JP4769752B2 (ja) * 2007-03-23 2011-09-07 トヨタ自動車株式会社 半導体装置および電動車両
CN102446878A (zh) * 2010-10-11 2012-05-09 海洋王照明科技股份有限公司 一种半导体制冷装置
CA2837127C (en) * 2011-05-24 2019-09-17 Ingeny PCR B.V. System for and method of changing temperatures of substances
JP2015005670A (ja) * 2013-06-21 2015-01-08 日本圧着端子製造株式会社 ペルチェ素子を有するコネクタ
US10611265B2 (en) * 2015-01-29 2020-04-07 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Charging plug for an electrically driven vehicle
DE102015112347A1 (de) * 2015-07-29 2017-02-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Ladestation mit einem Ladekabel
JP6607394B2 (ja) * 2016-02-15 2019-11-20 株式会社タイセー ペルチェモジュール及びペルチェモジュール装置
DE102016211464A1 (de) * 2016-06-27 2017-12-28 Phoenix Contact E-Mobility Gmbh Leistungskontaktsystem für einen Ladestecker und/oder eine Ladebuchse, Ladestecker und Ladestation zur Abgabe elektrischer Energie an einen Empfänger elektrischer Energie
CN110014948A (zh) * 2017-09-30 2019-07-16 比亚迪股份有限公司 充电连接件的散热器、充电系统以及车辆
CN207853021U (zh) * 2018-02-09 2018-09-11 东莞市天圳实业有限公司 一种具有散热功能的线束连接器
JP2019197641A (ja) * 2018-05-09 2019-11-14 トヨタ自動車株式会社 コネクタ
US11387598B2 (en) * 2019-02-19 2022-07-12 Aptiv Technologies Limited Electrical connector assembly with modular cooling features
CN113809224A (zh) * 2020-06-16 2021-12-17 比亚迪股份有限公司 半导体制冷片及其制作方法
CN213546657U (zh) * 2020-12-26 2021-06-25 惠东县凯宝科技有限公司 一种弹性端子连接线
CN215379644U (zh) * 2021-07-20 2021-12-31 长春捷翼汽车零部件有限公司 具有半导体冷却装置的连接器及汽车

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106410493A (zh) * 2016-11-18 2017-02-15 深圳市沃尔核材股份有限公司 充电枪散热结构
CN107554319A (zh) * 2017-07-18 2018-01-09 芜湖赛宝信息产业技术研究院有限公司 一种新能源汽车传导充电用连接装置
CN208134123U (zh) * 2018-04-02 2018-11-23 东莞市趣电智能科技有限公司 一种半导体导热散热的充电枪
CN212579636U (zh) * 2020-04-13 2021-02-23 中国电器科学研究院股份有限公司 半导体制冷式电动汽车直流充电插头
CN113490397A (zh) * 2021-07-20 2021-10-08 长春捷翼汽车零部件有限公司 具有半导体冷却装置的连接器及汽车

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4376564A4 *

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