WO2023005762A1 - 一种双振膜扬声器和电子设备 - Google Patents

一种双振膜扬声器和电子设备 Download PDF

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Publication number
WO2023005762A1
WO2023005762A1 PCT/CN2022/106799 CN2022106799W WO2023005762A1 WO 2023005762 A1 WO2023005762 A1 WO 2023005762A1 CN 2022106799 W CN2022106799 W CN 2022106799W WO 2023005762 A1 WO2023005762 A1 WO 2023005762A1
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WO
WIPO (PCT)
Prior art keywords
diaphragm
annular
magnetic circuit
circuit system
dual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2022/106799
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English (en)
French (fr)
Inventor
张毫毫
陶玲
郭明光
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to US18/292,820 priority Critical patent/US20250008269A1/en
Priority to JP2024505436A priority patent/JP7778910B2/ja
Priority to EP22848367.3A priority patent/EP4354901A4/en
Publication of WO2023005762A1 publication Critical patent/WO2023005762A1/zh
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/227—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only  using transducers reproducing the same frequency band
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R7/00—Diaphragms for electromechanical transducers; Cones
    • H04R7/02—Diaphragms for electromechanical transducers; Cones characterised by the construction
    • H04R7/04—Plane diaphragms
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/045—Mounting
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H04R9/063—Loudspeakers using a plurality of acoustic drivers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2869—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself
    • H04R1/2873—Reduction of undesired resonances, i.e. standing waves within enclosure, or of undesired vibrations, i.e. of the enclosure itself for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2420/00—Details of connection covered by H04R, not provided for in its groups
    • H04R2420/07—Applications of wireless loudspeakers or wireless microphones

Definitions

  • the present application relates to the field of electroacoustics, in particular to a double-diaphragm speaker and electronic equipment.
  • In-ear headphones have the advantages of good airtight sound insulation, good sound quality, and no sound leakage, but they may feel painful when worn.
  • the generated mechanical wave is directly transmitted to the ear canal through the earplug wire, which produces very unpleasant noise.
  • the wire that enters the ear is generally harder, which is conducive to the transmission of vibration).
  • the semi-in-ear earphones are favored by most consumers because of their semi-open structure, no stethoscope effect and comfortable wearing.
  • the middle and low frequency sound waves including the middle and low frequency signals in the target signal and/or the middle and low frequency signals in the noise reduction signal
  • leak relatively large which makes the middle and low frequency performance of the semi-in-ear earphones poor.
  • the middle and low frequency effect is not good when playing music, or the active noise cancellation (active noise cancellation, ANC) function has poor noise reduction effect on the middle and low frequency noise.
  • the way to solve this problem is to improve the mid-low frequency sensitivity of the speaker (speaker sensitivity refers to the sound pressure level generated by adding an electrical signal with a rated power of 1W to the speaker input and 1m away from the speaker axis. It reflects the power conversion The efficiency of sound energy, the higher the sensitivity, the easier it is for the speaker to be driven by the power amplifier).
  • the existing loudspeaker will increase the volume while improving the sensitivity of the middle and low frequencies, which cannot be applied to miniaturized electronic equipment or save space, which is not conducive to better meeting user needs. Therefore, how to realize a speaker and earphone with high middle and low frequency sensitivity and miniaturization has become an urgent problem to be solved at present.
  • the embodiment of the present application provides a dual-diaphragm loudspeaker and electronic equipment, which separate the sound wave transmission paths of the front chamber and the rear chamber of the two diaphragms, avoiding acoustic short circuit, and can further realize sound wave while ensuring a small volume.
  • Superposition and greater sound pressure enhance the performance of mid- and low-frequency, and further improve the sensitivity of mid- and low-frequency.
  • the embodiment of the present application provides a dual-diaphragm speaker.
  • the dual-diaphragm speaker includes: an annular housing; a magnetic circuit system arranged in the annular housing and aligning the annular The space in the casing is divided into a first chamber and a second chamber, and the magnetic circuit system includes a first magnetic gap and a second magnetic gap arranged at intervals around the central axis; the first diaphragm is arranged on the annular
  • the first end of the shell is used to form a first front cavity with the first cavity, and is used to form a first rear cavity with the first component on the side of the first diaphragm away from the magnetic circuit system;
  • the first The voice coil is arranged in the first front cavity, one end of the first voice coil is connected to the first diaphragm and the other end extends into the first magnetic gap;
  • the second diaphragm is arranged in the the second end of the annular shell is used to form a second rear cavity with the second cavity, and
  • the first passage can be located on at least one of the outer peripheral wall of the magnetic circuit system and the inner wall of the annular housing or located in the shell wall of the outer shell.
  • the first front cavity and the second front cavity are communicated through the first channel located inside or inside the ring shell, which facilitates the connection with the electronic equipment
  • the sound pipe connection can reduce the volume and facilitate miniaturization; at the same time, because the diaphragm can be arranged on the end face of the annular shell Above all, the area of the diaphragm is larger, more air is pushed, and the sound pressure is higher, which can further improve the mid-low frequency sensitivity of the speaker.
  • the outer peripheral wall of the magnetic circuit system is in sealing connection with the inner wall of the annular casing
  • the outer peripheral edge of the second diaphragm is in sealing connection with the magnetic circuit system
  • the first channel It includes a first slot arranged on the inner wall of the annular housing and/or the outer peripheral wall of the magnetic circuit system, wherein: the first diaphragm is in sealing connection with the entire end surface of the first end of the annular housing, and the The first slot extends from the first front chamber to the end surface of the second end of the annular housing; or, the first diaphragm is in sealing connection with the magnetic circuit system, and the magnetic circuit system is provided with a communicating
  • the first notch of the front chamber, the first passage further includes a first notch, and the first slot extends from the first notch to the end surface of the second end of the annular shell.
  • the first passage can be formed by providing slots on the inner wall of the annular housing, or by providing slots on the outer peripheral wall of the magnetic circuit system, or by providing the inner wall of the annular housing and the magnetic The outer peripheral wall of the circuit system is respectively provided with slots.
  • the first diaphragm can be sealed and connected with the ring shell or the magnetic circuit system; the second diaphragm can be sealed and connected with the magnetic circuit system.
  • the second rear chamber communicates with the first rear chamber or the atmosphere through a second channel
  • the magnetic circuit system is provided with a second gap communicating with the second rear chamber
  • the second passage includes a second port, the second notch and a second slot arranged on the inner wall of the annular casing and/or the outer peripheral wall of the magnetic circuit system, and the second port is arranged on On the outer peripheral wall of the annular shell, the second slot extends from the second notch to the second port; or, the first diaphragm is in sealing connection with the magnetic circuit system, and the second
  • the passage includes the second notch and a second slot provided on the inner wall of the annular housing and/or the outer peripheral wall of the magnetic circuit system, and the second slot extends from the second notch to the annular housing at the end face of the first end.
  • the second slot can be formed by arranging slots on the inner wall of the annular housing, or by providing slots on the outer peripheral wall of the magnetic circuit system, or by forming the inner wall of the annular housing and the magnetic circuit system.
  • the outer peripheral wall is formed by setting grooves respectively.
  • a first annular boss is provided on the inner wall of the first end of the annular housing, the first diaphragm is sealed and connected to the first annular boss, and the magnetic circuit system Connected to the side of the first annular boss away from the first diaphragm, the outer peripheral wall of the magnetic circuit system is in sealing connection with the inner wall of the annular housing, and the outer peripheral edge of the second diaphragm is connected to the The magnetic circuit system is sealed and connected; at least one of the first annular boss and the magnetic circuit system is provided with a first gap communicating with the first front cavity, and the first channel includes the first gap and a first slot provided on the inner wall of the annular housing and/or the outer peripheral wall of the magnetic circuit system, the first slot extending from the first notch to the end surface of the second end of the annular housing.
  • the first annular boss is provided to facilitate positioning and installation of the magnetic circuit system and prevent the magnetic circuit system from moving along the axial direction of the annular housing.
  • the second rear chamber communicates with the first rear chamber or the atmosphere through a second channel
  • the magnetic circuit system is provided with a second gap communicating with the second rear chamber
  • the second passage includes a second port, the second notch and a second slot arranged on the inner wall of the annular housing and/or the outer peripheral wall of the magnetic circuit system
  • the second port is arranged on the On the outer peripheral wall of the annular housing
  • the second slot extends from the second notch to the second port
  • the second passage includes the second notch and is arranged on the inner wall of the annular housing and/or Or the second slot on the outer peripheral wall of the magnetic circuit system, the second slot extends from the second notch to the end surface of the first end of the annular housing and runs through the first annular boss.
  • the second rear cavity when the second rear cavity can communicate with the atmosphere through the second channel, or, the second rear cavity can communicate with the first rear cavity through the second channel to increase the volume of the rear cavity, which can make the corresponding diaphragm
  • the vibration amplitude increases, forming a larger sound pressure, which helps to improve the mid-low frequency sensitivity of the speaker.
  • a second annular boss is provided on the inner wall of the second end of the annular housing, the second diaphragm is sealed and connected to the second annular boss, and the magnetic circuit system is connected to
  • the first channel includes a first slot provided on the inner wall of the annular housing and/or the outer peripheral wall of the magnetic circuit system, wherein : the first diaphragm is sealingly connected to the entire end surface of the first end of the annular housing, the first slot extends from the first front cavity to the end surface of the second end of the annular housing and runs through the The second annular boss; or, the first diaphragm is in sealing connection with the magnetic circuit system, the magnetic circuit system is provided with a first notch communicating with the front cavity, and the first channel also includes a first notch, The first slot extends from the first notch to the end surface of the second end of the annular shell.
  • the second annular boss is provided to facilitate
  • the second rear chamber communicates with the first rear chamber or the atmosphere through a second channel, and at least one of the second annular boss and the magnetic circuit system is provided with There is a second notch communicating with the second rear cavity, wherein: the second passage includes a second port, the second notch and the inner wall of the annular shell and/or the outer peripheral wall of the magnetic circuit system a second slot, the second port is disposed on the outer peripheral wall of the annular housing, and the second slot extends from the second notch to the second port; or, the first diaphragm Sealed connection with the magnetic circuit system, the second passage includes the second notch and a second slot provided on the inner wall of the annular shell and/or the outer peripheral wall of the magnetic circuit system, the second slot The groove extends from the second notch to the end surface of the first end of the annular shell.
  • the second rear cavity when the second rear cavity can communicate with the atmosphere through the second channel, or, the second rear cavity can communicate with the first rear cavity through the second channel to increase the volume of the rear cavity, which can make the corresponding diaphragm
  • the vibration amplitude increases, forming a larger sound pressure, which helps to improve the mid-low frequency sensitivity of the speaker.
  • a first annular boss is provided on the inner wall of the first end of the annular housing, a second annular boss is provided on the inner wall of the second end of the annular housing, and the magnetic circuit
  • the system is connected between the first annular boss and the second annular boss, the outer peripheral wall of the magnetic circuit system is in sealing connection with the inner wall of the annular casing, the outer peripheral edge of the first diaphragm is connected to the The first annular boss is sealed and connected; the outer peripheral edge of the second diaphragm is sealed and connected with the second annular boss; at least one of the first annular boss and the magnetic circuit system is provided with communicating with the first notch of the first front chamber, the first passage includes the first notch and a first slot provided on the inner wall of the annular casing and/or the outer peripheral wall of the magnetic circuit system, the The first slot extends from the first notch to the end surface of the second end of the annular housing and passes through the second annular boss.
  • the arrangement of the first annular boss is provided on the inner
  • the second rear chamber communicates with the first rear chamber or the atmosphere through a second channel, and at least one of the second annular boss and the magnetic circuit system is provided with There is a second notch communicating with the second rear cavity, wherein: the second passage includes a second port, the second notch and the inner wall of the annular shell and/or the outer peripheral wall of the magnetic circuit system a second slot, the second port is disposed on the outer peripheral wall of the annular housing, and the second slot extends from the second notch to the second port; or, the second passage includes The second notch and the second slot provided on the inner wall of the annular housing and/or the outer peripheral wall of the magnetic circuit system, the second slot extends from the second notch to the first The end surface of the end and through the first annular boss.
  • the second rear cavity when the second rear cavity can communicate with the atmosphere through the second channel, or, the second rear cavity can communicate with the first rear cavity through the second channel to increase the volume of the rear cavity, which can make the corresponding diaphragm
  • the vibration amplitude increases, forming a larger sound pressure, which helps to improve the mid-low frequency sensitivity of the speaker.
  • the outer peripheral wall of the magnetic circuit system is in sealing connection with the inner peripheral wall of the annular housing
  • the first channel includes a first channel disposed on the magnetic circuit system or the annular housing.
  • a through hole, one end of the first through hole communicates with the first front cavity, and the other end extends to the end surface of the second end of the annular shell.
  • the first passage can be formed by setting a through hole on the shell wall of the annular shell, or by setting a through hole on the magnetic circuit system.
  • the first diaphragm can be connected with the annular shell Or the magnetic circuit system is sealed and connected; the second diaphragm can be sealed and connected with the ring shell or the magnetic circuit system.
  • the second rear chamber communicates with the first rear chamber or the atmosphere through a second channel
  • the outer peripheral wall of the magnetic circuit system is in sealing connection with the inner peripheral wall of the annular shell
  • the second passage includes a second through hole arranged on the magnetic circuit system or the annular casing, the first end of the second through hole communicates with the second rear cavity, and the other end extends to the annular casing at the end surface of the first end of the first end or extending to the outer peripheral wall of the annular housing.
  • the second channel can be formed by setting a through hole on the shell wall of the annular shell, or by setting a through hole on the magnetic circuit system.
  • the first diaphragm can be connected with the annular shell Or the magnetic circuit system is sealed and connected; the second diaphragm can be sealed and connected with the ring shell or the magnetic circuit system.
  • a first annular boss is provided on the inner wall of the first end of the annular shell, and the magnetic circuit system is connected to the side of the first annular boss far away from the first diaphragm.
  • the first annular boss is sealed and connected; and/or, the inner wall of the second end of the annular shell is provided with a second annular boss, and the magnetic circuit system is far away from the second vibration of the second annular boss.
  • the side surface of the membrane is sealingly connected with the second annular boss.
  • the arrangement of the first annular boss and the second annular boss can facilitate the positioning and installation of the magnetic circuit system, and prevent the magnetic circuit system from moving along the axial direction of the annular housing.
  • the first diaphragm can be sealed and connected with the first annular boss; the second diaphragm can be sealed and connected with the second annular boss.
  • the dual-diaphragm speaker is provided with more than two first channels, and the two or more first channels are arranged at intervals along a circumferential direction of the annular casing. In this way, the arrangement of the first channel is more uniform, the sound is better, and the force of the annular shell is relatively balanced.
  • the dual-diaphragm speaker is provided with more than two second channels, and the two or more second channels are arranged at intervals along the circumferential direction of the annular housing. In this way, the arrangement of the second channel is more uniform, the sound is better, and the force of the annular shell is relatively balanced.
  • a positioning boss is provided on the outer peripheral wall of the annular casing, and a plurality of through holes communicating with the inner side and the outer side of the annular casing are arranged on the positioning boss, and the first The voice coil is provided with a first voice coil wire, and the second voice coil is provided with a second voice coil wire, and the first voice coil wire and the second voice coil wire respectively pass through the plurality of through holes and The power amplifier device is electrically connected, and the positioning boss is spaced apart from the at least one first channel or the at least one second channel along the circumferential direction of the annular shell.
  • the positioning boss can be used to position and install the dual-diaphragm speaker to the electronic device, and a structure for communicating the voice coil wire with the external circuit can be provided at the positioning boss, such as a communication channel connecting the inner and outer sides of the annular shell. Holes or embedded metal pads, so that the voice coil wire can pass through the hole to connect to the external circuit, or the voice coil wire can be connected to the metal pad in the annular shell, and the metal pad is then connected to the external circuit.
  • the positioning bosses and channels are arranged at intervals along the circumferential direction of the annular shell, so that the sound wave transmission is more uniform, the structural design is more reasonable, and the force is more balanced.
  • the annular shell includes a first shell and a second shell arranged along the direction of the central axis, wherein: one end of the first shell away from the second shell
  • the end face of the first diaphragm is provided with a first annular step
  • the outer peripheral edge of the first diaphragm is provided with a first annular installation part
  • the first annular installation part is arranged at the first annular step, so that the first diaphragm
  • the outer peripheral edge of the second shell is sealingly connected with the end face of the first end of the annular shell; and/or, the end face of the end of the second shell away from the first shell is provided with a second annular step
  • the second The outer peripheral edge of the diaphragm is provided with a second ring installation part, and the second ring installation part is arranged at the second annular step, so as to realize the connection between the outer peripheral edge of the second diaphragm and the end surface of the second end of the annular housing.
  • the annular shell in order to facilitate installation and manufacture, can be split into a first shell and a second shell, and in order to facilitate positioning and installation of the first diaphragm, the inner side of the end face of the first shell can be Or a first annular step is set on the outer side, and the first annular mounting part of the first diaphragm, such as a steel ring, can be arranged at the first annular step, which also makes the sealing effect between the first diaphragm and the first housing better ; Similarly, in order to facilitate the positioning and installation of the second diaphragm, a second annular step can be set on the inside or outside of the end face of the second housing, and the second annular mounting part of the second diaphragm can be arranged on the second ring such as a steel ring. The ring-shaped step makes the sealing effect between the second diaphragm and the second housing better. It can be understood that the first casing and the second casing can also be made integrally if
  • the vibration directions of the first diaphragm and the second diaphragm are the same. In this way, the superposition of sound waves can be realized to form a larger sound pressure, thereby improving the sensitivity of the middle and low frequencies.
  • the first component is a first structure of an electronic device on which the dual-diaphragm speaker is installed;
  • the second component is a sound output pipe of the electronic device. That is to say, the dual-diaphragm speaker can cooperate with the first structure of the electronic device to form the first rear cavity, and cooperate with the sound output pipe of the electronic device to form the second front cavity, so that the dual-diaphragm speaker does not need to be provided with a separate cover to form the first cavity.
  • the rear cavity and the second front cavity can reduce the volume, which is conducive to the realization of product miniaturization, and because the sound pipe and the double-diaphragm speaker form the second front cavity, it is convenient to guide the sound waves generated by the diaphragm into the sound pipe.
  • the dual-diaphragm speaker further includes: a first cover, and the first cover, as the first component, is sealingly connected with the first diaphragm to form the The first rear cavity; the second cover, the second cover is sealed and connected with the second diaphragm as a second component to form the second front cavity, and the second front cavity is used for connecting with electronic equipment The sound pipe is connected.
  • the first rear chamber can be closed, or communicated with the atmosphere.
  • the double-diaphragm speaker is provided with a first cover and a second cover
  • the first cover is sealed and connected with the first diaphragm to form a first rear cavity
  • the second cover is sealed and connected with the second diaphragm to form a The second front cavity, so that the first rear cavity and the second front cavity do not need to be formed by the structure of the electronic equipment, and the structural improvement of the electronic equipment is small, so that the application range of the dual-diaphragm speaker is larger and can be used for more types existing electronic equipment.
  • the first component is a first structure of electronic equipment for installing the dual-diaphragm speaker;
  • the dual-diaphragm speaker further includes: a second cover, the second cover As the second component, the body is sealingly connected with the second diaphragm to form the second front cavity, and the second front cavity is used to communicate with the sound output channel of the electronic device.
  • the double-diaphragm speaker is provided with a second cover body
  • the second cover body is sealed and connected with the second diaphragm to form a second front cavity
  • the first structure of the electronic device can form a first rear cavity with the first diaphragm, so that There is no need to use the structure of the electronic device to form the second front cavity, and the structure of the electronic device is slightly improved.
  • the second component is a sound outlet of an electronic device;
  • the dual-diaphragm speaker further includes: a first cover, and the first cover serves as the first component in the The side of the first diaphragm that is away from the magnetic circuit system is in sealing connection with the first diaphragm to form the first rear cavity.
  • the first rear chamber can be closed, or communicated with the atmosphere.
  • the double-diaphragm speaker is provided with a first cover
  • the first cover is sealed and connected with the first diaphragm to form the first rear cavity, so that the structure of the electronic device is not required to form the first rear cavity, which improves the structure of the electronic device Smaller, and because the sound pipe of the electronic device and the second diaphragm of the dual-diaphragm speaker form a second front cavity, it is convenient to guide the sound waves generated by the two diaphragms into the sound pipe.
  • the embodiment of the present application provides an electronic device, which includes: the dual-diaphragm speaker provided in the first aspect above; as the first structure of the first component, the first The side of the diaphragm far away from the magnetic circuit system is connected to the first diaphragm to form a first rear cavity; as the second part of the sound pipe, the second diaphragm of the dual-diaphragm speaker is far away from the The side of the magnetic circuit system is connected with the second diaphragm to form a second front cavity.
  • the first rear chamber can be closed, or communicated with the atmosphere.
  • an embodiment of the present application provides an electronic device, the electronic device includes a sound outlet pipe and the dual-diaphragm speaker provided in the first aspect above, and the dual-diaphragm speaker includes a first cover and a second cover, so The first cover, as the first component, is sealed and connected with the first diaphragm to form the first rear cavity; the second cover, as the second component, is sealed with the second diaphragm connected to form the second front cavity, and the second front cavity of the dual-diaphragm speaker communicates with the sound output duct.
  • an embodiment of the present application provides an electronic device, the electronic device includes: the dual-diaphragm speaker provided in the first aspect above, the dual-diaphragm speaker includes a second cover, and the second cover serves as the The second part is sealed and connected with the second diaphragm to form the second front cavity; as the first structure of the first part, the first diaphragm of the dual-diaphragm speaker is far away from the magnetic circuit system The side of the double-diaphragm speaker is connected with the first diaphragm to form a first rear cavity; a sound pipe, and the second front cavity of the dual-diaphragm speaker communicates with the sound pipe. Wherein, the first rear chamber can be closed, or communicated with the atmosphere.
  • the embodiment of the present application provides an electronic device, the electronic device includes: the dual-diaphragm speaker provided in the first aspect, the dual-diaphragm speaker includes a first cover, and the first cover serves as the The first part is in sealing connection with the first diaphragm on the side away from the magnetic circuit system of the first diaphragm to form the first rear cavity; The side of the second diaphragm of the dual-diaphragm speaker that is away from the magnetic circuit system is connected to the second diaphragm to form a second front cavity.
  • FIG. 1A is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • Fig. 1B is a graph of the sound pressure level of the electronic device in Fig. 1A after superposition of two diaphragm sound waves;
  • FIG. 2 is a perspective view of a dual-diaphragm speaker provided in the first embodiment of the present application
  • FIG. 3 is a schematic diagram of an exploded structure of the dual-diaphragm speaker shown in FIG. 2;
  • Fig. 4 is a top view of the dual-diaphragm speaker shown in Fig. 2;
  • Fig. 5 is a schematic cross-sectional structure diagram along the V-V line in Fig. 4;
  • Fig. 6 is a schematic diagram of the flow direction of the current in the two voice coils of the magnetic circuit system shown in Fig. 5;
  • Fig. 7 is a top perspective view of the first housing of the annular casing shown in Fig. 5;
  • Fig. 8 is a bottom perspective view of the first shell of the annular shell shown in Fig. 5;
  • Fig. 9 is a top perspective view of the second shell of the annular shell shown in Fig. 5;
  • Fig. 10 is a bottom perspective view of the second shell of the annular shell shown in Fig. 5;
  • Fig. 11 is a top view of another dual-diaphragm speaker provided in the first embodiment of the present application.
  • FIG. 12 is a schematic diagram of an exploded structure of another dual-diaphragm speaker shown in FIG. 11;
  • Fig. 13 is a schematic cross-sectional structure diagram along M-M line in Fig. 11;
  • FIG. 14 is a schematic cross-sectional structural view of a dual-diaphragm speaker provided in the second embodiment of the present application.
  • FIG. 15 is a schematic cross-sectional structural view of a dual-diaphragm speaker provided in the third embodiment of the present application.
  • Fig. 16 is a top view of another dual-diaphragm speaker shown in Fig. 11 when a cover is provided;
  • FIG. 17 is a schematic cross-sectional structural view along line N-N in FIG. 16 .
  • connection should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , can also be a contradictory connection or an integrated connection; those skilled in the art can understand the specific meanings of the above terms in this application according to specific situations.
  • the target signal may be an audio signal that needs to be played, such as music or voice, sent by a processor or a controller in the earphone to control the speaker.
  • the noise reduction signal refers to the signal that is in antiphase with the noise, and can be offset with the noise, so as to achieve the purpose of noise reduction.
  • the leakage target signal such as more middle and low frequencies of music will affect the sound quality; if the speaker is used for noise reduction, more middle and low frequencies of the noise reduction signal will be leaked, which will lead to active noise reduction of middle and low frequency noise ( active noise canceling, ANC) effect is poor.
  • the above problems can be solved by improving the mid-low frequency sensitivity of the speaker, that is, increasing the mid-low frequency sound waves generated by the speaker, and ensuring that the remaining mid-low frequency sound waves can still meet the use requirements when the mid-low frequency sound waves leak to a certain extent, thereby ensuring sound quality and / or ANC effect.
  • Another solution to increase the area of the diaphragm is the dual-diaphragm speaker, but the dual-diaphragm speaker in the prior art has the problem of mutual influence between the two diaphragms, or it cannot take into account the advantages of small size and good mid-low frequency performance. , that is, the area of the two diaphragms cannot be increased at the same time while ensuring a small volume, so for miniaturized equipment, there is still the problem of poor mid-low frequency sensitivity performance of the speaker.
  • FIG. 1A is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
  • the electronic equipment includes a dual-diaphragm speaker 30, which generally includes an annular casing 1, a magnetic circuit system 2 arranged in the annular casing 1, a first diaphragm 3 and a second diaphragm 5, etc., the magnetic circuit system 2 Divide the space inside the annular housing 1 into a first chamber Q1 and a second chamber Q2 in the axial direction.
  • the magnetic circuit system 2 includes a first magnetic gap C1 and a second magnetic gap C2 arranged at intervals around the central axis (C1 and C2 are not shown in FIG. A magnetic gap C1 inside.
  • the first voice coil (not shown in Figure 1A) connected to the inner surface of the first diaphragm 3 extends into the first magnetic gap C1, and the second voice coil (not shown in Figure 1A) connected to the inner surface of the second diaphragm 5 ) into the second magnetic gap.
  • the side of the first diaphragm 3 facing the first chamber Q1 can form a first front cavity, and the side facing away from the first chamber Q1 can form a first rear cavity; the side of the second diaphragm 5 facing the second chamber Q2 can form a In the second front chamber, the side facing away from the second chamber Q2 can form a second rear chamber.
  • the front cavity and the rear cavity of the two diaphragms of the existing dual-diaphragm speaker are not separated separately.
  • High-frequency sound waves are not easy to short-circuit, while medium- and low-frequency sound waves have long wavelengths and are easy to short-circuit.
  • Short-circuiting will reduce the sound pressure of medium and low frequencies, resulting in Loss of acoustic performance.
  • the existing dual-diaphragm loudspeaker cannot take into account the two advantages of small size and good mid-low frequency performance (both diaphragm areas are large). Two types of dual-diaphragm speakers in the prior art are introduced below.
  • the dual-diaphragm speaker of the prior art solution 1 includes a tweeter and a bass unit, and the diaphragm of the bass unit (equivalent to the second diaphragm 5 in FIG. 1A ) is provided with the sound on the side of the voice coil passing through the second magnetic gap C2 The opening of the sound is superimposed with the tweeter, and its goal is to extend the frequency response of the speaker to high frequencies.
  • the diameter of the tweeter diaphragm (equivalent to the first diaphragm 3 in Figure 1A) cannot be larger than the second magnetic gap opening (if it is larger, it will block the opening) , so that the area of the tweeter diaphragm cannot be increased, so the sensitivity improvement is very limited.
  • the two diaphragms vibrate in opposite directions to produce sound, relying on the cavity structure of the whole machine to guide the sound pressure of the two diaphragms to the sound hole, the goal is to reduce vibration, so that the speaker can Improve the sound effect of the speaker under the premise of large amplitude. Because the diaphragm vibrates in reverse to produce sound, the cavity of the whole machine is required to superimpose the sound wave guides of the two diaphragms, so the space of the whole machine is large, which is not conducive to the realization of product miniaturization, and the scope of application is small.
  • embodiments of the present application provide a dual-diaphragm speaker and electronic equipment including the dual-diaphragm speaker.
  • the dual-diaphragm speaker separates the sound wave transmission paths of the front and rear chambers of the two diaphragms, avoiding an acoustic short circuit, thereby improving the mid- and low-frequency sound waves (including the mid-low frequency of the target signal such as music and/or the mid-low frequency of the noise reduction signal), Higher mid-low frequency sensitivity is achieved; and in the case of a smaller volume, the diaphragm area is larger, which can push more air to form a larger sound pressure, further improving the mid-low frequency sensitivity.
  • the dual-diaphragm speaker of the embodiment of the present application can take into account the two advantages of small size and high sensitivity at medium and low frequencies, and can be used for miniaturization or thinning of electronic equipment such as earphones, mobile phones, notebook computers, tablet computers, stereos, and televisions. Scenarios, for example, HIFI audio playback, mid-bass enhancement, etc.
  • the rear cavity of the two diaphragms of the dual-diaphragm speaker is conveniently connected to the atmosphere, which can increase the amplitude of the diaphragm, generate a larger sound pressure, and better improve the sensitivity of the middle and low frequencies.
  • the electronic device may include a first structure 10 , a sound pipe 20 and a dual-diaphragm speaker 30 .
  • the first structure 10 may be a battery or other structures of an electronic device, such as a casing, a circuit board, and the like.
  • the first diaphragm 3 and the magnetic circuit system 2 of the dual-diaphragm speaker 30 form a first front chamber F1
  • the first structure 10 of the electronic device is on the side of the first diaphragm 3 away from the magnetic circuit system 2 and the first diaphragm 3 are connected to form the first rear chamber B1.
  • the second diaphragm 5 of the dual-diaphragm speaker and the magnetic circuit system 2 form a second rear cavity B2.
  • the sound pipe 20 of the electronic device is connected to the second diaphragm 5 on the side of the second diaphragm 5 away from the magnetic circuit system 2 to form a second front cavity F2.
  • the first front chamber F1 communicates with the second front chamber F2 through a first pipe P1 located in at least one of the magnetic circuit system 2 and the annular casing 1 .
  • the first pipe P1 is located on at least one of the outer peripheral wall of the magnetic circuit system 2 and the inner wall of the annular housing 1 or within the shell wall of the annular housing 1 .
  • one end of the first channel P1 communicates with the first front cavity F1
  • the port K1 at the other end is located on the end face of the second end of the annular housing 1
  • the second back chamber B2 may be closed or communicated with the first back chamber B1 or the atmosphere through at least one second passage P2.
  • One end of the second passage P2 communicates with the second rear cavity B2, and the port K2 at the other end can be located on the outer rear wall of the annular housing 1 or at the end surface of the first end of the annular housing 1 .
  • the first rear chamber B1 may be closed or communicated with the atmosphere.
  • the first front cavity F1 of the first diaphragm 3 is isolated from the first rear cavity B1
  • the second front cavity F2 of the second diaphragm 5 is isolated from the second rear cavity B2
  • the chamber B2 is not connected to the first front chamber F1, so that the two diaphragms do not affect each other; the two diaphragms vibrate together to produce sound, the first front chamber F1 and the second front chamber F2 can be connected through the first channel P1, and the first front chamber F1 and the second front chamber F2 can be communicated through the first channel P1.
  • the two-channel P2 can connect the first rear cavity B1 and the second rear cavity B2, thereby achieving sound pressure superposition, improving the mid-low frequency sensitivity of the speaker, and enhancing the mid-low frequency sound waves of the noise reduction signal and/or the target signal, providing consumers with Provide better active noise cancellation and/or sound quality experience.
  • the first channel P1 is located on the inner side and the inside of the annular shell near the annular shell 1, so that the area of the first diaphragm 3 and the second diaphragm 5 is larger, which improves the performance of the middle and low frequencies, and does not need to set a separate pipe outside the annular shell 1
  • the two front cavities are connected to effectively reduce the volume of the speaker, which is conducive to the miniaturization of electronic equipment, thereby improving the wearing comfort, battery life and other performances of the product.
  • FIG. 1B is a graph of the sound pressure level of the electronic device in FIG. 1A after the sound waves of the two diaphragms are superimposed.
  • " ⁇ 12 unit” represents the sound pressure level curve of a diaphragm with a diameter of 12mm, that is, the curve at the bottom; curve. It can be seen from Figure 1B that after the two diaphragms are superimposed, the middle and low frequency sound waves and high frequency sound waves are both improved.
  • the structure of the dual-diaphragm speaker in the electronic device according to the embodiment of the present application will be introduced below.
  • the dual-diaphragm loudspeaker in the embodiment of the present application has the characteristics of high sensitivity, high bandwidth, and small occupied space.
  • the two diaphragms vibrate in the same direction to produce sound, using the magnetic circuit system 2 and the annular shell 1 to form a channel, and at the same time make the area of the first diaphragm diaphragm 3 and the second diaphragm 5 larger, so that the sound pressure can achieve a superimposed effect, ensuring a higher In the case of small size, the mid-low frequency sensitivity of the speaker is improved, so that the ANC performance and/or sound quality experience of the semi-open architecture such as earphones and other electronic devices using the speaker is better.
  • the second rear chamber B2 can be closed, and at this time there is no second channel P2, only the first channel P1.
  • the second back chamber B2 may communicate with the first back chamber B1 or the atmosphere through at least one second passage P2. At this time, there may be both the first passage P1 and the second passage P2, and the first passage P1 and the second passage P2 is not connected.
  • the dual-diaphragm loudspeaker has both the first channel P1 and the second channel P2 as an example for introduction.
  • the port K1 of the first channel P1 may be provided with a first damping cloth for sealing.
  • a second damping cloth for sealing may be provided at the port K2 of the second channel P2.
  • Setting damping cloth can prevent foreign matter from entering on the one hand, and on the other hand, it can also adjust the acoustic performance such as frequency response curve, phase curve and distortion curve to a certain extent.
  • the specific structures of the port K1 and the port K2 can have multiple choices, which can be a whole opening, or can be composed of multiple small openings. a small opening.
  • the dual-diaphragm speaker may be provided with more than two first channels P1 , and the two or more first channels P1 are arranged at intervals along the circumferential direction of the annular housing 1 .
  • the dual-diaphragm speaker can be provided with more than two second channels P2, and the two or more second channels P2 are arranged at intervals along the circumferential direction of the annular shell 1 . In this way, the channel arrangement is more uniform, the sound is better, and the force of the annular shell 1 is relatively balanced.
  • the entire outer peripheral wall of the magnetic circuit system 2 can be sealingly connected with the entire inner peripheral wall of the annular housing 1
  • the first channel P1 can include a first through hole provided on the magnetic circuit system 2 or the annular housing 1 . That is, a first through hole can be provided inside the shell wall of the annular housing 1, or a first through hole can be provided on the magnetic circuit system 2. One end of the first through hole communicates with the first front cavity F1, and the other end extends to the bottom of the annular housing 1. at the end face of the second end.
  • the second channel P2 may include a second through hole provided on the magnetic circuit system 2 or the annular casing 1 .
  • a second through hole can be provided inside the shell wall of the annular housing 1, or a second through hole can be provided on the magnetic circuit system 2, one end of the second through hole communicates with the second back cavity B2, and the other end extends to the bottom of the annular housing 1.
  • the end face of the first end extends to the outer peripheral wall of the annular housing 1 .
  • a first annular boss L1 may be provided on the inner wall of the first end of the annular housing 1
  • the magnetic circuit system 2 is in sealing connection with the first annular boss L1 on the side of the first annular boss L1 away from the first diaphragm 3 .
  • a second annular boss L2 may be provided on the inner wall of the second end of the annular housing 1 , and the magnetic circuit system 2 is in sealing connection with the second annular boss L2 on the side of the second annular boss L2 away from the second diaphragm 5 .
  • the first passage P1 may include a first slot N1 (see FIG. 3 or FIG. 12 to be described below) provided on at least one of the inner wall of the annular housing 1 and the outer peripheral wall of the magnetic circuit system 2, The sealing contact between the inner wall of the annular housing 1 and the outer peripheral wall of the magnetic circuit system 2 can form a first channel P1 at the first slot N1.
  • the first slot N1 can only be provided on the inner wall of the annular housing 1, and the outer peripheral wall of the magnetic circuit system 2 corresponding to the first slot N1 can form the first channel P1 with the first slot N1; or, only The first slot N1 is set on the magnetic circuit system 2, and the inner wall corresponding to the first slot N1 of the annular shell 1 and the first slot N1 can form the first channel P1; or, the outer wall of the magnetic circuit system 2 and the annular First slots N1 are provided on the inner wall of the housing 1 , and the magnetic circuit system 2 and the two first slots N1 on the annular housing 1 together form a first channel P1 .
  • the second passage P2 may include a second slot N2 (see FIG. 3 or FIG.
  • Fig. 2 is a perspective view of a dual-diaphragm speaker provided in the first embodiment of the present application.
  • FIG. 3 is a schematic diagram of an exploded structure of the dual-diaphragm speaker shown in FIG. 2 .
  • the dual-diaphragm loudspeaker includes an annular shell 1 , a magnetic circuit system 2 , a first diaphragm 3 , a first voice coil 4 , a second diaphragm 5 and a second voice coil 6 .
  • the magnetic circuit system 2 may include a first magnetic conductor 21 , a first magnet 22 , a second magnetic conductor 23 , a second magnet 24 and a third magnetic conductor 25 .
  • FIG. 4 is a top view of the dual-diaphragm speaker shown in FIG. 2 .
  • FIG. 5 is a schematic cross-sectional structure diagram along line V-V in FIG. 4 .
  • the magnetic circuit system 2 is arranged in the annular housing 1 and divides the space in the annular housing 1 into a first chamber Q1 and a second chamber Q2 along the direction of the central axis of the annular housing 1 .
  • the first diaphragm 3 is arranged at the first end of the annular casing 1 to form a first front cavity F1 with the first chamber Q1, and is used to communicate with the first component such as
  • the above-mentioned first structure 10 of the electronic device forms the first rear cavity B1.
  • the first voice coil 4 is disposed in the first front cavity F1, one end of the first voice coil 4 is connected to the first diaphragm 3 and the other end extends into the first magnetic gap C1.
  • the second diaphragm 5 is arranged at the second end of the annular housing 1 to form a second rear cavity B2 with the second chamber Q2, and is used to communicate with second components such as The above-mentioned sound output duct 20 of the electronic device forms the second front chamber F2, and the second rear chamber B2 is not connected to the first front chamber F1.
  • the second voice coil 6 is disposed in the second rear cavity B2, one end of the second voice coil 6 is connected to the second diaphragm 5 and the other end extends into the second magnetic gap C2.
  • first voice coil 3 can be connected with the first diaphragm 3 by bonding
  • second voice coil 6 can be connected with the second diaphragm 5 by bonding.
  • the first diaphragm 3 and the second diaphragm 5 can be installed by bonding.
  • first end of the annular casing 1 can be provided with the first annular boss L1
  • second end of the annular casing 1 can be provided with the second annular boss L2, which can be divided into the following four according to the situation that the annular boss is set on the annular casing 1. options:
  • the outer peripheral wall of the magnetic circuit system 2 is in sealing connection with the inner wall of the annular housing 1, and the outer peripheral edge of the second diaphragm 5 is in sealing connection with the magnetic circuit system 2.
  • the first slot N1 on the outer peripheral wall of the magnetic circuit system 2 is in sealing connection with the entire end face of the first end of the annular shell 1, and the first slot N1 extends from the first front cavity F1 to At the end face of the second end of the annular casing 1 .
  • the first diaphragm 3 is in sealing connection with the magnetic circuit system 2, and the magnetic circuit system 2 is provided with a first notch E1 communicating with the front cavity F1, the first channel P1 also includes a first notch E1, and the first slot N1 is formed from the first notch E1.
  • a notch E1 extends to the end face of the second end of the annular housing 1 .
  • the second back chamber B2 can communicate with the first back chamber B1 or the atmosphere through the second passage P2, and the magnetic circuit system 2 is provided with a second gap E2 communicating with the second back chamber B2, and the second passage P2 includes a port K2 , the second notch E2 and the second slot N2 arranged on the inner wall of the annular housing 1 and/or the outer peripheral wall of the magnetic circuit system 2, the port K2 is arranged on the outer peripheral wall of the annular housing 1, and the second slot N2 from The second gap E2 extends to the port K2.
  • a first annular boss L1 is provided on the inner wall of the first end of the annular housing 1, the first diaphragm 3 is sealed and connected to the first annular boss L1, and the magnetic circuit system 2 is connected to the first annular boss L1.
  • the outer peripheral wall of the magnetic circuit system 2 is in sealing connection with the inner wall of the annular housing 1, and the outer peripheral edge of the second diaphragm 5 is in sealing connection with the magnetic circuit system 2;
  • the first annular boss L1 At least one of the magnetic circuit system 2 is provided with a first gap E1 communicating with the first front chamber F1, and the first channel P1 includes the first gap E1 and the inner wall of the annular shell 1 and/or the magnetic circuit system 2.
  • the first slot N1 on the outer peripheral wall extends from the first notch E1 to the end surface of the second end of the annular housing 1 .
  • the second back chamber B2 can communicate with the first back chamber B1 or the atmosphere through the second passage P2, and the magnetic circuit system 2 is provided with a second gap E2 communicating with the second back chamber B2, and the second passage P2 includes a port K2 , the second notch E2 and the second slot N2 arranged on the inner wall of the annular housing 1 and/or the outer peripheral wall of the magnetic circuit system 2, the port K2 is arranged on the outer peripheral wall of the annular housing 1, and the second slot N2 starts from the second The second notch E2 extends to the port K2.
  • the first annular boss L1 includes at least one first arc segment, and the first arc segment is provided on the inner wall of the first end of the annular shell 1 where the first slot N1 is not provided. That is to say, in order to facilitate the communication between the first slot N1 and the first front cavity F1, the first annular boss L1 may not be provided at the first slot N1, and the first annular boss L1 does not surround the entire inner peripheral wall of the annular housing 1 set up.
  • the first annular boss L1 may include a first arc segment, and the two ends of the first arc segment are spaced at the first slot N1, so that The first slot N1 communicates with the first front cavity F1; when the annular housing 1 is provided with two first slots N1, the first annular boss L1 may include two first arc segments, two first arc segments The shape segments are arranged at intervals at the first slot N1, so that the first slot N1 communicates with the first front chamber F1; when the annular shell 1 is provided with three first slots N1, the first annular boss L1 can include three two first arc-shaped segments, and two adjacent ones of the three first arc-shaped segments are arranged at intervals at the first slot N1, so that the first slot N1 communicates with the first front cavity F1, as shown in the figure to be introduced below As shown in FIG. 7 and FIG. 8 , the first annular boss L1 includes three first arc segments along the circumferential direction of the annular housing 1 .
  • the third solution the first annular boss L1 is not provided on the annular shell 1, but the second annular boss L2 is provided
  • a second annular boss L2 is provided on the inner wall of the second end of the annular housing 1, the second diaphragm 5 is sealed and connected to the second annular boss L2, and the magnetic circuit system 2 is connected to the second annular boss
  • the first channel P1 includes a first slot N1 arranged on the inner wall of the annular shell 1 and/or the outer peripheral wall of the magnetic circuit system 2, wherein: the first diaphragm 3 and the annular The entire end surface of the first end of the housing 1 is sealed and connected, the first slot N1 extends from the first front chamber F1 to the end surface of the second end of the annular housing 1 and runs through the second annular boss L2; or, the first diaphragm 3 and The magnetic circuit system 2 is sealed and connected.
  • the magnetic circuit system 2 is provided with a first gap E1 communicating with the front chamber F1.
  • the first channel P1 also includes a first gap E1.
  • the first slot N1 extends from the first gap E1 to the annular shell 1. at the end face of the second end of .
  • the second back chamber B2 communicates with the first back chamber B1 or the atmosphere through the second passage P2, and at least one of the second annular boss L2 and the magnetic circuit system 2 is provided with a The second notch E2, wherein: the second channel P2 includes a port K2, a second notch E2 and a second slot N2 arranged on the inner wall of the annular casing 1 and/or the outer peripheral wall of the magnetic circuit system 2, and the port K2 is arranged on the annular On the peripheral wall of the housing 1 , the second slot N2 extends from the second notch E2 to the port K2.
  • a first annular boss L1 is provided on the inner wall of the first end of the annular housing 1
  • a second annular boss L2 is provided on the inner wall of the second end of the annular housing 1
  • the magnetic circuit system 2 is connected to the first annular boss L1.
  • the outer peripheral wall of the magnetic circuit system 2 is in sealing connection with the inner wall of the annular housing 1, and the outer peripheral edge of the first diaphragm 3 is in sealing connection with the first annular boss L1; the second The outer peripheral edge of the second diaphragm 5 is in sealing connection with the second annular boss L2; at least one of the first annular boss L1 and the magnetic circuit system 2 is provided with a first gap E1 communicating with the first front cavity F1, the first The channel P1 includes a first notch E1 and a first slot N1 arranged on the inner wall of the annular housing 1 and/or the outer peripheral wall of the magnetic circuit system 2, and the first slot N1 extends from the first notch E1 to the second slot of the annular housing 1. The end surfaces of the two ends pass through the second annular boss L2.
  • the second back chamber B2 communicates with the first back chamber B1 or the atmosphere through the second passage P2, and at least one of the second annular boss L2 and the magnetic circuit system 2 is provided with a The second notch E2, wherein: the second channel P2 includes a port K2, a second notch E2 and a second slot N2 arranged on the inner wall of the annular casing 1 and/or the outer peripheral wall of the magnetic circuit system 2, and the port K2 is arranged on the annular On the peripheral wall of the housing 1 , the second slot N2 extends from the second notch E2 to the port K2.
  • the first magnetically permeable member 21 includes a recessed portion 211 and an annular flange 212 surrounding the opening of the recessed portion 211, and the recessed portion 211 includes a bottom wall and The opening of the recessed portion 211 faces the second diaphragm 5 or the first diaphragm 3 around the side wall disposed on the bottom wall.
  • the first magnet 22 and the second magnetic conducting member 23 are stacked in the recessed portion 211 and the first magnet 22 is located between the bottom wall of the recessed portion 211 and the second magnetic conducting member 23.
  • the magnetic circuit system 2 includes spaced arrangements around the central axis. The first magnetic gap C1 and the second magnetic gap C2.
  • first magnet 22 and the second magnetically conductive member 23 are spaced apart from the sidewall of the recessed portion 211 to form a second magnetic gap C2.
  • the second magnet 24 and the third magnetic member 25 are stacked on the annular flange 212 around the recess 211, and the second magnet 24 is located between the annular flange 212 and the third magnetic member 25, the second magnet 24 and the first
  • the three magnetic conductors 25 are spaced apart from the sidewall of the recessed portion 211 to form a first magnetic gap C1.
  • at least one of the annular flange 212 , the second magnet 24 and the third magnetic conducting member 25 is connected to the annular casing 1 .
  • All components of the magnetic circuit system 2 may be concentric.
  • a side of the first magnet 22 facing away from the first magnetic conducting member 21 is adhered to the second magnetic conducting member 23 .
  • a surface of the second magnet 24 facing away from the first magnetic conducting member 21 is adhered to the third magnetic conducting member 25 .
  • the magnetic circuit system 2 composed of the first magnetic conductor 21, the first magnet 22, the second magnetic conductor 23, the second magnet 24 and the third magnetic conductor 25 divides the inner space of the annular shell 1 into the first cavity Q1 and the second cavity Q2, and the first cavity Q1 and the second cavity Q2 are not connected.
  • the first voice coil 4 and the second voice coil 6 are coaxially placed in the magnetic gap, one end of the first voice coil 4 is suspended, and one end is bonded to the first diaphragm 3; one end of the second voice coil 6 is suspended, and the other end is connected to the second diaphragm.
  • the membrane 5 is bonded, the outer peripheral edge of the first diaphragm 3 is fixed on the annular casing 1 , and the outer peripheral edge of the second diaphragm 5 is fixed on the annular casing 1 .
  • the sound wave of the first diaphragm 3 close to the voice coil surface (in the first front cavity F1) is exported through the first pipe P1
  • the sound wave of the second diaphragm 5 close to the voice coil surface (in the second rear cavity B2) passes through the second pipe P2 export.
  • the first diaphragm 3 and the second diaphragm 5 emit sound at the same time, and the superposition of sound waves is realized through the conduction of the pipeline, which can realize the expansion of the bandwidth and the enhancement of the mid-bass.
  • the magnetic field lines of the two magnets converge the magnetic force through three magnetically conductive parts to form a closed loop.
  • the two voice coils are coaxially placed in the middle of the magnetic gap.
  • the magnetic circuit system 2 can make the first diaphragm 3 and the second diaphragm 5 shared magnetic circuit. In this way, there is no need to set up two magnetic circuit systems, which can improve the utilization rate of magnetic energy and save space, reduce the volume of the speaker, help to realize the miniaturization of electronic equipment, and make the electronic equipment using the speaker, such as earphones, more comfortable to wear, or can More space is used to install batteries, which helps to improve the battery life of electronic devices.
  • the vibration directions of the first diaphragm 3 and the second diaphragm 5 are the same. Specifically, there may be but not limited to the following two situations:
  • the opposite second magnet 24 and the first magnet 22 are connected coaxially, and the three magnetically conductive parts can play the role of magnetic force convergence, so that the magnetic force lines of the first magnet 22 and the second magnet 24 pass through the convergence of the three magnetically conductive parts Form two closed loops around the first magnetic gap C1 and the second magnetic gap C2 respectively, specifically, the second magnet 24 and the first magnet 22 are magnetized along the axial direction, and the magnetization direction is opposite, for example, the first magnet 22
  • the magnetism along the direction from the second diaphragm 5 to the first diaphragm 3 is that the S pole points to the N pole, and the magnetic N pole of the second magnet 24 along the direction from the second diaphragm 5 to the first diaphragm 3 points to
  • FIG. 6 is a schematic diagram of the flow direction of current in the two voice coils of the magnetic circuit system of the dual-diaphragm speaker shown in FIG. 5 .
  • the magnetism of the first magnet 22 along the central axis direction is opposite to that of the second magnet 24 along the central axis direction, and the current directions in the first voice coil 4 and the second voice coil 6 are opposite, so that the first vibrating The vibration directions of the membrane 3 and the second diaphragm 5 are the same.
  • the output sound pressure level is the highest.
  • the magnetic circuit system 2 of the dual-diaphragm speaker in the embodiment of the present application can have various structures, as long as it is arranged in the annular casing 1, the space in the annular casing 1 can be divided into different parts along the axial direction.
  • the first chamber Q1 and the second chamber Q2 communicate with each other, and it only needs to have the first magnetic gap C1 and the second magnetic gap C2.
  • FIG. 7 is a top perspective view of the first shell of the annular housing shown in FIG. 5 .
  • Fig. 8 is a bottom perspective view of the first shell of the annular casing shown in Fig. 5 .
  • the annular housing 1 may include a first housing 11 and a second housing 12 arranged along the direction of the central axis, and the first end of the annular housing 1 is the end of the first housing 11 away from the second housing 12. One end, the second end of the annular shell 1 is the end of the second shell 12 away from the first shell 11 .
  • a first annular step T1 is provided on the outside or inside of the end of the first housing 11 away from the second housing 12, and a first annular step T1 is provided on the outer peripheral edge of the first diaphragm 3.
  • the annular installation part A1, the first annular installation part A1 is arranged at the first annular step T1, and realizes the sealing connection between the outer peripheral edge of the first diaphragm 3 and the end surface of the first end of the annular housing 1 .
  • a part of the first slot N1 , the first annular boss L1 , the port K2 and a part of the positioning boss D described below can be disposed on the first housing 11 .
  • FIG. 9 is a top perspective view of the second housing of the annular housing shown in FIG. 5 .
  • FIG. 10 is a bottom perspective view of the second housing of the annular housing shown in FIG. 5 .
  • a second annular step T2 is provided on the outside or inside of the end of the second housing 12 away from the first housing 11, and a second annular step T2 is provided on the outer peripheral edge of the second diaphragm 5.
  • the ring installation part A2 and the second ring installation part A2 are arranged at the second annular step, so as to realize the sealing connection between the outer peripheral edge of the second diaphragm 5 and the end face of the second end of the annular housing 1 .
  • another part of the first slot N1, the second slot N2, the second annular boss L2, and another part of the positioning boss D described below can be arranged on the first shell Body 11.
  • the annular housing 1 can be split into the first housing 11 and the second housing 12, and for the convenience of positioning and installing the first diaphragm 3, the end surface of the first housing 11 can be
  • the first annular step T1 is set, and the first annular mounting part A1 of the first diaphragm 3, such as a steel ring, can be arranged at the first annular step T1, which also makes the seal between the first diaphragm 3 and the first housing 11 The effect is better; in the same way, in order to facilitate the positioning and installation of the second diaphragm 5, a second annular step T2 can be set on the end face of the second housing 12, and the second annular mounting part A2 of the second diaphragm 5, such as a steel ring, can It is arranged at the second annular step T2, so that the sealing effect between the second diaphragm 5 and the second casing 12 is better.
  • the first shell 11 and the second shell 12 can also be made integrally if
  • the outer peripheral wall of the annular housing 1 is provided with a positioning boss D, and the positioning boss D is provided with a plurality of through holes connecting the inner side and the outer side of the annular housing 1, as shown in Figure 3,
  • the first voice coil 4 is provided with a first voice coil wire X1
  • the second voice coil 6 is provided with a second voice coil wire X2
  • the first voice coil wire X1 and the second voice coil wire X2 pass through a plurality of through holes and communicate with each other respectively.
  • the power amplifier device is electrically connected, and the positioning boss D can be spaced apart from at least one port K1 along the circumferential direction of the annular shell 1 .
  • the positioning boss D may be spaced apart from at least one port K2 along the circumferential direction of the annular housing 1 .
  • the positioning boss D is provided to facilitate the positioning and installation of the dual-diaphragm speaker on the electronic device, ensuring that the port K1 and the port K2 correspond to the corresponding positions of the electronic device.
  • the voice coil may include an annular support frame and a multi-turn voice coil wire disposed around the annular support frame.
  • the voice coil may include an annular metal frame and a voice coil wire connected to the annular metal frame.
  • the electrical connection between the voice coil and the power amplifier device can be, but not limited to, the following two methods:
  • the other part exposes the annular shell 1.
  • the first voice coil wire X1 and the second voice coil wire X2 are connected to the metal pad H inside the ring shell 1, and the metal pad H is connected to the external power amplifier device, so that the sound
  • the coil wire does not expose the annular casing 1, which can better protect the voice coil wire and prevent damage to the voice coil wire.
  • the positioning boss D is provided on the outer peripheral wall of the annular shell 1, which can not only play the role of positioning assembly, but also facilitate the connection of the voice coil wire and the external circuit.
  • the second method the voice coil wire can protrude through the through hole at the positioning boss D and be connected to the power amplifier device, which reduces the processing difficulty of the annular shell 1 and is conducive to improving the processing speed and reducing the cost.
  • first slot N1 and the second slot N2 are arranged on the inner wall of the annular housing 1, and the first slot N1 and the second slot N2 can also be arranged on the magnetic circuit system, see below Figures 11-13 will be presented.
  • FIG. 11 is a top view of another dual-diaphragm speaker provided in the first embodiment of the present application.
  • FIG. 12 is a schematic diagram of an exploded structure of the dual-diaphragm speaker shown in FIG. 11 .
  • FIG. 13 is a schematic cross-sectional structural view along line M-M in FIG. 11 .
  • the first slot N1 and the second slot N2 are arranged on the magnetic circuit system 2, as shown in Figure 12, the first slot N1 can be arranged on the second magnet of the magnetic circuit system 2 24 and the third magnetic-conducting member 25, the second slot N2 is located on the first magnetic-conducting member 21, that is, the length of the first slot N2 is relatively short, and can only be provided on the first magnetic-conducting member 21, but there is If necessary, it can also be arranged on the second magnet 24 .
  • FIG. 14 is a schematic cross-sectional structure diagram of a dual-diaphragm speaker provided in the second embodiment of the present application.
  • the structure of the first passage P1 can refer to the above introduction about FIG. A structure is introduced.
  • the first diaphragm 3 is in sealing connection with the magnetic circuit system 2
  • the second passage P2 may include a second notch E2 and be provided on the annular shell
  • the second slot N2 on the inner wall of 1 and/or the outer peripheral wall of the magnetic circuit system 2 , the second slot N2 extends from the second gap E2 to the end surface of the first end of the annular housing 1 .
  • the second channel P2 includes a second notch E2 and is arranged on the inner wall of the annular housing 1 and/or the magnetic circuit system 2
  • the second slot N2 on the outer peripheral wall of the second slot N2 extends from the second notch E2 to the end surface of the first end of the annular shell 1 and passes through the first annular boss L1.
  • the first diaphragm 3 is in sealing connection with the magnetic circuit system 2
  • the second passage P2 may include the The second slot N2 and the second notch E2 are formed on the inner wall and/or the outer peripheral wall of the magnetic circuit system 2 , and the second slot N2 extends from the second notch E2 to the end surface of the first end of the annular housing 1 .
  • the second channel P2 includes a second notch E2 and the inner wall of the annular casing 1 and/or the outer peripheral wall of the magnetic circuit system 2
  • the second slot N2 extends from the second notch E2 to the end surface of the first end of the annular shell 1 and passes through the second annular boss L2.
  • a better mid-low frequency noise reduction effect is achieved and/or the mid-low frequency of the target signal is enhanced; moreover, the first front cavity and the second front cavity are communicated through the first channel located inside or inside the annular shell, which facilitates communication with electronic equipment Compared with the scheme of connecting the first front chamber and the second front chamber with pipes outside the annular shell, it can reduce the volume and facilitate the realization of miniaturization; at the same time, because the diaphragm can be arranged on the On the end face, the area of the diaphragm is larger, more air is pushed, and the sound pressure is higher, which can further improve the mid-low frequency sensitivity of the speaker.
  • FIG. 15 is a schematic cross-sectional structure diagram of a dual-diaphragm speaker provided in a third embodiment of the present application.
  • the port K1 is located on the outer peripheral wall of the annular housing 1
  • the port K2 is located on the outer peripheral wall of the annular housing 1 .
  • the inner wall of the annular housing 1 is provided with at least one first slot N1, the first slot N1 extends from the first front chamber F1 to the port K1, and communicates with the port K1; the first diaphragm 3 seals and covers the ring housing 1 The entire end face of the first end.
  • At least one second slot N2 is provided on the inner wall of the annular housing 1, and the second slot N2 extends from the second rear cavity B2 to the port K2 and communicates with the port K2; the second diaphragm 5 seals the ring housing 1 The entire face of the second end.
  • Part of the outer peripheral wall of the magnetic circuit system 2 is in sealing connection with the inner wall of the annular housing 1, the outer peripheral wall of the magnetic circuit system 2 corresponding to the first slot N1 forms a first channel P1 with the first slot N1, and the corresponding first channel P1 of the magnetic circuit system 2
  • the peripheral wall of the second slot N2 and the second slot N2 form a second channel P2.
  • first slot N1 and the second slot N2 can also be arranged only on the outer peripheral wall of the magnetic circuit system 2, the first slot N1 cooperates with the inner wall of the annular shell 1 to form the first channel P1, and the second slot N2 cooperates with the inner wall of the annular shell 1 to form the second channel P2.
  • slots may be provided on the outer peripheral wall of the magnetic circuit system 2 and the inner wall of the annular housing 1 to form the first passage P1 and the second passage P2.
  • the port K1 may be provided on the first housing 11 and/or on the second housing 12 . That is, the port K1 can be provided only on the first housing 11 , or only on the second housing 12 , or a part of it can be provided on the first housing 11 and another part can be provided on the second housing 12 .
  • the port K2 may be provided on the first housing 11 and/or on the second housing. That is, the port K2 can be provided only on the first housing 11 , or only on the second housing 12 , or part of it can be provided on the first housing 11 and the other part can be provided on the second housing 12 .
  • the positions of the two or more ports K1 along the direction of the central axis may be the same or different.
  • the positions of the two or more ports K2 along the direction of the central axis may be the same or different.
  • the port K2 is taken as an example for description below.
  • one of more than two ports K2 may be located on the end surface of the first housing 11 that is in contact with the second housing 12, for example, the end surface of the first housing 11 A slot is provided, and the slot matches the end face of the second housing 12 to form the port K2; the other of the two or more ports K2 can be located on the end face of the second housing 12 that is in contact with the first housing 11, A slot is provided on the end surface of the second housing 12 , and the port K2 can be formed by matching the slot with the end surface of the first housing 11 .
  • a boss can be provided on the inner wall of the annular housing 1 .
  • the first annular boss L1 is provided on the part where the first slot N1 is not provided; on the inner wall of the second end of the annular housing 1, the second slot N2 is not provided.
  • the magnetic circuit system 2 is located between the first annular boss L1 and the second annular boss L2, and is fixedly connected with the first annular boss L1 and the second annular boss L2.
  • the port K1 and the port K2 are both located on the outer peripheral wall of the annular shell 1, so that the installation surface of the diaphragm, that is, the end face of the annular shell, does not need to reserve a space for setting the port.
  • the membrane 3 can seal the entire opening of the first end of the annular housing 1
  • the second diaphragm 5 can seal the entire opening of the second end of the annular housing 1, so that the first diaphragm 3 and the second diaphragm 5
  • the larger area can push more air and generate more mid- and low-frequency sound waves, which helps to improve the noise reduction effect.
  • the dual-diaphragm speaker needs to cooperate with the structure of the electronic device to form the first rear chamber B1 and the second front chamber F2.
  • the first cover Z1 can also be set on the dual-diaphragm speaker to cooperate with the first diaphragm 3 to form the first rear cavity B1
  • the second cover Z2 can also be set on the dual-diaphragm speaker to cooperate with the second diaphragm.
  • the membrane 5 forms the second front chamber F2.
  • another dual-diaphragm loudspeaker of the first embodiment shown in FIGS. 11-13 is taken as an example for description.
  • FIG. 16 is a top view of another dual-diaphragm speaker shown in FIG. 11 when a cover is provided.
  • FIG. 17 is a schematic cross-sectional structural view along line N-N in FIG. 16 .
  • the dual-diaphragm speaker may further include a first cover Z1 and a second cover Z2 .
  • the first cover Z1 is sealed and connected with the first diaphragm 3 to form the first rear cavity B1.
  • the second cover Z2 is sealed and connected with the second diaphragm 5 as a second component to form a second front cavity F2 , and the first front cavity F1 and the second front cavity F2 of the dual-diaphragm speaker communicate through the first channel 1 .
  • the electronic device on which the dual-diaphragm speaker is installed may include a sound output duct, and the second front chamber F2 of the dual-diaphragm speaker communicates with the sound output duct.
  • the membrane 5 is sealingly connected to form a second front chamber F2, and the first front chamber F1 communicates with the second front chamber F2 through the first channel P1.
  • the first component is the first structure 10 of the electronic equipment on which the dual-diaphragm speaker is installed. That is, the electronic equipment for installing the dual-diaphragm speaker may include a first structure 10 and a sound pipe, and the first structure 10 is connected to the first diaphragm 3 on the side of the first diaphragm 3 of the dual-diaphragm speaker away from the magnetic circuit system 2. connected to form the first rear chamber B1.
  • the second front cavity F2 of the double-diaphragm speaker is connected with the sound pipe of the electronic equipment.
  • the second component is the sound output pipe of the electronic device.
  • the electronic equipment for installing the dual-diaphragm speaker can include a sound pipe 20, and the sound pipe 20 is connected to the second diaphragm 5 on the side of the second diaphragm 5 of the dual-diaphragm speaker away from the magnetic circuit system 2 to form a The second front cavity F2, the first front cavity F1 of the dual-diaphragm speaker communicates with the second front cavity F2 through the first channel P1 on the dual-diaphragm speaker.
  • the two diaphragms of the dual-diaphragm speaker can cooperate with the structure of the electronic device to form the first rear cavity and the second front cavity, since there is no need
  • the cover is set, which can save space, which is conducive to further reducing the volume of electronic equipment or can use the space for other structures, such as using a larger battery to improve battery life; when the dual-diaphragm speaker in the embodiment of the application
  • the first cover Z1 and/or the second cover Z2 are arranged on the top, the corresponding structure of the electronic equipment for installing the dual-diaphragm speaker does not need to be improved to form the first rear cavity and/or the second cavity with the diaphragm of the dual-diaphragm speaker.
  • Front cavity minor structural improvements to electronic equipment.
  • the dual-diaphragm loudspeaker of the embodiment of the present application separates the sound wave transmission paths of the front chamber and the rear chamber of the two diaphragms to avoid acoustic short circuit, and can make the two diaphragms vibrate in the same direction to produce sound.
  • the system and the annular shell form the channel of the cavity, so that the sound pressure can be superimposed, and the mid and low frequencies are enhanced, thereby improving the mid and low frequency sensitivity of the speaker, which can improve the ANC performance under the semi-open architecture and enhance the mid and low frequencies of the target signal.
  • it also has the characteristics of high bandwidth and small footprint, which can improve sound quality and reduce volume, which is conducive to improving user experience.
  • the TWS headphone module cannot take into account the high-frequency extension for the low- and medium-frequency noise reduction performance; it needs to use multiple units, but the multi-unit package takes up too much stacking space, and the utilization efficiency of the magnetic circuit is also low.
  • the loudspeaker of the embodiment of the present application constructs dual loudspeaker unit magnetic circuits that reinforce each other and circulates closed magnetic circuits, and is equipped with dual vibration systems and independent front and rear cavities, which improves the utilization rate of the magnetic circuit, reduces the volume, and increases the area of the diaphragm. Can improve speaker sensitivity and expand bandwidth.
  • the dual-diaphragm speaker of the embodiment of the present application has the advantages of high sensitivity to medium and low frequencies and small size, and can be applied to portable electronic devices such as small earphones, etc., and can be applied to speakers of audio products to realize the playback of music signals, support the realization of high sensitivity, High-bandwidth targets for high-quality music experience.
  • the dual PA of the TWS headset can drive the two diaphragms of the speaker separately, digital frequency division; it can be used for TWS active noise reduction, HIFI music playback, transparent transmission, 3D sound effects and other effects.
  • the low-frequency sensitivity of the dual-diaphragm speaker in the embodiment of the present application can be improved by 8dB;
  • the channel of the cavity is set inside the annular shell, no need to set additional pipelines to connect the two front cavities, and share the magnetic circuit at the same time, which can reduce the overall thickness, so that the volume can be reduced by 32%.

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Abstract

本申请实施例提供一种双振膜扬声器和电子设备。扬声器包括：环形外壳；磁路系统，沿轴向将环形外壳分为第一和第二腔室；第一振膜，设于环形外壳第一端，与第一腔室形成第一前腔，与第一部件形成第一后腔；第一音圈，设于第一前腔内，一端与第一振膜连接另一端伸入第一磁间隙；第二振膜，设于环形外壳第二端，与第二腔室形成第二后腔，与第二部件形成第二前腔，第二后腔与第一前腔不连通；第二音圈，设于第二后腔内，一端与第二振膜连接另一端伸入第二磁间隙；第一前腔通过第一通道与第二前腔连通，第一通道位于磁路系统和环形外壳的至少一者内。本申请实施例的双振膜扬声器体积较小，且能够提升中低频灵敏度。

Description

一种双振膜扬声器和电子设备
本申请要求于2021年07月30日提交中国国家知识产权局、申请号为202110873633.3、申请名称为“一种双振膜扬声器和电子设备”的中国专利申请的优先权，其全部内容通过引用结合在本申请中。
技术领域
本申请涉及电声领域，尤其涉及一种双振膜扬声器和电子设备。
背景技术
入耳式耳机具有密闭隔音好、音质好、不会漏音等优点，但佩戴起来可能会有胀痛感，最重要的是会有听诊器效应(即耳塞线或者单元处受外界碰撞或者空气摩擦，产生的机械波通过耳塞线直接传递到耳道内，产生让人很不愉快的噪声，入耳的线一般硬度较大，有利于传导振动)。而半入耳式耳机因为半开放式架构，无听诊器效应且佩戴舒适，受到大部分消费者喜爱。但是，由于其泄露架构，导致中低频声波(包括目标信号中的中低频信号，和/或降噪信号中的中低频信号)泄露较大，使得半入耳式耳机的中低频性能欠佳。例如，播放音乐时的中低频效果不好，或者，主动降噪(active noise canceling，ANC)功能对于中低频噪声的降噪效果差。
目前，解决此问题的办法是提高扬声器的中低频灵敏度(扬声器灵敏度是指在扬声器输入端加上额定功率为1W的电信号、距离扬声器轴方向1m处所产生的声压级。它体现了电能转换为声能的效率，灵敏度越高，扬声器越容易被功放驱动)。但现有扬声器在实现中低频灵敏度提升的同时会导致体积增大，无法应用于小型化电子设备或节省空间，不利于更好地满足用户需求。因此，如何实现一种中低频灵敏度高且小型化的扬声器和耳机，成为当前亟待解决的问题。
发明内容
本申请实施例提供一种双振膜扬声器和电子设备，将两个振膜的前腔和后腔的声波传递路径各自分隔，避免声短路，同时还能够在保证小体积的情况下进一步实现声波叠加和较大声压，增强中、低频的性能表现，进一步提升了中低频灵敏度。
为此，本申请的实施例采用如下技术方案：
第一方面，本申请实施例提供一种双振膜扬声器，双振膜扬声器包括：环形外壳；磁路系统，设置在所述环形外壳内并沿所述环形外壳的中心轴线方向将所述环形外壳内的空间划分为第一腔室和第二腔室，所述磁路系统包括围绕所述中心轴线间隔设置的第一磁间隙和第二磁间隙；第一振膜，设置在所述环形外壳的第一端，以与所述第一腔室形成第一前腔，并用于在所述第一振膜的远离所述磁路系统的侧面与第一部件形成第一后腔；第一音圈，设置在所述第一前腔内，所述第一音圈的一端与所述第一振膜连接且另一端伸入所述第一磁间隙；第二振膜，设置在所述环形外壳的第二端， 以与所述第二腔室形成第二后腔，并用于在所述第二振膜的远离所述磁路系统的侧面与第二部件形成第二前腔，且所述第二后腔与所述第一前腔不连通；第二音圈，设置在所述第二后腔内，所述第二音圈的一端与所述第二振膜连接且另一端伸入所述第二磁间隙；所述第一前腔通过至少一个第一通道与所述第二前腔连通，所述第一通道位于所述磁路系统和所述环形外壳的至少一者内；所述第二后腔封闭；或，所述第二后腔通过至少一个第二通道与所述第一后腔或大气连通。
其中，第一通道可位于磁路系统的外周壁和环形外壳的内壁中的至少一者上或位于外形外壳的壳壁内。
由于高频声波不容易短路，而中、低频声波波长较长容易短路，短路会使中、低频声压降低，造成声学性能损失，本申请实施例将两个振膜的前腔和后腔的声波传递路径各自分隔，能够避免声短路，在进行声波叠加时，可提高中、低频声波(包括目标信号的中低频和/或降噪信号的中低频)，提升了扬声器的中低频灵敏度，实现了更好的中低频降噪效果和/或增强了目标信号的中低频；并且，第一前腔和第二前腔通过位于环形外壳内侧或内部的第一通道实现连通，方便与电子设备的出声管道连接，与在环形外壳的外部设置管道连接第一前腔和第二前腔的方案相比，能够减小体积，有利于实现小型化；同时由于振膜能够设置在环形外壳的端面上，使得振膜的面积较大，推动的空气较多，声压较高，能够进一步提升扬声器的中低频灵敏度。
在一种可能的实现方式中，所述磁路系统的外周壁与所述环形外壳的内壁密封连接，所述第二振膜的外周边缘与所述磁路系统密封连接，所述第一通道包括设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第一开槽，其中：所述第一振膜与所述环形外壳的第一端的整个端面密封连接，所述第一开槽从所述第一前腔延伸至所述环形外壳的第二端的端面处；或，所述第一振膜与所述磁路系统密封连接，所述磁路系统上设置有连通前腔的第一缺口，所述第一通道还包括第一缺口，所述第一开槽从所述第一缺口延伸至所述环形外壳的第二端的端面处。在该实现方式中，第一通道可通过在环形外壳的内壁上设置开槽的方式形成，或通过在磁路系统的外周壁上设置开槽的方式形成，或通过在环形外壳的内壁和磁路系统的外周壁上分别设置开槽的方式形成，此时，第一振膜可与环形外壳或磁路系统密封连接；第二振膜可与磁路系统密封连接。
在一种可能的实现方式中，所述第二后腔通过第二通道与所述第一后腔或大气连通，所述磁路系统上设置有连通所述第二后腔的第二缺口，其中：所述第二通道包括第二端口、所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的至第二开槽，所述第二端口设置在所述环形外壳的外周壁上，所述第二开槽从所述第二缺口延伸至所述第二端口；或，所述第一振膜与所述磁路系统密封连接，所述第二通道包括所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第二开槽，所述第二开槽从所述第二缺口延伸至所述环形外壳第一端的端面处。在该实现方式中，第二后腔可通过第二通道与大气连通时，或者，第二后腔可通过第二通道与第一后腔连通来增大后腔体积，这样可以使相应振膜的振动幅度增大，形成较大的声压，有助于提升扬声器的中低频灵敏度。并且，第二开槽可通过在环形外壳的内壁上设置开槽的方式形成，或通过在磁路系统的外周壁上设置开槽的方式形成，或通过在 环形外壳的内壁和磁路系统的外周壁上分别设置开槽的方式形成。
在一种可能的实现方式中，所述环形外壳的第一端的内壁上设置有第一环形凸台，所述第一振膜与所述第一环形凸台密封连接，所述磁路系统连接于所述第一环形凸台的远离所述第一振膜的侧面，所述磁路系统的外周壁与所述环形外壳的内壁密封连接，所述第二振膜的外周边缘与所述磁路系统密封连接；所述第一环形凸台和所述磁路系统中的至少一者上设置有连通所述第一前腔的第一缺口，所述第一通道包括所述第一缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第一开槽，所述第一开槽从所述第一缺口延伸至所述环形外壳的第二端的端面。在实现方式中，设置第一环形凸台，可方便定位安装磁路系统，并能防止磁路系统沿环形外壳的轴向方向移动。
在一种可能的实现方式中，所述第二后腔通过第二通道与所述第一后腔或大气连通，所述磁路系统上设置有连通所述第二后腔的第二缺口，其中：所述第二通道包括第二端口、所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第二开槽，所述第二端口设置在所述环形外壳的外周壁上，所述第二开槽从所述第二缺口延伸至所述第二端口；或，所述第二通道包括所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第二开槽，所述第二开槽从所述第二缺口延伸至所述环形外壳第一端的端面处并贯穿所述第一环形凸台。在该实现方式中，第二后腔可通过第二通道与大气连通时，或者，第二后腔可通过第二通道与第一后腔连通来增大后腔体积，这样可以使相应振膜的振动幅度增大，形成较大的声压，有助于提升扬声器的中低频灵敏度。
在一种可能的实现方式中，所述环形外壳的第二端的内壁上设置有第二环形凸台，所述第二振膜与所述第二环形凸台密封连接，所述磁路系统连接于所述第二环形凸台的远离所述第二振膜的侧面，所述第一通道包括设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第一开槽，其中：所述第一振膜与所述环形外壳的第一端的整个端面密封连接，所述第一开槽从所述第一前腔延伸至所述环形外壳的第二端的端面并贯穿所述第二环形凸台；或，所述第一振膜与所述磁路系统密封连接，所述磁路系统上设置有连通前腔的第一缺口，所述第一通道还包括第一缺口，所述第一开槽从所述第一缺口延伸至所述环形外壳的第二端的端面处。在实现方式中，设置第二环形凸台，可方便定位安装磁路系统，并能防止磁路系统沿环形外壳的轴向方向移动。
在一种可能的实现方式中，所述第二后腔通过第二通道与所述第一后腔或大气连通，所述第二环形凸台和所述磁路系统中的至少一者上设置有与所述第二后腔连通的第二缺口，其中：所述第二通道包括第二端口、所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第二开槽，所述第二端口设置在所述环形外壳的外周壁上，所述第二开槽从所述第二缺口延伸至所述第二端口；或，所述第一振膜与所述磁路系统密封连接，所述第二通道包括所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第二开槽，所述第二开槽从所述第二缺口延伸至所述环形外壳第一端的端面处。在该实现方式中，第二后腔可通过第二通道与大气连通时，或者，第二后腔可通过第二通道与第一后腔连通来增大后腔体积，这样可以使相应振膜的振动幅度增大，形成较大的声压，有助于提升扬声器的中低频灵敏度。
在一种可能的实现方式中，所述环形外壳的第一端的内壁上设置有第一环形凸台， 所述环形外壳的第二端的内壁上设置有第二环形凸台，所述磁路系统连接于所述第一环形凸台和所述第二环形凸台之间，所述磁路系统的外周壁与所述环形外壳的内壁密封连接，所述第一振膜的外周边缘与所述第一环形凸台密封连接；所述第二振膜的外周边缘与所述第二环形凸台密封连接；所述第一环形凸台和所述磁路系统中的至少一者上设置有连通所述第一前腔的第一缺口，所述第一通道包括所述第一缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第一开槽，所述第一开槽从所述第一缺口延伸至所述环形外壳的第二端的端面并贯穿所述第二环形凸台。在实现方式中，设置第一环形凸台和第二环形凸台，可方便定位安装磁路系统，并能防止磁路系统沿环形外壳的轴向方向移动。
在一种可能的实现方式中，所述第二后腔通过第二通道与所述第一后腔或大气连通，所述第二环形凸台和所述磁路系统中的至少一者上设置有与所述第二后腔连通的第二缺口，其中：所述第二通道包括第二端口、所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第二开槽，所述第二端口设置在所述环形外壳的外周壁上，所述第二开槽从所述第二缺口延伸至所述第二端口；或，所述第二通道包括所述第二缺口和设置在环形外壳的内壁和/或所述磁路系统的外周壁上的第二开槽，所述第二开槽从所述第二缺口延伸至所述环形外壳第一端的端面处并贯穿所述第一环形凸台。在该实现方式中，第二后腔可通过第二通道与大气连通时，或者，第二后腔可通过第二通道与第一后腔连通来增大后腔体积，这样可以使相应振膜的振动幅度增大，形成较大的声压，有助于提升扬声器的中低频灵敏度。
在一种可能的实现方式中，所述磁路系统的外周壁与所述环形外壳的内周壁密封连接，所述第一通道包括设置在所述磁路系统或所述环形外壳上的第一通孔，所述第一通孔的一端连通所述第一前腔，另一端延伸至所述环形外壳的第二端的端面处。在该实现方式中，第一通道可通过在环形外壳的壳壁上设置通孔的方式形成，或通过在磁路系统上设置通孔的方式形成，此时，第一振膜可与环形外壳或磁路系统密封连接；第二振膜可与环形外壳或磁路系统密封连接。
在一种可能的实现方式中，所述第二后腔通过第二通道与所述第一后腔或大气连通，所述磁路系统的外周壁与所述环形外壳的内周壁密封连接，所述第二通道包括设置在所述磁路系统或所述环形外壳上的第二通孔，所述第二通孔的第一端连通所述第二后腔，另一端延伸至所述环形外壳的第一端的端面处或延伸至所述环形外壳的外周壁处。在该实现方式中，第二通道可通过在环形外壳的壳壁上设置通孔的方式形成，或通过在磁路系统上设置通孔的方式形成，此时，第一振膜可与环形外壳或磁路系统密封连接；第二振膜可与环形外壳或磁路系统密封连接。
在一种可能的实现方式中，所述环形外壳的第一端的内壁上设置有第一环形凸台，所述磁路系统在所述第一环形凸台的远离第一振膜的侧面与所述第一环形凸台密封连接；和/或，所述环形外壳的第二端的内壁上设置有第二环形凸台，所述磁路系统在所述第二环形凸台的远离第二振膜的侧面与所述第二环形凸台密封连接。在实现方式中，设置第一环形凸台和第二环形凸台，可方便定位安装磁路系统，并能防止磁路系统沿环形外壳的轴向方向移动。此时，第一振膜可与第一环形凸台密封连接；第二振膜可与第二环形凸台密封连接。
在一种可能的实现方式中，所述双振膜扬声器设置有两个以上所述第一通道，两个以上所述第一通道沿着所述环形外壳的周向方向间隔设置。这样使得第一通道设置比较均匀，发声较好，并且使环形外壳的受力比较平衡。
在一种可能的实现方式中，所述双振膜扬声器设置有两个以上所述第二通道，两个以上所述第二通道沿着所述环形外壳的周向方向间隔设置。这样使得第二通道设置比较均匀，发声较好，并且使环形外壳的受力比较平衡。
在一种可能的实现方式中，所述环形外壳的外周壁上设置有定位凸台，所述定位凸台上设置有连通所述环形外壳的内侧和外侧的多个通孔，所述第一音圈上设置有第一音圈线，所述第二音圈上设置有第二音圈线，所述第一音圈线和所述第二音圈线分别通过所述多个通孔与功放装置电连接，所述定位凸台与所述至少一个第一通道或与所述至少一个第二通道沿着所述环形外壳的周向方向间隔设置。在该实现方式中，定位凸台可用于将双振膜扬声器定位安装至电子设备，并且在定位凸台处可设置使音圈线与外界电路连通的结构，如连通环形外壳内侧和外侧的通孔或者内嵌金属焊盘，这样音圈线可穿过通孔与外界电路连接，或者音圈线可在环形外壳内与金属焊盘连接，金属焊盘再与外界电路连接。另外，定位凸台与通道沿环形外壳的周向方向间隔设置，使声波传导更加均匀，结构设计更加合理，受力更加均衡。
在一种可能的实现方式中，所述环形外壳包括沿所述中心轴线方向排列的第一壳体和第二壳体，其中：所述第一壳体的远离所述第二壳体的一端的端面设置有第一环形台阶，所述第一振膜的外周边缘设置有第一环形安装部，所述第一环形安装部设置在所述第一环形台阶处，实现所述第一振膜的外周边缘与所述环形外壳的第一端的端面密封连接；和/或，所述第二壳体的远离所述第一壳体的一端的端面设置有第二环形台阶，所述第二振膜的外周边缘设置有第二环安装部，所述第二环安装部设置在所述第二环形台阶处，实现所述第二振膜的外周边缘与所述环形外壳的第二端的端面密封连接。在该实现方式中，为了方便安装和制造，可将环形外壳可拆分为第一壳体和第二壳体，并且为了方便定位安装第一振膜，可在第一壳体的端面的内侧或外侧上设置第一环形台阶，第一振膜的第一环形安装部如钢圈可设置在第一环形台阶处，这样也使得第一振膜和第一壳体之间的密封效果较好；同理，为了方便定位安装第二振膜，可在第二壳体的端面的内侧或外侧上设置第二环形台阶，第二振膜的第二环形安装部如钢圈可设置在第二环形台阶处，使得第二振膜和第二壳体之间的密封效果较好。可以理解的是，在满足工作要求和加工条件的情况下，第一壳体和第二壳体也可以一体制成。
在一种可能的实现方式中，所述第一音圈和所述第二音圈通交流电时，所述第一振膜和所述第二振膜的振动方向相同。这样能够实现声波叠加，形成较大的声压，进而提升中低频灵敏度。
在一种可能的实现方式中，所述第一部件为安装所述双振膜扬声器的电子设备的第一结构；所述第二部件为所述电子设备的出声管道。也就是说，双振膜扬声器可以配合电子设备的第一结构形成第一后腔，并配合电子设备的出声管道形成第二前腔，这样双振膜扬声器无需设置单独的盖体形成第一后腔和第二前腔，能够减小体积，有利于实现产品小型化，并且由于出声管道与双振膜扬声器形成了第二前腔，这样方便 将振膜产生的声波导入出声管道。
在一种可能的实现方式中，所述的双振膜扬声器还包括：第一盖体，所述第一盖体作为所述第一部件与所述第一振膜密封连接，以形成所述第一后腔；第二盖体，所述第二盖体作为第二部件与所述第二振膜密封连接，以形成所述第二前腔，所述第二前腔用于与电子设备的出声管道连通。其中，第一后腔可以封闭，也可与大气连通。由于双振膜扬声器设置有第一盖体和第二盖体，第一盖体与第一振膜密封连接，形成了第一后腔，第二盖体与第二振膜密封连接，形成了第二前腔，这样无需借助电子设备的结构形成第一后腔和第二前腔，对电子设备的结构改进较小，使得该双振膜扬声器的适用范围较大，能够用于更多类型的已有电子设备。
在一种可能的实现方式中，所述第一部件为安装所述双振膜扬声器的电子设备的第一结构；所述的双振膜扬声器还包括：第二盖体，所述第二盖体作为所述第二部件与所述第二振膜密封连接，以形成所述第二前腔，所述第二前腔用于与所述电子设备的出声管道连通。由于双振膜扬声器设置有第二盖体，第二盖体与第二振膜密封连接，形成了第二前腔，电子设备的第一结构可与第一振膜形成第一后腔，这样无需借助电子设备的结构形成第二前腔，对电子设备的结构改进较小。
在一种可能的实现方式中，所述第二部件为电子设备的出声管道；所述的双振膜扬声器还包括：第一盖体，所述第一盖体作为所述第一部件在所述第一振膜的远离所述磁路系统的侧面与所述第一振膜密封连接，以形成所述第一后腔。其中，第一后腔可以封闭，也可与大气连通。由于双振膜扬声器设置有第一盖体，第一盖体与第一振膜密封连接，形成了第一后腔，这样无需借助电子设备的结构形成第一后腔，对电子设备的结构改进较小，并且由于电子设备的出声管道与双振膜扬声器的第二振膜形成了第二前腔，这样方便将两个振膜产生的声波导入出声管道。
第二方面，本申请实施例提供一种电子设备，所述电子设备包括：上述第一方面提供的双振膜扬声器；作为第一部件的第一结构，在所述双振膜扬声器的第一振膜的远离所述磁路系统的侧面与所述第一振膜连接，以形成第一后腔；作为第二部件的出声管道，在所述双振膜扬声器的第二振膜的远离所述磁路系统的侧面与所述第二振膜连接，以形成第二前腔。其中，第一后腔可以封闭，也可与大气连通。
第三方面，本申请实施例提供一种电子设备，所述电子设备包括出声管道和上述第一方面提供的双振膜扬声器，双振膜扬声器包括第一盖体和第二盖体，所述第一盖体作为所述第一部件与所述第一振膜密封连接，以形成所述第一后腔；所述第二盖体作为所述第二部件与所述第二振膜密封连接，以形成所述第二前腔，所述双振膜扬声器的第二前腔与所述出声管道连通。
第四方面，本申请实施例提供一种电子设备，所述电子设备包括：上述第一方面提供的双振膜扬声器，双振膜扬声器包括第二盖体，所述第二盖体作为所述第二部件与所述第二振膜密封连接，以形成所述第二前腔；作为第一部件的第一结构，在所述双振膜扬声器的第一振膜的远离所述磁路系统的侧面与所述第一振膜连接，以形成第一后腔；出声管道，所述双振膜扬声器的第二前腔与所述出声管道连通。其中，第一后腔可以封闭，也可与大气连通。
第五方面，本申请实施例提供一种电子设备，所述电子设备包括：上述第一方面 提供的双振膜扬声器，双振膜扬声器包括第一盖体，所述第一盖体作为所述第一部件在所述第一振膜的远离所述磁路系统的侧面与所述第一振膜密封连接，以形成所述第一后腔；作为第二部件的出声管道，在所述双振膜扬声器的第二振膜的远离所述磁路系统的侧面与所述第二振膜连接，以形成第二前腔。
本发明的其他特征和优点将在随后的具体实施例部分予以详细说明。
附图说明
下面对实施例或现有技术描述中所需使用的附图作简单地介绍。
图1A为本申请实施例提供的一种电子设备的结构示意图；
图1B为图1A中的电子设备的两个振膜声波叠加后的声压级曲线图；
图2为本申请第一实施例提供的一种双振膜扬声器的立体图；
图3为图2所示的双振膜扬声器的分解结构示意图；
图4为图2所示的双振膜扬声器的俯视图；
图5为图4中沿V-V线的剖视结构示意图；
图6为图5所示的磁路系统的两个音圈中的电流的流动方向的示意图；
图7为图5所示的环形外壳的第一壳体的俯视立体图；
图8为图5所示的环形外壳的第一壳体的仰视立体图；
图9为图5所示的环形外壳的第二壳体的俯视立体图；
图10为图5所示的环形外壳的第二壳体的仰视立体图；
图11为本申请第一实施例提供的另一种双振膜扬声器的俯视图；
图12为图11所示的另一种双振膜扬声器的分解结构示意图；
图13为图11中沿M-M线的剖视结构示意图；
图14为本申请第二实施例提供的双振膜扬声器的剖视结构示意图；
图15为本申请第三实施例提供的双振膜扬声器的剖视结构示意图；
图16为图11所示的另一种双振膜扬声器设置有盖体时的俯视图；
图17为图16中沿N-N线的剖视结构示意图。
具体实施方式
下面将结合本申请实施例中的附图，对本申请实施例中的技术方案进行描述。
在本申请的描述中，术语“中心”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系，仅是为了便于描述本申请和简化描述，而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作，因此不能理解为对本申请的限制。
在本申请的描述中，需要说明的是，除非另有明确的规定和限定，术语“安装”、“相连”、“连接”应做广义理解，例如可以是固定连接，也可以是可拆卸连接，还可以是抵触连接或一体的连接；对于本领域的普通技术人员而言，可以根据具体情况理解上述术语在本申请中的具体含义。
在本说明书的描述中，具体特征、结构、材料或者特点可以在任何的一个或多个 实施例或示例中以适合的方式结合。
诸如半入耳式耳机的电子设备，无听诊器效应且佩戴舒适，受到大部分消费者喜爱，但因其半开放式架构，存在中低频声波(包括目标信号和/或降噪信号)泄露较大的问题。其中，目标信号可以是耳机中的处理器或控制器控制扬声器发出的需要播放的音频信号，例如音乐或语音等。降噪信号是指与噪音反相的信号，能够与噪音抵消，从而实现降噪目的。若扬声器用于播放音乐，泄露目标信号如音乐的中低频较多，则会影响音质；若扬声器用于降噪，泄露降噪信号的中低频较多，会导致中低频噪声的主动降噪(active noise canceling，ANC)效果差。上述问题可通过提高扬声器的中低频灵敏度来解决，即可增加扬声器产生的中低频声波，保证在中低频声波有一定泄露的情况下，剩余的中低频声波仍能够满足使用需求，从而保证音质和/或ANC效果。
现有提高扬声器低频灵敏度的方案有以下两种思路：一是提高扬声器的力系数BL，这通常需要提高磁能密度和增大线圈匝数，但是受限于磁材发展、耳机堆叠空间、高频频宽拓展，力系数的提高也有一定限制；二是增大振膜面积，对于单振膜扬声器来说，这通常需要通过增大扬声器直径来实现。例如对于耳机，为了舒适性，一般设计扬声器的直径在14mm以下。因此对于小型化设备，能够容纳的扬声器的空间有限，振膜面积也会受到限制，不利于较好地提升中低频性能。
另一种增大振膜面积的方案是双振膜扬声器，但现有技术中的双振膜扬声器，两个振膜存在相互影响的问题，或者无法兼顾体积小和中低频性能好两种优点，即在保证较小体积的情况下不能同时增大两个振膜面积，这样对于小型化设备，仍存在扬声器的中低频灵敏度表现能力不佳的问题。
图1A为本申请实施例提供的一种电子设备的结构示意图。如图1A所示，电子设备包括双振膜扬声器30，其一般包括环形外壳1、设置在环形外壳1内的磁路系统2、第一振膜3和第二振膜5等，磁路系统2将环形外壳1内的空间沿轴向方向分为第一腔室Q1和第二腔室Q2。磁路系统2包括围绕中心轴线间隔设置的第一磁间隙C1和第二磁间隙C2(图1A中未示出C1和C2，可参见下面将介绍的图5)，第二磁间隙C2位于第一磁间隙C1内侧。第一振膜3内表面连接的第一音圈(图1A中未示出)伸入第一磁间隙C1，第二振膜5内表面上连接的第二音圈(图1A中未示出)伸入第二磁间隙。第一振膜3朝向第一腔室Q1的侧面可形成第一前腔，背离第一腔室Q1的侧面可形成第一后腔；第二振膜5朝向第二腔室Q2的侧面可形成第二前腔，背离第二腔室Q2的侧面可形成第二后腔。
现有双振膜扬声器的两个振膜的前腔和后腔没有各自分隔，高频声波不容易短路，而中、低频声波波长较长容易短路，短路会使中、低频声压降低，造成声学性能损失。另外，现有双振膜扬声器无法兼顾体积小和中低频性能好(两个振膜面积都较大)两种优点。下面介绍两种现有技术中的双振膜扬声器。
现有技术方案一的双振膜扬声器，包括高音单元和低音单元，低音单元的振膜(相当于图1A中的第二振膜5)设置有音圈一侧的声音通过第二磁间隙C2的开孔出声并与高音单元叠加，其目标是使扬声器的频响往高频延伸。由于低音单元通过第二磁间隙开孔出声，这使得高音单元振膜(相当于图1A中的第一振膜3)的直径不能大于第二磁间隙开孔(若大于会遮挡开孔)，导致高音单元振膜的面积无法增大，这样灵敏 度的提升非常有限。
现有技术方案二的双振膜扬声器，两个振膜反向振动发声，依靠整机腔体结构将两个振膜的声压导向出声孔，其目标是降低振动，使扬声器在有较大振幅前提下提升扬声器的音效。因为振膜反向振动发声，需要整机腔体将两振膜的声波导向叠加，因此需要整机空间较大，不利于实现产品小型化，适用范围较小。
鉴于此，本申请实施例提供一种双振膜扬声器和包括该双振膜扬声器的电子设备。双振膜扬声器将两个振膜各自的前后腔声波传递路径分隔，避免了声短路，从而提高了中、低频声波(包括目标信号如音乐的中低频和/或降噪信号的中低频)，实现了更高的中低频灵敏度；并且在实现较小体积的情况下，使振膜面积较大，能够推动更多空气，形成较大声压，进一步提升中低频灵敏度。也就是说，本申请实施例的双振膜扬声器即能够兼顾体积小和中低频灵敏度高两种优点，可用于耳机、手机、笔记本电脑、平板电脑、音响、电视等电子设备小型化或薄型化场景，例如，HIFI音频播放、中低音增强等。另外，双振膜扬声器的两个振膜的后腔方便与大气导通，能够增大振膜的振幅，产生较大的声压，更好地提升中低频灵敏度。
继续参考图1A，电子设备可包括第一结构10、出声管道20和双振膜扬声器30。其中，第一结构10可以是电子设备的电池或者其他结构，例如外壳、电路板等。双振膜扬声器30的第一振膜3与磁路系统2形成了第一前腔F1，电子设备的第一结构10在第一振膜3的远离磁路系统2的侧面与第一振膜3连接，形成第一后腔B1。双振膜扬声器的第二振膜5与磁路系统2形成第二后腔B2。电子设备的出声管道20在第二振膜5的远离磁路系统2的侧面与第二振膜5连接，形成第二前腔F2。第一前腔F1与第二前腔F2通过位于磁路系统2和环形外壳1的至少一者内的第一管道P1连通。第一管道P1位于磁路系统2的外周壁和环形外壳1的内壁中的至少一者上或位于环形外壳1的壳壁内。在图1A中，第一通道P1的一端连通第一前腔F1，另一端的端口K1位于环形外壳1的第二端的端面上。其中，第二后腔B2可封闭或可通过至少一个第二通道P2与第一后腔B1或大气连通。第二通道P2的一端连通第二后腔B2，另一端的端口K2可位于环形外壳1的外后壁或环形外壳1的第一端的端面处。第一后腔B1可封闭或者可与大气连通。
本申请实施例的电子设备，第一振膜3的第一前腔F1和第一后腔B1隔离，第二振膜5的第二前腔F2和第二后腔B2隔离，且第二后腔B2与第一前腔F1不连通，使得两个振膜相互不影响；两个振膜共同振动发声，通过第一通道P1可将第一前腔F1和第二前腔F2连通，通过第二通道P2可将第一后腔B1和第二后腔B2连通，从而实现声压叠加，提升了扬声器的中低频灵敏度，可增强降噪信号和/或目标信号的中低频声波，为消费者提供更好的主动降噪效果和/或音质体验。同时第一通道P1靠近环形外壳1位于环形外壳的内侧和内部，使得第一振膜3和第二振膜5的面积较大，提升了中低频性能，并且无需在环形外壳1外部设置单独管道连通两个前腔，有效降低了扬声器的体积，有利于实现电子设备的小型化，进而可改善产品的佩戴舒适性、续航能力等其他性能。
图1B为图1A中的电子设备的两个振膜声波叠加后的声压级曲线图。如图1B所示，“φ12单元”表示直径为12mm的振膜的声压级曲线，即位于下方的曲线；“二 合一”表示两个振膜叠加后的声压级曲线，即位于上方的曲线。由图1B可知，两个振膜叠加后的中低频声波和高频声波均有提升。
下面对本申请实施例的电子设备中的双振膜扬声器的结构进行介绍。本申请实施例的双振膜扬声器具有高灵敏度、高频宽、占用空间小等特点。两振膜同向振动发声，利用磁路系统2和环形外壳1构成通道，同时使得第一振膜振膜3和第二振膜5的面积较大，使声压实现叠加效果，在保证较小体积的情况下提升了扬声器的中低频灵敏度，使应用该扬声器的半开放式架构如耳机等电子设备的ANC表现和/或音质体验较好。
需说明的是，本申请实施例的双振膜扬声器，第二后腔B2可封闭，此时没有第二通道P2，仅有第一通道P1。或者，第二后腔B2可通过至少一个第二通道P2与第一后腔B1或大气连通，此时，可同时具有第一通道P1和第二通道P2，且第一通道P1和第二通道P2不连通。下面以双振膜扬声器同时具有第一通道P1和第二通道P2为例进行介绍。
其中，第一通道P1的端口K1处可设置有用于进行封闭的第一阻尼布。第二通道P2的端口K2处可设置有用于进行封闭的第二阻尼布。设置阻尼布，一方面能够防止异物进入，另一方面对声学性能如频率响应曲线、相位曲线和失真曲线也有一定的调整作用。另外，需说明的是，端口K1、端口K2的具体结构可以有多种选择，可以为一个整体开口，也可由多个小开口组成，例如，在端口处设置多孔结构或网状结构等形成多个小开口。
进一步地，双振膜扬声器可设置有两个以上第一通道P1，两个以上第一通道P1沿着环形外壳1的周向方向间隔设置。双振膜扬声器可设置有两个以上第二通道P2，两个以上第二通道P2沿着环形外壳1的周向方向间隔设置。这样使得通道设置比较均匀，发声较好，并且使环形外壳1的受力比较平衡。
另外，磁路系统2的整个外周壁可与环形外壳1的整个内周壁密封连接，第一通道P1可包括设置在磁路系统2或环形外壳1上的第一通孔。即可在环形外壳1的壳壁内部设置第一通孔，或者在磁路系统2上设置第一通孔，第一通孔的一端连通第一前腔F1，另一端延伸至环形外壳1的第二端的端面处。第二通道P2可包括设置在磁路系统2或环形外壳1上的第二通孔。即可在环形外壳1的壳壁内部设置第二通孔，或者在磁路系统2上设置第二通孔，第二通孔的一端连通第二后腔B2，另一端延伸至环形外壳1的第一端的端面处或延伸至环形外壳1的外周壁处。并且，为了方便在环形外壳1内定位安装磁路系统2和防止磁路系统2沿环形外壳1的轴向方向移动，环形外壳1的第一端的内壁上可设置有第一环形凸台L1，磁路系统2在第一环形凸台L1的远离第一振膜3的侧面与第一环形凸台L1密封连接。环形外壳1的第二端的内壁上可设置有第二环形凸台L2，磁路系统2在第二环形凸台L2的远离第二振膜5的侧面与第二环形凸台L2密封连接。
可替代地，第一通道P1可包括设置在环形外壳1的内壁和磁路系统2的外周壁中的至少一者上的第一开槽N1(参见下面将介绍的图3或图12)，环形外壳1的内壁和磁路系统2的外周壁密封接触可在第一开槽N1处形成第一通道P1。也就是说，可仅在环形外壳1的内壁上设置第一开槽N1，磁路系统2对应第一开槽N1的外周壁与 第一开槽N1可形成第一通道P1；或者，可仅在磁路系统2上设置第一开槽N1，环形外壳1的对应第一开槽N1的内壁与第一开槽N1可形成第一通道P1；或者，可在磁路系统2的外壁和环形外壳1的内壁上均设置第一开槽N1，磁路系统2和环形外壳1上的两个第一开槽N1一起形成第一通道P1。同理，第二通道P2可包括设置在环形外壳1的内壁和磁路系统2的外周壁中的至少一者上的第二开槽N2(参见下面将介绍的图3或图12)，环形外壳1的内壁和磁路系统2的外周壁密封接触可在第二开槽N2处形成第二通道P2。
下面以在环形外壳1上单独设置开槽或在磁路系统2上单独设置开槽形成第一通道P1和第二通道P2为例对本申请实施例的双振膜扬声器的具体结构进行介绍。
图2为本申请第一实施例提供的一种双振膜扬声器的立体图。图3为图2所示的双振膜扬声器的分解结构示意图。如图2和图3所示，该双振膜扬声器包括环形外壳1、磁路系统2、第一振膜3、第一音圈4、第二振膜5和第二音圈6。磁路系统2可包括第一导磁件21、第一磁铁22和第二导磁件23、第二磁铁24和第三导磁件25。
图4为图2所示的双振膜扬声器的俯视图。图5为图4中沿V-V线的剖视结构示意图。如图5所示，磁路系统2设置在环形外壳1内并沿环形外壳1的中心轴线方向将环形外壳1内的空间划分为第一腔室Q1和第二腔室Q2。第一振膜3设置在环形外壳1的第一端，以与第一腔室Q1形成第一前腔F1，并用于在第一振膜3的远离磁路系统2的侧面与第一部件如上述提到的电子设备的第一结构10形成第一后腔B1。第一音圈4设置在第一前腔F1内，第一音圈4的一端与第一振膜3连接且另一端伸入第一磁间隙C1。第二振膜5设置在环形外壳1的第二端，以与第二腔室Q2形成第二后腔B2，并用于在第二振膜5的远离磁路系统2的侧面与第二部件如上述提到的电子设备的出声管道20形成第二前腔F2，且第二后腔B2与第一前腔F1不连通。第二音圈6设置在第二后腔B2内，第二音圈6的一端与第二振膜5连接且另一端伸入第二磁间隙C2。其中，第一音圈3可通过粘接方式与第一振膜3连接，第二音圈6可通过粘接方式与第二振膜5连接。第一振膜3和第二振膜5可通过粘接方式安装。
其中，环形外壳1的第一端可设置第一环形凸台L1，环形外壳1的第二端可设置第二环形凸台L2，按照环形外壳1上设置环形凸台的情况可分为以下四种方案：
第一种方案——环形外壳1上未设置第一环形凸台L1和第二环形凸台L2
如图5所示，磁路系统2的外周壁与环形外壳1的内壁密封连接，第二振膜5的外周边缘与磁路系统2密封连接，第一通道P1包括设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第一开槽N1，第一振膜3与环形外壳1的第一端的整个端面密封连接，第一开槽N1从第一前腔F1延伸至环形外壳1的第二端的端面处。或者，第一振膜3与磁路系统2密封连接，磁路系统2上设置有连通前腔F1的第一缺口E1，第一通道P1还包括第一缺口E1，第一开槽N1从第一缺口E1延伸至环形外壳1的第二端的端面处。
进一步地，第二后腔B2可通过第二通道P2与第一后腔B1或大气连通，磁路系统2上设置有连通第二后腔B2的第二缺口E2，第二通道P2包括端口K2、第二缺口E2和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的至第二开槽N2，端口K2设置在环形外壳1的外周壁上，第二开槽N2从第二缺口E2延伸至端口K2。
第二种方案——环形外壳1上设置有第一环形凸台L1，但未设置第二环形凸台L2
如图5所示，环形外壳1的第一端的内壁上设置有第一环形凸台L1，第一振膜3与第一环形凸台L1密封连接，磁路系统2连接于第一环形凸台L1的远离第一振膜3的侧面，磁路系统2的外周壁与环形外壳1的内壁密封连接，第二振膜5的外周边缘与磁路系统2密封连接；第一环形凸台L1和磁路系统2中的至少一者上设置有连通第一前腔F1的第一缺口E1，第一通道P1包括第一缺口E1和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第一开槽N1，第一开槽N1从第一缺口E1延伸至环形外壳1的第二端的端面。
进一步地，第二后腔B2可通过第二通道P2与第一后腔B1或大气连通，磁路系统2上设置有连通第二后腔B2的第二缺口E2，第二通道P2包括端口K2、第二缺口E2和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第二开槽N2，端口K2设置在环形外壳1的外周壁上，第二开槽N2从第二缺口E2延伸至端口K2。
其中，第一环形凸台L1包括至少一个第一弧形段，环形外壳1的第一端的内壁上未设置第一开槽N1的部位设置有第一弧形段。也就是说，为了方便第一开槽N1与第一前腔F1连通，在第一开槽N1处可不设置第一环形凸台L1，第一环形凸台L1没有围绕环形外壳1的整个内周壁设置。当环形外壳1上仅设置有一个第一开槽N1时，第一环形凸台L1可包括一个第一弧形段，该第一弧形段的两端在第一开槽N1处间隔，使第一开槽N1与第一前腔F1连通；当环形外壳1上设置有两个第一开槽N1时，第一环形凸台L1可包括两个第一弧形段，两个第一弧形段在第一开槽N1处间隔设置，使第一开槽N1与第一前腔F1连通；当环形外壳1上设置有三个第一开槽N1时，第一环形凸台L1可包括三个第一弧形段，三个第一弧形段中相邻的两个在第一开槽N1处间隔设置，使第一开槽N1与第一前腔F1连通，如下面将介绍的图7和图8所示，第一环形凸台L1沿着环形外壳1的周向方向包括三个第一弧形段。
第三种方案——环形外壳1上未设置第一环形凸台L1，但设置有第二环形凸台L2
如图5所示，环形外壳1的第二端的内壁上设置有第二环形凸台L2，第二振膜5与第二环形凸台L2密封连接，磁路系统2连接于第二环形凸台L2的远离第二振膜5的侧面，第一通道P1包括设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第一开槽N1，其中：第一振膜3与环形外壳1的第一端的整个端面密封连接，第一开槽N1从第一前腔F1延伸至环形外壳1的第二端的端面并贯穿第二环形凸台L2；或，第一振膜3与磁路系统2密封连接，磁路系统2上设置有连通前腔F1的第一缺口E1，第一通道P1还包括第一缺口E1，第一开槽N1从第一缺口E1延伸至环形外壳1的第二端的端面处。
进一步地，第二后腔B2通过第二通道P2与第一后腔B1或大气连通，第二环形凸台L2和磁路系统2中的至少一者上设置有与第二后腔B2连通的第二缺口E2，其中：第二通道P2包括端口K2、第二缺口E2和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第二开槽N2，端口K2设置在环形外壳1的外周壁上，第二开槽N2从第二缺口E2延伸至端口K2。
第四种方案——环形外壳1上设置第一环形凸台L1和第二环形凸台L2
如图5所示，环形外壳1的第一端的内壁上设置有第一环形凸台L1，环形外壳1的第二端的内壁上设置有第二环形凸台L2，磁路系统2连接于第一环形凸台L1和第二环形凸台L2之间，磁路系统2的外周壁与环形外壳1的内壁密封连接，第一振膜3的外周边缘与第一环形凸台L1密封连接；第二振膜5的外周边缘与第二环形凸台L2密封连接；第一环形凸台L1和磁路系统2中的至少一者上设置有连通第一前腔F1的第一缺口E1，第一通道P1包括第一缺口E1和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第一开槽N1，第一开槽N1从第一缺口E1延伸至环形外壳1的第二端的端面并贯穿第二环形凸台L2。
进一步地，第二后腔B2通过第二通道P2与第一后腔B1或大气连通，第二环形凸台L2和磁路系统2中的至少一者上设置有与第二后腔B2连通的第二缺口E2，其中：第二通道P2包括端口K2、第二缺口E2和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第二开槽N2，端口K2设置在环形外壳1的外周壁上，第二开槽N2从第二缺口E2延伸至端口K2。
另外，在上述四种方案中，如图3和图5所示，第一导磁件21包括凹陷部211和围绕凹陷部211的敞口设置的环形凸缘212，凹陷部211包括底壁和围绕底壁设置的侧壁，凹陷部211的敞口朝向第二振膜5或第一振膜3。第一磁铁22和第二导磁件23层叠设置在凹陷部211内且第一磁铁22位于凹陷部211的底壁和第二导磁件23之间，磁路系统2包括围绕中心轴线间隔设置的第一磁间隙C1和第二磁间隙C2。具体地，第一磁铁22和第二导磁件23与凹陷部211的侧壁间隔设置以形成第二磁间隙C2。第二磁铁24和第三导磁件25围绕凹陷部211层叠设置在环形凸缘212上，且第二磁铁24位于环形凸缘212和第三导磁件25之间，第二磁铁24和第三导磁件25与凹陷部211的侧壁间隔设置以形成第一磁间隙C1。其中，环形凸缘212、第二磁铁24和第三导磁件25中的至少一者与环形外壳1连接。
磁路系统2的所有部件可以是同中心轴线。第一磁铁22背离第一导磁件21的一面粘接第二导磁件23。第二磁铁24背离第一导磁件21的一面粘接第三导磁件25。第一导磁件21、第一磁铁22、第二导磁件23、第二磁铁24和第三导磁件25组成的磁路系统2将环形外壳1的内部空间分为第一腔体Q1和第二腔体Q2，且第一腔体Q1和第二腔体Q2不连通。第一音圈4和第二音圈6同轴放置在磁间隙中，第一音圈4一端悬空，一端与第一振膜3粘接；第二音圈6一端悬空，一端与第二振膜5粘接，第一振膜3的外周边缘固定在环形外壳1上，第二振膜5的外周边缘固定在环形外壳1上。第一振膜3靠近音圈面的声波(第一前腔F1内)通过第一管道P1导出，第二振膜5靠近音圈面的声波(第二后腔B2内)通过第二管道P2导出。第一振膜3和第二振膜5同时发声，经过管道导通实现声波叠加，可以实现频宽拓展，中低音增强，相比单振膜扬声器，可以达到同时提升高、低音的目的。
两个磁铁的磁力线经过三个导磁件汇聚磁力作用，构成了闭合回路，两个音圈同轴摆放在磁间隙中间，该磁路系统2可使第一振膜3和第二振膜5共用磁路。这样无需设置两个磁路系统，能够提高对磁能的利用率和节省空间，减小了扬声器的体积，有利于实现电子设备小型化，使得使用该扬声器的电子设备如耳机佩戴更加舒适，或 者能够将更多空间用于安装电池，有助于提高电子设备的续航能力。
为了实现声波叠加，磁路系统2的第一音圈4和第二音圈6通交流电时，第一振膜3和第二振膜5的振动方向相同。具体地，可以有但不限于以下两种情况：
第一种情况——第一磁铁22沿中心轴线方向的磁性与第二磁铁24沿中心轴线方向的磁性相反，可使用共用的第一导磁件21将沿轴向方向充磁且充磁方向相反的第二磁铁24和第一磁铁22进行同轴连接，三个导磁件可起到磁力汇聚的作用，使得第一磁铁22和第二磁铁24的磁力线经过三个导磁件的汇聚作用形成分别围绕第一磁间隙C1和第二磁间隙C2的两个闭合回路，具体地，第二磁铁24和第一磁铁22沿轴向方向充磁，并且充磁方向相反，例如，第一磁铁22沿第二振膜5至第一振膜3方向的磁性为S极指向N极，第二磁铁24沿第二振膜5至第一振膜3方向的磁性N极指向S极，磁力线从第二磁铁24->第一导磁件21->第二导磁件23->第一磁铁22->第一导磁件21->第三导磁件25->第二磁铁24形成磁力线闭环。
图6为图5所示的双振膜扬声器的磁路系统的两个音圈中的电流的流动方向的示意图。如图6所示，第一磁铁22沿中心轴线方向的磁性与第二磁铁24沿中心轴线方向的磁性相反，第一音圈4和第二音圈6中的电流方向相反，使得第一振膜3和第二振膜5的振动方向相同。即结合磁铁的充磁方向，音圈的绕制与扬声器单元正负极的接线，保证两个音圈中电流的方向在同一时刻是相反的，使两个振膜同时同向振动，实现声波叠加，输出声压级最高。
第二种情况——第一磁铁22沿中心轴线方向的磁性与第二磁铁24沿中心轴线方向的磁性相同，第一音圈4和第二音圈6中的电流方向相同，使得第一振膜3和第二振膜5的振动方向相同。
另外，需说明的是，本申请实施例的双振膜扬声器的磁路系统2可以有多种结构，只要设于环形外壳1内时能够将环形外壳1内的空间沿轴向方向分为不连通的第一腔室Q1和第二腔室Q2，且具有第一磁间隙C1和第二磁间隙C2即可。
图7为图5所示的环形外壳的第一壳体的俯视立体图。图8为图5所示的环形外壳的第一壳体的仰视立体图。如图5所示，环形外壳1可包括沿中心轴线方向排列的第一壳体11和第二壳体12，环形外壳1的第一端为第一壳体11的远离第二壳体12的一端，环形外壳1的第二端为第二壳体12的远离第一壳体11的一端。如图5、图7和图8所示，第一壳体11的远离第二壳体12的一端的外侧或内侧设置有第一环形台阶T1，第一振膜3的外周边缘设置有第一环形安装部A1，第一环形安装部A1设置在第一环形台阶T1处，实现第一振膜3的外周边缘与环形外壳1的第一端的端面密封连接。另外，如图7和图8所示，第一开槽N1的一部分、第一环形凸台L1、端口K2以及下面将介绍的定位凸台D的一部分可设置在第一壳体11上。
图9为图5所示的环形外壳的第二壳体的俯视立体图。图10为图5所示的环形外壳的第二壳体的仰视立体图。如图5、图9和图10所示，第二壳体12的远离第一壳体11的一端的外侧或内侧设置有第二环形台阶T2，第二振膜5的外周边缘设置有第二环安装部A2，第二环安装部A2设置在第二环形台阶处，实现第二振膜5的外周边缘与环形外壳1的第二端的端面密封连接。另外，如图9和图10所示，第一开槽N1的另一部分、第二开槽N2、第二环形凸台L2以及下面将介绍的定位凸台D的另一部 分可设置在第一壳体11上。
也就是说，为了方便安装和制造，环形外壳1可拆分为第一壳体11和第二壳体12，并且为了方便定位安装第一振膜3，可在第一壳体11的端面上设置第一环形台阶T1，第一振膜3的第一环形安装部A1如钢圈可设置在第一环形台阶T1处，这样也使得第一振膜3和第一壳体11之间的密封效果较好；同理，为了方便定位安装第二振膜5，可在第二壳体12的端面上设置第二环形台阶T2，第二振膜5的第二环形安装部A2如钢圈可设置在第二环形台阶T2处，这样也使得第二振膜5和第二壳体12之间的密封效果较好。可以理解的是，在满足工作要求和加工条件的情况下，第一壳体11和第二壳体12也可以一体制成。
如图7-图10所示，环形外壳1的外周壁上设置有定位凸台D，定位凸台D上设置有连通环形外壳1的内侧和外侧的多个通孔，如图3所示，第一音圈4上设置有第一音圈线X1，第二音圈6上设置有第二音圈线X2，第一音圈线X1和第二音圈线X2分别通过多个通孔与功放装置电连接，定位凸台D可与至少一个端口K1沿着环形外壳1的周向方向间隔设置。定位凸台D可与至少一个端口K2沿着环形外壳1的周向方向间隔设置。设置定位凸台D，方便将双振膜扬声器定位安装至电子设备，保证使端口K1和端口K2对应电子设备的相应位置。音圈可包括环形支撑架和围绕环形支撑架设置的多匝音圈线。或者，音圈可包括环形金属架和与环形金属架连接的音圈线。音圈与功放装置电连接可以有但不限于以下两种方式：
第一种方式——在注塑环形外壳1时，将金属焊盘H(如图2所示)内嵌在环形外壳1的形成定位凸台D的部分，且金属焊盘H一部分位于环形外壳1内，另一部分露出环形外壳1，安装时，第一音圈线X1和第二音圈线X2在环形外壳1内部与金属焊盘H连接，金属焊盘H再与外部功放装置连接，这样音圈线不会露出环形外壳1，能够较好地保护音圈线，防止损坏音圈线。即在环形外壳1的外周壁上设置定位凸台D，不仅可起到定位组装的作用，还可方便音圈线与外部电路连接。
第二种方式——音圈线可通过定位凸台D处的通孔伸出并与功放装置连接，这样降低了环形外壳1的加工难度，有利于提高加工速度和降低成本。
另外，在图5中，第一开槽N1和第二开槽N2设置在环形外壳1的内壁上，第一开槽N1和第二开槽N2也可设置在磁路系统上，可参见下面将介绍的图11-图13。
图11为本申请第一实施例提供的另一种双振膜扬声器的俯视图。图12为图11所示的双振膜扬声器的分解结构示意图。图13为图11中沿M-M线的剖视结构示意图。如图11-图13所示，第一开槽N1和第二开槽N2设置在磁路系统2上，如图12所示，第一开槽N1可设置在磁路系统2的第二磁铁24和第三导磁件25上，第二开槽N2位于第一导磁件21上，即第一开槽N2的长度较短，可以仅设置在第一导磁件21上，但在有需要的情况下，也可设置在第二磁铁24上。
图14为本申请第二实施例提供的一种双振膜扬声器的剖视结构示意。如图14所示，当环形外壳1上未设置第一环形凸台L1和第二环形凸台L2、仅设置有第一环形凸台L1、仅设置有第二环形凸台L2以及设置有第一环形凸台L1和第二环形凸台L2这四种情况下，第一通道P1的结构可参考上面关于图5的介绍，下面结合图14仅针对这四种情况下第二通道P2的另一种结构进行介绍。
当环形外壳1上未设置第一环形凸台L1和第二环形凸台L2时，第一振膜3与磁路系统2密封连接，第二通道P2可包括第二缺口E2和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第二开槽N2，第二开槽N2从第二缺口E2延伸至环形外壳1第一端的端面处。
当环形外壳1上仅设置有第一环形凸台L1，但未设置第二环形凸台L2时，第二通道P2包括第二缺口E2和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第二开槽N2，第二开槽N2从第二缺口E2延伸至环形外壳1第一端的端面处并贯穿第一环形凸台L1。
当环形外壳1上仅设置有第二环形凸台L2，但未设置第一环形凸台L1时，第一振膜3与磁路系统2密封连接，第二通道P2可包括设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第二开槽N2和第二缺口E2，第二开槽N2从第二缺口E2延伸至环形外壳1第一端的端面处。
当环形外壳1上设置第一环形凸台L1和第二环形凸台L2时，第二通道P2包括第二缺口E2和设置在环形外壳1的内壁和/或磁路系统2的外周壁上的第二开槽N2，第二开槽N2从第二缺口E2延伸至环形外壳1第一端的端面处并贯穿第二环形凸台L2。
需说明的是，第二后腔B2封闭(即没有第二通道P2)时的情况可参考图5-图14描述上述实施例中第一通道P1的设计方式。
由于高频声波不容易短路，而中、低频声波波长较长容易短路，短路会使中、低频声压降低，造成声学性能损失，本申请实施例将两个振膜的前腔和后腔的声波传递路径各自分隔，能够避免声短路，在进行声波叠加时，可提高了中、低频声波(包括目标信号的中低频和/或降噪信号的中低频)，提升了扬声器的中低频灵敏度，实现了更好的中低频降噪效果和/或增强了目标信号的中低频；并且，第一前腔和第二前腔通过位于环形外壳内侧或内部的第一通道实现连通，方便与电子设备的出声管道连接，与在环形外壳的外部设置管道连接第一前腔和第二前腔的方案相比，能够减小体积，有利于实现小型化；同时由于振膜能够设置在环形外壳的端面上，使得振膜的面积较大，推动的空气较多，声压较高，能够进一步提升扬声器的中低频灵敏度。
图15为本申请第三实施例提供的双振膜扬声器的剖视结构示意图。如图15所示，端口K1位于环形外壳1的外周壁上，端口K2位于环形外壳1的外周壁上。环形外壳1的内壁上设置有至少一个第一开槽N1，第一开槽N1从第一前腔F1延伸至端口K1，并与端口K1连通；第一振膜3密封盖合环形外壳1的第一端的整个端面。环形外壳1的内壁上设置有至少一个第二开槽N2，第二开槽N2从第二后腔B2延伸至端口K2，并与端口K2连通；第二振膜5密封盖合环形外壳1的第二端的整个端面。磁路系统2的部分外周壁与环形外壳1的内壁密封连接，磁路系统2的对应第一开槽N1的外周壁与第一开槽N1形成第一通道P1，磁路系统2的对应第二开槽N2的外周壁与第二开槽N2形成第二通道P2。其中，也可仅在磁路系统2的外周壁上设置在第一开槽N1、第二开槽N2，第一开槽N1与环形外壳1的内壁配合形成第一通道P1，第二开槽N2与环形外壳1的内壁配合形成第二通道P2。或者，可在磁路系统2的外周壁和环形外壳1的内壁上同时设置开槽来形成第一通道P1和第二通道P2。
另外，端口K1可设置在第一壳体11上和/或第二壳体12上。即端口K1可仅设于第一壳体11上，或者仅设于第二壳体12上，或者一部分设于第一壳体11上，另一部分设于第二壳体12上。端口K2可设置在第一壳体11上和/或第二壳体上。即端口K2可仅设于第一壳体11上，或者仅设于第二壳体12上，或者一部分设于第一壳体11上，另一部分设于第二壳体12上。
并且，两个以上端口K1沿中心轴线方向的位置可相同，或者也可不同。两个以上端口K2沿中心轴线方向的位置可相同，或者也可不同。下面以端口K2为例进行说明，具体地，两个以上端口K2中的一者可位于第一壳体11的与第二壳体12接触的端面上，例如，第一壳体11的端面上设置开槽，该开槽配合第二壳体12的端面即可形成端口K2；两个以上端口K2中的另一者可位于第二壳体12的与第一壳体11接触的端面上，第二壳体12的端面上设置开槽，该开槽配合第一壳体11的端面即可形成端口K2。
在一个例子中，为了方便安装磁路系统2，防止磁路系统2沿着环形外壳1的中心轴线方向移动，在环形外壳1的内壁上可设置凸台。具体地，环形外壳1的第一端的内壁上未设置第一开槽N1的部位设置有第一环形凸台L1；环形外壳1的第二端的内壁上未设置第二开槽N2的部位设置有第二环形凸台L2；磁路系统2位于第一环形凸台L1和第二环形凸台L2之间，并与第一环形凸台L1和第二环形凸台L2固定连接。
本申请第三实施例的双振膜扬声器，端口K1和端口K2均位于环形外壳1的外周壁上，这样振膜的安装面即环形外壳的端面处无需预留设置端口的空间，第一振膜3可密封盖合环形外壳1的第一端的整个敞口，第二振膜5可密封盖合环形外壳1的第二端的整个敞口，使得第一振膜3和第二振膜5的面积较大，能够推动更多空气，产生更多中低频声波，有助于提升降噪效果。
在上述实施例中，双振膜扬声器需要与电子设备的结构配合形成第一后腔B1和第二前腔F2。另外，也可在双振膜扬声器上设置第一盖体Z1来与第一振膜3配合形成第一后腔B1，还可在双振膜扬声器上设置第二盖体Z2来与第二振膜5形成第二前腔F2。下面以图11-图13所示的第一实施例的另一种双振膜扬声器为例进行说明。
图16为图11所示的另一种双振膜扬声器设置有盖体时的俯视图。图17为图16中沿N-N线的剖视结构示意图。如图16和17所示，双振膜扬声器还可包括第一盖体Z1和第二盖体Z2。第一盖体Z1作为第一部件与第一振膜3密封连接，以形成第一后腔B1。第二盖体Z2作为第二部件与第二振膜5密封连接，以形成第二前腔F2，双振膜扬声器的第一前腔F1与第二前腔F2通过第一通道1连通。此时，安装该双振膜扬声器的电子设备可包括出声管道，该双振膜扬声器的第二前腔F2与出声管道连通。
在一个例子中，在图11-图13所示的第一实施例的另一种双振膜扬声器上，可仅设置第二盖体Z2，第二盖体Z2作为第二部件与第二振膜5密封连接，以形成第二前腔F2，第一前腔F1与第二前腔F2通过第一通道P1连通。第一部件为安装该双振膜扬声器的电子设备的第一结构10。即安装该双振膜扬声器的电子设备可包括第一结构10和出声管道，第一结构10在双振膜扬声器的第一振膜3的远离磁路系统2的侧面与第一振膜3连接，以形成第一后腔B1。双振膜扬声器的第二前腔F2与电子设备的出声管道连接。
在另一个例子中，在图11-图13所示的第一实施例的另一种双振膜扬声器上，可仅设置第一盖体Z1，第一盖体Z1在第一振膜3的远离磁路系统2的侧面与第一振膜3密封连接，以形成第一后腔B1。此时，第二部件为电子设备的出声管道。即安装该双振膜扬声器的电子设备可包括出声管道20，出声管道20在双振膜扬声器的第二振膜5的远离磁路系统2的侧面与第二振膜5连接，以形成第二前腔F2，双振膜扬声器的第一前腔F1与第二前腔F2通过双振膜扬声器上的第一通道P1连通。
也就是说，当本申请实施例的双振膜扬声器上没有设置盖体时，双振膜扬声器的两个振膜可与电子设备的结构配合形成第一后腔和第二前腔，由于无需设置盖体，这样可节省空间，有利于进一步减小电子设备的体积或者能够将空间用于其他结构，如采用更大的电池，以便提高续航能力；当在本申请实施例的双振膜扬声器上设置第一盖体Z1和/或第二盖体Z2时，安装该双振膜扬声器的电子设备的相应结构无需改进来与双振膜扬声器的振膜形成第一后腔和/或第二前腔，对电子设备的结构改进较小。
综上所述，本申请实施例的双振膜扬声器，将两个振膜的前腔和后腔的声波传递路径各自分隔，避免声短路，可使两振膜同向振动发声，利用磁路系统和环形外壳构成腔体的通道，使声压实现叠加效果，增强了中、低频，从而提升扬声器的中低频灵敏度，可改善半开放式架构下的ANC表现和增强目标信号的中低频。并且，还具有高频宽、占用空间小等特点，能够提高音质和减小体积，有利于提升用户使用体验。
TWS耳机模组为了中低频降噪性能，不能兼顾高频延伸；需要使用多单元，但是多单元封装占用太多堆叠空间，磁路利用效率也较低。本申请实施例的扬声器，构建双扬声器单元磁路相互增强和循环闭合磁回路，并搭配双振动系统及独立前后腔，提高了磁路利用率，减小了体积，增大了振膜面积，能够提高扬声器灵敏度及拓展频宽。
本申请实施例的双振膜扬声器具有中低频灵敏度高和体积小等优点，可应用于便携式电子设备如小耳机等，可应用于音频产品的扬声器，实现音乐信号的播放，支撑实现高灵敏度、高频宽目标，提供高品质音乐体验。具体地，TWS耳机双PA可分别驱动扬声器的两个振膜，数字分频；可用于TWS主动降噪，HIFI音乐播放、透传，3D音效等效果实现。在一个例子中，本申请实施例的双振膜扬声器，相对于现有单振膜扬声器，低频灵敏度可提升8dB；相比现有双振膜扬声器，低频灵敏度可提升10dB，并且连通两个前腔的通道设置在环形外壳内部，无需设置额外管路来连通两个前腔，同时共用磁路，可缩小整体厚度，使得体积可缩小32％。
最后说明的是：以上实施例仅用以说明本申请的技术方案，而对其限制；尽管参照前述实施例对本申请进行了详细的说明，本领域的普通技术人员应当理解：其依然可以对前述各实施例所记载的技术方案进行修改，或者对其中部分技术特征进行等同替换；而这些修改或替换，并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。

Claims (25)

  1. 一种双振膜扬声器，其特征在于，包括：
    环形外壳(1)；
    磁路系统(2)，设置在所述环形外壳(1)内并沿所述环形外壳(1)的中心轴线方向将所述环形外壳(1)内的空间划分为第一腔室(Q1)和第二腔室(Q2)，所述磁路系统(2)包括围绕所述中心轴线间隔设置的第一磁间隙(C1)和第二磁间隙(C2)；
    第一振膜(3)，设置在所述环形外壳(1)的第一端，以与所述第一腔室(Q1)形成第一前腔(F1)，并用于在所述第一振膜(3)的远离所述磁路系统(2)的侧面与第一部件形成第一后腔(B1)；
    第一音圈(4)，设置在所述第一前腔(F1)内，所述第一音圈(4)的一端与所述第一振膜(3)连接且另一端伸入所述第一磁间隙(C1)；
    第二振膜(5)，设置在所述环形外壳(1)的第二端，以与所述第二腔室(Q2)形成第二后腔(B2)，并用于在所述第二振膜(5)的远离所述磁路系统(2)的侧面与第二部件形成第二前腔(F2)，且所述第二后腔(B2)与所述第一前腔(F1)不连通；
    第二音圈(6)，设置在所述第二后腔(B2)内，所述第二音圈(6)的一端与所述第二振膜(5)连接且另一端伸入所述第二磁间隙(C2)；
    所述第一前腔(F1)通过至少一个第一通道(P1)与所述第二前腔(F2)连通，所述第一通道(P1)位于所述磁路系统(2)和所述环形外壳(1)的至少一者内；
    所述第二后腔(B2)封闭；或，所述第二后腔(B2)通过至少一个第二通道(P2)与所述第一后腔(B1)或大气连通。
  2. 根据权利要求1所述的双振膜扬声器，其特征在于，所述磁路系统(2)的外周壁与所述环形外壳(1)的内壁密封连接，所述第二振膜(5)的外周边缘与所述磁路系统(2)密封连接，所述第一通道(P1)包括设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第一开槽(N1)，其中：
    所述第一振膜(3)与所述环形外壳(1)的第一端的整个端面密封连接，所述第一开槽(N1)从所述第一前腔(F1)延伸至所述环形外壳(1)的第二端的端面处；或，
    所述第一振膜(3)与所述磁路系统(2)密封连接，所述磁路系统(2)上设置有连通前腔(F1)的第一缺口(E1)，所述第一通道(P1)还包括第一缺口(E1)，所述第一开槽(N1)从所述第一缺口(E1)延伸至所述环形外壳(1)的第二端的端面处。
  3. 根据权利要求2所述的双振膜扬声器，其特征在于，所述第二后腔(B2)通过第二通道(P2)与所述第一后腔(B1)或大气连通，所述磁路系统(2)上设置有连通所述第二后腔(B2)的第二缺口(E2)，其中：
    所述第二通道(P2)包括第二端口(K2)、所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的至第二开槽(N2)，所述第二端口(K2)设置在所述环形外壳(1)的外周壁上，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述第二端口(K2)；或，
    所述第一振膜(3)与所述磁路系统(2)密封连接，所述第二通道(P2)包括所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第二开槽(N2)，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述环形外壳(1)第一端的端面处。
  4. 根据权利要求1所述的双振膜扬声器，其特征在于，所述环形外壳(1)的第一端的内壁上设置有第一环形凸台(L1)，所述第一振膜(3)与所述第一环形凸台(L1)密封连接，所述磁路系统(2)连接于所述第一环形凸台(L1)的远离所述第一振膜(3)的侧面，所述磁路系统(2)的外周壁与所述环形外壳(1)的内壁密封连接，所述第二振膜(5)的外周边缘与所述磁路系统(2)密封连接；所述第一环形凸台(L1)和所述磁路系统(2)中的至少一者上设置有连通所述第一前腔(F1)的第一缺口(E1)，所述第一通道(P1)包括所述第一缺口(E1)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第一开槽(N1)，所述第一开槽(N1)从所述第一缺口(E1)延伸至所述环形外壳(1)的第二端的端面。
  5. 根据权利要求4所述的双振膜扬声器，其特征在于，所述第二后腔(B2)通过第二通道(P2)与所述第一后腔(B1)或大气连通，所述磁路系统(2)上设置有连通所述第二后腔(B2)的第二缺口(E2)，其中：
    所述第二通道(P2)包括第二端口(K2)、所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第二开槽(N2)，所述第二端口(K2)设置在所述环形外壳(1)的外周壁上，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述第二端口(K2)；或，
    所述第二通道(P2)包括所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第二开槽(N2)，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述环形外壳(1)第一端的端面处并贯穿所述第一环形凸台(L1)。
  6. 根据权利要求1所述的双振膜扬声器，其特征在于，所述环形外壳(1)的第二端的内壁上设置有第二环形凸台(L2)，所述第二振膜(5)与所述第二环形凸台(L2)密封连接，所述磁路系统(2)连接于所述第二环形凸台(L2)的远离所述第二振膜(5)的侧面，所述第一通道(P1)包括设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第一开槽(N1)，其中：
    所述第一振膜(3)与所述环形外壳(1)的第一端的整个端面密封连接，所述第一开槽(N1)从所述第一前腔(F1)延伸至所述环形外壳(1)的第二端的端面并贯穿所述第二环形凸台(L2)；或，
    所述第一振膜(3)与所述磁路系统(2)密封连接，所述磁路系统(2)上设置有连通前腔(F1)的第一缺口(E1)，所述第一通道(P1)还包括第一缺口(E1)，所述第一开槽(N1)从所述第一缺口(E1)延伸至所述环形外壳(1)的第二端的端面处。
  7. 根据权利要求6所述的双振膜扬声器，其特征在于，所述第二后腔(B2)通过第二通道(P2)与所述第一后腔(B1)或大气连通，所述第二环形凸台(L2)和所述磁路系统(2)中的至少一者上设置有与所述第二后腔(B2)连通的第二缺口(E2)，其中：
    所述第二通道(P2)包括第二端口(K2)、所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第二开槽(N2)，所述第二端口(K2)设置在所述环形外壳(1)的外周壁上，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述第二端口(K2)；或，
    所述第一振膜(3)与所述磁路系统(2)密封连接，所述第二通道(P2)包括所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第二开槽(N2)，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述环形外壳(1)第一端的端面处。
  8. 根据权利要求1所述的双振膜扬声器，其特征在于，所述环形外壳(1)的第一端的内壁上设置有第一环形凸台(L1)，所述环形外壳(1)的第二端的内壁上设置有第二环形凸台(L2)，所述磁路系统(2)连接于所述第一环形凸台(L1)和所述第二环形凸台(L2)之间，所述磁路系统(2)的外周壁与所述环形外壳(1)的内壁密封连接，所述第一振膜(3)的外周边缘与所述第一环形凸台(L1)密封连接；所述第二振膜(5)的外周边缘与所述第二环形凸台(L2)密封连接；
    所述第一环形凸台(L1)和所述磁路系统(2)中的至少一者上设置有连通所述第一前腔(F1)的第一缺口(E1)，所述第一通道(P1)包括所述第一缺口(E1)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第一开槽(N1)，所述第一开槽(N1)从所述第一缺口(E1)延伸至所述环形外壳(1)的第二端的端面并贯穿所述第二环形凸台(L2)。
  9. 根据权利要求8所述的双振膜扬声器，其特征在于，所述第二后腔(B2)通过第二通道(P2)与所述第一后腔(B1)或大气连通，所述第二环形凸台(L2)和所述磁路系统(2)中的至少一者上设置有与所述第二后腔(B2)连通的第二缺口(E2)，其中：
    所述第二通道(P2)包括第二端口(K2)、所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第二开槽(N2)，所述第二端口(K2)设置在所述环形外壳(1)的外周壁上，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述第二端口(K2)；或，
    所述第二通道(P2)包括所述第二缺口(E2)和设置在环形外壳(1)的内壁和/或所述磁路系统(2)的外周壁上的第二开槽(N2)，所述第二开槽(N2)从所述第二缺口(E2)延伸至所述环形外壳(1)第一端的端面处并贯穿所述第一环形凸台(L1)。
  10. 根据权利要求1所述的双振膜扬声器，其特征在于，所述磁路系统(2)的外周壁与所述环形外壳(1)的内周壁密封连接，所述第一通道(P1)包括设置在所述磁路系统(2)或所述环形外壳(1)上的第一通孔，所述第一通孔的一端连通所述第一前腔(F1)，另一端延伸至所述环形外壳(1)的第二端的端面处。
  11. 根据权利要求1、2、4、6、8和10中任一项所述的双振膜扬声器，其特征在于，所述第二后腔(B2)通过第二通道(P2)与所述第一后腔(B1)或大气连通，所述磁路系统(2)的外周壁与所述环形外壳(1)的内周壁密封连接，所述第二通道(P2)包括设置在所述磁路系统(2)或所述环形外壳(1)上的第二通孔，所述第二通孔的第一端连通所述第二后腔(B2)，另一端延伸至所述环形外壳(1)的第一端的端面 处或延伸至所述环形外壳(1)的外周壁处。
  12. 根据权利要求10或11所述的双振膜扬声器，其特征在于：
    所述环形外壳(1)的第一端的内壁上设置有第一环形凸台(L1)，所述磁路系统(2)在所述第一环形凸台(L1)的远离第一振膜(3)的侧面与所述第一环形凸台(L1)密封连接；和/或，
    所述环形外壳(1)的第二端的内壁上设置有第二环形凸台(L2)，所述磁路系统(2)在所述第二环形凸台(L2)的远离第二振膜(5)的侧面与所述第二环形凸台(L2)密封连接。
  13. 根据权利要求1-12中任一项所述的双振膜扬声器，所述双振膜扬声器设置有两个以上所述第一通道(P1)，两个以上所述第一通道(P1)沿着所述环形外壳(1)的周向方向间隔设置。
  14. 根据权利要求3、5、7、9和11中任一项所述的双振膜扬声器，所述双振膜扬声器设置有两个以上所述第二通道(P2)，两个以上所述第二通道(P1)沿着所述环形外壳(1)的周向方向间隔设置。
  15. 根据权利要求1所述的双振膜扬声器，其特征在于，所述环形外壳(1)的外周壁上设置有定位凸台(D)，所述定位凸台(D)上设置有连通所述环形外壳(1)的内侧和外侧的多个通孔，所述第一音圈(4)上设置有第一音圈线(X1)，所述第二音圈(6)上设置有第二音圈线(X2)，所述第一音圈线(X1)和所述第二音圈线(X2)分别通过所述多个通孔与功放装置电连接，所述定位凸台(D)与所述至少一个第一通道(P1)或与所述至少一个第二通道(P2)沿着所述环形外壳(1)的周向方向间隔设置。
  16. 根据权利要求1、4-10和15中任一项所述的双振膜扬声器，其特征在于，所述环形外壳(1)包括沿所述中心轴线方向排列的第一壳体(11)和第二壳体(12)，其中：
    所述第一壳体(11)的远离所述第二壳体(12)的一端的端面设置有第一环形台阶(T1)，所述第一振膜(3)的外周边缘设置有第一环形安装部(A1)，所述第一环形安装部(A1)设置在所述第一环形台阶(T1)处，实现所述第一振膜(3)的外周边缘与所述环形外壳(1)的第一端的端面密封连接；和/或，
    所述第二壳体(12)的远离所述第一壳体(11)的一端的端面设置有第二环形台阶(T2)，所述第二振膜(5)的外周边缘设置有第二环安装部(A2)，所述第二环安装部(A2)设置在所述第二环形台阶处，实现所述第二振膜(5)的外周边缘与所述环形外壳(1)的第二端的端面密封连接。
  17. 根据权利要求1-16中任一项所述的双振膜扬声器，其特征在于，所述第一音圈(4)和所述第二音圈(6)通交流电时，所述第一振膜(3)和所述第二振膜(5)的振动方向相同。
  18. 根据权利要求1-17中任一项所述的双振膜扬声器，其特征在于，所述第一部件为安装所述双振膜扬声器的电子设备的第一结构；所述第二部件为所述电子设备的出声管道。
  19. 根据权利要求1-17中任一项所述的双振膜扬声器，其特征在于，所述的双振膜 扬声器还包括：
    第一盖体，所述第一盖体作为所述第一部件与所述第一振膜(3)密封连接，以形成所述第一后腔(B1)；
    第二盖体，所述第二盖体作为所述第二部件与所述第二振膜(5)密封连接，以形成所述第二前腔(F2)，所述第二前腔(F2)用于与电子设备的出声管道连通。
  20. 根据权利要求1-17中任一项所述的双振膜扬声器，其特征在于，所述第一部件为安装所述双振膜扬声器的电子设备的第一结构；所述的双振膜扬声器还包括：
    第二盖体，所述第二盖体作为所述第二部件与所述第二振膜(5)密封连接，以形成所述第二前腔(F2)，所述第二前腔(F2)用于与所述电子设备的出声管道连通。
  21. 根据权利要求1-17中任一项所述的双振膜扬声器，其特征在于，所述第二部件为电子设备的出声管道；所述的双振膜扬声器还包括：
    第一盖体，所述第一盖体作为所述第一部件在所述第一振膜(3)的远离所述磁路系统(2)的侧面与所述第一振膜(3)密封连接，以形成所述第一后腔(B1)。
  22. 一种电子设备，其特征在于，所述电子设备包括：
    如权利要求18所述的双振膜扬声器(30)；
    第一结构(10)，在所述双振膜扬声器的第一振膜(3)的远离所述磁路系统(2)的侧面与所述第一振膜(3)连接，以形成第一后腔(B1)；
    出声管道(20)，在所述双振膜扬声器的第二振膜(5)的远离所述磁路系统(2)的侧面与所述第二振膜(5)连接，以形成第二前腔(F2)。
  23. 一种电子设备，其特征在于，所述电子设备包括出声管道和如权利要求19所述的双振膜扬声器，所述双振膜扬声器的第二前腔(F2)与所述出声管道连通。
  24. 一种电子设备，其特征在于，所述电子设备包括：
    如权利要求20所述的双振膜扬声器；
    第一结构，在所述双振膜扬声器的第一振膜(3)的远离所述磁路系统(2)的侧面与所述第一振膜(3)连接，以形成第一后腔(B1)；
    出声管道，所述双振膜扬声器的第二前腔(F2)与所述出声管道连通。
  25. 一种电子设备，其特征在于，所述电子设备包括：
    如权利要求21所述的双振膜扬声器；
    出声管道，在所述双振膜扬声器的第二振膜(5)的远离所述磁路系统(2)的侧面与所述第二振膜(5)连接，以形成第二前腔(F2)。
PCT/CN2022/106799 2021-07-30 2022-07-20 一种双振膜扬声器和电子设备 Ceased WO2023005762A1 (zh)

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