WO2024043664A2 - Appareil électronique comprenant une carte de circuit imprimé souple - Google Patents

Appareil électronique comprenant une carte de circuit imprimé souple Download PDF

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Publication number
WO2024043664A2
WO2024043664A2 PCT/KR2023/012406 KR2023012406W WO2024043664A2 WO 2024043664 A2 WO2024043664 A2 WO 2024043664A2 KR 2023012406 W KR2023012406 W KR 2023012406W WO 2024043664 A2 WO2024043664 A2 WO 2024043664A2
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
housing
side wall
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2023/012406
Other languages
English (en)
Korean (ko)
Inventor
이영선
권기환
김병걸
김현학
우재훈
정영진
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020220123286A external-priority patent/KR20240028260A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2024043664A2 publication Critical patent/WO2024043664A2/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
    • F16C11/00—Pivots; Pivotal connections
    • F16C11/04—Pivotal connections
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings

Definitions

  • This document relates to a flexible printed circuit board including a laminated structure capable of reducing the overall thickness and adjusting the aperture ratio of the shielding layer, an electronic device including the same, and a method of manufacturing the flexible printed circuit board.
  • Electronic devices refer to devices that perform specific functions according to installed programs, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video/audio devices, desktop/laptop computers, or vehicle navigation devices. It can mean. For example, these electronic devices can output stored information as sound or video.
  • various technologies are being developed to improve the portability of electronic devices and user convenience in using multimedia functions. For example, as electronic devices become smaller, displays provided in electronic devices can provide the same or even improved usability (e.g., larger screens).
  • Flexible printed circuit boards may be useful in providing electrical connections while providing electrical connections.
  • a flexible printed circuit board can be used as a wiring that electrically connects electrical components or electronic components inside different structures.
  • An electronic device may include a housing and a flexible printed circuit board disposed within the housing.
  • the flexible printed circuit board may include a base layer, an insulating layer, and/or a shielding layer.
  • the base layer may include a first surface facing a first direction and at least one signal line disposed on the first surface.
  • the insulating layer may be laminated on the first side of the base layer to cover the at least one signal line.
  • the shielding layer is laminated on the insulating layer and may include a plurality of through holes.
  • the plurality of through holes may be formed in at least a partial area including an area overlapping with the signal line based on the first direction.
  • the through holes may be spaced apart along the longitudinal direction of the signal line. At least a portion of the insulating layer may be exposed by the plurality of through holes.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.
  • FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment disclosed in this document.
  • FIG. 3 is a diagram illustrating a folded state of an electronic device according to an embodiment disclosed in this document.
  • Figure 4 is an exploded perspective view of an electronic device, according to an embodiment disclosed in this document.
  • Figure 5 is a perspective view of a flexible printed circuit board of an electronic device according to an embodiment disclosed in this document.
  • Figure 6 is a plan view of a flexible printed circuit board according to an embodiment disclosed in this document.
  • FIG. 7 is a cross-sectional view of the flexible printed circuit board taken along line A-A' in FIG. 6.
  • FIG. 8 is a cross-sectional view of the flexible printed circuit board taken along line B-B' in FIG. 6.
  • FIG. 9 is a cross-sectional view of the flexible printed circuit board taken along line C-C' in FIG. 6.
  • Figure 10 is a partial enlarged view of Figure 9.
  • FIG. 11 is a diagram showing a portion of a first base layer, a first signal wire, and a first shielding layer according to an embodiment disclosed in this document.
  • FIG. 12 is a diagram for explaining a through hole according to an embodiment disclosed in this document.
  • Figure 13 is a diagram for explaining a through hole according to an embodiment disclosed in this document.
  • Figure 14 is a diagram for explaining a through hole according to an embodiment disclosed in this document.
  • FIG. 15 is a diagram showing a portion of a first base layer, a first signal wire, and a first shielding layer according to an embodiment disclosed in this document.
  • 16 is a diagram of a flexible printed circuit according to one embodiment disclosed herein.
  • FIG. 17 is a cross-sectional view taken along line D-D' of FIG. 16.
  • 18 is a flow chart of a method of manufacturing a flexible printed circuit according to an embodiment disclosed in this document.
  • FIG. 1 is a block diagram of an electronic device in a network environment, according to an embodiment disclosed in this document.
  • the electronic device 101 communicates with the electronic device 102 through a first network 198 (e.g., a short-range wireless communication network) or a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (e.g., a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • a first network 198 e.g., a short-range wireless communication network
  • a second network 199 e.g., a long-distance wireless communication network.
  • the electronic device 101 may communicate with the electronic device 104 through the server 108.
  • the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or may include an antenna module 197.
  • at least one of these components eg, the connection terminal 178) may be omitted, or one or more other components may be added to the electronic device 101.
  • some of these components are integrated into one component (e.g., display module 160). It can be.
  • the processor 120 for example, executes software (e.g., program 140) to operate at least one other component (e.g., hardware or software component) of the electronic device 101 connected to the processor 120. It can be controlled and various data processing or calculations can be performed. According to one embodiment, as at least part of data processing or computation, the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132. The commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • software e.g., program 140
  • the processor 120 stores instructions or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132.
  • the commands or data stored in the volatile memory 132 can be processed, and the resulting data can be stored in the non-volatile memory 134.
  • the processor 120 includes the main processor 121 (e.g., a central processing unit or an application processor) or an auxiliary processor 123 that can operate independently or together (e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor).
  • the main processor 121 e.g., a central processing unit or an application processor
  • an auxiliary processor 123 e.g., a graphics processing unit, a neural network processing unit ( It may include a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor.
  • the electronic device 101 includes a main processor 121 and a secondary processor 123
  • the secondary processor 123 may be set to use lower power than the main processor 121 or be specialized for a designated function. You can.
  • the auxiliary processor 123 may be implemented separately from the main processor 121 or as part of it.
  • the auxiliary processor 123 may, for example, act on behalf of the main processor 121 while the main processor 121 is in an inactive (e.g., sleep) state, or while the main processor 121 is in an active (e.g., application execution) state. ), together with the main processor 121, at least one of the components of the electronic device 101 (e.g., the display module 160, the sensor module 176, or the communication module 190) At least some of the functions or states related to can be controlled.
  • co-processor 123 e.g., image signal processor or communication processor
  • may be implemented as part of another functionally related component e.g., camera module 180 or communication module 190. there is.
  • the auxiliary processor 123 may include a hardware structure specialized for processing artificial intelligence models.
  • Artificial intelligence models can be created through machine learning. For example, such learning may be performed in the electronic device 101 itself, where artificial intelligence is performed, or may be performed through a separate server (e.g., server 108).
  • Learning algorithms may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but It is not limited.
  • An artificial intelligence model may include multiple artificial neural network layers.
  • Artificial neural networks include deep neural network (DNN), convolutional neural network (CNN), recurrent neural network (RNN), restricted boltzmann machine (RBM), belief deep network (DBN), bidirectional recurrent deep neural network (BRDNN), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the examples described above.
  • artificial intelligence models may additionally or alternatively include software structures.
  • the memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101. Data may include, for example, input data or output data for software (e.g., program 140) and instructions related thereto.
  • Memory 130 may include volatile memory 132 or non-volatile memory 134.
  • the program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142, middleware 144, or application 146.
  • the input module 150 may receive commands or data to be used in a component of the electronic device 101 (e.g., the processor 120) from outside the electronic device 101 (e.g., a user).
  • the input module 150 may include, for example, a microphone, mouse, keyboard, keys (eg, buttons), or digital pen (eg, stylus pen).
  • the sound output module 155 may output sound signals to the outside of the electronic device 101.
  • the sound output module 155 may include, for example, a speaker or a receiver. Speakers can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.
  • the display module 160 can visually provide information to the outside of the electronic device 101 (eg, a user).
  • the display module 160 may include, for example, a display, a hall area programmable device, or a projector and a control circuit for controlling the device.
  • the display module 160 may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of force generated by the touch.
  • the audio module 170 can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device (e.g., directly or wirelessly connected to the electronic device 101). Sound may be output through the electronic device 102 (e.g., speaker or headphone).
  • the electronic device 102 e.g., speaker or headphone
  • the sensor module 176 detects the operating state (e.g., power or temperature) of the electronic device 101 or the external environmental state (e.g., user state) and generates an electrical signal or data value corresponding to the detected state. can do.
  • the sensor module 176 includes, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, humidity sensor, or light sensor.
  • the interface 177 may support one or more designated protocols that can be used to connect the electronic device 101 directly or wirelessly with an external electronic device (eg, the electronic device 102).
  • the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card interface
  • audio interface audio interface
  • connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102).
  • the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).
  • the haptic module 179 can convert electrical signals into mechanical stimulation (e.g., vibration or movement) or electrical stimulation that the user can perceive through tactile or kinesthetic senses.
  • the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module 180 can capture still images and moving images.
  • the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module 188 can manage power supplied to the electronic device 101.
  • the power management module 188 may be implemented as at least a part of, for example, a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery 189 may supply power to at least one component of the electronic device 101.
  • the battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • Communication module 190 is configured to provide a direct (e.g., wired) communication channel or wireless communication channel between electronic device 101 and an external electronic device (e.g., electronic device 102, electronic device 104, or server 108). It can support establishment and communication through established communication channels. Communication module 190 operates independently of processor 120 (e.g., an application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • processor 120 e.g., an application processor
  • the communication module 190 may be a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., : LAN (local area network) communication module, or power line communication module) may be included.
  • a wireless communication module 192 e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module 194 e.g., : LAN (local area network) communication module, or power line communication module
  • the corresponding communication module is a first network 198 (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (e.g., legacy It may communicate with an external electronic device 104 through a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., LAN or WAN).
  • a telecommunication network such as a cellular network, a 5G network, a next-generation communication network
  • the wireless communication module 192 uses subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199.
  • subscriber information e.g., International Mobile Subscriber Identifier (IMSI)
  • IMSI International Mobile Subscriber Identifier
  • the wireless communication module 192 may support 5G networks after 4G networks and next-generation communication technologies, for example, NR access technology (new radio access technology).
  • NR access technology provides high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low latency). -latency communications)) can be supported.
  • the wireless communication module 192 may support high frequency bands (eg, mmWave bands), for example, to achieve high data rates.
  • the wireless communication module 192 uses various technologies to secure performance in high frequency bands, for example, beamforming, massive array multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. It can support technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module 192 may support various requirements specified in the electronic device 101, an external electronic device (e.g., electronic device 104), or a network system (e.g., second network 199).
  • the wireless communication module 192 supports Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mmTC, or U-plane latency (e.g., 164 dB or less) for realizing URLLC.
  • Peak data rate e.g., 20 Gbps or more
  • loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 164 dB or less
  • the antenna module 197 may transmit or receive signals or power to or from the outside (eg, an external electronic device).
  • the antenna module 197 may include an antenna including a radiator made of a conductor or a conductive pattern formed on a substrate (eg, PCB).
  • the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected to the plurality of antennas by, for example, the communication module 190. can be selected Signals or power may be transmitted or received between the communication module 190 and an external electronic device through the at least one selected antenna.
  • other components eg, radio frequency integrated circuit (RFIC) may be additionally formed as part of the antenna module 197.
  • RFIC radio frequency integrated circuit
  • the antenna module 197 may form a mmWave antenna module.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side) of the printed circuit board and capable of transmitting or receiving signals in the designated high frequency band. can do.
  • a mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (e.g., bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., mmWave band), And a plurality of antennas (e.g., array antennas) disposed on or adjacent to the second side (e.g., top or side)
  • peripheral devices e.g., bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)
  • signal e.g. commands or data
  • commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199.
  • Each of the external electronic devices 102 or 104 may be of the same or different type as the electronic device 101.
  • all or part of the operations performed in the electronic device 101 may be executed in one or more of the external electronic devices 102, 104, or 108.
  • the electronic device 101 may perform the function or service instead of executing the function or service on its own.
  • one or more external electronic devices may be requested to perform at least part of the function or service.
  • One or more external electronic devices that have received the request may execute at least part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device 101.
  • the electronic device 101 may process the result as is or additionally and provide it as at least part of a response to the request.
  • cloud computing distributed computing, mobile edge computing (MEC), or client-server computing technology can be used.
  • the electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing.
  • the external electronic device 104 may include an Internet of Things (IoT) device.
  • Server 108 may be an intelligent server using machine learning and/or neural networks.
  • the external electronic device 104 or server 108 may be included in the second network 199.
  • the electronic device 101 may be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • the length direction, width direction and/or thickness direction of the electronic device may be mentioned, with the length direction being the 'Y axis direction', the width direction being the 'X axis direction', and/or the thickness direction. can be defined as 'Z-axis direction'.
  • the direction in which a component faces may be referred to as 'yin/yang (-/+)' in addition to the orthogonal coordinate system illustrated in the drawing.
  • the front of an electronic device or housing can be defined as a 'side facing the +Z direction'
  • the back side can be defined as a 'side facing the -Z direction'.
  • the side of the electronic device or housing may include an area facing the +X direction, an area facing the +Y direction, an area facing the -X direction, and/or an area facing the -Y direction.
  • 'X-axis direction' may mean including both '-X direction' and '+X direction'. Please note that this is based on the Cartesian coordinate system described in the drawings for brevity of explanation, and that the description of directions or components does not limit the embodiment disclosed in this document. For example, the direction in which the front or rear faces are different depending on whether the electronic device is unfolded or folded, and the direction mentioned above may be interpreted differently depending on the user's holding habits.
  • FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment disclosed in this document.
  • FIG. 3 is a diagram illustrating a folded state of an electronic device according to an embodiment disclosed in this document.
  • the configuration of the electronic device 101 in FIGS. 2 and 3 may be the same in whole or in part as the configuration of the electronic device 101 in FIG. 1 .
  • FIG. 2 is a diagram illustrating an unfolded state of an electronic device according to an embodiment disclosed in this document.
  • FIG. 3 is a diagram illustrating a folded state of an electronic device according to an embodiment disclosed in this document.
  • the electronic device 101 includes a housing 201, a hinge cover 230 that covers a foldable portion of the housing 201, and the housing 201. It may include a flexible or foldable display 240 (hereinafter, referred to as “display” 240) disposed in a space formed by .
  • display a flexible or foldable display 240
  • the surface on which the display 240 is placed is defined as the front (eg, first front 210a and second front 220a) of the electronic device 101.
  • the surface opposite to the front is defined as the back of the electronic device 101 (eg, the first back 210b and the second back 220b).
  • the surface surrounding the space between the front and rear surfaces is defined as the side (eg, first side 211a and second side 221a) of the electronic device 101.
  • the housing 201 includes a first housing 210, a second housing 220 rotatably or rotatably coupled to the first housing 210, a first rear cover 280, and a first housing 201. 2 It may include a rear cover 290 and a hinge module (eg, hinge module 202 in FIG. 4).
  • the hinge module 202 may provide at least one folding axis A that becomes the center of rotation of the first housing 210 and/or the second housing 220.
  • the housing 201 of the electronic device 101 is not limited to the shape and combination shown in FIGS. 3 and 4 and may be implemented by combining and/or combining other shapes or parts.
  • the first housing 210 and the first rear cover 280 may be formed integrally, and the second housing 220 and the second rear cover 290 may be formed integrally.
  • the first housing 210 is connected to a hinge module (e.g., the hinge module 202 in FIG. 4), has a first front surface 210a facing a first direction, and a first front surface 210a facing the first direction. It may include a first rear surface 210b facing the second direction.
  • the second housing 220 is connected to the hinge module 202 and includes a second front surface 220a facing a third direction, and a second rear surface 220b facing a fourth direction opposite to the third direction. and can rotate with respect to the first housing 210 around the hinge module 202.
  • the electronic device 101 can change to a folded or unfolded state.
  • the electronic device 101 may have the first front surface 210a face the second front surface 220a, and in the unfolded state, the third direction may be aligned with the first direction. may be substantially parallel.
  • the direction will be described based on the unfolded state of the electronic device 101.
  • the first housing 210 and the second housing 220 are disposed on both sides of the folding axis (A) and may have an overall symmetrical shape with respect to the folding axis (A).
  • the angle or distance between the first housing 210 and the second housing 220 may vary depending on whether the electronic device 101 is in an unfolded state, a folded state, or an intermediate state. there is.
  • the second housing 220 unlike the first housing 210, additionally includes a sensor area 224 where various sensors (e.g., front cameras) are placed, but in other areas, It may have a symmetrical shape with the first housing 210.
  • the folding axis A may be a plurality of parallel folding axes (eg, two).
  • the folding axis A is provided along the longitudinal direction (Y-axis direction) of the electronic device 101, but the direction of the folding axis A is not limited thereto.
  • the electronic device 101 may be understood as including a folding axis A extending along the width direction (eg, X-axis direction).
  • the electronic device 101 may include a structure into which a digital pen can be inserted.
  • a hole 223 into which the digital pen can be inserted may be formed on the side of the first housing 210 or the second housing 220 of the electronic device 101.
  • At least a portion of the first housing 210 and the second housing 220 may be formed of a metallic material or a non-metallic material having a selected level of rigidity to support the display 240. At least a portion formed of the metal material may provide a ground plane of the electronic device 101 and may be electrically connected to a ground conductor provided on a printed circuit board (e.g., the board assembly 260 of FIG. 4). there is.
  • a printed circuit board e.g., the board assembly 260 of FIG. 4
  • the sensor area 224 may be formed to have a predetermined area adjacent to one corner of the second housing 220.
  • the arrangement, shape, and size of the sensor area 224 are not limited to the illustrated example.
  • the sensor area 224 may be provided in the first housing 210 or in another corner of the second housing 220 or any area between the top and bottom corners.
  • components for performing various functions built into the electronic device 101 pass through the sensor area 224 or through one or more openings provided in the sensor area 224. It may be visually exposed on the front of the electronic device 101.
  • the components may include various types of sensors.
  • the sensor may include, for example, at least one of a front camera, a receiver, or a proximity sensor.
  • the first rear cover 280 is disposed on one side of the folding axis A on the rear of the electronic device 101 and has, for example, a substantially rectangular periphery. The edge may be surrounded by the first housing 210.
  • the second rear cover 290 may be disposed on the other side of the folding axis A on the rear of the electronic device 101, and its edge may be wrapped by the second housing 220.
  • the first rear cover 280 and the second rear cover 290 may have a substantially symmetrical shape about the folding axis (A).
  • the first rear cover 280 and the second rear cover 290 do not necessarily have mutually symmetrical shapes, and in one embodiment, the electronic device 101 includes the first rear cover 280 and the second rear cover 290 of various shapes. It may include a second rear cover 290.
  • the first rear cover 280, the second rear cover 290, the first housing 210, and the second housing 220 are various parts of the electronic device 101 (e.g. A space in which a printed circuit board (printed circuit board, or battery) can be placed can be formed.
  • one or more components may be placed or visually exposed on the rear of the electronic device 101.
  • the sub-display e.g, sub-display 244 of FIG. 4
  • the sensor may include a proximity sensor and/or a camera module 206 (e.g., a rear camera).
  • the front camera or the second rear area 292 of the second rear cover 290 is visually exposed to the front of the electronic device 101 through one or more openings provided in the sensor area 224.
  • the camera module 206 visually exposed through may include one or a plurality of lenses, an image sensor, and/or an image signal processor. In some embodiments, two or more lenses (an infrared camera, a wide-angle and a telephoto lens) and image sensors may be placed on one side of the electronic device 101.
  • the hinge cover 230 is disposed between the first housing 210 and the second housing 220 to cover internal components (e.g., the hinge module 202 in FIG. 4). It can be configured. According to one embodiment, the hinge cover 230 includes the first housing 210 and the first housing 210 depending on the state (e.g., flat state or folded state) of the electronic device 101. 2 It may be covered by a portion of the housing 220 or may be exposed to the outside. For example, in the unfolded state, the hinge cover 230 may be substantially covered by the first housing 210 and the second housing 220, and in the folded state, most of the outer surface of the hinge cover 230 is exposed to the outside. may be exposed.
  • the state e.g., flat state or folded state
  • the hinge cover 230 may be substantially covered by the first housing 210 and the second housing 220, and in the folded state, most of the outer surface of the hinge cover 230 is exposed to the outside. may be exposed.
  • the hinge cover 230 when the electronic device 101 is in an unfolded state, the hinge cover 230 is exposed and covered by the first housing 210 and the second housing 220. It may not work.
  • the hinge cover 230 when the electronic device 101 is in a folded state (e.g., fully folded state), the hinge cover 230 is connected to the first housing 210 and It may be exposed to the outside between the second housing 220.
  • the hinge cover 230 when the first housing 210 and the second housing 220 are in an intermediate state folded with a certain angle, the hinge cover 230 is folded with the first housing 210. ) and the second housing 220 may be partially exposed to the outside.
  • the exposed area may be less than in the fully folded state.
  • the hinge cover 230 may include a curved surface.
  • the display 240 may be placed in the space formed by the housing 201.
  • the display 240 is seated on a recess formed by the housing 201 and may constitute most of the front surface of the electronic device 101.
  • the front of the electronic device 101 may include the display 240 and a partial area of the first housing 210 adjacent to the display 240 and a partial area of the second housing 220.
  • the rear of the electronic device 101 includes a first rear cover 280, a partial area of the first housing 210 adjacent to the first rear cover 280, a second rear cover 290, and a second rear cover ( It may include a portion of the second housing 220 adjacent to 290).
  • the display 240 may refer to a display in which at least some areas can be transformed into a flat or curved surface.
  • the display 240 includes a folding area 243 and a first display area disposed on one side of the folding area 243 (e.g., the left side of the folding area 243 shown in FIG. 2). 241 and a second display area 242 disposed on the other side (e.g., the right side of the folding area 243 shown in FIG. 2).
  • the division of the areas of the display 240 is illustrative, and the display 240 may be divided into a plurality of areas (for example, four or more or two) depending on the structure or function.
  • the area of the display 240 may be divided by the folding area 243 or the folding axis (A axis) extending parallel to the Y axis, but in one embodiment, the display 240 may be divided into regions based on different folding regions (eg, folding regions parallel to the X-axis) or different folding axes (eg, folding axes parallel to the X-axis).
  • the display 240 is combined with a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of touch, and/or a digitizer (not shown) configured to detect a magnetic field-type stylus pen. It can be placed or placed adjacent to it.
  • the first display area 241 and the second display area 242 may have an overall symmetrical shape with the folding area 243 as the center.
  • the second display area 242 unlike the first display area 241, may include a notch cut according to the presence of the sensor area 224.
  • other areas may have a symmetrical shape with the first display area 241.
  • the first display area 241 and the second display area 242 may include a portion having a symmetrical shape and a portion having an asymmetrical shape.
  • the operation and display of the first housing 210 and the second housing 220 according to the state (e.g., flat state, or unfolded state) and folded state of the electronic device 101 ( 240) explains each area.
  • the first housing 210 and the second housing 220 form an angle of substantially 180 degrees and the first housing 210 and the second housing 220 form an angle of substantially 180 degrees.
  • the display area 241 and the second display area 242 may be arranged to face substantially the same direction.
  • the surface of the first display area 241 and the surface of the second display area 242 form an angle of 180 degrees to each other and may face the same direction (eg, the front direction of the electronic device).
  • the folding area 243 may form substantially the same plane as the first display area 241 and the second display area 242 .
  • the first housing 210 and the second housing 220 may be disposed to face each other.
  • the surface of the first display area 241 and the surface of the second display area 242 of the display 240 form a narrow angle (eg, between 0 degrees and 10 degrees) and may substantially face each other.
  • At least a portion of the folding area 243 may be formed as a curved surface with a predetermined curvature.
  • the first housing 210 and the second housing 220 are at a certain angle to each other. can be placed.
  • the surface of the first display area 241 and the surface of the second display area 242 of the display 240 may form an angle that is larger than in the folded state and smaller than in the unfolded state.
  • At least a portion of the folding area 243 may be made of a curved surface with a predetermined curvature, and the curvature at this time may be smaller than that in the folded state.
  • Figure 4 is an exploded perspective view of an electronic device, according to an embodiment disclosed in this document.
  • the electronic device 101 of FIG. 4 may be referred to as the electronic device 101 of FIG. 1 and/or the electronic device 101 of FIGS. 2 and 3 .
  • the configuration of the housing 201 and/or the display 240 in FIG. 4 may be identical in whole or in part to the configuration of the housing 201 and/or the display 240 in FIGS. 2 and 3, respectively.
  • electronic device 101 may include a housing 201, a display 240, a hinge module 202, a battery 250, and/or a substrate assembly 260. .
  • the housing 201 includes a first housing 210 (e.g., the first housing 210 in FIGS. 2 and 3) and a second housing 220 (e.g., the first housing 210 in FIGS. 2 and 3).
  • 2 housing 220 e.g., the first housing 210 in FIGS. 2 and 3
  • a hinge cover 230 e.g., the hinge cover 230 in FIG. 3
  • a first rear cover 280 e.g., the first rear cover 280 in FIG. 3
  • It may include a rear cover 290 (e.g., the second rear cover 290 in FIG. 3).
  • a hinge module 202 is disposed inside the housing 201 to provide a folding axis (e.g., the folding axis A in FIG. 1) to connect the first housing 210 and the second housing 220. can be connected rotatably.
  • the first housing 210 and the second housing 220 may be assembled to each other to be coupled to both sides of the hinge module 202.
  • the first housing 210 has a first support area capable of supporting components of the electronic device 101 (e.g., the first circuit board 262 and/or the first battery 252).
  • 212 eg, a first support plate or a first support member
  • the first side wall 211 may include the first side of the electronic device 101 (eg, the first side 211a of FIG. 2).
  • the second housing 220 has a second support area capable of supporting components of the electronic device 101 (e.g., the second circuit board 264 and/or the second battery 254).
  • 222 e.g, a second support plate or a second support member
  • the second side wall 221 may include the second side of the electronic device 101 (eg, the second side 221a of FIG. 3).
  • the display 240 includes a first display area 241 (e.g., the first display area 241 in FIG. 2) and a second display area 242 (e.g., the second display area in FIG. 2). (242)), a folding area 243 (e.g., the folding area 243 in FIG. 2), and/or a sub-display 244.
  • the sub-display 244 may display the screen in a different direction from the display areas 241 and 242.
  • the sub-display 244 may output a screen in a direction opposite to the first display area 241.
  • the sub-display 244 may be disposed on the first rear cover 280.
  • the battery 250 may include a first battery 252 disposed in the first housing 210 and a second battery 254 disposed in the second housing 220.
  • the first battery 252 may be disposed on the first circuit board 262
  • the second battery 254 may be disposed on the second circuit board 264.
  • the substrate assembly 260 may include a first circuit board 262 disposed within the first housing 210 and a second circuit board 264 disposed within the second housing 220. .
  • the board assembly 260 may include at least one flexible printed circuit board 270 for electrically connecting the first circuit board 262 and the second circuit board 264. .
  • at least a portion of the flexible printed circuit board 270 may be disposed across the hinge module 202.
  • the first circuit board 262 and the second circuit board 264 include a first housing 210, a second housing 220, a first rear cover 280, and a second rear cover. It can be placed inside the space formed by (290).
  • components for implementing various functions of the electronic device 101 may be disposed on the first circuit board 262 and the second circuit board 264.
  • the electronic device 101 may include a speaker module 208 (eg, the audio module 170 of FIG. 1).
  • the speaker module 208 can convert electrical signals into sound.
  • the speaker module 208 is disposed inside the space formed by the first housing 210, the second housing 220, the first rear cover 280, and the second rear cover 290. It can be.
  • an electronic device may include three or more housings, and 'a pair of housings' in the embodiments disclosed below means 'two of the three or more housings rotatably coupled to each other. It can mean ‘housing’.
  • the electronic device 101 disclosed in FIGS. 2 to 4 is illustrated as having the appearance of a foldable electronic device, but is not limited thereto.
  • the electronic device may be a bar type, plate type, or rollable electronic device.
  • a 'rollable electronic device' refers to a display (e.g., display 240 in FIG. 4) capable of bending and deforming, at least partially wound or rolled, or housing (e.g., display 240 in FIG. 2). It may refer to an electronic device that can be stored inside the housing 201).
  • the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of the display to the outside.
  • FIGS. 5 to 17 we will look at the specific configuration of a flexible printed circuit board according to various embodiments.
  • the electronic device 101 of the above-described embodiment may be referred to, and similar or identical components to the preceding embodiments are given the same reference numerals or omitted, and the detailed description thereof It may also be omitted.
  • Figure 5 is a perspective view of a flexible printed circuit board of an electronic device according to an embodiment disclosed in this document.
  • Figure 6 is a plan view of a flexible printed circuit board according to an embodiment disclosed in this document.
  • FIG. 7 is a cross-sectional view of the flexible printed circuit board taken along line A-A' in FIG. 6.
  • FIG. 8 is a cross-sectional view of the flexible printed circuit board taken along line B-B' in FIG. 6.
  • FIG. 9 is a cross-sectional view of the flexible printed circuit board taken along line C-C' in FIG. 6.
  • Figure 10 is a partial enlarged view of Figure 9.
  • the configuration of the flexible printed circuit board 270 of FIGS. 5 to 10 may be the same or similar in whole or in part to the configuration of the flexible printed circuit board 270 of FIG. 4 .
  • one or more flexible printed circuit boards 270 may be provided inside an electronic device (e.g., the electronic device 101 of FIGS. 2 to 4). You can.
  • the flexible printed circuit board 270 may include a flexible and/or rigid flex circuit board.
  • the flexible printed circuit board 270 may be in the form of a strip extending between both ends (eg, both ends in the X-axis direction).
  • the longitudinal direction of the flexible printed circuit board 270 is an extension of the signal wires (e.g., the first signal wire 12 and the second signal wire 22) mounted on the flexible printed circuit board 270. It may be substantially the same or similar to the direction.
  • the flexible printed circuit board 270 may be at least partially curved depending on the path or structure along which the printed circuit board 270 is mounted or wired in an electronic device.
  • the flexible printed circuit board 270 includes a seating portion 271, a first portion 272 extending from both ends of the seating portion 271, and a second portion, respectively. It may include two parts 273, at least one fixing member 276, and/or at least one connector 278.
  • the first part 272 and the second part 273 may be separated by a dotted line shown in FIG. 5 for convenience.
  • the seating portion 271, the first portion 272, and/or the second portion 273 are configured to operate (e.g., fold) an electronic device (e.g., the electronic device 101 of FIGS. 2 to 4). , sliding) and may be at least partially deformed (e.g., bending deformation).
  • the seating portion 271 bends and deforms based on the operation of the electronic device (e.g., the electronic device 101 of FIGS. 2 to 4) compared to the first portion 272 and the second portion 273.
  • the resulting displacement or bending curvature may be larger.
  • the flexible printed circuit board 270 is configured to cross the hinge module (e.g., the hinge module 202 of FIG. 4) and the first housing (e.g., the first housing 210 of FIGS. 2 to 4). ) and a second housing (e.g., the second housing 220 of FIGS. 2 to 4).
  • the hinge module e.g., the hinge module 202 of FIG. 4
  • the first housing e.g., the first housing 210 of FIGS. 2 to 4
  • a second housing e.g., the second housing 220 of FIGS. 2 to 4
  • at least a portion of the seating portion 271 may be seated on a hinge cover (eg, the hinge cover 230 in FIG. 3).
  • the seating portion 271 may be bent and deformed based on a folding operation of the electronic device or rotation of a hinge module (eg, the hinge module 202 in FIG. 4).
  • the flexible printed circuit board 270 of FIG. 5 may represent a state when the electronic device 101 is in an unfolded state (eg, FIG. 2 ).
  • the seating portion 271 may form an alphabet 'U' shape when the electronic device is in an unfolded state (eg, FIG. 2 ).
  • the flexible printed circuit board 270 can be applied to electronic devices of various shapes in addition to electronic devices including foldable displays (e.g., the displays 240 of FIGS. 2 to 4).
  • the flexible printed circuit board 270 may be at least a portion of a display (e.g., display 240 of Figure 4) wound or rolled or a housing (e.g., housing 201 of Figures 2-4). ) can be applied to an electronic device that can be stored inside.
  • a display e.g., display 240 of Figure 4
  • a housing e.g., housing 201 of Figures 2-4.
  • the seating portion 271 may include a first seating area 271a and a second seating area 271b extending from both sides of the first seating area 271a.
  • the first seating area 271a may substantially face at least a portion of the hinge cover (eg, the hinge cover 230 of FIG. 3).
  • the second seating area 271b is located on both sides (e.g., both sides of the hinge module 202 in the width direction or X-axis direction) of the hinge module (e.g., the hinge module 202 in FIG. 4). can be placed.
  • the second seating area 271b may have a greater range of curvature or displacement in bending deformation than the first seating area 271a.
  • the second seating area 271b may be bent in a range of 0 degrees to about 100 degrees.
  • a relatively greater internal stress may act on the second seating area 271b.
  • the first portion 272 extends from the seating portion 271 to cross the first side wall (e.g., first side wall 211 of FIGS. 2 and 3) and at least a portion of the first portion 272 extends from the seating portion 271 to cross the first side wall (e.g., first side wall 211 of FIGS. 2 and 3) and at least a portion of the first portion 272 extends from the seating portion 271 to cross the first side wall (e.g., first side wall 211 of FIGS. 2 and 3) : Can be placed in the first housing 210 of FIGS. 2 to 4).
  • the second portion 273 extends from the seating portion 271 to cross the second side wall (e.g., the second side wall 221 in FIGS.
  • At least a portion of the first portion 272 is disposed between a support plate (e.g., first support area 212 in Figure 4) and a display (e.g., display 240 in Figures 2-4). It can be.
  • at least a portion of the second portion 273 may be disposed between a support plate (e.g., second support area 222) and a display (e.g., display 240 of FIGS. 2 to 4). .
  • At least one fixing member 276 may be disposed in one area of the first part 272 and/or the second part 273.
  • the fixing member 276 may include a pair of plate members coupled to face each other with the first part 272 or the second part 273 interposed therebetween.
  • the fixing member 276 may be provided in the first part 272 and the second part 273, respectively.
  • each fixing member 276 may be coupled to one area of the support plate (eg, the first support area 212 or the second support area 222 in FIG. 4).
  • each fixing member 276 may include at least one fastening hole disposed outside the first part 272 or the second part 273.
  • each fixing member 276 is connected to the first support area 212 or the first support area 212 through an adhesive member (eg, adhesive or double-sided tape) or a fastening member (eg, fixing screw) disposed in the fastening hole. 2 may be coupled to one area of the support area 222. For example, at least a portion of the area overlapping with the fixing member 276 of the first part 272 and/or the second part 273 is the remainder of the first part 272 and/or the second part 273. It may have relatively low ductility compared to the area.
  • an adhesive member eg, adhesive or double-sided tape
  • a fastening member eg, fixing screw
  • connector 278 may be disposed in first portion 272 and/or second portion 273.
  • the fixing member 276 may be provided on one side of the first part 272 or the second part 273.
  • each connector 278 may be disposed within the first housing 210 or the second housing 220 and may be disposed on a circuit board (e.g., the first circuit board 262 or the second circuit board of FIG. 4). 284)) can be combined.
  • the connector 278 may include a plurality of connectors 278 coupled to the first circuit board 262 and the second circuit board 284.
  • the flexible printed circuit board 270 includes a first substrate structure 10, a second substrate structure 20, and the first substrate structure 10 and the second substrate structure. It may include shielding layers 60 and 70 respectively stacked on the two substrate structures 20. In one embodiment, the flexible printed circuit board 270 includes an upper substrate structure 30 disposed above the first substrate structure 10 and a lower substrate structure 40 disposed below the second substrate structure 20. ) may further be included. In one embodiment, flexible printed circuit board 270 includes a first shielding layer 60 disposed on a surface of first substrate structure 10 and top substrate structure 30, a second substrate structure 20, and It may include a second shielding layer 70 disposed on the surface of the lower substrate structure 40. In this document, the shielding layers 60 and 70 are understood as components included in the first substrate structure 10, the second substrate structure 20, the upper substrate structure 30 and/or the lower substrate structure 40. It could be.
  • the first substrate structure 10 may include a first base layer 11, a first signal wire 12, and/or a first insulating layer 13.
  • different layers of the first substrate structure 10 may be sequentially stacked in a first direction (eg, +Z direction) from the first base layer 11 including the substrate.
  • the second substrate structure 20 may include a second base layer 21, a second signal line 22, and/or a second insulating layer 23.
  • one side of the second base layer 21 faces the first base layer 11, and a second signal wire 22 may be disposed on a side opposite to the one side.
  • the layers of the upper substrate structure 30 may be sequentially stacked from the second base layer 21 including the substrate in a second direction (eg, -Z direction) that is opposite to the first direction.
  • the first substrate structure 10 and the second substrate structure 20 may be spaced apart from each other at a predetermined distance.
  • an air gap 52 may be formed between the first substrate structure 10 and the second substrate structure 20.
  • the first substrate structure 10 and the second substrate structure 20 may be at least partially symmetrical in shape.
  • the upper substrate structure 30 and/or the lower substrate structure 40 may be formed in the 1-1 portion 272a and/or the 2-1 portion 273a.
  • the 1-1 part 272a and/or the 2-1 part 273a may be a part of the first part 272 or the second part 273 where the fixing member 276 is disposed.
  • the first substrate structure 10 and the second substrate structure 20 may form an intermediate stacked structure.
  • the upper substrate structure 30 may be disposed on the first substrate structure 10
  • the lower substrate structure 40 may be opposed to the lower portion of the second substrate structure 20 .
  • the upper substrate structure 30 may include a third base layer 31, a third signal line 32, and/or a third insulating layer 33.
  • the layers of the upper substrate structure 30 may be sequentially stacked in a first direction (eg, +Z direction) from the third base layer 31 including the substrate.
  • the upper substrate structure 30 may have a stacked structure that is at least partially the same or similar to the first substrate structure 10 .
  • the lower substrate structure 40 may include a fourth base layer 41 and a fourth signal wire 42.
  • the shielding layers 60 and 70 may cover the surface of the upper substrate structure 30 or the lower substrate structure 40, respectively.
  • the upper substrate structure 30 and/or lower substrate structure 40 may at least partially overlap the first substrate structure 10 of first portion 272 and/or second portion 273. You can.
  • the upper substrate structure 30 and/or the lower substrate structure 40 disposed in the 1-1 portion 272a of the first portion 272 are disposed on both sides (e.g., both sides in the X-axis direction).
  • the first portion 272 disposed may at least partially overlap with the first substrate structure 10 and/or the second substrate structure 20 about one axis (e.g., stacking direction or Z-axis direction). .
  • the upper substrate structure 30 and/or the lower substrate structure 40 disposed in the 2-1 portion 273a of the second portion 273 are disposed on both sides (e.g., both sides in the X-axis direction).
  • the second portion 273 may at least partially overlap with the first substrate structure 10 and/or the second substrate structure 20 about one axis (e.g., stacking direction or Z-axis direction).
  • at least some of the plurality of layers of the first substrate structure 10 and/or the second substrate structure 20 are at least in the region between the upper substrate structure 30 and the lower substrate structure 40. It may be partially omitted.
  • the first insulating layer 13 of the first substrate structure 10 and/or the second insulating layer 23 of the second substrate structure 20 is connected to the upper substrate. At least a portion (eg, a middle region) that overlaps the structure 30 and the lower substrate structure 40 with respect to one axis (eg, the stacking direction or the Z-axis direction) may be omitted. However, unlike the above, some layers of the first substrate structure 10 and/or the second substrate structure 20 disposed between the upper substrate structure 30 and the lower substrate structure 40 may not be omitted. , for example, some omitted layers and/or regions may be changed. In one embodiment, the upper substrate structure 30 and the lower substrate structure 40 may be spaced apart at a predetermined distance.
  • the separation distance between the upper substrate structure 30 and the lower substrate structure 40 may be greater than the separation distance between the first substrate structure 10 and the second substrate structure 20.
  • an intermediate layer 53 may be disposed between the upper and lower substrate structures 30 and 40 that are spaced apart from each other.
  • the intermediate layer 53 may be disposed between the upper substrate structure 30 and the first signal line layer 12.
  • the intermediate layer 53 may be disposed between the lower substrate structure 40 and the second signal interconnection layer 22.
  • intermediate layer 53 may include an insulating and/or adhesive material.
  • the intermediate layer 53 may include a molding agent including glass (eg, prepreg).
  • the insulating layer 53 may provide rigidity to the overlapping substrate structures 10, 20, 30, and 40 based on one axis (e.g., stacking direction or Z-axis direction). .
  • base layers 11 and 21 may include a flexible substrate.
  • the substrate may include, for example, an insulating film (eg, polyimide film).
  • the signal lines 12 and 22 may include a plurality of signal lines 12a, 12b, and 22a formed on one side of the base layers 11 and 21.
  • the signal lines 12a, 12b, and 22a may be conductors or printed circuit patterns for grounding, transmitting data signals, or transmitting charging power.
  • the signal lines 12a, 12b, and 22a are formed by a plate in which a metal (e.g., copper) thin film is laminated on one side of the base layer (11, 21) (e.g., a flexible copper clad laminate, It can be formed by processing FCCL)).
  • a metal e.g., copper
  • the thickness of the base layers 11 and 21 may be about 8 ⁇ m to 100 ⁇ m.
  • the thickness of the signal wires 12 and 22 may be about 4 ⁇ m to 30 ⁇ m.
  • the thickness of the base layers 11 and 21 may be about 12 ⁇ m
  • the average thickness of the signal lines 12 and 22 may be about 12 ⁇ m, for example.
  • the first signal line 12 may include a plurality of signal lines 12a and 12b disposed on one side of the base layer.
  • the plurality of signal lines 12a and 12b may include a first signal line 12a for transmitting analog signals and/or digital signals and a second signal line 12b for transmitting charging power. there is.
  • at least a portion of the first signal line 12a may provide high-speed data communication.
  • the first signal line 12a is connected to a processor (e.g., processor 120), a serial interface (e.g., interface 177), and a display module (e.g., display module 160 of FIG. 1, FIG. 2 to FIG. 4), a camera module (e.g., camera module 180 in FIG.
  • the first signal line 12a supports a serial display interface (e.g., display serial interface, DSI), a serial camera interface (e.g., camera serial interface, DSI), and/or PCI Express (e.g., PCIe Gen2). You can.
  • the first signal line 12a may include a differential impedance signal line, for example, the impedance of the first signal line 12a may be from 80 ohms to about 100 ohms. there is.
  • the impedance of the first signal line 12a may be approximately 100 ohms.
  • the width of the first signal line 12a (eg, width w1 in FIG. 10) may be about 40 ⁇ m to 80 ⁇ m. In one embodiment, the width w1 of the first signal line 12a may be about 60 ⁇ m.
  • the type, width, and impedance of the signal lines 12a and 12b are not limited to the above.
  • the first signal line 12a may include a single impedance signal line.
  • the description of the signal lines 12a and 12b described above may be applied in the same or similar manner to the third signal line 22a of the second signal line 22.
  • the insulating layers 13 and 23 may be disposed between the shielding layers 60 and 70 and the signal wires 12 and 22.
  • the insulating layers 13 and 23 may be laminated to the signal lines 12 and 22, surrounding the signal lines 12a, 12b, and 22a to provide a protective coating.
  • the insulating layers 13 and 23 may include insulating adhesive layers 13a and 23a and insulating film layers 13b and 23b.
  • the insulating film layers 13a and 23a may be coupled to the signal wires 12 and 22 through the insulating adhesive layers 13a and 23a.
  • the insulating adhesive layers 13a and 23a may be formed by applying an adhesive material and may fill the space between the continuous signal lines 12a, 12b and 22a.
  • the insulating film layers 13b and 23b may include a coverlay film.
  • the description of the above-described insulating layers 13 and 23 may be applied in the same or similar manner to the third insulating layer 33.
  • the distance (distance in the thickness direction or Z-axis direction of the flexible printed circuit board 270) may be referred to as the first designated distance h1.
  • the first specified distance h1 can be shortened by reducing the thickness of the first insulating layer 13, especially the first insulating adhesive layer 13a.
  • the first designated distance h1 decreases, the overall thickness of the flexible printed circuit board 270 decreases, so the range of motion or flexibility during bending deformation of the flexible printed circuit board 270 may be improved, Bending curvature may increase.
  • the impedance of the signal line (eg, first signal line 12a) of the first signal wire 12 may decrease.
  • a decrease in impedance due to a decrease in the first designated distance h1 can be compensated for by reducing the drift rate of the first shielding layer 60.
  • the first shielding layer 60 is opened (e.g., through hole 60a)
  • parasitic effects between the first shielding layer 60 and the signal line (e.g., first signal line 12a) may occur.
  • Capacitance may decrease and the impedance of the signal line may increase.
  • the above-described description of the first insulating layer 13 may be applied to the second insulating layer 23 in the same or similar manner.
  • the minimum thickness of the first insulating adhesive layer 13a is one side of the first signal wire 12 (+Z direction side) and one side of the first shielding layer 60 (-Z direction side) facing each other. It can be the distance between sides).
  • the maximum thickness of the first insulating adhesive layer 13a is one side of the first base layer 11 (+Z direction side) and one side of the first shielding layer 60 (-Z direction side) facing each other. It can be the distance between sides).
  • the thickness of the first insulating film layer 13b may be about 5 ⁇ m to about 50 ⁇ m.
  • the maximum thickness of the first insulating adhesive layer 13a may be less than about 50 ⁇ m.
  • the minimum thickness of the first insulating adhesive layer 13a may be less than the thickness of the first insulating film layer 13b.
  • the minimum thickness of the first insulating adhesive layer 13a may be 8 ⁇ m, and the thickness of the first insulating film layer 13b may be about 12.5 ⁇ m.
  • the average thickness of the first insulating adhesive layer 13a may be similar to the average thickness of the first insulating film layer 13b.
  • shielding layers 60 and 70 may be laminated to insulating layers 13 and 23.
  • the shielding layers 60 and 70 may shield the signal lines 12a, 12b, and 22a from electronic components around the flexible printed circuit board 270.
  • the shielding layers 60 and 70 may be provided in the form of thin films having a thickness of about 7 ⁇ m to about 20 ⁇ m. In one embodiment, the thickness of the shielding layers 60, 70 may be approximately 16 ⁇ m.
  • the shielding layers 60 and 70 may include a base layer 61, protective layers 62 and 63, and a resin adhesive layer 64.
  • the base layer 61 may be a base film member with protective layers 62 and 63 formed on one side.
  • the base layer 61 may include polyethylene terephthalate (PET).
  • PET polyethylene terephthalate
  • the thickness of the substrate layer 61 may be about 1 ⁇ m to about 10 ⁇ m.
  • the protective layers 62 and 63 may be disposed between the substrate layer 61 and the resin adhesive layer 64.
  • the protective layers 62 and 63 may be made of a layer of an electrically conductive material laminated on one side of the base layer 61.
  • the protective layers 62 and 63 may be copper foil or a deposited layer made of various conductive materials such as copper (Cu), gold (Au), silver (Ag), tin (sn), or alloys thereof. You can.
  • the protective layers 62 and 63 may be made of a combination of a thin copper plate and a vapor deposition layer.
  • the protective layers 62 and 63 are laminated with a first protective layer 62 laminated on one side of the base layer 61, and a laminated layer on the first protective layer 62 and resin-bonded on one side.
  • the layer 64 may include a laminated second protective layer 63 .
  • the second protective layer 63 may include a shielding material such as carbon black, black paste, or black ink.
  • the thickness of the first protective layer 62 may be greater than the thickness of the second protective layer 63.
  • the total thickness of the protective layers 62 and 63 may be from about 2 ⁇ m to about 8 ⁇ m.
  • the resin adhesive layer 64 may be formed on one side of the protective layers 62 and 63.
  • the resin adhesive layer 64 may include a conductive material (eg, conductive powder) and a resin adhesive (eg, thermoplastic resin adhesive).
  • the thermoplastic resin adhesive may include epoxy resin or polyester resin.
  • the resin adhesive layer 64 may be anisotropic conductive.
  • the resin adhesive layer 64 may include a conductive material, thereby electrically connecting the protective layers 62 and 63 disposed thereon to the ground region of the flexible printed circuit board 270.
  • the insulating layers 13 and 23 may be disposed between the signal wires 12 and 22 and the resin adhesive layers 64 to prevent direct contact between the two layers. For example, an electrical short circuit between the signal lines of the signal wires 12 and 22 and the resin adhesive layer 64 can be prevented by the insulating layers 13 and 23.
  • the thickness of the resin adhesive layer 64 may be about 3 ⁇ m to about 7 ⁇ m.
  • the first shielding layer 60 may include a plurality of through holes 60a.
  • the through hole 60a is in the seating portion 271 and/or a portion of the first portion 272 and the second portion 273 of the flexible printed circuit board 270. can be formed.
  • the through hole 60a may not be formed in the second seating area 271b of the seating portion 271.
  • the through hole 60a includes a first seating area 271a of the seating area 271, a second seating area 271b on both sides of the first seating area 271a, and a first portion ( 272) may be formed between the 1-1 part 272a or the 2-1 part 273a, respectively.
  • the through hole 60a may be formed through the first shielding layer 60 in one direction (eg, the thickness direction or Z-axis direction of the flexible printed circuit board 270).
  • the through hole 60a may be formed extending from one side of the first shielding layer 60 facing the outside of the flexible printed circuit board 270 to the other side facing the first insulating layer 13. there is.
  • the through hole 60a may be hollow and cylindrical.
  • the through hole 60a may have an inclined or tapered side.
  • the through hole 60a may be formed after stacking the first shielding layer 60 on the first insulating layer 13.
  • the through hole 60a can be formed by drilling the first shielding layer 60 with a laser drill.
  • the through hole 60a may be formed at a location corresponding to at least one first signal line 12a.
  • each through hole 60a may be aligned with or overlap the first signal line 12a along one axis (eg, the thickness direction or Z-axis direction of the flexible printed circuit board 270).
  • the through hole 60a may not be aligned with or overlap the second signal line 12b.
  • 9 and 10 may be an example of forming a through hole 60a corresponding to a differential impedance signal line, but the through hole 60a may also be applied to a single impedance signal line.
  • the impedance of the signal line may increase.
  • the impedance of the first signal line 12a may increase by about 15 ohms.
  • the impedance of the first signal line 12a can be set to a target impedance that achieves impedance matching.
  • FIG. 11 is a diagram showing a portion of a first base layer, a first signal wire, and a first shielding layer according to an embodiment disclosed in this document.
  • 12 is a diagram for explaining a through hole according to an embodiment disclosed in this document.
  • Figure 13 is a diagram for explaining a through hole according to an embodiment disclosed in this document.
  • Figure 14 is a diagram for explaining a through hole according to an embodiment disclosed in this document.
  • FIG. 15 is a diagram showing a portion of a first base layer, a first signal wire, and a first shielding layer according to an embodiment disclosed in this document.
  • the first base layer 11, the first signal wire 12, and the first shielding layer 60 of FIGS. 13 to 15 are the first base layer of the flexible printed circuit board 270 of FIGS. 5 to 7 ( 11), the first signal wire 12, and the first shielding layer 60. 11 and 15, the resin adhesive layer 64 of the first shielding layer 60 may be omitted. 12 to 14, illustration of the first insulating layer 13 may be omitted.
  • adjacent through holes 60a may be formed along the extension direction (eg, X-axis direction) of the first signal line 12a.
  • a plurality of through holes 60a may be formed at predetermined intervals in the extending direction of the first signal line 12a.
  • the through hole 60a may be formed along a signal wire having a curved section.
  • the through hole 60a may not be aligned with or overlap the second signal line 12b for transmitting charging power.
  • an area in the first shielding layer 60 where the through hole 60a is not formed may have greater electromagnetic shielding performance than an area where the through hole 60a is formed.
  • the first signal line 12a may include a pair of first signal lines 12a (eg, differential impedance signal lines) extending parallel to each other.
  • first signal lines 12a eg, differential impedance signal lines
  • the through hole 60a formed in the two first signal lines 12a parallel to each other is formed in the width direction (Y-axis direction) of the first signal line 12a. can be aligned with each other.
  • the through holes 60a formed in the two first signal lines 12a parallel to each other are aligned with each other in the width direction (Y-axis direction) of the first signal lines 12a. It may be formed misaligned or misaligned.
  • one through hole 60a may be formed to correspond to a plurality of first signal lines 12a.
  • the through hole 60a may be a long hole or slot.
  • the through hole 60a penetrates the first shielding layer 60 in the thickness direction (Z-axis direction) of the flexible printed circuit board 270 and penetrates the first signal line 12a in the width direction (Y-axis direction). direction) can be extended.
  • each through hole 60a is connected to a pair of first signal lines 12a extending parallel to each other along one axis (e.g., the thickness direction or Z-axis direction of the flexible printed circuit board 270). Can be aligned or nested.
  • the through hole 60a may be arranged to cross the pair of first signal lines 12a.
  • adjacent through holes 60a may be formed along the extension direction (eg, X-axis direction) of the first signal line 12a.
  • the plurality of through holes 60a may be spaced apart at predetermined intervals in the direction in which the first signal line 12a extends.
  • the through holes 60a formed in the two first signal lines 12a parallel to each other may be aligned with each other in the width direction (Y-axis direction) of the first signal lines 12a.
  • the through holes 60a formed in the two first signal lines 12a parallel to each other are not aligned with each other in the width direction (Y-axis direction) of the first signal lines 12a but are misaligned. can be formed.
  • the flexible printed circuit board 270 of FIGS. 5 to 10 includes at least one of the embodiments of the through hole 60a described above with reference to FIGS. 11 to 12, 13, 14, or 15. One may apply.
  • the first shielding layer 60 may be formed using the first protective layer 62 in which the through hole 60a is previously formed.
  • the second protective layer 63 may be laminated on one side of the first protective layer 62 where the through hole 60a is formed.
  • the first shielding layer 60 can be laminated on the first insulating layer 13 through the resin adhesive layer 61 disposed on the other side of the first protective layer 62.
  • the first protective layer 62 without the through hole 60a may be disposed in an area where the first signal line 12a is not disposed.
  • FIG. 16 is a diagram of a flexible printed circuit according to one embodiment disclosed herein.
  • FIG. 17 is a cross-sectional view taken along line D-D' of FIG. 16.
  • the configuration of the first base layer 11, the first signal wire 12, and the first shielding layer 60 in FIG. 17 is similar to the first base layer 11 of the flexible printed circuit board 270 in FIGS. 5 to 7. ), all or part of the configuration of the first signal wire 12 and the first shielding layer 60 may be the same.
  • the configuration of the through hole 60a in FIGS. 16 and 17 may be completely or partially the same as the configuration of the through hole 60a in FIGS. 7 to 15 .
  • the flexible printed circuit board 370 of FIG. 16 can be applied to electronic devices of various shapes, including, for example, bar-type electronic devices.
  • the flexible printed circuit board 370 of FIG. 16 may include a laminate structure that is partially different from the flexible printed circuit board 370 described above with reference to FIGS. 5 to 9 .
  • the flexible printed circuit board 370 of Figure 16 includes a single base layer (e.g., first base layer 11) and an air gap (e.g., air gap 52 of Figures 7-9). )) may not be included.
  • the flexible printed circuit board 370 has a first base layer 11, and is disposed on one side of the first base layer 11 in one direction (eg, +Z direction). It may include a first signal wire 12, a first insulating layer 13, and/or a first shielding layer 60 that are sequentially stacked.
  • the first base layer 11 includes a second signal wire 22 sequentially stacked on a surface opposite to the one surface in a second direction (e.g., -Z direction) opposite to the one direction, It may include two insulating layers 23 and/or a second shielding layer 70.
  • the insulating layers 13 and 23 may include insulating adhesive layers 13a and 13b and insulating film layers 13b and 23b, respectively.
  • the through hole 60a is connected to the first signal wire 12 of the first signal wire 12 (e.g., the first signal wire 12 of FIGS. 9 to 15) and one axis (e.g., flexible They may be aligned or overlapped in the thickness direction or Z axis of the printed circuit board 370.
  • first signal wire 12 of the first signal wire 12 e.g., the first signal wire 12 of FIGS. 9 to 15
  • one axis e.g., flexible They may be aligned or overlapped in the thickness direction or Z axis of the printed circuit board 370.
  • FIGS. 16 and 17 may be applied to the embodiments shown in FIGS. 5 to 10, 11 to 12, 13, 14, or 15, or a combination thereof.
  • the through hole 60a shown in FIGS. 16 and 17 may be a through hole 60a according to the embodiment shown in FIGS. 12, 13, 14, and/or 15.
  • 18 is a flow chart of a method of manufacturing a flexible printed circuit according to an embodiment disclosed in this document.
  • the configuration of the flexible printed circuit board in operation S10 of FIG. 18 may be the same in whole or in part as the configuration of the flexible printed circuit board 270 of FIGS. 4 to 8 and/or the printed circuit board 370 of FIG. 16. there is.
  • a method of manufacturing a flexible printed circuit may include providing a flexible printed circuit board (S10).
  • the manufacturing method includes adding a shielding layer (e.g., the first insulating layer 13 in FIGS. 7 to 10 and/or the first insulating layer 13 in FIG. 17) to the insulating layer (e.g., the first insulating layer 13 in FIGS. 7 to 10 and/or the first insulating layer 13 in FIG. 17).
  • An operation S20 of stacking the first shielding layer 60 of FIGS. 7 to 10 and FIG. 12 and/or the first shielding layer 60 of FIG. 17 may be included.
  • the manufacturing method includes forming a through hole in the shielding layer (e.g., the first shielding layer 60 in FIGS. 7 to 10 and FIG. 12 and/or the first shielding layer 60 in FIG. 17). It may include an operation S30 of forming (e.g., the through hole 60a of FIGS. 7 to 14 and/or the through hole 60a of FIGS. 16 and 17).
  • the connector and flexible printed circuit board according to the embodiments disclosed in this document can be applied to various electronic devices, where the form and type of the electronic device are not limited.
  • the flexible printed circuit board according to an embodiment disclosed in this document is used for foldable type electronic devices (e.g., smartphones), as well as slideable and bar type electronic devices. may be provided to the device.
  • 'electronic devices' in this document include home appliances, mobile communication terminals (e.g. smartphones), tablet PCs, video/audio devices, computer devices (e.g. desktop/laptop computers), portable medical devices, and vehicle navigation devices. and/or may include a wearable device, and may refer to a device that performs a specific function according to a loaded program.
  • electronic devices according to embodiments of this document are not limited to the above-described devices.
  • the mounting space in which the flexible printed circuit board is embedded may also become smaller.
  • the flexible printed circuit board can be bent and deformed to form a curved shape of smaller curvature based on the deformation motion of the electronic device. Accordingly, the fatigue degree applied to the flexible printed circuit board may further increase due to repeated deformation operations of the electronic device, and the bending life performance required for the flexible printed circuit board may not be secured. If the thickness of the flexible printed circuit board is reduced to ensure flexibility, the bending life performance can be improved. However, the bending life performance and communication performance of a flexible printed circuit board may have a trade-off relationship.
  • the impedance of the signal line of the flexible printed circuit board may decrease due to the reduction in thickness and may deviate from the target impedance value for impedance matching. Accordingly, communication performance of the flexible printed circuit board, including signal integrity, may be deteriorated.
  • bending life performance is improved by securing flexibility by reducing the thickness of the signal line of the flexible printed circuit board, but by forming an opening in a part of the shielding structure corresponding to the impedance signal line.
  • An electronic device including a flexible printed circuit board that prevents deterioration of signal quality by adjusting the impedance of the signal line and a method of manufacturing the flexible printed circuit board can be provided.
  • the impedance of the signal line is increased to the target impedance by adjusting the aperture ratio of the shielding structure, thereby improving the communication performance of the flexible printed circuit board. It can be secured.
  • the thickness of the adhesive layer of the insulating layer can be minimized to improve the flexibility of the flexible printed circuit board.
  • the through hole is formed in the shielding layer in an area that overlaps the first signal line for data communication, and is not formed in the location that overlaps the second signal line for power transmission. , the impedance of the first signal line can be adjusted, but the electromagnetic shielding performance of the shielding layer for the second signal line can be maintained.
  • the through hole is formed in advance in the shielding layer and then laminated on the insulating layer. It can be formed precisely at a position that aligns with or overlaps the line.
  • An electronic device (e.g., 101 in FIGS. 1 and/or 2 to 4) according to an embodiment disclosed in this document includes a housing (e.g., 210 and 220 in FIGS. 2 to 8) and a device disposed within the housing. It may include a flexible printed circuit board (eg, 270 in FIGS. 4 to 9 or 370 in FIG. 16 ).
  • the flexible printed circuit board includes a base layer (e.g., 11 in FIGS. 7 to 14 and/or 11 in FIG. 17), an insulating layer (e.g., 13 in FIGS. 7 to 10 and/or 13 in FIG. 17), and/ Alternatively, it may include a shielding layer (e.g., 60 in FIGS. 7 to 10, 60 in FIG.
  • the base layer has a first surface facing in a first direction (e.g., +Z direction) and at least one signal line (e.g., 12a of FIGS. 9 to 15, 9 to 13, It may include 12b) of FIG. 15.
  • the insulating layer may be laminated on the first side of the base layer to cover the at least one signal line.
  • the shielding layer is laminated on the insulating layer and may include a plurality of through holes (eg, 60a in FIGS. 7 to 15 and/or 60a in FIGS. 16 and 17).
  • the plurality of through holes may be formed in at least a partial area including an area overlapping with the signal line based on the first direction.
  • the through holes may be spaced apart along the longitudinal direction of the signal line. At least a portion of the insulating layer may be exposed by the plurality of through holes.
  • the insulating layer is an insulating adhesive layer laminated to cover the at least one signal line (e.g., 13a in FIGS. 7 to 10 and/or 23a in FIG. 17) and/or on the insulating adhesive layer. It may include an insulating film layer that is laminated and at least a portion of which is exposed by the through hole (e.g., 13b in FIGS. 7 to 10 and/or 23b in FIG. 17 ).
  • the distance between the signal line and the insulating film layer may be smaller than the thickness of the insulating film layer.
  • the shielding layer may include a plurality of layers.
  • the plurality of through holes may extend to at least some of the plurality of layers of the shielding layer.
  • the shielding layer includes a plurality of layers, and the plurality of through holes may extend throughout the plurality of layers of the shielding layer. For example, at least a portion of the insulating layer may be exposed to the outside of the flexible printed circuit board through the plurality of through holes.
  • the shielding layer includes a resin adhesive layer containing conductive powder (e.g., 61 in FIG. 10), at least one protective layer laminated on the resin adhesive layer and containing a conductive material (e.g., 61 in FIG. 10). 62, 63) and/or a base layer (eg, 64 in FIG. 10) laminated on the protective layer.
  • a resin adhesive layer containing conductive powder e.g., 61 in FIG. 10
  • at least one protective layer laminated on the resin adhesive layer and containing a conductive material e.g., 61 in FIG. 10
  • 62, 63 a base layer laminated on the protective layer.
  • the through hole (eg, through hole 60a of FIG. 15) may be formed through at least one of the protective layers.
  • the plurality of signal lines include a first signal line for high-speed data transmission (e.g., 12a in FIGS. 9 to 15) and/or a second signal line for power transmission (e.g., FIG. 9 to 13 and 12b of FIG. 15).
  • the plurality of through holes may overlap with respect to the first signal line and the first direction. According to one embodiment, the through hole may not overlap the second signal line.
  • at least some of the through holes formed along the pair of signal lines are It can be aligned in the width direction of the signal line.
  • at least some of the through holes formed along the pair of signal lines may be arranged to be offset in the width direction of the signal lines.
  • At least a portion of the through holes are connected to one signal line in the first direction. May overlap.
  • At least a portion of the through holes may overlap a plurality of signal lines in the first direction.
  • the housing may include a first housing (eg, 210 in FIGS. 2 to 4 ) and a second housing (eg, 220 in FIGS. 2 to 4 ).
  • the electronic device includes a hinge module (e.g., 202 in FIG. 4) disposed between the first housing and the second housing and rotatably connecting the second housing to the first housing. More may be included.
  • the flexible printed circuit board is disposed across the hinge module and includes a seating portion (e.g., 271 in FIG. 6) that is at least partially bent and deformed based on rotation of the second housing. It can be included.
  • the seating portion includes a first seating area (e.g., 271a in FIG. 6 ), at least a portion of which faces the hinge module, and/or a second seating area extending from both ends of the first seating area ( Example: It may include 271b) of FIG. 6.
  • the second seating area may be disposed on both sides of the hinge module.
  • the through hole may not be formed in an area of the shielding layer disposed in the second seating area.
  • a method of manufacturing a flexible printed circuit board includes a base including a signal line (e.g., 12a of FIGS. 9 to 15, 12b of FIGS. 9 to 13, and 15) on one side. layer (e.g., 11 in FIGS. 7 to 14 and/or 11 in FIG. 17) and an insulating layer (e.g., 13 in FIGS. 7 to 10 and/or 13 in FIG. 17) laminated on one side of the base layer. It may include an operation (e.g., S10 in FIG. 18) of providing a flexible printed circuit board (e.g., 270 in FIGS. 4 to 9 or 370 in FIG. 16). The manufacturing method may include an operation (e.g., S20 in FIG.
  • the manufacturing method includes forming a through hole (e.g., 60a in FIGS. 7 to 15 and/or 60a in FIGS. 16 and 17) in at least a portion of the shielding layer including a region overlapping with the signal line. (e.g. S30 in FIG. 18).
  • the operation of providing the flexible printed circuit board includes: an insulating adhesive layer surrounding the signal line (e.g., 13a in FIGS. 7 to 10 and/or 23a in FIG. 17) and lamination on the insulating adhesive layer.
  • the method may include forming the insulating layer including an insulating film layer (e.g., 13b in FIGS. 7 to 10 and/or 23b in FIG. 17 ).
  • forming the insulating layer may include forming the distance between the signal line and the insulating film layer to be smaller than the thickness of the insulating film layer.
  • forming the through hole may include forming the through hole by perforating the shielding layer with a laser drill.
  • forming the through hole may include forming a plurality of through holes spaced apart along the length direction of the signal line.
  • providing the flexible printed circuit board includes forming a first signal line (e.g., 12a in FIGS. 9 to 15) for high-speed data communication on the one side of the base layer. can do.
  • forming the through hole may include forming a through hole that overlaps the first signal line.
  • An electronic device may be of various types.
  • Electronic devices may include, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, or home appliances.
  • Electronic devices according to embodiments of this document are not limited to the above-described devices.
  • first, second, or first or second may be used simply to distinguish one component from another, and to refer to that component in other respects (e.g., importance or order) is not limited.
  • One (e.g., first) component is said to be “coupled” or “connected” to another (e.g., second) component, with or without the terms “functionally” or “communicatively.”
  • any of the components can be connected to the other components directly (e.g. wired), wirelessly, or through a third component.
  • module used in one embodiment of this document may include a unit implemented in hardware, software, or firmware, and may be interchangeable with terms such as logic, logic block, component, or circuit, for example. can be used
  • a module may be an integrated part or a minimum unit of the parts or a part thereof that performs one or more functions.
  • the module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • One embodiment of the present document is one or more instructions stored in a storage medium (e.g., built-in memory 136 or external memory 138) that can be read by a machine (e.g., electronic device 101). It may be implemented as software (e.g., program 140) including these.
  • a processor e.g., processor 120
  • the one or more instructions may include code generated by a compiler or code that can be executed by an interpreter.
  • a storage medium that can be read by a device may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' only means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and this term refers to cases where data is semi-permanently stored in the storage medium. There is no distinction between temporary storage cases.
  • a method according to an embodiment disclosed in this document may be provided and included in a computer program product.
  • Computer program products are commodities and can be traded between sellers and buyers.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store TM ) or on two user devices (e.g. It can be distributed (e.g. downloaded or uploaded) directly between smart phones) or online.
  • a portion of the computer program product may be at least temporarily stored or temporarily created in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.
  • each component (e.g., module or program) of the above-described components may include a single or multiple entities, and some of the multiple entities may be separately placed in other components.
  • one or more of the above-described corresponding components or operations may be omitted, or one or more other components or operations may be added.
  • multiple components eg, modules or programs
  • the integrated component may perform one or more functions of each component of the plurality of components in the same or similar manner as those performed by the corresponding component of the plurality of components prior to the integration. .
  • operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or , or one or more other operations may be added.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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PCT/KR2023/012406 2022-08-24 2023-08-22 Appareil électronique comprenant une carte de circuit imprimé souple Ceased WO2024043664A2 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20220106314 2022-08-24
KR10-2022-0106314 2022-08-24
KR10-2022-0123286 2022-09-28
KR1020220123286A KR20240028260A (ko) 2022-08-24 2022-09-28 가요성 인쇄회로 기판을 포함하는 전자 장치

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