WO2024149205A1 - 扬声器模组、扬声器系统和车辆 - Google Patents

扬声器模组、扬声器系统和车辆 Download PDF

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Publication number
WO2024149205A1
WO2024149205A1 PCT/CN2024/071207 CN2024071207W WO2024149205A1 WO 2024149205 A1 WO2024149205 A1 WO 2024149205A1 CN 2024071207 W CN2024071207 W CN 2024071207W WO 2024149205 A1 WO2024149205 A1 WO 2024149205A1
Authority
WO
WIPO (PCT)
Prior art keywords
speaker
vibration plate
passive vibration
vehicle
loudspeaker
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/CN2024/071207
Other languages
English (en)
French (fr)
Inventor
陈文光
麻乘榕
杨彰昭
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202480006367.6A priority Critical patent/CN120476613A/zh
Priority to EP24741204.2A priority patent/EP4637184A4/en
Priority to AU2024206915A priority patent/AU2024206915A1/en
Priority to KR1020257026733A priority patent/KR20250151385A/ko
Priority to JP2025540911A priority patent/JP2026500872A/ja
Publication of WO2024149205A1 publication Critical patent/WO2024149205A1/zh
Priority to US19/267,003 priority patent/US20250386134A1/en
Priority to MX2025008201A priority patent/MX2025008201A/es
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/283—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm
    • H04R1/2834—Enclosures comprising vibrating or resonating arrangements using a passive diaphragm for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/025—Arrangements for fixing loudspeaker transducers, e.g. in a box, furniture
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2819—Enclosures comprising vibrating or resonating arrangements of the bass reflex type for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/20—Arrangements for obtaining desired frequency or directional characteristics
    • H04R1/22—Arrangements for obtaining desired frequency or directional characteristics for obtaining desired frequency characteristic only 
    • H04R1/28—Transducer mountings or enclosures modified by provision of mechanical or acoustic impedances, e.g. resonator, damping means
    • H04R1/2807—Enclosures comprising vibrating or resonating arrangements
    • H04R1/2815—Enclosures comprising vibrating or resonating arrangements of the bass reflex type
    • H04R1/2823—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material
    • H04R1/2826—Vents, i.e. ports, e.g. shape thereof or tuning thereof with damping material for loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/025—Magnetic circuit
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/02—Details
    • H04R9/04—Construction, mounting, or centering of coil
    • H04R9/041—Centering
    • H04R9/043—Inner suspension or damper, e.g. spider
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
    • H04R9/06—Loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2400/00—Loudspeakers
    • H04R2400/11—Aspects regarding the frame of loudspeaker transducers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/13—Acoustic transducers and sound field adaptation in vehicles

Definitions

  • the present disclosure relates to the technical field of acoustic devices, and in particular to a speaker module, a speaker system and a vehicle.
  • a speaker is an electroacoustic transducer that converts electrical energy into sound energy and radiates the sound energy to a distant place.
  • the present disclosure provides a speaker module, a speaker system and a vehicle, wherein the speaker module includes a frame, a speaker and a passive vibration plate, wherein the resonant frequency of the passive vibration plate is greater than the resonant frequency of the speaker.
  • the frame has an air vent, which is connected to the cavity between the frame, the speaker and the passive vibration plate.
  • the present disclosure provides a speaker module, the speaker module comprising a frame, a speaker and a passive vibration plate, the resonance frequency of the passive vibration plate being greater than the resonance frequency of the speaker.
  • the frame has a first opening, a second opening and a vent.
  • the speaker is located at the first opening, the passive vibration plate is located at the second opening, a cavity is formed between the frame, the speaker and the passive vibration plate, and the cavity is connected to the vent.
  • the frame is used to support the speaker and the passive vibration plate, and can play a certain protective role for the speaker and the passive vibration plate.
  • the frame has a vent, which can be connected to the back cavity, and the larger the volume of the back cavity, the smaller the resistance of the air in the back cavity and the frame to the vibration of the speaker and the passive vibration plate, and the smaller the effect of increasing the resonant frequency of the speaker. Since the lower limit frequency of the working frequency band of the speaker is near the resonant frequency of the speaker, the larger the volume of the back cavity connected to the vent, the stronger the low-frequency diving ability of the speaker module.
  • the speaker has a vibration component, and the vibration component has a vibration plate, and the vibration plate produces sound when it vibrates.
  • the cavity can be located between the frame, the vibration plate and the passive vibration plate.
  • the vibration plate can also be called a vibration membrane, a diaphragm, a vibration basin, etc.
  • Passive vibration plates are similar to vibration plates, but do not require electrical signal drive when working. Sound is produced by fluid and acoustic-solid coupling vibration. When the vibration plate in the speaker vibrates, the passive vibration plate can vibrate under the drive of the vibration plate. Passive vibration plates can also be called passive vibration membranes, passive diaphragms, passive radiators (PR) and PR disks.
  • the speaker module provided by the present disclosure is provided with a passive vibration plate, which can vibrate under the drive of the speaker, so that the passive vibration plate radiates sound waves to the outside of the frame as a secondary sound source.
  • the resonant frequency of the passive vibration plate is set to be greater than the resonant frequency of the speaker, the sound waves radiated outward by the passive vibration plate and the speaker can be superimposed on each other within the working frequency band of the speaker module, thereby improving the sound pressure level of the speaker module in the working frequency band and also improving the utilization rate of sound energy.
  • a ratio of the resonance frequency of the passive vibration plate to an upper limit frequency of an operating frequency band of the speaker module is greater than 0.8.
  • the resonant frequency of the passive vibration plate determines the upper limit frequency of the operating frequency band of the speaker module to a certain extent.
  • the ratio of the resonant frequency of the passive vibration plate to the upper limit frequency of the working frequency band of the speaker module to be greater than 0.8, in most of the working frequency band of the speaker module, the sound waves radiated outward by the speaker and the passive vibration plate are superimposed, thereby improving the sound pressure level of the speaker module in the working frequency band.
  • a ratio of the resonance frequency of the passive vibration plate to an upper limit frequency of an operating frequency band of the speaker module is greater than or equal to 1.
  • a ratio of a resonance frequency of the passive vibration plate to an upper limit frequency of an operating frequency band of the speaker module is less than 2.
  • the resonance frequency of the passive vibration plate should not exceed the upper limit frequency of the working frequency band of the speaker module by too much.
  • a ratio of the resonance frequency of the passive vibration plate to an upper limit frequency of an operating frequency band of the speaker module is less than 1.5.
  • a ratio of the resonance frequency of the passive vibration plate to an upper limit frequency of an operating frequency band of the speaker module is less than 1.2.
  • the resonance frequency of the passive vibration plate is greater than the first frequency, wherein the first frequency is the resonance frequency of a system consisting of the cavity and the passive vibration plate.
  • the system composed of the cavity and the passive vibration plate resonates, which will generate a huge force impedance on the speaker, so that at the first frequency, the sound waves radiated by the speaker are at a minimum value.
  • the resonant frequency of the passive vibration plate By setting the resonant frequency of the passive vibration plate to be greater than the first frequency, when the speaker module operates at the first frequency, the sound waves radiated by the speaker and the sound waves radiated by the passive vibration plate are in phase. Then, due to the superposition of the sound waves radiated outward by the passive vibration plate, the sound pressure level of the sound waves radiated by the speaker module at the first frequency is still high.
  • a ratio of the resonance frequency of the passive vibration plate to the resonance frequency of the speaker is greater than 1.5.
  • a ratio of the resonance frequency of the passive vibration plate to the resonance frequency of the speaker is greater than 2.
  • the ratio of the mass of the passive vibration plate to the mass of the vibration component of the loudspeaker is less than 0.5. In this way, the resonance frequency of the passive vibration plate and the resonance frequency of the loudspeaker can meet the above relationship.
  • a ratio of the mass of the passive vibration plate to the mass of the vibration component is less than 0.2.
  • a ratio of an area of the passive vibration plate to an area of the vibration plate of the speaker is greater than 0.5 and less than 2.
  • the vent is used to communicate with the rear cavity, wherein a ratio of a volume of the rear cavity to a volume of the cavity is greater than 10.
  • the back cavity is an infinite back cavity.
  • the speaker module is applied inside the vehicle, and the rear cavity is the space outside the vehicle.
  • the speaker module is used inside a room, and the rear cavity is an outdoor space, or a space inside another room.
  • the frame has a pipe
  • the pipe is connected to the cavity
  • the pipe has a vent.
  • the existence of the pipe can also improve the sound pressure level of the speaker module.
  • the frame includes a main body and a pipe, the main body has a first opening and a second opening, a cavity is formed between the main body, the speaker and the passive vibration plate, one end of the pipe is connected to the cavity, and the other end has a vent.
  • a ratio of the resonant frequency of the cavity and the pipe to the resonant frequency of the passive vibration plate is greater than 0.5.
  • a ratio of the resonant frequency of the cavity and the pipe to the resonant frequency of the passive vibration plate is greater than 0.7.
  • a ratio of a resonant frequency of the cavity and the pipe to a resonant frequency of the passive vibration plate is less than 5.
  • a ratio of a resonant frequency of the cavity and the pipe to a resonant frequency of the passive vibration plate is less than 3.
  • the first opening and the second opening are respectively located at two ends of the main body, and the pipeline is connected to one side of the main body.
  • the speaker closes the first opening
  • the passive vibration plate closes the second opening
  • the loudspeaker and the passive vibration plate are opposite to each other, so that the space required for the loudspeaker and the passive vibration plate can be reduced, which is conducive to reducing the volume of the loudspeaker module.
  • the two first openings are opposite to each other.
  • the speaker includes a first speaker and a second speaker, and the first speaker and the second speaker are respectively located at the two first openings, and the first speaker and the second speaker offset each other.
  • the vibration directions of the vibration plates in the two speakers are opposite, that is, the two vibration plates either move relative to each other or move in opposite directions, then the reaction forces caused by the vibration of the vibration plates will offset each other, and the vibration of the supporting components of the two speakers is small, which is conducive to reducing the resonance amplitude of the speaker module and can improve the sound quality.
  • the passive vibration plate includes a first passive vibration plate and a second passive vibration plate, and the first passive vibration plate and the second passive vibration plate are respectively located at the two second openings.
  • a cavity is formed between the first speaker, the first passive vibration plate and the frame, and a cavity is formed between the second speaker, the second passive vibration plate and the frame, and both cavities are connected to the vent.
  • the speaker module further includes a protective cover, which is connected to the frame and covers the passive vibration plate.
  • the protective cover can protect the passive vibration plate to reduce the possibility of damage to the passive vibration plate.
  • the protective cover has a frame structure, so that the protective cover does not close the outer side of the passive vibration plate, and the protective cover does not affect the vibration of the passive vibration plate.
  • the speaker includes a support assembly, a magnetic circuit assembly and a vibration assembly
  • the vibration assembly includes a voice coil, a vibration plate and a centering support.
  • the support assembly supports the magnetic circuit assembly and the vibration assembly, the magnetic circuit assembly is used to drive the voice coil to vibrate, the vibration plate is connected to the voice coil and the support assembly respectively, and the centering support is connected to the vibration plate and the support assembly respectively.
  • the centering support piece can also be called a spring wave.
  • the centering support piece is in a circular ring shape, and the inner side of the centering support piece is connected to the vibration plate, and the outer side of the centering support piece is connected to the support assembly.
  • a side of the support assembly facing the cavity has a frame structure.
  • the present disclosure provides a speaker system, comprising a wall and a speaker module as described in any one of the first aspects.
  • a first side of the wall forms a rear cavity, and the volume of the rear cavity is at least 10 times the volume of the cavity of the speaker module.
  • the speaker module is located on a second side of the wall, and the vent of the speaker module is connected to the rear cavity.
  • the wall may also be referred to as a baffle and a mounting wall.
  • the wall may also be referred to as an infinite baffle.
  • the technical solution provided by the present invention on the one hand, because the rear cavity is large enough, the low-frequency diving ability of the speaker module can be improved by connecting the vent of the speaker module with the rear cavity, thereby ensuring the low-frequency performance of the speaker module. Moreover, the volume of the speaker module does not need to be too large and does not need to occupy too much space.
  • the passive vibration plate will be driven to vibrate, and the outwardly radiated sound waves generated by the speaker and the passive vibration plate can be superimposed, thereby increasing the sound pressure level of the speaker module in the operating frequency band and improving the utilization rate of sound energy.
  • the speaker module is mounted on a wall, the wall has a through hole, and the vent is connected to the rear cavity through the through hole.
  • the speaker system is applied to a vehicle, the wall is a wall on the vehicle, the speaker module is located inside the vehicle, and the vent of the speaker module is connected to the outside of the vehicle, wherein the outside of the vehicle forms an infinitely large rear cavity.
  • the speaker system is used in a room
  • the wall is a wall, a top wall or a bottom wall
  • the speaker module is located inside the room
  • the vent of the speaker module is connected to the outside, wherein the outside forms an infinite back cavity.
  • the speaker system is used in a room
  • the wall is a wall, a top wall or a bottom wall
  • the speaker module is located inside a room
  • the vent of the speaker module is connected to another room.
  • the volume of the space (or back cavity) in the other room is at least 10 times the volume of the cavity of the speaker module.
  • the present disclosure provides a vehicle having a speaker module as described in any one of the first aspects, wherein the speaker module is located inside the vehicle, and an air vent of the speaker module is connected to the outside of the vehicle.
  • the technical solution provided by the present disclosure since the external space of the vehicle forms an infinitely large rear cavity, the low-frequency diving ability of the speaker module is improved by connecting the vent of the speaker module with the outside of the vehicle, thereby ensuring the low-frequency performance of the speaker module.
  • the volume of the speaker module does not need to be too large, and the speaker module does not occupy too much space in the vehicle.
  • the passive vibration plate will be driven to vibrate, and the outwardly radiated sound waves generated by the speaker and the passive vibration plate can be superimposed, thereby increasing the sound pressure level of the speaker module in the operating frequency band and improving the utilization rate of sound energy.
  • the speaker module is mounted on a wall of a vehicle, the wall of the vehicle has a through hole, and the vent of the speaker module is connected to the outside of the vehicle through the through hole.
  • the speaker module is located above the tire of the vehicle, the air vent faces the bottom of the vehicle, one of the speaker and the passive vibration plate faces the left side of the vehicle, and the other faces the right side of the vehicle.
  • the speaker module is located in the trunk of the vehicle, the vent faces the bottom of the vehicle, and one of the speaker and the passive vibration plate faces the left side of the vehicle, and the other faces the right side of the vehicle.
  • the speaker module is located in the footwell area of the vehicle, which refers to the position where the driver or passenger puts their feet, and can be the footwell area of the main driver's seat or the footwell area of the co-driver's seat.
  • the vent of the speaker module faces the bottom of the vehicle, the speaker faces the rear of the vehicle, and the passive vibration plate faces the front of the vehicle.
  • the speaker module is located in a spare tire storage box of the vehicle, and the spare tire storage box is used to store the spare tire.
  • the speaker module is located below the wheel hub of the spare tire, the vent and the passive vibration plate face the bottom of the vehicle, and the speaker faces the top of the vehicle.
  • the wheel hub has a frame structure, so that the sound waves generated by the speaker module are radiated into the cabin.
  • FIG1 is a schematic diagram of a principle of acoustic short circuit provided by an embodiment of the present disclosure
  • FIG2 is a schematic diagram of a speaker module with a sealed sound box in a related art provided by an embodiment of the present disclosure
  • FIG3 is a schematic diagram of a speaker module having a speaker box connected to the outside of a vehicle in a related art provided by an embodiment of the present disclosure
  • FIG4 is an equivalent circuit diagram of the speaker module shown in FIG3 provided by an embodiment of the present disclosure.
  • FIG5 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG6 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG7 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG8 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG9 is an equivalent circuit diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG10 is a schematic diagram of the sound pressure levels of a speaker, a passive vibration plate, and a speaker module provided by an embodiment of the present disclosure
  • FIG11 is a schematic diagram showing a comparison of sound pressure levels of different speaker modules provided by an embodiment of the present disclosure
  • FIG12 is a three-dimensional schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG13 is a three-dimensional schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG14 is a cross-sectional view of a speaker module provided by an embodiment of the present disclosure.
  • FIG15 is an exploded view of a speaker module provided by an embodiment of the present disclosure.
  • FIG16 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG17 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG18 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG19 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG20 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG21 is an equivalent circuit diagram of the speaker module shown in FIG20 provided by an embodiment of the present disclosure.
  • FIG22 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG23 is a schematic diagram of a speaker module provided by an embodiment of the present disclosure.
  • FIG24 is a cross-sectional view of a speaker module provided by an embodiment of the present disclosure.
  • FIG25 is a three-dimensional schematic diagram of a speaker provided by an embodiment of the present disclosure.
  • FIG26 is a cross-sectional view of a speaker provided by an embodiment of the present disclosure.
  • FIG27 is a schematic diagram of a vehicle provided by an embodiment of the present disclosure.
  • FIG28 is a schematic diagram of the installation position of a speaker module provided by an embodiment of the present disclosure.
  • FIG29 is a schematic diagram of the installation position of a speaker module provided by an embodiment of the present disclosure.
  • FIG. 30 is a schematic diagram of the installation position of a speaker module provided in an embodiment of the present disclosure.
  • FIG. 1 illustration 100, speaker module, 200, rear cavity, 300, wall, 400, through hole, 500, trunk, 600, spare tire storage box, 700, spare tire, 710, wheel hub; 1. frame, 11. main body, 110. cavity, 111. first opening, 112. second opening, 12. pipeline, 120. vent; 2. Speaker, 21. Support assembly, 211. First bracket, 212. Second bracket, 22. Magnetic circuit assembly, 221. First magnetic conductive sheet, 222, magnet, 223, second magnetic guide sheet, 23, vibration assembly, 231, voice coil, 232, vibration plate, 233, centering support sheet, 234, dust cover; 3. Passive vibration plate; 4. Protective cover.
  • a speaker is an electroacoustic transducer that converts electrical energy into sound energy and radiates the sound energy in the air to a distant place.
  • a speaker generally includes a support component, a magnetic circuit component, and a vibration component.
  • the support component is used to support the magnetic circuit component and the vibration component.
  • the magnetic circuit component is used to drive the vibration component to vibrate. When the vibration component vibrates, sound is generated.
  • the vibration component includes a vibration plate, and when the vibration plate vibrates, sound is generated.
  • Acoustic short circuit occurs when the speaker is working.
  • Acoustic short circuit means that when the vibration plate of the speaker vibrates forward or backward, the sound waves generated in front of and behind the vibration plate are in opposite phases, and the sound waves generated in front of and behind the vibration plate will cancel each other out, so the sound is also very light.
  • Figure 1 a vivid understanding is that when the vibration plate moves forward at a certain moment, the air density in front of the vibration plate is large, and the air density behind the vibration plate is small. If there is no obstruction, the air in front of the vibration plate will flow to the back under the action of the pressure difference, making it impossible for the air to propagate forward.
  • the acoustic short circuit is related to the vibration frequency of the vibration plate.
  • the lower the vibration frequency the stronger the diffraction ability of the sound wave.
  • the sound waves generated behind the vibration plate are more likely to diffract to the rear, and the sound waves generated behind the vibration plate are also more likely to diffract to the front. As a result, the sound waves in the front and the sound waves in the rear are more likely to cancel each other out, and the phenomenon of acoustic short circuit becomes more obvious.
  • the speaker in order to prevent acoustic short circuit of the speaker, the speaker is generally installed in a closed sound box, so that the sound waves generated in front of the speaker's vibration plate and the sound waves generated in the back are isolated, so that acoustic short circuit will not occur.
  • the gas in the sealed sound box forms an air spring.
  • the existence of the air spring increases the resistance that the vibration plate needs to overcome when vibrating, which causes the resonance frequency of the speaker (vibration plate) to increase. Since the lower limit frequency of the speaker's operating frequency band is near the speaker's resonance frequency, the increase in the speaker's resonance frequency will cause the lower limit frequency of the speaker's operating frequency band to increase, which causes the speaker's operating frequency band to shift to a higher frequency, making the speaker's low-frequency diving ability poor.
  • the larger the volume of the speaker the smaller the elastic force of the air spring formed by the air inside the speaker, and the smaller the impact on the resonant frequency of the speaker. Therefore, in order to improve the low-frequency performance of the speaker and achieve better low-frequency dive, such as diving to 40Hz or lower, it can be achieved by increasing the volume of the speaker, for example, increasing the volume of the speaker to more than 20L.
  • the speaker box has a larger volume.
  • an overly large speaker box will greatly occupy the limited space in the vehicle, resulting in a reduction in the space available for passengers or storage.
  • a speaker module in the related art, which includes a speaker box and a speaker.
  • the speaker box is installed on the wall of the vehicle and is connected to the outside of the vehicle through a pipe.
  • the space outside the vehicle forms an infinitely large rear cavity, which is equivalent to installing the speaker in an infinitely large speaker box, thereby achieving the goal of not occupying a large space inside the vehicle and ensuring the low-frequency diving ability of the speaker.
  • the speaker module provided in the related art has at least the following technical problems:
  • the sound waves generated by the vibration of the speaker inside the sound box are all radiated to the outside of the vehicle through the pipe, reducing the utilization rate of sound energy.
  • the sound pressure level of the speaker module in the working frequency band may be attenuated.
  • FIG4 an equivalent circuit diagram of the speaker module shown in FIG3 is shown.
  • the resistor Rs, the capacitor Cs and the inductor Ls are equivalent electrical components of the speaker.
  • the capacitor Cb is an equivalent electrical component of the cavity
  • the inductor Lp is an equivalent electrical component of the pipeline
  • the capacitor Cp is an equivalent electrical component of the back cavity.
  • the back cavity is the space outside the vehicle connected to the pipeline. Since the back cavity is infinite, the capacitor Cp is infinite. In this case, the capacitor Cp can be considered as a short circuit. Therefore, the capacitor Cp is no longer considered in the circuit analysis.
  • the magnitude of the current flowing through the resistor Rs, capacitor Cs and inductor Ls depends on the power supply p and the impedance generated by the parallel circuit of the capacitor Cb and the inductor Lp. Since the impedance of the capacitor Cb gradually decreases with the increase of the AC frequency of the power supply p (equal to the vibration frequency of the vibration plate), and the impedance of the inductor Lp gradually increases with the increase of the AC frequency, when the impedance of the capacitor Cb is equal to the impedance of the inductor Lp, the impedance generated by the parallel circuit of the capacitor Cb and the inductor Lp is a maximum value.
  • the capacitor Cb and the inductor Lp have produced parallel resonance, or that the pipe and the cavity have produced resonance.
  • the impedance generated by the parallel circuit of the capacitor Cb and the inductor Lp is a maximum value, the current flowing through the resistor Rs, capacitor Cs and inductor Ls is significantly reduced, causing the sound pressure level of the speaker to drop.
  • the frequency at which the capacitor Cb and the inductor Lp produce parallel resonance is called the resonant frequency fp. If the resonant frequency fp is within the working frequency band of the speaker module, it will cause the attenuation of the sound pressure level of the speaker module in the working frequency band. In order to make the resonant frequency fp outside the working frequency band of the speaker, the shape and size of the cavity and the pipe need to be specially designed. Generally, the pipe needs to be very short and the pipe diameter is large, and the volume of the cavity needs to be very small, which obviously limits the application scenario of the speaker module.
  • an embodiment of the present disclosure provides a speaker module 100, which can not only achieve better low-frequency dive, but also improve the sound pressure level of the speaker module 100 within the working frequency band, and can reduce the restrictions on the shape and size of the cavity and the pipe.
  • the speaker module 100 provided in the embodiment of the present disclosure is exemplarily described below:
  • the speaker module 100 includes a frame 1, a speaker 2 and a passive vibration plate 3.
  • the frame 1 has a first opening 111, a second opening 112 and a vent 120, the speaker 2 is located at the first opening 111, the passive vibration plate 3 is located at the second opening 112, a cavity 110 is formed between the frame 1, the speaker 2 and the passive vibration plate 3, and the cavity 110 is connected to the vent 120.
  • the frame 1 may also be called a sound box or a cabinet, etc., and is used to support the speaker 2 and the passive vibration plate 3.
  • the frame 1 has a first opening 111 and a second opening 112 for mounting the speaker 2 and the passive vibration plate 3.
  • the speaker 2 closes the first opening 111
  • the passive vibration plate 3 closes the second opening 112.
  • the frame 1 may have a pipe 12, one end of which is connected to the cavity 110. The other end has a vent 120.
  • the speaker 2 has a vibration plate 232, and the vibration plate 232 vibrates to generate sound.
  • the cavity 110 may be formed between the vibration plate 232, the passive vibration plate 3, and the frame 1.
  • the vibration plate 232 may also be called a diaphragm or a vibration film.
  • the passive vibration plate 3 is similar to the vibration plate 232, but does not require an electrical signal to drive it when working. It generates sound by vibrating the fluid and the acoustic-solid coupling. When the vibration plate 232 vibrates, the passive vibration plate 3 can vibrate under the drive of the vibration plate 232.
  • the passive vibration plate 3 can also be called a passive vibration membrane or a passive radiator (PR).
  • the vibration plate 232 and the passive vibration plate 3 are generally composed of a plate body and a folded ring.
  • the material of the plate body is generally paper, plastic or metal, and the folded ring is generally rubber or cloth.
  • the speaker module 100 provided by the embodiment of the present disclosure has at least the following beneficial effects:
  • the frame 1 of the speaker module 100 provided in the embodiment of the present disclosure is provided with a vent 120, and the vent 120 is connected with the cavity 110.
  • the vent 120 By connecting the vent 120 with a rear cavity 200 with a sufficiently large volume, the low-frequency diving ability of the speaker module 100 can be improved, thereby ensuring the low-frequency performance of the speaker module 100.
  • the volume of the rear cavity 200 connected to the vent 120 is at least 10 times the volume of the cavity 110. That is, the ratio of the volume of the rear cavity 200 to the volume of the cavity 110 is greater than 10.
  • the volume of the cavity 110 may also be considered to include the volume of the pipe 12.
  • the rear cavity 200 is an infinite rear cavity, for example, the speaker module 100 is located in a car, and the rear cavity 200 is a space outside the car.
  • the speaker module 100 is located indoors, and the rear cavity 200 is an outdoor space.
  • the speaker module 100 provided in the embodiment of the present disclosure is provided with a passive vibration plate 3, which can vibrate under the drive of the speaker 2, so that the passive vibration plate 3 radiates sound waves to the outside (frame 1) as a secondary sound source.
  • a passive vibration plate 3 which can vibrate under the drive of the speaker 2, so that the passive vibration plate 3 radiates sound waves to the outside (frame 1) as a secondary sound source.
  • the sound waves radiated outward by the passive vibration plate 3 and the speaker 2 can be superimposed within the working frequency band of the speaker module 100, thereby improving the sound pressure level of the speaker module 100 in the working frequency band, and also improving the utilization rate of sound energy.
  • the passive vibration plate 3 in the speaker module 100 provided in the embodiment of the present disclosure can improve the sound pressure level of the speaker module 100 in the working frequency band, even if the resonance frequency fp of the cavity and the pipe is within the working frequency band of the speaker module 100, the passive vibration plate 3 can compensate for the attenuation of the sound pressure level of the speaker module 100 caused by the cavity and the pipe.
  • the resonance frequency fp of the cavity and the pipe is outside the working frequency band of the speaker module 100, that is, the limitation on the shape and size of the cavity and the pipe is reduced, which is conducive to expanding the application scenarios of the speaker module 100.
  • the resonance frequency fp of the cavity and the pipe may still be outside the working frequency band of the speaker module 100, which is not required in the embodiment of the present disclosure.
  • the loudspeaker 2 and the passive vibration plate 3 vibrate outward at the same time, and the sound waves radiated by the loudspeaker 2 and the passive vibration plate 3 to the outside of the frame 1 are in phase, and the two can be superimposed, thereby improving the sound pressure level of the loudspeaker module 100.
  • the volume of the cavity 110 increases and the pressure decreases.
  • the gas in the rear cavity 200 flows into the cavity 110 through the vent 120, and the gas flowing into the cavity 110 increases the pressure in the cavity 110, so that the pressure difference between the pressure in the cavity 110 and the pressure outside the loudspeaker 2 and the passive vibration plate 3 is reduced, thereby reducing the resistance encountered by the loudspeaker 2 and the passive vibration plate 3 when vibrating outward, which is beneficial to the low-frequency dive of the loudspeaker module 100.
  • the loudspeaker 2 and the passive vibration plate 3 vibrate inward at the same time, and the sound waves radiated by the loudspeaker 2 and the passive vibration plate 3 to the outside of the frame 1 are in phase, and the two can be superimposed, thereby improving the sound pressure level of the loudspeaker module 100.
  • the volume of the cavity 110 becomes smaller and the pressure becomes larger.
  • the gas in the cavity 110 flows into the rear cavity 200 through the vent 120, which in turn reduces the pressure in the cavity 110, thereby reducing the resistance encountered by the loudspeaker 2 and the passive vibration plate 3 when vibrating inward, which is beneficial to the low-frequency dive of the loudspeaker module 100.
  • the sound waves radiated outward by the speaker 2 and the sound waves radiated outward by the passive vibration plate 3 may not only be in phase but also be in opposite phases, that is, they may not only be superimposed on each other but also cancel each other out.
  • the in-phase of the sound waves radiated outward by the loudspeaker 2 and the passive vibration plate 3 in the embodiment of the present disclosure does not mean that the phases of the sound waves radiated outward by the loudspeaker 2 and the passive vibration plate 3 are exactly the same, but means that the phases of the sound waves radiated outward by the loudspeaker 2 and the passive vibration plate 3 are the same.
  • the phase difference is between - ⁇ /2 and ⁇ /2. When the phase difference is greater than - ⁇ /2 and less than ⁇ /2, the sound waves radiated outward by the loudspeaker 2 and the passive vibration plate 3 are superimposed on each other.
  • the anti-phase of the sound waves radiated outward by the speaker 2 and the passive vibration plate 3 referred to in the embodiment of the present disclosure does not mean that the phase difference of the sound waves radiated outward by the speaker 2 and the passive vibration plate 3 is strictly equal to ⁇ , but means that the phase difference of the sound waves radiated outward by the speaker 2 and the passive vibration plate 3 is between - ⁇ and - ⁇ /2, and between ⁇ /2 and ⁇ . When the phase difference is within this range, the sound waves radiated outward by the speaker and the passive vibration plate 3 cancel each other out.
  • the operating frequency of the speaker module 100 is simultaneously lower than the resonance frequency fs of the speaker 2 and the resonance frequency fr of the passive vibration plate 3 , the sound waves radiated outward by the speaker 2 and the sound waves radiated outward by the passive vibration plate 3 are in anti-phase, presenting a destructive effect.
  • the operating frequency of the speaker module 100 is greater than the resonance frequency fs of the speaker 2 and the resonance frequency fr of the passive vibration plate 3 at the same time, the sound waves radiated outward by the speaker 2 and the sound waves radiated outward by the passive vibration plate 3 are in anti-phase, presenting a destructive effect.
  • the resonance frequency fs of the speaker 2 is greater than the resonance frequency fr of the passive vibration plate 3
  • the operating frequency of the speaker module 100 is less than the resonance frequency fs of the speaker 2 and greater than the resonance frequency fr of the passive vibration plate 3
  • the sound waves radiated outward by the speaker 2 and the sound waves radiated outward by the passive vibration plate 3 are in phase, presenting a superposition effect.
  • the resonance frequency fs of the speaker 2 is lower than the resonance frequency fr of the passive vibration plate 3
  • the operating frequency of the speaker module 100 is higher than the resonance frequency fs of the speaker 2 and lower than the resonance frequency fr of the passive vibration plate 3
  • the sound waves radiated outward by the speaker 2 and the sound waves radiated outward by the passive vibration plate 3 are in phase, presenting a superposition effect.
  • the resonance frequency fs of the loudspeaker 2 is located near the lower limit frequency of the operating frequency band of the loudspeaker module 100 , it can be assumed that the resonance frequency fs of the loudspeaker 2 is equal to the lower limit frequency of the operating frequency band of the loudspeaker module 100 .
  • the resonance frequency fr of the passive vibration plate 3 is set to be lower than the resonance frequency fs of the speaker 2, then the sound waves radiated outwards by the speaker 2 and the sound waves radiated outwards by the passive vibration plate 3 are in phase only when the speaker module 100 operates in a frequency band lower than the resonance frequency fs of the speaker 2. At this time, the passive vibration plate 3 plays the role of enhancing the low-frequency diving ability of the speaker module 100.
  • the speaker module 100 When the speaker module 100 operates in a frequency band higher than the resonance frequency fs of the speaker 2, that is, when operating in the operating frequency band of the speaker module 100, the sound waves radiated outwards by the speaker 2 and the sound waves radiated outwards by the passive vibration plate 3 are both in anti-phase, and the passive vibration plate 3 cannot play the role of increasing the sound pressure level of the speaker module 100 in the operating frequency band.
  • the resonance frequency fr of the passive vibration plate 3 is set to be greater than the resonance frequency fs of the speaker 2, when the speaker module 100 operates in a frequency band greater than the resonance frequency fs of the speaker 2 and less than the resonance frequency fr of the passive vibration plate 3, the sound waves radiated outwards by the speaker 2 and the sound waves radiated outwards by the passive vibration plate 3 are in phase.
  • the frequency band is within the operating frequency band of the speaker module 100.
  • the resonance frequency fr of the passive vibration plate 3 should be set greater than the resonance frequency fs of the speaker 2 .
  • the resonant frequency fr of the passive vibration plate 3 determines the operating frequency band of the speaker module 100 to a certain extent.
  • the resonant frequency fr of the passive vibration plate 3 can be set to be greater than or equal to the upper limit frequency of the working frequency band of the speaker module 100. That is, the ratio of the resonant frequency of the passive vibration plate 3 to the upper limit frequency of the working frequency band of the speaker module 100 is greater than or equal to 1.
  • the speaker module 100 when the speaker module 100 operates in a frequency band greater than the resonant frequency fr of the passive vibration plate 3, although the sound waves radiated by the passive vibration plate 3 will cancel out the sound waves radiated by the speaker 2, causing the sound pressure level of the speaker module 100 to decrease.
  • the decrease in the sound pressure level of the speaker module 100 has a process, so when the speaker module 100 operates in a frequency band slightly greater than the resonant frequency fr of the passive vibration plate 3, the speaker module 100 still has a relatively high sound pressure level. Therefore, the resonant frequency of the passive vibration plate 3 can also be slightly less than the upper limit frequency of the working frequency band of the speaker module 100. In some examples, the ratio of the resonant frequency of the passive vibration plate 3 to the upper limit frequency of the working frequency band of the speaker module 100 is greater than 0.8.
  • the amplitude of the passive vibration plate 3 is the largest at the resonance frequency, in order to utilize the passive vibration plate 3 at the resonance frequency
  • the resonant frequency fr of the passive vibration plate 3 should not exceed the upper limit frequency of the working frequency band of the speaker module 100 by too much.
  • the ratio of the resonant frequency fr of the passive vibration plate 3 to the upper limit frequency of the working frequency band of the speaker module 100 is less than 2.
  • the ratio of the resonance frequency fr of the passive vibration plate 3 to the upper limit frequency of the working frequency band of the speaker module 100 is less than 1.5. Further, the ratio is less than 1.2.
  • the ratio of the resonant frequency of the passive vibration plate 3 to the resonant frequency of the speaker 2 is greater than 1.5. Further, in some examples, the ratio is greater than 2.
  • the ratio of the mass of the passive vibration plate 3 to the mass of the vibration component 23 of the speaker 2 can be set to be less than 0.5.
  • the mass of the passive vibration plate 3 refers to the sum of the masses of the plate body and the folding ring of the passive vibration plate 3
  • the mass of the vibration component 23 refers to the sum of the masses of the voice coil 231, the vibration plate 232 and the centering support plate 233 included in the vibration component 23. In some examples, it may also include the mass of the dust cover 234.
  • the ratio of the mass of the passive vibration plate 3 to the mass of the vibration assembly 23 is less than 0.2.
  • the ratio of the area of the passive vibration plate 3 to the area of the vibration plate 232 of the speaker 2 is greater than 0.2 and less than 2. Further, the ratio of the area of the passive vibration plate 3 to the area of the vibration plate 232 of the speaker 2 is greater than 0.5 and less than 2.
  • FIG. 9 an equivalent circuit diagram of the speaker module shown in FIG. 5 to FIG. 8 is shown.
  • the resistor Rs, the capacitor Cs and the inductor Ls are equivalent electrical components of the speaker 2.
  • the capacitor Cb is an equivalent electrical component of the cavity 110
  • the inductor Lp is an equivalent electrical component of the pipe 12
  • the capacitor Cp is an equivalent electrical component of the back cavity 200.
  • the capacitor Cp is infinite, and the capacitor Cp can be considered as a short circuit. Therefore, the capacitor Cp is no longer considered in the circuit analysis.
  • the resistor Rr, the capacitor Cr and the inductor Lr are equivalent electrical components of the passive vibration plate 3. Similarly, for the passive vibration plate 3, the larger the current flowing through the resistor Rr, the capacitor Cr and the inductor Lr, the larger the sound pressure level of the passive vibration plate 3.
  • the addition of the passive vibration plate 3 makes a branch connected in parallel to the parallel circuit of the capacitor Cb and the inductor Lp, and the branch includes a resistor Rr, a capacitor Cr and an inductor Lr connected in series. This obviously reduces the impedance of the loop where the electrical components corresponding to the loudspeaker 2 are located, and improves the sound pressure level of the loudspeaker 2.
  • the improvement of the sound pressure level of the speaker module 100 is affected by the following two aspects:
  • the superposition of the sound waves radiated outward by the loudspeaker 2 and the passive vibration plate 3 increases the sound pressure level of the loudspeaker module 100 .
  • the introduction of the passive vibration plate 3 improves the sound pressure level of the loudspeaker 2 itself.
  • an embodiment of the present disclosure provides a schematic diagram comparing the sound pressure level of sound waves radiated outwardly by a speaker 2 , the sound pressure level of sound waves radiated outwardly by a passive vibration plate 3 , and the sound pressure level radiated outwardly by a speaker module 100 .
  • the sound pressure level of the sound waves generated by the loudspeaker 2 is a minimum value.
  • the minimum value is generated because the cavity 110, the pipe 12 (if any) and the passive vibration plate 3 resonate at the first frequency f1.
  • the impedance formed by the branch where Cb is located, the branch where Lp is located, and the branch where Cr is located has a maximum value at the first frequency f1.
  • the first frequency f1 can also be called the resonant frequency of the system composed of the cavity 110, the pipe 12 (if any) and the passive vibration plate 3.
  • the resonance frequency fr of the passive vibration plate 3 is set to be greater than the first frequency f1.
  • the embodiment of the present disclosure provides a schematic diagram comparing the sound pressure levels of this solution with those of Related Art 1 and Related Art 2.
  • Related Art 1 represents the technical solution shown in Figure 2 in which the speaker is installed in a closed box
  • Related Art 2 represents the technical solution shown in Figure 3.
  • the speaker module 100 provided in the embodiment of the present disclosure is provided with a vent 120, and the vent 120 is connected to a sufficiently large rear cavity 200, the low-frequency diving ability of the speaker module 100 provided in the embodiment of the present disclosure is significantly improved.
  • the low-frequency diving capability of the speaker of the related art 1 is significantly better than that of the speaker of the related art 1.
  • the sound pressure level of the speaker module 100 provided by the embodiment of the present disclosure is improved by more than 3 dB compared with the sound pressure level of the speaker of the related art 1.
  • the speaker modules are connected to a sufficiently large back cavity 200, in the first half of the working frequency band (20Hz to 50Hz), the sound pressure levels of the speaker module 100 provided in the embodiment of the present disclosure and the speaker module in the related art 2 are not much different.
  • the second half of the working frequency band 50Hz to 200Hz
  • the sound pressure level of the speaker module 100 provided in the embodiment of the present disclosure is significantly improved.
  • the pipe and the cavity will still cause the sound pressure level of the speaker module in Related Art 2 to drop in the second half of the working frequency band (e.g., 100 Hz-200 Hz).
  • a ratio of the resonance frequency fp of the cavity 110 and the pipe 12 to the resonance frequency fr of the passive vibration plate 3 is greater than 0.5.
  • the resonance frequency fr of the passive vibration plate 3 is located near the resonance frequency fp of the cavity 110 and the pipe 12, so that the passive vibration plate 3 can effectively compensate for the drop in the sound pressure level of the speaker module caused by the cavity 110 and the pipe 12, and maximize the role of the passive vibration plate 3.
  • the resonance frequency fp of the cavity 110 and the pipe 12 is located outside the working frequency band of the speaker module, which can reduce the resonance of the pipe 12 and the cavity 110 and the impact of the sound pressure level in the working frequency band of the speaker module.
  • the ratio of the resonance frequency fp of the cavity 110 and the pipe 12 to the resonance frequency fr of the passive vibration plate 3 is greater than 0.7.
  • the ratio of the resonance frequency fp of the cavity 110 and the pipe 12 to the resonance frequency fr of the passive vibration plate 3 is less than 5. Further, less than 3.
  • the resonance frequency fs of the speaker 2 and the resonance frequency fr of the passive vibration plate 3 referred to in the embodiment of the present disclosure refer to the working resonance frequency of the speaker 2 and the passive vibration plate 3.
  • the speaker 2 and the passive vibration plate 3 also have a natural frequency (or called a true frequency), which refers to the resonance frequency of the speaker 2 and the passive vibration plate 3 when the speaker 2 and the passive vibration plate 3 are not installed on the frame 1.
  • the speaker 2 and the passive vibration plate 3 are installed in the frame 1, the speaker 2 is affected by the passive vibration plate 3, the cavity 110 and the pipe 12, and the passive vibration plate 3 is affected by the speaker 2, the cavity 110 and the pipe 12, so the natural frequency is different from the working resonant frequency.
  • the structure of the speaker module 100 provided in the embodiment of the present disclosure is described in more detail below:
  • FIG. 12 to FIG. 15 there are actual pictures of a speaker module 100 provided in an embodiment of the present disclosure.
  • the frame 1 includes a main body 11 and a pipe 12, the main body 11 has a first opening 111 and a second opening 112, and a cavity 110 is formed between the main body 11, the speaker 2 and the passive vibration plate 3.
  • One end of the pipe 12 is connected to the cavity 110, and the other end has a vent 120.
  • the embodiment of the present disclosure does not limit the connection position between the pipe 12 and the main body 11.
  • the first opening 111 is defined to be located at the end of the main body 11, and the pipe 12 is connected to one side of the main body 11.
  • the pipe 12 is connected to an end of the main body 11 , and the end is opposite to an end where the first opening 111 is located.
  • the pipe 12 may also be connected to the end where the first opening 111 is located.
  • the embodiment of the present disclosure does not limit the shape of the pipeline 12.
  • the pipeline 12 is a straight pipeline, and in other examples, the pipeline 12 is a curved pipeline.
  • the diameter of the pipeline 12 remains unchanged.
  • the diameter of the pipeline 12 gradually decreases along the direction away from the main body 11.
  • the frame 1 may not have the pipe 12.
  • an equivalent circuit diagram of the speaker module 100 shown in Fig. 20 is shown.
  • the electrical component corresponding to the cavity 110 is the inductor Lp, and in this case, the cavity 110 plays the role of a pipe.
  • the present embodiment does not limit the relative positions of the speaker 2 and the passive vibration plate 3 on the frame 1.
  • An exemplary description is given below:
  • the loudspeaker 2 and the passive vibration plate 3 are opposite to each other. In this way, the space occupied by the loudspeaker 2 and the passive vibration plate 3 can be reduced, which is beneficial to reducing the volume of the loudspeaker module 2 .
  • the speaker 2 and the passive vibration plate 3 are respectively located on two adjacent frame walls.
  • the speaker 2 and the passive vibration plate 3 are located on the same frame wall.
  • the several positions of the loudspeaker 2 and the passive vibration plate 3 shown above are merely exemplary.
  • the loudspeaker 2 and the passive vibration plate 3 may also be located at other positions, which is not limited in the embodiments of the present disclosure.
  • the disclosed embodiment does not limit the number of the loudspeaker 2 and the passive vibration plate 3.
  • An exemplary description is given below:
  • the speaker 2 and the passive vibration plate 3 are both one.
  • the speaker 2 is one and the passive vibration plate 3 is multiple.
  • one speaker 2 may be opposite to multiple (e.g., two) passive vibration plates 3.
  • the passive vibration plate 3 is one and the speaker 2 is multiple.
  • the passive vibration plate 3 and the speaker 2 are both multiple, and the number of multiple passive vibration plates 3 and multiple speakers 2 may be the same or different. Multiple speakers 2 may be opposite to multiple passive vibration plates 3, respectively.
  • the speaker 2 includes a first speaker 2a and a second speaker 2b, and the first speaker 2a and the second speaker 2b are respectively located in the two first openings 111, and the first speaker 2a and the second speaker 2b are offset from each other.
  • the vibration directions of the vibration plates 232 in the two speakers 2 are opposite, that is, the two vibration plates 232 either move relative to each other or move away from each other, then the reaction forces brought by the vibrations of the vibration plates 232 will cancel each other out, and the vibration of the supporting components of the two speakers 2 is smaller, which is beneficial to reducing the resonance amplitude of the speaker module and improving the sound quality.
  • the passive vibration plate 3 includes a first passive vibration plate 3a and a second passive vibration plate 3b, and the first passive vibration plate 3a and the second passive vibration plate 3b are respectively located at the two second openings 112.
  • a cavity 110 is formed between the first speaker 2a, the first passive vibration plate 3a and the frame 1, and a cavity 110 is formed between the second speaker 2b, the second passive vibration plate 3b and the frame 1, and both cavities 110 are connected to the vent 120.
  • the speaker module 100 further includes a protective cover 4, which is connected to the frame 1 and covers the passive vibration plate 3.
  • the protective cover 4 has a frame structure, so that the protective cover 4 will not close the outer side of the passive vibration plate 3 and will not affect the vibration of the passive vibration plate 3.
  • the structure of the speaker 2 provided in the embodiment of the present disclosure is exemplarily described below:
  • the loudspeaker 2 provided in the embodiment of the present disclosure is a dynamic loudspeaker, and the loudspeaker 2 includes a supporting assembly 21, a magnetic circuit assembly 22 and a vibration assembly 23.
  • the supporting assembly 21 supports the magnetic circuit assembly 22 and the vibration assembly 23, and the magnetic circuit assembly 22 is used to drive the vibration assembly 23 to vibrate, and the vibration assembly 23 emits sound when vibrating.
  • the support assembly 21 includes a first bracket 211 and a second bracket 212, wherein the first bracket 211 is located inside the frame 1, and the second bracket 212 is located outside the frame 1.
  • the first bracket 211 and the second bracket 212 are fixedly connected and play a role in protecting and supporting the magnetic circuit assembly 22 and the vibration assembly 23.
  • the magnetic circuit assembly 22 includes a first magnetic conductive sheet 221, a magnet 222, and a second magnetic conductive sheet 223, wherein the first magnetic conductive sheet 221, the magnet 222, and the second magnetic conductive sheet 223 are coaxially arranged, and the magnet 222 is located between the first magnetic conductive sheet 221 and the second magnetic conductive sheet 223.
  • the magnetic circuit assembly 22 is used to generate a changing magnetic field to drive the vibration assembly 23 to vibrate.
  • the vibration assembly 23 includes a voice coil 231, a vibration plate 232 and a centering support piece 233, and the voice coil 231 is connected to the vibration plate 232.
  • the magnetic circuit assembly 22 drives the voice coil 231 to move, and the voice coil 231 drives the vibration plate 232 to vibrate when it moves.
  • the centering support piece 233 is respectively connected to the vibration plate 232 and the support assembly 21 (such as the first bracket 211), and the centering support piece 233 is used to locate the position of the voice coil 231 and the vibration plate 232 to ensure that the voice coil 231 and the vibration plate 232 reciprocate axially.
  • the centering support piece 233 has a certain elasticity and can have a certain influence on the resonant frequency of the speaker 2. Furthermore, the centering support piece 233 can also play a role in dust prevention. Among them, the centering support piece 233 can also be called a spring wave.
  • the centering support piece 233 is in a circular ring shape, and the inner side of the centering support piece 233 is connected to the vibration plate 232 , for example, by bonding, and the outer side of the centering support piece 233 is connected to the support assembly 21 .
  • the vibration assembly 23 further includes a dust cover 234 .
  • the support assembly 21 has a frame structure on one side facing the cavity 110.
  • the first bracket 211 has a frame structure.
  • the magnetic circuit assembly 22 is located inside the cavity 110 . In other examples, as shown in FIG. 26 , the magnetic circuit assembly 22 may also be located outside the cavity 110 .
  • the embodiment of the present disclosure also provides a speaker system, as shown in FIGS. 5-8, 16-20, 22 and 23, the speaker system includes a wall 300 and a speaker module 100, the first side of the wall 300 forms (or is referred to as having) a rear cavity 200, and the volume of the rear cavity 200 is at least 10 times the volume of the cavity 110 of the speaker module 100.
  • the speaker module 100 is located on the second side of the wall 300, and the passage of the speaker module 100 is The air port 120 is communicated with the rear cavity 200 .
  • the wall 300 may also be referred to as a baffle and a mounting wall.
  • the wall 300 may also be referred to as an infinite baffle.
  • the low-frequency diving ability of the speaker module 100 can be improved by setting the vent 120 of the speaker module 100 to be connected to the rear cavity 200, thereby ensuring the low-frequency performance of the speaker module 100, and the volume of the speaker module 100 does not need to be too large, and does not need to occupy too much space.
  • the passive vibration plate 3 will be driven to vibrate, and the sound waves generated by the speaker 2 and the passive vibration plate 3 can be superimposed, thereby improving the sound pressure level of the speaker module 100 in the operating frequency band and improving the utilization rate of sound energy.
  • the speaker module 100 is mounted on a wall 300 , a through hole 400 is provided on the wall 300 , and the vent 120 is connected to the rear cavity 200 through the through hole 400 .
  • the embodiments of the present disclosure do not limit the application scenario of the speaker system, as long as there is a sufficiently large back cavity 200 (the volume of the back cavity 200 is at least 10 times the volume of the cavity 110) or a sufficiently large baffle (wall 300) in the application scenario.
  • the following is an exemplary description of the application scenario of the speaker system:
  • the speaker system is applied to a vehicle, and the wall 300 is a wall on the vehicle, such as a bottom wall or a side wall of the vehicle, and the vent 120 of the speaker module 100 is connected to the outside of the vehicle, and the outside of the vehicle forms an infinite rear cavity 200.
  • the wall 300 is a wall on the vehicle, such as a bottom wall or a side wall of the vehicle
  • the vent 120 of the speaker module 100 is connected to the outside of the vehicle, and the outside of the vehicle forms an infinite rear cavity 200.
  • the speaker system is used in a room, and the wall 300 is a wall, bottom wall or top wall of the room.
  • the speaker module 100 is located inside the room, and the vent 120 of the speaker module 100 leads to the outside, forming an infinite back cavity 200 outside.
  • the speaker module 100 is located in a room, and the vent 120 of the speaker module 100 leads to another room, and the volume of the space in the other room (the back cavity 200 ) is at least 10 times the volume of the cavity 110 .
  • the embodiment of the present disclosure also provides a vehicle, as shown in FIGS. 27 to 30 , wherein the vehicle has a speaker module 100 , the speaker module 100 is located inside the vehicle, and a vent 120 of the speaker module 100 is connected to the outside of the vehicle.
  • the technical solution provided by the embodiment of the present disclosure since the external space of the vehicle forms an infinitely large rear cavity 200, the low-frequency diving ability of the speaker module 100 is improved by connecting the vent 120 of the speaker module 100 with the outside of the vehicle, thereby ensuring the low-frequency performance of the speaker module 100.
  • the volume of the speaker module 100 does not need to be too large, and the speaker module 100 will not occupy too much space in the vehicle.
  • the passive vibration plate 3 will be driven to vibrate, and the sound waves generated by the speaker 2 and the passive vibration plate 3 can be superimposed, thereby improving the sound pressure level of the speaker module 100 in the operating frequency band and improving the utilization rate of sound energy.
  • the speaker module 100 is mounted on a wall 300 of a vehicle, and a through hole 400 is provided on the wall 300 of the vehicle, and the vent 120 of the speaker module 100 is connected to the outside of the vehicle through the through hole 400 .
  • the embodiment of the present disclosure does not limit the specific installation position of the speaker module 100.
  • the speaker module 100 in order to reduce the occupation of the activity space of the occupants in the vehicle, can be installed in the following positions:
  • the speaker module 100 is located above the tire of the vehicle, and the wall 300 is the wall above the tire.
  • the vent 120 of the speaker module 100 faces downward, and the speaker 2 and the passive vibration plate 3 can face the horizontal direction or the approximately horizontal direction of the vehicle, for example, they can face the left and right direction of the vehicle (as shown in Figure 28), or they can face the front and back direction of the vehicle.
  • the speaker module 100 is located in the trunk 500 of the vehicle, and the wall 300 may be the bottom wall of the trunk 500.
  • the vent 120 of the speaker module 100 faces downward, and the speaker 2 and the passive vibration plate 3 may face the horizontal direction or the approximately horizontal direction of the vehicle, for example, the left-right direction of the vehicle (as shown in FIG29 ), or the front-back direction of the vehicle.
  • the speaker module 100 is located in a spare tire storage box 600 of a vehicle.
  • the spare tire storage box 600 is used to store a spare tire of the vehicle, and the spare tire storage box 600 may be located below the trunk 500 of the vehicle.
  • the wall 300 may be the bottom wall of the spare tire storage box 600.
  • the vent 120 of the speaker module 100 faces downward, and the speaker 2 and the passive vibration plate 3 may face the upper and lower directions of the vehicle.
  • the speaker 2 faces the upper side of the vehicle, and the passive vibration plate 3 faces the lower side of the vehicle.
  • the embodiment of the present disclosure does not limit the specific position of the speaker module 100 in the spare tire storage box 600.
  • the speaker module 100 is located below the wheel hub 710 of the spare tire 700 of the vehicle.
  • the wheel hub 710 has a frame structure, so that the sound emitted by the speaker module 100 is radiated into the cabin of the vehicle.
  • the speaker module 100 is located in the footwell area of the vehicle.
  • the footwell area refers to the interior of the vehicle cabin where the driver Or the position where the occupants put their feet, for example, the footwell area of the main driver's seat, that is, the area where the brake and accelerator are located, and another example, the footwell area of the co-pilot's seat.
  • Wall 300 can be a wall of the chassis of the vehicle.
  • the vent 120 of the speaker module 100 faces downward, and the speaker 2 and the passive vibration plate 3 can face the horizontal direction or the approximately horizontal direction of the vehicle, and can face the left and right direction or the front and back direction of the vehicle.
  • the speaker 2 faces the rear of the vehicle, and the passive vibration plate 3 faces the front of the vehicle.

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Abstract

本公开提供了一种扬声器模组、扬声器系统和车辆，属于声学器件技术领域。扬声器模组包括框体(1)、扬声器(2)和被动振动板(3)，被动振动板(3)的谐振频率大于扬声器(2)的谐振频率。扬声器(2)和被动振动板(3)均安装在框体(1)上，且框体(1)、扬声器(2)和被动振动板(3)之间形成空腔(110)。框体(1)具有通气口(120)，通气口(120)与空腔(110)连通。

Description

扬声器模组、扬声器系统和车辆
本公开要求于2023年01月12日提交的申请号为202310072591.2、发明名称为“扬声器模组、扬声器系统和车辆”的中国专利申请的优先权，其全部内容通过引用结合在本公开中。
技术领域
本公开涉及声学器件技术领域，特别涉及一种扬声器模组、扬声器系统和车辆。
背景技术
扬声器是把电能转换为声能，并将声能辐射到远处的电声换能器。
对于扬声器来说，如何既提升扬声器的低频下潜能力，又提升扬声器在工作频段的声压级，是一个关键的技术问题。
发明内容
本公开提供了一种扬声器模组、扬声器系统和车辆，扬声器模组包括框体、扬声器和被动振动板，被动振动板的谐振频率大于扬声器的谐振频率。框体具有通气口，通气口与框体、扬声器和被动振动板之间的空腔连通。通过将通气口与足够大的后腔连通，能够提升扬声器模组的低频下潜能力。并且，扬声器和被动振动板振动向外辐射的声波能够叠加，从而提高了扬声器模组的声压级。所述扬声器模组、扬声器系统和车辆的技术方案如下所述。
第一方面，本公开提供了一种扬声器模组，扬声器模组包括框体、扬声器和被动振动板，被动振动板的谐振频率大于扬声器的谐振频率。框体具有第一开口、第二开口和通气口。扬声器位于第一开口，被动振动板位于第二开口，框体、扬声器和被动振动板之间形成空腔，空腔与通气口连通。
其中，框体用于支撑扬声器和被动振动板，且能够对扬声器和被动振动板起到一定的保护作用。框体具有通气口，通气口可以与后腔连通，且后腔的容积越大，后腔和框体中的空气对扬声器和被动振动板的振动产生的阻力越小，对扬声器的谐振频率的提升作用越小。由于扬声器的工作频段的下限频率位于扬声器的谐振频率附近，所以，通气口连通的后腔的容积越大，扬声器模组的低频下潜能力越强。
扬声器具有振动组件，振动组件具有振动板，振动板振动时产生声音。空腔可以位于框体、振动板和被动振动板之间。振动板还可以称为振动膜、振膜和振动盆等。
被动振动板和振动板类似，但工作时不需要电信号驱动，由流体和声固耦合振动发声。当扬声器中的振动板振动时，被动振动板能够在振动板的驱动下振动。被动振动板还可以称为被动振动膜、被动振膜、无源辐射器(passive radiators，PR)和PR盘等。
本公开提供的技术方案，一方面，由于扬声器模组的框体具有通气口，且通气口与空腔连通，则通过将通气口与容积足够大的后腔连通，能够提高扬声器模组的低频下潜能力，保证了扬声器模组的低频性能。
另一方面，本公开提供的扬声器模组中设置有被动振动板，被动振动板能够在扬声器的驱动下振动，使得被动振动板作为次级声源向框体外部辐射声波。并且，通过设置被动振动板的谐振频率大于扬声器的谐振频率，使得在扬声器模组的工作频段内，被动振动板和扬声器向外辐射的声波能够互相叠加，从而，提高了扬声器模组在工作频段的声压级，并且，也提高了声能利用率。
在一种可能的实现方式中，被动振动板的谐振频率与扬声器模组的工作频段的上限频率的比值大于0.8。
由于当扬声器模组工作在大于扬声器的谐振频率，且小于被动振动板的谐振频率的频段时，扬声器向外辐射的声波和被动振动板向外辐射的声波互相叠加，而当扬声器模组工作在大于被动振动板的谐振频率的频段时，扬声器向外辐射的声波和被动振动板向外辐射的声波相消，所以，被动振动板的谐振频率在一定程度上决定了扬声器模组的工作频段的上限频率。
通过设置被动振动板的谐振频率与扬声器模组的工作频段的上限频率的比值大于0.8，使得在扬声器模组的大部分工作频段内，扬声器和被动振动板向外辐射的声波都是叠加的，从而，提高了扬声器模组在工作频段的声压级。
在一种可能的实现方式中，被动振动板的谐振频率与扬声器模组的工作频段的上限频率的比值大于或等于1。
这样，能够保证在扬声器模组的整个工作频段内，扬声器和被动振动板向外辐射的声波都是叠加的。
在一种可能的实现方式中，被动振动板的谐振频率与扬声器模组的工作频段的上限频率的比值小于2。
由于被动振动板在谐振频率处的振幅最大，因此，为了利用被动振动板在谐振频率附近产生的声波。被动振动板的谐振频率也不宜超过扬声器模组的工作频段的上限频率过多。
在一种可能的实现方式中，被动振动板的谐振频率与扬声器模组的工作频段的上限频率的比值小于1.5。
在一种可能的实现方式中，被动振动板的谐振频率与扬声器模组的工作频段的上限频率的比值小于1.2。
在一种可能的实现方式中，被动振动板的谐振频率大于第一频率，其中，第一频率为空腔和被动振动板组成的系统的谐振频率。
当扬声器模组工作在第一频率时，由于空腔和被动振动板组成的系统发生谐振，所以会对扬声器产生极大的力阻抗，使得在第一频率，扬声器辐射的声波为极小值。
而通过设置被动振动板的谐振频率大于第一频率，使得当扬声器模组工作在第一频率时，扬声器辐射的声波和被动振动板辐射的声波是同相的，则在被动振动板向外辐射的声波的叠加作用下，扬声器模组在第一频率辐射的声波的声压级仍然较高。
在一种可能的实现方式中，被动振动板的谐振频率与扬声器的谐振频率的比值大于1.5。
在一种可能的实现方式中，被动振动板的谐振频率与扬声器的谐振频率的比值大于2。
在一种可能的实现方式中，被动振动板的质量与扬声器的振动组件的质量的比值小于0.5。这样，能够实现被动振动板的谐振频率和扬声器的谐振频率符合上述关系。
在一种可能的实现方式中，被动振动板的质量与振动组件的质量的比值小于0.2。
在一种可能的实现方式中，被动振动板的面积与扬声器的振动板的面积的比值大于0.5且小于2。
这样，被动振动板和扬声器产生的声波的叠加效果较好，使得扬声器模组的声压级更好。
在一种可能的实现方式中，通气口用于与后腔连通，其中，后腔的容积与空腔的容积的比值大于10。
在一种可能的实现方式中，后腔为无限大后腔。
在一种可能的实现方式中，扬声器模组应用在车辆的内部，后腔为车辆外部的空间。
在一种可能的实现方式中，扬声器模组应用在房间的内部，后腔为室外的空间，或者，另一房间内部的空间。
在一种可能的实现方式中，框体具有管道，管道与空腔连通，且管道具有通气口。其中，管道的存在也能够对扬声器模组的声压级起到提升作用。
在一种可能的实现方式中，框体包括主体部和管道，主体部具有第一开口和第二开口，主体部、扬声器和被动振动板之间形成空腔。管道的一端与空腔连通，另一端具有通气口。
在一种可能的实现方式中，空腔和管道的谐振频率，与被动振动板的谐振频率的比值，大于0.5。
在一种可能的实现方式中，空腔和管道的谐振频率，与被动振动板的谐振频率的比值，大于0.7。
在一种可能的实现方式中，空腔和管道的谐振频率，与被动振动板的谐振频率的比值，小于5。
在一种可能的实现方式中，空腔和管道的谐振频率，与被动振动板的谐振频率的比值，小于3。
在一种可能的实现方式中，第一开口和第二开口分别位于主体部的两端，管道与主体部的一侧连接。
在一种可能的实现方式中，扬声器封闭第一开口，被动振动板封闭第二开口。
在一种可能的实现方式中，扬声器和被动振动板相对。这样，能够减少扬声器和被动振动板所需占用的空间，有利于减小扬声器模组的体积。
在一种可能的实现方式中，第一开口为两个，且两个第一开口相对。扬声器包括第一扬声器和第二扬声器，第一扬声器和第二扬声器分别位于两个第一开口，且第一扬声器和第二扬声器相抵。两个扬声器中的振动板的振动方向是相反的，也即，两个振动板要么相对运动，要么相背运动，则振动板振动带来的反作用力会互相抵消，两个扬声器的支撑组件的振动较小，有利于降低扬声器模组的谐振幅度，能够提升音质。
在一种可能的实现方式中，第二开口为两个，被动振动板包括第一被动振动板和第二被动振动板，第一被动振动板和第二被动振动板分别位于两个第二开口。第一扬声器、第一被动振动板和框体之间形成一个空腔，第二扬声器、第二被动振动板和框体之间形成一个空腔，且两个空腔均与通气口连通。
在一种可能的实现方式中，扬声器模组还包括保护盖，保护盖与框体连接，且罩住被动振动板。保护盖能够对被动振动板起到保护作用，以降低被动振动板损坏的可能性。
另外，保护盖具有框架结构，从而，保护盖不会将被动振动板的外侧封闭起来，保护盖不会影响被动振动板的振动。
在一种可能的实现方式中，扬声器包括支撑组件、磁路组件和振动组件，振动组件包括音圈、振动板和定心支片。支撑组件支撑磁路组件和振动组件，磁路组件用于驱动音圈振动，振动板分别与音圈、支撑组件连接，定心支片分别与振动板、支撑组件连接。
其中，定心支片还可以称为弹波。
在一种可能的实现方式中，定心支片呈圆环状，且定心支片的内侧与振动板连接，定心支片的外侧与支撑组件连接。
在一种可能的实现方式中，支撑组件朝向空腔的一侧具有框架结构。
第二方面，本公开提供了一种扬声器系统，扬声器系统包括壁和如第一方面任一项所述的扬声器模组。壁的第一侧形成后腔，后腔的容积至少为扬声器模组的空腔的容积的10倍。扬声器模组位于壁的第二侧，且扬声器模组的通气口与后腔连通。
其中，壁还可以称为障板和安装壁，当壁的第一侧的后腔无限大时，壁还可以称为无限大障板。
本公开提供的技术方案，一方面，由于后腔足够大，所以，通过将扬声器模组的通气口与后腔连通，能够提高扬声器模组的低频下潜能力，保证了扬声器模组的低频性能，而且，扬声器模组的体积也不必过大，不需占据过大的空间。
另一方面，在扬声器模组的工作频段内，在扬声器振动的同时，会驱动被动振动板振动，且扬声器和被动振动板产生的向外辐射的声波可以叠加，从而，提高了扬声器模组在工作频段的声压级，且提高了声能利用率。
在一种可能的实现方式中，扬声器模组安装在壁上，壁具有通孔，通气口通过通孔连通后腔。
在一种可能的实现方式中，扬声器系统应用于车辆，壁为车辆上的壁，扬声器模组位于车辆的内部，扬声器模组的的通气口与车辆外部连通。其中，车辆的外部形成无限大的后腔。
在一种可能的实现方式中，扬声器系统应用在房间中，壁为墙壁、顶壁或底壁，扬声器模组位于房间的内部，且扬声器模组的通气口与室外连通。其中，室外形成无限大的后腔。
在一种可能的实现方式中，扬声器系统应用在房间中，壁为墙壁、顶壁或底壁，扬声器模组位于一个房间的内部，且扬声器模组的通气口与另一个房间连通。其中，该另一个房间内中的空间(或后腔)的容积至少为扬声器模组的空腔的容积的10倍。
第三方面，本公开提供了一种车辆，车辆具有如第一方面任一项所述的扬声器模组，扬声器模组位于车辆的内部，且扬声器模组的通气口与车辆的外部连通。
本公开提供的技术方案，一方面，由于车辆的外部空间形成无限大的后腔，所以，通过将扬声器模组的通气口与车辆的外部连通，提高了扬声器模组的低频下潜能力，保证了扬声器模组的低频性能。并且，扬声器模组的体积不必过大，扬声器模组不会占据车内过大的空间。
另一方面，在扬声器模组的工作频段内，在扬声器振动的同时，会驱动被动振动板振动，且扬声器和被动振动板产生的向外辐射的声波可以叠加，从而，提高了扬声器模组在工作频段的声压级，且提高了声能利用率。
在一种可能的实现方式中，扬声器模组安装在车辆的壁上，车辆的壁上具有通孔，扬声器模组的通气口通过通孔连通车辆的外部。
在一种可能的实现方式中，扬声器模组位于车辆的轮胎的上方，通气口朝向车辆的下方，扬声器和被动振动板中的一个朝向车辆的左方，另一个朝向车辆的右方。
在一种可能的实现方式中，扬声器模组位于车辆的后备箱中，通气口朝向车辆的下方，且扬声器和被动振动板中的一个朝向车辆的左方，另一个朝向车辆的右方。
在一种可能的实现方式中，扬声器模组位于车辆的脚坑区域，脚坑区域是指驾驶员或乘员用于放脚的位置，可以是主驾驶位的脚坑区域，也可以是副驾驶位的脚坑区域。扬声器模组的通气口朝向车辆的下方，扬声器朝向车辆的后方，被动振动板朝向车辆的前方。
在一种可能的实现方式中，扬声器模组位于车辆的备胎容纳箱中，备胎容纳箱用于存放备胎。扬声器模组位于备胎的轮毂的下方，通气口和被动振动板朝向车辆的下方，扬声器朝向车辆的上方。轮毂上具有框架结构，从而，便于扬声器模组产生的声波向座舱内辐射。
附图说明
图1是本公开实施例提供的一种声短路的原理的示意图；
图2是本公开实施例提供的一种相关技术中具有密闭的音箱的扬声器模组的示意图；
图3是本公开实施例提供的一种相关技术中具有连通车辆外部的音箱的扬声器模组的示意图；
图4是本公开实施例提供的一种图3示出的扬声器模组的等效电路图；
图5是本公开实施例提供的一种扬声器模组的示意图；
图6是本公开实施例提供的一种扬声器模组的示意图；
图7是本公开实施例提供的一种扬声器模组的示意图；
图8是本公开实施例提供的一种扬声器模组的示意图；
图9是本公开实施例提供的一种扬声器模组的等效电路图；
图10是本公开实施例提供的一种扬声器、被动振动板和扬声器模组的声压级的示意图；
图11是本公开实施例提供的一种不同扬声器模组的声压级的对比示意图；
图12是本公开实施例提供的一种扬声器模组的三维示意图；
图13是本公开实施例提供的一种扬声器模组的三维示意图；
图14是本公开实施例提供的一种扬声器模组的剖视图；
图15是本公开实施例提供的一种扬声器模组的爆炸视图；
图16是本公开实施例提供的一种扬声器模组的示意图；
图17是本公开实施例提供的一种扬声器模组的示意图；
图18是本公开实施例提供的一种扬声器模组的示意图；
图19是本公开实施例提供的一种扬声器模组的示意图；
图20是本公开实施例提供的一种扬声器模组的示意图；
图21是本公开实施例提供的一种图20示出的扬声器模组的等效电路图；
图22是本公开实施例提供的一种扬声器模组的示意图；
图23是本公开实施例提供的一种扬声器模组的示意图；
图24是本公开实施例提供的一种扬声器模组的剖视图；
图25是本公开实施例提供的一种扬声器的三维示意图；
图26是本公开实施例提供的一种扬声器的剖视图；
图27是本公开实施例提供的一种车辆的示意图；
图28是本公开实施例提供的一种扬声器模组的安装位置示意图；
图29是本公开实施例提供的一种扬声器模组的安装位置示意图；
图30是本公开实施例提供的一种扬声器模组的安装位置示意图。
图例说明
100、扬声器模组，200、后腔，300、壁，400、通孔，500、后备箱，600、备胎容纳箱，700、备胎，
710、轮毂；
1、框体，11、主体部，110、空腔，111、第一开口，112、第二开口，12、管道，120、通气口；
2、扬声器，21、支撑组件，211、第一支架，212、第二支架，22、磁路组件，221、第一导磁片，
222、磁石，223、第二导磁片，23、振动组件，231、音圈，232、振动板，233、定心支片，234、防尘盖；
3、被动振动板；
4、保护盖。
具体实施方式
扬声器是把电能转换为声能，并将声能在空气中辐射到远处的电声换能器。扬声器一般包括支撑组件、磁路组件和振动组件，支撑组件用于支撑磁路组件和振动组件，磁路组件用于驱动振动组件振动，振动组件振动时产生声音。其中，振动组件包括振动板，振动板振动时发出声音。
扬声器工作时会发生声短路的现象。声短路是指扬声器的振动板向前或向后振动时，振动板前方和后方产生的声波是反相的，则振动板前方产生的声波和后方产生的声波会互相抵消，所以声音也很轻。如图1所示，形象的理解就是，当某一瞬间振动板往前运动，振动板前方的空气密度大，后方的空气密度小，如果没有什么阻拦，在压差的作用下振动板前方的空气会流动到后方，使得空气无法向前传播。
声短路与振动板的振动频率有关，振动频率越低，声波的绕射能力就越强，则振动板前方产生的声 波更容易绕射至后方，振动板后方产生的声波也更容易绕射至前方。从而，前方的声波和后方的声波更加容易互相抵消，声短路的现象也就越明显。
如图2所示，为了避免扬声器发生声短路，一般将扬声器安装在一个密闭的音箱中，则扬声器的振动板前方产生的声波和后方产生的声波被隔离，使得不会出现声短路的现象。
但是，密闭的音箱中的气体形成了空气弹簧，空气弹簧的存在使得振动板在振动时需要克服的阻力变大，这就造成了扬声器(振动板)的谐振频率的升高。由于扬声器的工作频段的下限频率位于扬声器的谐振频率的附近，因此，扬声器的谐振频率的升高，会造成扬声器的工作频段的下限频率升高，这造成了扬声器的工作频段向更高的频率偏移，使得扬声器的低频下潜能力较差。
可以理解的是，音箱的容积越大，音箱内的空气形成的空气弹簧的弹力越小，则对扬声器的谐振频率的影响越小，因此，为了提高扬声器的低频性能，实现更好的低频下潜，如下潜至40Hz或者更低，可以通过增大音箱的容积来实现，例如，将音箱的容积增大至20L以上。
然而，在某些场景中，不支持音箱具有较大的容积。例如，对于应用于车辆上的扬声器来说，过大的音箱会极大占用车内有限的空间，导致乘员或储物可利用空间缩减。
为了在不增大音箱容积的前提下，提高扬声器的低频性能，如图3所示，相关技术中提供了一种扬声器模组，该扬声器模组包括音箱和扬声器，音箱安装在车辆的壁上，且通过管道通入至车辆的外部。这样，车外的空间形成一个无限大的后腔，相当于将扬声器安装在一个无限大的音箱中，从而，实现了既不需占用较大的车内空间，也保证了扬声器的低频下潜能力。
然而，相关技术中提供的扬声器模组至少产生了如下技术问题：
第一，扬声器振动产生的位于音箱内的声波，全部通过管道辐射至车辆的外部，降低了声能利用率。
第二，受到音箱的空腔和管道的影响，扬声器模组在工作频段的声压级可能会有所衰减。
下面，结合相关技术中的扬声器模组的等效电路图，对上述第二个问题进行解释说明：
如图4所示，示出了图3示出的扬声器模组的等效电路图。在图4中，电阻Rs、电容Cs和电感Ls为扬声器的等效电器件，流经电阻Rs、电容Cs和电感Ls的电流越大，扬声器的声压级越大。电容Cb为空腔的等效电器件，电感Lp为管道的等效电器件，电容Cp为后腔的等效电器件。其中，后腔为与管道连通的车外的空间，由于后腔无限大，所以电容Cp无穷大，这种情况下电容Cp可认为是短路，因此，在电路分析时，不再考虑电容Cp。
流经电阻Rs、电容Cs和电感Ls的电流的大小，取决于电源p，以及电容Cb和电感Lp的并联电路产生的阻抗。而由于电容Cb的阻抗随着电源p的交流频率(与振动板的振动频率相等)的升高逐渐降低，电感Lp的阻抗随着交流频率的升高逐渐增大，则当电容Cb的阻抗和电感Lp的阻抗相等时，电容Cb和电感Lp的并联电路产生的阻抗为极大值，此时可以认为电容Cb和电感Lp产生了并联谐振，或认为管道和空腔产生了谐振。当电容Cb和电感Lp的并联电路产生的阻抗为极大值时，流经电阻Rs、电容Cs和电感Ls的电流显著减小，造成扬声器的声压级下降。
为了便于描述，将电容Cb和电感Lp产生并联谐振时的频率称为谐振频率fp，如果谐振频率fp位于扬声器模组的工作频段内，则会造成扬声器模组在工作频段的声压级的衰减。而为了使得谐振频率fp位于扬声器的工作频段之外，需要对空腔和管道的形状和大小进行特别设计，一般需要管道很短且管径很大，且需要空腔的容积很小，这显然限制了扬声器模组的应用场景。并且，如图11中表示相关技术2的声压级的曲线所示，即使将谐振频率fp设置在扬声器模组的工作频段(20Hz-200Hz)之外，则管道和空腔的存在仍然会使得扬声器模组在工作频段的声压级有所衰减。
鉴于上述技术问题，本公开实施例提供了一种扬声器模组100，该扬声器模组100既能够实现较好的低频下潜，也能够提升扬声器模组100在工作频段内的声压级，且可以减少对空腔和管道的形状和大小的限定。
下面，对本公开实施例提供的扬声器模组100进行示例性说明：
如图5所示，扬声器模组100包括框体1、扬声器2和被动振动板3。框体1具有第一开口111、第二开口112和通气口120，扬声器2位于第一开口111，被动振动板3位于第二开口112，框体1、扬声器2和被动振动板3之间形成空腔110，空腔110与通气口120连通。
其中，框体1还可以称为音箱和箱体等，用于支撑扬声器2和被动振动板3。框体1具有用于安装扬声器2和被动振动板3的第一开口111和第二开口112，在一些示例中，扬声器2封闭第一开口111，被动振动板3封闭第二开口112。另外，如图5所示，框体1可以具有管道12，管道12的一端与空腔110连 通，另一端具有通气口120。
如图6所示，扬声器2具有振动板232，振动板232振动产生声音。空腔110可以是在振动板232、被动振动板3和框体1之间形成的。振动板232还可以称为振膜和振动膜等。
被动振动板3和振动板232类似，但工作时不需要电信号驱动，由流体和声固耦合振动发声。当振动板232振动时，被动振动板3能够在振动板232的驱动下振动。被动振动板3还可以称为被动振动膜或无源辐射器(passive radiators，PR)。振动板232和被动振动板3一般由板体和折环组成，板体的材料一般为纸、塑料或金属，折环一般为橡胶或布等。
本公开实施例提供的扬声器模组100至少具有以下有益效果：
第一，本公开实施例提供的扬声器模组100的框体1设置有通气口120，且通气口120与空腔110连通，则通过将通气口120与容积足够大的后腔200连通，能够提高扬声器模组100的低频下潜能力，保证了扬声器模组100的低频性能。
在一些示例中，通气口120连通的后腔200的容积至少为空腔110的容积的10倍。也即，后腔200的容积与空腔110的容积的比值大于10。其中，空腔110的容积也可以认为包括管道12的容积。
在一些示例中，后腔200为无限大后腔，例如，扬声器模组100位于车内，后腔200为车外的空间。再例如，扬声器模组100位于室内，后腔200为室外的空间。
第二，本公开实施例提供的扬声器模组100中设置有被动振动板3，被动振动板3能够在扬声器2的驱动下振动，使得被动振动板3作为次级声源向(框体1)外辐射声波。并且，通过对扬声器2和被动振动板3的谐振频率的合理设置，能够使得在扬声器模组100的工作频段内，被动振动板3和扬声器2向外辐射的声波叠加，从而，提高了扬声器模组100在工作频段的声压级，并且，也提高了声能利用率。
另外，对于相关技术中因空腔和管道发生谐振，造成扬声器模组在工作频段的声压级衰减的问题，由于本公开实施例提供的扬声器模组100中的被动振动板3能够提升扬声器模组100在工作频段的声压级，所以，即使空腔和管道的谐振频率fp在扬声器模组100的工作频段内，则被动振动板3也能够对空腔和管道导致的扬声器模组100的声压级的衰减进行弥补，从而，可以不要求空腔和管道的谐振频率fp位于扬声器模组100的工作频段之外，也即，减少了对空腔和管道的形状和大小的限定，有利于扩展扬声器模组100的应用场景。
当然，空腔和管道的谐振频率fp还可以仍然位于扬声器模组100的工作频段之外，本公开实施例对此不作要求。
下面，结合图7和图8，对扬声器模组100的工作过程进行示例性说明：
如图7所示，在同一时刻，扬声器2和被动振动板3同时向外振动，则扬声器2和被动振动板3向框体1的外侧辐射的声波是同相的，两者能够叠加，从而，提升了扬声器模组100的声压级。并且，在扬声器2和被动振动板3向外振动的过程中，空腔110的容积变大，压强变小，在压差的作用下，后腔200中的气体通过通气口120流入至空腔110中，流入至空腔110中的气体又增大了空腔110中的压强，使得空腔110中的压强与扬声器2的外侧和被动振动板3的外侧的压强的压差减小，从而，降低了扬声器2和被动振动板3向外振动时遇到的阻力，有利于扬声器模组100的低频下潜。
如图8所示，在同一时刻，扬声器2和被动振动板3同时向内振动，则扬声器2和被动振动板3向框体1的外侧辐射的声波是同相的，两者能够叠加，从而，提升了扬声器模组100的声压级。并且，在扬声器2和被动振动板3向内振动的过程中，空腔110的容积变小，压强变大，在压差的作用，空腔110中的气体通过通气口120流入至后腔200中，这又使得空腔110中的压强变小，从而，降低了扬声器2和被动振动板3向内振动时遇到的阻力，有利于扬声器模组100的低频下潜。
可以理解的是，当扬声器2和被动振动板3同时振动时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波，不仅存在同相的可能性，也存在反相的可能性，也即，不仅存在互相叠加的可能性，也存在互相抵消的可能性。
具体的，如图7和图8所示，当扬声器2和被动振动板3同时向外振动以及同时向内振动时，扬声器2和被动振动板3向外辐射的声波是同相的，呈现的是叠加的效果。而如果扬声器2和被动振动板3中的一个向外振动，另一个向内振动，则扬声器2和被动振动板3向外辐射的声波是反相的，呈现的是抵消的效果。
需要说明的是，本公开实施例所指的扬声器2和被动振动板3向外辐射的声波同相，并不是指扬声器2和被动振动板3向外辐射的声波的相位完全相同，而是指扬声器2和被动振动板3向外辐射的声波的相 位差在-π/2至π/2之间，当相位差大于-π/2且小于π/2时，扬声器2和被动振动板3向外辐射的声波互相叠加。
同样的，本公开实施例所指的扬声器2和被动振动板3向外辐射的声波反相，并不是指扬声器2和被动振动板3向外辐射的声波的相位差严格等于π，而是指扬声器2和被动振动板3向外辐射的声波的相位差在-π至-π/2之间，以及在π/2至π之间，当相位差在该范围内时，扬声器和被动振动板3向外辐射的声波互相抵消。
下面，对如何使得在扬声器模组100的工作频段内，扬声器2向外辐射的声波和被动振动板3向外辐射的声波能够互相叠加进行说明：
经理论计算和实验验证：
当扬声器模组100的工作频率同时小于扬声器2的谐振频率fs和被动振动板3的谐振频率fr时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波是反相的，呈现的是相消的效果。
当扬声器模组100的工作频率同时大于扬声器2的谐振频率fs和被动振动板3的谐振频率fr时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波是反相的，呈现的是相消的效果。
对于扬声器2的谐振频率fs大于被动振动板3的谐振频率fr的情况，当扬声器模组100的工作频率小于扬声器2的谐振频率fs且大于被动振动板3的谐振频率fr时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波是同相的，呈现的是叠加的效果。
对于扬声器2的谐振频率fs小于被动振动板3的谐振频率fr的情况，当扬声器模组100的工作频率大于扬声器2的谐振频率fs且小于被动振动板3的谐振频率fr时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波是同相的，呈现的是叠加的效果。
由于扬声器2的谐振频率fs位于扬声器模组100的工作频段的下限频率附近，则可以先假定扬声器2的谐振频率fs与扬声器模组100的工作频段的下限频率相等。
如果设置被动振动板3的谐振频率fr小于扬声器2的谐振频率fs，则仅在扬声器模组100工作在小于扬声器2的谐振频率fs的频段时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波才是同相的，此时，被动振动板3起到的作用是增强扬声器模组100的低频下潜能力。在扬声器模组100工作在大于扬声器2的谐振频率fs的频段时，也即，工作在扬声器模组100的工作频段时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波都是反相的，被动振动板3无法起到增加扬声器模组100在工作频段的声压级的作用。
如果设置被动振动板3的谐振频率fr大于扬声器2的谐振频率fs，则在扬声器模组100工作在大于扬声器2的谐振频率fs和小于被动振动板3的谐振频率fr的频段时，扬声器2向外辐射的声波和被动振动板3向外辐射的声波是同相的。其中，该频段位于扬声器模组100的工作频段内。
综上，为了使得在扬声器模组100的工作频段内，扬声器2向外辐射的声波和被动振动板3向外辐射的声波能够互相叠加，应设置被动振动板3的谐振频率fr大于扬声器2的谐振频率fs。
另外，从上述论述中也可以得出，如果扬声器模组100工作在大于被动振动板3的谐振频率fr的频段，则被动振动板3向外辐射的声波与扬声器2向外辐射的声波会互相抵消，被动振动板3反而会使得扬声器模组100的声压级衰减。因此，被动振动板3的谐振频率fr在一定程度上决定了扬声器模组100的工作频段。
在一些示例中，为了使得扬声器模组100在整个工作频段的声压级均较高，可以设置被动振动板3的谐振频率fr大于或等于扬声器模组100的工作频段的上限频率。也即，被动振动板3的谐振频率与扬声器模组100的工作频段的上限频率的比值大于或等于1。
这样，在扬声器模组100的整个工作频段(后整个工作频段的后半段)内，扬声器2向外辐射的声波和被动振动板3向外辐射的声波均是叠加的。
另外，当扬声器模组100工作在大于被动振动板3的谐振频率fr的频段时，虽然被动振动板3辐射的声波会与扬声器2辐射的声波相消，造成扬声器模组100的声压级下降。但是，扬声器模组100的声压级的下降有个过程，所以，当扬声器模组100工作在略大于被动振动板3的谐振频率fr的频段时，扬声器模组100仍具有较高的声压级。因此，被动振动板3的谐振频率，也可以略小于扬声器模组100的工作频段的上限频率，则在一些示例中，被动振动板3的谐振频率与扬声器模组100的工作频段的上限频率的比值大于0.8。
在一些示例中，由于被动振动板3在谐振频率处的振幅最大，因此，为了利用被动振动板3在谐振频 率附近产生的声波。被动振动板3的谐振频率fr也不宜超过扬声器模组100的工作频段的上限频率过多。在一些示例中，被动振动板3的谐振频率fr与扬声器模组100的工作频段的上限频率的比值小于2。
在一些示例中，被动振动板3的谐振频率fr与扬声器模组100的工作频段的上限频率的比值小于1.5。进一步的，该比值小于1.2。
在一些示例中，被动振动板3的谐振频率与扬声器2的谐振频率的比值大于1.5。进一步的，在一些示例中，该比值大于2。
为了将被动振动板3的谐振频率fr和扬声器2的谐振频率fs调节为上述关系，在一些示例中，可以设置被动振动板3的质量与扬声器2的振动组件23的质量的比值小于0.5。
其中，被动振动板3的质量是指的被动振动板3的板体和折环的质量的总和，振动组件23的质量是指的振动组件23包括的音圈231、振动板232和定心支片233的质量的总和，在一些示例中，还可以包括防尘盖234的质量。
进一步的，在一些示例中，被动振动板3的质量与振动组件23的质量的比值小于0.2。
为了使得扬声器2向外辐射的声波和被动振动板3向外辐射的声波的叠加效果更好，在一些示例中，被动振动板3的面积与扬声器2的振动板232的面积的比值大于0.2且小于2。进一步的，被动振动板3的面积与扬声器2的振动板232的面积的比值大于0.5且小于2。
下面，结合本公开实施例提供的扬声器模组100的等效电路图，对引入被动振动板3后，扬声器模组100的变化进行说明：
如图9所示，示出了图5-图8示出的扬声器模组的等效电路图。在图9中，电阻Rs、电容Cs和电感Ls为扬声器2的等效电器件，对于扬声器2来说，流经电阻Rs、电容Cs和电感Ls的电流越大，扬声器2的声压级越大。电容Cb为空腔110的等效电器件，电感Lp为管道12的等效电器件，电容Cp为后腔200的等效电器件，当后腔200很大时，电容Cp无穷大，则电容Cp可认为是短路，因此，在电路分析时，不再考虑电容Cp。电阻Rr、电容Cr和电感Lr为被动振动板3的等效电器件，同样的，对于被动振动板3来说，流经电阻Rr、电容Cr和电感Lr的电流越大，被动振动板3的声压级越大。
从图9中可以看出，被动振动板3的加入，使得在电容Cb和电感Lp的并联电路上，又并联了一个支路，该支路包括串联的电阻Rr、电容Cr和电感Lr。这显然降低了扬声器2对应的电器件所在的回路的阻抗，提升了扬声器2的声压级。
也即，扬声器模组100的声压级的提升共存在以下两个方面的影响：
第一方面，扬声器2和被动振动板3向外辐射的声波叠加使得扬声器模组100的声压级提升。
第二方面，被动振动板3的引入，使得扬声器2本身的声压级提升。
如图10所示，本公开实施例提供了一种扬声器2向外辐射的声波的声压级、被动振动板3向外辐射的声波的声压级和扬声器模组100向外辐射的声压级的对比示意图。
从图10中可以看出，扬声器2在工作频段的后半段产生的声波的声压级存在明显的下降，在频率为第一频率f1时，扬声器2产生的声波的声压级为一个极小值。其中，该极小值的产生是因为空腔110、管道12(如果具有)和被动振动板3在第一频率f1产生谐振。对应到图9示出的电路图，可以理解为，Cb所在的支路、Lp所在的支路和Cr所在的支路形成的阻抗在第一频率f1出现了极大值。其中，第一频率f1还可以称为空腔110、管道12(如果具有)和被动振动板3组成的系统的谐振频率。
为了使得扬声器模组100在第一频率f1的声压级提升，如图10所示，设置被动振动板3的谐振频率fr大于第一频率f1，从而，当扬声器模组100工作在第一频率f1时，被动振动板3产生的声波与扬声器2产生的声波叠加，使得扬声器模组100的声压级提升。
另外，从图10也可以看出，被动振动板3在自身的谐振频率fr之后向外辐射的声波，与扬声器2向外辐射的声波会互相抵消，这会使得扬声器模组100的声压级有一个很低的值，如图10中虚线框框出的部分。然而，由于该部分对应的频率位于扬声器模组100的工作频段之外，所以，并不会造成扬声器模组100在工作频段的声压级的衰减。
如图11所示，本公开实施例提供了一种本方案与相关技术1和相关技术中2的声压级的对比示意图。其中，相关技术1表示图2示出的扬声器安装在密闭箱体中的技术方案，相关技术2表示图3示出的技术方案。
从图11中可以看出，与相关技术1相比，由于本公开实施例提供的扬声器模组100设置有通气口120，且通气口120与足够大的后腔200连通，所以，本公开实施例提供的扬声器模组100的低频下潜能力，显 著优于相关技术1的扬声器的低频下潜能力。具体的，在40Hz以下，本公开实施例提供的扬声器模组100的声压级相对于相关技术1的扬声器的声压级提升3dB以上。
与相关技术2相比，由于扬声器模组均与足够大的后腔200连通，所以，在工作频段的前半段(20Hz～50Hz)，本公开实施例提供的扬声器模组100和相关技术2中的扬声器模组的声压级相差不大。然而，在工作频段的后半段(50Hz～200Hz)，由于本公开实施例提供的扬声器模组100中的被动振动板3振动产生的声波的叠加作用，以及，扬声器2本身的声压级的提升，本公开实施例提供的扬声器模组100的声压级有明显的提升。
另外，从图11中可以看出，虽然相关技术2中将管道和腔体的谐振频率fp设置为远大于扬声器模组的工作频段的上限频率(200Hz)。然而，管道和空腔仍然会使得相关技术2中的扬声器模组在工作频段的后半段(如100Hz-200Hz)的声压级下降。
在一些示例中，空腔110和管道12的谐振频率fp，与被动振动板3的谐振频率fr的比值，大于0.5。
这样，被动振动板3的谐振频率fr位于空腔110和管道12的谐振频率fp的附近，使得被动振动板3能够对因空腔110和管道12造成的扬声器模组的声压级的下降，进行有效的补偿，最大限度的发挥了被动振动板3的作用。或者，当fp较大时(如fp大于2)，空腔110和管道12的谐振频率fp位于扬声器模组的工作频段之外，则能够降低管道12和空腔110发生谐振，对扬声器模组的工作频段内的声压级的影响。
进一步的，在一些示例中，空腔110和管道12的谐振频率fp，与被动振动板3的谐振频率fr的比值，大于0.7。
在一些示例中，空腔110和管道12的谐振频率fp，与被动振动板3的谐振频率fr的比值，小于5。进一步的，小于3。
需要说明的是，本公开实施例所指的扬声器2的谐振频率fs和被动振动板3的谐振频率fr均是指的扬声器2和被动振动板3工作谐振频率。除了工作谐振频率之外，扬声器2和被动振动板3还具有固有频率(或称为本真频率)，固有频率是指扬声器2和被动振动板3未安装到框体1上时，扬声器2和被动振动板3的谐振频率。
由于在扬声器2和被动振动板3安装在框体1之后，扬声器2因受到被动振动板3、空腔110和管道12的影响，被动振动板3因受到扬声器2、空腔110和管道12的影响，所以固有频率与工作谐振频率不同。
下面，对本公开实施例提供的扬声器模组100的结构进行更加详细的示例性说明：
如图12-图15所示，为本公开实施例提供的一种扬声器模组100的实物图。
在一些示例中，如图5-图8，以及，图12-图19所示，框体1包括主体部11和管道12，主体部11具有第一开口111和第二开口112，主体部11、扬声器2和被动振动板3之间形成空腔110。管道12的一端与空腔110连通，另一端具有通气口120。
本公开实施例对管道12与主体部11的连接位置不作限定，在一些示例中，如图5-图8和图19，定义第一开口111位于主体部11的端部，则管道12与主体部11的一侧连接。
在另一些示例中，如图18所示，管道12与主体部11的端部连接，且该端部与第一开口111所在的端部相对。
在另一些示例中，管道12也可以与第一开口111所在的端部连接。
本公开实施例对管道12的形态不作限定，在一些示例中，管道12为直管道，在另一些示例中，管道12为弯曲的管道。在一些示例中，如图5-图8，以及，图12-图18所示，管道12的管径保持不变。在另一些示例中，如图19所示，沿着远离主体部11的方向，管道12的管径逐渐减小。
当然，在另一些示例中，如图20所示，框体1还可以不具有管道12。如图21所示，示出了图20示出的扬声器模组100的等效电路图。在图21中，空腔110对应的电器件为电感Lp，此时，空腔110起到的是管道的作用。
本公开实施例对扬声器2和被动振动板3在框体1上的相对位置不作限定，下面，进行示例性说明：
在一些示例中，如图5所示，扬声器2和被动振动板3相对。这样，能够减小扬声器2和被动振动板3所占用的空间，有利于减小扬声器模组2的体积。
在一些示例中，如图16所示，扬声器2和被动振动板3分别位于相邻的两个框壁上。
在一些示例中，如图17所示，扬声器2和被动振动板3位于同一框壁上。
需要说明的是，以上示出的扬声器2和被动振动板3的几种位置仅仅是示例性说明，扬声器2和被动振动板3还可以位于其它位置，本公开实施例对此不作限定。
本公开实施例对扬声器2和被动振动板3的数量不作限定，下面，进行示例性说明：
在一些示例中，如图5所示，扬声器2和被动振动板3均为一个。在一些示例中，如图22所示，扬声器2为一个，被动振动板3为多个。示例性的，一个扬声器2可以与多个(例如两个)被动振动板3相对。在一些示例中，被动振动板3为一个，扬声器2为多个。在一些示例中，被动振动板3和扬声器2均为多个，多个被动振动板3和多个扬声器2的数量可以相同，也可以不同。多个扬声器2可以分别与多个被动振动板3相对。
下面，对具有两个扬声器2的扬声器模组100进行示例性说明。如图23和图24所示，第一开口111为两个，且两个第一开口111相对。扬声器2包括第一扬声器2a和第二扬声器2b，第一扬声器2a和第二扬声器2b分别位于两个第一开口111，且第一扬声器2a和第二扬声器2b相抵。
这样，两个扬声器2中的振动板232的振动方向是相反的，也即，两个振动板232要么相对运动，要么相背运动，则振动板232振动带来的反作用力会互相抵消，两个扬声器2的支撑组件的振动较小，有利于降低扬声器模组的谐振幅度，能够提升音质。
在一些示例中，如图23和图24所示，第二开口112为两个，被动振动板3包括第一被动振动板3a和第二被动振动板3b，第一被动振动板3a和第二被动振动板3b分别位于两个第二开口112。第一扬声器2a、第一被动振动板3a和框体1之间形成一个空腔110，第二扬声器2b、第二被动振动板3b和框体1之间形成一个空腔110，且两个空腔110均与通气口120连通。
为了对被动振动板3进行一定的保护，降低被动振动板3损坏的可能性，在一些示例中，如图12-图15所示，扬声器模组100还包括保护盖4，保护盖4与框体1连接，且罩住被动振动板3。并且，保护盖4具有框架结构，从而，保护盖4不会将被动振动板3的外侧封闭起来，不会对被动振动板3的振动产生影响。
下面，对本公开实施例提供的扬声器2的结构进行示例性说明：
如图6、如图25和图26所示，本公开实施例提供的扬声器2为动圈式扬声器，扬声器2包括支撑组件21、磁路组件22和振动组件23。支撑组件21支撑磁路组件22和振动组件23，磁路组件22用于驱动振动组件23振动，振动组件23振动时发出声音。
在一些示例中，如图25和图26所示，支撑组件21包括第一支架211和第二支架212，第一支架211位于框体1的内部，第二支架212位于框体1的外部。第一支架211和第二支架212固定连接，并对磁路组件22和振动组件23起到保护和支撑的作用。
在一些示例中，如图6和图26所示，磁路组件22包括第一导磁片221、磁石222和第二导磁片223，第一导磁片221、磁石222和第二导磁片223同轴设置，且磁石222位于第一导磁片221和第二导磁片223之间。磁路组件22用于产生变化的磁场，以驱动振动组件23振动。
在一些示例中，如图6、图25和图26所示，振动组件23包括音圈231、振动板232和定心支片233，音圈231与振动板232连接。磁路组件22驱动音圈231运动，音圈231运动时带动振动板232振动。定心支片233分别与振动板232和支撑组件21(如第一支架211)连接，定心支片233用于定位音圈231和振动板232的位置，保证音圈231和振动板232沿轴向往复运动。并且，定心支片233具有一定的弹性，能够对扬声器2的谐振频率起到一定的影响。再者，定心支片233还能够起到防尘的作用。其中，定心支片233还可以称为弹波。
在一些示例中，如图25所示，定心支片233呈圆环状，且定心支片233的内侧与振动板232连接，例如，粘接，定心支片233的外侧与支撑组件21连接。
在一些示例中，如图6、图25和图26所示，振动组件23还包括防尘盖234。
在一些示例中，如图25所示，支撑组件21朝向空腔110的一侧具有框架结构。示例性的，第一支架211具有框架结构。
在一些示例中，如图6所示，磁路组件22位于空腔110的内部，在另一些示例中，如图26所示，磁路组件22也可以位于空腔110的外部。
本公开实施例还提供了一种扬声器系统，如图5-图8、图16-图20以及图22和图23所示，扬声器系统包括壁300和扬声器模组100，壁300的第一侧形成(或称为具有)后腔200，后腔200的容积至少为扬声器模组100的空腔110的容积的10倍。扬声器模组100位于壁300的第二侧，且扬声器模组100的通 气口120与后腔200连通。
其中，壁300还可以称为障板和安装壁，当壁300的第一侧的后腔200无限大时，壁300还可以称为无限大障板。
本公开实施例提供的技术方案，一方面，由于后腔200足够大，所以，通过设置扬声器模组100的通气口120与后腔200连通，能够提高扬声器模组100的低频下潜能力，保证了扬声器模组100的低频性能，且扬声器模组100的体积不必过大，不需占据过大的空间。
另一方面，在扬声器模组100的工作频段内，在扬声器2振动的同时，会驱动被动振动板3振动，且扬声器2和被动振动板3产生的声波可以叠加，从而，提高了扬声器模组100在工作频段的声压级，且提高了声能利用率。
在一些示例中，如图5-图8、图16-图20以及图22和图23所示，扬声器模组100安装在壁300上，壁300上设置有通孔400，通气口120通过通孔400连通后腔200。
本公开实施例对扬声器系统的应用场景不作限定，只要在该应用场景中具有足够大的后腔200(后腔200的容积至少为空腔110的容积的10倍)，或具有足够大的障板(壁300)即可。下面，对扬声器系统的应用场景进行示例性说明：
在一些示例中，如图27-图30所示，扬声器系统应用于车辆，则壁300为车辆上的壁，如车辆的底壁或侧壁等，扬声器模组100的通气口120与车辆外部连通，车辆的外部形成无限大的后腔200。有关扬声器系统应用在车辆上的具体方案，可以参见下述车辆的相关内容，在此不再赘述。
在一些示例中，扬声器系统应用在房间中，则壁300为房间的墙壁、底壁或顶壁。在一些示例中，扬声器模组100位于房间的内部，扬声器模组100的通气口120通入室外，室外形成无限大的后腔200。
在另一些示例中，扬声器模组100位于一个房间中，扬声器模组100的通气口120通入至另一个房间中，该另一个房间内的空间(后腔200)的容积至少为空腔110的容积的10倍。
本公开实施例还提供了一种车辆，如图27-图30所示，车辆具有扬声器模组100，扬声器模组100位于车辆的内部，且扬声器模组100的通气口120与车辆的外部连通。
本公开实施例提供的技术方案，一方面，由于车辆的外部空间形成无限大的后腔200，所以，通过将扬声器模组100的通气口120与车辆的外部连通，提高了扬声器模组100的低频下潜能力，保证了扬声器模组100的低频性能。并且，扬声器模组100的体积不必过大，扬声器模组100不会占据车内过大的空间。
另一方面，在扬声器模组100的工作频段内，在扬声器2振动的同时，会驱动被动振动板3振动，且扬声器2和被动振动板3产生的声波可以叠加，从而，提高了扬声器模组100在工作频段的声压级，且提高了声能利用率。
在一些示例中，如图27-图30所示，扬声器模组100安装在车辆的壁300上，车辆的壁300上具有通孔400，扬声器模组100的通气口120通过通孔400连通车辆的外部。
本公开实施例对扬声器模组100具体的安装位置不作限定，在一些示例中，为了减少对车内人员的活动空间的占用，扬声器模组100可以安装在下述几个位置：
在一些示例中，如图28所示，扬声器模组100位于车辆的轮胎的上方，则壁300为轮胎上方的壁。在一些示例中，扬声器模组100的通气口120朝下，扬声器2和被动振动板3可以朝向车辆的水平方向或近似水平方向，例如，可以朝向车辆的左右方向(如图28所示)，也可以朝向车辆的前后方向。
在一些示例中，如图29所示，扬声器模组100位于车辆的后备箱500中，则壁300可以为后备箱500的底壁。在一些示例中，扬声器模组100的通气口120朝下，扬声器2和被动振动板3可以朝向车辆的水平方向或近似水平方向，例如，可以朝向车辆的左右方向(如图29所示)，也可以朝向车辆的前后方向。
在一些示例中，如图30所示，扬声器模组100位于车辆的备胎容纳箱600中。其中，备胎容纳箱600用于容纳车辆的备胎，备胎容纳箱600可以位于车辆的后备箱500的下方。壁300可以为备胎容纳箱600的底壁。在一些示例中，扬声器模组100的通气口120朝下，扬声器2和被动振动板3可以朝向车辆上下方向。例如，扬声器2朝向车辆的上方，被动振动板3朝向车辆的下方。
另外，本公开实施例对扬声器模组100在备胎容纳箱600中的具体位置不作限定，在一些示例中，如图30所示，扬声器模组100位于车辆的备胎700的轮毂710的下方。其中，轮毂710上具有框架结构，从而，便于扬声器模组100发出的声音辐射至车辆的座舱内。
在一些示例中，扬声器模组100位于车辆的脚坑区域。其中，脚坑区域是指车辆的座舱内部，驾驶员 或乘员用于放脚的位置，例如，主驾驶位的脚坑区域，也即，刹车和油门等所在的区域，再例如，副驾驶位的脚坑区域。壁300可以为车辆的底盘的壁，在一些示例中，扬声器模组100的通气口120朝下，扬声器2和被动振动板3可以朝向车辆的水平方向或近似水平方面，可以朝向车辆的左右方向或前后方向。例如，扬声器2朝向车辆的后方，被动振动板3朝向车辆的前方。
本公开的实施方式部分使用的术语仅用于对本公开的实施例进行解释，而非旨在限定本公开。除非另作定义，本公开的实施方式使用的技术术语或者科学术语应当为本公开所属领域内具有一般技能的人士所理解的通常意义。本公开说明书以及权利要求书中使用的“第一”、“第二”以及类似的词语并不表示任何顺序、数量或者重要性，而只是用来区分不同的组成部分。同样，“一个”或者“一”等类似词语也不表示数量限制，而是表示存在至少一个。“包括”或者“包含”等类似的词语意指出现在“包括”或者“包含”前面的元件或者物件涵盖出现在“包括”或者“包含”后面列举的元件或者物件及其等同，并不排除其他元件或者物件。“上”、“下”、“左”、“右”等仅用于表示相对位置关系，当被描述对象的绝对位置改变后，则所述相对位置关系也可能相应地改变。“多个”指两个或两个以上，除非另有明确的限定。
以上所述仅为本公开的可选实施例，并不用以限制本公开，凡在本公开的原则之内，所作的任何修改、等同替换、改进等，均应包含在本公开的保护范围之内。

Claims (24)

  1. 一种扬声器模组，其特征在于，所述扬声器模组包括框体(1)、扬声器(2)和被动振动板(3)，所述被动振动板(3)的谐振频率大于所述扬声器(2)的谐振频率；
    所述框体(1)具有第一开口(111)、第二开口(112)和通气口(120)；
    所述扬声器(2)位于所述第一开口(111)，所述被动振动板(3)位于所述第二开口(112)，所述框体(1)、所述扬声器(2)和所述被动振动板(3)之间形成空腔(110)，所述空腔(110)与所述通气口(120)连通。
  2. 根据权利要求1所述的扬声器模组，其特征在于，所述被动振动板(3)的谐振频率与所述扬声器模组的工作频段的上限频率的比值大于0.8。
  3. 根据权利要求1或2所述的扬声器模组，其特征在于，所述被动振动板(3)的谐振频率与所述扬声器模组的工作频段的上限频率的比值小于2。
  4. 根据权利要求1-3任一项所述的扬声器模组，其特征在于，所述被动振动板(3)的谐振频率大于第一频率，其中，所述第一频率为所述空腔(110)和所述被动振动板(3)组成的系统的谐振频率。
  5. 根据权利要求1-4任一项所述的扬声器模组，其特征在于，所述被动振动板(3)的谐振频率与所述扬声器(2)的谐振频率的比值大于1.5。
  6. 根据权利要求1-5任一项所述的扬声器模组，其特征在于，所述被动振动板(3)的质量与所述扬声器(2)的振动组件(23)的质量的比值小于0.5。
  7. 根据权利要求1-6任一项所述的扬声器模组，其特征在于，所述被动振动板(3)的面积与所述扬声器(2)的振动板(232)的面积的比值大于0.5且小于2。
  8. 根据权利要求1-7任一项所述的扬声器模组，其特征在于，所述通气口(120)用于与后腔(200)连通，其中，所述后腔(200)的容积与所述空腔(110)的容积的比值大于10。
  9. 根据权利要求1-8任一项所述的扬声器模组，其特征在于，所述框体(1)包括主体部(11)和管道(12)；
    所述主体部(11)具有所述第一开口(111)和所述第二开口(112)，所述主体部(11)、所述扬声器(2)和所述被动振动板(3)之间形成所述空腔(110)；
    所述管道(12)的一端与所述空腔(110)连通，另一端具有所述通气口(120)。
  10. 根据权利要求9所述的扬声器模组，其特征在于，所述空腔(110)和所述管道(12)的谐振频率，与所述被动振动板(3)的谐振频率的比值，大于0.5。
  11. 根据权利要求9或10所述的扬声器模组，其特征在于，所述第一开口(111)和所述第二开口(112)分别位于所述主体部(11)的两端；
    所述管道(12)与所述主体部(11)的一侧连接。
  12. 根据权利要求1-11任一项所述的扬声器模组，其特征在于，所述扬声器(2)封闭所述第一开口(111)，所述被动振动板(3)封闭所述第二开口(112)。
  13. 根据权利要求1-12任一项所述的扬声器模组，其特征在于，所述扬声器(2)和所述被动振动板(3)相对。
  14. 根据权利要求1-13任一项所述的扬声器模组，其特征在于，所述第一开口(111)为两个，且两个所述第一开口(111)相对；
    所述扬声器(2)包括第一扬声器(2a)和第二扬声器(2b)，所述第一扬声器(2a)和所述第二扬声器(2b)分别位于两个所述第一开口(111)，且所述第一扬声器(2a)和所述第二扬声器(2b)相抵。
  15. 根据权利要求14所述的扬声器模组，其特征在于，所述第二开口(112)为两个；
    所述被动振动板(3)包括第一被动振动板(3a)和第二被动振动板(3b)，所述第一被动振动板(3a)和所述第二被动振动板(3b)分别位于两个所述第二开口(112)；
    所述第一扬声器(2a)、所述第一被动振动板(3a)和所述框体(1)之间形成一个空腔(110)，所述第二扬声器(2b)、所述第二被动振动板(3b)和所述框体(1)之间形成一个空腔(110)，且两个所述空腔(110)均与所述通气口(120)连通。
  16. 根据权利要求1-15任一项所述的扬声器模组，其特征在于，所述扬声器模组还包括保护盖(4)，所述保护盖(4)与所述框体(1)连接，且罩住所述被动振动板(3)。
  17. 根据权利要求1-16任一项所述的扬声器模组，其特征在于，所述扬声器(2)包括支撑组件(21)、磁路组件(22)和振动组件(23)，所述振动组件(23)包括音圈(231)、振动板(232)和定心支片(233)；
    所述支撑组件(21)支撑所述磁路组件(22)和所述振动组件(23)，所述磁路组件(22)用于驱动所述音圈(231)振动；
    所述振动板(232)分别与所述音圈(231)、所述支撑组件(21)连接，所述定心支片(233)分别与所述振动板(232)、所述支撑组件(21)连接。
  18. 根据权利要求17所述的扬声器模组，其特征在于，所述支撑组件(21)朝向所述空腔(110)的一侧具有框架结构。
  19. 一种扬声器系统，其特征在于，所述扬声器系统包括壁(300)和如权利要求1-18任一项所述的扬声器模组(100)；
    所述壁(300)的第一侧形成后腔(200)，所述后腔(200)的容积与所述扬声器模组(100)的空腔(110)的容积的比值大于10；
    所述扬声器模组(100)位于所述壁(300)的第二侧，且所述扬声器模组(100)的通气口(120)与所述后腔(200)连通。
  20. 一种车辆，其特征在于，所述车辆具有如权利要求1-18任一项所述的扬声器模组(100)；
    所述扬声器模组(100)位于所述车辆的内部，且所述扬声器模组(100)的通气口(120)与所述车辆的外部连通。
  21. 根据权利要求20所述的车辆，其特征在于，所述扬声器模组(100)位于所述车辆的轮胎的上方；
    所述通气口(120)朝向所述车辆的下方，且所述扬声器模组(100)的扬声器(2)和被动振动板(3)中的一个朝向所述车辆的左方，另一个朝向所述车辆的右方。
  22. 根据权利要求20所述的车辆，其特征在于，所述扬声器模组(100)位于所述车辆的后备箱(500)中；
    所述通气口(120)朝向所述车辆的下方，且所述扬声器模组(100)的扬声器(2)和被动振动板(3)中的一个朝向所述车辆的左方，另一个朝向所述车辆的右方。
  23. 根据权利要求20所述的车辆，其特征在于，所述扬声器模组(100)位于所述车辆的脚坑区域；
    所述通气口(120)朝向所述车辆的下方，所述扬声器模组(100)的扬声器(2)朝向所述车辆的后方，所述扬声器模组(100)的被动振动板(3)朝向所述车辆的前方。
  24. 根据权利要求20所述的车辆，其特征在于，所述扬声器模组(100)位于所述车辆的备胎容纳箱(600)中，且位于所述车辆的备胎(700)的轮毂(710)的下方；
    所述通气口(120)和所述扬声器模组(100)的被动振动板(3)朝向所述车辆的下方，所述扬声器模组(100)的扬声器(2)朝向所述车辆的上方。
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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115988392B (zh) * 2023-01-12 2024-01-16 华为技术有限公司 扬声器模组、扬声器系统和车辆
CN120857032A (zh) * 2025-06-30 2025-10-28 深圳引望智能技术有限公司 扬声器模组、音响系统及交通工具

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139075A (en) * 1976-08-31 1979-02-13 Sansui Electric Co., Ltd. Loudspeaker device
GB9500068D0 (en) * 1995-01-04 1995-03-01 B & W Loudspeakers Loudspeaker systems
JPH0898292A (ja) * 1994-03-02 1996-04-12 Sony Corp スピーカ装置
FR3039959A1 (fr) * 2015-08-05 2017-02-10 Sagemcom Broadband Sas Enceinte acoustique de type bass-reflex
CN111836157A (zh) * 2020-08-10 2020-10-27 苏州上声电子股份有限公司 一种车载低音扬声器装置及其设计方法
CN215499438U (zh) * 2021-07-14 2022-01-11 常州威百特电子有限公司 一种被动扩音的迷你扬声设备
CN115988392A (zh) * 2023-01-12 2023-04-18 华为技术有限公司 扬声器模组、扬声器系统和车辆

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3315329B2 (ja) * 1996-09-30 2002-08-19 パイオニア株式会社 スピーカシステム
JP2976284B2 (ja) * 1997-06-06 1999-11-10 成範 平松 スピーカシステムの低音増強装置
US7463747B2 (en) * 2004-03-31 2008-12-09 Panasonic Corporation Loudspeaker system
JP3926833B1 (ja) * 2006-06-07 2007-06-06 洋 中田 スピーカ装置
EP2154906B1 (en) * 2007-06-12 2017-08-09 Panasonic Intellectual Property Management Co., Ltd. Speaker system
EP4187919A1 (en) * 2009-10-23 2023-05-31 Blueprint Acoustics Pty Ltd Loudspeaker assembly and system
US10567867B2 (en) * 2017-09-05 2020-02-18 Bose Corporation Externally ducted vehicle loudspeaker
CN209120453U (zh) * 2018-12-14 2019-07-16 深圳纽斯声学系统有限公司 汽车门低音炮
CN114125662B (zh) * 2020-09-01 2026-01-23 华为技术有限公司 扬声器及电子设备
KR102857416B1 (ko) * 2020-11-27 2025-09-09 현대자동차주식회사 차량 및 그 제어방법

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4139075A (en) * 1976-08-31 1979-02-13 Sansui Electric Co., Ltd. Loudspeaker device
JPH0898292A (ja) * 1994-03-02 1996-04-12 Sony Corp スピーカ装置
GB9500068D0 (en) * 1995-01-04 1995-03-01 B & W Loudspeakers Loudspeaker systems
FR3039959A1 (fr) * 2015-08-05 2017-02-10 Sagemcom Broadband Sas Enceinte acoustique de type bass-reflex
CN111836157A (zh) * 2020-08-10 2020-10-27 苏州上声电子股份有限公司 一种车载低音扬声器装置及其设计方法
CN215499438U (zh) * 2021-07-14 2022-01-11 常州威百特电子有限公司 一种被动扩音的迷你扬声设备
CN115988392A (zh) * 2023-01-12 2023-04-18 华为技术有限公司 扬声器模组、扬声器系统和车辆

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
See also references of EP4637184A1

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AU2024206915A1 (en) 2025-07-31
MX2025008201A (es) 2025-10-01

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