WO2024225632A1 - Test device - Google Patents
Test device Download PDFInfo
- Publication number
- WO2024225632A1 WO2024225632A1 PCT/KR2024/004150 KR2024004150W WO2024225632A1 WO 2024225632 A1 WO2024225632 A1 WO 2024225632A1 KR 2024004150 W KR2024004150 W KR 2024004150W WO 2024225632 A1 WO2024225632 A1 WO 2024225632A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- probe
- tested
- subject
- signal
- test device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0864—Measuring electromagnetic field characteristics characterised by constructional or functional features
- G01R29/0878—Sensors; antennas; probes; detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/10—Radiation diagrams of antennas
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0807—Measuring electromagnetic field characteristics characterised by the application
- G01R29/0814—Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
- G01R29/0821—Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning rooms and test sites therefor, e.g. anechoic chambers, open field sites or TEM cells
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R29/00—Arrangements for measuring or indicating electric quantities not covered by groups G01R19/00 - G01R27/00
- G01R29/08—Measuring electromagnetic field characteristics
- G01R29/0807—Measuring electromagnetic field characteristics characterised by the application
- G01R29/0814—Field measurements related to measuring influence on or from apparatus, components or humans, e.g. in ESD, EMI, EMC, EMP testing, measuring radiation leakage; detecting presence of micro- or radiowave emitters; dosimetry; testing shielding; measurements related to lightning
- G01R29/0835—Testing shielding, e.g. for efficiency
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06772—High frequency probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/282—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
- G01R31/2822—Testing of electronic circuits specially adapted for particular applications not provided for elsewhere of microwave or radiofrequency circuits
Definitions
- the disclosure relates to a test device for testing the characteristics of a subject-to-be-tested with a built-in antenna that emits a wireless signal.
- a subject-to-be-tested i.e., a semiconductor device includes a built-in patch antenna. Accordingly, there is required a test device capable of evaluating the characteristics of the built-in antenna of the semiconductor device.
- An aspect of the disclosure is to provide a test device for testing the characteristics of a subject-to-be-tested including a built-in antenna that emits a wireless signal.
- the test device includes a signal probe including one end portion to be in contact with a first terminal of the subject-to-be-tested to transmit a test signal; a ground probe to be in contact with a second terminal of the subject-to-be-tested; and a socket block including a probe supporter to support the signal probe and the ground probe, and a waveguide corresponding to the antenna of the subject-to-be-tested and penetrating therethrough in a lengthwise direction of the signal probe to measure the wireless signal in a different area from the probe supporter.
- the waveguide may include a shielding wall protruding from one side of the socket block facing the subject-to-be-tested toward the antenna.
- the shielding wall may have a height set to satisfy loss characteristics of the wireless signal when the first terminal and the second terminal of the subject-to-be-tested are in contact with the signal probe and the ground probe, respectively.
- the shielding wall may include terminal guide grooves recessed along a test direction to guide the second terminal to move down upon a test.
- the probe supporter and the waveguide may include a conductive material.
- the probe supporter may be made of an insulating material.
- the waveguide may be made of a conductive material.
- the socket block may include a conductive connector that connects the ground probe and the waveguide.
- the test device tests not only the electrical characteristics of the subject-to-be-tested but also the characteristics of the built-in patch antenna at a time, thereby reducing test time and test costs.
- FIG. 1 is a view showing a subject-to-be-tested viewed from below.
- FIG. 2 is a perspective view of a test device according to an embodiment of the disclosure.
- FIG. 3 is an exploded perspective view of the test device in FIG. 2.
- FIG. 4 is a perspective view of a socket block in FIG. 2 viewed from above.
- FIG. 5 is a perspective view of the socket block of FIG. 2 vied from below.
- FIG. 6 is a cross-sectional view taken along line A-A in FIG. 4.
- FIG. 7 is an enlarged cross-sectional view of B in FIG. 6.
- FIG. 8 is an enlarged perspective view of C in FIG. 4.
- FIG. 9 shows the loss characteristics of a wireless signal according to gaps between the bottom of a subject-to-be-tested and the top of a shielding wall.
- FIG. 10 is a cross-sectional view of a socket block according to another embodiment of the disclosure.
- test device 100 according to an embodiment of the disclosure will be described with reference to the accompanying drawings.
- FIG. 1 is a view showing a subject-to-be-tested 1 viewed from below
- FIG. 2 is a perspective view of the test device 100 according to an embodiment of the disclosure
- FIG. 3 is an exploded perspective view of the test device 100 in FIG. 2.
- the subject-to-be-tested 1 refers to a thing, the electrical characteristics and antenna characteristics of which will be subjected to a test.
- the subject-to-be-tested 1 may be a semiconductor device including a plurality of built-in patch antennas 11.
- the subject-to-be-tested 1 includes a plurality of terminals 12 protruding in the form of bumps on the bottom thereof.
- the plurality of terminals 12 includes a signal terminal, a ground terminal, and a power terminal.
- the test device 100 is to test the electrical characteristics and antenna characteristics of the subject-to-be-tested 1 of FIG. 1, and includes a test object insertion block 110, a socket block 120, and a block supporter 130.
- the test object insertion block 110 includes a test object accommodating portion 111 that accommodates the subject-to-be-tested 1 to perform a test.
- the socket block 120 has one side exposed to the test object accommodating portion 111 as shown in FIG. 2 while being supported in the block supporter 130.
- the block supporter 130 includes a first block supporter 131 and a second block supporter 132.
- the socket block 120 is interposed between the first block supporter 131 and the second block supporter 132.
- the first block supporter 131 includes a first opening 1311 that communicates with the test object accommodating portion 111 of the test object insertion block 110.
- the first opening 1311 accommodates an upper probe supporter 1211 (see FIG. 4), which protrudes from one side of the socket block 120, therein.
- the second block supporter 132 includes a second opening 1321.
- the second opening 1321 accommodates a lower probe supporter 1221 (see FIG. 5), which protrudes from an opposite side to the one side of the socket block 120, therein.
- FIG. 4 is a perspective view of the socket block 120 in FIG. 2 viewed from above
- FIG. 5 is a perspective view of the socket block 120 of FIG. 2 vied from below.
- the socket block 120 includes the upper and lower probe supporters 1211 and 1221 to support a plurality of probes, i.e., a signal probe 140, a ground probe 150, and a power probe 160.
- the socket block 120 includes a waveguide 124 corresponding to the antenna 11 of the subject-to-be-tested 1 and penetrating therethrough in the lengthwise direction of the signal probe 140 to measure the wireless signal in a different area from the upper and lower probe supporters 1211 and 1221.
- the socket block 120 may be made of a conductive material, for example, brass.
- the socket block 120 includes an upper block 121 and a lower block 122.
- the upper block 121 includes an upper probe supporter 1211 and an upper skirt portion 1212.
- the upper probe supporter 1211 supports each upper portion of the signal probe 140, the ground probe 150 and the power probe 160 respectively corresponding to the signal terminal, the ground terminal and the power terminal of the subject-to-be-tested 1.
- the upper skirt portion 1212 is coupled to a lower skirt portion 1222.
- the lower block 122 includes a lower probe supporter 1221 and the lower skirt portion 1222.
- the lower probe supporter 1221 supports each lower portion of the signal probe 140, the ground probe 150 and the power probe 160.
- the lower skirt portion 1222 is coupled to the upper skirt portion 1212.
- FIG. 6 is a cross-sectional view taken along line A-A in FIG. 4,
- FIG. 7 is an enlarged view of B in FIG. 6,
- FIG. 8 is an enlarged perspective view of C in FIG. 4, and
- FIG. 9 shows the loss characteristics of a wireless signal according to gaps between the bottom of the subject-to-be-tested 1 and the top of a shielding wall 1241.
- the socket block 120 has a signal probe hole 1231, a power probe hole 1232 and a ground probe hole 1233 to respectively support the signal probe 140, the power probe 150 and the ground probe 160.
- the signal probe 140 and the power probe 150 are supported in the signal probe hole 1231 and the power probe hole 1232 by insulation supporting members 1251 and 1252 so as not to be electrically connected to the socket block, and the ground probe 160 is supported in the ground probe hole 1233 so as to be electrically connected to the socket block.
- the socket block 120 includes a first insulation cover member 1253 surrounding first end portions of the signal probe 140 and the power probe150 on one side thereof, and a second insulation cover member 1254 surrounding second end portions of the signal probe 140 and the power probe 150 on an opposite side to the one side.
- the first and second insulation cover members 1253 and 1254 can prevent the terminals 12 of the subject-to-be-tested 1 and the terminal 22 of a test circuit board 2 from a short-circuit as being in contact with the adjacent conductive probe supporters 1211 and 1221 during the test.
- the waveguide 124 is formed to have a cross-sectional area corresponding to the size of the patch antenna 11 of the subject-to-be-tested 1 and penetrate the upper and lower probe supporters 1211 and 1221.
- the waveguide 124 refers to a passage through which a wireless signal emitted from the patch antenna 11 of the subject-to-be-tested 1 is guided to the antenna 21 of the test circuit board 2.
- the patch antenna 11 of the subject-to-be-tested 1 is a transmission antenna
- the antenna 21 of the test circuit board 2 is a reception antenna.
- the waveguide 124 includes the shielding wall 1241 protruding from one side of the socket block 120 facing the subject-to-be-tested 1 toward the patch antenna 11 of the subject-to-be-tested 1.
- the subject-to-be-tested 1 includes the terminal 12 protruding from the bottom thereof. Therefore, the wireless signal emitted from the antenna 11 during the test may be leak to the outside through a gap corresponding to a protrusion height. The wireless signal may be interfere with noise from the noise through a gap corresponding to a protrusion height.
- the shielding wall 1241 serves to block the gap, thereby preventing the wireless signal from leaking to the outside or interfering with noise.
- the height of the shielding wall 1241 may be set to satisfy the loss characteristics for the wireless signal when the terminal 12 of the subject-to-be-tested 1 is in contact with the signal probe 140, the power probe 150 and the ground probe 160.
- the loss characteristics for the wireless signal an insertion loss of -1 to 0 dB, and a return loss of -10 dB or less are required to be satisfied.
- the height of the shielding wall 1241 is required to be smaller than the height of the terminal 12 of the subject-to-be-tested 1.
- the shielding wall 1241 includes terminal guide grooves 128 recessed along a test direction so that the terminals 12 adjacent to the antenna 11 can be guided to move down upon the test.
- the subject-to-be-tested 1 may be damaged by the shielding wall 1241 when the bottom thereof is in direct contact with the top of the shielding wall 1241.
- the subject-to-be-tested 1 is required to space the bottom thereof apart by a predetermined gap H from the top of the shielding wall 1241 without contact during the test as shown in FIG. 9. The larger the gap H, the worse the loss characteristics of the wireless signal.
- FIG. 9 shows the insertion losses and the return losses when the gaps H are 0 mm, 0.1 mm, 0.2 mm, and 0.285 mm.
- the insertion loss of -1 to 0 dB and the return loss of -10 dB or less are satisfied when the gap H is 0.285 mm or less, but such loss characteristics are not satisfied when the gap H is larger than 0.285 mm.
- FIG. 10 is a cross-sectional view of a socket block 220 according to another embodiment of the disclosure.
- the socket block 220 includes an upper block 221 made of an insulating material, a lower block 222 made of an insulating material, and a middle block 223 made of a conductive material.
- the socket block 220 supports the signal probe 140, the power probe 150, the ground probe 160, and a conductive waveguide 224.
- the upper and lower blocks 221 and 222 support the signal probe 140, the power probe 150, and the ground probe 160 while being in contact therewith.
- the middle block 223 is not in contact with the signal probe 140 and the power probe 150, and is in contact with the ground probe 160 and the waveguide 224. Therefore, the middle block 223 serves as a conductive connector that connects the ground probe 160 and the waveguide 240 electrically.
- the waveguide 224 is shaped to have a cross-section corresponding to the surface shapes that the antenna 11 of the subject-to-be-tested 1 and the antenna 24 of the test circuit board 2 have.
- the waveguide 224 may be implemented as a conductive tube or a conductive coating layer.
- the test device tests not only the electrical characteristics of the subject-to-be-tested but also the characteristics of the built-in patch antenna at a time, thereby reducing test time and test costs.
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
Claims (6)
- A test device for testing characteristics of a subject-to-be-tested with a built-in antenna that emits a wireless signal, the test device comprising:a signal probe comprising one end portion to be in contact with a first terminal of the subject-to-be-tested to transmit a test signal;a ground probe to be in contact with a second terminal of the subject-to-be-tested; anda socket block comprising a probe supporter to support the signal probe and the ground probe, and a waveguide corresponding to the antenna of the subject-to-be-tested and penetrating therethrough in a lengthwise direction of the signal probe to measure the wireless signal in a different area from the probe supporter.
- The test device of claim 1, wherein the waveguide comprises a shielding wall protruding from one side of the socket block facing the subject-to-be-tested toward the antenna.
- The test device of claim 2, wherein the shielding wall has a height set to satisfy loss characteristics of the wireless signal when the first terminal and the second terminal of the subject-to-be-tested are in contact with the signal probe and the ground probe, respectively.
- The test device of claim 2, wherein the shielding wall comprises terminal guide grooves recessed along a test direction to guide the second terminal to move down upon a test.
- The test device of claim 1, wherein the probe supporter and the waveguide comprise a conductive material.
- The test device of claim 1, whereinthe probe supporter comprises an insulating material,the waveguide comprises a conductive material, andthe socket block comprises a conductive connector that connects the ground probe and the waveguide.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202480019510.5A CN121002383A (en) | 2023-04-25 | 2024-04-01 | Test device |
| EP24797294.6A EP4705779A4 (en) | 2023-04-25 | 2024-04-01 | TEST DEVICE |
| JP2025560004A JP2026512365A (en) | 2023-04-25 | 2024-04-01 | Inspection equipment |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2023-0054194 | 2023-04-25 | ||
| KR1020230054194A KR102933152B1 (en) | 2023-04-25 | 2023-04-25 | Test device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2024225632A1 true WO2024225632A1 (en) | 2024-10-31 |
Family
ID=93256710
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/KR2024/004150 Ceased WO2024225632A1 (en) | 2023-04-25 | 2024-04-01 | Test device |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP4705779A4 (en) |
| JP (1) | JP2026512365A (en) |
| KR (1) | KR102933152B1 (en) |
| CN (1) | CN121002383A (en) |
| TW (1) | TWI906806B (en) |
| WO (1) | WO2024225632A1 (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170227598A1 (en) * | 2016-02-04 | 2017-08-10 | Advantest Corporation | Integrated waveguide structure and socket structure for millimeter waveband testing |
| US20190113556A1 (en) * | 2017-10-13 | 2019-04-18 | Universal Scientific Industrial ( Shanghai ) Co., Ltd. | Test device with a built-in test antenna |
| US20200141980A1 (en) * | 2017-08-11 | 2020-05-07 | Leeno Industrial Inc. | Test device |
| US20220182155A1 (en) * | 2019-08-28 | 2022-06-09 | Advantest Corporation | Test equipment for testing a device under test having a circuit coupled to an antenna |
| US20220357361A1 (en) * | 2020-06-30 | 2022-11-10 | Leeno Industrial Inc. | Test socket and method of fabricating the same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9588173B2 (en) * | 2013-12-17 | 2017-03-07 | Keyssa, Inc. | Waveguides for capturing close-proximity electromagnetic radiation transmitted by wireless chips during testing on automated test equipment (ATE) |
| KR101762836B1 (en) * | 2015-09-10 | 2017-07-28 | 리노공업주식회사 | A probe socket |
| DE102016111884B4 (en) * | 2016-06-29 | 2024-08-22 | Infineon Technologies Ag | Apparatus, system and method for automatically testing integrated antennas |
| US10680727B2 (en) * | 2017-08-29 | 2020-06-09 | Mediatek Inc. | Over the air wireless test system for testing microelectronic devices integrated with antenna |
| CN113075429A (en) * | 2020-01-03 | 2021-07-06 | 迪科特测试科技(苏州)有限公司 | Detection card, detection system and detection method |
-
2023
- 2023-04-25 KR KR1020230054194A patent/KR102933152B1/en active Active
-
2024
- 2024-03-22 TW TW113110884A patent/TWI906806B/en active
- 2024-04-01 JP JP2025560004A patent/JP2026512365A/en active Pending
- 2024-04-01 EP EP24797294.6A patent/EP4705779A4/en active Pending
- 2024-04-01 CN CN202480019510.5A patent/CN121002383A/en active Pending
- 2024-04-01 WO PCT/KR2024/004150 patent/WO2024225632A1/en not_active Ceased
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170227598A1 (en) * | 2016-02-04 | 2017-08-10 | Advantest Corporation | Integrated waveguide structure and socket structure for millimeter waveband testing |
| US20200141980A1 (en) * | 2017-08-11 | 2020-05-07 | Leeno Industrial Inc. | Test device |
| US20190113556A1 (en) * | 2017-10-13 | 2019-04-18 | Universal Scientific Industrial ( Shanghai ) Co., Ltd. | Test device with a built-in test antenna |
| US20220182155A1 (en) * | 2019-08-28 | 2022-06-09 | Advantest Corporation | Test equipment for testing a device under test having a circuit coupled to an antenna |
| US20220357361A1 (en) * | 2020-06-30 | 2022-11-10 | Leeno Industrial Inc. | Test socket and method of fabricating the same |
Non-Patent Citations (1)
| Title |
|---|
| See also references of EP4705779A4 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2026512365A (en) | 2026-04-15 |
| KR102933152B1 (en) | 2026-03-03 |
| EP4705779A4 (en) | 2026-04-08 |
| TWI906806B (en) | 2025-12-01 |
| KR20240157409A (en) | 2024-11-01 |
| EP4705779A1 (en) | 2026-03-11 |
| CN121002383A (en) | 2025-11-21 |
| TW202445156A (en) | 2024-11-16 |
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