WO2024253038A1 - Dispositif de broyage de grains - Google Patents

Dispositif de broyage de grains Download PDF

Info

Publication number
WO2024253038A1
WO2024253038A1 PCT/JP2024/020044 JP2024020044W WO2024253038A1 WO 2024253038 A1 WO2024253038 A1 WO 2024253038A1 JP 2024020044 W JP2024020044 W JP 2024020044W WO 2024253038 A1 WO2024253038 A1 WO 2024253038A1
Authority
WO
WIPO (PCT)
Prior art keywords
grinding
cylindrical casing
grain
grain polishing
section
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2024/020044
Other languages
English (en)
Japanese (ja)
Inventor
博幸 川野
健太 古谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Satake Engineering Co Ltd
Satake Corp
Original Assignee
Satake Engineering Co Ltd
Satake Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Satake Engineering Co Ltd, Satake Corp filed Critical Satake Engineering Co Ltd
Priority to CN202480036915.XA priority Critical patent/CN121219077A/zh
Publication of WO2024253038A1 publication Critical patent/WO2024253038A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
    • B02B—PREPARING GRAIN FOR MILLING; REFINING GRANULAR FRUIT TO COMMERCIAL PRODUCTS BY WORKING THE SURFACE
    • B02B3/00—Hulling; Husking; Decorticating; Polishing; Removing the awns; Degerming

Definitions

  • the present invention relates to a grain polishing device capable of removing the germ and pericarp of grains.
  • Patent Document 1 discloses an apparatus in which a rotor is disposed inside a polishing drum having a porous wall portion (sieve portion) and a filing surface (projections), and the gap between the polishing drum and the rotor is formed in a germ removal chamber (working chamber).
  • the inner surface of the grinding drum is configured such that perforated wall sections that form the sieve section and file surfaces that form the file section are alternately arranged in the direction of rotation of the rotor. This configuration makes it possible to remove corn wear debris formed in the file section from the germ removal chamber in the sieve section immediately after its formation.
  • the present invention aims to provide a grain polishing device that can reduce the effort and cost required for replacing replacement parts in the grain polishing device.
  • One aspect of the present invention is a grain polishing device that includes a cylindrical casing formed by connecting multiple divided porous wall sections and a grain polishing roll rotatably arranged inside the cylindrical casing, and a grain polishing chamber is formed between the inner surface of the cylindrical casing and the outer surface of the grain polishing roll.
  • the inner surface of the cylindrical casing is provided with a grinding section with which the grain comes into contact, and the grinding section has a grinding surface on the inner surface side of the grinding section, and the grinding surface has multiple protrusions that protrude inward beyond the grinding surface in the circumferential direction and in the direction of the rotation axis of the cylindrical casing, and the protrusions are configured so that protruding members can be detached from fitting holes formed in the grinding surface.
  • the grinding portion may be disposed between the two porous wall portions and may be disposed in multiple portions within the cylindrical casing.
  • the cylindrical casing may include a plurality of pillars supporting the upper and lower ends of the cylindrical casing, and the grinding portion may be disposed on the pillars.
  • the grinding section may be divided into an upper grinding section and a lower grinding section, and the upper grinding section and the lower grinding section may have different grinding surfaces.
  • the protrusion may be fitted with a spring pin.
  • a grinding section is provided on the inner peripheral surface of the cylindrical casing of the grain polishing device, and the grinding section is provided with multiple detachable protrusions. This makes it possible to replace only the worn protrusions without replacing the entire grinding section, and thus significantly reduces the maintenance costs of the grain polishing device compared to conventional methods.
  • FIG. 1 is a schematic cross-sectional view of a grain polishing device in one embodiment of the present invention.
  • FIG. 2 is an exploded oblique view of the grain polishing section in one embodiment of the present invention.
  • FIG. 2 is a cross-sectional view of the grain polishing section in one embodiment of the present invention.
  • FIG. 2 is an oblique view of a cylindrical casing of the grain polishing section in one embodiment of the present invention.
  • FIG. 2 is a perspective view of a cylindrical casing showing an arrangement of a grinding portion in one embodiment of the present invention.
  • 3A and 3B are a plan view and a side view of a grinding unit in one embodiment of the present invention.
  • 4 is a perspective view of the grinding portion, illustrating a manner in which a spring pin is installed in the grinding portion in one embodiment of the present invention.
  • 4A to 4C are side views of a spring pin and diagrams illustrating dimensions of the spring pin in one embodiment of the present invention.
  • Fig. 1 shows a schematic cross-sectional view of a grain polishing apparatus 100 according to one embodiment of the present invention.
  • the grain polishing apparatus 100 is capable of removing germs and pericarp from grains such as corn. That is, the grain polishing apparatus 100 includes at least a drive motor 40 for rotating the grain polishing roll 30 of the grain polishing section 1 shown in Fig. 2, a blower 50 for blowing air to the grain polishing section 1, a supply section 60 for supplying grains to the grain polishing section 1, and a discharge section 20 for discharging the germs of the grains.
  • the grain polishing device 100 is also capable of polishing rice, wheat, etc.
  • Figure 3 shows a cross-sectional view of the grain polishing section 1 from above
  • Figure 4 shows an oblique view of the cylindrical casing 10.
  • a grain polishing chamber 15 is formed between the inner surface of the cylindrical casing 10 and the outer surface of the grain polishing roll 30, and the grain is polished while flowing as shown by the arrows.
  • an abrasive plate 13 which serves as a grinding section that applies a grinding action to the grain, is provided on the inner peripheral surface of the cylindrical casing 10. As shown in Figures 3 and 4, the abrasive plate 13 is disposed between the two screens 11 and multiple abrasive plates 13 are disposed inside the cylindrical casing 10.
  • the cylindrical casing 10 is provided with four pillars 14 that support the upper and lower ends thereof, and the abrasive plate 13 is disposed on the pillars 14.
  • FIG. 5 shows an embodiment in which the abrasive plate 13 is attached to the four pillars 14 of the cylindrical casing 10.
  • the cylindrical casing 10 is divided into upper and lower portions, and is composed of an upper abrasive plate 131 (upper grinding portion) and a lower abrasive plate 132 (lower grinding portion).
  • the abrasive plate 13 has multiple protrusions 1311 formed on it that protrude from the inner circumferential surface of the cylindrical casing 10.
  • multiple fitting holes 1312 are formed in the grinding surface of the abrasive plate 13, and spring pins 1313, which are protruding members, are inserted into the fitting holes 1312 so that they protrude 0.5 to 3 mm from the plate surface.
  • the abrasive plate 13 of this embodiment is a flat plate having a fitting hole 1312 of a predetermined size drilled therein, and a spring pin 1313 as shown in FIG. 8 is inserted into the fitting hole 1312 to form a protrusion 1311.
  • the spring pin 1313 is hammered into the fitting hole 1312 to reduce its outer diameter, and the spring pin 1313 is fixed in place by the repulsive force.
  • the spring pin 1313 is hammered into the fitting hole 1312 and fixed in place. Therefore, when all or part of the spring pin 1313 reaches the end of its wear life, it is possible to replace only the spring pin 1313 to be replaced, without replacing the abrasive plate 13. This configuration makes it possible to significantly reduce maintenance costs compared to conventional methods.
  • the size of the spring pin 1313 is not particularly limited, and it is possible to use a spring pin 1313 with an outer diameter of 2 to 5 mm, as shown in FIG. 8, for example.
  • the spring pin 1313 forms a protrusion 1311 on the abrasive plate 13, and the grinding action of the abrasive plate 13 makes it possible to effectively separate, for example, the endosperm portion of corn from the germ and pericarp.
  • the protruding portion of the spring pin 1313 has more opportunities to collide with the germ portion of the corn kernel in the polishing chamber 15, making it possible to efficiently separate the germ from the endosperm portion while keeping the internal pressure of the polishing chamber 15 low.
  • the frictional force between the kernels is reduced, reducing the crushing of the endosperm portion and making it possible to suppress the generation of powdery matter.
  • the amount of powder discharged outside the polishing chamber 15 can be reduced, improving product yield.
  • the protruding portion of the spring pin 1313 exerts a grinding action on the endosperm surface, and the pericarp is separated from the endosperm portion, making it possible to prevent deterioration of polished grain quality.
  • the number of spring pins 1313 installed on the abrasive plate 13 is not particularly limited.
  • the illustrated upper abrasive plate 131 and lower abrasive plate 132 each have a grinding surface of 250 cm2 , and it is preferable to install 100 to 300 spring pins 1313 on each plate to form the protrusions 1311.
  • the number of spring pins 1313 installed per unit area on the grinding surface is 0.4 to 1.2 pins/ cm2 .
  • the abrasive plates 13 are arranged on the pillar portions 14 at four locations, but this is not necessarily limited to this, and it is also possible to arrange the abrasive plates 13 at three or five locations within the cylindrical casing 10.
  • the abrasive plate 13 is divided into an upper and lower abrasive plate 131 and a lower abrasive plate 132, but this is not essential and the abrasive plate 13 can be a single abrasive plate. Furthermore, the division of the abrasive plate 13 described above is not limited to two divisions as described above, but it is also possible to divide it into three or more divisions. In addition, the division of the abrasive plate 13 is not necessarily limited to the vertical division as described above, but it may be divided in the direction of rotation of the grain polishing roll 30.
  • the embodiment in which the spring pin 1313 is inserted as the protrusion 1311 is shown as the most preferred example.

Landscapes

  • Adjustment And Processing Of Grains (AREA)

Abstract

La présente invention concerne un dispositif de broyage de grains (100) comprenant : un carter cylindrique (10) obtenu en fournissant en continu une pluralité de parties parois poreuses divisées (11) de façon à former une forme cylindrique ; et un rouleau de broyage de grains (30) disposé de manière rotative à l'intérieur du carter cylindrique (10), une chambre de broyage de grains (15) étant formée entre la surface périphérique interne du carter cylindrique (10) et la surface périphérique externe du rouleau de broyage de grains (30). La surface périphérique interne du carter cylindrique (10) est pourvue d'une partie de broyage (13) qui est mise en contact par des grains, et la partie de broyage (13) comprend une pluralité de saillies (1311) faisant saillie vers la surface périphérique interne du carter cylindrique (10). Les saillies (1311) sont chacune conçues de telle sorte qu'un élément en saillie (1313) peut être fixé à un trou d'ajustement (1312) formé dans la partie de broyage (13)/détaché de celui-ci.
PCT/JP2024/020044 2023-06-07 2024-05-31 Dispositif de broyage de grains Pending WO2024253038A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202480036915.XA CN121219077A (zh) 2023-06-07 2024-05-31 碾谷装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023-094253 2023-06-07
JP2023094253A JP7494988B1 (ja) 2023-06-07 2023-06-07 精穀装置

Publications (1)

Publication Number Publication Date
WO2024253038A1 true WO2024253038A1 (fr) 2024-12-12

Family

ID=91321926

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2024/020044 Pending WO2024253038A1 (fr) 2023-06-07 2024-05-31 Dispositif de broyage de grains

Country Status (3)

Country Link
JP (1) JP7494988B1 (fr)
CN (1) CN121219077A (fr)
WO (1) WO2024253038A1 (fr)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244342A (ja) * 1984-05-14 1985-12-04 フエリ−ペ　サレ−テ−ガルセス 粒体のもみすり、皮むき、みがき及び漂白機用スクリ−ン・ロ−タ組立体
JPS61163047U (fr) * 1985-03-28 1986-10-09
US5036757A (en) * 1987-07-22 1991-08-06 Buehler Ag Apparatus for shelling and de-germinating corn
JPH11138024A (ja) * 1997-11-13 1999-05-25 Shizuoka Seiki Co Ltd 精穀機
JP2001219081A (ja) * 2000-02-10 2001-08-14 Seirei Ind Co Ltd 横形研削式精米機の精穀装置
JP2006068628A (ja) * 2004-09-01 2006-03-16 Kubota Corp 精穀用ブラシの製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60244342A (ja) * 1984-05-14 1985-12-04 フエリ−ペ　サレ−テ−ガルセス 粒体のもみすり、皮むき、みがき及び漂白機用スクリ−ン・ロ−タ組立体
JPS61163047U (fr) * 1985-03-28 1986-10-09
US5036757A (en) * 1987-07-22 1991-08-06 Buehler Ag Apparatus for shelling and de-germinating corn
JPH11138024A (ja) * 1997-11-13 1999-05-25 Shizuoka Seiki Co Ltd 精穀機
JP2001219081A (ja) * 2000-02-10 2001-08-14 Seirei Ind Co Ltd 横形研削式精米機の精穀装置
JP2006068628A (ja) * 2004-09-01 2006-03-16 Kubota Corp 精穀用ブラシの製造方法

Also Published As

Publication number Publication date
JP7494988B1 (ja) 2024-06-04
CN121219077A (zh) 2025-12-26
JP2024176048A (ja) 2024-12-19

Similar Documents

Publication Publication Date Title
CN211865348U (zh) 一种间歇式谷朊粉生产用磨粉装置
CN201287055Y (zh) 谷物剥皮机
WO2014183465A1 (fr) Unité d'usinage et système de polissage du riz
CN106861845B (zh) 干粉物料粉碎装置
JP7494988B1 (ja) 精穀装置
US1374207A (en) Grinding-mill
CN101396671A (zh) 谷物剥皮机
JP4823081B2 (ja) 摩擦精穀ロール及び摩擦精穀機
CN102240580A (zh) 锤片粉碎机
JP7166673B1 (ja) 穀類選別スクリーンドラム装置
KR20220000450A (ko) 탁주 제성기용 회전익
US655805A (en) Grinding-mill.
JP3946076B2 (ja) 精米機の精白装置
CN107855153A (zh) 一种高效稻谷脱壳装置
JP5091222B2 (ja) 精米装置
JP3764947B2 (ja) 旋動式破砕機用原料供給装置
CN221518431U (zh) 一种色母生产用的研磨装置
CN207614967U (zh) 造粒装置
CN222499834U (zh) 一种双盘磨设备
CN108421580A (zh) 一种低损薏苡脱壳仓
RU2845274C1 (ru) Молотковая дробилка
CN212758753U (zh) 适用于组合式碾米机的进料过滤装置
CN224009953U (zh) 一种面粉研磨装置
RU2434680C2 (ru) Устройство для шлифования мелкого зерна и/или продуктов его дробления
US652919A (en) Peanut-huller.

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24819268

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202517113913

Country of ref document: IN

WWE Wipo information: entry into national phase

Ref document number: 2501008262

Country of ref document: TH

REG Reference to national code

Ref country code: BR

Ref legal event code: B01A

Ref document number: 112025026718

Country of ref document: BR

WWP Wipo information: published in national office

Ref document number: 202517113913

Country of ref document: IN

NENP Non-entry into the national phase

Ref country code: DE