WO2024253359A1 - Dispositif électronique comprenant une antenne - Google Patents

Dispositif électronique comprenant une antenne Download PDF

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Publication number
WO2024253359A1
WO2024253359A1 PCT/KR2024/006795 KR2024006795W WO2024253359A1 WO 2024253359 A1 WO2024253359 A1 WO 2024253359A1 KR 2024006795 W KR2024006795 W KR 2024006795W WO 2024253359 A1 WO2024253359 A1 WO 2024253359A1
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WIPO (PCT)
Prior art keywords
electronic device
metal
metal region
support
exemplary electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2024/006795
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English (en)
Korean (ko)
Inventor
김종인
박우진
백무현
김선오
목진아
이한엽
임군
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020230105681A external-priority patent/KR20240174021A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2024253359A1 publication Critical patent/WO2024253359A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24—Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets

Definitions

  • the present disclosure relates to an electronic device including an antenna.
  • Electronic devices are being used widely in our daily lives, and the use of content is increasing.
  • Electronic devices contain multiple antennas to support various communication technologies.
  • Embodiments of the present disclosure provide an electronic device including an antenna for securing or improving coverage and/or antenna radiation performance.
  • Various embodiments of the present disclosure are provided to solve or at least alleviate the problems mentioned above.
  • an electronic device including a front cover, a case, a support, a wireless communication circuit, and a sealing member.
  • the front cover forms at least a portion of a front of the electronic device.
  • the case includes a rear portion forming at least a portion of a rear portion of the electronic device and a side portion forming at least a portion of a side portion of the electronic device.
  • the support is positioned between the front cover and the case.
  • the support includes a first portion and a second portion.
  • the first portion is positioned between the first portion and the side portion and is connected to the side portion.
  • the electronic device includes a metal including a first metal region disposed in the first portion and a second metal region disposed in the second portion. The metal is formed through press working.
  • the wireless communication circuit is configured to transmit a signal of a specified frequency band through the first metal region.
  • the sealing member is positioned between the first portion and the rear portion to prevent fluid flow through the first portion and the rear portion.
  • An electronic device including an antenna according to an exemplary embodiment of the present disclosure may secure or improve coverage and/or antenna radiation performance by implementing an antenna radiator on a part of an extended support for waterproofing and/or dustproofing.
  • FIG. 1 is a block diagram of a first exemplary electronic device within a network environment, according to one embodiment of the present disclosure.
  • FIG. 2 is a diagram illustrating a second exemplary electronic device according to one embodiment of the present disclosure.
  • FIG. 3 is an exploded perspective view of a second exemplary electronic device according to one embodiment of the present disclosure.
  • FIG. 4 is a perspective view of a combination of a support and a second adhesive member according to one embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view of a portion of a second exemplary electronic device taken along line A-A' of FIG. 2, according to one embodiment of the present disclosure.
  • FIG. 6 is a drawing showing a support and a metal included in the support according to one embodiment of the present disclosure.
  • FIG. 7 is a perspective view of a portion of a third exemplary electronic device according to one embodiment of the present disclosure.
  • FIG. 8 is a drawing showing a metal according to one embodiment of the present disclosure.
  • FIG. 9 is a perspective view of a portion of a fourth exemplary electronic device according to one embodiment of the present disclosure.
  • FIG. 10 illustrates a radiation pattern of the fourth exemplary electronic device of FIG. 9, according to one embodiment of the present disclosure.
  • FIG. 11 is a cross-sectional view of a portion of a second exemplary electronic device taken along line A-A' of FIG. 2, according to one embodiment of the present disclosure.
  • FIG. 12 is a perspective view of a portion of a fifth exemplary electronic device according to one embodiment of the present disclosure.
  • FIG. 13 is a graph showing resonance characteristics of the fifth exemplary electronic device of FIG. 12 according to one embodiment of the present disclosure.
  • FIG. 14 illustrates a radiation pattern of the fifth exemplary electronic device of FIG. 12 according to one embodiment of the present disclosure.
  • FIG. 15 is a perspective view of a portion of a sixth exemplary electronic device according to one embodiment of the present disclosure.
  • FIG. 16 is a graph showing resonance characteristics of the sixth exemplary electronic device of FIG. 15 according to one embodiment of the present disclosure.
  • FIG. 17 illustrates a radiation pattern of the sixth exemplary electronic device of FIG. 15, according to one embodiment of the present disclosure.
  • FIG. 18 is a perspective view of a metal according to one embodiment of the present disclosure.
  • FIG. 19 is a cross-sectional view of a portion of a seventh exemplary electronic device taken along line B-B' of FIG. 18, according to one embodiment of the present disclosure.
  • FIG. 20 is a cross-sectional view of a portion of a seventh exemplary electronic device taken along line C-C' of FIG. 18, according to one embodiment of the present disclosure.
  • FIG. 21 is a perspective view of a portion of an eighth exemplary electronic device according to one embodiment of the present disclosure.
  • FIG. 22 is a graph showing resonance characteristics of the eighth exemplary electronic device of FIG. 21 according to one embodiment of the present disclosure.
  • FIG. 23 illustrates a radiation pattern of the eighth exemplary electronic device of FIG. 21, according to one embodiment of the present disclosure.
  • FIG. 24 is a cross-sectional view of a portion of a ninth exemplary electronic device according to various embodiments of the present disclosure.
  • FIG. 25 is a cross-sectional view of a portion of a tenth exemplary electronic device according to various embodiments of the present disclosure.
  • FIG. 26 is a cross-sectional view of a portion of an eleventh exemplary electronic device according to various embodiments of the present disclosure.
  • FIG. 1 is a block diagram of a first exemplary electronic device (101) within a network environment (100) according to one embodiment of the present disclosure.
  • a first exemplary electronic device (101) may communicate with an external electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an external electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network).
  • the first exemplary electronic device (101) may communicate with the external electronic device (104) via the server (108).
  • a first exemplary electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), and/or an antenna module (197).
  • the first exemplary electronic device (101) may include at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added.
  • a sensor module (176), a camera module (180), or an antenna module (197) may be implemented embedded in one component (e.g., a display module (160)).
  • the processor (120) may control at least one other component (e.g., a hardware or software component) of the first exemplary electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations. As at least part of the data processing or calculations, the processor (120) may load a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) into the volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in the nonvolatile memory (134).
  • a command or data received from another component e.g., a sensor module (176) or a communication module (190)
  • the processor (120) may include a main processor (121) (e.g., a central processing unit (CPU) or an application processor (AP)) or an auxiliary processor (123) (e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that may operate independently or together with the main processor (121).
  • a main processor (121) e.g., a central processing unit (CPU) or an application processor (AP)
  • auxiliary processor (123) e.g., a graphics processing unit (GPU)), a neural processing unit (NPU)), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)
  • the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function.
  • the auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
  • the auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the first exemplary electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state.
  • the auxiliary processor (123) e.g., an image signal processor (ISP) or a communication processor (CP)
  • the auxiliary processor (123) may include a hardware structure specialized for processing an artificial intelligence model.
  • the artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, in the first exemplary electronic device (101) itself on which the artificial intelligence model is executed, or may be performed via a separate server (e.g., server (108)).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • the artificial neural network may be any one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent DNN (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above.
  • the artificial intelligence model may additionally or alternatively include a software structure.
  • the memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the first exemplary electronic device (101).
  • the various data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto.
  • the memory (130) can include volatile memory (132) and/or nonvolatile memory (134).
  • the program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), and/or an application (146).
  • the input module (150) can receive commands or data to be used by other components of the first exemplary electronic device (101) (e.g., the processor (120)) from an external source (e.g., a user) of the first exemplary electronic device (101).
  • the input module (150) can include, for example, a microphone, a mouse, a keyboard, keys (e.g., buttons), or a digital pen (e.g., a stylus pen).
  • the audio output module (155) can output an audio signal to the outside of the first exemplary electronic device (101).
  • the audio output module (155) can include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback, and the receiver can be used for incoming calls.
  • the receiver can be implemented separately from the speaker, or as a part thereof.
  • the display module (160) can visually provide information to an external party (e.g., a user) of the first exemplary electronic device (101).
  • the display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device.
  • the display module (160) can include a touch circuit configured to detect a touch (e.g., a touch sensor), or a sensor circuit configured to measure a strength of a force generated by the touch (e.g., a pressure sensor).
  • the audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound.
  • the audio module (170) can obtain sound through the input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an external electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the first exemplary electronic device (101).
  • an external electronic device e.g., an external electronic device (102)
  • a speaker or a headphone directly or wirelessly connected to the first exemplary electronic device (101).
  • the sensor module (176) can detect an operating state (e.g., power or temperature) of the first exemplary electronic device (101) or an external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state.
  • the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the first exemplary electronic device (101) to an external electronic device (e.g., the external electronic device (102)).
  • the interface (177) may include, for example, a high-definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high-definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital
  • the connection terminal (178) may include a connector through which the first exemplary electronic device (101) may be physically connected to an external electronic device (e.g., the external electronic device (102)).
  • the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, and/or an audio connector (e.g., a headphone connector).
  • the haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense.
  • the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module (180) can capture still images and moving images.
  • the camera module (180) can include one or more lenses, image sensors, image signal processors (ISPs), or flashes.
  • ISPs image signal processors
  • the power management module (188) can manage power supplied to or consumed by the first exemplary electronic device (101).
  • the power management module (188) can be implemented, for example, as at least a portion of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • a battery (189) may power at least one component of the first exemplary electronic device (101).
  • the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, and/or a fuel cell.
  • the communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the first exemplary electronic device (101) and an external electronic device (e.g., the external electronic device (102), the external electronic device (104), or the server (108)), and performance of communication through the established communication channel.
  • the communication module (190) may operate independently from the processor (120) (e.g., an application processor (AP)) and may include one or more communication processors (CPs) that support direct (e.g., wired) communication or wireless communication.
  • AP application processor
  • CPs communication processors
  • the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module (192) e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module (194) e.g., a local area network (LAN) communication module, or a power line communication module.
  • any of these communication modules may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as BLUETOOTH, WiFi (wireless fidelity) direct, or IrDA (IR data association)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G ( 5th generation) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)).
  • a first network (198) e.g., a short-range communication network such as BLUETOOTH, WiFi (wireless fidelity) direct, or IrDA (IR data association)
  • a second network (199) e.g., a long-range communication network such as a legacy cellular network, a 5G ( 5th generation) network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)
  • a wireless communication module (192) may identify or authenticate a first exemplary electronic device (101) within a communication network, such as a first network (198) or a second network (199), using subscriber information (e.g., international mobile subscriber identity (IMSI)) stored in a subscriber identity module (SIM) (196).
  • subscriber information e.g., international mobile subscriber identity (IMSI)
  • SIM subscriber identity module
  • the wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G ( 4th generation) network, for example, NR access technology (new radio access technology).
  • the NR access technology can support high-speed transmission of high-capacity data (i.e., enhanced mobile broadband (eMBB)), terminal power minimization and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate.
  • a high-frequency band e.g., mmWave band
  • the wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna.
  • the wireless communication module (192) may support various requirements specified in the first exemplary electronic device (101), an external electronic device (e.g., the external electronic device (104)), or a network system (e.g., the second network (199)).
  • the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.
  • a peak data rate e.g., 20 Gbps or more
  • a loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip
  • the antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device).
  • the antenna module (197) can include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a printed circuit board (PCB)).
  • the antenna module (197) can include a plurality of antennas (e.g., an antenna array).
  • at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199) can be selected from the plurality of antennas by, for example, the communication module (190).
  • a signal or power can be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna.
  • other components e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module (197) can form a mmWave antenna module.
  • the mmWave antenna module can include a printed circuit board (PCB), an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high-frequency band.
  • PCB printed circuit board
  • an RFIC disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band)
  • a plurality of antennas e.g., an array antenna
  • peripheral devices e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • Commands or data may be transmitted or received between the first exemplary electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199).
  • Each of the external electronic devices (102, or 104) may be the same or a different type of device as the first exemplary electronic device (101). All or part of the operations performed on the first exemplary electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the first exemplary electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the first exemplary electronic device (101) may, instead of or in addition to, perform the function or service itself, request one or more external electronic devices to perform at least a portion of the function or service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the first exemplary electronic device (101).
  • the first exemplary electronic device (101) may provide the result, as is or additionally processed, as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the first exemplary electronic device (101) may provide an ultra-low delay service by using, for example, distributed computing or mobile edge computing (MEC).
  • the external electronic device (104) may include an IoT (internet of things) device.
  • the server (108) may be an intelligent server using machine learning and/or a neural network.
  • an external electronic device (104) or a server (108) may be included in the second network (199).
  • the first exemplary electronic device (101) may be applied to an intelligent service (e.g., a smart home, a smart city, a smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • An electronic device may be a device of various forms.
  • the electronic device may include a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device.
  • a portable communication device e.g
  • first,” “second,” or “first” or “second” may be used merely to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order).
  • a first component e.g., a first component
  • another element e.g., a second component
  • the element can be connected to the other element directly (e.g., wired), wirelessly, or through a third component.
  • module may include a unit implemented by hardware, software, or firmware, or any combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example.
  • a module may be an integrally configured component or a minimum unit of the component or a portion thereof that performs one or more functions.
  • a module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • Various embodiments of the present disclosure may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., the first exemplary electronic device (101)).
  • a processor e.g., the processor (120)
  • the machine e.g., the first exemplary electronic device (101)
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
  • 'non-transitory' simply means that the storage medium is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.
  • a method may be provided as included in a computer program product.
  • the computer program product may be traded between a seller and a buyer as a commodity.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g., a compact disc read only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) via an application store (e.g., PLAYSTORE TM ) or directly between two user devices (e.g., smart phones).
  • an application store e.g., PLAYSTORE TM
  • at least a part of the computer program product may be at least temporarily stored or temporarily generated in a machine-readable storage medium, such as a memory of a manufacturer's server, a server of an application store, or a relay server.
  • Each component (e.g., a module or a program) of the above-described components may include a single or multiple entities. One or more of the components or operations of the above-described components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (e.g., a module or a program) may be integrated into a single component. In such a case, the integrated component may perform one or more functions of each of the components of the plurality of components identically or similarly to those performed by the corresponding component of the plurality of components prior to the integration. The operations performed by the module, program or other component may be performed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations may be performed in a different order, omitted, or one or more other operations may be added.
  • FIG. 2 is a drawing showing a second exemplary electronic device (2) according to one embodiment of the present disclosure.
  • the direction in which the display area included in the second exemplary electronic device (2) is visually visible is defined as the front side (20A) of the second exemplary electronic device (2)
  • the opposite direction e.g., -z-axis direction
  • the back side (20B) of the second exemplary electronic device (2) is defined as the front side (20A) of the second exemplary electronic device (2)
  • the opposite direction e.g., -z-axis direction
  • the second exemplary electronic device (2) may include a housing (20) that provides (or forms) at least a portion of an exterior appearance of the second exemplary electronic device (2).
  • the housing (20) may provide, for example, a front surface (20A) of the second exemplary electronic device (2), a back surface (20B) of the second exemplary electronic device (2), and a side surface (20C) of the second exemplary electronic device (2).
  • the housing (20) may refer to a structure (or structure) that provides at least a portion of the front surface (20A), the back surface (20B), and the side surface (20C).
  • the housing (20) may include a front cover (or front plate, or front portion) (21) and a case (or shell) (22).
  • the front cover (21) can provide (or form) at least a portion of the front surface (20A) of the second exemplary electronic device (2).
  • the front cover (21) can be substantially transparent at least in part.
  • the front cover (21) can include, for example, a glass plate including various coating layers, or a polymer plate.
  • the case (22) can provide (or form) at least a portion of the back surface (20B) and the side surface (20C) of the second exemplary electronic device (2).
  • the case (22) can include a back surface (221) and/or a side surface (222).
  • the back surface (221) of the case (22) can provide (or form) at least a portion of the back surface (20B) of the second exemplary electronic device (2).
  • the side surface (222) of the case (22) can provide (or form) at least a portion of the side surface (20C) of the second exemplary electronic device (2).
  • the case (22) can be substantially opaque.
  • the case (22) may be provided (or formed) as an integrated or single structure (e.g., a single continuous structure or a complete structure) including a back portion (221) and a side portion (222).
  • the case (22) may include, for example, a non-metallic material.
  • the case (22) may include, for example, a metallic material.
  • the case (22) may include, for example, a combination of at least one non-conductive portion (not shown separately) including a non-metallic material and at least one conductive portion (not shown separately) including a metallic material.
  • a back plate (or back cover) (not shown separately) and a side member (or side bezel structure, side wall portion, or side) (not shown separately) may be provided.
  • the back plate may provide (or form) at least a portion of the back (20B) of the second exemplary electronic device (2).
  • the back plate may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel, or magnesium), or a combination of at least two of the above materials.
  • the side member may provide (or form) at least a portion of the side (20C) of the second exemplary electronic device (2).
  • the side member may include a metallic material and/or a non-metallic material.
  • the side portion (222) of the case (22) may include a first side portion (or, a first side wall, a first side wall portion, a first bezel, or a first bezel portion) (2221), a second side portion (or, a second side wall, a second side wall portion, a second bezel, or a second bezel portion) (2222), a third side portion (or, a third side wall, a third side wall portion, a third bezel, or a third bezel portion) (2223), and/or a fourth side portion (or, a fourth side wall, a fourth side wall portion, a fourth bezel, or a fourth bezel portion) (2224).
  • a first side portion or, a first side wall, a first side wall portion, a first bezel, or a first bezel portion
  • a second side portion or, a second side wall, a second side wall portion, a second bezel, or a second bezel portion
  • a third side portion or, a third side wall
  • the first side portion (2221) when viewed from above (e.g., when viewed in the -z-axis direction) of the front surface (20A) of the second exemplary electronic device (2), the first side portion (2221) can be positioned spaced apart from the second side portion (2222) in a first direction (e.g., in the +y-axis direction) and can be substantially parallel to the second side portion (2222).
  • the first side portion (2221) can provide a first side corresponding to a first direction among the side surfaces (20C) of the second exemplary electronic device (2).
  • the second side portion (2222) can provide a second side corresponding to a second direction (e.g., in the -y-axis direction) opposite to the first direction among the side surfaces (20C) of the second exemplary electronic device (2).
  • the third side portion (2223) can connect one end of the first side portion (2221) and one end of the second side portion (2222).
  • the fourth side portion (2224) can connect the other end of the first side portion (2221) and the other end of the second side portion (2222).
  • the third side portion (2223) can be positioned spaced apart from the fourth side portion (2224) in a third direction (e.g., in the +x axis direction) and can be substantially parallel to the fourth side portion (2224).
  • the third side portion (2223) can provide a third side corresponding to the third direction among the sides (20C) of the second exemplary electronic device (2).
  • the fourth side portion (2224) can provide a fourth side corresponding to a fourth direction (e.g., -x axis direction) opposite to the third direction among the sides (20C) of the second exemplary electronic device (2).
  • the first corner (2225) where the first side portion (2221) and the third side portion (2223) are connected, the second corner (2226) where the first side portion (2221) and the fourth side portion (2224) are connected, the third corner (2227) where the second side portion (2222) and the third side portion (2223) are connected, and/or the fourth corner (2228) where the second side portion (2222) and the fourth side portion (2224) are connected may be provided (or formed) in a smooth curved shape.
  • the second exemplary electronic device (2) may include a display module (230), a first camera module (241), a second camera module (242), a third camera module (243), a fourth camera module (244), a first light-emitting module (250), a second light-emitting module (not shown separately), a first sensor module (260), a second sensor module (not shown separately), an audio input module (not shown separately), a first audio output module (not shown separately), a second audio output module (not shown separately), a key input module, a first connection terminal (280), and/or a second connection terminal (not shown separately).
  • the second exemplary electronic device (2) may omit at least one of the above components or may additionally include other components.
  • the second exemplary electronic device (2) may include at least some of the plurality of components included in the first exemplary electronic device (101) of FIG. 1.
  • the display area (or active area or screen area) of the display module (230) is visually visible through the front cover (21) of the housing (20).
  • the second exemplary electronic device (2) may be implemented so that the display area of the display module (230) visible through the front cover (21) of the housing (20) is displayed as large as possible (e.g., a large screen or a full screen).
  • the display module (230) may be provided to have an outer shape that is substantially the same as the outer shape of the front cover (21) of the housing (20), for example.
  • the first camera module (241), the second camera module (242), the third camera module (243), and/or the fourth camera module (244) may include one or more lenses, image sensor(s), and/or image signal processor (ISP), although not shown separately.
  • ISP image signal processor
  • the first camera module (241), the second camera module (242), and the third camera module (243) may be positioned corresponding to the rear side (20B) of the second exemplary electronic device (2).
  • the first camera module (241), the second camera module (242), and the third camera module (243) may be defined or interpreted as 'rear camera modules'.
  • the first camera module (241) is positioned corresponding to the first camera hole provided (or formed) in the rear portion (221) of the case (22), or the first transparent portion (or, the first transparent member or the first transparent body) arranged in the first camera hole, and can be visually visible from the outside of the second exemplary electronic device (2).
  • the second camera module (242) is positioned corresponding to the second camera hole provided (or formed) in the rear portion (221) of the case (22), or the second transparent portion (or, the second transparent member or the second transparent body) arranged in the second camera hole, and can be visually visible from the outside of the second exemplary electronic device (2).
  • the third camera module (243) is positioned corresponding to a third camera hole provided (or formed) in the rear portion (221) of the case (22), or a third transparent portion (or a third transparent member or a third transparent body) arranged in the third camera hole, and can be visually seen from the outside of the second exemplary electronic device (2).
  • the first camera module (241), the second camera module (242), and the third camera module (243) may be arranged in a second direction (e.g., in the -y-axis direction) from the first side surface (2221) to the second side surface (2222).
  • the first camera module (241) When viewed from above (e.g., when viewed in the +z-axis direction) of the rear surface (20B) of the second exemplary electronic device (2), the first camera module (241) may be positioned corresponding to the first corner (2225) where the first side surface (2221) and the third side surface (2223) are connected, and the second camera module (242) may be positioned between the first camera module (241) and the third camera module (243).
  • the relative positions between the first camera module (241), the second camera module (242), and the third camera module (243) are not limited to the illustrated example and may vary.
  • the number of rear camera modules is not limited to the illustrated example and may vary.
  • the first camera module (241), the second camera module (242), and/or the third camera module (243) may include a wide-angle camera module, a telephoto camera module, a color camera module, a monochrome camera module, or an IR camera (e.g., a time of flight (TOF) camera, a structured light camera) module.
  • a wide-angle camera module e.g., a telephoto camera module, a color camera module, a monochrome camera module, or an IR camera (e.g., a time of flight (TOF) camera, a structured light camera) module.
  • TOF time of flight
  • the first camera module (241), the second camera module (242), and the third camera module (243) may have different properties (e.g., field of view) or functions.
  • the first camera module (241), the second camera module (242), and/or the third camera module (243) may provide different angles of view (or lenses with different angles of view).
  • the second exemplary electronic device (2) may selectively use the angles of view of the first camera module (241), the second camera module (242), and/or the third camera module (243) based on a user's selection regarding the angle of view.
  • the fourth camera module (244) may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20) corresponding to the front (20A) of the second exemplary electronic device (2). External light may pass through the front cover (21) of the housing (20) to reach the fourth camera module (244).
  • the fourth camera module (244) may be defined or interpreted as a 'front camera module'.
  • the fourth camera module (244) may be positioned closer to the first side portion (2221) than to the second side portion (2222) when viewed from above the front (20A) of the second exemplary electronic device (2).
  • the fourth camera module (244) may be positioned, for example, adjacent to the first side portion (2221).
  • the distance at which the fourth camera module (244) is spaced from the third side portion (2223) and the distance at which the fourth camera module (244) is spaced from the fourth side portion (2224) may be substantially the same.
  • the fourth camera module (244) may be positioned in alignment with or at least partially inserted into an opening provided in a display area of the display module (230). External light may pass through the opening of the front cover (21) of the housing (20) and the display area to reach the fourth camera module (244).
  • the opening of the display area aligned with or overlapping the fourth camera module (244) may be provided as a notch.
  • the opening of the display area aligned with or overlapping the fourth camera module (244) may be provided (or formed) in the form of a hole (not shown separately).
  • the fourth camera module (244) may overlap the display area of the display module (230) when viewed from above the front (20A) of the second exemplary electronic device (2).
  • the fourth camera module (244) may be positioned below or beneath the display area on the back of the display area.
  • the fourth camera module (244), or the position of the fourth camera module (244) may be substantially visually indistinguishable (or invisible).
  • the fourth camera module (244) may include, for example, a hidden display back camera (e.g., an under display camera (UDC)). External light may pass through the front cover (21) of the housing (20) and the display area of the display module (230) to reach the fourth camera module (244).
  • UDC under display camera
  • the fourth camera module (244) may be positioned aligned with, or at least partially inserted into, a recess provided on the back surface of the display area of the display module (230).
  • the fourth camera module (244), or the position of the fourth camera module (244) may be substantially visually invisible or indistinguishable.
  • a portion of the display area of the display module (230) that at least partially overlaps with the fourth camera module (244) may include a different pixel structure and/or wiring structure compared to other areas.
  • the pixel structure and/or wiring structure provided in the portion of the display area that at least partially overlaps with the fourth camera module (244) may be implemented to reduce light loss between the outside of the second exemplary electronic device (2) and the fourth camera module (244).
  • the portion of the display area that at least partially overlaps with the fourth camera module (244) may have, for example, a different pixel density (e.g., number of pixels per unit area) compared to other areas.
  • the portion of the display area that at least partially overlaps with the fourth camera module (244) may not substantially include a plurality of pixels.
  • the first light-emitting module (250) may be positioned corresponding to the rear side (20B) of the second exemplary electronic device (2).
  • the first light-emitting module (250) may include a light source for the first camera module (241), the second camera module (242), and/or the third camera module (243).
  • the first light-emitting module (250) may include, but is not limited to, an LED, an IR LED, or a xenon lamp.
  • the first light-emitting module (250) may be positioned corresponding to a flash hole provided (or formed) in the rear portion (221) of the case (22), or a fourth transparent portion (or fourth transparent member or fourth transparent body) arranged in the flash hole.
  • a second light-emitting module (e.g., an LED, an IR LED, or a xenon lamp) (not shown separately) may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20) corresponding to the front side (20A) of the second exemplary electronic device (2).
  • the second light-emitting module may provide status information of the second exemplary electronic device (2) in the form of light.
  • the second light-emitting module may provide a light source that is linked to the operation of the fourth camera module (244).
  • the first sensor module (260) may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20) corresponding to the front surface (20A) of the second exemplary electronic device (2).
  • the first sensor module (260) may include, for example, an optical sensor (e.g., a proximity sensor or a light sensor).
  • an optical sensor e.g., a proximity sensor or a light sensor.
  • the position of the first sensor module (260) is not limited to the illustrated example and may vary.
  • the first sensor module (260) may be positioned in alignment with or at least partially inserted into an opening provided in a display area of the display module (230). External light may pass through the front cover (21) of the housing (20) and the opening of the display area of the display module (230) to reach the first sensor module (260).
  • the opening of the display area aligned with or overlapping the first sensor module (260) may be provided in the form of a hole.
  • the opening of the display area aligned with or overlapping the first sensor module (260) may be provided as a notch (not shown separately).
  • the first sensor module (260) may overlap the display area of the display module (230) when viewed from above the front (20A) of the second exemplary electronic device (2).
  • the first sensor module (260) may be positioned below or beneath the display area.
  • the first sensor module (260), or the location of the first sensor module (260) may be substantially invisible or indistinguishable.
  • External light may pass through the front cover (21) of the housing (20) and the display area of the display module (230) to reach the first sensor module (260).
  • the first sensor module (260) may be positioned aligned with, or at least partially inserted into, a recess provided on the back surface of the display area of the display module (230).
  • the first sensor module (260), or the position of the first sensor module (260) may be substantially visually invisible or indistinguishable.
  • a portion of the display area of the display module (230) that at least partially overlaps with the first sensor module (260) may include a different pixel structure and/or wiring structure compared to other areas.
  • the pixel structure and/or wiring structure provided in the portion of the display area that at least partially overlaps with the first sensor module (260) may be implemented to reduce light loss between the outside of the second exemplary electronic device (2) and the first sensor module (260).
  • a portion of the display area that at least partially overlaps with the first sensor module (260) may have a different pixel density (e.g., number of pixels per unit area) compared to other areas.
  • a portion of the display area that at least partially overlaps with the first sensor module (260) may not substantially include a plurality of pixels.
  • the second sensor module may include an optical, electrostatic, or ultrasonic biometric sensor (e.g., a fingerprint sensor).
  • the second sensor module may be located within the second exemplary electronic device (2) or accommodated in the housing (20), for example, in a manner at least partially identical or similar to the first sensor module (260).
  • the second exemplary electronic device (2) may further include at least one other sensor module provided in various other locations.
  • the audio input module may include a microphone (or microphones).
  • the microphone may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20), for example, corresponding to a microphone hole (MH) provided in the second side portion (2222).
  • MH microphone hole
  • the position or number of the microphone and the microphone holes corresponding to the microphone are not limited to the shown example and may vary.
  • the first audio output module may include a first speaker (e.g., a call receiver) used for a call.
  • the first speaker may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20) corresponding to a first speaker hole (SH1) (e.g., a through hole or a notch-shaped opening) provided in the front cover (21) or the first side portion (2221) between the front cover (21) and the first side portion (2221) of the housing (20), for example.
  • the first speaker may include a piezo speaker, and the first speaker hole (SH1) may be omitted.
  • the position or number of the first audio output modules including the first speaker may vary.
  • the second audio output module may include a second speaker used to play back data relating to multimedia or recording.
  • the second speaker may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20), for example, corresponding to a second speaker hole (SH2) provided in the second side portion (2222).
  • the second speaker may include a piezo speaker, and the second speaker hole (SH2) may be omitted.
  • the position or number of the second audio output module including the second speaker may vary.
  • a single hole may be provided (or formed) to replace the microphone hole (MH) and the second speaker hole (SH2).
  • the key input module may include a first key (271) positioned in a first key hole of the third side portion (2223), a second key (272) positioned in a second key hole of the third side portion (2223), and/or a key signal generating unit (not shown separately) that generates a key signal in response to a press or touch on the first key (271) and/or the second key (272).
  • a key signal generating unit not shown separately
  • the position or number of the key input modules is not limited to the illustrated example and may vary.
  • a first connection terminal (e.g., a first connector) (280) may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20) corresponding to a first connection terminal hole (e.g., a first connector hole) provided in the second side portion (2222).
  • An external electronic device may be electrically connected to the second exemplary electronic device (2) through the first connection terminal (280).
  • the second exemplary electronic device (2) may receive power and/or data from or transmit power and/or data to the external electronic device through the first connection terminal (280).
  • the first connection terminal (280) may include, for example, a USB connector or an HDMI connector.
  • the position or number of the first connection terminals (280) is not limited to the illustrated example and may vary.
  • a second connection terminal (e.g., a second connector) (not shown separately) may be positioned inside the second exemplary electronic device (2) or accommodated in the housing (20) corresponding to a second connection terminal hole (e.g., a second connector hole) provided in the fourth side portion (2224).
  • a cover member (290) may be positioned in the second connection terminal hole to cover the second connection terminal.
  • An external storage medium such as a SIM card (or a USIM (universal SIM) card) or a memory card (e.g., an SD (secure digital memory) card) may be connected to the second connection terminal.
  • SIM card or a USIM (universal SIM) card
  • a memory card e.g., an SD (secure digital memory) card
  • the position or number of the second connection terminals is not limited to the illustrated example and may vary.
  • the second exemplary electronic device (2) may further include various components depending on its provision form. These components are not all enumerated because they are modified in various ways depending on the convergence trend of the second exemplary electronic device (2), but components equivalent to the above-mentioned components may be additionally included in the second exemplary electronic device (2). In various embodiments, specific components may be excluded from the above-mentioned components or replaced with other components depending on its provision form.
  • FIG. 3 is an exploded perspective view of a second exemplary electronic device (2) according to an embodiment of the present disclosure.
  • FIG. 4 is a perspective view of a combination of a support (31) and a sealing member (35) according to an embodiment of the present disclosure.
  • FIG. 5 is a cross-sectional view of a portion of the second exemplary electronic device (2) taken along line A-A' of FIG. 2 according to an embodiment of the present disclosure.
  • FIG. 6 is a drawing showing a support (31) and a metal (4) included in the support (31) according to an embodiment of the present disclosure. It should be understood that the present disclosure contemplates and includes all combinations of the features and/or embodiments disclosed with respect to FIGS. 3, 4, 5, and 6. That is, all combinations of the features described below with respect to FIGS. 3, 4, 5, and 6 should be considered to be included in the present disclosure as specific examples.
  • the second exemplary electronic device (2) may include a housing (20), a support (or support, support member, support structure, or bracket) (31), a first electromagnetic shield (32), a second electromagnetic shield (33), an adhesive member (also referred to as an adhesive, an adhesive portion, an adhesive portion, an adhesive member, an adhesive, an adhesive portion, an adhesive material, or an adhesive material) (34), a seal member (35), a display module (230), a first board assembly (36), a second board assembly (37), a battery (38), and/or a flexible conductor (39).
  • the second exemplary electronic device (2) may omit some of the above components or may additionally include other components.
  • the housing (20) may include a front cover (21) and a case (22).
  • the front cover (21) may provide (or form) at least a portion of the front (20A) of the second exemplary electronic device (2).
  • the case (22) may include a back portion (221) that forms (or provides) at least a portion of the back portion (20B) of the second exemplary electronic device (2) and a side portion (222) that forms (or provides) at least a portion of the side portion (20C) of the second exemplary electronic device (2).
  • the case (22) may be provided (or formed) as an integrated or single structure including, for example, the back portion (221) and the side portion (222).
  • the case (22) may have a third recess (503) by a combination of the rear portion (221) and the side portion (222).
  • the support (31) may be positioned between the front cover (21) and the case (22).
  • the support (31) may be positioned in the third recess (503) of the case (22).
  • the support (31) may include a first portion (311) and a second portion (312) connected to or extending from the first portion (311).
  • the first portion (311) may be connected to a side portion (222) of the case (22).
  • the first portion (311) may be arranged (or extended) in a looped shape along the side portion (222) of the case (22).
  • the second portion (312) may be positioned inside the first portion (311) when viewed from above on the front (20A) or the rear (20B) of the second exemplary electronic device (2).
  • the second portion (312) may be surrounded laterally by the first portion (311) when viewed from above on the front (20A) or the rear (20B) of the second exemplary electronic device (2).
  • the second part (312) of the support (31) may be provided (or formed) in the form of a plate (e.g., a mounting plate) positioned between the front cover (21) and the rear part (221) of the case (22).
  • the first part (311) of the support (31) may extend along the edge of the second part (312) in the form of a plate.
  • the combination of the case (22) and the support (31) may be interpreted as a structural component that arranges and/or supports electrical components (or functional components) such as the display module (230), the first substrate assembly (36), the second substrate assembly (37), or the battery (38), and/or mechanical components (or mechanical elements) (not shown separately).
  • the combination of the case (22) and the support (31) may be referred to as, for example, a 'frame', a 'frame structure', or a 'framework'.
  • the case (22) may be referred to as a 'first frame (or, first frame structure or first framework)'
  • the support (31) may be referred to as a 'second frame (or, second frame structure or second framework)'.
  • the support (31) can be interpreted as a part of the housing (20).
  • the first portion (311) of the support (31) may be provided (or formed) higher in the direction (e.g., +z-axis direction) toward the front surface (20A) of the second exemplary electronic device (2) than the second portion (312). Due to the shape in which the first portion (311) protrudes further than the second portion (312) in the direction toward the front surface (20A) of the second exemplary electronic device (2), the support (31) may have a first recess (501) corresponding to the front surface (20A) of the second exemplary electronic device (2).
  • One or more components, such as the front cover (21) and the display module (230), may be positioned in the first recess (501) and disposed on or supported by the support (31).
  • the first portion (311) of the support (31) may be provided (or formed) higher in the direction (e.g., -z-axis direction) toward the rear surface (20B) of the second exemplary electronic device (2) than the second portion (312). Due to the shape in which the first portion (311) protrudes further than the second portion (312) in the direction toward the rear surface (20B) of the second exemplary electronic device (2), the support (31) may have a second recess (502) corresponding to the rear surface (20B) of the second exemplary electronic device (2).
  • a plurality of components such as one or more rear camera modules (e.g., the first camera module (241), the second camera module (242), and/or the third camera module (243) of FIG. 2 ), the first electromagnetic shield (32), the second electromagnetic shield (33), the first substrate assembly (36), the second substrate assembly (37), and/or the battery (38), may be positioned in the second recess (502) and disposed on or supported by the support (31).
  • the first portion (311) protrudes further in the direction toward the front (20A) and/or the rear (20B) of the second exemplary electronic device (2) than the second portion (312), which may contribute to reducing the thickness of the second portion (312) (e.g., the thickness in the direction toward the front (20A) or the rear (20B) of the second exemplary electronic device (2)) while securing or improving the rigidity (e.g., torsional rigidity) of the support (31) for slimming the second exemplary electronic device (2).
  • the rigidity e.g., torsional rigidity
  • the first portion (311) of the support (31) may protrude further relative to the second portion (312) of the support (31) in a direction toward which the rear surface (20B) of the second exemplary electronic device (2) faces than in a direction toward which the front surface (20A) of the second exemplary electronic device (2) faces.
  • the first portion (311) may protrude a first height relative to the second portion (312) in a direction toward which the rear surface (20B) of the second exemplary electronic device (2) faces, and may protrude a second height lower than the first height relative to the second portion (312) in a direction toward which the front surface (20A) of the second exemplary electronic device (2) faces.
  • a portion (3113) (e.g., a portion of the non-metal (5)) included in the first portion (311) of the support (31) may be positioned between the front cover (21) and the side portion (222) of the case (22) to provide a portion of the outer surface of the second exemplary electronic device (2).
  • the support (31) may include a first support surface (31A), a second support surface (31B), and/or a third support surface (31C).
  • the first support surface (31A) may be positioned corresponding to the front (20A) side of the second exemplary electronic device (2), and the second support surface (31B) may be positioned corresponding to the rear (20B) side of the second exemplary electronic device (2).
  • the third support surface (31C) may face the side portion (222) of the case (22) and be coupled with the side portion (222).
  • the first support surface (31A) of the support (31) can provide a front mounting portion for stably positioning or supporting one or more components, such as the front cover (21) and the display module (230).
  • the front mounting portion can be provided by a combination of surface areas of different heights.
  • the front mounting portion can include, for example, a first recess (501).
  • the first support surface (31A) of the support (31) may include a first side (511).
  • the first side (511) may be substantially oriented in a direction in which the front side (20A) of the second exemplary electronic device (2) faces.
  • the front cover (21) may be coupled to the support (31) via an adhesive member (34) (e.g., a double-sided tape) including an adhesive material disposed between the front cover (21) and the first side (511) of the support (31).
  • the first side (511) may be defined or interpreted as an 'attachment area' configured to have the adhesive member (34) disposed thereon for coupling with the front cover (21).
  • the first side (511) of the support (31) may be included in the first portion (311) of the support (31) and provided in a loop shape.
  • the adhesive member (34) may be arranged in a loop shape along the first side (511) of the first portion (311).
  • the edge (211) of the front cover (21) may overlap the first side (511) of the support (31).
  • the adhesive member (34) may be disposed between the first side (511) of the support (31) and the edge (211) of the front cover (21).
  • the display module (230) may be positioned between the front cover (21) and the support (31), and may be combined with the front cover (21) via an optically transparent adhesive material (or an optically transparent adhesive material) (e.g., an optical clear adhesive (OCA), an optical clear resin (OCR), or a super view resin (SVR)) disposed between the front cover (21) and the display module (230).
  • an optically transparent adhesive material e.g., an optical clear adhesive (OCA), an optical clear resin (OCR), or a super view resin (SVR)
  • the adhesive member (34) can reduce or prevent external foreign substances, such as moisture and/or dust, from entering the space between the front cover (21) and the support (31) through the space between the front cover (21) and the support (31).
  • the adhesive member (34) may be referred to as a 'sealing member', a 'sealing portion', a 'waterproof member', or a 'waterproof portion'.
  • the combination of the adhesive member (34), the area of the front cover (21) where the adhesive member (34) is disposed, and the first surface (511) of the support (31) where the adhesive member (34) is disposed may be defined or interpreted as a 'first sealing area' or a 'first waterproof area' of the second exemplary electronic device (2).
  • the second support surface (31B) of the support (31) can provide a rear mounting portion for stably positioning or supporting a plurality of components, such as one or more rear camera modules (e.g., the first camera module (241), the second camera module (242), and/or the third camera module (243) of FIG. 2), the first electromagnetic shield (32), the second electromagnetic shield (33), the first substrate assembly (36), the second substrate assembly (37), and/or the battery (38).
  • the rear mounting portion can be provided by a combination of surface areas of different heights.
  • the rear mounting portion can include, for example, the second recess (502).
  • the second support surface (31B) of the support (31) can include a second face (512).
  • the second face (512) can be substantially oriented in a direction toward the rear surface (20B) of the second exemplary electronic device (2).
  • the first portion (311) of the support (31) can be configured to directly or indirectly contact the rear surface (221) of the case (22) through the second face (512).
  • 'direct contact' between the second surface (512) of the support (31) and the rear surface (221) of the case (22) may be defined or interpreted as the second surface (512) physically contacting the rear surface (221) without a medium (or intermediate member) between the second surface (512) and the rear surface (221).
  • 'indirect or mediate contact' between the second surface (512) of the support (31) and the rear surface (221) of the case (22) may be defined or interpreted as the second surface (512) being in contact with the rear surface (221) via (or as a mediator) at least one medium (or intermediate member) between the second surface (512) and the rear surface (221).
  • the second side (512) of the support (31) may be included in the first part (311) of the support (31) and provided in a loop shape.
  • the sealing member (35) may be arranged in a loop shape along the second side (512).
  • the rear surface (221) of the case (22) may include a third surface (513) that overlaps the second surface (512) of the support (31).
  • the sealing member (35) may be disposed between the second surface (512) of the support (31) and the third surface (513) of the case (22).
  • the third surface (513) may, for example, extend in a loop shape adjacent to the boundary between the rear surface (221) and the side surface (222) of the case (22).
  • direct or indirect contact between the second side (512) of the support (31) and the rear side (221) of the case (22) can reduce or prevent external foreign substances, such as moisture and/or dust, from entering the space between the support (31) and the case (22) through the support (31) and the case (22).
  • external foreign substances may enter between the side side (222) of the case (22) and the first portion (311) of the support (31)
  • direct or indirect contact between the second side (512) of the support (31) and the rear side (221) of the case (22) can reduce or prevent the external foreign substances from moving into the space between the support (31) and the rear side (221) of the case (22).
  • Direct or indirect contact between the second surface (512) of the support (31) and the third surface (513) of the case (22) may be defined or interpreted as a ‘second sealing area’ or a ‘second waterproof area’ of the exemplary electronic device (2).
  • the sealing member (35) in response to the indirect contact between the second face (512) of the support (31) and the third face (513) of the case (22), the sealing member (35) may be placed between the second face (512) of the support (31) and the third face (513) of the case (22).
  • the sealing member (35) may extend in a loop shape along the second face (512) and the third face (513).
  • the sealing member (35) may be placed on the second side (512) of the support (31) or the third side (513) of the case (22) via an adhesive material (or bonding material) (e.g., double-sided tape) (not shown separately).
  • an adhesive material e.g., double-sided tape
  • the sealing member (35) can be compressed between the second face (512) of the support (31) and the third face (513) of the case (22).
  • the sealing member (35) can include an elastic member or a flexible member, such as, for example, a sponge or rubber.
  • the sealing member (35) can be formed of various materials that can substantially block the movement of moisture and/or dust between the second face (512) of the support (31) and the third face (513) of the case (22).
  • the sealing member (35) when the sealing member (35) includes an adhesive material (or bonding material) such as a double-sided tape, the second side (512) of the support (31) and the third side (513) of the case (22) can be bonded or attached through the sealing member (35).
  • the indirect contact between the second side (512) of the support (31) and the third side (513) of the case (22) through the sealing member (35) of the adhesive material can be interpreted as a 'connection' between the support (31) and the case (22) through the sealing member (35).
  • the direct or indirect contact for waterproofing and/or dustproofing between the first part (311) of the support (31) and the rear part (221) of the case (22) is not limited to the illustrated example and may extend to the first part (311) of the support (31) and the side part (222) of the case (22).
  • the first height at which the first part (311) of the support (31) protrudes in the direction toward the rear side (20B) of the second exemplary electronic device (2) relative to the second part (312) can be formed to enable stable insertion of the sealing member (35) while reducing the gap between the first part (311) and the rear side (221) of the case (22).
  • the first part (311) of the support (31) can be coupled with the side part (222) of the case (22) through mechanical fastening.
  • the support (31) and the case (22) are coupled, when the support (31) is inserted into the third recess (503) of the case (22), the first part (311) of the support (31) can be coupled with the side part (222) through mechanical fastening between the first part (311) and the side part (222) of the case (22).
  • the first part (311) of the support (31) may include a plurality of first fastening elements arranged or formed on the third support surface (31C).
  • the side part (222) of the case (22) may include a plurality of second fastening elements corresponding to the plurality of first fastening elements.
  • a plurality of first fastening elements included in a first portion (311) of a support (31) and a plurality of second fastening elements included in a side portion (222) of a case (22) may be joined through sliding fastening.
  • the plurality of first fastening elements may include sliders
  • the plurality of second fastening elements may include grooves (or recesses) into which the sliders can be inserted and fitted.
  • the plurality of second fastening elements may include sliders
  • the plurality of first fastening elements may include grooves (or recesses) into which the sliders can be inserted and fitted.
  • a plurality of first fastening elements included in a first portion (311) of a support (31) and a plurality of second fastening elements included in a side portion (222) of a case (22) may be joined through snap-fit fastening.
  • the snap-fit fastening may be an assembly method in which interlocking elements of the first portion (311) of the support (31) and the side portion (222) of the case (22) are elastically pushed together to join them.
  • the plurality of first fastening elements may include hooks
  • the plurality of second fastening elements may include hook fastening portions (catching portions) corresponding to the hooks.
  • the plurality of second fastening elements may include hooks
  • the plurality of first fastening elements may include hook fastening portions (catching portions) corresponding to the hooks.
  • first part (311) of the support (31) and the side part (222) of the case (22) may be joined in various other ways.
  • the distance (or thickness of the gap) between the second surface (512) of the support (31) and the third surface (513) of the case (22) can be determined by the bonding of the third support surface (31C) of the support (31) and the side surface (222) of the case (22).
  • the distance between the second surface (512) of the support (31) and the third surface (513) of the case (22) can be formed to enable stable interposition of the sealing member (35).
  • the support (31) may include a metal (4) and/or a non-metal (5).
  • the support (31) including the first portion (311) and the second portion (312) may be provided (or formed) as a combination of the metal (4) and the non-metal (5).
  • the metal (4) may include, for example, a combination of one or more conductive portions (or metal portions).
  • the non-metal (5) may include, for example, a combination of one or more non-conductive portions (or non-metal portions).
  • the metal (4) may include a first metal region (41) included in a first portion (311) of the support (31) and a second metal region (42) included in a second portion (312) of the support (31).
  • the first metal region (41) may extend from or be connected to the second metal region (42).
  • the first metal region (41) can be bent and extended from the second metal region (42).
  • the first metal region (41) can be bent and extended in a direction from the second metal region (42) toward the rear portion (221) of the case (22).
  • the first metal region (41) can be bent and extended in a direction from the second metal region (42) toward the front cover (21) (see FIG. 26).
  • the metal (4) may be provided (or formed) as an integrated or single metal (or metal structure) (e.g., a single continuous structure or a complete structure) comprising a first metal region (41) and a second metal region (42).
  • the first metal region (41) and the second metal region (42) may comprise the same metal material.
  • the metal (4) may comprise, for example, aluminum (Al), but is not limited thereto.
  • the first metal region (41) and the second metal region (42) may be separated from each other at least in part.
  • the first metal region (41) may include one or more conductive patterns (e.g., the first conductive pattern (731) and the second conductive pattern (732) of FIG. 1).
  • the non-metal (5) may include a first non-metal region (51) included in a first portion (311) of the support (31) and a second non-metal region (52) included in a second portion (312) of the support (31).
  • the non-metal (5) may be provided (or formed) as an integrated or single non-metal (or non-metal structure) (e.g., a single continuous structure or a complete structure) comprising a first non-metal region (51) and a second non-metal region (52).
  • the first non-metal region (51) and the second non-metal region (52) may comprise the same non-metallic material (e.g., a polymer).
  • the first support surface (31A) of the support (31) can be provided (or formed) through a combination of a conductive surface (or metal surface) by metal (4) and/or a non-conductive surface (or non-metal surface) by non-metal (5).
  • the second support surface (31B) of the support (31) can be provided (or formed) through a combination of a conductive surface (or metal surface) by metal (4) and/or a non-conductive surface (or non-metal surface) by non-metal (5).
  • the third support surface (31C) of the support (31) can be provided (or formed) through a combination of a conductive surface (or metal surface) by metal (4) and/or a non-conductive surface (or non-metal surface) by non-metal (5).
  • the metal (4) of the support (31) may be manufactured through press processing.
  • the non-metal (4) of the support (31) can be manufactured through injection molding (e.g., insert injection molding).
  • injection molding e.g., insert injection molding
  • a molten resin can be injected into a mold in which a metal (4) is placed, and then the molten resin can be cooled to form a non-metal (5) combined with the metal (4).
  • the support (31) can be substantially completed by external processing (e.g., computer numerical control (CNC)) and/or surface processing (e.g., coating and/or painting) of the primary molded product manufactured after press working and injection molding.
  • CNC computer numerical control
  • surface processing e.g., coating and/or painting
  • the support (31) can be manufactured by various other methods.
  • the first substrate assembly (36), the second substrate assembly (37), and/or the battery (38) can be positioned between the second portion (312) of the support (31) and the rear portion (221) of the case (22).
  • the first substrate assembly (36), the second substrate assembly (37), and/or the battery (38) can be positioned (or coupled) to the second portion (312) of the support (31).
  • the first substrate assembly (36) and the second substrate assembly (37) may be positioned spaced apart from each other with the battery (38) interposed therebetween when viewed from above on the rear surface (20B) of the second exemplary electronic device (2).
  • the first substrate assembly (36) when viewed from above on the rear surface (20B) of the second exemplary electronic device (2), can be positioned at least partially between the first side surface (2221) of the case (22) and the battery (38).
  • the second substrate assembly (37) when viewed from above on the rear surface (20B) of the second exemplary electronic device (2), can be positioned at least partially between the second side surface (2222) and the battery (38).
  • the first substrate assembly (36) may include a first printed circuit board (361), electrical elements (not shown) disposed on or connected to the first printed circuit board (361), and/or mechanical elements (or structural elements) (not shown) disposed on or connected to the first printed circuit board (361).
  • the second substrate assembly (37) may include a second printed circuit board (371), electrical elements (not shown) disposed on or connected to the second printed circuit board (371), and/or mechanical elements (or structural elements) (not shown) disposed on or connected to the second printed circuit board (371).
  • the first substrate assembly (36) and the second substrate assembly (37) may be electrically connected via an electrical path (or electrical connecting member) (not shown) such as a flexible printed circuit board.
  • the first printed circuit board (361) included in the first substrate assembly (36) may include a protrusion (not shown separately) extending between the third side portion (2223) and the battery (38), or between the fourth side portion (2224) and the battery (38), when viewed from above on the rear surface (20B) of the second exemplary electronic device (2).
  • the protrusion may be electrically connected to the second printed circuit board (371) of the second substrate assembly (37) via an electrical path, such as a flexible printed circuit board.
  • an integrated or single printed circuit board may be provided that replaces the first printed circuit board (361) included in the first substrate assembly (36) and the second printed circuit board (371) included in the second substrate assembly (37).
  • the integrated or single printed circuit board may include, for example, a first substrate portion positioned between the first side portion (2221) and the battery (38), a second substrate portion positioned between the second side portion (2222) and the battery (38), and a third substrate portion connecting the first substrate portion and the second substrate portion, when viewed from above on the rear surface (20B) of the second exemplary electronic device (2).
  • the third substrate portion may be positioned between the third side portion (2223) and the battery (38), or between the fourth side portion (2224) and the battery (38), when viewed from above on the rear surface (20B) of the second exemplary electronic device (2).
  • the third substrate portion may be implemented substantially rigidly or flexibly.
  • the first substrate assembly (36) or the second substrate assembly (37) may include a primary printed circuit board (or main printed circuit board), a secondary printed circuit board (or sub printed circuit board), and/or an interposer substrate.
  • a primary printed circuit board or main printed circuit board
  • a secondary printed circuit board or sub printed circuit board
  • an interposer substrate When viewed from above on the rear surface (20B) of the second exemplary electronic device (2), the primary printed circuit board and the secondary printed circuit board may at least partially overlap.
  • the interposer substrate may be disposed between the primary printed circuit board and the secondary printed circuit board and electrically connect the primary printed circuit board and the secondary printed circuit board.
  • the battery (38) is a device for powering at least one component of the second exemplary electronic device (2), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the first electromagnetic shield (32) can be positioned between the first substrate assembly (36) and the rear portion (221) of the case (22).
  • the first electromagnetic shield (32) can be disposed (or coupled) to the first substrate assembly (36).
  • the first electromagnetic shield (32) can cover and/or protect the first substrate assembly (36).
  • the first electromagnetic shield (32) can reduce electromagnetic influences (e.g., electromagnetic interference (EMI)) from noise introduced from outside the second exemplary electronic device (2) or from peripheral electrical elements within the second exemplary electronic device (2) on a plurality of electronic components included in the first substrate assembly (36).
  • the first electromagnetic shield (32) can include, for example, a first shield can.
  • the second electromagnetic shield (33) can be positioned between the second substrate assembly (37) and the rear portion (221) of the case (22).
  • the second electromagnetic shield (33) can be positioned (or coupled) to the second substrate assembly (37).
  • the second electromagnetic shield (33) can cover and/or protect the second substrate assembly (37).
  • the second electromagnetic shield (33) can reduce electromagnetic influences (e.g., EMI) from noise introduced from outside the second exemplary electronic device (2) or from peripheral electrical elements within the second exemplary electronic device (2) on a plurality of electronic components included in the second substrate assembly (37).
  • the second electromagnetic shield (33) can include, for example, a second shield can.
  • the metal (4) of the support (31) can be electrically connected to a first ground structure (not shown) included in the first substrate assembly (36).
  • the metal (4) of the support (31) can be electrically connected to the first ground structure included in the first substrate assembly (36) via a conductive adhesive material (or adhesive material) and/or a flexible conductor (or a flexible conductive portion or flexible conductive member) (not shown) positioned between the metal (4) and the first substrate assembly (36).
  • the flexible conductor can include, for example, a conductive clip (e.g., a conductive structure including a resilient structure), a pogo-pin, a spring, a conductive poron, a conductive sponge, a conductive rubber, a conductive tape, or a conductive connector.
  • the first ground structure (not shown separately) of the first substrate assembly (36) may include a first ground region included in the first printed circuit board (710) of the first substrate assembly (36), and/or at least one conductor or metal body electrically connected to the first ground region.
  • the metal (4) of the support (31) can be electrically connected to a second ground structure (not shown separately) included in the second substrate assembly (37).
  • the metal (4) of the support (31) can be electrically connected to the second ground structure included in the second substrate assembly (37) via a conductive adhesive material (or adhesive material) and/or a flexible conductor (or, a flexible conductive portion or a flexible conductive member) (not shown separately) positioned between the metal (4) and the second substrate assembly (37).
  • the second ground structure (not shown separately) of the second substrate assembly (37) may include a second ground region included in the second printed circuit board (371) of the second substrate assembly (37), and/or at least one conductor or metal body electrically connected to the second ground region.
  • the first ground structure (not shown separately) of the first substrate assembly (36) and the second ground structure (not shown separately) of the second substrate assembly (37) may be electrically connected via an electrical connecting member (e.g., a flexible printed circuit board) (not shown separately) that electrically connects the first substrate assembly (36) and the second substrate assembly (37).
  • an electrical connecting member e.g., a flexible printed circuit board
  • the metal (4) of the support (31) may be defined or interpreted as a ‘third ground structure’.
  • the display module (230) may be electrically connected to the metal (4) of the support (31) via a conductive material (not shown separately) positioned between the display module (230) and the support (31).
  • a conductive material e.g., a metal sheet for electromagnetic shielding such as a copper sheet
  • the conductive material positioned between the display module (230) and the support (31) may include, for example, a conductive adhesive material (or a conductive adhesive material).
  • the conductive material positioned between the display module (230) and the support (31) may include, for example, a flexible conductor (or a flexible conductive portion or a flexible conductive member).
  • At least one conductive layer (e.g., an electromagnetic shielding metal sheet such as a copper sheet) (not shown separately) electrically connected to the metal (4) of the support (31) among the display modules (230) may be defined or interpreted as a 'fourth ground structure'.
  • an electromagnetic shielding metal sheet such as a copper sheet
  • the first electromagnetic shield (32) may be defined or interpreted as a 'fifth ground structure' electrically connected to the first ground structure (not shown separately) of the first substrate assembly (36).
  • the second electromagnetic shield (33) may be defined or interpreted as a 'sixth ground structure' electrically connected to the second ground structure (not shown separately) of the second substrate assembly (37).
  • a combination of the first ground structure of the first substrate assembly (36), the second ground structure of the second substrate assembly (37), the third ground structure (e.g., metal (4)) of the support (31), the fourth ground structure of the display module (230), the fifth ground structure (e.g., first electromagnetic shield (32)), and/or the sixth ground structure (e.g., second electromagnetic shield (33)) of the display module (230) may be defined or interpreted as a 'ground structure (or ground)' of the second exemplary electronic device (2).
  • the ground structure of the second exemplary electronic device (2) may further include various other ground structures (e.g., conductors or metal bodies) (not shown separately) electrically connected to the first ground structure, the second ground structure, the third ground structure, the fourth ground structure, the fifth ground structure, and/or the sixth ground structure.
  • various other ground structures e.g., conductors or metal bodies
  • the ground structure of the second exemplary electronic device (2) can reduce or prevent electromagnetic interference (EMI) to electrical elements included in the second exemplary electronic device (2).
  • EMI electromagnetic interference
  • the ground structure of the second exemplary electronic device (2) can reduce or prevent electromagnetic effects of noise from outside the second exemplary electronic device (2) on electrical elements included in the second exemplary electronic device (2).
  • the ground structure of the second exemplary electronic device (2) can reduce or prevent electromagnetic interference between electrical elements included in the second exemplary electronic device (2).
  • the second exemplary electronic device (2) may include a first conductive region (not shown separately) and a second conductive region (not shown separately).
  • the first conductive region and the second conductive region may be electrically connected, or may be electrically and physically connected.
  • the first conductive region among the combination of the first conductive region and the second conductive region may be defined or interpreted as an antenna radiator
  • the second conductive region among the combination of the first conductive region and the second conductive region may be defined or interpreted as a ground structure of the second exemplary electronic device (2) that is distinct from the antenna radiator.
  • the first conductive region when the first conductive region is configured to substantially radiate electromagnetic waves, a combination of the first conductive region and the second conductive region may be defined or interpreted as a ground structure of the second exemplary electronic device (2), and the first conductive region may be defined or interpreted as an antenna radiator implemented through a part of the ground structure of the second exemplary electronic device (2).
  • the second conductive region when the first conductive region is configured to substantially radiate electromagnetic waves, the second conductive region may be configured as an antenna ground that exerts an electromagnetic effect on the first conductive region (e.g., the antenna radiator).
  • the antenna ground may contribute to securing antenna radiation performance (or, radio transmission/reception performance or communication performance) and/or securing coverage with respect to the antenna radiator.
  • the antenna ground may reduce electromagnetic interference (EMI) or signal loss with respect to the antenna radiator.
  • EMI electromagnetic interference
  • a portion (not shown separately) of the ground structure of the second exemplary electronic device (2) may be configured as an antenna radiator.
  • a portion of the ground structure of the second exemplary electronic device (2) may be electrically connected to a wireless communication circuit (or a wireless communication module) (e.g., a wireless communication module (192) of FIG. 1) included in the first substrate assembly (36) or the second substrate assembly (37).
  • a portion of the ground structure of the second exemplary electronic device (2) may receive (or be powered by) an electromagnetic signal (or a wireless signal, an RF signal, or a radiated current) from the wireless communication circuit and operate as an antenna radiator (or a radiator, a radiating portion, or a resonator).
  • a portion of the ground structure of the second exemplary electronic device (2) comprising an antenna radiator may be included in the metal (4) of the support (31).
  • a portion of the ground structure of the second exemplary electronic device (2) configured as an antenna radiator may include at least a portion of a first metal region (41) included in a first portion (311) of the support (31).
  • At least a portion of the first metal region (41) included in the first portion (311) of the support (31) is configured to radiate electromagnetic waves
  • at least a portion of the first metal region (41) may be defined or interpreted as being excluded from the third ground structure (e.g., the metal (4)) of the support (31) or the ground structure of the second exemplary electronic device (2).
  • Various other conductive portions (or conductive regions or conductive patterns) configured to radiate electromagnetic waves may be defined or interpreted as being excluded from the ground structure of the electronic device (1).
  • a portion (not illustrated separately) of the ground structure of the second exemplary electronic device (2) may operate as an antenna ground that exerts an electromagnetic influence on at least one antenna radiator.
  • a portion of the ground structure of the second exemplary electronic device (2) comprising an antenna radiator may be varied.
  • the case (22) or the side portion (222) of the case (22) may be formed of a non-conductive material having a permittivity (e.g., low permittivity) that can reduce or secure degradation of antenna radiation performance.
  • a permittivity e.g., low permittivity
  • the flexible conductor (39) may be disposed on the first printed circuit board (710).
  • the first metal region (41) of the support (31) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first printed circuit board (710) through the flexible conductor (39).
  • the first metal region (41) may be provided with (or powered by) an electromagnetic signal (or, a wireless signal, an RF signal, or a radiated current) from the wireless communication circuit and may operate as an antenna radiator.
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1 provides (or supplies) an electromagnetic signal (or, a wireless signal, an RF signal, or a radiated current) to the first metal region (41)
  • the first metal region (41) may be spaced apart from the display module (230) to reduce electromagnetic influence (e.g., electromagnetic coupling) between the first metal region (41) and the display module (230) to secure antenna radiation performance.
  • the wireless communication circuitry of the second exemplary electronic device (2) can process a transmit signal or a receive signal in at least one selected or designated frequency band via at least one antenna radiator.
  • the selected or designated frequency band can include, for example, at least one of a low band (LB) (about 600 MHz to about 1 GHz), a middle band (MB) (about 1 GHz to about 2.3 GHz), a high band (HB) (about 2.3 GHz to about 2.7 GHz), or an ultra-high band (UHB) (about 2.7 GHz to about 6 GHz).
  • the designated frequency band can include various other frequency bands.
  • a non-conductive body (or non-conductive structure) of a non-metallic material and at least one conductive pattern disposed on the non-conductive body may be included.
  • the at least one conductive pattern may be electrically connected to a wireless communication circuit of the second exemplary electronic device (2) (e.g., the wireless communication module (192) of FIG. 1) to operate as an antenna radiator.
  • the at least one conductive pattern may be disposed on the non-conductive body, for example, through laser direct structuring (LDS).
  • LDS laser direct structuring
  • any one exemplary electronic device may be interpreted as being included in the scope of various embodiments of the present disclosure by changing or modifying at least some of the plurality of components of any other exemplary electronic device.
  • the same terminology and/or the same reference numerals may be used for components that are at least partially identical or similar to or related to components of any other exemplary electronic device.
  • two components that have the same terminology but different reference numerals may be understood to be substantially the same or have changed or modified forms.
  • FIG. 7 is a perspective view of a portion of a third exemplary electronic device (7) according to one embodiment of the present disclosure. It should be understood that the present disclosure encompasses and includes all combinations of the features and/or embodiments disclosed with respect to FIG. 7. That is, all combinations of the features described below with respect to FIG. 7 should be considered to be included in the present disclosure as specific examples.
  • the third exemplary electronic device (7) may include a case (22), a metal (4), a first printed circuit board (710) (e.g., the first printed circuit board (361) of FIG. 5), a first flexible conductor (721), a second flexible conductor (722), and/or a third flexible conductor (723).
  • the case (22) may include a rear portion (221), a first side portion (2221), a third side portion (2223), and/or a fourth side portion (2224).
  • the metal (4) may include a second metal region (42), a first conductive pattern (731), and/or a second conductive pattern (732).
  • the second metal region (42) may be included in a second portion (312) of the support (31) (see FIG. 5).
  • the first conductive pattern (731) and the second conductive pattern (732) may extend from the second metal region (42).
  • the first conductive pattern (731) and the second conductive pattern (732) may be included in the first portion (311) of the support (31) (see FIG. 5).
  • the first metal region (41) (see FIG. 5) included in the first portion (311) of the support (31) may include the first conductive pattern (731) and the second conductive pattern (732).
  • the second metal region (42) of the metal (4) may be positioned between the rear surface (221) of the case (22) and the first printed circuit board (710).
  • the first conductive pattern (731) and the second conductive pattern (732) of the metal (4) may be positioned corresponding to the first side portion (2221) of the case (22).
  • the position or shape of the first conductive pattern (731) and/or the second conductive pattern (732) is not limited to the illustrated example and may vary.
  • the first conductive pattern (731) can be configured to operate as a first antenna radiator, and the second conductive pattern (732) can be configured to operate as a second antenna radiator.
  • the first conductive pattern (731) and the second conductive pattern (732) being positioned corresponding to the first side portion (2221) can reduce the likelihood that the first conductive pattern (731) and the second conductive pattern (732) will be positioned corresponding to a grip position of a user's hand with respect to the third exemplary electronic device (7).
  • Reducing the likelihood that the first conductive pattern (731) and the second conductive pattern (732) will be positioned corresponding to a grip position of a user's hand with respect to the third exemplary electronic device (7) can reduce the likelihood that the radiation performance will be degraded by the user's hand (e.g., a dielectric).
  • a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) may be arranged on the first printed circuit board (710).
  • the second metal region (42) of the metal (4) can be electrically connected to the first ground region (G1) of the first printed circuit board (710).
  • the first ground region (G1) of the first printed circuit board (710) can be electrically connected to the second metal region (42) via, for example, a conductive member (e.g., a conductive adhesive material or a flexible conductor) disposed between the first printed circuit board (710) and the second metal region (42).
  • a conductive member e.g., a conductive adhesive material or a flexible conductor
  • a combination of the first ground region (G1) of the first printed circuit board (710) and the first metal region (41) of the metal (4) can function as an antenna ground (G).
  • the antenna ground (G) can help secure antenna radiation performance (or, radio transmission/reception performance or communication performance) and/or coverage with respect to at least one antenna radiator (e.g., the first conductive pattern (731) and the second conductive pattern (732)).
  • the antenna ground (G) can reduce electromagnetic interference (EMI) or signal loss with respect to at least one antenna radiator (e.g., the first conductive pattern (731) and the second conductive pattern (732)).
  • EMI electromagnetic interference
  • the first flexible conductor (721), the second flexible conductor (722), and/or the third flexible conductor (723) can be disposed on the first printed circuit board (710).
  • the first flexible conductor (721), the second flexible conductor (722), and/or the third flexible conductor (723) can include, for example, a conductive clip, a pogo pin, a spring, a conductive poron, a conductive sponge, a conductive rubber, a conductive tape, or a conductive connector.
  • the first conductive pattern (731) of the metal (4) can be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a first printed circuit board (710) via a first flexible conductor (721) (e.g., a flexible conductor (39) of FIG. 5).
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1
  • a location or portion of the first conductive pattern (731) that physically contacts the first flexible conductor (721) can be a first feeding point.
  • the wireless communication circuit can provide (or feed) an electromagnetic signal (or, a wireless signal, an RF signal, or a radiated current) to the first feeding point.
  • the first conductive pattern (731) of the metal (4) can be electrically connected to the first ground region (G1) of the first printed circuit board (710) through the second flexible conductor (722).
  • a location or portion of the first conductive pattern (731) that physically contacts the second flexible conductor (722) can be a grounding point.
  • a portion of the first conductive pattern (731) of the metal (4) that extends from the second metal region (42) of the metal (4) may be a first grounding short section (7311).
  • the first conductive pattern (731) may, for example, extend from the first grounding short section (7311) to the first open end (7312).
  • the first grounding short section (7311) may be positioned closer to the first corner (2225) of the case (22) than to the second corner (2226) of the case (22).
  • the first open end (7312) may be positioned closer to the second corner (2226) than to the first grounding short section (7311).
  • the shape of the first conductive pattern (731) is not limited to the illustrated example and may vary.
  • a wireless communication circuit when a wireless communication circuit provides (or feeds) an electromagnetic signal (or a radio signal, an RF signal, or a radiation current) to a first feed point of a first conductive pattern (731), a first signal path through which an electromagnetic signal flows may be formed between the first feed point of the first conductive pattern (731), the ground point of the first conductive pattern (731), and the first ground short circuit (7311), and the antenna ground (G).
  • a first radiation pattern (or a first radiation field or a first electromagnetic field) may be provided (or formed) through electromagnetic coupling between the first signal path and the antenna ground (G).
  • the first radiation pattern may have a first resonant frequency corresponding to an electrical length (e.g., a length expressed as a ratio of wavelengths) of the first signal path.
  • the first challenge pattern (731) can be operated as a planar inverted F antenna (PIFA).
  • PIFA planar inverted F antenna
  • the location or number of the power supply point or ground point for the first challenge pattern (731) may vary and is not limited to the illustrated example.
  • the location or number of the first grounding short circuit portion (7311) of the first conductive pattern (731) is not limited to the illustrated example and may vary.
  • the first conductive pattern (731) may extend from the first end to the second end, and the first grounding short circuit portion (7311) may extend from a portion between the first end and the second end of the first conductive pattern (731) to the second metal region (42).
  • the first conductive pattern (731) may be physically separated from the second metal region (42).
  • the first grounding short circuit (7311) may be omitted.
  • the third exemplary electronic device (7) may include a first transmission line electrically connecting a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and a first power point of a first conductive pattern (731).
  • the first transmission line may include, for example, a first flexible conductor (721) and a first conductive line (or first wiring) included in a first printed circuit board (710).
  • the first conductive line may electrically connect the first flexible conductor (721) and the wireless communication circuit.
  • the first transmission line may transmit a signal (voltage, current) of RF.
  • the second conductive pattern (732) of the metal (4) can be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first printed circuit board (710) via a third flexible conductor (723) (e.g., a flexible conductor (39) of FIG. 5).
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1
  • a third flexible conductor (723) e.g., a flexible conductor (39) of FIG. 5
  • a location or portion of the second conductive pattern (732) that is in physical contact with the third flexible conductor (723) can be a second power supply point.
  • the wireless communication circuit can provide (or supply) an electromagnetic signal (or, a wireless signal, an RF signal, or a radiated current) to the second power supply point.
  • a portion of the second conductive pattern (732) of the metal (4) that extends from the second metal region (42) of the metal (4) may be a second grounding short circuit (7321).
  • the second conductive pattern (732) may, for example, extend from the second grounding short circuit (7321) to the second open end (7322).
  • the second grounding short circuit (7321) may be positioned closer to the second corner (2226) of the case (22) than to the first corner (2225) of the case (22).
  • the second open end (7322) may be positioned closer to the first corner (2225) than to the second grounding short circuit (7321).
  • the shape of the second conductive pattern (732) is not limited to the illustrated example and may vary.
  • a second signal path through which the electromagnetic signal flows may be formed between the second feed point and the second ground short circuit (7321) of the second conductive pattern (732), and the antenna ground (G).
  • a second radiation pattern (or, a second radiation field or a second electromagnetic field) may be provided (or formed) through electromagnetic coupling between the second signal path and the antenna ground (G).
  • the second radiation pattern may have a second resonant frequency corresponding to an electrical length (e.g., a length expressed as a ratio of wavelengths) of the second signal path.
  • the second challenge pattern (732) can be operated as a PIFA.
  • the location or number of power supply points for the second challenge pattern (732) may vary and are not limited to the illustrated example.
  • the location or number of the second grounding short circuit portions (7321) of the second conductive pattern (732) is not limited to the illustrated example and may vary.
  • the second conductive pattern (732) may extend from the third end to the fourth end, and the second grounding short circuit portion (7321) may extend from a portion between the third end and the fourth end of the second conductive pattern (732) to the second metal region (42).
  • the second conductive pattern (732) may include at least one ground point electrically connected to the first ground area (G1) of the first printed circuit board (710) via a flexible conductor.
  • the second conductive pattern (732) may be physically separated from the second metal area (42), and the second ground short circuit (7321) may be omitted.
  • the third exemplary electronic device (7) may include a second transmission line electrically connecting a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and a second power point of a second conductive pattern (732).
  • the second transmission line may include, for example, a third flexible conductor (723) and a second conductive line (or second wiring) included in a first printed circuit board (710).
  • the second conductive line may electrically connect the third flexible conductor (723) and the wireless communication circuit.
  • the second transmission line may transmit a signal (voltage, current) of RF.
  • the seventh exemplary electronic device (7) can include a first matching circuit (not shown) electrically connected to a first transmission line for the first conductive pattern (731).
  • the first matching circuit can adjust a resonance of the first conductive pattern (731).
  • the first matching circuit can include a frequency adjustment circuit and can shift a resonant frequency of the first conductive pattern (731) to a specified frequency or by a specified amount.
  • the first matching circuit can reduce a reflection (or amount of reflection) at a selected or specified frequency (or, an operating frequency or a usage frequency) for the first conductive pattern (731).
  • the first matching circuit can reduce power loss through the first conductive pattern (731) at the selected or specified frequency.
  • the first matching circuit may have a component value capable of matching an impedance between a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and a first conductive pattern (731).
  • the first matching circuit may include, for example, at least one electrical element (e.g., a lumped element or a passive element) having a component such as capacitance, inductance, or conductance, or a circuit implemented with a combination of such electrical elements.
  • the wireless communication circuit may be described as the wireless communication module (192) of FIG. 1.
  • the wireless communication circuit may include, for example, a wireless communication processor (CP).
  • the first matching circuit may have at least one antenna radiator (e.g., the second conductive pattern (732)) positioned around the first conductive pattern (731) of the third exemplary electronic device (7) and/or the conductor (or conductive region) may have a designated isolation degree with respect to the first conductive pattern (731) to secure antenna radiation performance in a selected or designated frequency band while reducing electromagnetic influence of the first conductive pattern (731) on the first conductive pattern (731).
  • the second conductive pattern (732) positioned around the first conductive pattern (731) of the third exemplary electronic device (7) and/or the conductor (or conductive region) may have a designated isolation degree with respect to the first conductive pattern (731) to secure antenna radiation performance in a selected or designated frequency band while reducing electromagnetic influence of the first conductive pattern (731) on the first conductive pattern (731).
  • the seventh exemplary electronic device (7) can include a second matching circuit (not shown) electrically connected to a second transmission line for the second conductive pattern (732).
  • the second matching circuit can adjust a resonance of the second conductive pattern (732).
  • the second matching circuit can include a frequency adjustment circuit and can shift a resonant frequency of the second conductive pattern (732) to a specified frequency or by a specified amount.
  • the second matching circuit can reduce a reflection (or amount of reflection) at a selected or specified frequency (or, an operating frequency or a usage frequency) for the second conductive pattern (732).
  • the second matching circuit can reduce power loss through the second conductive pattern (732) at the selected or specified frequency.
  • the second matching circuit may have element values capable of matching the impedance between the wireless communication circuit (e.g., the wireless communication module (192) of FIG. 1) and the second conductive pattern (732).
  • the second matching circuit may include, for example, a circuit implemented with at least one electrical element (e.g., a lumped element or a passive element) having a component such as capacitance, inductance, or conductance, or a combination of such electrical elements.
  • the second matching circuit can ensure antenna radiation performance in a selected or designated frequency band while reducing electromagnetic influence of at least one antenna radiator (e.g., the first conductive pattern (731)) and/or conductor (or conductive region) positioned around the second conductive pattern (732) of the third exemplary electronic device (7) on the second conductive pattern (732), thereby allowing the second conductive pattern (732) to have a designated degree of isolation with respect to at least one surrounding antenna radiator and/or conductor.
  • at least one antenna radiator e.g., the first conductive pattern (731)
  • conductor or conductive region
  • the first conductive pattern (731) and the second conductive pattern (732) may at least partially overlap each other when viewed from above on the front side (20A) (see FIG. 2) or the rear side (20B) (see FIG. 2) of the third exemplary electronic device (7).
  • the first matching circuit and/or the second matching circuit may be configured to reduce the electromagnetic influence (or electromagnetic coupling) between the first conductive pattern (731) and the second conductive pattern (732) so that the first conductive pattern (731) can smoothly radiate (or transmit and receive) a first signal in the first frequency band while reducing signal loss, and so that the second conductive pattern (732) can smoothly radiate (or transmit and receive) a second signal in the second frequency band while reducing signal loss.
  • the first matching circuit and/or the second matching circuit can improve or secure the isolation for the first conductive pattern (731) and the second conductive pattern (732).
  • the third exemplary electronic device (7) may include an integrated matching circuit (not shown separately) replacing the first matching circuit and the second matching circuit.
  • the integrated matching circuit may have a function of matching (e.g., impedance matching) or tuning so that the first conductive pattern (731) can smoothly radiate (or transmit and receive) a first signal in a first frequency band while reducing signal loss, and the second conductive pattern (732) can smoothly radiate (or transmit and receive) a second signal in a second frequency band while reducing signal loss.
  • FIG. 8 is a drawing showing a metal (4) according to one embodiment of the present disclosure. It should be understood that the present disclosure contemplates and includes all combinations of the features and/or embodiments disclosed with respect to FIG. 8. That is, all combinations of the features described below with respect to FIG. 8 should be considered to be included in the present disclosure as specific examples.
  • the metal (4) may include a second metal region (42), a first conductive pattern (810), and/or a second conductive pattern (820).
  • the second metal region (42) of the metal (4) may be included in the second portion (312) of the support (31) (see FIG. 5).
  • the first conductive pattern (810) and the second conductive pattern (820) of the metal (4) may extend from the second metal region (42).
  • the first conductive pattern (810) and the second conductive pattern (820) may be included in the first portion (311) of the support (31) (see FIG. 5).
  • the first conductive pattern (810) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and may be operated as a first antenna radiator.
  • the second conductive pattern (820) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and may be operated as a second antenna radiator.
  • the first conductive pattern (810) may include a first partial conductive pattern (811) and a second partial conductive pattern (812).
  • the first partial conductive pattern (811) may extend from the first metal region (41) and may be positioned corresponding to a first side portion (2221) (see FIG. 2) of the case (22).
  • the second partial conductive pattern (812) may extend from the first partial conductive pattern (811) and may be positioned corresponding to a first corner (2225) (see FIG. 2) of the case (22).
  • the second partial conductive pattern (812) may include a curve corresponding to the first corner (2225) (see FIG. 2) of the case (22).
  • the second partial conductive pattern (812) of the first conductive pattern (810) may be further extended corresponding to the third side portion (2223) of the case (22) (see FIG. 2).
  • the second conductive pattern (820) may include a third partial conductive pattern (821) and a fourth partial conductive pattern (822).
  • the third partial conductive pattern (821) may extend from the first metal region (41) and may be positioned corresponding to the first side portion (2221) of the case (22) (see FIG. 2).
  • the fourth partial conductive pattern (822) may extend from the third partial conductive pattern (821) and may be positioned corresponding to the second corner (2226) of the case (22) (see FIG. 2).
  • the fourth partial conductive pattern (822) may include a curve corresponding to the second corner (2226) of the case (22) (see FIG. 2).
  • the fourth portion of the conductive pattern (822) of the second conductive pattern (820) may be further extended to correspond to the fourth side portion (2224) (see FIG. 2) of the case (22).
  • the second metal region (42) of the metal (4) may include a first partial metal region (421), a second partial metal region (422), and/or a third partial metal region (423).
  • the first partial metal region (421) may be a region connecting a first conductive pattern (810) and a third partial metal region (423) of the metal (4).
  • the first conductive pattern (810) may extend from the first partial metal region (421).
  • the second partial metal region (422) may be a region connecting a second conductive pattern (820) and a third partial metal region (423) of the metal (4).
  • the second conductive pattern (820) may extend from the second partial metal region (422).
  • the second metal region (42) of the metal (4) may include a non-metal region (424) between the first partial metal region (421), the second partial metal region (422), and the third partial metal region (423).
  • the first partial metal region (421) and the second partial metal region (422) may be positioned spaced apart from each other with the non-metal region (424) therebetween.
  • the non-metal region (424) of the second metal region (42) may overlap the fourth camera module (244) when viewed from above the front side (20A) (see FIG. 2) of the second exemplary electronic device (2).
  • FIG. 9 is a perspective view of a portion of a fourth exemplary electronic device (9) according to an embodiment of the present disclosure.
  • FIG. 10 illustrates a radiation pattern (1000) of the fourth exemplary electronic device (9) of FIG. 9 according to an embodiment of the present disclosure.
  • the second metal region (42) may be located at least partially between the first printed circuit board (920) and the rear portion (221) of the case (22) (see FIG. 2).
  • the second metal region (42) may be included in the second portion (312) of the support (31) (see FIG. 5).
  • the conductive pattern (910) can extend from the second metal region (42).
  • the conductive pattern (910) can be included in the first portion (311) of the support (31) (see FIG. 5).
  • the conductive pattern (910) can include a third partial conductive pattern (911) (e.g., the third partial conductive pattern (821) of FIG. 8), a fourth partial conductive pattern (912) (e.g., the fourth partial conductive pattern (822) of FIG. 8), and/or a fifth partial conductive pattern (913).
  • the third partial conductive pattern (911) can be positioned corresponding to a portion of the first side portion (2221) of the case (22).
  • the fourth partial conductive pattern (912) may extend from the third partial conductive pattern (911) and may be positioned corresponding to the second corner (2226) of the case (22).
  • the fifth partial conductive pattern (913) may extend from the fourth partial conductive pattern (912) and may be positioned corresponding to a portion of the fourth side portion (2224) of the case (22).
  • a first flexible conductor (931) and a second flexible conductor (932) can be disposed on a first printed circuit board (920).
  • the first flexible conductor (931) and the second flexible conductor (932) can be in physical contact with the conductive pattern (910).
  • the conductive pattern (910) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a first printed circuit board (920) via one of the first flexible conductors (931) and the second flexible conductors (932).
  • the conductive pattern (910) may be electrically connected to a first ground region (G1) included in the first printed circuit board (920) via the other of the first flexible conductors (931) and the second flexible conductors (932).
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1
  • a wireless communication module e.g., a wireless communication module (192) of FIG. 1
  • the conductive pattern (910) can form a radiated pattern (1000).
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1
  • a wireless communication module e.g., a wireless communication module (192) of FIG. 1
  • an electromagnetic signal or, a wireless signal, an RF signal, or a radiated current
  • FIG. 11 is a cross-sectional view of a portion of a second exemplary electronic device (2) taken along line A-A' of FIG. 2, according to one embodiment of the present disclosure. It should be understood that the present disclosure encompasses and includes all combinations of the features and/or embodiments disclosed with respect to FIG. 11. That is, all combinations of the features described below with respect to FIG. 11 should be considered to be included in the present disclosure as specific examples.
  • the second exemplary electronic device (2) may include a front cover (21), a case (22), a support (31), an adhesive member (34), a sealing member (35), a display module (230), a first printed circuit board (361), and/or a flexible conductor (39).
  • the case (22) may include a rear portion (221) and a side portion (222).
  • the support (31) may include a metal (4) and a non-metal (5).
  • the support (31) may include a first portion (311) and a second portion (312) provided through a combination of the metal (4) and the non-metal (5).
  • the metal (4) of the support (31) may include a first metal region (41) included in a first portion (311) of the support (31) and a second metal region (42) included in a second portion (312) of the support (31).
  • the nonmetal (5) of the support (31) may include a first nonmetal region (51) included in the first portion (311) of the support (31) and a second nonmetal region (52) included in the second portion (312) of the support (31).
  • the second metal region (42) of the metal (4) may include a first conductive portion (1110) and a second conductive portion (1120) that are physically separated from each other.
  • the first conductive portion (1110) of the second metal region (42) may be located at least partially between the display module (230) (or front cover (21)) and the rear portion (221) of the case (22).
  • the second conductive portion (1120) of the second metal region (42) may be located at least partially between the display module (230) (or front cover (21)) and the rear portion (221) of the case (22).
  • the second conductive portion (1120) of the second metal region (42) may overlap the front cover (21) when viewed from above the front (20A) or the rear (20B) of the second exemplary electronic device (2), and may not overlap the display module (230).
  • the second conductive portion (1120) of the second metal region (42) may be positioned closer to the first side portion (2221) of the case (22) than the first conductive portion (1110) of the second metal region (42).
  • the first metal region (41) may extend from the second conductive portion (1120).
  • the second metal region (42) of the metal (4) includes a first conductive portion (1110) and a second conductive portion (1120) that are separated from each other, which can reduce the electromagnetic influence that the second metal region (42) of the metal (4) has on the first metal region (41) configured to substantially operate as an antenna radiator, thereby reducing degradation of antenna radiation performance.
  • the flexible conductor (39) may be disposed on the first printed circuit board (710).
  • the first metal region (41) of the support (31) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first printed circuit board (710) through the flexible conductor (39).
  • the second conductive portion (1120) of the first metal region (41) and the second metal region (42) may receive (or be powered by) an electromagnetic signal (or, a wireless signal, an RF signal, or a radiated current) from the wireless communication circuit and may operate as an antenna radiator.
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1 provides (or supplies) an electromagnetic signal (or, a wireless signal, an RF signal, or a radiation current) to the first metal region (41)
  • the second conductive portion (1120) of the second metal region (42) may be spaced apart from the display module (230) to reduce electromagnetic influence (e.g., electromagnetic coupling) between the display module (230) and the second conductive portion (1120) of the second metal region (42) to secure antenna radiation performance.
  • the second conductive portion (1120) of the second metal region (42) may not overlap with the display module (230) when viewed from above on the front (20A) or the rear (20B) of the second exemplary electronic device (2).
  • the second conductive portion (1120) of the second metal region (42) may be omitted.
  • the first metal region (41) may operate as an antenna radiator.
  • FIG. 12 is a perspective view of a portion of a fifth exemplary electronic device (12) according to an embodiment of the present disclosure.
  • FIG. 13 is a graph showing resonance characteristics (e.g., reflection coefficient) of the fifth exemplary electronic device (12) of FIG. 12 according to an embodiment of the present disclosure.
  • FIG. 14 shows a radiation pattern (1400) of the fifth exemplary electronic device (12) of FIG. 12 according to an embodiment of the present disclosure.
  • the fifth exemplary electronic device (12) may include a case (22), a second metal region (42), a conductive pattern (1210), and/or a first printed circuit board (1220) (e.g., the first printed circuit board (361) of FIG. 5 ).
  • the second metal region (42) and the conductive pattern (1210) may be included in the metal (4) of the support (31) (see FIG. 3).
  • the second metal region (42) may be included in the second portion (312) of the support (31) (see FIG. 3).
  • the conductive pattern (1210) may be included in the first portion (311) of the support (31) (see FIG. 3).
  • the second metal region (42) may be located at least partially between the first printed circuit board (1220) and the rear surface (221) of the case (22) (see FIG. 2).
  • the challenge pattern (1210) may be positioned corresponding to a portion of the fourth side portion (2222) of the case (22).
  • the conductive pattern (1210) can be physically separated from the second metal region (42).
  • the conductive pattern (1210) and the second metal region (42) can be physically separated.
  • the conductive pattern (1210) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on a first printed circuit board (1220) to operate as an antenna radiator.
  • a power supply point on the conductive pattern (1210) may be electrically connected to the wireless communication circuit via a first flexible conductor (not shown separately) disposed between the first printed circuit board (1220) and the conductive pattern (1210).
  • a ground point on the conductive pattern (1210) may be electrically connected to a first ground region (G1) included in the first printed circuit board (1220) via a second flexible conductor (not shown separately) disposed between the first printed circuit board (1220) and the conductive pattern (1210).
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1 provides (or supplies) an electromagnetic signal (or, a radio signal, an RF signal, or a radiated current) to a conductive pattern (1210), and transmits and/or receives the signal in a selected or designated frequency band having a center frequency (or resonant frequency) of about 2.4 GHz through the conductive pattern (1210).
  • a radiation pattern (1400) can be formed through the conductive pattern (1210) to smoothly transmit and receive a signal in the selected or designated frequency band.
  • the shape or position of the conductive pattern (1210), the position or number of feeding points for the conductive pattern (1210), and the position or number of grounding points for the conductive pattern (1210) may vary, although not shown separately.
  • FIG. 15 is a perspective view of a portion of a sixth exemplary electronic device (15) according to an embodiment of the present disclosure.
  • FIG. 16 is a graph showing resonance characteristics (e.g., reflection coefficient) of the sixth exemplary electronic device (15) of FIG. 15 according to an embodiment of the present disclosure.
  • FIG. 17 shows a radiation pattern (1700) of the sixth exemplary electronic device (15) of FIG. 15 according to an embodiment of the present disclosure.
  • the second metal region (42) and the conductive pattern (1210) may be included in the metal (4) of the support (31) (see FIG. 3).
  • the second metal region (42) may be included in the second portion (312) of the support (31) (see FIG. 3).
  • the conductive pattern (1510) may be included in the first portion (311) of the support (31) (see FIG. 3).
  • the support (31) may include a first portion (311) and a second portion (312).
  • the first portion (311) of the support (31) may be coupled with a side portion (222) (see FIG. 5) of the case (22).
  • the first portion (311) of the support (31) may include a first face (511) coupled with a front cover (21) (see FIG. 5) via an adhesive member (34) (see FIG. 5).
  • the first portion (311) of the support (31) may include a second face (512) indirectly contacting a rear portion (221) (see FIG. 5) of the case (22) via a sealing member (35) (see FIG. 5).
  • the second part (312) of the support (31) is surrounded laterally by the first part (311) of the support (31) and can be positioned between the front cover (21) (see FIG. 5) and the rear part (221) of the case (22) (see FIG. 5).
  • the metal (4) of the support (31) may include a first metal region (41), a second metal region (42), and/or a third metal region (43).
  • the first metal region (41) may be included in a first portion (311) of the support (31).
  • the second metal region (42) may be included in a second portion (312) of the support (31).
  • the third metal region (43) may be included in the first portion (311) of the support (31).
  • the third metal region (43) of the metal (4) can be coupled with the first metal region (41) of the metal (4).
  • the first metal region (41) and the third metal region (43) can be electrically and physically connected.
  • the third metal region (43) of the metal (4) can be joined to the first metal region (41) of the metal (4) through welding.
  • the third metal region (43) of the metal (4) can enhance the rigidity of the support (31) (or the seventh exemplary electronic device (18)).
  • the flexible conductor (39) may be disposed on the first printed circuit board (710).
  • the first metal region (41) of the support (31) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first printed circuit board (710) through the flexible conductor (39).
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1
  • the first metal region (41) and the third metal region (43), which are electrically and physically connected, can receive (or be powered by) an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) from a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and operate as an antenna radiator.
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1
  • the support (31) may include a metal (4) and a non-metal (5).
  • the metal (4) can include a first metal region (41), a second metal region (42), and/or a third metal region (43).
  • the combination of the first metal region (41) and the third metal region (43) of the metal (4) and a portion of the non-metal (5) can provide (or form) a first portion (311) of the support (31) (see FIG. 19).
  • the combination of the second metal region (42) of the metal (4) and a portion of the non-metal (5) can provide (or form) a second portion (312) of the support (31) (see FIG. 19).
  • the first metal region (41) of the metal (4) may include a first partial region (411) (e.g., the third partial conductive pattern (821) of FIG. 8), a second partial region (412) (e.g., the fourth partial conductive pattern (822) of FIG. 8), and/or a third partial region (413) (e.g., the fifth partial conductive pattern (913) of FIG. 9).
  • the first partial region (411) may be positioned corresponding to a portion of a first side portion (2221) (see FIG. 9) of the case (22).
  • the second partial region (412) may extend from the first partial region (411) and be positioned corresponding to a second corner (2226) (see FIG. 9) of the case (22).
  • the third partial region (413) extends from the second partial region (412) and can be positioned corresponding to a part of the fourth side portion (2224) (see FIG. 9) of the case (22).
  • the third metal region (43) can be electrically and physically connected to the first metal region (41).
  • the third metal region (43) can be electrically and physically connected to the first metal region (41), for example, through welding.
  • the third metal region (43) may be positioned corresponding to the first side portion (2221) of the case (22) (see FIG. 9). Although not illustrated separately, the position or shape of the third metal region (43) is not limited to the illustrated example and may vary. In various embodiments, the third metal region (43) may further extend to the second corner (2226) of the case (22) (see FIG. 9). In various embodiments, the third metal region (43) may further extend to the fourth side portion (2224) of the case (22) (see FIG. 9).
  • the first metal region (41) may be electrically connected to a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) disposed on the first printed circuit board (2110) via a first flexible conductor (2121) disposed between the first metal region (41) and the first printed circuit board (2110).
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1
  • a first flexible conductor (2121) disposed between the first metal region (41) and the first printed circuit board (2110).
  • the first metal region (41) can be electrically connected to a first ground region (G1) included in the first printed circuit board (2110) via a second flexible conductor (2122) disposed between the first metal region (41) and the first printed circuit board (2110).
  • the second metal region (42) of the metal (4) can be electrically connected to the first ground region (G1) of the first printed circuit board (710).
  • the first ground region (G1) of the first printed circuit board (710) can be electrically connected to the second metal region (42) via, for example, a conductive member (e.g., a conductive adhesive material or a flexible conductor) disposed between the first printed circuit board (710) and the second metal region (42).
  • a conductive member e.g., a conductive adhesive material or a flexible conductor
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1) disposed on a first printed circuit board (2110) provides (or supplies) an electromagnetic signal (or, a wireless signal, an RF signal, or a radiation current) to a first metal region (41) of a metal (4) through a first flexible conductor (2121)
  • a radiation pattern (2300) can be formed that can substantially smoothly transmit and/or receive a signal in a selected or designated frequency band (e.g., about 0.7 GHz to about 0.95 GHz) through the first metal region (41) and the third metal region (43) that are electrically and physically connected to each other.
  • the third metal region (43) may be implemented to further include a bent portion, as indicated by reference numeral '1901', for changing the physical length (e.g., extension), changing the electrical length of the signal path when powering up (e.g., expansion), and/or improving the rigidity of the support (31).
  • the position or shape of the third metal region (43) is not limited to the illustrated example and may vary.
  • FIG. 24 is a cross-sectional view of a portion of a ninth exemplary electronic device (24), according to various embodiments of the present disclosure.
  • FIG. 25 is a cross-sectional view of a portion of a tenth exemplary electronic device (25), according to various embodiments of the present disclosure. It should be understood that the present disclosure contemplates and includes all combinations of the features and/or embodiments disclosed with respect to FIGS. 24 and 25 . That is, all combinations of the features described below with respect to FIGS. 24 and 25 should be considered to be included in the present disclosure as specific examples.
  • the ninth exemplary electronic device (24) and/or the tenth exemplary electronic device (25) may include a support (31), a first printed circuit board (361), and/or a flexible conductor (39).
  • the support (31) may include a first portion (311) and a second portion (312).
  • the first portion (311) of the support (31) may be coupled with a side portion (222) (see FIG. 5) of the case (22).
  • the first portion (311) of the support (31) may include a first face (511) coupled with a front cover (21) (see FIG. 5) via an adhesive member (34) (see FIG. 5).
  • the first portion (311) of the support (31) may include a second face (512) indirectly contacting a rear portion (221) (see FIG. 5) of the case (22) via a sealing member (35) (see FIG. 5).
  • the second part (312) of the support (31) is surrounded laterally by the first part (311) of the support (31) and can be positioned between the front cover (21) (see FIG. 5) and the rear part (221) of the case (22) (see FIG. 5).
  • the support (31) may include a metal (4) and a non-metal (5).
  • the first portion (311) and the second portion (312) of the support (31) may be provided (or formed) by a combination of the metal (4) and the non-metal (5).
  • the metal (4) of the support (31) can include a first metal region (41), a second metal region (42), and/or a third metal region (43).
  • the first metal region (41) can be included in a first portion (311) of the support (31).
  • the second metal region (42) can be included in a second portion (312) of the support (31).
  • the third metal region (43) can extend from the first portion (311) of the support (31) to the second portion (312) of the support (31).
  • the third metal region (43) may include a first region (2401) included in a first portion (311) of the support (31), and a second region (2402) extended from the first region (2401) and included in a second portion (312) of the support (31).
  • the second region (2402) of the third metal region (43) may be positioned between the second metal region (42) and the front cover (21) (see FIG. 5), and may be electrically and physically connected to the second metal region (42) through welding.
  • the first region (2401) of the third metal region (43) may be extended in a curved manner from the second region (2402) of the third metal region (43).
  • the first metal region (41) can be extended and bent in a direction from the second metal region (42) toward the rear portion (221) of the case (22) (see FIG. 5), and the first region (2401) of the third metal region (43) can be extended and bent in a direction from the second region (2402) of the third metal region (43) toward the front cover (21) (see FIG. 5).
  • the third metal region (43) may include a first region (2501) included in a first portion (311) of the support (31), and a second region (2502) extended from the first region (2501) and included in a second portion (312) of the support (31).
  • the second region (2502) of the third metal region (43) may be positioned between the second metal region (42) and the front cover (21) (see FIG. 5), and may be electrically and physically connected to the second metal region (42) through welding.
  • the first region (2501) of the third metal region (43) may be extended in a curved manner from the second region (2502) of the third metal region (43).
  • the first metal region (41) can be extended and bent in a direction from the second metal region (42) toward the rear portion (221) of the case (22) (see FIG. 5).
  • the first region (2501) of the third metal region (43) can be extended and bent in a direction from the second region (2502) of the third metal region (43) toward the rear portion (221) of the case (22) (see FIG. 5).
  • the first region (2501) of the third metal region (43) can be extended between the first metal region (41) and the side portion (222) of the case (22) (see FIG. 5).
  • the first metal region (41) and the third metal region (43), which are electrically and physically connected, can receive (or be powered by) an electromagnetic signal (or a radio signal, an RF signal, or a radiated current) from a wireless communication circuit (e.g., a wireless communication module (192) of FIG. 1) and operate as an antenna radiator.
  • a wireless communication circuit e.g., a wireless communication module (192) of FIG. 1

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  • Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Un dispositif électronique selon un exemple de mode de réalisation de la présente divulgation est fourni. Le dispositif électronique comprend : un couvercle avant formant au moins une partie d'une surface avant du dispositif électronique ; un boîtier comprenant une partie de surface arrière formant au moins une partie d'une surface arrière du dispositif électronique et une partie de surface latérale formant au moins une partie d'une surface latérale du dispositif électronique ; un corps de support positionné entre le couvercle avant et le boîtier et comprenant une première partie et une seconde partie, la première partie étant située entre la seconde partie et la partie de surface latérale et étant reliée à la partie de surface latérale ; un métal comprenant une première région métallique disposée dans la première partie et une seconde région métallique disposée dans la seconde partie, le métal étant formé par traitement à la presse ; un circuit de communication sans fil configuré pour transmettre un signal dans une bande de fréquence spécifiée à travers la première région métallique ; et un élément d'étanchéité disposé entre la première partie et la partie de surface arrière pour empêcher un écoulement de fluide entre la première partie et la partie de surface arrière.
PCT/KR2024/006795 2023-06-07 2024-05-20 Dispositif électronique comprenant une antenne Ceased WO2024253359A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR20230073165 2023-06-07
KR10-2023-0073165 2023-06-07
KR10-2023-0105681 2023-08-11
KR1020230105681A KR20240174021A (ko) 2023-06-07 2023-08-11 안테나를 포함하는 전자 장치

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WO2024253359A1 true WO2024253359A1 (fr) 2024-12-12

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WO (1) WO2024253359A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112490628A (zh) * 2020-11-30 2021-03-12 维沃移动通信有限公司 电子设备
KR20220110036A (ko) * 2021-01-29 2022-08-05 삼성전자주식회사 하우징을 포함하는 전자 장치
KR20230003763A (ko) * 2021-06-30 2023-01-06 삼성전자주식회사 안테나를 포함하는 전자 장치
KR20230022497A (ko) * 2021-08-09 2023-02-16 삼성전자주식회사 안테나를 포함하는 전자 장치 및 상기 전자 장치의 제조 방법
KR20230076605A (ko) * 2021-11-24 2023-05-31 삼성전자주식회사 메탈 안테나를 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112490628A (zh) * 2020-11-30 2021-03-12 维沃移动通信有限公司 电子设备
KR20220110036A (ko) * 2021-01-29 2022-08-05 삼성전자주식회사 하우징을 포함하는 전자 장치
KR20230003763A (ko) * 2021-06-30 2023-01-06 삼성전자주식회사 안테나를 포함하는 전자 장치
KR20230022497A (ko) * 2021-08-09 2023-02-16 삼성전자주식회사 안테나를 포함하는 전자 장치 및 상기 전자 장치의 제조 방법
KR20230076605A (ko) * 2021-11-24 2023-05-31 삼성전자주식회사 메탈 안테나를 포함하는 전자 장치

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