WO2024253364A1 - Dispositif électronique comprenant un interposeur - Google Patents

Dispositif électronique comprenant un interposeur Download PDF

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Publication number
WO2024253364A1
WO2024253364A1 PCT/KR2024/007000 KR2024007000W WO2024253364A1 WO 2024253364 A1 WO2024253364 A1 WO 2024253364A1 KR 2024007000 W KR2024007000 W KR 2024007000W WO 2024253364 A1 WO2024253364 A1 WO 2024253364A1
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WO
WIPO (PCT)
Prior art keywords
printed circuit
circuit board
interposer
electronic device
guide member
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
PCT/KR2024/007000
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English (en)
Korean (ko)
Inventor
최종훈
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020230096707A external-priority patent/KR20240173573A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Publication of WO2024253364A1 publication Critical patent/WO2024253364A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits

Definitions

  • Various embodiments disclosed in this document relate to an electronic device including an interposer.
  • Electronic devices are becoming increasingly slimmer and are being developed in the direction of increasing the rigidity of electronic devices. For example, it may be important for electronic devices to have a robust structure that can ensure effective electrical connection between electronic components placed inside and maintain electrical connection between electronic components even under external impact.
  • An electronic device may include at least one electronic component arranged in an internal space.
  • the at least one electronic component may be electrically connected to each other to perform a function of the electronic device.
  • the electronic component may include at least two printed circuit boards arranged in an internal space of the electronic device.
  • Each printed circuit board may be arranged in a manner of being stacked on top of each other to secure an efficient mounting space, and may be electrically connected to each other by an interposer arranged therebetween.
  • each printed circuit board may include a plurality of conductive terminals, and the two printed circuit boards may be electrically connected by physically contacting a plurality of corresponding conductive terminals arranged on corresponding surfaces of the interposer.
  • a substrate structure including a plurality of printed circuit boards and an interposer may be arranged adjacent to a side of a housing in terms of the arrangement structure of an electronic device. At least one of the plurality of printed circuit boards may be formed to protrude toward one side (e.g., a side) of the housing with respect to the interposer or another printed circuit board, thereby supporting the substrate structure with respect to the housing. However, when an external impact is applied to the electronic device, a portion of the plurality of printed circuit boards that protrudes toward one side of the housing may be damaged due to a concentrated external force.
  • an electronic device includes a housing including a front surface, a back surface opposite the front surface, and a side surface surrounding a space between the front surface and the back surface, a first printed circuit board disposed in the housing and including a first conductive terminal, a second printed circuit board disposed parallel to the first printed circuit board and including a second conductive terminal, an interposer disposed between the first printed circuit board and the second printed circuit board and including a first conductive pad connected to the first conductive terminal and a second conductive pad connected to the second conductive terminal, and a guide member disposed on one surface of the interposer, wherein the guide member can further protrude with respect to one end of the first printed circuit board and one end of the second printed circuit board.
  • An electronic device includes a housing including a front surface, a back surface opposite the front surface, and a side surface surrounding a space between the front surface and the back surface, a first printed circuit board disposed in the housing and including a first conductive terminal, a second printed circuit board disposed parallel to the first printed circuit board and including a second conductive terminal, an interposer disposed between the first printed circuit board and the second printed circuit board and including a first conductive pad connected to the first conductive terminal and a second conductive pad connected to the second conductive terminal, and a guide member including a first support portion disposed on one surface of the interposer and a second support portion bent from the first support portion and disposed on one surface of the second printed circuit board on which the second conductive terminal is disposed, wherein one of one end of the first printed circuit board and one end of the second printed circuit board may further protrude with respect to the other of the one end of the first printed circuit board and the one end of the second printed circuit board and the guide member.
  • a guide member may be arranged on one side of an interposer.
  • the guide member may further protrude toward one side (e.g., a side) of a housing with respect to a plurality of printed circuit boards, thereby supporting a substrate structure including a plurality of printed circuit boards and the interposer with respect to the housing. Since the guide member is formed of a material having a certain level of rigidity, even if an external impact of an electronic device is applied and the housing and the guide member collide, the guide member may not be damaged.
  • a separate hole for inserting a heat dissipation member can be formed in the guide member. Accordingly, the area on which electronic components can be placed can be expanded since a plurality of printed circuit boards do not have holes formed for inserting a heat dissipation member.
  • FIG. 1 is a block diagram of an electronic device within a network environment according to one embodiment of the present disclosure.
  • FIG. 2A is a perspective view of a front side of an electronic device according to one embodiment of the present disclosure.
  • FIG. 2b is a perspective view of the rear surface of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.
  • FIG. 4 is a configuration diagram of a first printed circuit board, a second printed circuit board, and electronic components according to one embodiment of the present disclosure.
  • FIG. 5a is a perspective view of an interposer according to one embodiment of the present disclosure.
  • FIG. 5b is a cross-sectional view illustrating a configuration and bonding state between an interposer and printed circuit boards according to one embodiment of the present disclosure.
  • FIG. 6 is a perspective view of a laminated structure of a first printed circuit board, an interposer, and a second printed circuit board according to one embodiment of the present disclosure.
  • FIG. 7a is a perspective view of a guide member according to one embodiment of the present disclosure.
  • FIGS. 7b and 7c are drawings explaining the combination of the guide member and the interposer of FIG. 7a.
  • FIG. 7d is a drawing illustrating a conductive plate electrically connecting a conductive pad of an interposer and a guide member.
  • FIG. 8a is a cross-sectional view taken along line A-A of FIG. 6 with the guide member of FIG. 7a coupled to the interposer.
  • FIG. 8b is a drawing showing a state in which a first printed circuit board, an interposer, and a second printed circuit board are laminated as viewed in the -X direction of FIG. 8a.
  • Fig. 9a is a perspective view of a guide member different from that of Fig. 7a.
  • Figure 9b is a drawing explaining the combination of the guide member and the interposer of Figure 9a.
  • FIG. 10a is a cross-sectional view taken along line A-A of FIG. 6 with the guide member of FIG. 9a coupled to the interposer.
  • FIG. 10b is a drawing showing a state in which a first printed circuit board, an interposer, and a second printed circuit board are laminated as viewed in the -X direction of FIG. 10a.
  • FIG. 11a is a cross-sectional view of an embodiment in which a guide member different from that of FIGS. 7a and 9a is arranged on an interposer, a first printed circuit board, and a second printed circuit board.
  • FIG. 11b is a drawing showing a state in which a first printed circuit board, an interposer, and a second printed circuit board are laminated as viewed in the -X direction of FIG. 11a.
  • FIGS. 12A and 12B are drawings explaining an embodiment in which a plurality of printed circuit boards and a plurality of interposers are stacked.
  • phrases “A or B”, “at least one of A and B”, “or at least one of B,” “A, B, or C,” “at least one of A, B, and C,” and “at least one of B, or C” can each include any one of the items listed together in that phrase, or all possible combinations thereof.
  • Terms such as “first”, “second”, or “first” or “second” may be used merely to distinguish the corresponding component from other corresponding components, and do not limit the corresponding components in any other respect (e.g., importance or order).
  • a component e.g., a first
  • another component e.g., a second
  • the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.
  • FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.
  • the electronic device (101) may communicate with the electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with the electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network).
  • the electronic device (101) may communicate with the electronic device (104) via the server (108).
  • the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197).
  • the electronic device (101) may omit at least one of these components (e.g., the connection terminal (178)), or may have one or more other components added.
  • some of these components e.g., the sensor module (176), the camera module (180), or the antenna module (197) may be integrated into one component (e.g., the display module (160)).
  • the processor (120) may control at least one other component (e.g., a hardware or software component) of an electronic device (101) connected to the processor (120) by executing, for example, software (e.g., a program (140)), and may perform various data processing or calculations.
  • the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store result data in a nonvolatile memory (134).
  • the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or an auxiliary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor) that can operate independently or together with the main processor (121).
  • a main processor (121) e.g., a central processing unit or an application processor
  • an auxiliary processor (123) e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor
  • the auxiliary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function.
  • the auxiliary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
  • the auxiliary processor (123) may control at least a portion of functions or states associated with at least one of the components of the electronic device (101) (e.g., the display module (160), the sensor module (176), or the communication module (190)), for example, while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state.
  • the auxiliary processor (123) e.g., an image signal processor or a communication processor
  • the auxiliary processor (123) may include a hardware structure specialized for processing artificial intelligence models.
  • the artificial intelligence models may be generated through machine learning. Such learning may be performed, for example, in the electronic device (101) on which artificial intelligence is performed, or may be performed through a separate server (e.g., server (108)).
  • the learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above.
  • the artificial intelligence model may include a plurality of artificial neural network layers.
  • the artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above.
  • the artificial intelligence model may additionally or alternatively include a software structure.
  • the memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101).
  • the data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto.
  • the memory (130) can include volatile memory (132) or nonvolatile memory (134).
  • the program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).
  • the input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101).
  • the input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
  • the audio output module (155) can output an audio signal to the outside of the electronic device (101).
  • the audio output module (155) can include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes such as multimedia playback or recording playback.
  • the receiver can be used to receive an incoming call. According to one embodiment, the receiver can be implemented separately from the speaker or as a part thereof.
  • the display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101).
  • the display module (160) can include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device.
  • the display module (160) can include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can obtain sound through an input module (150), or output sound through an audio output module (155), or an external electronic device (e.g., an electronic device (102)) (e.g., a speaker or a headphone) directly or wirelessly connected to the electronic device (101).
  • an electronic device e.g., an electronic device (102)
  • a speaker or a headphone directly or wirelessly connected to the electronic device (101).
  • the sensor module (176) can detect an operating state (e.g., power or temperature) of the electronic device (101) or an external environmental state (e.g., user state) and generate an electric signal or data value corresponding to the detected state.
  • the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)).
  • the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., the electronic device (102)).
  • the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
  • the haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that a user can perceive through a tactile or kinesthetic sense.
  • the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module (180) can capture still images and moving images.
  • the camera module (180) can include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module (188) can manage power supplied to the electronic device (101).
  • the power management module (188) can be implemented as, for example, at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • the battery (189) can power at least one component of the electronic device (101).
  • the battery (189) can include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module (190) may support establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., the electronic device (102), the electronic device (104), or the server (108)), and performance of communication through the established communication channel.
  • the communication module (190) may operate independently from the processor (120) (e.g., the application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module or a power line communication module).
  • a wireless communication module (192) e.g., a cellular communication module, a short-range wireless communication module, or a GNSS (global navigation satellite system) communication module
  • a wired communication module (194) e.g., a local area network (LAN) communication module or a power line communication module.
  • a corresponding communication module may communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)).
  • a first network (198) e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network (199) e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)
  • a computer network e.g.,
  • the wireless communication module (192) may use subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196) to identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199).
  • subscriber information e.g., an international mobile subscriber identity (IMSI)
  • IMSI international mobile subscriber identity
  • the wireless communication module (192) can support a 5G network and next-generation communication technology after a 4G network, for example, NR access technology (new radio access technology).
  • the NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), terminal power minimization and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate.
  • a high-frequency band e.g., mmWave band
  • the wireless communication module (192) may support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module (192) may support various requirements specified in an electronic device (101), an external electronic device (e.g., an electronic device (104)), or a network system (e.g., a second network (199)).
  • the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip) for URLLC realization.
  • a peak data rate e.g., 20 Gbps or more
  • a loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 0.5 ms or less for downlink (DL) and uplink (UL) each, or 1 ms or less for round trip
  • the antenna module (197) can transmit or receive signals or power to or from the outside (e.g., an external electronic device).
  • the antenna module (197) can include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (e.g., a PCB).
  • the antenna module (197) can include a plurality of antennas (e.g., an array antenna).
  • at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199) can be selected from the plurality of antennas by, for example, the communication module (190).
  • a signal or power can be transmitted or received between the communication module (190) and the external electronic device through the selected at least one antenna.
  • another component e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module (197) may form a mmWave antenna module.
  • the mmWave antenna module may include a printed circuit board, an RFIC positioned on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) positioned on or adjacent a second side (e.g., a top side or a side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.
  • a first side e.g., a bottom side
  • a plurality of antennas e.g., an array antenna
  • peripheral devices e.g., a bus, a general purpose input and output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)
  • GPIO general purpose input and output
  • SPI serial peripheral interface
  • MIPI mobile industry processor interface
  • commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199).
  • Each of the external electronic devices (102, or 104) may be the same or a different type of device as the electronic device (101).
  • all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of executing the function or service itself or in addition, request one or more external electronic devices to perform at least a part of the function or service.
  • One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101).
  • the electronic device (101) may provide the result, as is or additionally processed, as at least a part of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example.
  • the external electronic device (104) may include an IoT (Internet of Things) device.
  • the server (108) may be an intelligent server using machine learning and/or a neural network.
  • the external electronic device (104) or the server (108) may be included in the second network (199).
  • the electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • FIG. 2A is a perspective view of a front side of an electronic device according to an embodiment of the present disclosure.
  • FIG. 2B is a perspective view of a rear side of the electronic device of FIG. 2A according to an embodiment of the present disclosure.
  • the electronic device (200) described below may include at least one of the components of the electronic device (101) described above in FIG. 1.
  • an electronic device (200) may include a housing (210) including a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) surrounding a space between the first side (210A) and the second side (210B).
  • the housing may refer to a structure forming a portion of the first side (210A), the second side (210B), and the side surface (210C) of FIG. 2A .
  • the first side (210A) may be formed by a front plate (202) that is at least partially substantially transparent (e.g., a glass plate or a polymer plate including various coating layers).
  • the second side (210B) may be formed by a substantially opaque back plate (211).
  • the back plate (211) may be formed of, for example, a coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials.
  • the side (210C) may be formed by a side bezel structure (218) (or “side member”) that is coupled with the front plate (202) and the back plate (211) and comprises a metal and/or polymer.
  • the back plate (211) and the side bezel structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).
  • the front plate (202) can include a first region (210D) that extends seamlessly from the first surface (210A) toward the rear plate, at both ends of a long edge of the front plate.
  • the rear plate (211) can include a second region (210E) that extends seamlessly from the second surface (210B) toward the front plate, at both ends of a long edge.
  • the front plate (202) or the rear plate (211) can include only one of the first region (210D) or the second region (210E).
  • the front plate (202) may not include the first region and the second region, but may only include a flat plane that is arranged parallel to the second surface (210B).
  • the side bezel structure (218) when viewed from the side of the electronic device, may have a first thickness (or width) on the side that does not include the first region (210D) or the second region (210E), and may have a second thickness that is thinner than the first thickness on the side that includes the first region (210D) or the second region (210E).
  • the electronic device (200) may include at least one of a display (201), an input device (203), an audio output device (207, 214), a sensor module (204, 219), a camera module (205, 212), a key input device (217), an indicator (not shown), and a connector (208).
  • the electronic device (200) may omit at least one of the components (e.g., the key input device (217) or the indicator) or may additionally include other components.
  • the display (201) may be visually exposed, for example, through a significant portion of the front plate (202). In some embodiments, at least a portion of the display (201) may be exposed through the front plate (202) forming the first side (210A) and the first region (210D) of the side (210C).
  • the display (201) may be coupled to or adjacent to a touch sensing circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer detecting a magnetic field type stylus pen.
  • at least a portion of the sensor modules (204, 219), and/or at least a portion of the key input device (217) may be disposed in the first region (210D), and/or the second region (210E).
  • the input device (203) may include a microphone (203). In some embodiments, the input device (203) may include a plurality of microphones (203) arranged to detect the direction of sound.
  • the audio output device (207, 214) may include speakers (207, 214).
  • the speakers (207, 214) may include an external speaker (207) and a call receiver (214).
  • the microphone (203), the speakers (207, 214), and the connector (208) may be arranged at least partially in the internal space of the electronic device (200) and may be exposed to the external environment through at least one hole formed in the housing (210). In some embodiments, the hole formed in the housing (210) may be used jointly for the microphone (203) and the speakers (207, 214).
  • the audio output device (207, 214) may include a speaker (e.g., a piezo speaker) that operates without the hole formed in the housing (210).
  • the sensor module (204, 219) can generate an electric signal or data value corresponding to an internal operating state of the electronic device (200) or an external environmental state.
  • the sensor module (204, 219) can include, for example, a first sensor module (204) (e.g., a proximity sensor) and/or a second sensor module (not shown) (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and/or a third sensor module (219) (e.g., an HRM sensor) disposed on a second surface (210B) of the housing (210).
  • the fingerprint sensor can be disposed on the first surface (210A) of the housing (210) (e.g., a home key button), a portion of the second surface (210B), and/or below the display (201).
  • the electronic device (200) may further include at least one of a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.
  • a sensor module not shown, for example, a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, a proximity sensor, or an illuminance sensor.
  • the camera modules (205, 212) may include a first camera module (205) disposed on a first side (210A) of the electronic device (200), a second camera module (212) disposed on a second side (210B), and/or a flash (213).
  • the camera modules (205, 212) may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash (213) may include, for example, a light emitting diode or a xenon lamp.
  • two or more lenses (a wide-angle lens, an ultra-wide-angle lens, or a telephoto lens) and image sensors may be disposed on one side of the electronic device (200).
  • the key input device (217) may be positioned on a side surface (210C) of the housing (210).
  • the electronic device (200) may not include some or all of the above-mentioned key input devices (217), and the key input devices (217) that are not included may be implemented in other forms, such as soft keys, on the display (201).
  • the key input device (217) may be implemented using a pressure sensor included in the display (201).
  • the indicator may be disposed, for example, on the first side (210A) of the housing (210).
  • the indicator may provide, for example, status information of the electronic device (200) in the form of light (e.g., a light-emitting element).
  • the light-emitting element may provide, for example, a light source that is linked to the operation of the camera module (205).
  • the indicator may include, for example, an LED, an IR LED, and/or a xenon lamp.
  • the connector hole (208) may include a first connector hole (208) that can accommodate a connector (e.g., a universal serial bus (USB) connector) for transmitting and receiving power and/or data with an external electronic device, and/or a second connector hole (or earphone jack) (not shown) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.
  • a connector e.g., a universal serial bus (USB) connector
  • USB universal serial bus
  • the camera modules (205, 212), some of the sensor modules (204, 219), or the indicator may be arranged to be visually exposed through the display (201).
  • the camera module (205), the sensor module (204), or the indicator may be arranged to be in contact with the external environment through an opening or a transparent area perforated from the internal space of the electronic device (200) to the front plate (202) of the display (201).
  • an area where the display (201) and the camera module (205) face each other may be formed as a transparent area having a certain transmittance as part of an area where content is displayed.
  • the transparent area may be formed to have a transmittance in a range of about 5% to about 20%.
  • Such a transparent area may include an area that overlaps with an effective area (e.g., a field of view area) of the camera module (205) through which light passes to be imaged by the image sensor to create an image.
  • the transparent area of the display (201) may include an area having a lower pixel density than the surrounding area.
  • the transparent area may replace the opening.
  • the camera module (205) may include an under display camera (UDC).
  • UDC under display camera
  • some of the sensor modules (204) may be arranged to perform their functions without being visually exposed through the front plate (202) in the internal space of the electronic device.
  • the area of the display (201) that faces the sensor module may not require a perforated opening.
  • the electronic device (200) has a bar type or plate type appearance, but the present invention is not limited thereto.
  • the illustrated electronic device (200) may be a part of a foldable electronic device, a slidable electronic device, a stretchable electronic device, and/or a rollable electronic device.
  • the terms "foldable electronic device”, “slidable electronic device”, “stretchable electronic device” and/or “rollable electronic device” may refer to an electronic device in which a display (e.g., a display (330) of FIG.
  • 3) is capable of bending deformation, such that at least a portion thereof is folded, wound or rolled, at least a portion thereof is expanded, and/or the display can be housed inside a housing (e.g., a housing (210) of FIGS. 2A and 2B).
  • the foldable electronic device, the slidable electronic device, the stretchable electronic device and/or the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a wider area of the display to the outside, depending on the needs of the user.
  • FIG. 3 is an exploded perspective view of the electronic device of FIG. 2a, according to one embodiment of the present disclosure.
  • the electronic device (300) of FIG. 3 may be at least partially similar to the electronic device (200) of FIGS. 2A and 2B, or may include other embodiments of the electronic device.
  • an electronic device (300) may include a side member (310) (e.g., a side bezel structure), a first support member (311) (e.g., a bracket or a support structure), a front plate (320) (e.g., a front cover), a display (330) (e.g., the display (201) of FIG.
  • a side member (310) e.g., a side bezel structure
  • a first support member e.g., a bracket or a support structure
  • a front plate (320) e.g., a front cover
  • a display (330) e.g., the display (201) of FIG.
  • the electronic device (300) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (300) may be identical to or similar to at least one of the components of the electronic device (200) of FIG. 2A or FIG. 2B, and any redundant description will be omitted below.
  • the first support member (311) may be disposed inside the electronic device (300) and connected to the side member (310), or may be formed integrally with the side member (310).
  • the first support member (311) may be formed of, for example, a metal material and/or a non-metallic (e.g., polymer) material.
  • the first support member (311) may have a display (330) coupled to one surface and a substrate (340) coupled to the other surface.
  • a processor, a memory, and/or an interface may be mounted on the substrate (340).
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphic processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the memory may include, for example, volatile memory or non-volatile memory.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • the interface may electrically or physically connect the electronic device (300) to an external electronic device, for example, and may include a USB connector, an SD card/MMC connector, or an audio connector.
  • the battery (350) is a device for supplying power to at least one component of the electronic device (300), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the substrate (340).
  • the battery (350) may be integrally disposed within the electronic device (300). In one embodiment, the battery (350) may be disposed to be detachable from the electronic device (300).
  • the antenna (370) may be positioned between the rear plate (380) and the battery (350).
  • the antenna (370) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna (370) may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.
  • the antenna structure may be formed by a part or a combination of the side bezel structure (310) and/or the first support member (311).
  • FIG. 4 is a configuration diagram of an electronic device to which an interposer is applied according to various embodiments of the present invention.
  • the electronic device (400) of FIG. 4 may be at least partially similar to the electronic device (100) of FIGS. 1 and 2 or the electronic device (300) of FIG. 3, or may include other embodiments of the electronic device.
  • the electronic device (400) may include a housing structure (e.g., the housing (210) of FIG. 2A) including a front cover (481) (e.g., the front plate (320) of FIG. 3), a rear cover (480) facing in an opposite direction to the front cover (481) (e.g., the rear plate (380) of FIG. 3), and a side member (410) (e.g., the side member (310) of FIG. 3) surrounding a space between the front cover (481) and the rear cover (480).
  • the electronic device (400) may include a first support member (411) (e.g., the first support member (311) of FIG.
  • the first support member (411) may be disposed to extend from the side member (410) into the internal space. In another embodiment, the first support member (411) may be provided separately in the internal space of the electronic device (400). According to one embodiment, the first support member (411) may extend from the side member (410) and at least a portion thereof may be formed of a conductive material. According to one embodiment, the electronic device (400) may include a camera structure ([P) arranged in the space between the front cover (481) and the rear cover (480).
  • the electronic device (400) may include a pair of printed circuit boards (420, 430) positioned between a first support member (411) and a rear cover (480) in an internal space.
  • the pair of printed circuit boards (420, 430) may be positioned such that at least a portion of the front cover (481) overlaps when viewed from above.
  • the pair of printed circuit boards (420, 430) may include a first printed circuit board (420) (e.g., a main board) positioned between the first support member (411) and the rear cover (480), and a second printed circuit board (430) (e.g., a sub board) positioned between the first printed circuit board (420) and the rear cover (480).
  • the electronic device (400) may include an interposer (440) interposed between a first printed circuit board (420) and a second printed circuit board (430).
  • the interposer (440) may include a plurality of conductive pads and may electrically connect the two printed circuit boards (420, 430) by physically contacting conductive terminals disposed on the two printed circuit boards (420, 430) through pre-solder.
  • the interposer (440) may be preferentially disposed on the first printed circuit board (420) through pre-solder applied to the first conductive pad.
  • the interposer (440) may be preferentially disposed on the second printed circuit board (430) through pre-solder applied to the second conductive pad.
  • the electronic device (400) may include a second support member (450) disposed between the second printed circuit board (430) and the rear cover (480).
  • the second support member (450) may be disposed at a position at least partially overlapping the second printed circuit board (430).
  • the second support member (450) may include a metal plate.
  • the first printed circuit board (420), the interposer (440), and the second printed circuit board (430) may be fixed to the first support member (411) through the second support member (450) disposed thereon.
  • the second support member (450) may be fixed to the first support member (411) through a fastening member such as a screw, thereby firmly supporting an electrical connection between the first printed circuit board (420), the interposer (440), and the second printed circuit board (430).
  • a fastening member such as a screw
  • FIG. 5a is a perspective view of an interposer according to various embodiments of the present invention.
  • FIG. 5b is a partial cross-sectional view illustrating the configuration and bonding state between an interposer and printed circuit boards according to various embodiments of the present invention.
  • the interposer (440) may include a dielectric substrate (441) including a first surface (4401) facing in a first direction (1 direction) (e.g., + Z direction of FIG. 5A) and a second surface (4402) facing in a direction (2 direction) opposite to the first surface (4401) (e.g., - Z direction of FIG. 5A).
  • the interposer (440) may include a plurality of conductive pads (442, 443) (e.g., first conductive pad (442) and second conductive pad (443) of FIG. 5B) that are arranged at regular or irregular intervals on the first surface (4401) and the second surface (4402) and are exposed to the outside.
  • the plurality of conductive pads (442, 443) may have different sizes and may be arranged at regular or irregular intervals. For example, at least one conductive pad connected to the ground among the plurality of conductive pads (442, 443) may be formed larger than at least one conductive pad used for signal transmission. According to one embodiment, the plurality of conductive pads (442, 443) may be electrically connected through a conductive post (e.g., a conductive post (444) of FIG. 5B) (e.g., a conductive via) that penetrates from the first surface (4401) to the second surface (4402) of the dielectric substrate (441).
  • a conductive post e.g., a conductive post (444) of FIG. 5B
  • a conductive via e.g., a conductive via
  • the interposer (440) can include at least one screw fastening portion (4411) that is at least partially disposed.
  • the interposer (440) can be secured to at least one support structure (e.g., the first support member (411) and/or the second support member (450) of FIG. 4) disposed inside an electronic device (e.g., the electronic device (400) of FIG. 4) via the screw fastening portion (4411).
  • the interposer (440) may have a shape substantially identical to at least one of the first printed circuit board (e.g., the first printed circuit board (420) of FIG. 4) or the second printed circuit board (e.g., the second printed circuit board (430) of FIG. 4)) and may include a first opening (4404) formed in the center.
  • the interposer (440) may be formed in a loop shape including the first opening (4404).
  • the interposer (440) may be formed in a shape at least partially different from at least one of the first printed circuit board (e.g., the first printed circuit board (420) of FIG. 4) or the second printed circuit board (e.g., the second printed circuit board (430) of FIG. 4).
  • the first opening (4404) can be utilized as an accommodation space for accommodating electronic components (e.g., various electrical components (e.g., electrical components (P) of FIG. 8A) or shield cans) arranged on at least one of the two printed circuit boards (420, 430).
  • electronic components e.g., various electrical components (e.g., electrical components (P) of FIG. 8A) or shield cans
  • shield cans arranged on at least one of the two printed circuit boards (420, 430).
  • an electronic device may include a first printed circuit board (420) disposed in an internal space and including a plurality of first conductive terminals (421), a second printed circuit board (430) disposed substantially parallel to the first printed circuit board (420) and including a second plurality of conductive terminals (431), and an interposer (440) disposed between the first printed circuit board (420) and the second printed circuit board (430) to electrically connect the first printed circuit board (420) and the second printed circuit board (430).
  • a first printed circuit board (420) disposed in an internal space and including a plurality of first conductive terminals (421)
  • a second printed circuit board (430) disposed substantially parallel to the first printed circuit board (420) and including a second plurality of conductive terminals (431)
  • an interposer (440) disposed between the first printed circuit board (420) and the second printed circuit board (430) to electrically connect the first printed circuit board (420) and the second printed circuit board (430).
  • the interposer (440) may include a dielectric substrate (441) having a first side (4401) facing a first printed circuit board (420) (e.g., a main board) and a second side (4402) facing in an opposite direction from the first side (4401) and facing a second printed circuit board (430) (e.g., a sub board).
  • the interposer (440) may include a first conductive pad (442) disposed on the first side (4401) of the dielectric substrate (4401) to face a first conductive terminal (421) disposed on one side of the first printed circuit board (420).
  • the interposer (440) may include a second conductive pad (443) disposed on a second side (4402) of the dielectric substrate (441) so as to face a second conductive terminal (431) disposed on one side of the second printed circuit board (430).
  • the first conductive pad (442) and the second conductive pad (443) can be electrically connected via a conductive post (444) (e.g., a conductive via) positioned to penetrate from the first surface (4401) to the second surface (4402) of the dielectric substrate (441).
  • the interposer (440) can include a pre-solder (PS) positioned such that the first conductive pad (442) is electrically and physically connected to the first conductive terminal (421) of the first printed circuit board (420) and the second conductive pad (443) is electrically and physically connected to the second conductive terminal (431).
  • PS pre-solder
  • the pre-solder (PS) can connect the respective terminals to each other through a reflow process when the first printed circuit board (420) and the second printed circuit board (430) are connected to the interposer (440).
  • the reflow process may be a process for soldering to a substrate (e.g., the first printed circuit board (420) or the second printed circuit board (430)) by supplying solder in advance to a land of the substrate (e.g., the first printed circuit board (420) or the second printed circuit board (430)) and melting the solder with an external heat source to connect the land.
  • the soldering process is not limited to reflow soldering, and various methods such as flow soldering other than reflow soldering may be used.
  • the interposer (440) may include a second opening (501).
  • the second opening (501) of the interposer (440) may be an area from which a portion of the interposer (440) has been removed.
  • the second opening (501) of the interposer (440) may be formed on one side of the interposer (440) formed in a loop shape and may be connected to a first opening (4404) located inside the loop formed by the interposer (440).
  • the guide member (510) to be described below may be placed on one side of the interposer (440) to cover the second opening (501).
  • the coupling relationship between the interposer (440) and the guide member (510) will be described in detail below.
  • FIG. 6 is a perspective view of a laminated structure of a first printed circuit board, an interposer, and a second printed circuit board according to an embodiment of the present disclosure.
  • FIG. 7a is a perspective view of a guide member according to an embodiment of the present disclosure.
  • FIGS. 7b and 7c are drawings explaining the coupling of the guide member and the interposer of FIG. 7a.
  • FIG. 7d is a drawing explaining a conductive plate electrically connecting a conductive pad of the interposer and the guide member.
  • FIG. 8a is a cross-sectional view taken along the line A-A of FIG. 6 in a state where the guide member of FIG. 7a is coupled with the interposer.
  • FIG. 8b is a drawing showing a state in which the first printed circuit board, the interposer, and the second printed circuit board are laminated as seen in the -X direction of FIG.
  • an interposer (440) may be disposed between a first printed circuit board (420) and a second printed circuit board (430) to electrically connect the first printed circuit board (420) and the second printed circuit board (430).
  • a first conductive terminal (421) of the first printed circuit board (420) may be electrically connected to a first conductive pad (442) of the interposer (440) through a pre-solder (PS).
  • a second conductive terminal (431) of the second printed circuit board (430) may be electrically connected to a second conductive pad (443) of the interposer (440) through a pre-solder (PS).
  • PS pre-solder
  • the interposer (440) may include a first surface (4401) facing a first conductive terminal (421) disposed on one surface of a first printed circuit board (420) (e.g., a first surface (4401) of a dielectric substrate (4401)), a second surface (4402) facing a second conductive terminal (431) disposed on one surface of a second printed circuit board (430) (e.g., a second surface (4402) of a dielectric substrate (4401) (4402)), and a third surface (4403) surrounding a space between the first surface (4401) and the second surface (4402).
  • a first surface (4401) facing a first conductive terminal (421) disposed on one surface of a first printed circuit board (420) e.g., a first surface (4401) of a dielectric substrate (4401)
  • a second surface (4402) facing a second conductive terminal (431) disposed on one surface of a second printed circuit board (430) e.g., a second surface (4402) of a
  • the guide member (510) may be disposed on the third side (4403) of the interposer (440) to face a mechanism adjacent to the first printed circuit board (420) and the second printed circuit board (430).
  • the guide member (510) may face one side of a support member (e.g., the first support member (411) of FIG. 4 ) adjacent to the first printed circuit board (420) and the second printed circuit board (430) and/or a side surface (210C) of the housing (210).
  • the guide member (510) may face a side surface member (410) disposed in the housing (210) (e.g., the side surface member (310) of FIG. 3 ).
  • the guide member (510) faces the side surface (210C) of the housing (210).
  • the guide member (510) may face one side of the support member (e.g., the first support member (411)), the bracket, or the side member (410) on which the first printed circuit board (420) and the second printed circuit board (430) are placed.
  • the guide member (510) may be disposed on the third side (4403) of the interposer (440) to protrude further than the first printed circuit board (420) disposed on the first side (4401) of the interposer (440) and the second printed circuit board (430) disposed on the second side (4402) of the interposer (440).
  • the guide member (510) may protrude in the ⁇ X direction with respect to FIG. 6 toward a mechanism (e.g., a support member, a bracket, a housing (210)) on which the first printed circuit board (420) and the second printed circuit board (430) are disposed.
  • the guide member (510) may be formed of a material having a certain level of rigidity.
  • the guide member (510) may be formed of a metal material having a certain level of rigidity and electrical conductivity, such as aluminum (Al), iron (Fe), or copper (Cu). Accordingly, when an external impact (e.g., dropping) is applied to the electronic device (400), the guide member (510) may come into contact with the side surface (210C) of the housing (210) or the support member (e.g., the first support member (411) of FIG. 4) to alleviate the impact applied to the laminated structure of the first printed circuit board (420) - interposer (440) - second printed circuit board (430).
  • a metal material having a certain level of rigidity and electrical conductivity such as aluminum (Al), iron (Fe), or copper (Cu). Accordingly, when an external impact (e.g., dropping) is applied to the electronic device (400), the guide member (510) may come into contact with the side surface (210C) of the housing (210) or the support member (e.g., the first support member (411) of FIG. 4) to alleviate
  • the first printed circuit board (420) and the second printed circuit board (430) on which a plurality of electronic components (P) are arranged may generate heat.
  • a heat dissipation member may be arranged between the first printed circuit board (420) and the second printed circuit board (430).
  • the heat dissipation member may be a thermal interface material (TIM) having excellent heat conduction efficiency, and may also mean various thermally conductive materials having excellent heat conductivity.
  • TIM thermal interface material
  • an insertion hole (e.g., an insertion hole (514) of FIG. 7A, an insertion hole (614) of FIG. 9A) into which a liquid heat dissipation material (not shown) can be injected may be formed in at least one of the first printed circuit board (420), the second printed circuit board (430), and the interposer (440). In one embodiment, an insertion hole into which a liquid heat dissipation material can be injected may be formed in a third surface (4403) of the interposer (440).
  • a guide material (510) may be arranged in the third surface (4403) of the interposer (440), and separately, an insertion hole into which a heat dissipation material is injected may be formed in a portion where the guide material (510) is not arranged.
  • a nozzle (N) connected to a device including a heat dissipation member can be inserted into the insertion hole to emit the heat dissipation member between the first printed circuit board (420) and the second printed circuit board (430). Accordingly, the heat dissipation member can be filled between the first printed circuit board (420) and the second printed circuit board (430).
  • a separate flexible member e.g., a flexible member (540) of FIG. 8B
  • a flexible member (540) covering the insertion hole can be placed on a third surface (4403) of the interposer (440).
  • the flexible member (540) may include a plurality of cutting portions (541).
  • the flexible member (540) may allow the nozzle (N) to be inserted into the first opening (4404) of the interposer (440) by bending the plurality of cutting portions (541) in the insertion direction of the nozzle (N), and may block the insertion hole of the interposer (440) while the nozzle (N) is not inserted.
  • the interposer (440) may include a second opening (501), which is a space into which a nozzle (N) for emitting a heat dissipation member is inserted.
  • the second opening (501) may be a space formed by removing at least a portion of the interposer (440).
  • the guide member (510) may be disposed on the third surface (4403) of the interposer (440) to cover at least a portion of the second opening (501).
  • the guide member (510) may include an insertion hole (514) connected to the second opening (501). In one embodiment, the insertion hole (514) may be formed to have a smaller size than the second opening (501).
  • the size of the insertion hole (514) may be formed such that the heat dissipation material filled between the first printed circuit board (420) and the second printed circuit board (430) does not flow out of the interposer (440). Accordingly, as will be described later, the heat dissipation material filled between the first printed circuit board (420) and the second printed circuit board (430) can be prevented from being released out of the interposer (440) through the insertion hole (514).
  • the second opening (501) may be a hole formed in the third surface (4403) of the interposer (440).
  • the second opening (501) of the interposer (440) and the insertion hole (514) of the guide member (510) may be formed to have substantially the same size.
  • the insertion hole (514) of the guide member (510) may be formed to have a smaller size than the second opening (501) of the interposer (440). Accordingly, as will be described later, it is possible to prevent the heat dissipation member filled between the first printed circuit board (420) and the second printed circuit board (430) from being released to the outside of the interposer (440) through the insertion hole (514).
  • the guide member (510) may include a body (511) disposed on one surface (e.g., the third surface (4403)) of the interposer (440), a first cut portion (512) bent relative to the body (511) to face the first printed circuit board (420), and a second cut portion (513) bent relative to the body (511) to face the second printed circuit board (430).
  • a second opening (501) may be formed in the body (511) of the guide member (510).
  • the first section (512) of the guide member (510) may be positioned at least partially in the second opening (501) of the interposer (440) to contact the first conductive terminal (421) of the first printed circuit board (420).
  • the second section (513) of the guide member (510) may be positioned at least partially in the second opening (501) of the interposer (440) to contact the second conductive terminal (431) of the second printed circuit board (430). Accordingly, the guide member (510) may electrically connect the first printed circuit board (420) and the second printed circuit board (430).
  • the guide member (510) can be secured to the third face (4403) of the interposer (440) in various ways. In one embodiment, referring to FIGS. 7b and 7c, the guide member (510) can be secured to the interposer (440) via an adhesive member (530) disposed between the body (511) and the third face (4403) of the interposer (440).
  • the adhesive member (530) may be formed of a conductive material and may serve as a passage for transmitting a signal transmitted from the first printed circuit board (420) or the second printed circuit board (430) to the guide member (510).
  • the adhesive member (530) may be in contact with the first conductive pad (442) and the second conductive pad (443) of the interposer (440). Accordingly, an electrical signal generated from the first printed circuit board (420) may be transmitted to the second printed circuit board (430) via the interposer (440) - the adhesive member (530) - the guide member (510).
  • an electrical signal generated from the second printed circuit board (430) may be transmitted to the first printed circuit board (420) via the interposer (440) - the adhesive member (530) - the guide member (510).
  • a conductive plate formed of a conductive material may be disposed on the first side (4401) and/or the second side (4402) of the interposer (440).
  • the conductive plate may include a first conductive plate (521) disposed on the first side (4401) of the interposer (440) and a second conductive plate (not shown) disposed on the second side (4402).
  • the first conductive plate (521) may be disposed on the first side (4401) of the interposer (440) to cover the first section (512) of the guide member (510).
  • the second conductive plate may be disposed on the second side (4402) of the interposer (440) to cover the second section (513) of the guide member (510). Accordingly, the conductive plates can be placed on the first side (4401) and the second side (4402) of the interposer (440) to secure the guide member (510) to the interposer (440).
  • the conductive plate can electrically connect the first printed circuit board (420) - the guide member (510) - the second printed circuit board (430).
  • the first conductive plate (521) can be in contact with at least one of the first conductive terminal (421) of the first printed circuit board (420) and the first conductive pad (442) of the interposer (440).
  • the second conductive plate can be in contact with at least one of the second conductive terminal (431) of the second printed circuit board (430) and the second conductive pad (443) of the interposer (440).
  • a conductive path can be formed that connects the first printed circuit board (420) - the first conductive plate (521) - the guide member (510) - the second conductive plate - the second printed circuit board (430).
  • an electrical signal transmitted from the first printed circuit board (420) to the interposer (440) may be transmitted to the second printed circuit board (430) through the first conductive plate (521) - the guide member (510) - the second conductive plate.
  • an electrical signal transmitted from the second printed circuit board (430) to the interposer (440) may be transmitted to the first printed circuit board (420) through the second conductive plate - the guide member (510) - the first conductive plate (521). Accordingly, the first printed circuit board (420) and the second printed circuit board (430) can be electrically connected through the guide member (510) and the conductive plate.
  • the guide member (510) may include an insertion hole (514) connected to the second opening (501) of the interposer (440).
  • the insertion hole (514) may be formed in the body (511) of the guide member (510) located on the third surface (4403) of the interposer (440).
  • the insertion hole (514) may guide the nozzle (N) so that the nozzle (N) may be inserted into the second opening (501) of the interposer (440).
  • the nozzle (N) may sequentially discharge the heat dissipation member between the first printed circuit board (420) and the second printed circuit board (430) through the insertion hole (514) of the guide member (510) and the second opening (501) of the interposer (440).
  • a flexible member (540) covering an insertion hole (514) may be arranged on the guide member (510).
  • the flexible member (540) may be arranged on a body (511) of the guide member (510).
  • the flexible member (540) may be arranged on a back surface of the guide member (510) (e.g., a surface facing the + X direction with respect to FIG. 8A).
  • the flexible member (540) may be arranged on a front surface of the guide member (510) (e.g., a surface facing the - X direction with respect to FIG. 8A).
  • the flexible member (540) may have a plurality of cut portions (541) that can be bent in the insertion direction of the nozzle (N) (e.g., + X direction with reference to FIG. 8A) when a nozzle (N) emitting a heat dissipation member is inserted into the insertion hole (514) to allow the nozzle (N) to be inserted into the first opening (4404) of the interposer (440), and block the insertion hole (514) while the nozzle (N) is not inserted.
  • a nozzle (N) emitting a heat dissipation member is inserted into the insertion hole (514) to allow the nozzle (N) to be inserted into the first opening (4404) of the interposer (440), and block the insertion hole (514) while the nozzle (N) is not inserted.
  • the interposer (440) may include an opening other than the second opening (501).
  • the interposer (440) may include a third opening (not shown) (e.g., an inspection hole) for inspecting whether a liquid heat dissipation member is inserted between the first printed circuit board (420) and the second printed circuit board (430).
  • the third opening may be formed in the interposer (440) so as to face the second opening (501) through which a nozzle (N) for emitting the heat dissipation member is inserted.
  • the interposer (440) may include a fourth opening (e.g., a vent hole) (not shown) for dissipating heat transferred from the first printed circuit board (420) and the second printed circuit board (430) to the heat dissipation member.
  • a fourth opening e.g., a vent hole
  • Fig. 9a is a perspective view of a guide member different from Fig. 7a.
  • Fig. 9b is a drawing explaining the combination of the guide member of Fig. 9a and the interposer.
  • Fig. 10a is a cross-sectional view taken along the line A-A of Fig. 6, showing the guide member of Fig. 9a combined with the interposer.
  • Fig. 10b is a drawing showing the first printed circuit board, the interposer, and the second printed circuit board stacked in the -X direction of Fig. 10a.
  • the guide member (610) (e.g., the guide member (510) of FIG. 7A) may be formed of a conductive material to electrically connect the first printed circuit board (420) and the second printed circuit board (430).
  • the guide member (610) may include a body (611) disposed on one surface (e.g., the third surface (4403)) of the interposer (440), a first cut portion (612) bent relative to the body (611) to face the first printed circuit board (420), and a second cut portion (613) bent relative to the body (611) to face the second printed circuit board (430).
  • a body (611) disposed on one surface (e.g., the third surface (4403)) of the interposer (440), a first cut portion (612) bent relative to the body (611) to face the first printed circuit board (420), and a second cut portion (613) bent relative to the body (611) to face the second printed circuit board (430).
  • the first section (612) may be positioned at least partially between the first printed circuit board (420) and the interposer (440).
  • the second section (613) may be positioned at least partially between the second printed circuit board (430) and the interposer (440).
  • the guide member (610) may protrude from a first printed circuit board (420) disposed on a first surface (4401) of the interposer (440) and a second printed circuit board (430) disposed on a second surface (4402) of the interposer (440) such that at least a portion (e.g., the body (611)) of the guide member (610) is disposed on the third surface (4403) of the interposer (440).
  • the body (611) of the guide member (610) may protrude in the ⁇ X direction with respect to one end of the first printed circuit board (420) and one end of the second printed circuit board (430) with respect to FIG.
  • the body (611) of the guide member (610) comes into contact with the mechanism (e.g., the first support member (411) and/or the housing (210)) on which the first printed circuit board (420) and the second printed circuit board (430) are placed, thereby alleviating the impact applied to the laminated structure of the first printed circuit board (420) - interposer (440) - second printed circuit board (430).
  • the guide member (610) can be secured to the interposer (440), the first printed circuit board (420), the second printed circuit board (430), and the interposer (440) in various ways.
  • the guide member (610) can be secured to the interposer (440) via an adhesive member disposed between the body (611) and the third side (4403) of the interposer (440).
  • the first printed circuit board (420) can include a first mounting groove (not shown) in which the first cut portion (612) of the guide member (610) can be secured.
  • the second printed circuit board (430) can include a second mounting groove (not shown) in which the second cut portion (613) of the guide member (610) can be secured.
  • the first cut portion (612) and the second cut portion (613) of the guide member (610) may be positioned between the printed circuit board (420, 430) and the interposer (440).
  • the first cut portion (612) may be in contact with at least one of the first conductive terminal (421) of the first printed circuit board (420) and the first conductive pad (442) of the interposer (440).
  • the second cut portion (613) may be in contact with at least one of the second conductive terminal (431) of the second printed circuit board (430) and the second conductive pad (443) of the interposer (440).
  • the guide member (610) can electrically connect the first printed circuit board (420) and the second printed circuit board (430) as the first cut portion (612) comes into contact with the first conductive terminal (421) and/or the first conductive pad (442) and the second cut portion (613) comes into contact with the second conductive terminal (431) and/or the second conductive pad (443).
  • a conductive path connecting the first printed circuit board (420) - the guide member (610) - the second printed circuit board (430) can be formed.
  • an electrical signal transmitted from the first printed circuit board (420) to the interposer (440) can be transmitted to the second printed circuit board (430) through the first section (612) of the guide member (610) - the body (611) of the guide member (610) - the second section (613) of the guide member (610).
  • an electrical signal transmitted from the second printed circuit board (430) to the interposer (440) can be transmitted to the first printed circuit board (420) through the second section (613) of the guide member (610) - the body (611) of the guide member (610) - the first section (612) of the guide member (610). Accordingly, the first printed circuit board (420) and the second printed circuit board (430) can be electrically connected through the guide member (610).
  • the guide member (610) may include an insertion hole (614) connected to the second opening (501) of the interposer (440), as illustrated in FIGS. 9A and 9B and FIG. 10A.
  • the insertion hole (614) may be formed in the body (611) of the guide member (610) located on the third surface (4403) of the interposer (440).
  • the insertion hole (614) may guide the nozzle (N) so that the nozzle (N) may be inserted into the second opening (501) of the interposer (440).
  • the nozzle (N) may sequentially discharge the heat dissipation member between the first printed circuit board (420) and the second printed circuit board (430) through the insertion hole (614) of the guide member (610) and the second opening (501) of the interposer (440).
  • the insertion hole (614) may be formed to have a smaller size than the second opening (501).
  • the size of the insertion hole (614) may be formed to such a size that the heat dissipation material filled between the first printed circuit board (420) and the second printed circuit board (430) does not flow out of the interposer (440).
  • the heat dissipation material filled between the first printed circuit board (420) and the second printed circuit board (430) may be prevented from being discharged out of the interposer (440) through the insertion hole (614).
  • the second opening (501) may be formed in a hole shape on the third surface (4403) of the interposer (440).
  • the second opening (501) of the interposer (440) and the insertion hole (614) of the guide member (610) may be formed to have substantially the same size.
  • the insertion hole (614) of the guide member (610) may be formed to have a smaller size than the second opening (501) of the interposer (440). Accordingly, the heat dissipation member filled between the first printed circuit board (420) and the second printed circuit board (430) may be prevented from being released to the outside of the interposer (440) through the insertion hole (614).
  • a flexible member (540) covering an insertion hole (614) may be disposed on the guide member (610).
  • the flexible member (540) may be disposed on a body (611) of the guide member (610).
  • the flexible member (540) may be disposed on a back surface (e.g., a surface facing the +X direction with respect to FIG. 10A) of the guide member (610).
  • the flexible member (540) may be disposed on a front surface (e.g., a surface facing the -X direction with respect to FIG. 10A) of the guide member (610).
  • the flexible member (540) may have a plurality of cut portions (e.g., cut portions (541) of FIG. 8b) that may be bent in the insertion direction of the nozzle (N) (e.g., + X direction based on FIG. 10a) when a nozzle (N) that emits a heat dissipation member is inserted into the insertion hole (614) to allow the nozzle (N) to be inserted into the first opening (4404) of the interposer (440), and may block the insertion hole (614) while the nozzle (N) is not inserted.
  • cut portions e.g., cut portions (541) of FIG. 8b
  • FIG. 11a is a cross-sectional view of an embodiment in which a guide member different from that of FIGS. 7a and 9a is arranged on an interposer, a first printed circuit board, and a second printed circuit board.
  • FIG. 11b is a drawing showing a state in which the first printed circuit board, the interposer, and the second printed circuit board are stacked as viewed in the -X direction of FIG. 11a.
  • a guide member (710) of another embodiment will be described in relation to the guide member described in FIGS. 7A to 10B (e.g., the guide member (510) of FIG. 7A, the guide member (610) of FIG. 9A).
  • the guide member (510) of FIG. 7A, the guide member (610) of FIG. 9A e.g., the guide member (510) of FIG. 7A, the guide member (610) of FIG. 9A.
  • one end of the first printed circuit board (420) and one end of the second printed circuit board (430) may further protrude toward a mechanism adjacent to the first printed circuit board (420) and the second printed circuit board (430) relative to the other.
  • one end of the first printed circuit board (420) and one end of the second printed circuit board (430) may further protrude toward a support member (e.g., the first support member (411)) on which the first printed circuit board (420) and the second printed circuit board (430) are disposed and/or a side surface (210C) of the housing (210) relative to the other.
  • a support member e.g., the first support member (411)
  • the mechanism facing one end of the first printed circuit board (420) and one end of the second printed circuit board (430) is the side surface (210C) of the housing (210), and that one end of the first printed circuit board (420) and one end of the second printed circuit board (430) protrudes toward the side surface (210C) of the housing (210) relative to the other.
  • one end of the second printed circuit board (430) may further protrude toward the side surface (210C) of the housing (210) with respect to one end of the first printed circuit board (420). In one embodiment not illustrated in the drawing, one end of the first printed circuit board (420) may further protrude toward the side surface (210C) of the housing (210) with respect to one end of the second printed circuit board (430).
  • the portion of one end of the first printed circuit board (420) and one end of the second printed circuit board (430) that protrudes toward the side surface (210C) of the housing (210) may be supported through the housing (210), thereby alleviating the impact applied to the first printed circuit board (420), the second printed circuit board (430), and the interposer (440).
  • the second printed circuit board (430) protrudes further toward the side surface (210C) of the housing (210) than one end of the first printed circuit board (420).
  • one end of the second printed circuit board (430) facing the side surface (210C) of the housing (210) may be plated with a metal material.
  • the rigidity of one end of the second printed circuit board (430) may be reinforced through the plating. Accordingly, damage that may occur when an external impact is applied to the electronic device (400) and one end of the second printed circuit board (430) comes into contact with the side surface (210C) of the housing (210) may be prevented or reduced.
  • the guide member (710) may be at least partially disposed on the first printed circuit board (420) and the second printed circuit board (430) to increase the bonding force between the first printed circuit board (420) and the second printed circuit board (430).
  • the guide member (710) may include a first support member (711) disposed on a third surface (4403) of the interposer (440), a second support member (712) bent from the first support member (711) and disposed on one surface of the second printed circuit board (430), and a third support member (713) bent from the first support member (711) and disposed on one surface of the first printed circuit board (420).
  • the second support member (712) may be coupled with a surface on which the second conductive terminal (431) of the second printed circuit board (430) is arranged.
  • the third support member (713) may be coupled with a surface on which the first conductive terminal (421) of the first printed circuit board (420) is arranged or an opposite surface. Since the second printed circuit board (430) is coupled with the first printed circuit board (420) through the guide member (710), when an external impact is applied to the electronic device (400) and one end of the second printed circuit board (430) comes into contact with the housing (210), the impact may be dispersed. In addition, since the second printed circuit board (430) is fixed to the first printed circuit board (420) through the guide member (710), even if it collides with the housing (210), a buckling or bending phenomenon may be improved or reduced.
  • the guide member (710) can be fixed to the interposer (440), the first printed circuit board (420), the second printed circuit board (430), and the interposer (440) in various ways.
  • the first support member (711) of the guide member (710) can be fixed to the third surface (4403) of the interposer (440) via an adhesive member.
  • the second support member (712) can be positioned and fixed in a second fixing groove formed on one surface of the second printed circuit board (430).
  • the third support member (713) can be positioned and fixed in a first fixing groove formed on one surface of the first printed circuit board (420).
  • the guide member (710) can electrically connect the first printed circuit board (420) and the second printed circuit board (430).
  • the second support member (712) and the third support member (713) of the guide member (710) can be disposed on the second printed circuit board (430) and the first printed circuit board (420), respectively.
  • the second support member (712) can be in contact with the second conductive terminal (431) of the second printed circuit board (430).
  • the third support member (713) can be electrically connected to the first conductive terminal (421) of the first printed circuit board (420).
  • FIG. 11A the second support member (712) and the third support member (713) of the guide member (710) can be disposed on the second printed circuit board (430) and the first printed circuit board (420), respectively.
  • the second support member (712) can be in contact with the second conductive terminal (431) of the second printed circuit board (430).
  • the third support member (713) can be electrically connected to the first conductive terminal (421) of the first printed circuit board (420).
  • the third support member (713) may be disposed on an opposite surface of the first printed circuit board (420) on which the first conductive terminal (421) is disposed, and may be electrically connected to the first printed circuit board (420). Accordingly, the guide member (710) may be used as a conductive path for transmitting an electrical signal generated in the first printed circuit board (420) to the second printed circuit board (430), or for transmitting an electrical signal generated in the second printed circuit board (430) to the first printed circuit board (420).
  • the guide member (710) may include an insertion hole (714) connected to the second opening (501) of the interposer (440).
  • the insertion hole (714) may be formed in the first support portion (711) of the guide member (710) located on the third surface (4403) of the interposer (440).
  • the insertion hole (714) may guide the nozzle (N) so that the nozzle (N) may be inserted into the second opening (501) of the interposer (440).
  • the nozzle (N) may sequentially discharge the heat dissipation member between the first printed circuit board (420) and the second printed circuit board (430) through the insertion hole (714) of the guide member (710) and the second opening (501) of the interposer (440).
  • the insertion hole (714) may be formed to have a smaller size than the second opening (501).
  • the size of the insertion hole (714) may be formed to such a size that the heat dissipation material filled between the first printed circuit board (420) and the second printed circuit board (430) does not flow out of the interposer (440). Accordingly, the heat dissipation material filled between the first printed circuit board (420) and the second printed circuit board (430) may be prevented or reduced from being discharged out of the interposer (440) through the insertion hole (714).
  • the second opening (501) may be a hole formed in the third surface (4403) of the interposer (440).
  • the second opening (501) of the interposer (440) and the insertion hole (714) of the guide member (710) may be formed to have substantially the same size.
  • the insertion hole (714) of the guide member (710) may be formed to have a smaller size than the second opening (501) of the interposer (440). Accordingly, the heat dissipation member filled between the first printed circuit board (420) and the second printed circuit board (430) may be prevented from being released to the outside of the interposer (440) through the insertion hole (714).
  • the guide member (710) may be provided with a flexible member (540) that covers the insertion hole (714).
  • the flexible member (540) may be disposed on the body of the guide member (710).
  • the flexible member (540) may be disposed on the front surface (e.g., the surface facing the -X direction with respect to FIG. 11A) of the guide member (710).
  • the flexible member (540) may be disposed on the back surface (e.g., the surface facing the +X direction with respect to FIG. 11A) of the guide member (710).
  • the flexible member (540) may have a plurality of cut portions that can be bent in the insertion direction of the nozzle (N) (e.g., +X direction with reference to FIG. 11A) when a nozzle (N) emitting a heat dissipation member is inserted into the insertion hole (714) to allow the nozzle (N) to be inserted into the first opening (4404) of the interposer (440), and block the insertion hole (714) while the nozzle (N) is not inserted.
  • the nozzle (N) e.g., +X direction with reference to FIG. 11A
  • FIGS. 12A and 12B are drawings explaining an embodiment in which a plurality of printed circuit boards and a plurality of interposers are stacked.
  • an electronic device (400) may include a structure in which a plurality of printed circuit boards (e.g., a first printed circuit board (810), a second printed circuit board (820), and a third printed circuit board (830)) and a plurality of interposers (e.g., a first interposer (840) and a second interposer (850)) are stacked.
  • a plurality of printed circuit boards e.g., a first printed circuit board (810), a second printed circuit board (820), and a third printed circuit board (830)
  • interposers e.g., a first interposer (840) and a second interposer (850)
  • a first printed circuit board (810) e.g., the first printed circuit board (420) and/or the second printed circuit board (430) of FIG. 8A
  • a first interposer (840) e.g., the interposer (440) of FIG. 8A
  • a second printed circuit board 820
  • a second interposer (850) e.g., the interposer (440) of FIG. 8A
  • a third printed circuit board (830) e.g., the first printed circuit board (420) and/or the second printed circuit board (430) of FIG.
  • the first interposer (840) may be formed in a loop shape including a first-first opening (841) (e.g., the first opening (4404) of FIG. 5a).
  • the first interposer (840) may include a first-second opening (842) formed on one side and connected to the first-first opening (841).
  • the second interposer (850) may be formed in a loop shape including a second-first opening (851) (e.g., the first opening (4404) of FIG. 5a).
  • the second interposer (850) may include a second-second opening (852) formed on one side and connected to the second-first opening (851).
  • the guide member (910) (e.g., the guide member (510) of FIG. 7A and/or the guide member (610) of FIG. 9A) may include a body (911) disposed on one surface of the first interposer (840) and one surface of the second interposer (850), a first cut portion (912) bent from the body (911) and contacting the first printed circuit board (810), and a second cut portion (913) bent from the body (911) and contacting the third printed circuit board (830).
  • the guide member (910) may be formed to further protrude toward the side surface (210C) of the housing (210) with respect to one end of the first printed circuit board (810), one end of the second printed circuit board (820), and one end of the third printed circuit board (830).
  • the guide member (910) may further protrude in the -X direction of FIG. 12A with respect to one end of the first printed circuit board (810), one end of the second printed circuit board (820), and one end of the third printed circuit board (830).
  • the guide member (910) may come into contact with the housing (210) to alleviate the impact applied to the laminated structure of the first printed circuit board (810) - the first interposer (840) - the second printed circuit board (820) - the second interposer (850) - the third printed circuit board (830).
  • the above-described guide member (910) is merely an example, and the shape of the guide member (910) may be variously modified.
  • the guide member (910) may include a first insertion hole (914) connected to the first-2 opening (842) of the first interposer (840) and a second insertion hole (915) connected to the second-2 opening (852) of the second interposer (850).
  • the first insertion hole (914) and the second insertion hole (915) may be formed in the body (911) of the guide member (910).
  • the first insertion hole (914) may guide the nozzle (N) so that the nozzle (N) may be inserted into the first-2 opening (842) of the first interposer (840).
  • the nozzle (N) can sequentially release a heat dissipation member (not shown) between the first printed circuit board (810) and the second printed circuit board (820) through the first insertion hole (914) of the guide member (910) and the first-2 opening (842) of the first interposer (840).
  • the second insertion hole (915) can guide the nozzle (N) so that the nozzle (N) can be inserted into the second-2 opening (852) of the second interposer (850).
  • the nozzle (N) can sequentially release the heat dissipation member between the second printed circuit board (820) and the third printed circuit board (830) through the second insertion hole (915) of the guide member (910) and the second-2 opening (852) of the second interposer (850).
  • a flexible member (540) may be disposed on the guide member (910) to cover the first insertion hole (914) and the second insertion hole (915).
  • the flexible member (540) may be disposed on the body (911) of the guide member (910).
  • the flexible member (540) may be disposed on the back surface of the guide member (910) (e.g., the surface facing the +X direction with respect to FIG. 12A).
  • the flexible member (540) may be disposed on the front surface of the guide member (910) (e.g., the surface facing the -X direction with respect to FIG. 12A).
  • the flexible member (540) may have a plurality of cutting portions (541) that are bent in the insertion direction of the nozzle (N) (e.g., +X direction with reference to FIG. 12A) when a nozzle (N) for emitting a heat dissipation member is inserted into the first insertion hole (914) and the second insertion hole (915), thereby allowing the nozzle (N) to be inserted into the first-2 opening (842) and the second-2 opening (852) of the first interposer (840) and the second interposer (850), and blocking the insertion holes (914, 915) while the nozzle (N) is not inserted.
  • a plurality of cutting portions (541) that are bent in the insertion direction of the nozzle (N) (e.g., +X direction with reference to FIG. 12A) when a nozzle (N) for emitting a heat dissipation member is inserted into the first insertion hole (914) and the second insertion hole (915), thereby allowing the
  • the guide member e.g., the guide member (510) of FIG. 7a, the guide member (610) of FIG. 9a, the guide member (710) of FIG. 11a, and/or the guide member (910) of FIG. 12a
  • the guide members (510, 610, 710, 910) may be formed of a material that can cushion the shock transmitted from the housing (210) as the part that first comes into contact with the housing among the first printed circuit board (420), the second printed circuit board (420), and the interposer (430) when an external shock is applied to the electronic device (400).
  • the guide members (510, 610, 710, 910) may be formed of a material having a cushioning function, such as rubber, urethane, or epoxy.
  • an electronic device (400) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, the electronic device (300) of FIG. 3) comprises: a housing (210) including a front surface (210A), a back surface (210B) opposite the front surface, and a side surface (210C) surrounding a space between the front surface and the back surface; a first printed circuit board (420) disposed in the housing and including a first conductive terminal (421); a second printed circuit board (430) disposed parallel to the first printed circuit board and including a second conductive terminal (431); an interposer (440) disposed between the first printed circuit board and the second printed circuit board and including a first conductive pad (442) connected to the first conductive terminal and a second conductive pad (443) connected to the second conductive terminal; and a guide disposed on one surface of the interposer.
  • a housing (210) including a front surface (210A), a back surface (210B) opposite the front surface, and a side
  • the guide member comprises an absence (e.g., a guide member (510) of FIG. 7a, a guide member (610) of FIG. 9a), and the guide member can further protrude with respect to one end of the first printed circuit board and one end of the second printed circuit board.
  • the interposer is formed in a loop shape including a first opening (4404), and includes a second opening (501) formed on one surface of the interposer and connected to the first opening, and the guide member includes an insertion hole (514, 614) connected to the second opening and can be arranged to cover at least a portion of the second opening.
  • the interposer may further include a heat dissipation member disposed in the first opening and in contact with the first printed circuit board and the second printed circuit board.
  • the insertion hole of the guide member may be formed to have a smaller size than the second opening of the interposer.
  • the guide member is formed of a conductive material and can electrically connect the first printed circuit board and the second printed circuit board.
  • the guide member may include a body (e.g., a body (511) of FIG. 7A, a body (611) of FIG. 9A) disposed on one surface of the interposer, a first cut portion (e.g., a first cut portion (512) of FIG. 7A, a first cut portion (612) of FIG. 9A) bent from the body to face the first printed circuit board and at least a portion of which is positioned in the second opening, and a second cut portion (e.g., a second cut portion (513) of FIG. 7A, a second cut portion (613) of FIG. 9A) bent from the body to face the second printed circuit board and at least a portion of which is positioned in the second opening.
  • a body e.g., a body (511) of FIG. 7A, a body (611) of FIG. 9A
  • a first cut portion e.g., a first cut portion (512) of FIG. 7A, a first cut portion (612) of FIG.
  • the guide member may include a body (611) disposed on one surface of the interposer, a first cut portion (612) bent from the body and at least a portion of which is disposed between the first printed circuit board and the interposer, and a second cut portion (613) bent from the body and at least a portion of which is disposed between the second printed circuit board and the interposer.
  • the guide member may be configured such that the first section may be in contact with at least one of a first conductive terminal of the first printed circuit board and a first conductive pad of the interposer, and the second section may be in contact with at least one of a second conductive terminal of the second printed circuit board and a second conductive pad of the interposer.
  • first printed circuit board may include a first mounting groove in which the first section of the guide member is mounted
  • second printed circuit board may include a second mounting groove in which the second section of the guide member is mounted
  • it may include a first conductive plate (521) formed of a conductive material and arranged between the interposer and the first printed circuit board, making contact with at least one of the first conductive pad and the first conductive terminal and covering at least a portion of the guide member, and a second conductive plate formed of a conductive material and arranged between the interposer and the second printed circuit board, making contact with at least one of the second conductive pad and the second conductive terminal and covering at least a portion of the guide member.
  • a first conductive plate formed of a conductive material and arranged between the interposer and the first printed circuit board, making contact with at least one of the first conductive pad and the first conductive terminal and covering at least a portion of the guide member
  • a second conductive plate formed of a conductive material and arranged between the interposer and the second printed circuit board, making contact with at least one of the second conductive pad and the second conductive terminal and covering at least a portion of the guide member.
  • the interposer may include a third opening formed at a position opposite to the second opening and connected to the first opening.
  • the flexible member (540) is further provided with a plurality of cutting portions arranged on one side of the guide member and covering the insertion hole, and the plurality of cutting portions (541) of the flexible member can be bent in the direction in which an external object is inserted.
  • an electronic device (400) (e.g., the electronic device (101) of FIG. 1, the electronic device (200) of FIG. 2A, the electronic device (300) of FIG. 3) comprises: a housing (210) including a front surface (210A), a back surface (210B) opposite the front surface, and a side surface (210C) surrounding a space between the front surface and the back surface; a first printed circuit board (420) disposed in the housing and including a first conductive terminal (421); a second printed circuit board (430) disposed parallel to the first printed circuit board and including a second conductive terminal (431); an interposer (440) disposed between the first printed circuit board and the second printed circuit board and including a first conductive pad (442) connected to the first conductive terminal and a second conductive pad (443) connected to the second conductive terminal; and a second conductive pad (443) disposed on one surface of the interposer.
  • a housing (210) including a front surface (210A), a back surface (210B) opposite the front
  • a guide member (710) including a first support member (711) and a second support member (712) that is bent from the first support member and arranged on one surface of the second printed circuit board on which the second conductive terminal is arranged, wherein one of one end of the first printed circuit board and one end of the second printed circuit board can further protrude relative to the other of one end of the first printed circuit board and one end of the second printed circuit board and the guide member.
  • the guide member may include a third support member (713) that is bent from the first support member and arranged on an opposite side of one side of the first printed circuit board on which the first conductive terminal is arranged.
  • the interposer is formed in a loop shape including a first opening (4404), and includes a second opening (501) formed on one surface of the interposer and connected to the first opening, and the first support portion of the guide member includes an insertion hole (714) connected to the second opening and can be arranged to cover at least a portion of the second opening.
  • the insertion hole of the guide member may be formed to have a smaller size than the second opening of the interposer.
  • the interposer may include a third opening formed at a position opposite to the second opening and connected to the first opening.
  • a flexible member (540) is further included, which is arranged on one side of the guide member and includes a plurality of cutting portions covering the insertion hole, and the plurality of cutting portions (541) of the flexible member can be bent in the direction in which an external object is inserted.
  • the guide member can electrically connect the first printed circuit board and the second printed circuit board.
  • a guide member (e.g., the guide member (510) of FIG. 7a, the guide member (610) of FIG. 9a, and/or the guide member (910) of FIG. 12a) may be disposed on one surface of an interposer (440) (e.g., the interposer (440) of FIG. 8a, the first interposer (840) of FIG. 12a, and/or the second interposer (850) of FIG. 12a).
  • the guide members (510, 610, 910) may further protrude toward the side surface (210C) of the housing (210) relative to a plurality of printed circuit boards (e.g., the first printed circuit board (420) of FIG. 8A, the second printed circuit board (430) of FIG.
  • the guide member (510, 610, 910) is formed of a material having a certain level of rigidity, even if an external impact is applied to the electronic device (400) and the housing (210) and the guide member (510, 610, 910) collide, they may not be damaged.
  • a separate hole e.g., insertion hole (514) of FIG. 7a, insertion hole (614) of FIG. 9a, insertion hole (714) of FIG. 11a, first insertion hole (914) of FIG. 12a, and/or second insertion hole (915) of FIG. 12a
  • a separate hole e.g., insertion hole (514) of FIG. 7a, insertion hole (614) of FIG. 9a, insertion hole (714) of FIG. 11a, first insertion hole (914) of FIG. 12a, and/or second insertion hole (915) of FIG. 12a

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

Selon un mode de réalisation de la présente divulgation, le dispositif électronique comprend : un boîtier comprenant une surface avant, une surface arrière opposée à la surface avant, et une surface latérale entourant un espace entre la surface avant et la surface arrière ; une première carte de circuit imprimé disposée dans le boîtier et comprenant une première borne conductrice ; une seconde carte de circuit imprimé disposée en parallèle avec la première carte de circuit imprimé et comprenant une seconde borne conductrice ; un interposeur disposé entre la première carte de circuit imprimé et la seconde carte de circuit imprimé et comprenant un premier plot conducteur connecté à la première borne conductrice et un second plot conducteur connecté à la seconde borne conductrice ; et un élément de guidage disposé sur une surface de l'interposeur, l'élément de guidage pouvant en outre faire saillie par rapport à une extrémité de la première carte de circuit imprimé et à une extrémité de la seconde carte de circuit imprimé.
PCT/KR2024/007000 2023-06-05 2024-05-23 Dispositif électronique comprenant un interposeur Ceased WO2024253364A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2023-0072153 2023-06-05
KR20230072153 2023-06-05
KR1020230096707A KR20240173573A (ko) 2023-06-05 2023-07-25 인터포저를 포함하는 전자 장치
KR10-2023-0096707 2023-07-25

Publications (1)

Publication Number Publication Date
WO2024253364A1 true WO2024253364A1 (fr) 2024-12-12

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WO (1) WO2024253364A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190029215A (ko) * 2017-09-12 2019-03-20 삼성전자주식회사 인터포저를 포함하는 전자 장치
KR20190038264A (ko) * 2017-09-29 2019-04-08 엘지전자 주식회사 이동 단말기
KR20200101018A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 인터포저를 이용한 인쇄 회로 기판 적층 구조 및 그것을 포함하는 전자 장치
WO2021172739A1 (fr) * 2020-02-26 2021-09-02 삼성전자 주식회사 Dispositif électronique comprenant une interposeur
KR20230053642A (ko) * 2020-12-21 2023-04-21 엘지전자 주식회사 기판 적층 구조체 및 인터포저 블록

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190029215A (ko) * 2017-09-12 2019-03-20 삼성전자주식회사 인터포저를 포함하는 전자 장치
KR20190038264A (ko) * 2017-09-29 2019-04-08 엘지전자 주식회사 이동 단말기
KR20200101018A (ko) * 2019-02-19 2020-08-27 삼성전자주식회사 인터포저를 이용한 인쇄 회로 기판 적층 구조 및 그것을 포함하는 전자 장치
WO2021172739A1 (fr) * 2020-02-26 2021-09-02 삼성전자 주식회사 Dispositif électronique comprenant une interposeur
KR20230053642A (ko) * 2020-12-21 2023-04-21 엘지전자 주식회사 기판 적층 구조체 및 인터포저 블록

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