WO2024253423A1 - Cutting tool comprising sequential tool bit module for forming depth grooves of high aspect ratio in film - Google Patents

Abstract

Embodiments relate to a cutting tool having a plurality of tool bits for cutting an object to be cut, the cutting tool comprising: a plurality of tool bits forming at least one sequential tool bit module, wherein each sequential tool bit module has a series of tool bits arranged sequentially in a reference direction in which the cutting tool moves to the object to be cut to carry out a cutting operation; a handle from which the plurality of tool bits protrude; and a chip discharge portion which is formed along exposed regions that are respectively in front of the series of tool bits in the same sequential tool bit module.

Description

Cutting tool including sequential bite modules for forming deep grooves in the film

Embodiments of the present application relate to a sequential bite module for forming deep grooves of high-precision equipment on a film, a cutting tool comprising the sequential bite module, and a cutting tool including the sequential bite module.

As interest in privacy and security has increased recently, the demand for security films with limited viewing angles has been steadily increasing. These security films are films with micro-grooves formed so that the light transmittance varies depending on the angle of incidence, and are also called privacy films or viewing angle-limiting films.

In general, when viewing a security film from the front, the center appears brightest and the sides appear darker. Therefore, when a security film is installed on a monitor, a user in front can freely view the information displayed on the screen, but a person on the side far from the center (e.g., more than 30° to the left/right) will only see a dark, black screen, preventing information from being leaked to others.

Figure 1 illustrates a process for manufacturing a security film according to a conventional embodiment.

According to Korean Patent Publication No. 10-2009-0083058 (published on August 3, 2009), as shown in Fig. 1, a security film is produced by transferring a concave-convex pattern onto a film using an ultraviolet-curable resin as a master mold and then injecting black ink into the concave portion of the pattern.

Figure 2 illustrates the result of a micro-groove cutting tool according to another conventional embodiment.

The conventional micro-groove cutting tool illustrated in Patent Publication No. 10-2002-0015487 (published on February 28, 2002) forms a micro-groove by first processing a base groove for installing an LED element and then processing the micro-groove inside the base groove. Therefore, a shape in which different cross-sectional shapes are overlapped, as illustrated in Fig. 2, is inevitably derived. Such a double groove is not suitable as a structure that can provide security by allowing as much information to pass through the space between the grooves as possible and blocking as much information through the grooves as possible, thereby showing information only to the user and not showing information to people around the user.

Therefore, there is a problem in that the existing byte method cannot produce a security film that requires a narrow and deep groove shape in the cross-section.

In order to solve the above-described problem, according to one aspect of the present application, there is provided a sequential bite module for forming a deep groove of high precision and a constant cross-sectional structure in a reference direction of the bite (cutting direction of the bite) on a film, so as to more easily produce a security film micro-pattern having a narrow and deep groove by a cutting operation alone, and a multi-row sequential bite cutting tool in which a plurality of sequential bite modules are arranged in a direction (column direction) orthogonal to the reference direction.

In addition, according to various embodiments of the present application, in order to produce a security film that allows the user to see information not only through the central portion of the security film but also through both side portions, thereby being comfortable to use, a cutting tool having a sequential bite module of a sequential bite module for forming a deep groove of a high-definition device and a multi-row sequential bite module formed thereof is provided.

A cutting tool including a plurality of bites for cutting a workpiece in a single operation and forming a groove according to one aspect of the present application may include a plurality of bites forming at least one sequential bite module; a shank from which the plurality of bites protrude; and a series of chip discharge portions formed along an exposed area located at a front portion of each of a series of bites in the same sequential bite module. The bites protrude in a three-dimensional structure on a surface of the shank. Each sequential bite module is a series of bites sequentially arranged along a reference direction in which the workpiece is cut by the series of bites, and the series of bites are configured such that the height of each bite gradually increases toward the rear end in the sequential bite module. The maximum height of the bite in the sequential bite module is longer than the width of the sequential bite module so that the groove formed by the sequential bite module becomes a deep groove having a depth furrow having a depth ratio of 1 or greater.

In one embodiment, the plurality of sequential byte modules may be configured to have a plurality of planar patterns having different unit patterns. The plurality of planar patterns may be respectively positioned in different areas on a plane of the cutting tool.

In one embodiment, the series of bytes, and the chip discharge portion, may be formed in an oblique direction between the parallel and orthogonal directions to the sequential byte modules.

In one embodiment, a series of bytes in each of the plurality of sequential byte modules may be formed such that the cross-sectional protrusion angles are all formed at a specific angle that is the same. The specific angle may be an angle that is not perpendicular to the plane.

In one embodiment, the plurality of sequential bite modules may be configured such that light passing through the plurality of deep grooves formed in the workpiece travels toward the same focus. The focus is located on an imaginary line extending from a central portion on a plane of the cutting tool along a bite protrusion direction. The plurality of sequential bite modules protrude at an angle that is relatively closer to the vertical with respect to a reference plane of the cutting tool the closer they are to the width central portion of the cutting tool, and protrude at an angle that is closer to the vertical with respect to the reference plane the farther they are from the width central portion of the cutting tool.

In one embodiment, a reference plane or auxiliary reference plane located on a surface of the shaft in the sequential byte module may have a non-planar cross-section, and a series of bytes in the sequential byte module may be protruded on the reference plane or auxiliary reference plane having the non-planar cross-section.

A cutting tool having a multi-row sequential bite module according to various embodiments of the present application can form a large-area deep groove array on a film with a single cutting operation. The cutting tool can be used to produce a security film micro-pattern having a deep groove of high precision in which the depth of the groove is longer than the width. In addition, in some embodiments, the cutting tool can be used to produce a security film having a reduced shaded area and enhanced security compared to a conventional security film having an orthogonal cross-sectional structure. The produced security film can be attached to the surface of a display device such as a smartphone, a laptop, or a digital door lock, or applied to a glass window of a specific space such as a house or a vehicle.

The effects obtainable from the present invention are not limited to the effects mentioned above, and other effects not mentioned will be clearly understood by those skilled in the art to which the present disclosure pertains from the description below.

Figure 1 illustrates a process for manufacturing a security film according to a conventional embodiment.

Figure 2 illustrates the result of a micro-groove cutting tool according to another conventional embodiment.

FIG. 3 is a perspective view of a cutting tool according to various embodiments of the present application.

FIG. 4 is a cross-sectional view of a sequential byte module according to various embodiments of the present application.

FIG. 5 is an exploded perspective view illustrating the positions of wires according to various embodiments of the present application.

Figure 6 is a schematic diagram of a process for removing a chip by the wire of Figure 5.

FIG. 7 is a schematic diagram of a process for forming a deep groove with a cutting tool having diagonally arranged bites according to various embodiments of the present application.

FIG. 8 is a schematic diagram of a process for forming a trench structure in a grid pattern on a workpiece using a cutting tool according to various embodiments of the present application.

FIG. 9 is a schematic diagram of a process for forming a deep groove with a cutting tool having a two-row deformation pattern of bytes according to various embodiments of the present application.

FIG. 10 is a plan view of another variation pattern of a byte including a plurality of unit patterns according to various embodiments of the present application.

FIG. 11 is a front view of an inclined cutting tool for producing a security film having an inclined deep groove (hereinafter, “inclined security film”) according to another aspect of the present application.

FIG. 12 is a schematic diagram of a process for forming an inclined deep groove in a film using an inclined cutting tool according to various embodiments of the present application.

FIG. 13 is a drawing comparing the effect of a security film produced by a second type cutting tool and the effect of a security film produced by the cutting tool of FIG. 3 according to another aspect of the present application.

FIG. 14 is a front view of a focal cutting tool for producing a security film having a focal deep groove (hereinafter, “focal security film”) according to another aspect of the present application.

FIG. 15 is a drawing comparing the effect of a security film produced by a focus-type cutting tool according to various embodiments of the present application with the effect of a security film produced by the cutting tool of FIG. 3.

FIG. 16 illustrates security films having various cross trench patterns according to various embodiments of the present application.

Fig. 17 is a schematic diagram of a cutting tool (10_4) for producing a security film (20) having a curved cross-section in an orthogonal direction according to another aspect of the present application.

FIG. 18 is a schematic diagram of a process for producing a security film using a cutting tool having a handle whose cross-section in the reference direction is curved, according to another aspect of the present application.

[Explanation of symbols]

10, 10_1, 10_2, 10_3, 10_4, 10_5: Cutting tools

100, 100_1, 100_2, 100_3, 100_4, 100_5: Sequential byte modules

110, 110_1, 110_2, 110_3, 110_4, 110_5: bytes

120, 120_1, 120_2, 120_3, 120_4, 120_5: Sack

130, 130_1, 130_2, 130_3, 130_4, 130_5: Chip discharge section

140, 140_1, 140_2, 140_3, 140_4, 140_5: Burr removal part

150 : Wire

The terms used in the present invention are used only to describe specific embodiments and are not intended to limit the present invention. The singular forms “a,” “an,” and “the” as used in the scope of the present invention and the appended claims are intended to include the plural forms as well, unless the context clearly indicates otherwise. Also, the term “and/or” as used in the present invention should be understood to include any or all possible combinations of one or more of the relevant listed items.

The terms first, second, and third, etc. are used to describe, but are not limited to, various parts, components, regions, layers, and/or sections. These terms are only used to distinguish one part, component, region, layer, or section from another part, component, region, layer, or section. Thus, a first part, component, region, layer, or section described below may be referred to as a second part, component, region, layer, or section without departing from the scope of the present invention.

When a part is said to be "on" another part, it may be directly on top of the other part, or there may be other parts involved. In contrast, when a part is said to be "directly on" another part, there are no other parts involved.

Relative spatial terms such as "below", "above", etc. may be used to more easily describe the relationship of one part to another part depicted in the drawings. These terms are intended to encompass other meanings or operations of the device being used along with the intended meaning in the drawings. For example, if the device in the drawings is turned over, some parts described as being "below" other parts are described as being "above" the other parts. Thus, the exemplary term "below" includes both the up and down directions. The device may be rotated 90° or at other angles, and the relative spatial terms interpreted accordingly.

Unless otherwise defined, all terms, including technical and scientific terms, used herein have the same meaning as commonly understood by those of ordinary skill in the art to which the present invention belongs. Terms defined in commonly used dictionaries are additionally interpreted as having a meaning consistent with the relevant technical literature and the presently disclosed content, and are not interpreted in an ideal or very formal sense unless defined.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

In this specification, a deep furrow refers to a high aspect ratio groove having a slenderness ratio in which the width of the groove in the cross-sectional structure is longer than the depth of the groove in the vertical length. Conversely, a low aspect ratio groove (low groove) refers to a groove having a slenderness ratio in which the width is shorter than the vertical length of the groove.

A cutting tool according to various aspects of the present application is configured to at least partially cut a cross-section of a workpiece.

In various embodiments of the present application, the workpiece may be an optical film having light transmittance. Here, the optical film may be a polymer, such as a thermoplastic resin, a thermosetting resin, a resin curable by actinic rays such as ultra violet (UV) light, etc. Examples of such resins may include, but are not limited to, cellulose resins such as cellulose acetate butyrate (CAB), triacetyl cellulose (TAC), etc.; polyolefin resins such as polyethylene, polypropylene, etc.; polyester resins such as polyethylene terephthalate (PET), etc.; polystyrene; polyurethane; polyvinyl chloride (PVC); acrylic resins, and polycarbonate resins.

However, the workpiece is not limited to an optical film for a security film. The workpiece may be a metal object made of aluminum, wrought iron, or other metal materials for producing various optical films for a security film, a prism sheet, a retroreflective sheet, etc., or a plate that absorbs specific wavelengths (X-rays, sound waves, radio waves).

For example, the cut transparent film can be used as a security film with a limited viewing angle by filling the grooves created with an opaque material. Alternatively, the cut film can be used as a sound absorbing plate in which sound waves enter the cut pattern and are dissipated, or can be used as an x-ray grid by filling the cut pattern with lead or tungsten, etc., to produce an article with a pattern structure.

Hereinafter, for the clarity of explanation, the cutting tool of the present application is described in detail with examples of cutting tools for producing a security film.

FIG. 3 is a perspective view of a cutting tool according to various embodiments of the present application, and FIG. 4 is a cross-sectional view of a sequential bite module according to various embodiments of the present application.

Referring to FIGS. 3 and 4, the cutting tool (10) includes a plurality of bytes (110) and a handle (120) from which the plurality of bytes (110) protrude.

The above handle (120) is a part that supports a plurality of bites (110) and provides a body of the cutting tool (10). The surface of the handle (120) includes a part where the bites (110) protrude and an exposed part (122) where the surface of the handle (120) is exposed as it is without the bites (110) being positioned. The exposed part (122) provides a reference plane (M) or an auxiliary reference plane (N) of the cutting tool (10) described below.

The bite (110) is a component for cutting processing that can directly form a groove in an already hardened film. The bite (110) can form a more precise and deeper groove by repeatedly cutting the same groove several times after first forming a groove in the workpiece (20) through a linear or rotary cutting motion and then cutting the groove a little deeper.

The above byte (110) can be protruded on the surface of the handle (120) as a three-dimensional structure for cutting processing.

In various embodiments of the present application, the byte (110) may be composed of a byte front portion seen from a reference direction, two byte side portions facing each other at both edges thereof, and a byte upper portion facing and above the front portion. In the byte (110), a byte rear portion is provided on the opposite side of the front portion. In some embodiments, the byte (110) may not have a byte rear portion, and an extension of the byte upper portion may directly contact the reference plane. In addition, in some embodiments, the inclination of the byte (110) front portion may be formed to be inclining along the reference direction.

The bite (110) in the cutting tool (10) is made of a relatively hard material having properties capable of cutting a workpiece. In various embodiments of the present application, the bite (110) in the cutting tool (10) may be made of a metal material. Components (e.g., 110, 120) in the cutting tool (10) may be made of the same mold material.

The above-described plurality of bytes (110) form one or more sequential byte modules (100) arranged along a reference direction. Each sequential byte module (100) is composed of a series of bytes (110). Here, the reference direction is a direction in which a series of bytes (110) are arranged in the sequential byte module (100). The reference direction is a cutting processing direction in which a workpiece (20) is cut by the series of bytes (110). As illustrated in FIG. 4, it may be a byte movement direction in which a cutting tool (10) approaches a workpiece (20) for cutting processing.

In the above cutting tool (10), two or more sequential bite modules (100) can be spaced apart by a thermal gap (W) with an exposure area (122) between them.

When the above cutting tool (10) includes m multi-row sequential byte modules (100), each sequential byte module (100) including n bytes (110), n×m bytes (110) are protruded on the reference plane (M) of the cutting tool (10).

The planar structure of the cutting tool (10) can be expressed as a matrix structure. In the matrix structure, the column arrangement corresponds to the reference direction of the sequential byte module (100). The planar pattern formed by the column arrangement can be referred to as a column pattern. In the matrix structure, the row arrangement is a structure in which the bytes (110) are arranged along a direction orthogonal to the column arrangement. For example, in FIG. 3, the cutting tool (10) can be expressed as a planar structure of 5 rows and 4 columns.

In various embodiments of the present application, a plurality of sequential bite modules (100) forming a multi-column based on the front direction of the cutting tool (10) may be arranged in a repeating manner to form a plane pattern. A plurality of bites (110) protruding from the handle (120) may be considered to be subsetted by the number of sequential bite modules (100).

A series of bytes (110) arranged sequentially within the same sequential byte module (100) may be implemented in a protruding form on a single body. In addition, a plurality of bytes (110) in the sequential byte module (100) are arranged sequentially with a gap between adjacent bytes (110), which are expressed as chip discharge portions (130) below.

In the cutting tool (10), each sequential bite module (100) is a series of bites arranged sequentially along a reference direction along which the cutting tool moves toward the workpiece for cutting operation.

For clarity of explanation, the meaning of terms in this specification will first be explained with reference to FIGS. 3 and 4.

The cutting tool (10) may have a multi-bite front structure in which a plurality of sequential bite modules (100) are arranged in an orthogonal direction. In the cutting tool (10) or the sequential bite module (100), the orthogonal direction is a direction orthogonal to the reference direction among the directions on the reference plane (M) from which the bites (110) protrude, and may be referred to as an orthogonal direction to the reference direction.

In the cutting tool (10), the end facing the reference direction is referred to as the front end, and the end located in the opposite direction to the reference direction is referred to as the rear end.

The cross-sectional structure of the sequential bite module (100) in which the protruding bites (110) from the cutting tool (10) are arranged in succession, as shown in FIG. 4, may be referred to as a sequential bite module.

The above-mentioned reference plane (M) or auxiliary reference plane (N) provides a reference for setting the depth relationship between the cutting tool (10) and the object to be cut (workpiece). In the sequential bite module (100), the bite has one front side, two side sides, and one upper side. The highest part of the front side plays a role in digging into the workpiece and cutting it, and the vertical distance (i.e., level) between this point and the reference plane is referred to as the bite height (A). The groove cutting depth of the film is determined according to the above-mentioned bite height (A). The deep groove formed in the workpiece by the reference plane (M) can be uniformly adjusted to a desired depth for the security film.

In the sequential byte module (100), the width (B) of the byte (110) represents the length in the orthogonal direction of the protruding byte (110), and may be referred to as the horizontal length of the byte (110) in the multi-byte frontal structure. The width (B) of the byte (110) may be the horizontal length of the part where the cutting tool (10) and the byte (110) come into contact.

In a sequential byte module (100), the thickness (C) of a byte (110) represents the length in the reference direction of the byte (110).

In a sequential byte module (100), each of a series of bytes (110) has a step (D) from other adjacent bytes (110). The step (D) of a byte (110) of a specific sequential number in the same sequential byte module (100) is the difference between the height of the byte (110) of the specific sequential number and the height of the byte (110) of the previous sequential number. The byte (110) of the previous sequential number is a byte (110) that is immediately adjacent in the reference direction. The step (D) of the byte (110) is the vertical length of the byte, and thus may be referred to as a height difference per row. If the byte step (D) is small, the wall surface of the groove may be made smooth when the groove is formed, but if the byte step is large, the wall surface of the groove may be made rough when the groove is formed. Therefore, the byte step (D) may be a smaller value than the byte width (B).

In some embodiments, the height of the bytes (110b, . . ., 110n) thereafter may be increased sequentially based on the height of the byte (110a) located at the frontmost end, and the step (D) that occurs when the height thereof is increased sequentially may be the same. That is, the height (A) of a series of bytes (100a to 100n) may be expressed in the form of an arithmetic sequence that increases according to the array order and the step (D).

The cutting tool width (F) represents the total width of the bite row in the direction orthogonal to the reference direction of the cutting tool (10), and is a width that can create a number of deep grooves.

The column length (E) is the length in the reference direction of the sequential byte module (100). The column length (E) may be the sum of the thickness (C) of a series of bytes in the sequential byte module (100); the spacing between the byte (110) located at the frontmost end and the front end of the sequential byte module (100); and the spacing between bytes (110) (e.g., H).

The pitch (P) corresponds to a basic pattern unit forming a heat pattern. 1 Pitch (P) may be the length obtained by adding the width of the exposure area (122) within the sequential byte module (100) and the width (B) of a series of bytes (110).

In the sequential byte module (100), the angle formed by the side of each byte (110) with the reference plane (M) is referred to as the protrusion angle (V).

In various embodiments of the present application, the series of bytes (110) may be formed such that the height of each byte gradually increases toward the rear end in the same sequential byte module (100) including the series of bytes (110). As a result, the byte (110) having the highest height (Amax) in the sequential byte module (100) may be the byte (110) located at the rearmost end.

Specifically, a series of bytes (110) within the same sequential byte module (100) have a more protruding height as they are relatively closer to the rear end, and a less protruding height as they are relatively closer to the front end. In a series of n bytes (110), the height of the byte (110a) located at the frontmost end is the lowest (wherein, n is a natural number). Based on the height of the byte (110a) located at the frontmost end, the heights of the subsequent bytes (110b, .., 110n) sequentially increase. The byte (110n) located at the rearmost end is the highest. The greater the number of bytes (110) in a sequential byte module, the better the quality of a deep groove created can be. The quality of a deep groove is evaluated to be higher as the actual cross section is closer to the design cross section.

In addition, in the sequential byte module (100), the highest height (Amax) among the heights (A) of the series of bytes (110), i.e., the byte (110) located at the rearmost end, may have a length longer than the width of the sequential byte module (100). The width of the sequential byte module (100) is the widest width (Bmax) among the widths (B) of the series of bytes (110) in the sequential byte module (100).

By this height-width relationship, the groove corresponding to the sequential byte module (100) and formed by the sequential byte module (100) can be a deep groove (depth furrow) having a depth ratio of 1 or more.

In various embodiments of the present application, the height (A) of each of the series of bytes (110) arranged in the same sequential byte module (100) may be configured such that the byte step (D), which is the difference between the heights (A) of adjacent bytes (110) in the sequential byte module (100), is smaller than the width (B) of each of the series of bytes (110).

The width (B) of each of the five series of bytes (110a, 110b, 110c, 110d, 110e) illustrated in FIG. 4 may have a width smaller than the step (D1) of the adjacent bytes (110a, 110b), the step (D2) of the adjacent bytes (110b, 110c), the step (D3) of the adjacent bytes (110c, 110d), and the step (D4) of the adjacent bytes (110d, 110e).

If the width (B) of each of the series of bytes (110) is less than or equal to the step (D) between the heights of adjacent bytes (110) and the series of bytes (110) advance to form a groove in the workpiece (20), there is a problem that the side of the workpiece is greatly chipped off by the bytes (110), thereby forming a rough, deep groove. If the width (B) of each of the series of bytes (110) is greater than the step (D) between the heights of adjacent bytes (110), the side of the deep groove formed in the workpiece (20) is chipped off slightly, thereby forming a smooth and precise shape.

In the sequential byte module (100), the width (B) of each of the series of bytes (110) may be the same, but is not limited thereto. According to embodiments, the width (B) of each of the series of bytes (110) may be the same, but may increase or decrease from the front end to the back end in the sequential byte module (100).

In some embodiments, the width (B) of each of the series of bytes (110) arranged in the same sequential byte module (100) may be configured such that a side of a groove first formed in the workpiece by a byte (110) relatively closer to the front end of the cutting tool (10) among adjacent bytes (110) in the series of bytes (110) does not come into contact with a byte relatively closer to the rear end of the cutting tool (10) among the adjacent bytes (110). Furthermore, in some embodiments, the width (B) of each of the series of bytes (110) arranged in the same sequential byte module (100) may be configured such that it becomes sequentially narrower from the front end to the rear end of the sequential byte module (100).

Additionally, in some embodiments, an internal width of one or more bytes (110) of a series of bytes (110) arranged in the same sequential byte module (100) may gradually narrow from a front end to a rear end of the sequential byte module on a single byte (110) plane. Specifically, one or more bytes (110) of the series of bytes (110) may have a trapezoidal plane, and a first side having a relatively long length in the trapezoidal plane may be positioned relatively close to the front end of the sequential byte module (100), and a second side having a relatively short length in the trapezoidal plane may be positioned relatively close to the rear end of the sequential byte module (100). In this case, the sequential byte module (100) may have a byte height (A) that increases toward the rear end, and a byte width (B) that gradually decreases toward the rear end so that the wall of the groove first created by the preceding byte (110) located relatively close to the front end is hardly touched by the next byte (110) of the preceding byte (110).

For example, as illustrated in FIG. 3, the width (B3) of a series of bytes (110) in a sequential byte module (100) located in the third column sequentially decreases compared to the preceding bytes, and at the same time, it gradually decreases within the same byte, so that the byte (110) located at the rearmost end has the highest height (A3max) and the narrowest width (B3min). Due to this width structure, the sequential byte module (100) may be referred to as a sequential narrowing structure (or array).

While the cutting tool (10) performs cutting work on the workpiece (20), the resistance caused by friction between the side surfaces of the plurality of bites (110) and the workpiece (20) may increase. This is because the bite height (A) is sequentially increased to form a deep groove, and the width of the side surface of the bite (110) becomes wider as it goes toward the rear end. On the other hand, the sequential narrowing structure (100) contacts only the side surface of the stepped portion of the front end of the bite (110) required for the cutting work, so that the resistance is reduced. This reduction in resistance is because the deep groove formed by the sequential narrowing structure (100) does not continuously experience friction, and thus the deep groove formed in the workpiece has a sophisticated cross-sectional structure.

The width (B) within the plane of each byte (110) of a series of bytes (110) may be sequentially reduced, or the width (B) within the plane of some bytes (110) (e.g., two or more) of the series of bytes (110) may be sequentially reduced. This reduction structure of the internal plane is different from a simple tapered structure in which the width (B) gradually becomes narrower.

In some other embodiments, the width (B) of each of the series of bytes (110) arranged in the same sequential byte module (100) may gradually widen from the front end to the rear end of the sequential byte module. Additionally, in some embodiments, the internal width of one or more bytes (110) of the series of bytes (110) arranged in the same sequential byte module (100) may gradually widen from the front end to the rear end of the sequential byte module (100) on a single byte (110) plane.

For example, as illustrated in FIG. 3, the width (B4) of a series of bytes (110) in a sequential bite module (100) located in the fourth column sequentially increases compared to the preceding bytes, and at the same time, it gradually increases within the same byte, so that the byte (110) located at the rearmost end has the highest height (A4max) and the widest width (B4max). Due to this width structure, the sequential bite module (100) may be referred to as a sequential widening structure (or array). When a workpiece (20) is cut and machined using a cutting tool (10) having this sequential widening structure (100), the wall surface of the groove is sequentially and continuously chipped away little by little, so that a smooth wall surface structure can be created. Specifically, the sequential bite module (100) composed of a series of bytes (110) sequentially chip away a portion of the workpiece (20) that it comes into contact with while passing over the workpiece (20). The initial cutting of the workpiece (20) is the shallowest and is then sequentially cut deeper.

In various embodiments of the present application, the sequential byte module (100) may include a series of chip discharge portions (130) formed along a reference direction of the sequential byte module (100) and providing spacing between a series of bytes (110).

The chip discharge unit (130) is located in front of the bite (110) in the sequential bite module (100). The cutting tool (10) can discharge chips generated during cutting by the chip discharge unit (130). Specifically, the chip discharge unit (130) is configured to have a concave structure in front of the bite so that chips, which are debris generated while the cutting tool (10) moves in a reference direction to cut the surface of a target object (i.e., a workpiece) to form a deep groove, are naturally removed when the cutting tool (10) moves. The chip discharge unit (130) can be formed with a cross-sectional structure in which the surface is more concave than the reference plane (M). For example, as illustrated in FIG. 4, a chip discharge unit (130) having a concave cross-sectional structure can be formed along an exposed area between adjacent bites (110).

In some embodiments, the center of the chip discharge portion (130) is configured to be formed deeper than the side surface of the chip discharge portion (130) that comes into contact with the surrounding bytes (110). Specifically, the cross-section of the chip discharge portion (130) may be formed as a symmetrical curved structure in which the vertex of the curved cross-section of the chip discharge portion (130) is located at the center. When the chip discharge portions (130) of adjacent sequential bite modules (100) have the same position and the same cross-sectional structure, the chip discharge portions (130) may form a three-dimensional structure in which a concave structure in a curved shape such as a ditch is extended.

As a result, when the reference plane (M) of the cutting tool (10) comes into contact with the surface of the film for cutting the film, an extra space is provided where the chip discharge unit (130) and the surface of the film do not come into contact with each other. If the chip discharge unit (130) is not present, the chip cannot be removed from underneath or in front of the bite (110), whereas the chip discharge unit (130) provides a space in which the chip can move when it comes into contact with the workpiece (20) in the gap between the bites (110).

In various embodiments of the present application, a tool capable of discharging a chip to the outside may be moved forward or backward in the internal space of the chip discharge unit (130) to discharge the chip. The tool may be, for example, a thread, a wire, or the like, or may be a vacuum or a high-pressure gas, but is not limited thereto. The forward and backward directions of the tool may be parallel to the orthogonal direction.

FIG. 5 is an exploded perspective view illustrating the positions of wires according to various embodiments of the present application, and FIG. 6 is a schematic diagram of a process of removing a chip by the wire of FIG. 5.

Referring to FIGS. 5 and 6, the wire (150) may be installed in a space provided by at least one chip discharge unit (130) among the series of chip discharge units (130). As illustrated in FIG. 5, as many wires (150) as the number of chip discharge units (130) may be installed in all the spaces provided by the series of chip discharge units (130). Due to the concave structure of the chip discharge unit (130), the wire (150) may not be affected by the movement of the workpiece (20) relative to the fixedly positioned cutting tool (10). As the chip flows out along the wire (150), the chip may be removed from the groove of the workpiece (20).

Referring again to FIGS. 3 and 4, in various embodiments of the present application, the cutting tool (10) may further include at least one burr removal unit (140) within an individual sequential bite module (100). The burr removal unit (140) has a structure that protrudes toward the chip discharge unit (130) at the same height as the reference plane (M). In some embodiments, the burr removal unit (140) may be located behind the last byte (110) within the individual sequential bite module (100). The cutting tool (10) may include at least as many burr removal units (140) as the number of sequential bite modules (100).

In various embodiments of the present application, the sequential byte module (100) may include a plurality of burr removal units (140) within the sequential byte module (100). The plurality of burr removal units (140) may be arranged along the arrangement direction of the same sequential byte module (100). In addition, in some embodiments, at least one burr removal unit (140) among the plurality of burr removal units (140) may be implemented in the form of a byte, having the same height as the exposed surface of the byte (110) and its reference plane (M), as located in the second row of FIG. 3. In this case, a structure that sharply protrudes from the reference plane (M) in the direction of the chip discharge portion cuts the burr protruding from the structure of the byte (110) and serves as the burr removal unit (140). As illustrated in FIG. 4, the sequential byte module (100) may include a byte (110b) substructure that operates as a byte removal unit (140a), and a byte removal unit (140b) that is not in the form of a byte.

The above-mentioned burr removal part (140b) has a height lower than or equal to the height (Amax) of the most protruding byte (110) in the sequential byte module (100).

The above-described burr removal unit (140) removes a burr created in a groove corresponding to the sequential bite module (100) formed in the workpiece (20) as the sequential bite module (100) in the cutting tool (10) moves in a reference direction. Specifically, the burr removal unit (140b) removes a burr created in a deep groove corresponding to the sequential bite module (100) by pushing it into the deep groove while moving along the extension direction of the deep groove. The burr removal unit (140a) can cut and remove a burr from a surface that comes into contact with the burr removal unit (140a) in the deep groove.

Additionally, in some embodiments, the width of the burr removal unit (140b) may match the width of the widest byte (110) in the sequential byte module (100).

In some embodiments, the burr removal unit (140b) may be implemented at least partially in a roller shape. For example, as illustrated in FIG. 4, the burr removal unit (140b) may be implemented in a partial roller shape in which the roller is split in half.

The above cutting tool (10) can cut a workpiece (20) to form a deep groove. A deep groove (depth furrow) is formed in the workpiece (20) in the form of a trench structure, which is a three-dimensional structure in which a deep groove of a high-precision cutting edge extends along the cutting direction.

When a single cutting operation is performed by moving the cutting tool (10) of Fig. 3 in a reference direction while in contact with the surface of the film (20), a deep groove having a vertical cross-section is formed when viewed in the reference direction. When the cutting tool (10) moves from one end of the workpiece to the other end while maintaining the distance from the workpiece, i.e. the height of the reference plane (M), during the cutting operation, the deep groove is extended to form a vertical trench structure. The vertical trench structure forms a plane pattern in which the same linear pattern of deep grooves having a vertical cross-section is repeated.

In the step of moving the cutting tool in one direction toward the workpiece to at least partially cut the workpiece, a series of bites (110) arranged in individual sequential bite modules (100) in the cutting tool (10) can sequentially contact a surface of the workpiece (20) and pass over the surface of the workpiece (20) to form a deep groove. Specifically, the depth of the deep groove formed while the series of bites (110) pass over the workpiece while the surface of the workpiece and the reference plane (M) are in contact gradually increases as the sequential bite modules (100) advance in the reference direction.

As described above, since the height (A) of a series of bytes (110) arranged in the reference direction sequentially increases, a deeper groove can be formed as the series of bytes (110) sequentially pass through the workpiece (20). That is, as the cutting tool (10) moves along the reference direction, the depth of the deep groove formed along the reference direction can sequentially deepen. The deep groove finally formed has a single cross-sectional shape and a high-definition ratio when viewed from the reference direction of the cutting tool (10).

The front shape of the byte (110) and/or the arrangement direction of the chip discharge portion (130) shown in the above drawing 3 may be modified according to embodiments.

In various embodiments of the present application, the frontal shape of the byte (110) as viewed from the reference direction can be designed in various shapes. That is, as shown in FIG. 3, the frontal shape of the byte (110) is not limited to a square cross-section of the deep groove, and can be designed to have a different shape.

The frontal shapes of a series of bytes (110) within the above sequential byte module (100) can be configured to form a cross-section of a deep groove into a triangle with a wide base or a triangle with a wide top.

In one embodiment, the series of bytes (110) within the sequential byte module (100) may be sequentially designed such that the frontal shape of the frontmost byte (110) closest to the front end has a trapezoidal shape and the lowest height, and the trapezoidal heights of the frontal shapes of the bytes (110) arranged thereafter sequentially increase, so that the frontal shape of the lastly positioned byte (110) has a triangular shape, in order to form a cross-section of the deep groove into a triangle. The base lengths of the frontal shapes of the series of bytes (110) are the same.

In another embodiment, a series of bytes (110) in the sequential byte module (100) may be designed to have triangular shapes of different widths, respectively, in order to form a cross-section of a deep groove into a triangle. The base lengths of the triangular shapes of the series of bytes (110) may be the same. The height of the triangle of the frontmost byte (110) may be the lowest, and the heights of the trapezoids of the frontal shapes of the bytes (110) arranged thereafter may be sequentially designed so that the frontal shape of the last byte (110) has a triangular shape.

In another embodiment, the series of bytes (110) in the sequential byte module (100) may be designed to have triangular shapes of different widths, respectively, in order to form a cross-section of a deep groove into a triangle. The triangular area of the first byte (110) in the series of bytes (110) may be the narrowest, and the triangular areas of the bytes (110) arranged thereafter may sequentially increase, so that the triangular area of the last byte (110) may be the widest. The triangular shapes of the series of bytes (110) have the same ratio. When a sequential byte module (100) having such a sequential byte module enters a workpiece (20), as if the blade of the previous byte (110) passes and the blade of the next byte (110) passes sequentially, the first byte (110a) passes through the workpiece (20) first and then the subsequent byte (110b) passes through the workpiece (20) sequentially, so that even an internal structure wider than the entrance of the workpiece (20) can be cut simply by moving while the blades of the byte (110) move in a parallel arrangement without entering the inside of the workpiece (20) from the surface of the object. Eventually, the trace of passage becomes wider and wider to form a final deep triangular groove.

Therefore, the byte shape of the sequential byte module seen from the front of the sequential byte can have various patterns such as triangle, square, circle, etc.

FIG. 7 is a schematic diagram of a process for forming a deep groove with a cutting tool having diagonally arranged bites according to various embodiments of the present application.

Referring to Fig. 7, in the sequential byte module (100), a series of chip discharge portions (130) may be formed in an oblique direction that is neither parallel to the reference direction nor parallel to the orthogonal direction. As a result, chips may be discharged more smoothly without using thread or wire (150) or vacuum or high-pressure gas.

Using the above cutting tool (10), a workpiece (20) having a trench structure of various patterns can be manufactured. The trench plane structure formed in the workpiece (20) is determined according to the plane arrangement of the bite (110) appearing on the plane of the above cutting tool (10).

The above-mentioned planar arrangement of bytes (110) is formed by a column arrangement corresponding to a reference direction and/or a row arrangement corresponding to a direction different from the reference direction.

A column array is an array of a series of bytes (110) by a sequential byte module (100). The column array can correspond to a horizontal pattern in a planar arrangement of bytes (110) within a cutting tool (10).

A row array is an array of bytes (110) arranged along a direction other than the reference direction and having the same byte (A) height, and can form a linear pattern.

The arrangement direction of bytes (110) in the row array may be orthogonal to the reference direction, but is not limited thereto. The arrangement direction of the row array may be diagonal, as illustrated in FIG. 7 below.

The cutting tool (10) may have a planar arrangement of bytes (110) that forms a planar pattern in which rows of bytes (110) are arranged along a reference direction on a plane, and/or may have a planar arrangement of bytes (110) that forms a planar pattern in which rows of bytes (110) are arranged along a direction orthogonal to the reference direction on a plane.

In various embodiments of the present application, bytes (110) included in the same row array may have the same height (A). Bytes (110) included in the same column array while having the same height (A) may be referred to as multiple bites.

The above cutting tool (10) has a plane pattern structure in which a row pattern and/or a column pattern are combined according to the arrangement of a plurality of bytes (110).

In various embodiments of the present application, the cutting tool (10) may include a plurality of sequential byte modules (100) to form a multi-column array. The plurality of sequential byte modules (100) form a multi-row array. That is, the plurality of sequential byte modules (100) have a grid plane pattern structure in which the multi-column array and the multi-row array intersect. The bytes (110) of the cutting tool (10) correspond to grid points in the grid plane pattern structure.

In each column array within the above grid plane pattern structure, the same number of bytes (110) are arranged, and in each row array, the same number of bytes (110) are arranged.

Meanwhile, as described above, bytes (110) of the same height (A) forming a row pattern in the cutting tool (10) are arranged with a row spacing (W) equal to the width of the exposed area (122).

In one example, the cutting tool (10) may be configured to have a pitch (P) of approximately 0.1 mm, a bite width (B) of approximately 0.03 mm, a bite height (A) of approximately 0.21 mm, a step (D) per row of 0.01 mm, an inclination angle (K) of approximately 15°, a clearance angle (L) of approximately 6°, and a number of bytes in a series (i.e., the total number of rows) in a sequential bite module (100) of 21, but is not limited thereto.

When cutting a workpiece (20) with a cutting tool (10) having such a grid plane pattern structure, a trench pattern having a grid plane pattern can be created.

FIG. 8 is a schematic diagram of a process for forming a trench structure in a grid pattern on a workpiece using a cutting tool according to various embodiments of the present application.

Referring to FIG. 8, a method of manufacturing a workpiece having a deep groove using a cutting tool includes a step of moving the cutting tool (10) in one direction toward the workpiece to at least partially cut the workpiece. In some embodiments, the step of at least partially cutting the workpiece can be performed through a vibration cutting process. The cutting tool (10) can vibrate to perform the vibration cutting process.

Specifically, the cutting step may include a step of moving the workpiece to contact the at least one sequential bite module (100) until the at least one sequential bite module (100) traverses the workpiece (20) while applying vibration to the at least one sequential bite module (100). As the workpiece (20) moves while the sequential bite module (100) is fixed, the sequential bite module (100) can traverse the surface of the workpiece (20).

In addition, in various embodiments of the present application, a method for manufacturing a workpiece (20) having a deep groove using the cutting tool (10) may further include a step of rotating the workpiece (20) after the at least one sequential bite module (100) traverses the workpiece (20); a step of moving the workpiece (20) so as to contact the at least one sequential bite module (100) until the at least one sequential bite module (100) traverses the rotated workpiece (20) while applying vibration to the at least one sequential bite module; When the rotation of the workpiece (20) is 90°, a trench pattern having a lattice structure with a lattice angle of 90° is formed on the workpiece (20).

In addition, by using the cutting tool (10) to create a pattern of deep grooves in a specific direction on the workpiece (20), rotating the workpiece (20), and then using the cutting tool (10) again to create an additional pattern of deep grooves in a specific direction on the workpiece (20), a planar structure in which two or more patterns in different directions intersect can be formed.

In addition, by using the cutting tool (10), a deep groove can be formed on both one surface of the workpiece (20) and the other surface opposite to the one surface.

According to various embodiments of the present application, a method for manufacturing a workpiece (20) having a deep groove using a cutting tool (10) comprises the steps of: moving the workpiece (20) so as to contact the at least one sequential bite module (100) until the at least one sequential bite module (100) traverses the workpiece (20) while applying vibration to the at least one sequential bite module (100); after the workpiece (20) traverses the at least one sequential bite module (100) to form a deep groove on a first surface of the workpiece (20), the step of turning the workpiece (20) over so that a second surface of the workpiece (20) contacts the at least one sequential bite module (100); The step of moving the workpiece (20) so that it comes into contact with the at least one sequential bite module (100) while applying vibration to the at least one sequential bite module (100) until the at least one sequential bite module (100) traverses the overturned workpiece (20) may be included.

Additionally, in various embodiments of the present application, the methods described above may further include a step of forcibly removing the chip from the chip outlet using a vacuum, suction, thread, wire, and/or other tools.

In one embodiment, the methods for manufacturing a workpiece (20) having a deep groove using a cutting tool (10) may further include a step of installing a wire (150) in a space provided by at least one chip discharge unit (130) of the series of chip discharge units (130) before the workpiece (20) contacts the at least one sequential bite module (100). Furthermore, in one embodiment, the methods for manufacturing a workpiece (20) having a deep groove using a cutting tool (10) may further include a step of moving the wire (150) while the workpiece (20) moves until it traverses the at least one sequential bite module (100). The wire (150) may move in one direction as illustrated in FIG. 6 so as to pass through the cutting tool (10). However, it is not limited to the moving direction of the wire (150) illustrated in FIG. 6. The direction of movement of the wire (150) illustrated in FIG. 6 is merely exemplary, and it will be apparent to those skilled in the art that the wire (150) can also move in the opposite direction.

In other embodiments, methods of fabricating a workpiece (20) having a deep groove using a cutting tool (10) may further include the step of changing the pressure of a space provided by the series of chip discharge portions by means of a vacuum device or a suction device while the at least one sequential bite module (100) moves across the workpiece (20).

In addition, in still other embodiments, methods for manufacturing a workpiece (20) having a deep groove using a cutting tool (10) may further include the steps of: installing a wire (150) in a space provided by at least one chip discharge unit (130) of the series of chip discharge units (130) before the workpiece (20) contacts the at least one sequential bite module (100); and changing the air pressure of the space provided by the series of chip discharge units using a vacuum device or a suction device while the at least one sequential bite module (100) moves until it traverses the workpiece (20).

A method of manufacturing a workpiece (20) having a deep groove using a cutting tool (10) in this way can be used to manufacture a security film (20) having a deep groove.

When the above-mentioned workpiece (20) is a film, a micro-pattern for a security film capable of limiting the viewing angle can be produced by having a deep groove pattern extending in one direction only through a cutting operation without any additional hardening operation.

In addition, as shown in Fig. 8, when the workpiece (20) is rotated, a deep groove pattern is formed by crossing each other, so that the plane of the protrusion of the workpiece (20) surrounded by the deep groove can have various shapes.

In addition, by using the cutting tool (10) to create a pattern of deep grooves in a specific direction on the workpiece (20), rotating the workpiece (20), and then using the cutting tool (10) again to create an additional pattern of deep grooves in a specific direction on the workpiece (20), a planar structure in which two or more patterns in different directions intersect can be formed.

For example, the plane of the protrusion of the workpiece (20) formed in a columnar structure may be square, as shown in FIG. 5, but is not limited thereto.

By cutting the workpiece (20) using one byte to create a deep groove, a shallow groove is created and then processed again to gradually create a deeper groove, so a deep groove can be created through multiple movements.

On the other hand, if cutting is performed using a cutting tool (10) having a sequential byte module (100) in which lower bytes are arranged in relatively earlier bytes (110) and higher bytes are arranged in relatively later bytes (110), there is no need to replace bytes or adjust depth for each operation, and work errors caused by replacing bytes can be prevented.

In addition, since it is difficult to produce a pattern in which a horizontal trench pattern and a vertical trench pattern intersect in a cross-section of a high-definition device using the conventional transfer method illustrated in FIG. 1, a film having a double-layer lattice pattern can be produced by arranging a first film having a horizontal trench pattern formed and a second film having a vertical trench pattern formed so that the respective trench patterns intersect in a plan view.

On the other hand, as shown in Fig. 8, by using the cutting tool (10), a security film (20) having a lattice pattern of a single layer that is thinner than a double layer can be easily produced.

The cutting tool (10) according to the embodiments of the present application may be configured such that the number of bytes (110) arranged along two adjacent row arrays, as shown in FIG. 3, is the same, so that the number of bytes (110) per row array is the same, but is not limited thereto. That is, the cutting tool (10) according to the embodiments of the present application is not limited to a planar pattern of a plurality of bytes (110) in which a unit pattern consisting of one row array is repeated, as shown in FIG. 3, and may be configured to have various deformation patterns.

If the grid plane pattern of Fig. 3 is considered as a basic plane pattern, a plane pattern different from the basic plane pattern can be considered as a deformation pattern.

FIG. 9 is a schematic diagram of a process for forming a deep groove with a cutting tool having a two-row deformation pattern of bytes according to various embodiments of the present application.

Referring to FIG. 9, the cutting tool (10) may include a plurality of sequential byte modules (100) having a plane arrangement of bytes (110) in which a unit pattern is repeated, consisting of two or more row arrangements. In the cutting tool (10), a plurality of bytes (110) having the same height (A) and width (B) are arranged in the row direction in the same row arrangement in the unit pattern. In addition, in some embodiments, the bytes (110) of individual row arrangements included in the unit pattern may be arranged to be located in different column arrangements from the bytes (110) of other row arrangements in the unit pattern.

In one example, the unit pattern is composed of two row arrays, and the number of bytes (110) in the first row array and the number of bytes (110) in the second row array may be different from each other. In addition, the bytes (110) of the first row array and the bytes (110) of the second row array in the unit pattern may be arranged crosswise to be located in different column arrays.

As illustrated in FIG. 9, in a cutting tool (10) including the seven sequential byte modules (100), the plane arrangement of the bytes (110) can provide a plane pattern formed by repetition of a unit pattern composed of two row arrangements. Here, a first row arrangement (110at1, 110bt1) in the unit pattern can be composed of four bytes (110), and a second row arrangement (110at2, 110bt2) in the unit pattern can be composed of three bytes (110). The four bytes (110) in the first row arrangement and the three bytes (110) in the second row arrangement are cross-arranged to be located in different column arrangements.

In another example, the unit pattern may be composed of three row arrays, and the numbers of bytes (110) in the first to third row arrays may be the same. In addition, the bytes (110) in the first row array, the bytes (110) in the second row array, and the bytes (110) in the third row array in the unit pattern may be arranged in cross-arrangements to be located in different column arrays.

In various embodiments of the present application, the cutting tool (10) may include a plurality of sequential bite modules (100) having a plurality of plane patterns having different unit patterns. The plurality of plane patterns may be respectively positioned in different areas on a plane of the cutting tool (10).

In one example, the cutting tool (10) may include a plurality of sequential bite modules (100) having a first plane pattern formed by a first unit pattern and a second plane pattern formed by a second unit pattern.

Alternatively, the cutting tool (10) may include a plurality of sequential bite modules (100) having a first plane pattern formed by a first unit pattern, a second plane pattern formed by a second unit pattern, and a third plane pattern formed by a third unit pattern.

Different unit patterns may have different numbers of bytes (110) included in each row array, and/or different directions in which the row arrays are formed.

FIG. 10 is a plan view of another variation pattern of a byte including a plurality of unit patterns according to various embodiments of the present application.

Referring to Fig. 10, the first plane pattern may be located in a first area on the plane of the cutting tool, and the second plane pattern may be located in a second area on the plane of the cutting tool. The first area may be an area located closer to the front end of the cutting tool than the second area.

The above first unit pattern is composed of two row arrays, and the number of bytes (110) in the first row array and the number of bytes (110) in the second row array may be different from each other. In addition, the bytes (110) of the first row array and the bytes (110) of the second row array in the above unit pattern may be arranged to cross each other so as to be located in different column arrays.

The above second unit pattern is composed of three row arrays, and the number of bytes (110) in the first to third row arrays may be the same. In addition, the bytes (110) of the first row array, the bytes (110) of the second row array, and the bytes (110) of the third row array in the above unit pattern may be arranged in cross-arrangements so as to be located in different column arrays.

In another example, the unit patterns of the first plane pattern and the second plane pattern are both formed by two-row arrangements, and the first plane pattern has a row pattern in an orthogonal direction with respect to the reference direction, and the second plane pattern may have a row pattern in an oblique direction with respect to the reference direction, as shown in FIG. 7.

When a workpiece (20) is cut and machined using a cutting tool (10) having a deformation pattern as shown in the above-mentioned FIGS. 9 and 10, a multi-trench structure with deep grooves extending as many as the number of sequential bite modules (100) can be formed in the workpiece (20).

As a result, instead of using a cutting tool (10) with a narrower spacing between the bites (110) in the sequential bite module (100) and a relatively more precise cutting tool, the same number of trench structures can be formed in the workpiece (20). Since the precision of the cutting tool (10) and the manufacturing difficulty and consumable cost of the cutting tool (10) are proportional, there is an advantage in that the same cutting processing result is provided even with lower manufacturing difficulty and consumable cost. This is because the decrease in manufacturing cost is greater than the increase in material cost due to the increase in the length of the cutting tool (10) by changing from a standard pattern to a modified pattern.

Specifically, let us assume that the sequential byte structure (100) in the basic plane pattern and the modified plane pattern each includes ten series of bytes (110). The pitch within the lattice plane pattern may be referred to as the basic pitch, and the pitch within the plane pattern of FIGS. 9 and 10 and the modified plane pattern of FIGS. 9 and 10 may be referred to as the modified plane pattern and the modified pitch, respectively.

In the individual sequential byte structure (100) within the basic plane pattern, the basic pitch (P) is calculated as the sum of the width (B) of the individual byte (110) and the column spacing (W) equal to the number of bytes in the series (110). The basic pitch (P) may be the sum of the width (B) of one byte (110) and the column spacing (W) as a unit length.

On the other hand, in the individual sequential byte structure (100) in the deformed plane pattern having a unit pattern consisting of two row arrangements, the unit length of the deformed pitch (Pt) may be the sum of twice the width (B) of the byte (110) in the basic plane pattern and twice the column spacing (W) of the byte (110). In addition, in the individual sequential byte structure (100) in the deformed plane pattern having a unit pattern consisting of three row arrangements, the unit length of the deformed pitch (Pt) may be the sum of three times the width (B) of the byte (110) in the basic plane pattern and three times the column spacing (W) of the byte (110).

If the bite width (B) in the basic pattern is 0.03 mm and the row spacing (W) is 0.07 mm, the basic pitch value becomes 0.1 mm. To match this row spacing, the maximum thickness of the tool for protruding the bite must be 0.07 mm or less to manufacture a cutting tool (10) having such a multi-row sequential bite module.

Since the maximum thickness of the tool for protruding the bite in the cutting tool (10) in which two row arrays form a unit pattern is a deformation row spacing (Wt2) equal to B+2W (wherein, W is the row spacing of the bite (110) in the basic plane pattern, and B is the width of the bite (110) in the basic plane pattern), it is possible to manufacture a cutting tool (10) having a multi-row sequential bite module using a tool (end mill or bite, laser, etc.) having a maximum thickness of 0.17 mm.

Since the maximum thickness of the tool for protruding the bite in the cutting tool (10) in which three rows of arrangements form a unit pattern is 2B+3W, a cutting tool (10) having a multi-row sequential bite module can be manufactured using a tool having a maximum thickness of 0.27 mm.

In the conventional transfer method, the minimum row spacing (W) that can be made with a 0.1 mm end mill was 0.1 mm, but if it is made with a deformation pitch (Pt2) in the cutting tool (10) in which two rows form a unit pattern, it is possible to make a pitch with a deformation row spacing (Wt2) of 0.035 mm, so that an advantage in precision can be obtained.

In this way, by using the cutting tool (10) of FIG. 9 or FIG. 10, a result (e.g., a security film) including vertical deep grooves having the same groove spacing and depth can be produced, similarly to using the cutting tool (10) of FIG. 3.

Cutting tool for forming deep inclined grooves

A cutting tool (10_2) according to another aspect of the present application may be configured to form a deep groove (hereinafter, a slope-shaped deep groove) whose cross-sectional structure is not perpendicular to the surface of the workpiece (20) but has a different angle of inclination.

The above cutting tool (10_2) is a different type of cutting tool from the cutting tool (10) for forming the vertical deep groove of Fig. 3. The cutting tool (10) of Fig. 3 may be referred to as a first type cutting tool, and the cutting tool (10_2) for forming the inclined deep groove may be referred to as a second type cutting tool (or inclined cutting tool) hereinafter. The second type cutting tool (10_2) may be used to produce a security film (20) having an inclined deep groove.

FIG. 11 is a front view of a second type cutting tool for producing a security film having an inclined deep groove (hereinafter, “inclined security film”) according to another aspect of the present application.

Referring to FIG. 11, the second type cutting tool (10_2) corresponds to the form of the cutting tool (10) of FIG. 3 having one sequential bite module (100). Specifically, the single sequential bite module in the first type cutting tool (10_2) includes a series of bites (110_2), a handle (120_2) in contact with the series of bites (110_2), and a chip discharge portion (130_2) formed on a surface of the handle (120_2). In addition, in some embodiments, the first type cutting tool (10_2) may include a burr removal portion (140_2).

The components (10_2, 100_2, 110_2, 120_2, 130_2, 140_2) of the second type cutting tool (10_2) are components corresponding to the components (10, 100, 110, 120, 130, 140) of FIG. 3, and should be understood to provide the same function, although they are designated by different symbols for identification purposes.

Since the above second type cutting tool (10_2) is identical or similar to the vertical cutting tool (10), the differences will be mainly described.

In various embodiments of the present application, the cross-sectional structure of the deep groove film (20) forming the inclination at an angle different from the orthogonal can be inclined at any angle between the surface of the film and the orthogonal direction of the film. Specifically, the protrusion angle of the byte (110) forming the inclination refers to the cross-sectional protrusion angle (V) illustrated in FIG. 3, which is distinguished from the inclination angle (K) of FIG. 3. The protrusion angle (V) represents the angle at which the byte (110) protrudes toward the side of the byte (110) (referred to as a row pattern) from the reference plane (M) and inclines with respect to the surface of the protrusion area (122) of the sequential byte module (100).

The second type cutting tool (10_2) may include a series of bites (110_2) formed at a specific angle in which each of the plurality of sequential bite modules (100_2) has a cross-sectional protrusion angle that is the same. The specific angle may be an angle other than perpendicular to a plane. In some embodiments, the specific angle may be any angle corresponding to 30° to 89° or 91° to 210°.

In the above-described plurality of sequential byte modules (100_2), a plurality of bytes (110_2) constituting each row pattern may be protruded at the same cross-sectional protrusion angle (V). The cross-sectional protrusion angle (V) of the bytes (110_2) may be set to an arbitrary angle of 45° or more and less than 90° (or 90° to 135°) with respect to a reference plane (M) of an inclined cutting tool (10_2) so that an inclined deep groove formed corresponding to the bytes (110_2) has a high degree of precision. For example, all bytes (110_2) in the inclined cutting tool (10_2) may be protruded in an orthogonal direction at an angle of 45° (or 135°) with respect to the reference plane (M).

Since Fig. 11 is a front view of the module (10_2) showing the shortest height (Amin) byte, it will be apparent to those skilled in the art that the step (D) is shown relative to the height (A) of the byte (110_2).

FIG. 12 is a schematic diagram of a process for forming an inclined deep groove in a film using a second type cutting tool according to various embodiments of the present application.

Referring to FIG. 12, when performing a single cutting operation by moving the second type inclined cutting tool (10_2) of FIG. 11 in a reference direction while in contact with the surface of the film (20), the deep groove may have an inclined structure when viewed in the reference direction. At this time, the inclined deep groove formed in the film (20) forms an inclined trench pattern extending along the reference direction. That is, even if the second type cutting tool (10_2) is simply moved in a frontal direction, the inclined deep groove can be easily manufactured.

In this way, the security film (20) produced using the cutting tool (10_2) of Fig. 11 can include an inclined deep groove having a high-definition device in which the height of the inclined deep groove is longer than the width of the inclined deep groove, as shown in Fig. 12, and thus has high security when applied to digital door locks, etc.

FIG. 13 is a drawing comparing the effect of a security film produced by a second type cutting tool according to various embodiments of the present application with the effect of a security film produced by the cutting tool of FIG. 3.

Referring to Fig. 13, a security film (20) manufactured using a second type cutting tool (10_2) has a deep, inclined groove, thereby enhancing the security of a digital door lock.

Specifically, a digital door lock is a mechanical device that opens and locks a door, and is configured to open the door by pressing a password on the number plate. If the password is leaked, others can break into the house, so special security is required for the password. The door lock user can attach a security film to the digital door lock to prevent the password from being exposed to a third party or other outsiders while entering the password.

Most door lock users enter their passwords at a close distance of less than 1m from the digital door lock. Therefore, in order for the security film applied to these digital door locks to achieve its original purpose, it must be configured to allow a field of view for close-range users at a close distance of less than 1m and restrict the field of view for long-range users at a distance of more than 1m.

As shown on the left side of Fig. 13, it can be seen that the conventional security film has a width-to-height ratio of 2.5 to 4.0 between the grooves in the cross-sectional structure and that the fine pattern is formed in a direction perpendicular to the film surface. Such a conventional security film has a security angle of 21° when the transparent pattern portion has a width-to-height ratio of 4.

Specular ratio (refractive index 1.5) 2 2.5 3 3.5 4 4.5 5 Security angle (°) 39.8 32.7 27.7 23.9 21 18.8 16.9

Referring to Table 1, when the security film of Fig. 1 having an aspect ratio of 4 in the transparent pattern portion is attached to a digital door lock, the screen for entering a password is most visible to a user who is about 2 m away from the digital door lock to which the security film is attached, as shown in Fig. 13. When the security film of Fig. 1 is applied to a digital door lock as is, the input screen passing through the security film is not clearly visible to the user of the door lock, and rather, the input screen of the security film is more visible to a third party at a distance behind the user of the door lock, which has the opposite effect. On the other hand, when a slanted security film (20) having slanted deep grooves is attached to a digital door lock, the input screen passing through the slanted security film (20) is most visible to a user at a close distance of 1 m or less, as shown in Fig. 13, and the input screen passing through the security film is not clearly visible to a third party at a distance, such as an outsider behind the user of the door lock. In this way, the inclined security film (20) manufactured using the cutting tool (10_2) of Fig. 11 allows a user at a closer distance to see a screen passing through the inclined security film (20) due to a limited viewing angle that can be provided to the user depending on the attachment location, while not allowing a person at a further distance to see a screen to which the inclined security film (20) is attached. As a result, the password of the digital door lock is prevented from being exposed to a third party at a distance.

Focused cutting tool

A cutting tool (10_3) according to another aspect of the present application may be configured to form a plurality of deep grooves in a workpiece (20), with a virtual extension line for each of the deep grooves progressing toward a focus.

Hereinafter, the cutting tool (10_3) may be referred to as a third type cutting tool (or a focal cutting tool). A deep groove that allows light to proceed with the same focus may be referred to as a focal deep groove. A security film (20) produced by the third type cutting tool (10_3) and having a focal deep groove may be referred to as a focal security film (20_3).

Fig. 14 is a front view of a focus-type cutting tool (10_3) according to another aspect of the present application.

Referring to FIG. 14, the third type cutting tool (10_3) corresponds to the form of the cutting tool (10) of FIG. 3 having one sequential bite module (100). Specifically, the single sequential bite module in the third type cutting tool (10_3) includes a series of bites (110_3), a handle (120_3) in contact with the series of bites (110_3), and a chip discharge portion (130_3) formed on a surface of the handle (120_3). In addition, in some embodiments, the third type cutting tool (10_3) may include a burr removal portion (140_3).

The components (10_3, 100_3, 110_3, 120_3, 130_3, 140_3) of the third type cutting tool (10_3) are components corresponding to the components (10, 100, 110, 120, 130, 140) of FIG. 3, and should be understood to provide the same function, although they are designated by different symbols for identification purposes.

The focal cutting tool (10_3) illustrated in Fig. 14 is similar to the vertical cutting tool (10) illustrated in Fig. 3, so the differences will be mainly described.

The bytes (110) in each sequential byte module (100_3) can be sequentially protruded at a protrusion angle (V) according to the order of the row arrangement from the reference plane (M) of the focal cutting tool (10_3). The protrusion angle refers to a cross-sectional protrusion angle (V) at which the bytes (110_3) protrude from the reference plane (M) in an orthogonal direction, for example, so that the cross-sectional structure is inclined, and is distinguished from the inclination angle (K) of FIG. 3.

In the above-described plurality of sequential byte modules (100_3), a series of bytes (110_3) constituting each row pattern are protruded so that the inclined deep grooves formed by cutting individual bytes (110_3) face the same focus. Since the cutting tool (10_3) cuts in a byte manner, an inclined deep groove corresponding to the protrusion angle and protrusion position of the bytes (110_3) is formed as is.

In various embodiments of the present application, the protrusion angles of a series of bites (110_3) in the focal cutting tool (10_3) can be designed such that imaginary lines extending from the central axis of individual bites (110_3) meet at the same focus.

In various embodiments of the present application, the focus-type cutting tool (10_3) may be configured such that the focus is positioned on an imaginary line extending from the central portion on the plane of the focus-type cutting tool (10_3) along the direction of bite protrusion, i.e., the normal direction of the reference plane (M), so as to allow a field of view on the central portion of the security film (20). To this end, the plurality of sequential bite modules (100_3) protrude at an angle closer to the vertical with respect to the reference plane (M) the closer they are to the width central portion of the module (10_3) and protrude at an acute angle (or obtuse angle) closer to the reference plane (M) the farther they are from the width central portion of the module (10_3). The degree of the acute angle (or obtuse angle) decreases (or increases) in proportion to the distance from the width central portion and increases (or decreases) in proportion to the proximity to the width central portion.

The difference between the protrusion inclination angles (V) between adjacent bytes (110_3) in a row-wise series of bytes (110_3) is determined based on the spacing between adjacent bytes (110_3) on a reference plane (M), i.e., the width of the exposure area (122) between adjacent bytes (110_3), and the distance from the reference plane (M) to the focus.

The cross-sectional protrusion angle (V) of the above-described byte (110_3) may be set to an angle of 45° to 90° (or 90° to 135°) with respect to the reference plane (M) of the inclined cutting tool (10_3) so that the inclined deep groove formed corresponding to the byte (110_3) has a high degree of precision. For example, among a series of bytes (110_3), the byte (110_3) furthest from the center of the width of the module (10_3) may protrude from the reference plane (M) at a cross-sectional protrusion angle of 45°, and the byte closest to the center of the width of the module (10_3), i.e., the center byte (110_3), may protrude from the reference plane (M) at an angle of 90°.

When cutting the film (20) using the cutting tool (10_3) of the above-described Fig. 14, a plurality of inclined trench patterns are formed. The plurality of inclined trench patterns have as many trench patterns as the number of sequential bite modules (100_3). The cross-section of each trench pattern is configured so that light passing through the cross-section of the corresponding trench pattern continues to travel and is focused on the same focal point.

Figure 15 illustrates the results of comparing the effectiveness of a focal security film produced by the focal cutting tool of Figure 14 with the security film of Figure 1.

Referring to FIG. 14, the focus-type security film (20) can provide high user convenience by providing the entire screen area that passes through the focus-type security film (20) with uniform brightness to a user located at the focus of the security film (20), that is, the focus of the focus-type cutting tool (10_3) used to produce the security film (20).

As a result, the disadvantage of the conventional vertical security film (20) that the entire screen area penetrating the conventional vertical security film (20) is not provided with uniform brightness but rather becomes darker towards the side, thereby providing low user convenience, can be overcome, and the focus-type security film (20) provides the same screen brightness to the user no matter how high the aspect ratio of the transparent pattern layer is, whereas the conventional vertical security film (20) of FIG. 1 has a limit in increasing security performance because the shadow area gradually increases for the user as the aspect ratio of the transparent pattern layer increases.

In this way, the focus-type security film (20) can provide higher user convenience and, at the same time, higher security compared to the conventional vertical security film (20).

In alternative embodiments, by allowing overlap and using two or more cutting tools among the vertical cutting tool (10) of FIG. 3, the cutting tool (10_2) of FIG. 11, and the cutting tool (10_3) of FIG. 14, it is possible to produce a security film in which trench patterns with different cross-sectional structures intersect in the cutting direction with each cutting tool.

FIG. 16 illustrates security films having various cross trench patterns according to various embodiments of the present application.

In one example, by performing two cutting operations as illustrated in FIG. 8, but with the same direction of movement of the vertical cutting tool (10) in each cutting operation and the workpiece (20) being rotated 90° after the first cutting operation to continuously perform the second cutting operation, a security film (20) having a cross trench pattern as shown in a) of FIG. 16 can be produced.

Alternatively, b) inclined*vertical (90°) of FIG. 16 is a perspective view of a security film in which a vertical trench pattern created by a vertical cutting tool (10) of FIG. 3 and an inclined trench pattern created by an inclined cutting tool (10_2) of FIG. 11 intersect.

By using a combination of two cutting tools (10) that are the same or different among the vertical cutting tool (10) of FIG. 3, the inclined cutting tool (10_2) of FIG. 11, and the focus cutting tool (10_3) of FIG. 14, two cutting operations as illustrated in FIG. 8 are performed, but the moving direction of the vertical cutting tool (10) is the same in each cutting operation, and the workpiece (20) is rotated 90° after the first cutting operation and the second cutting operation is continuously performed, a security film (20) having one of the cross trench patterns of FIG. 16b) to e) can be created.

In addition, by performing three cutting operations as illustrated in FIG. 8 using the vertical cutting tool (10) of FIG. 3, but the moving direction of the vertical cutting tool (10) is the same in each cutting operation, and the workpiece (20) is rotated at an angle less than 90° (e.g., 60°) after the first cutting operation to continuously perform the second cutting operation, a security film (20) having a cross trench pattern forming a triangular plane as in FIG. 14f) can be created.

According to another aspect of the present application, in the sequential byte module (100), a reference plane or an auxiliary reference plane located on the surface of the shaft (120) has a non-planar cross-section such as a curved surface, and a series of bytes (110) in the sequential byte module can be protruded on the reference plane or the auxiliary reference plane having the non-planar cross-section.

Specifically, the cutting tool (10) may be configured to be capable of producing a security film (20) having a cross-section in a reference direction or a cross-section in an orthogonal direction that is curved. The security film (20) having a cross-section in a curved shape may be referred to as a security film (20) formed on a curved surface, so as to be distinguished from a security film (20) having a cross-section in a straight shape.

Fig. 17 is a schematic diagram of a cutting tool (10_4) for producing a security film (20) having a curved cross-section in an orthogonal direction according to another aspect of the present application.

Referring to FIG. 17, the handle (120_4) of the cutting tool (10_4) may be configured such that the reference plane (M) of the cutting tool (10_4) has a curved cross-sectional structure. The cutting tool (10_4) has a shape in which bites (110) are arranged vertically on a curved reference plane (M) such as a convex surface or a concave surface in cross-section. By forming a groove using the cutting tool (10_4) of FIG. 17 and pulling the security film (20) to both ends to change it into a flat shape, a focus-type security film (20) such as a focus-type pattern film made of a multi-row sequential bite module of FIG. 14 can be created.

FIG. 18 is a schematic diagram of a process for producing a security film using a cutting tool (10_5) having a handle (120_5) whose cross-section in the reference direction is curved, according to another aspect of the present application.

Referring to FIG. 18, a cutting tool (10_5) according to another aspect of the present application may include a handle (120_5) having a curved cross-section in a reference direction.

The above handle (120_5) may have a shape that wraps around a cylinder. The above reference plane (M) may be a curved surface of the handle (120_5) having a shape that wraps around a cylinder. The plurality of bytes (110_5) may be arranged to protrude on the curved surface.

Referring to Fig. 18, a cross-section of a reference plane in a reference direction is formed in a curved shape, and a groove is created in a film (20) that moves along the curve on a roller, so that a film (20) can be continuously produced.

The above film (20) can be cut while passing along the reference plane (M) of the cutting tool (10_5) while moving in a curved shape through a circular roller.

Meanwhile, when a simple cutting operation is performed without any special measures using a cutting tool (10) including a multi-row byte module (100), the module (100) may not move because the groove is jammed while making a groove in the film (20). Therefore, in the case of a multi-row sequential byte module (100), an external force such as vibration of ultrasonic waves or the like may be further applied to the byte module (100) to make it easy to generate chips while continuously making grooves. As a result, the life of the cutting tool (10) can be maintained longer.

The arrangement pattern according to the reference direction and orthogonal direction of multiple bytes (110_5) has been described above with reference to FIGS. 3 to 14, and a detailed description thereof is omitted.

The present invention discussed above has been described with reference to the embodiments illustrated in the drawings, but these are merely exemplary, and those skilled in the art will understand that various modifications and variations of embodiments are possible. However, such modifications should be considered to be within the technical protection scope of the present invention. Therefore, the true technical protection scope of the present invention should be determined by the technical idea of the appended patent claims.

By using a cutting tool having a sequential bite module according to embodiments of the present application, a security film micro-pattern having a narrow and deep groove can be manufactured more easily by only cutting, and thus high industrial applicability in the cutting field is expected.

Claims (14)

In a cutting tool including multiple bites that cut the workpiece in a single operation to create a groove, A plurality of bytes forming at least one sequential byte module; A shaft from which the above plurality of bytes protrude; and A series of chip ejectors formed along an exposed area located in front of each of a series of bytes within the same sequential byte module; The above bytes are protruded in a three-dimensional structure on the surface of the handle, Each sequential byte module is a series of bytes arranged sequentially along a reference direction in which a workpiece is cut by a series of bytes, and the series of bytes is configured such that the height of each byte gradually increases toward the rear end of the sequential byte module. The groove formed by the sequential byte module is a deep groove (depth furrow) having a depth ratio of 1 or more, characterized in that the maximum height of the byte in the sequential byte module is longer than the width of the sequential byte module. Cutting tools. In the first paragraph, The height of each of the above series of bytes arranged in the same sequential byte module is characterized in that the byte step, which is the difference between the heights of adjacent bytes in the sequential byte module, is configured to be smaller than the width of each of the above series of bytes. Cutting tools. In the first paragraph, The width of each of a series of bytes arranged in the same sequential byte module becomes sequentially narrower from the front to the back of the sequential byte module. The internal width of one or more bytes in the above series of bytes is also characterized in that it gradually narrows from the front end to the back end of the sequential byte module. Cutting tools. In the first paragraph, the cutting tool, Contains multiple sequential byte modules, The above plurality of sequential byte modules are characterized in that bytes of the same height are arranged along a direction different from the reference direction on the plane of the cutting tool to form a row arrangement on the plane of the cutting tool. Cutting tools. In the fourth paragraph, the plurality of sequential byte modules, It is configured to form a plane pattern by repeating a unit pattern consisting of an array of adjacent n rows (n is a natural number greater than or equal to 2). In the same row array within the unit pattern, a number of bytes with the same height and width are arranged in the row direction. The bytes of the individual row arrays included in the above unit pattern are arranged in different column arrays from the bytes of other row arrays within the above unit pattern. Cutting tools. In the fourth paragraph, the plurality of sequential byte modules, It is configured to have a plurality of plane patterns having different unit patterns, The above plurality of plane patterns are characterized in that they are each located in different areas on the plane of the cutting tool. Cutting tools. In the first paragraph, A cutting tool, characterized in that the above series of bytes and chip discharge portions are formed in an oblique direction between the direction parallel and the direction orthogonal to the sequential bite modules. In paragraph 4, In each of the above multiple sequential byte modules, a series of bytes are formed at a specific angle where the cross-sectional protrusion angles are all the same, The above specific angle is characterized in that it is an angle that is not perpendicular to the plane. Cutting tools. In the first paragraph, The above plurality of sequential byte modules are configured such that light passing through a plurality of deep grooves formed in the workpiece proceeds toward the same focus, The above focus is located on an imaginary line extending along the bite protrusion direction from the central portion on the plane of the above cutting tool, The above multiple sequential byte modules are: The closer it is to the center of the width of the cutting tool, the closer it is to the vertical relative to the reference plane of the cutting tool, and the closer it is to the center of the width of the cutting tool, the closer it is to the reference plane. Cutting tools. In the first paragraph, In the sequential byte module, a reference plane or an auxiliary reference plane located on the surface of the shaft has a non-planar cross-section, and a series of bytes in the sequential byte module are characterized in that they protrude on the reference plane or the auxiliary reference plane having the non-planar cross-section. Cutting tool In the first paragraph, Further comprising a thread or wire disposed in a space provided by at least one chip discharge unit of the series of chip discharge units prior to contacting the workpiece with the at least one sequential bite module. Cutting tools. In the first paragraph, The above-mentioned workpiece is characterized in that it is a plate or film. Cutting tools. A method for producing a workpiece having a deep groove using a cutting tool according to any one of claims 1 to 12, A step of moving the workpiece to contact the at least one sequential bite module until the at least one sequential bite module traverses the workpiece while applying vibration to the at least one sequential bite module; comprising; method. In Article 12, A step of rotating the workpiece after the at least one sequential byte module has traversed the workpiece; further comprising a step of moving the workpiece to contact the at least one sequential bite module until the at least one sequential bite module traverses the rotated workpiece while applying vibration to the at least one sequential bite module; method.

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