WO2024255812A1 - Chip positioning apparatus, chip outer frame apparatus for gene sequencer, and gene sequencer - Google Patents

Chip positioning apparatus, chip outer frame apparatus for gene sequencer, and gene sequencer Download PDF

Info

Publication number
WO2024255812A1
WO2024255812A1 PCT/CN2024/099091 CN2024099091W WO2024255812A1 WO 2024255812 A1 WO2024255812 A1 WO 2024255812A1 CN 2024099091 W CN2024099091 W CN 2024099091W WO 2024255812 A1 WO2024255812 A1 WO 2024255812A1
Authority
WO
WIPO (PCT)
Prior art keywords
chip
frame
limiting
pressure claw
gene sequencer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/099091
Other languages
French (fr)
Chinese (zh)
Inventor
蔡克亚
王国伟
张彤
邵京
贾海舟
孟佳
王伟
卢伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sikun Life Science Co Ltd
Original Assignee
Sikun Life Science Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202310699027.3A external-priority patent/CN116536145A/en
Priority claimed from CN202322038680.3U external-priority patent/CN220531663U/en
Priority claimed from CN202323165477.9U external-priority patent/CN221397857U/en
Application filed by Sikun Life Science Co Ltd filed Critical Sikun Life Science Co Ltd
Priority to KR1020257040035A priority Critical patent/KR20260004486A/en
Publication of WO2024255812A1 publication Critical patent/WO2024255812A1/en
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L9/00Supporting devices; Holding devices
    • B01L9/52Supports specially adapted for flat sample carriers, e.g. for plates, slides, chips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L9/00Supporting devices; Holding devices
    • CCHEMISTRY; METALLURGY
    • C12BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12MAPPARATUS FOR ENZYMOLOGY OR MICROBIOLOGY; APPARATUS FOR CULTURING MICROORGANISMS FOR PRODUCING BIOMASS, FOR GROWING CELLS OR FOR OBTAINING FERMENTATION OR METABOLIC PRODUCTS, i.e. BIOREACTORS OR FERMENTERS
    • C12M1/00Apparatus for enzymology or microbiology
    • C12M1/34Measuring or testing with condition measuring or sensing means, e.g. colony counters
    • CCHEMISTRY; METALLURGY
    • C12BIOCHEMISTRY; BEER; SPIRITS; WINE; VINEGAR; MICROBIOLOGY; ENZYMOLOGY; MUTATION OR GENETIC ENGINEERING
    • C12QMEASURING OR TESTING PROCESSES INVOLVING ENZYMES, NUCLEIC ACIDS OR MICROORGANISMS; COMPOSITIONS OR TEST PAPERS THEREFOR; PROCESSES OF PREPARING SUCH COMPOSITIONS; CONDITION-RESPONSIVE CONTROL IN MICROBIOLOGICAL OR ENZYMOLOGICAL PROCESSES
    • C12Q1/00Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions
    • C12Q1/68Measuring or testing processes involving enzymes, nucleic acids or microorganisms; Compositions therefor; Processes of preparing such compositions involving nucleic acids
    • C12Q1/6869Methods for sequencing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/02Adapting objects or devices to another
    • B01L2200/025Align devices or objects to ensure defined positions relative to each other
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2200/00Solutions for specific problems relating to chemical or physical laboratory apparatus
    • B01L2200/06Fluid handling related problems
    • B01L2200/0689Sealing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0809Geometry, shape and general structure rectangular shaped
    • B01L2300/0819Microarrays; Biochips
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B01PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01LCHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
    • B01L2300/00Additional constructional details
    • B01L2300/08Geometry, shape and general structure
    • B01L2300/0848Specific forms of parts of containers

Definitions

  • the present application relates to the field of chip processing gene sequencing, and specifically, to a chip positioning device, a chip frame device for a gene sequencer, and a gene sequencer.
  • the purpose of the present application is to provide a chip positioning device, a chip frame device for a gene sequencer, and a gene sequencer, which can quickly position the chip.
  • a chip positioning device for positioning a chip in a gene sequencer, the device comprising:
  • a base used for carrying the chip
  • a first limiting structure fixedly connected to the base, used to abut against the chip to limit the chip from moving along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other;
  • a second limiting structure movably connected to the base, and used to abut against the chip to limit the movement of the chip in a direction opposite to the first direction and in a direction opposite to the second direction;
  • the execution structure is connected to the base and abuts against the second limiting structure, and is used to push the second limiting structure to move along the first direction and the second direction to abut against the chip.
  • the second limiting structure forms an abutment surface, and the abutment surface is inclined from a direction opposite to the first direction toward a direction opposite to the second direction;
  • the execution structure includes an abutment member and an elastic member; the elastic member is connected to the base and the abutment member to push the abutment member to move; the abutment member abuts against the abutment surface to push the second limiting structure to move along the first direction and the second direction under the action of the elastic member.
  • the abutment member is rotatably connected to the base, and a rotation axis of the abutment member is parallel to the second direction.
  • one end of the elastic member is fixedly connected to the base, and the other end of the elastic member is fixedly connected to one end of the abutment member, and the elastic member is used to push the abutment member to rotate toward a direction close to the second limiting structure.
  • a pressing portion is formed on the abutment member, and the pressing portion is arranged on a side of the abutment member away from the elastic member.
  • the pressing portion is used to receive external force and rotate in a direction away from the second limiting structure under the action of the external force.
  • the first limiting structure includes:
  • a first limiting member fixedly connected to the base, and used to abut against the chip to limit the movement of the chip along the first direction;
  • the second limiting member is fixedly connected to the base and is used to abut against the chip to limit the chip from moving along the The second direction of movement.
  • the second limiting structure is annular, and a cavity for accommodating the chip is formed inside the second limiting structure;
  • the second limiting structure has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction.
  • the second limiting structure forms an opening, the opening is connected to the cavity, and the opening is used to accommodate the first limiting member and the second limiting member.
  • it also includes:
  • the cover body is rotatably connected to the base and is used for pressing the chip when the cover body is close to the base.
  • At least two groups of pressing claw assemblies are symmetrically installed on the lower surface of the cover body, and the at least two groups of pressing claw assemblies abut against the chip when the cover body is close to the base, so as to press and fix the chip.
  • the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip.
  • the pressure claw assembly also includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring.
  • the pressure jaw assembly further includes a supporting member, the pressure jaw is disposed between the supporting member and the rotating shaft, and a middle portion of the pressure jaw abuts against the supporting member.
  • the contact point between the pressing claw and the supporting member has an arc-shaped convex surface, and the pressing claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip.
  • a limiting groove is provided on the top of the pressing claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressing claw frame.
  • the contact surface between the pressure claw and the chip is a flexible structure
  • the flexible structure is one of a rubber pad, a sponge pad and a polyurethane foam.
  • the chip is provided with a plurality of flow channels arranged along its length direction, and fluid ports are respectively provided on both sides of the flow channels along the thickness direction of the chip, and the fluid ports are connected to the flow channel ports in the base.
  • a chip frame device for a gene sequencer comprising a chip frame, a chip and a sealing gasket, the chip frame is provided with a chip slot, the chip is arranged in the chip slot, and the chip slot is provided with a first fixing mechanism for fixing the chip;
  • the sealing gasket is detachably mounted on the bottom of the chip frame
  • the chip is provided with a plurality of transverse and mutually parallel fluid grooves inside, the lower end surface of the chip is provided with a fluid port connected with both ends of the fluid grooves, the sealing gasket is provided with a fluid circular hole, and the fluid port and the fluid circular hole are connected in sequence.
  • the sealing gasket is provided with a plug-in groove for engaging with the plug-in boss of the gene sequencer.
  • the first fixing mechanism includes an upper limit plate and a lower limit plate, and there are at least one pair of the upper limit plate and the lower limit plate respectively.
  • the at least one pair of upper and lower limit plates are respectively fixedly mounted on the inner walls on opposite sides of the chip frame, and the chip is accommodated in a groove formed between the upper limit plate and the lower limit plate.
  • the first fixing mechanism also includes a limiting boss, which is fixedly mounted on the inner side wall of the chip frame, and at least one limiting boss is arranged on each inner side wall of the chip frame, and the limiting boss has a contact surface that conflicts with the side wall of the chip.
  • the contact surface is a plane, a curved surface or a spherical surface.
  • the limiting boss located on the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip outer frame through an elastic sheet and has a pressing force toward the inner side of the chip slot. Elasticity.
  • the limiting boss located on the left side has an inclined surface that is inclined from top to bottom toward the inside, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss.
  • a hook is fixedly provided at the bottom of the chip frame, a hanging hole for the hook to be inserted is opened on the sealing gasket, and the sealing gasket is connected to the hook at the bottom of the chip frame through the hanging hole.
  • a limiting notch is provided on the chip outer frame and corresponds to a positioning reference on the gene sequencer, and the positioning reference is embedded in the limiting notch.
  • the outer side wall of the chip frame has a positioning groove for positioning and cooperating with a positioning element on the gene sequencer, and when the positioning element is in a retracted position, the positioning element is separated from the positioning groove.
  • a gene sequencer comprising a chip platform for carrying a chip
  • a first limiting structure fixedly connected to the chip platform, used to abut against the chip to limit the movement of the chip along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other;
  • a chip outer frame movably connected to the chip platform, the chip outer frame is provided with a chip slot, the chip is arranged in the chip slot, so as to limit the movement of the chip in a direction opposite to the first direction and a direction opposite to the second direction;
  • An execution structure connected to the chip platform and abutting against the chip outer frame, used for pushing the chip outer frame to move along the first direction and the second direction to abut against the chip;
  • a sealing gasket detachably mounted on the bottom of the chip frame
  • a sealing block corresponding to the position of the sealing pad is arranged on the chip platform;
  • the chip is provided with a plurality of transverse and mutually parallel fluid grooves inside, the lower end surface of the chip is provided with a fluid port connected with the two ends of the fluid groove, the sealing gasket is provided with a fluid circular hole, the sealing block is provided with a flow channel opening, and the fluid port, the fluid circular hole and the flow channel opening are connected in sequence.
  • the chip outer frame forms an abutting surface, and the abutting surface is inclined from a direction opposite to the first direction toward a direction opposite to the second direction;
  • the execution structure includes an abutment member and an elastic member; the elastic member is connected to the chip platform and the abutment member to push the abutment member to move; the abutment member abuts against the abutment surface to push the chip frame to move along the first direction and the second direction under the action of the elastic member.
  • the abutment member is rotatably connected to the chip platform, and a rotation axis of the abutment member is parallel to the second direction.
  • one end of the elastic member is fixedly connected to the chip platform, and the other end of the elastic member is fixedly connected to one end of the abutment member, and the elastic member is used to push the abutment member to rotate toward the direction close to the chip frame.
  • a pressing portion is formed on the abutment member, and the pressing portion is arranged on a side of the abutment member away from the elastic member.
  • the pressing portion is used to receive external force and rotate in a direction away from the chip frame under the action of the external force.
  • the first limiting structure includes:
  • a first limiting member fixedly connected to the chip platform, and used to abut against the chip to limit the movement of the chip along the first direction;
  • the second limiting member is fixedly connected to the chip platform and is used for abutting against the chip to limit the movement of the chip along the second direction.
  • the chip frame is annular, and a cavity for accommodating the chip is formed inside the chip frame;
  • the chip frame has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction.
  • the chip frame forms an opening, and the opening is connected to the cavity.
  • the opening is used to accommodate the first limiting member and the second limiting member.
  • it also includes:
  • the cover body is rotatably connected to the chip platform and is used for pressing the chip when the cover body is close to the chip platform.
  • At least two groups of pressing claw assemblies are symmetrically installed on the lower surface of the cover body, and the at least two groups of pressing claw assemblies abut against the chip when the cover body is in a closed state, so as to press and fix the chip.
  • the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip.
  • the pressure claw assembly also includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring.
  • the pressure jaw assembly further includes a supporting member, the pressure jaw is disposed between the supporting member and the rotating shaft, and a middle portion of the pressure jaw abuts against the supporting member.
  • the contact point between the pressing claw and the supporting member has an arc-shaped convex surface, and the pressing claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip.
  • a limiting groove is provided on the top of the pressing claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressing claw frame.
  • a first fixing mechanism for fixing the chip is provided on the chip slot;
  • the first fixing mechanism includes an upper limit plate and a lower limit plate, and there are at least one pair of upper limit plates and lower limit plates respectively, and at least one pair of upper and lower limit plates are respectively fixedly installed on the inner walls on opposite sides of the chip outer frame, and the chip is accommodated in the groove formed between the upper limit plate and the lower limit plate.
  • the first fixing mechanism also includes a limiting boss, which is fixedly mounted on the inner side wall of the chip frame, and at least one limiting boss is arranged on each inner side wall of the chip frame, and the limiting boss has a contact surface that conflicts with the side wall of the chip.
  • the contact surface is a plane, a curved surface or a spherical surface.
  • the limiting boss located on the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip outer frame through an elastic sheet and has an elastic force that presses toward the inner side of the chip slot.
  • the limiting boss located on the left side has an inclined surface that is inclined from top to bottom toward the inside, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss.
  • the embodiment of the present application positions the chip at different positions through the cooperation of various mechanisms, which can effectively improve the positioning efficiency of the chip.
  • FIG1 is a schematic diagram of the structure of a chip positioning device provided in an embodiment of the present application.
  • FIG2 is a cross-sectional view of a chip positioning device provided in an embodiment of the present application.
  • FIG3 is a schematic diagram of a chip base structure used in a gene sequencer of the present application.
  • FIG4 is a schematic diagram showing the disassembled structure of the sequencing chip of FIG3 of the present application.
  • FIG5 is a schematic diagram showing the structure of the pressure claw assembly in FIG3 of the present application.
  • FIG6 is a schematic diagram of a side cross-sectional structure of FIG5 of the present application.
  • FIG. 7 is a schematic diagram of the front view structure of FIG. 5 of the present application.
  • FIG8 is a schematic diagram of the structure of a chip frame device for a gene sequencer
  • FIG9 is a schematic diagram of the back structure of a chip frame device for a gene sequencer
  • FIG10 is a top view of a chip frame device for a gene sequencer
  • FIG11 is a cross-sectional view of a hook in a chip frame device for a gene sequencer
  • FIG12 is a schematic diagram of the installation structure of a chip frame and a chip platform in a chip frame device for a gene sequencer;
  • FIG13 is a schematic diagram of the structure of a chip platform in a chip frame device for a gene sequencer
  • Chip outer frame 10 hook 101, elastic boss 102, limiting boss 103, upper limiting plate 104, lower limiting plate 105, positioning groove 106, limiting notch 107; Sequencing chip 20, fluid port 201, fluid groove 202; Sealing gasket 30, fluid circular hole 301, hanging hole 302, plug-in groove 303; Chip platform 40, positioning reference 401, positioning element 402, positioning head 402a; Sealing block 50, plug-in boss 501, flow channel port 502.
  • horizontal does not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted.
  • “horizontal” only means that its direction is more horizontal than “vertical”, and does not mean that the structure must be completely horizontal, but can be slightly tilted.
  • the terms “set”, “install”, “connect”, and “connect” should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements.
  • the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
  • an embodiment of the present application provides a chip split positioning device 100, the chip split positioning device 100 comprises: a base 110, a first limiting structure 120, a second limiting structure 130 and an execution structure 140.
  • the base 110 is used to carry the chip 200. Specifically, a plane may be formed on the base 110, and the plane may be parallel to the horizontal plane. When the chip 200 is carried on the base 110, the chip 200 is on the horizontal plane, and the position of the chip 200 can be determined by controlling the position of the chip 200 on the horizontal plane.
  • the first limiting structure 120 is fixedly connected to the base 110, and the first limiting structure 120 is used to abut against the chip 200.
  • the first limiting structure 120 can limit the movement of the chip 200 along the first direction and the second direction.
  • the first direction and the second direction can both be horizontal directions, and the first direction and the second direction are perpendicular to each other.
  • the first limiting structure 120 may include: a first limiting member 121 and a second limiting member 122, wherein the first limiting member 121 is fixedly connected to the base 110 and is used to abut against the chip 200 to limit the movement of the chip 200 in the first direction. That is, the first limiting member 121 is arranged on the path of the chip 200 moving in the first direction to prevent the chip 200 from continuing to move in the first direction.
  • the second limiting member 122 is fixedly connected to the base 110 and is used to abut against the chip 200 to limit the movement of the chip 200 in the second direction. That is, the second limiting member 122 is arranged on the path of the chip 200 moving in the second direction to prevent the chip 200 from continuing to move in the second direction.
  • the first limiting member 121 and the second limiting member 122 can both be set as columnar structures, and the side walls of the columnar structures can abut against the chip 200 to prevent the chip 200 from moving.
  • the second limiting structure 130 is movably connected to the base 110 and is used to abut against the chip 200. When the second limiting structure 130 abuts against the chip 200, the second limiting structure 130 can limit the chip 200 from moving in the opposite direction of the first direction and the opposite direction of the second direction.
  • the chip positioning device includes: a base, a first limiting structure, a second limiting structure and an execution structure.
  • the base is used to carry the chip.
  • the base can be used to place the chip on a horizontal plane to determine the position of the chip in the vertical direction;
  • the first limiting structure is fixedly connected to the base, the first limiting structure is used to abut against the chip, and the first limiting structure is used to limit the movement of the chip along the first direction and the second direction. Both the first direction and the second direction can be horizontal directions.
  • the chip In the horizontal direction, the chip only needs to be tightly fitted to the first limiting structure to fix the position of the chip on the horizontal plane; the second limiting structure is movably connected to the base, the second limiting structure is used to abut against the chip, and the second limiting structure is used to limit the movement of the chip in the opposite direction of the first direction and the opposite direction of the second direction.
  • the second limiting structure can be used to abut the first limiting structure to fix the position of the chip; the execution structure is connected to the base and abuts against the second limiting structure.
  • the execution structure is used to push the second limiting structure to move along the first direction and the second direction to abut against the chip; the execution structure can be used to push the second limiting structure to move along the first direction and the second direction, so that the chip is tightly fitted to the first limiting structure and the second limiting structure, thereby determining the position of the chip.
  • the execution structure can be used to simultaneously determine the position of the chip in the first direction and the position of the chip in the second direction on the horizontal plane, which can effectively improve the positioning efficiency of the chip.
  • the second limiting structure 130 can be set to be annular, and the interior of the second limiting structure 130 forms a cavity for accommodating the chip 200.
  • the two inner walls of the second limiting structure 130 namely the first inner wall 132 and the second inner wall 133, can be closely fitted to the chip 200.
  • the first inner wall 132 is used to abut against the chip 200 to limit the movement of the chip 200 in the opposite direction of the first direction;
  • the second inner wall 133 is used to abut against the chip 200 to limit the movement of the chip 200 in the opposite direction of the second direction.
  • the first inner wall 132 and the second inner wall 133 can be perpendicular to each other.
  • the second limiting structure 130 is an annular structure, the relative position relationship between the first inner wall 132 and the second inner wall 133 remains fixed. Therefore, by controlling the second limiting structure 130, the first inner wall 132 and the second inner wall 133 can be controlled simultaneously, so as to facilitate the determination of the position of the chip 200.
  • the execution structure 140 is connected to the base 110 and abuts against the second limiting structure 130.
  • the execution structure 140 is used to push the second limiting structure 130 to move along the first direction and the second direction so that the second limiting structure 130 abuts against the chip 200.
  • the execution structure 140 can be used to push the second limiting structure 130 to move along the first direction and the second direction so as to abut against the chip 200, and push the chip 200 to abut against the first limiting structure 120, so as to determine the position of the chip 200.
  • the second limit structure 130 forms an abutting surface 131, and the abutting surface 131 is inclined from the opposite direction of the first direction to the opposite direction of the second direction.
  • the structure 130 moves in the first direction and the second direction simultaneously.
  • the execution structure 140 includes an abutment member 141 and an elastic member 142.
  • the abutment member 141 abuts against the abutment surface 131 to push the second position-limiting structure 130 to move together in the first direction and the second direction.
  • the elastic member 142 is connected to the base 110 and the abutment member 141.
  • the elastic member 142 is used to push the abutment member 141 to move. Under the action of the elastic member 142, the abutment member 141 can be kept in a state of abutting against the second position-limiting member 122 structure, thereby ensuring the stability of the position of the chip 200.
  • the abutment 141 is rotatably connected to the base 110, and the rotation axis of the abutment 141 is parallel to the second direction. Specifically, by using the abutment 141 to be rotatably connected to the base 110, not only can the abutment 141 be moved closer to or farther from the second position-limiting structure 130 by rotation, but the position of the abutment 141 can also be kept stable to prevent the abutment 141 from separating from the base 110.
  • one end of the elastic member 142 is fixedly connected to the base 110, and the other end of the elastic member 142 is fixedly connected to one end of the abutting member 141, and the elastic member 142 is used to push the abutting member 141 to rotate in a direction close to the second limiting structure 130.
  • the end of the abutting member 141 abuts against the abutting surface 131 and pushes the second limiting structure 130 to move, thereby pushing the second limiting structure 130 to move in the first direction and the second direction at the same time, so as to determine the position of the chip 200.
  • a pressing portion is formed on the abutment 141, and the pressing portion is arranged on the side of the abutment 141 away from the elastic member 142.
  • the user can apply pressure to the pressing portion so that the abutment 141 can overcome the elastic force of the elastic member 142 and rotate in a direction away from the second limiting structure 130, thereby increasing the activity space of the second limiting structure 130, which is conducive to the placement of the chip 200.
  • the abutting member 141 may also be slidably connected to the base 110, and the elastic member 142 may allow the abutting member 141 to elastically abut against the abutting surface 131 of the second position-limiting structure 130. Under the elastic force of the elastic member 142, the abutting member 141 may slide along the first direction or the second direction and abut against the abutting surface 131, and then under the action of the abutting surface 131, the second position-limiting structure 130 is pushed to move toward the first direction and the second direction at the same time, so as to determine the position of the chip 200.
  • the second position-limiting structure 130 forms an opening, and the opening is connected to the cavity, and the opening is used to accommodate the first position-limiting member 121 and the second position-limiting member 122.
  • the opening can be set to three, wherein the first position-limiting member 121 is set to two, and the second position-limiting member 122 is set to one, two openings are used to place the first position-limiting member 121, and the other opening is used to place the second position-limiting member 122.
  • the chip separation and positioning device 100 further includes: a cover body 150 .
  • the cover 150 is rotatably connected to the base 110 .
  • the cover 150 is used to press the chip 200 when the cover 150 and the base 110 are close to each other, so that the vertical position of the chip 200 is further determined, and the position stability of the chip 200 is further ensured.
  • the cover 150 includes a pressing block, which is an elastic structure.
  • the pressing block presses the chip 200 to determine the position of the chip 200 in the vertical direction.
  • the present application also provides a chip processing device, which includes the above-mentioned chip split positioning device.
  • the above-mentioned chip split positioning device can be used to quickly position the chip, thereby improving work efficiency.
  • the present application provides a chip seat (i.e., the chip positioning device in Figure 1) applied to a gene sequencer, including a sequencing chip platform 2 (i.e., the base 110 in Figure 1) with a built-in sequencing chip 1 (i.e., the chip 200 in Figure 1), and also includes: a pressure cover 3 (i.e., the cover body 150 in Figure 1), which is rotatably installed on the upper surface of the sequencing chip platform 2 through an axle seat or a hinge.
  • a chip seat i.e., the chip positioning device in Figure 1 applied to a gene sequencer, including a sequencing chip platform 2 (i.e., the base 110 in Figure 1) with a built-in sequencing chip 1 (i.e., the chip 200 in Figure 1), and also includes: a pressure cover 3 (i.e., the cover body 150 in Figure 1), which is rotatably installed on the upper surface of the sequencing chip platform 2 through an axle seat or a hinge.
  • the chip seat includes at least two groups of pressing claw assemblies 4, which are symmetrically mounted on the lower surface of the pressing cover 3 and abut against the sequencing chip 1 to press and fix the sequencing chip 1.
  • the pressure claw assembly 4 includes a pressure claw frame 41, a rotating shaft 42 and a pressure claw 43. Through grooves are provided on both sides of the pressure claw frame 41 to be rotatably connected to the rotating shaft 42.
  • the pressure claw 43 abuts between the pressure claw frame 41 and the rotating shaft 42, and the pressure claw 43 is arranged in a "Z"-shaped structure.
  • the pressure claw 43 is used to press the sequencing chip 1.
  • the pressure claw assembly 4 also includes a spring 44.
  • One end of the pressure claw 43 is used to press the sequencing chip 1.
  • the other end of the pressure claw 43 is fixedly connected to the pressure claw frame 41 through the spring 44 to provide pressure for the pressure claw 43 to stably press the sequencing chip 1.
  • the pressing claw assembly 4 also includes a support member 45, and the pressing claw 43 is placed between the support member 45 and the rotating shaft 42.
  • the middle part of the pressing claw 43 abuts against the support member 45, which can make the rotation of the pressing claw 43 more stable, thereby improving the stability of the pressing claw 43.
  • the contact point between the pressure claw 43 and the support member 45 has an arc-shaped convex surface, and the pressure claw 43 can rotate along the arc-shaped convex surface to adapt to the angle of the sequencing chip 1 and can move slightly, especially when the pressure claw assembly 4 is located on the pressure cover 3 and has two or more pressure claws 43.
  • multiple pressure claws 43 can contact the upper surface of the sequencing chip 1 at the same time, which is more compliant.
  • a limiting groove 46 is opened on the top of the pressing claw 43, and the rotating shaft 42 passes through the limiting groove 46 and is rotatably connected to the pressing claw frame 41, so as to limit the pressing claw 3 and ensure the stability during rotation, thereby improving the stability of the pressing claw 43 in pressing the sequencing chip 1.
  • the contact surface between the pressure claw 43 and the sequencing chip 1 is a flexible structure, and the flexible structure is one of a rubber pad, a sponge pad and a polyurethane foam, so as to avoid scratches between the pressure claw 43 and the sequencing chip 1, thereby protecting the sequencing chip 1.
  • the chip seat also includes at least two groups of chip positioning blocks 5 and a chip frame 6 (i.e., the second limiting structure 130 in Figure 1).
  • the chip positioning blocks 5 are installed on the periphery of the top of the sequencing chip platform 2, and the chip frame 6 is arranged on the periphery of the sequencing chip 1 and is located in the installation area formed between the chip positioning blocks 5, which can position the sequencing chip 1, thereby improving the accuracy of detection.
  • a plurality of flow channels 7 arranged along the length direction are provided on the top of the sequencing chip 1 , and fluid ports 8 are respectively provided on both sides of the flow channels 7 along the thickness direction of the sequencing chip 1 , and the fluid ports 8 are connected to the flow channel ports 9 in the sequencing chip platform 2 to facilitate the flow of the test liquid.
  • the sequencing chip platform 2 further includes a sealing structure 11, which is located between the flow channel port 9 and the fluid port 8 and is used to seal and connect the flow channel port 9 and the fluid port 8.
  • the sealing structure 11 is a sealing gasket or a filling sealant to prevent leakage when the test liquid circulates and improve the sealing degree.
  • the working principle of this embodiment is as follows: when in use, first assemble the sequencing chip 1 and the chip frame 6 and place them inside the upper surface of the sequencing chip platform 2, and fix them by the chip positioning blocks 5 located at the four corners to ensure the accuracy of the placement and the accuracy of the detection. Then, the pressure cover 3 is turned over on the upper surface of the sequencing chip platform 2, and the pressure cover 3 drives the pressure claw assembly 4 to move synchronously until the pressure claw 43 is tightly attached to the upper surface of the sequencing chip 1 to clamp and fix the sequencing chip 1.
  • the elastic force of the spring 44 cooperates with the rotating shaft 42 and the support 45 to form a lever principle, so that one end of the pressure claw 43 gives a certain clamping force to the sequencing chip 1, keeps the entire clamping mechanism working smoothly, clamps and positions the edge of the sequencing chip 1, and the bottom surface of the pressure claw 3 corresponding to the contact with the sequencing chip 1 is prevented from scratching the sequencing chip 1 through the sealing cushion when pressing down, thereby providing protection.
  • the sequencing chip 1 presses the sealing structure 11 vertically downward through the cooperation of the spring 44 and the pressure claw 43, so that the sealing structure 11 forms a seal between the fluid port 8 and the flow channel port 9, thereby preventing leakage when the subsequent sequencing reaction working liquid passes through.
  • the sequencing chip 1 is positioned, and the sequencing chip 1 and internal components are protected, which is convenient for carrying and use in multiple locations.
  • the sequencing chip can be tightly pressed to ensure the flatness and tightness of the sequencing chip and avoid leakage; further, the sequencing chip can be positioned and the internal sequencing chip and internal components can be protected, making it convenient to carry and use in multiple locations.
  • This embodiment provides a chip frame device for a gene sequencer, which is used to fix a sequencing chip 20 (i.e., the chip in Figure 1 and the sequencing chip 1 in Figure 3) so that the sequencing chip 20 is stably installed on the gene sequencer to improve the clarity of image acquisition.
  • the chip frame device includes a chip frame 10 (i.e., the second limiting structure 130 in Figure 1 and the chip frame 6 in Figure 3), a sealing gasket 30, a sealing block 50 (i.e., the sealing structure 11 in Figure 4), and a chip platform 40 (i.e., the base 110 in Figure 1 and the sequencing chip 1 in Figure 3).
  • the chip platform 2) includes a chip frame 10 which is a generally rectangular frame.
  • the interior of the chip frame 10 is provided with a chip slot for accommodating and fixing the sequencing chip 20.
  • the chip slot is provided with a first fixing mechanism for fixing the sequencing chip 20.
  • the sequencing chip 20 can be stably installed in the chip slot, and at the same time, the sequencing chip 20 can be stably limited in the front-to-back, left-to-right, and up-and-down directions, thereby improving its installation fixity.
  • the sequencing chip 20 is provided with a plurality of transverse and mutually parallel fluid grooves 202 (i.e., the flow channels 7 in FIG. 3 ), and the lower end surface of the sequencing chip 20 is provided with fluid ports 201 connected to both ends of the fluid grooves 202.
  • the sealing gasket 30 is detachably mounted on the bottom of the chip outer frame 10 and corresponds to the position of the fluid ports 201 to improve the sealing performance at the fluid ports 201.
  • the sealing gasket 30 is provided with fluid circular holes 301 corresponding to the fluid ports 201 and connected to each other, so that the fluid in the fluid grooves 202 can flow into the fluid circular holes 301 in accordance with the fluid ports 201.
  • the chip platform 40 is used as a substrate to carry the chip frame 10, and the chip frame 10 with the sequencing chip 20 installed is fixed on the gene sequencer through the chip platform 40.
  • a second fixing mechanism is provided between the chip frame 10 and the chip platform 40. Through the provision of the second fixing mechanism, the chip frame 10 can be stably installed on the chip platform 40, thereby improving the overall stability.
  • the chip platform 40 is provided with a sealing block 50 corresponding to the position of the sealing gasket 30, and the sealing block 50 is provided with a flow channel opening 502 corresponding to the position of the fluid circular hole 301.
  • a plug-in groove 303 is opened on the sealing gasket 30, and a plug-in boss 501 matching the plug-in groove 303 is fixedly installed on the sealing block 50.
  • the sealing gasket 30 is fixedly installed at the bottom of the core outer frame and installed together on the chip platform 40. At this time, the plug-in groove 303 and the plug-in boss 501 are engaged with each other, thereby improving the positioning accuracy between the sealing gasket 30 and the sealing block 50, and ensuring the precise alignment of the fluid circular hole 301 and the flow channel opening 502.
  • the first fixing mechanism specifically includes an upper limit plate 104, a lower limit plate 105 and a limit boss 103, wherein the upper limit plate 104 and the lower limit plate 105 are respectively at least one pair, and at least one pair of upper and lower limit plates 105 are respectively fixedly installed on the inner walls on the opposite sides of the chip frame 10 and the two pairs of upper and lower limit plates 105 are symmetrically distributed.
  • one pair of upper and lower limit plates 105 are fixedly installed on the front inner wall of the chip frame 10
  • the other pair of upper and lower limit plates 105 are fixedly installed on the rear inner wall of the chip frame 10.
  • a groove for upper and lower limit positioning of the sequencing chip 20 is formed between the upper limit plate 104 and the lower limit plate 105.
  • the lower end surface of the sequencing chip 20 is supported on the lower limit plate 105, and the upper end surface thereof is in contact with the upper limit plate 104, thereby achieving the upper and lower position fixation of the sequencing chip 20.
  • the upper and lower limit plates 105 may be plates extending continuously along the inner wall of the chip frame 10 , or may be a plurality of plates separated from each other and arranged at intervals, which is not specifically limited here.
  • the limiting boss 103 is fixedly mounted on the inner side wall of the chip outer frame 10. At least one limiting boss 103 is arranged on each inner side wall of the chip outer frame 10.
  • the limiting boss 103 has a contact surface that conflicts with the side wall of the sequencing chip 20.
  • the contact surface can be a plane, an arc surface or a spherical surface.
  • the four side walls of the sequencing chip 20 are respectively in conflict with the contact surfaces on the limiting boss 103, thereby achieving multi-point limiting of the side wall of the sequencing chip 20 to achieve its position fixation in the front-back and left-right directions.
  • the limiting boss 103 located on the front side is an elastic boss 102
  • the elastic boss 102 is fixedly mounted on the inner wall of the chip outer frame 10 through an elastic sheet.
  • the elastic sheet is roughly parallel to the inner wall of the chip outer frame 10 and has an elastic force that presses toward the inner side of the chip slot.
  • the elastic boss 102 is fixedly mounted on the end of the elastic sheet.
  • the side of the chip frame located on the elastic boss 102 is elastic.
  • the elastic side of the chip outer frame 10 is pulled outward and a clearance space is generated.
  • the rear side of the sequencing chip 20 is inserted between the upper and lower limiting plates 105 on the rear side, and then the front side is inserted into the front side through the clearance space. It can be between the upper and lower limit plates 105 on the side.
  • the limiting boss 103 on the left side has an inclined surface that tilts inward from top to bottom, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss 103.
  • the sequencing chip 20 is inserted forward and backward, the sequencing chip 20 is pushed to the right, and the left side is pressed downward along the inclined surface, so that the sequencing chip 20 is smoothly buckled into the chip slot, further improving the installation convenience of the sequencing chip 20.
  • the inclined surface set on the limiting boss 103 on the right side can also achieve the same effect, and no specific limitation is made here.
  • the sealing gasket 30 and the chip frame 10 are detachably connected. Specifically, a hook 101 is fixedly provided at the bottom of the chip frame 10, and a hanging hole 302 is opened on the sealing gasket 30 for the hook 101 to be inserted. The sealing gasket 30 is connected to the hook 101 at the bottom of the chip frame 10 through the hanging hole 302, thereby fixing the two.
  • a second fixing mechanism is arranged between the chip frame 10 and the chip platform 40.
  • the second fixing mechanism includes at least one front-to-back positioning reference 401 (i.e., the first limiting member 121 in FIG. 1 ) and at least one left-to-right positioning reference 401 (i.e., the second limiting member 122 in FIG. 1 ) and a positioning element 402 (i.e., the execution structure 140 in FIG. 1 ).
  • the positioning reference 401 is fixedly installed on the chip platform 40.
  • a limiting notch 107 corresponding to the positioning reference 401 is provided on the chip frame 10.
  • the positioning element 402 and the chip platform 40 can be connected by sliding or pressing, and can be moved and switched between the retracted position and the positioning position.
  • the positioning element 402 is slidably installed on the chip platform 40, and a positioning head 402a is provided on the positioning element 402.
  • the positioning head 402a can be a plane, an arc surface or a spherical surface.
  • the outer wall of the chip frame 10 has a positioning groove 106 (that is, the groove body where the abutment surface 131 in Figure 1 is located) for the positioning head 402a to be inserted into.
  • the positioning head 402a is inserted into the positioning groove 106, thereby further fixing the chip frame 10.
  • the chip frame assembly of the present application has a compact structure.
  • the chip frame and the sequencing chip are fixed by a first fixing mechanism, thereby ensuring that the sequencing chip has a good stability effect in all directions of up and down, left and right, and front and back, and ensuring the accuracy and clarity of the sequencing chip image acquisition;
  • the chip frame and the chip platform are fixed to each other by a second fixing mechanism, thereby ensuring that the overall stability of the chip frame is strong;
  • the chip frame assembly of the present application realizes upper and lower position limits of the sequencing chip by setting the first fixing mechanism as an upper limit plate, a lower limit plate and a limit boss, and fixing at least two pairs of upper and lower limit plates on the opposite inner walls of the chip frame. At least one limit boss with a contact surface is set on each inner side wall of the chip frame to limit the side of the sequencing chip, thereby ensuring that it is fixedly limited in the horizontal direction.
  • the chip frame assembly of the present application sets one of the limiting bosses as an elastic boss, and the elastic boss is fixed to the side wall of the chip frame by an elastic sheet, so that the elastic boss has a certain interference in a free state.
  • the sequencing chip is installed, the sequencing chip is squeezed toward the opposite side of the elastic boss under the elastic force of the elastic boss, ensuring that the sequencing chip is more stable in the front and back directions.
  • the side of the chip frame located on the elastic boss is elastic.
  • the elastic side of the chip frame is pulled outward and a clearance space is generated.
  • the rear side of the sequencing chip is inserted between the upper and lower limiting plates on the rear side, and then the front side is inserted between the upper and lower limiting plates on the front side through the clearance space, which is convenient for installation.
  • the chip frame assembly of the present application has an inclined surface that is inclined from top to bottom toward the inside on the limiting boss on the left side, and the lower end of the inclined surface is transitionally connected with the contact surface on the limiting boss.
  • the present application also provides a gene sequencer, which includes a chip platform for carrying chip;
  • a first limiting structure fixedly connected to the chip platform, used to abut against the chip to limit the movement of the chip along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other;
  • a chip outer frame movably connected to the chip platform, the chip outer frame is provided with a chip slot, the chip is arranged in the chip slot, so as to limit the movement of the chip in a direction opposite to the first direction and a direction opposite to the second direction;
  • An execution structure connected to the chip platform and abutting against the chip outer frame, used for pushing the chip outer frame to move along the first direction and the second direction to abut against the chip;
  • a sealing gasket detachably mounted on the bottom of the chip frame
  • the chip is provided with a plurality of transverse and mutually parallel fluid grooves, the lower end surface of the chip is provided with a fluid port connected with both ends of the fluid groove, the sealing gasket is provided with a fluid circular hole, the sealing block is provided with a flow channel port, and the fluid port, the fluid circular hole, and the flow channel port are connected in sequence.
  • the chip frame forms an abutment surface, and the abutment surface is inclined from the opposite direction of the first direction to the opposite direction of the second direction;
  • the execution structure includes an abutment member and an elastic member;
  • the elastic member is connected to the chip platform and the abutment member, and is used to push the abutment member to move;
  • the abutment member abuts against the abutment surface to push the chip frame to move along the first direction and the second direction under the action of the elastic member.
  • the abutment member is rotatably connected to the chip platform, and the rotation axis of the abutment member is parallel to the second direction.
  • the rotation axis of the abutment member is parallel to the second direction.
  • one end of the elastic member is fixedly connected to the chip platform, and the other end of the elastic member is fixedly connected to one end of the abutment member, and the elastic member is used to push the abutment member to rotate toward the direction close to the chip frame.
  • the elastic member is used to push the abutment member to rotate toward the direction close to the chip frame.
  • a pressing portion is formed on the abutment member, and the pressing portion is arranged on a side of the abutment member away from the elastic member, and the pressing portion is used to receive an external force and rotate in a direction away from the chip frame under the action of the external force.
  • the pressing portion is used to receive an external force and rotate in a direction away from the chip frame under the action of the external force.
  • the first limiting structure includes: a first limiting member fixedly connected to the chip platform and used to abut against the chip to limit the movement of the chip along the first direction; a second limiting member fixedly connected to the chip platform and used to abut against the chip to limit the movement of the chip along the second direction.
  • a first limiting member fixedly connected to the chip platform and used to abut against the chip to limit the movement of the chip along the first direction
  • a second limiting member fixedly connected to the chip platform and used to abut against the chip to limit the movement of the chip along the second direction.
  • the chip outer frame is annular, and a cavity for accommodating the chip is formed inside the chip outer frame;
  • the chip outer frame has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction.
  • the chip frame forms an opening, the opening is connected to the cavity, and the opening is used to accommodate the first stopper and the second stopper.
  • the opening is connected to the cavity, and the opening is used to accommodate the first stopper and the second stopper.
  • a cover body rotatably connected to the chip platform, for pressing the chip when close to the chip platform.
  • At least two groups of pressure claw assemblies are symmetrically installed on the lower surface of the cover, and the at least two groups of pressure claw assemblies abut against the chip when the cover is in a closed state, so as to press and fix the chip.
  • the at least two groups of pressure claw assemblies abut against the chip when the cover is in a closed state, so as to press and fix the chip.
  • the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip.
  • the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip.
  • the pressure claw assembly further includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring.
  • the pressure claw assembly further includes a support member, the pressure claw is disposed between the support member and the rotating shaft, and the middle portion of the pressure claw abuts against the support member.
  • the contact point between the pressure claw and the support member has an arc-shaped convex surface, and the pressure claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip.
  • a limiting groove is provided on the top of the pressing claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressing claw frame.
  • the chip slot is provided with a first fixing mechanism for fixing the chip;
  • the first fixing mechanism includes an upper limit plate and a lower limit plate, and the upper limit plate and the lower limit plate are at least one pair, and the at least one pair of upper and lower limit plates are respectively fixedly mounted on the inner walls of the opposite sides of the chip outer frame, and the chip is accommodated in the groove formed between the upper limit plate and the lower limit plate.
  • the first fixing mechanism further includes a limiting boss, which is fixedly mounted on the inner side wall of the chip outer frame, and each inner side wall of the chip outer frame is provided with at least one limiting boss, which has a contact surface that conflicts with the side wall of the chip.
  • a limiting boss which is fixedly mounted on the inner side wall of the chip outer frame, and each inner side wall of the chip outer frame is provided with at least one limiting boss, which has a contact surface that conflicts with the side wall of the chip.
  • the contact surface is a plane, a curved surface or a spherical surface.
  • the contact surface is a plane, a curved surface or a spherical surface.
  • the limiting boss located at the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip outer frame through an elastic sheet and has an elastic force to squeeze toward the inner side of the chip slot.
  • an elastic boss which is fixedly mounted on the inner wall of the chip outer frame through an elastic sheet and has an elastic force to squeeze toward the inner side of the chip slot.
  • the limiting boss on the left side has an inclined surface that tilts inward from top to bottom, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss.

Landscapes

  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Wood Science & Technology (AREA)
  • Zoology (AREA)
  • Proteomics, Peptides & Aminoacids (AREA)
  • Bioinformatics & Cheminformatics (AREA)
  • Biotechnology (AREA)
  • Clinical Laboratory Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Health & Medical Sciences (AREA)
  • Microbiology (AREA)
  • Genetics & Genomics (AREA)
  • Physics & Mathematics (AREA)
  • Biophysics (AREA)
  • Immunology (AREA)
  • Molecular Biology (AREA)
  • Sustainable Development (AREA)
  • Medicinal Chemistry (AREA)
  • Biomedical Technology (AREA)
  • Apparatus Associated With Microorganisms And Enzymes (AREA)

Abstract

Provided are a chip positioning apparatus, a chip outer frame apparatus for a gene sequencer, and a gene sequencer. The chip positioning apparatus is used for positioning a chip, and comprises: a base used for carrying said chip; a first limiting structure fixedly connected to the base and used for abutting against the chip so as to limit the movement of the chip in a first direction and a second direction, the first direction and the second direction being perpendicular to one another; a second limiting structure movably connected to the base and used for abutting against the chip so as to limit the movement of the chip in the direction opposite the first direction and the direction opposite the second direction; and an execution structure connected to the base and abutting against and holding the second limiting structure, used for pushing the second limiting structure to move in the first direction and the second direction such that the second limiting structure abuts against the chip. By using the execution structure, the position of the chip in the first direction on the horizontal plane and the position of the chip in the second direction on the horizontal plane can be determined simultaneously, thus effectively improving chip positioning efficiency.

Description

芯片定位装置、用于基因测序仪的芯片外框装置及基因测序仪Chip positioning device, chip outer frame device for gene sequencer and gene sequencer

本申请要求在2023年7月28日提交中国专利局、申请号为202322038680.3、申请名称为“芯片定位装置及芯片处理装置”的中国专利;在2023年11月22日提交中国专利局、申请号为202323165477.9、申请名称为“一种应用于基因测序仪的芯片座”的中国专利;在2023年6月13日提交中国专利局、申请号为202310699027.3、申请名称为“一种用于基因测序仪的芯片外框装置”的中国专利的优先权,其全部内容通过引用结合在本申请中。This application claims the priority of the Chinese patent filed with the Chinese Patent Office on July 28, 2023, with application number 202322038680.3 and application name “Chip positioning device and chip processing device”; the Chinese patent filed with the Chinese Patent Office on November 22, 2023, with application number 202323165477.9 and application name “A chip holder for a gene sequencer”; and the Chinese patent filed with the Chinese Patent Office on June 13, 2023, with application number 202310699027.3 and application name “A chip frame device for a gene sequencer”, all of which are incorporated by reference in this application.

技术领域Technical Field

本申请涉及芯片处理基因测序领域,具体而言,涉及一种芯片定位装置、用于基因测序仪的芯片外框装置及基因测序仪。The present application relates to the field of chip processing gene sequencing, and specifically, to a chip positioning device, a chip frame device for a gene sequencer, and a gene sequencer.

背景技术Background Art

生物芯片在使用的时候,需要将芯片固定于预设的位置,其位置的精确直接关系到实验结果的精确度,相关技术中对于生物芯片的位置的固定过程较为繁琐,需要从不同的方向进行分别固定,不易于操作。When a biochip is in use, it is necessary to fix the chip at a preset position. The accuracy of its position is directly related to the accuracy of the experimental results. In the related art, the process of fixing the position of the biochip is relatively cumbersome and needs to be fixed separately from different directions, which is not easy to operate.

发明内容Summary of the invention

本申请的目的在于提供一种芯片定位装置、用于基因测序仪的芯片外框装置及基因测序仪,其能够快速对芯片进行定位。The purpose of the present application is to provide a chip positioning device, a chip frame device for a gene sequencer, and a gene sequencer, which can quickly position the chip.

本申请的实施例是这样实现的:The embodiment of the present application is implemented as follows:

第一方面,提供了一种芯片定位装置,用于定位芯片于基因测序仪内,该装置包括:In a first aspect, a chip positioning device is provided for positioning a chip in a gene sequencer, the device comprising:

基座,用于承载所述芯片;A base, used for carrying the chip;

第一限位结构,固定连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿第一方向和第二方向运动;其中,所述第一方向和所述第二方向相互垂直;A first limiting structure, fixedly connected to the base, used to abut against the chip to limit the chip from moving along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other;

第二限位结构,活动连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿所述第一方向的相反方向和所述第二方向的相反方向运动;a second limiting structure, movably connected to the base, and used to abut against the chip to limit the movement of the chip in a direction opposite to the first direction and in a direction opposite to the second direction;

执行结构,连接于所述基座并抵持于所述第二限位结构,用于推动所述第二限位结构沿所述第一方向和所述第二方向运动,以抵接于所述芯片。The execution structure is connected to the base and abuts against the second limiting structure, and is used to push the second limiting structure to move along the first direction and the second direction to abut against the chip.

在一个具体的可实施方案中,所述第二限位结构形成抵接面,所述抵接面由所述第一方向的相反方向朝向所述第二方向的相反方向倾斜;In a specific possible implementation manner, the second limiting structure forms an abutment surface, and the abutment surface is inclined from a direction opposite to the first direction toward a direction opposite to the second direction;

所述执行结构包括抵接件和弹性件;所述弹性件连接于所述基座和所述抵接件,用于推动所述抵接件运动;所述抵接件抵接于所述抵接面以在所述弹性件的作用下推动第二限位结构沿第一方向和第二方向运动。The execution structure includes an abutment member and an elastic member; the elastic member is connected to the base and the abutment member to push the abutment member to move; the abutment member abuts against the abutment surface to push the second limiting structure to move along the first direction and the second direction under the action of the elastic member.

在一个具体的可实施方案中,所述抵接件转动连接于所述基座,所述抵接件的转动轴平行于所述第二方向。In a specific possible implementation manner, the abutment member is rotatably connected to the base, and a rotation axis of the abutment member is parallel to the second direction.

在一个具体的可实施方案中,所述弹性件的一端固定连接于所述基座,所述弹性件的另一端固定连接于所述抵接件的一端,所述弹性件用于推动所述抵接件朝向靠近于所述第二限位结构的方向转动。In a specific possible implementation manner, one end of the elastic member is fixedly connected to the base, and the other end of the elastic member is fixedly connected to one end of the abutment member, and the elastic member is used to push the abutment member to rotate toward a direction close to the second limiting structure.

在一个具体的可实施方案中,所述抵接件上形成按压部,所述按压部设置于所述抵接件背离于所述弹性件的一侧,所述按压部用于接收外力,并在外力的作用下朝向远离于所述第二限位结构的方向转动。In a specific possible implementation scheme, a pressing portion is formed on the abutment member, and the pressing portion is arranged on a side of the abutment member away from the elastic member. The pressing portion is used to receive external force and rotate in a direction away from the second limiting structure under the action of the external force.

在一个具体的可实施方案中,所述第一限位结构包括:In a specific implementation scheme, the first limiting structure includes:

第一限位件,固定连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿所述第一方向运动;A first limiting member, fixedly connected to the base, and used to abut against the chip to limit the movement of the chip along the first direction;

第二限位件,固定连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿所 述第二方向运动。The second limiting member is fixedly connected to the base and is used to abut against the chip to limit the chip from moving along the The second direction of movement.

在一个具体的可实施方案中,所述第二限位结构为环状,所述第二限位结构内部形成用于容纳所述芯片的空腔;所述第二限位结构具有第一内壁和第二内壁,所述第一内壁用于抵接于所述芯片,以限制所述芯片沿所述第一方向的相反方向运动;所述第二内壁用于抵接于所述芯片,以限制所述芯片沿所述第二方向的相反方向运动。In a specific possible implementation scheme, the second limiting structure is annular, and a cavity for accommodating the chip is formed inside the second limiting structure; the second limiting structure has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction.

在一个具体的可实施方案中,所述第二限位结构形成开孔,所述开孔连通于所述空腔,所述开孔用于容纳所述第一限位件和所述第二限位件。In a specific possible implementation manner, the second limiting structure forms an opening, the opening is connected to the cavity, and the opening is used to accommodate the first limiting member and the second limiting member.

在一个具体的可实施方案中,还包括:In a specific embodiment, it also includes:

盖体,转动连接于所述基座,用于在和所述基座靠近的状态下按压所述芯片。The cover body is rotatably connected to the base and is used for pressing the chip when the cover body is close to the base.

在一个具体的可实施方案中,在所述盖体的下表面对称安装至少两组压爪组件,且所述至少两组压爪组件在所述盖体在和所述基座靠近的状态下与所述芯片抵接,用于将所述芯片压紧固定。In a specific possible implementation manner, at least two groups of pressing claw assemblies are symmetrically installed on the lower surface of the cover body, and the at least two groups of pressing claw assemblies abut against the chip when the cover body is close to the base, so as to press and fix the chip.

在一个具体的可实施方案中,所述压爪组件包括压爪架、转轴和压爪,所述压爪架与所述转轴转动连接,所述压爪抵接在所述压爪架与所述转轴之间,所述压爪用于压紧所述芯片。In a specific possible implementation manner, the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip.

在一个具体的可实施方案中,所述压爪组件还包括弹簧,所述压爪的一端用于压紧所述芯片,所述压爪的另一端通过所述弹簧与所述压爪架固定连接。In a specific possible implementation scheme, the pressure claw assembly also includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring.

在一个具体的可实施方案中,所述压爪组件还包括支撑件,所述压爪置于所述支撑件和所述转轴之间,所述压爪的中部抵接所述支撑件。In a specific possible implementation manner, the pressure jaw assembly further includes a supporting member, the pressure jaw is disposed between the supporting member and the rotating shaft, and a middle portion of the pressure jaw abuts against the supporting member.

在一个具体的可实施方案中,所述压爪与所述支撑件的抵接处具有弧形凸面,所述压爪可沿所述弧形凸面旋转以适应所述芯片的角度。In a specific embodiment, the contact point between the pressing claw and the supporting member has an arc-shaped convex surface, and the pressing claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip.

在一个具体的可实施方案中,所述压爪的顶部开设限位槽,所述转轴穿过所述限位槽与所述压爪架转动连接。In a specific possible implementation mode, a limiting groove is provided on the top of the pressing claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressing claw frame.

在一个具体的可实施方案中,所述压爪与所述芯片的接触面为柔性结构,所述柔性结构为橡胶垫、海绵垫和聚氨酯泡沫之一。In a specific possible implementation manner, the contact surface between the pressure claw and the chip is a flexible structure, and the flexible structure is one of a rubber pad, a sponge pad and a polyurethane foam.

在一个具体的可实施方案中,所述芯片的内部设置沿其长度方向排布的多组流道,所述流道的两侧分别开设沿所述芯片厚度方向的流体口,所述流体口与所述基座内的流道口连通。In a specific implementation scheme, the chip is provided with a plurality of flow channels arranged along its length direction, and fluid ports are respectively provided on both sides of the flow channels along the thickness direction of the chip, and the fluid ports are connected to the flow channel ports in the base.

第二方面,提供了一种用于基因测序仪的芯片外框装置,该装置包括芯片外框、芯片及密封垫,所述芯片外框上设有芯片槽,所述芯片设置于芯片槽内,所述芯片槽上设置有用于对芯片进行固定的第一固定机构;In a second aspect, a chip frame device for a gene sequencer is provided, the device comprising a chip frame, a chip and a sealing gasket, the chip frame is provided with a chip slot, the chip is arranged in the chip slot, and the chip slot is provided with a first fixing mechanism for fixing the chip;

所述密封垫可拆卸安装在所述芯片外框的底部;The sealing gasket is detachably mounted on the bottom of the chip frame;

所述芯片的内部开设置有多个横置且相互平行的流体槽,所述芯片的下端面开设有与所述流体槽的两端连通的流体口,所述密封垫上设置有流体圆孔,所述流体口、流体圆孔依次连通。The chip is provided with a plurality of transverse and mutually parallel fluid grooves inside, the lower end surface of the chip is provided with a fluid port connected with both ends of the fluid grooves, the sealing gasket is provided with a fluid circular hole, and the fluid port and the fluid circular hole are connected in sequence.

在一个具体的可实施方案中,所述密封垫上开设有用于与所述基因测序仪的插接凸台卡合的插接槽。In a specific possible implementation manner, the sealing gasket is provided with a plug-in groove for engaging with the plug-in boss of the gene sequencer.

在一个具体的可实施方案中,所述第一固定机构包括上限位板和下限位板,所述上限位板和下限位板分别至少有一对,至少一对的上、下限位板分别固定安装在所述芯片外框的相对两侧内壁上,所述芯片容置于上限位板和下限位板之间形成的槽内。In a specific implementation scheme, the first fixing mechanism includes an upper limit plate and a lower limit plate, and there are at least one pair of the upper limit plate and the lower limit plate respectively. The at least one pair of upper and lower limit plates are respectively fixedly mounted on the inner walls on opposite sides of the chip frame, and the chip is accommodated in a groove formed between the upper limit plate and the lower limit plate.

在一个具体的可实施方案中,所述第一固定机构还包括限位凸台,所述限位凸台固定安装在所述芯片外框的内侧壁上,所述芯片外框的每个内侧壁上设置有至少一个限位凸台,限位凸台上具有与所述芯片的侧壁相抵触的接触面。In a specific implementation scheme, the first fixing mechanism also includes a limiting boss, which is fixedly mounted on the inner side wall of the chip frame, and at least one limiting boss is arranged on each inner side wall of the chip frame, and the limiting boss has a contact surface that conflicts with the side wall of the chip.

在一个具体的可实施方案中,所述接触面为是平面、弧面或球面的一种。In a specific implementation manner, the contact surface is a plane, a curved surface or a spherical surface.

在一个具体的可实施方案中,位于前侧的所述限位凸台为弹性凸台,所述弹性凸台通过弹性片固定安装在所述芯片外框的内壁上,并具有朝向芯片槽内侧方向挤压的 弹力。In a specific embodiment, the limiting boss located on the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip outer frame through an elastic sheet and has a pressing force toward the inner side of the chip slot. Elasticity.

在一个具体的可实施方案中,位于左侧的所述限位凸台上具有一自上而下朝内侧倾斜的倾斜面,所述倾斜面的下端与该限位凸台上的接触面过渡连接。In a specific possible implementation manner, the limiting boss located on the left side has an inclined surface that is inclined from top to bottom toward the inside, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss.

在一个具体的可实施方案中,所述芯片外框的底部固定设置有挂钩,所述密封垫上开设有用于使挂钩卡入的挂孔,密封垫通过挂孔卡接在芯片外框底部的挂钩处。In a specific implementation scheme, a hook is fixedly provided at the bottom of the chip frame, a hanging hole for the hook to be inserted is opened on the sealing gasket, and the sealing gasket is connected to the hook at the bottom of the chip frame through the hanging hole.

在一个具体的可实施方案中,所述芯片外框上开设有与位于所述基因测序仪上的定位基准对应配合的限位缺口,所述定位基准嵌入所述限位缺口内。In a specific possible implementation scheme, a limiting notch is provided on the chip outer frame and corresponds to a positioning reference on the gene sequencer, and the positioning reference is embedded in the limiting notch.

在一个具体的可实施方案中,所述芯片外框的外侧壁上具有用于与所述基因测序仪上的定位元件定位配合的定位槽,当定位元件处于缩回位置时,所述定位元件与定位槽分离。In a specific possible implementation scheme, the outer side wall of the chip frame has a positioning groove for positioning and cooperating with a positioning element on the gene sequencer, and when the positioning element is in a retracted position, the positioning element is separated from the positioning groove.

第三方面,提供了一种基因测序仪,该基因测序仪包括芯片平台,用于承载芯片;In a third aspect, a gene sequencer is provided, the gene sequencer comprising a chip platform for carrying a chip;

第一限位结构,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿第一方向和第二方向运动;其中,所述第一方向和所述第二方向相互垂直;A first limiting structure, fixedly connected to the chip platform, used to abut against the chip to limit the movement of the chip along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other;

芯片外框,活动连接于所述芯片平台,所述芯片外框上设有芯片槽,所述芯片设置于芯片槽内,以限制所述芯片沿所述第一方向的相反方向和所述第二方向的相反方向运动;A chip outer frame, movably connected to the chip platform, the chip outer frame is provided with a chip slot, the chip is arranged in the chip slot, so as to limit the movement of the chip in a direction opposite to the first direction and a direction opposite to the second direction;

执行结构,连接于所述芯片平台并抵持于所述芯片外框,用于推动所述芯片外框沿所述第一方向和所述第二方向运动,以抵接于所述芯片;An execution structure, connected to the chip platform and abutting against the chip outer frame, used for pushing the chip outer frame to move along the first direction and the second direction to abut against the chip;

密封垫,可拆卸安装在所述芯片外框的底部;A sealing gasket, detachably mounted on the bottom of the chip frame;

所述芯片平台上设置有与所述密封垫位置对应的密封块;A sealing block corresponding to the position of the sealing pad is arranged on the chip platform;

所述芯片的内部开设置有多个横置且相互平行的流体槽,所述芯片的下端面开设有与所述流体槽的两端连通的流体口,所述密封垫上设置有流体圆孔,所述密封块上开设有的流道口,所述流体口、流体圆孔、流道口依次连通。The chip is provided with a plurality of transverse and mutually parallel fluid grooves inside, the lower end surface of the chip is provided with a fluid port connected with the two ends of the fluid groove, the sealing gasket is provided with a fluid circular hole, the sealing block is provided with a flow channel opening, and the fluid port, the fluid circular hole and the flow channel opening are connected in sequence.

在一个具体的可实施方案中,所述芯片外框形成抵接面,所述抵接面由所述第一方向的相反方向朝向所述第二方向的相反方向倾斜;In a specific possible implementation manner, the chip outer frame forms an abutting surface, and the abutting surface is inclined from a direction opposite to the first direction toward a direction opposite to the second direction;

所述执行结构包括抵接件和弹性件;所述弹性件连接于所述芯片平台和所述抵接件,用于推动所述抵接件运动;所述抵接件抵接于所述抵接面以在所述弹性件的作用下推动芯片外框沿第一方向和第二方向运动。The execution structure includes an abutment member and an elastic member; the elastic member is connected to the chip platform and the abutment member to push the abutment member to move; the abutment member abuts against the abutment surface to push the chip frame to move along the first direction and the second direction under the action of the elastic member.

在一个具体的可实施方案中,所述抵接件转动连接于所述芯片平台,所述抵接件的转动轴平行于所述第二方向。In a specific possible implementation manner, the abutment member is rotatably connected to the chip platform, and a rotation axis of the abutment member is parallel to the second direction.

在一个具体的可实施方案中,所述弹性件的一端固定连接于所述芯片平台,所述弹性件的另一端固定连接于所述抵接件的一端,所述弹性件用于推动所述抵接件朝向靠近于所述芯片外框的方向转动。In a specific implementation scheme, one end of the elastic member is fixedly connected to the chip platform, and the other end of the elastic member is fixedly connected to one end of the abutment member, and the elastic member is used to push the abutment member to rotate toward the direction close to the chip frame.

在一个具体的可实施方案中,所述抵接件上形成按压部,所述按压部设置于所述抵接件背离于所述弹性件的一侧,所述按压部用于接收外力,并在外力的作用下朝向远离于所述芯片外框的方向转动。In a specific implementation scheme, a pressing portion is formed on the abutment member, and the pressing portion is arranged on a side of the abutment member away from the elastic member. The pressing portion is used to receive external force and rotate in a direction away from the chip frame under the action of the external force.

在一个具体的可实施方案中,所述第一限位结构包括:In a specific implementation scheme, the first limiting structure includes:

第一限位件,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿所述第一方向运动;A first limiting member, fixedly connected to the chip platform, and used to abut against the chip to limit the movement of the chip along the first direction;

第二限位件,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿所述第二方向运动。The second limiting member is fixedly connected to the chip platform and is used for abutting against the chip to limit the movement of the chip along the second direction.

在一个具体的可实施方案中,所述芯片外框为环状,所述芯片外框内部形成用于容纳所述芯片的空腔;所述芯片外框具有第一内壁和第二内壁,所述第一内壁用于抵接于所述芯片,以限制所述芯片沿所述第一方向的相反方向运动;所述第二内壁用于抵接于所述芯片,以限制所述芯片沿所述第二方向的相反方向运动。In a specific possible implementation scheme, the chip frame is annular, and a cavity for accommodating the chip is formed inside the chip frame; the chip frame has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction.

在一个具体的可实施方案中,所述芯片外框形成开孔,所述开孔连通于所述空腔, 所述开孔用于容纳所述第一限位件和所述第二限位件。In a specific embodiment, the chip frame forms an opening, and the opening is connected to the cavity. The opening is used to accommodate the first limiting member and the second limiting member.

在一个具体的可实施方案中,还包括:In a specific embodiment, it also includes:

盖体,转动连接于所述芯片平台,用于在和所述芯片平台靠近的状态下按压所述芯片。The cover body is rotatably connected to the chip platform and is used for pressing the chip when the cover body is close to the chip platform.

在一个具体的可实施方案中,在所述盖体的下表面对称安装至少两组压爪组件,且所述至少两组压爪组件在所述盖体处于关合状态时与所述芯片抵接,用于将所述芯片压紧固定。In a specific possible implementation manner, at least two groups of pressing claw assemblies are symmetrically installed on the lower surface of the cover body, and the at least two groups of pressing claw assemblies abut against the chip when the cover body is in a closed state, so as to press and fix the chip.

在一个具体的可实施方案中,所述压爪组件包括压爪架、转轴和压爪,所述压爪架与所述转轴转动连接,所述压爪抵接在所述压爪架与所述转轴之间,所述压爪用于压紧所述芯片。In a specific possible implementation manner, the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip.

在一个具体的可实施方案中,所述压爪组件还包括弹簧,所述压爪的一端用于压紧所述芯片,所述压爪的另一端通过所述弹簧与所述压爪架固定连接。In a specific possible implementation scheme, the pressure claw assembly also includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring.

在一个具体的可实施方案中,所述压爪组件还包括支撑件,所述压爪置于所述支撑件和所述转轴之间,所述压爪的中部抵接所述支撑件。In a specific possible implementation manner, the pressure jaw assembly further includes a supporting member, the pressure jaw is disposed between the supporting member and the rotating shaft, and a middle portion of the pressure jaw abuts against the supporting member.

在一个具体的可实施方案中,所述压爪与所述支撑件的抵接处具有弧形凸面,所述压爪可沿所述弧形凸面旋转以适应所述芯片的角度。In a specific embodiment, the contact point between the pressing claw and the supporting member has an arc-shaped convex surface, and the pressing claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip.

在一个具体的可实施方案中,所述压爪的顶部开设限位槽,所述转轴穿过所述限位槽与所述压爪架转动连接。In a specific possible implementation mode, a limiting groove is provided on the top of the pressing claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressing claw frame.

在一个具体的可实施方案中,所述芯片槽上设置有用于对芯片进行固定的第一固定机构;所述第一固定机构包括上限位板和下限位板,所述上限位板和下限位板分别至少有一对,至少一对的上、下限位板分别固定安装在所述芯片外框的相对两侧内壁上,所述芯片容置于上限位板和下限位板之间形成的槽内。In a specific feasible implementation scheme, a first fixing mechanism for fixing the chip is provided on the chip slot; the first fixing mechanism includes an upper limit plate and a lower limit plate, and there are at least one pair of upper limit plates and lower limit plates respectively, and at least one pair of upper and lower limit plates are respectively fixedly installed on the inner walls on opposite sides of the chip outer frame, and the chip is accommodated in the groove formed between the upper limit plate and the lower limit plate.

在一个具体的可实施方案中,所述第一固定机构还包括限位凸台,所述限位凸台固定安装在所述芯片外框的内侧壁上,所述芯片外框的每个内侧壁上设置有至少一个限位凸台,限位凸台上具有与所述芯片的侧壁相抵触的接触面。In a specific implementation scheme, the first fixing mechanism also includes a limiting boss, which is fixedly mounted on the inner side wall of the chip frame, and at least one limiting boss is arranged on each inner side wall of the chip frame, and the limiting boss has a contact surface that conflicts with the side wall of the chip.

在一个具体的可实施方案中,所述接触面为是平面、弧面或球面的一种。In a specific implementation manner, the contact surface is a plane, a curved surface or a spherical surface.

在一个具体的可实施方案中,位于前侧的所述限位凸台为弹性凸台,所述弹性凸台通过弹性片固定安装在所述芯片外框的内壁上,并具有朝向芯片槽内侧方向挤压的弹力。In a specific possible implementation manner, the limiting boss located on the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip outer frame through an elastic sheet and has an elastic force that presses toward the inner side of the chip slot.

在一个具体的可实施方案中,位于左侧的所述限位凸台上具有一自上而下朝内侧倾斜的倾斜面,所述倾斜面的下端与该限位凸台上的接触面过渡连接。In a specific possible implementation manner, the limiting boss located on the left side has an inclined surface that is inclined from top to bottom toward the inside, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss.

本申请的有益效果是:The beneficial effects of this application are:

本申请实施例通过各个机构的配合在不同的方位对芯片进行定位,可以有效提高芯片的定位效率。The embodiment of the present application positions the chip at different positions through the cooperation of various mechanisms, which can effectively improve the positioning efficiency of the chip.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

为了更清楚地说明本申请实施例的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,应当理解,以下附图仅示出了本申请的某些实施例,因此不应被看作是对范围的限定,对于本基因测序领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他相关的附图。In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only illustrate certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in the field of gene sequencing, other relevant drawings can be obtained based on these drawings without creative work.

图1为本申请实施例提供的芯片定位装置的结构示意图;FIG1 is a schematic diagram of the structure of a chip positioning device provided in an embodiment of the present application;

图2为本申请实施例提供的芯片定位装置的剖面图;FIG2 is a cross-sectional view of a chip positioning device provided in an embodiment of the present application;

图3给出本申请一种应用于基因测序仪的芯片座结构示意图;FIG3 is a schematic diagram of a chip base structure used in a gene sequencer of the present application;

图4给出本申请图3的测序芯片拆卸结构示意图;FIG4 is a schematic diagram showing the disassembled structure of the sequencing chip of FIG3 of the present application;

图5给出本申请图3中压爪组件的结构示意图;FIG5 is a schematic diagram showing the structure of the pressure claw assembly in FIG3 of the present application;

图6给出本申请图5的侧视向剖面结构示意图; FIG6 is a schematic diagram of a side cross-sectional structure of FIG5 of the present application;

图7给出本申请图5的正视向结构示意图。FIG. 7 is a schematic diagram of the front view structure of FIG. 5 of the present application.

图8为用于基因测序仪的芯片外框装置的结构示意图;FIG8 is a schematic diagram of the structure of a chip frame device for a gene sequencer;

图9为用于基因测序仪的芯片外框装置的背面结构示意图;FIG9 is a schematic diagram of the back structure of a chip frame device for a gene sequencer;

图10为用于基因测序仪的芯片外框装置的俯视图;FIG10 is a top view of a chip frame device for a gene sequencer;

图11为用于基因测序仪的芯片外框装置中挂钩处的剖视图;FIG11 is a cross-sectional view of a hook in a chip frame device for a gene sequencer;

图12为用于基因测序仪的芯片外框装置中芯片外框与芯片平台的安装结构示意图;FIG12 is a schematic diagram of the installation structure of a chip frame and a chip platform in a chip frame device for a gene sequencer;

图13为用于基因测序仪的芯片外框装置中芯片平台的结构示意图;FIG13 is a schematic diagram of the structure of a chip platform in a chip frame device for a gene sequencer;

图标:
100、芯片分体定位装置;110、基座;120、第一限位结构;121、
第一限位件;122、第二限位件;130、第二限位结构;131、抵接面;132、第一内壁;133、第二内壁;140、执行结构;141、抵接件;142、弹性件;150、盖体;200、芯片。1、测序芯片;2、测序芯片平台;3、压盖;4、压爪组件;41、压爪架;42、转轴;43、压爪;44、弹簧;45、支撑件;46、限位槽;5、芯片定位块;6、芯片框;7、流道;8、流体口;9、流道口;11、密封结构;芯片外框10、挂钩101、弹性凸台102、限位凸台103、上限位板104、下限位板105、定位槽106、限位缺口107;测序芯片20、流体口201、流体槽202;密封垫30、流体圆孔301、挂孔302、插接槽303;芯片平台40、定位基准401、定位元件402、定位头402a;密封块50、插接凸台501、流道口502。
icon:
100, chip split positioning device; 110, base; 120, first limiting structure; 121,
First limiting member; 122, second limiting member; 130, second limiting structure; 131, abutting surface; 132, first inner wall; 133, second inner wall; 140, execution structure; 141, abutting member; 142, elastic member; 150, cover body; 200, chip. 1. Sequencing chip; 2. Sequencing chip platform; 3. Pressure cover; 4. Pressure claw assembly; 41. Pressure claw frame; 42. Rotating shaft; 43. Pressure claw; 44. Spring; 45. Support member; 46. Limiting groove; 5. Chip positioning block; 6. Chip frame; 7. Flow channel; 8. Fluid port; 9. Flow channel port; 11. Sealing structure; Chip outer frame 10, hook 101, elastic boss 102, limiting boss 103, upper limiting plate 104, lower limiting plate 105, positioning groove 106, limiting notch 107; Sequencing chip 20, fluid port 201, fluid groove 202; Sealing gasket 30, fluid circular hole 301, hanging hole 302, plug-in groove 303; Chip platform 40, positioning reference 401, positioning element 402, positioning head 402a; Sealing block 50, plug-in boss 501, flow channel port 502.

具体实施方式DETAILED DESCRIPTION

为使本申请实施例的目的、技术方案和优点更加清楚,下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例是本申请一部分实施例,而不是全部的实施例。通常在此处附图中描述和示出的本申请实施例的组件可以以各种不同的配置来布置和设计。In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

因此,以下对在附图中提供的本申请的实施例的详细描述并非旨在限制要求保护的本申请的范围,而是仅仅表示本申请的选定实施例。基于本申请中的实施例,本基因测序领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field of gene sequencing without creative work are within the scope of protection of the present application.

应注意到:相似的标号和字母在下面的附图中表示类似项,因此,一旦某一项在一个附图中被定义,则在随后的附图中不需要对其进行进一步定义和解释。It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

在本申请实施例的描述中,需要说明的是,术语“中心”、“上”、“下”、“左”、“右”、“竖直”、“水平”、“内”、“外”等指示的方位或位置关系为基于附图所示的方位或位置关系,或者是该申请产品使用时惯常摆放的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”、“第三”等仅用于区分描述,而不能理解为指示或暗示相对重要性。In the description of the embodiments of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or are the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

此外,术语“水平”、“竖直”、“悬垂”等术语并不表示要求部件绝对水平或悬垂,而是可以稍微倾斜。如“水平”仅仅是指其方向相对“竖直”而言更加水平,并不是表示该结构一定要完全水平,而是可以稍微倾斜。In addition, the terms "horizontal", "vertical", "overhanging" and the like do not mean that the components are required to be absolutely horizontal or overhanging, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

在本申请实施例的描述中,还需要说明的是,除非另有明确的规定和限定,术语“设置”、“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通。对于本基因测序领域的普通技术人员而言,可以具体情况理解上述术语在本申请实施例中的具体含义。In the description of the embodiments of the present application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal connection of two elements. For ordinary technicians in the field of gene sequencing, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

请参阅图1和图2,本申请的实施例提供的一种芯片分体定位装置100,该芯片分体定位装置100包括:基座110、第一限位结构120、第二限位结构130以及执行结构 140。Referring to FIG. 1 and FIG. 2 , an embodiment of the present application provides a chip split positioning device 100, the chip split positioning device 100 comprises: a base 110, a first limiting structure 120, a second limiting structure 130 and an execution structure 140.

基座110用于承载芯片200。具体的,基座110上可以形成平面,该平面可以平行于水平面,在芯片200承载于基座110上的情况下,该芯片200即处于水平面上,只需要控制芯片200在水平面上的位置,即可完成对芯片200的位置的确定。The base 110 is used to carry the chip 200. Specifically, a plane may be formed on the base 110, and the plane may be parallel to the horizontal plane. When the chip 200 is carried on the base 110, the chip 200 is on the horizontal plane, and the position of the chip 200 can be determined by controlling the position of the chip 200 on the horizontal plane.

第一限位结构120固定连接于基座110,第一限位结构120用于抵接于芯片200。在第一限位结构120抵接于芯片200的情况下,第一限位结构120可以限制芯片200沿第一方向和第二方向运动。其中,第一方向和第二方向均可以为水平方向,且第一方向和第二方向相互垂直。The first limiting structure 120 is fixedly connected to the base 110, and the first limiting structure 120 is used to abut against the chip 200. When the first limiting structure 120 abuts against the chip 200, the first limiting structure 120 can limit the movement of the chip 200 along the first direction and the second direction. The first direction and the second direction can both be horizontal directions, and the first direction and the second direction are perpendicular to each other.

具体的,第一限位结构120可以包括:第一限位件121和第二限位件122,第一限位件121固定连接于基座110,用于抵接于芯片200,以限制芯片200沿第一方向运动。即第一限位件121设置于芯片200沿第一方向运动的路径上,以阻止芯片200沿第一方向继续运动。第二限位件122固定连接于基座110,用于抵接于芯片200,以限制芯片200沿第二方向运动。即第二限位件122设置于芯片200沿第二方向运动的路径上,以阻止芯片200沿第二方向继续运动。具体的,第一限位件121和第二限位件122均可以设置为柱状结构,利用柱状结构的侧壁可以抵接于芯片200,以阻止芯片200运动。Specifically, the first limiting structure 120 may include: a first limiting member 121 and a second limiting member 122, wherein the first limiting member 121 is fixedly connected to the base 110 and is used to abut against the chip 200 to limit the movement of the chip 200 in the first direction. That is, the first limiting member 121 is arranged on the path of the chip 200 moving in the first direction to prevent the chip 200 from continuing to move in the first direction. The second limiting member 122 is fixedly connected to the base 110 and is used to abut against the chip 200 to limit the movement of the chip 200 in the second direction. That is, the second limiting member 122 is arranged on the path of the chip 200 moving in the second direction to prevent the chip 200 from continuing to move in the second direction. Specifically, the first limiting member 121 and the second limiting member 122 can both be set as columnar structures, and the side walls of the columnar structures can abut against the chip 200 to prevent the chip 200 from moving.

第二限位结构130活动连接于基座110,第二限位结构130用于抵接于芯片200。在第二限位结构130抵接于芯片200的情况下,第二限位结构130可以限制芯片200沿第一方向的相反方向和第二方向的相反方向运动。The second limiting structure 130 is movably connected to the base 110 and is used to abut against the chip 200. When the second limiting structure 130 abuts against the chip 200, the second limiting structure 130 can limit the chip 200 from moving in the opposite direction of the first direction and the opposite direction of the second direction.

本申请实施例提供的芯片定位装置包括:基座、第一限位结构、第二限位结构以及执行结构。基座用于承载芯片,利用基座可以使芯片放置于水平面上,确定芯片在竖直方向上的位置;第一限位结构固定连接于基座,第一限位结构用于抵接于芯片,第一限位结构用于限制芯片沿第一方向和第二方向运动,第一方向和第二方向均可以为水平方向,在水平方向上,只需要使芯片紧密贴合于第一限位结构,即可固定芯片在水平面上的位置;第二限位结构活动连接于基座,第二限位结构用于抵接于芯片,第二限位结构用于限制芯片沿第一方向的相反方向和第二方向的相反方向运动,利用第二限位结构可以使芯片抵接于第一限位结构,从而固定芯片的位置;执行结构连接于基座并抵持于第二限位结构,执行结构用于推动第二限位结构沿第一方向和第二方向运动,以抵接于芯片;利用执行结构可以推动第二限位结构沿第一方向和第二方向运动,使芯片紧密贴合于第一限位结构和第二限位结构,从而实现对芯片的位置的确定。The chip positioning device provided in the embodiment of the present application includes: a base, a first limiting structure, a second limiting structure and an execution structure. The base is used to carry the chip. The base can be used to place the chip on a horizontal plane to determine the position of the chip in the vertical direction; the first limiting structure is fixedly connected to the base, the first limiting structure is used to abut against the chip, and the first limiting structure is used to limit the movement of the chip along the first direction and the second direction. Both the first direction and the second direction can be horizontal directions. In the horizontal direction, the chip only needs to be tightly fitted to the first limiting structure to fix the position of the chip on the horizontal plane; the second limiting structure is movably connected to the base, the second limiting structure is used to abut against the chip, and the second limiting structure is used to limit the movement of the chip in the opposite direction of the first direction and the opposite direction of the second direction. The second limiting structure can be used to abut the first limiting structure to fix the position of the chip; the execution structure is connected to the base and abuts against the second limiting structure. The execution structure is used to push the second limiting structure to move along the first direction and the second direction to abut against the chip; the execution structure can be used to push the second limiting structure to move along the first direction and the second direction, so that the chip is tightly fitted to the first limiting structure and the second limiting structure, thereby determining the position of the chip.

因此,利用执行结构可以同时确定芯片在水平面上的第一方向的位置和第二方向的位置,可以有效提高芯片的定位效率。Therefore, the execution structure can be used to simultaneously determine the position of the chip in the first direction and the position of the chip in the second direction on the horizontal plane, which can effectively improve the positioning efficiency of the chip.

具体的,第二限位结构130可以设置为环状,第二限位结构130的内部形成用于容纳芯片200的空腔,在芯片200放置于该空腔内的情况下,第二限位结构130的两个内壁,即第一内壁132和第二内壁133可以紧密贴合于芯片200,第一内壁132用于抵接于芯片200,以限制芯片200沿第一方向的相反方向运动;第二内壁133用于抵接于芯片200,以限制芯片200沿第二方向的相反方向运动。第一内壁132和第二内壁133可以相互垂直。由于第二限位结构130为环状结构,因此第一内壁132和第二内壁133之间的相对位置关系保持固定,因此通过控制第二限位结构130可以同时控制第一内壁132和第二内壁133,便于实现对芯片200位置的确定。Specifically, the second limiting structure 130 can be set to be annular, and the interior of the second limiting structure 130 forms a cavity for accommodating the chip 200. When the chip 200 is placed in the cavity, the two inner walls of the second limiting structure 130, namely the first inner wall 132 and the second inner wall 133, can be closely fitted to the chip 200. The first inner wall 132 is used to abut against the chip 200 to limit the movement of the chip 200 in the opposite direction of the first direction; the second inner wall 133 is used to abut against the chip 200 to limit the movement of the chip 200 in the opposite direction of the second direction. The first inner wall 132 and the second inner wall 133 can be perpendicular to each other. Since the second limiting structure 130 is an annular structure, the relative position relationship between the first inner wall 132 and the second inner wall 133 remains fixed. Therefore, by controlling the second limiting structure 130, the first inner wall 132 and the second inner wall 133 can be controlled simultaneously, so as to facilitate the determination of the position of the chip 200.

执行结构140连接于基座110并抵持于第二限位结构130,执行结构140用于推动第二限位结构130沿第一方向和第二方向运动,以使第二限位结构130抵接于芯片200。利用执行结构140可以推动第二限位结构130沿第一方向和第二方向运动,从而抵接于芯片200,并且推动芯片200抵接于第一限位结构120,以实现对芯片200的位置的确定。The execution structure 140 is connected to the base 110 and abuts against the second limiting structure 130. The execution structure 140 is used to push the second limiting structure 130 to move along the first direction and the second direction so that the second limiting structure 130 abuts against the chip 200. The execution structure 140 can be used to push the second limiting structure 130 to move along the first direction and the second direction so as to abut against the chip 200, and push the chip 200 to abut against the first limiting structure 120, so as to determine the position of the chip 200.

具体的,第二限位结构130形成抵接面131,抵接面131由第一方向的相反方向朝向第二方向的相反方向倾斜。利用执行结构140抵接于抵接面131,可以推动第二限位 结构130同时朝向第一方向和第二方向运动。Specifically, the second limit structure 130 forms an abutting surface 131, and the abutting surface 131 is inclined from the opposite direction of the first direction to the opposite direction of the second direction. The structure 130 moves in the first direction and the second direction simultaneously.

执行结构140包括抵接件141和弹性件142,抵接件141抵接于抵接面131以推动第二限位结构130沿第一方向和第二方向共同运动。弹性件142连接于基座110和抵接件141,弹性件142用于推动抵接件141运动,在弹性件142的作用下,可以使抵接件141保持于抵接于第二限位件122结构的状态,保障了芯片200位置的稳定。The execution structure 140 includes an abutment member 141 and an elastic member 142. The abutment member 141 abuts against the abutment surface 131 to push the second position-limiting structure 130 to move together in the first direction and the second direction. The elastic member 142 is connected to the base 110 and the abutment member 141. The elastic member 142 is used to push the abutment member 141 to move. Under the action of the elastic member 142, the abutment member 141 can be kept in a state of abutting against the second position-limiting member 122 structure, thereby ensuring the stability of the position of the chip 200.

在本申请的一些实施例中,抵接件141转动连接于基座110,抵接件141的转动轴平行于第二方向。具体的,利用抵接件141转动连接于基座110,不仅可以通过转动达到靠近和远离于第二限位结构130的效果,还可以使抵接件141的位置保持稳定,防止抵接件141和基座110分离。In some embodiments of the present application, the abutment 141 is rotatably connected to the base 110, and the rotation axis of the abutment 141 is parallel to the second direction. Specifically, by using the abutment 141 to be rotatably connected to the base 110, not only can the abutment 141 be moved closer to or farther from the second position-limiting structure 130 by rotation, but the position of the abutment 141 can also be kept stable to prevent the abutment 141 from separating from the base 110.

具体的,在本申请的一些实施例中,弹性件142的一端固定连接于基座110,弹性件142的另一端固定连接于抵接件141的一端,弹性件142用于推动抵接件141朝向靠近于第二限位结构130的方向转动。具体的,在抵接件141朝向靠近于第二限位结构130转动的过程中,抵接件141的端部抵接于抵接面131,并推动第二限位结构130运动,进而推动第二限位结构130同时朝向第一方向和第二方向运动,以实现对芯片200的位置的确定。Specifically, in some embodiments of the present application, one end of the elastic member 142 is fixedly connected to the base 110, and the other end of the elastic member 142 is fixedly connected to one end of the abutting member 141, and the elastic member 142 is used to push the abutting member 141 to rotate in a direction close to the second limiting structure 130. Specifically, in the process of the abutting member 141 rotating toward the second limiting structure 130, the end of the abutting member 141 abuts against the abutting surface 131 and pushes the second limiting structure 130 to move, thereby pushing the second limiting structure 130 to move in the first direction and the second direction at the same time, so as to determine the position of the chip 200.

在本申请的一些实施例中,抵接件141上形成按压部,按压部设置于抵接件141背离于弹性件142的一侧,利用按压部,使用者可以对按压部施加压力,使抵接件141可以克服弹性件142的弹性力,并朝向远离于第二限位结构130的方向转动,从而可以增加第二限位结构130的活动空间,有利于放置芯片200。In some embodiments of the present application, a pressing portion is formed on the abutment 141, and the pressing portion is arranged on the side of the abutment 141 away from the elastic member 142. Using the pressing portion, the user can apply pressure to the pressing portion so that the abutment 141 can overcome the elastic force of the elastic member 142 and rotate in a direction away from the second limiting structure 130, thereby increasing the activity space of the second limiting structure 130, which is conducive to the placement of the chip 200.

在其他的实施例中,抵接件141也可以滑动连接于基座110,弹性件142可使得抵接件141弹性抵持于第二限位结构130的抵接面131。在弹性件142的弹力作用下,抵接件141可以沿第一方向或第二方向滑动并与抵接面131抵接,进而在抵接面131的作用下推动第二限位结构130同时朝向第一方向和第二方向运动,以实现对芯片200的位置的确定。In other embodiments, the abutting member 141 may also be slidably connected to the base 110, and the elastic member 142 may allow the abutting member 141 to elastically abut against the abutting surface 131 of the second position-limiting structure 130. Under the elastic force of the elastic member 142, the abutting member 141 may slide along the first direction or the second direction and abut against the abutting surface 131, and then under the action of the abutting surface 131, the second position-limiting structure 130 is pushed to move toward the first direction and the second direction at the same time, so as to determine the position of the chip 200.

在本申请的一些实施例中,第二限位结构130形成开孔,且开孔连通于空腔,开孔用于容纳第一限位件121和第二限位件122。具体的,开孔可以设置为三个,其中第一限位件121设置为两个,第二限位件122设置为一个,两个开孔用于放置第一限位件121,另外一个开孔用于放置第二限位件122。利用开孔和第一限位件121以及第二限位件122的相互配合,可以使芯片200进行初步定位,有利于后续定位工作的顺利进行。In some embodiments of the present application, the second position-limiting structure 130 forms an opening, and the opening is connected to the cavity, and the opening is used to accommodate the first position-limiting member 121 and the second position-limiting member 122. Specifically, the opening can be set to three, wherein the first position-limiting member 121 is set to two, and the second position-limiting member 122 is set to one, two openings are used to place the first position-limiting member 121, and the other opening is used to place the second position-limiting member 122. By using the mutual cooperation between the opening and the first position-limiting member 121 and the second position-limiting member 122, the chip 200 can be initially positioned, which is conducive to the smooth progress of subsequent positioning work.

在本申请的一些实施例中,该芯片分体定位装置100还包括:盖体150。In some embodiments of the present application, the chip separation and positioning device 100 further includes: a cover body 150 .

盖体150转动连接于基座110,盖体150用于在盖体150和基座110靠近的状态下按压芯片200,使芯片200在竖直方向的位置得到进一步确定,进一步保障芯片200的位置稳定。The cover 150 is rotatably connected to the base 110 . The cover 150 is used to press the chip 200 when the cover 150 and the base 110 are close to each other, so that the vertical position of the chip 200 is further determined, and the position stability of the chip 200 is further ensured.

在本申请的一些实施例中,盖体150包括压块,压块为弹性结构,在盖体150处于关闭状态下,压块按压芯片200,使芯片200在竖直方向上的位置确定。In some embodiments of the present application, the cover 150 includes a pressing block, which is an elastic structure. When the cover 150 is in a closed state, the pressing block presses the chip 200 to determine the position of the chip 200 in the vertical direction.

本申请还提供了一种芯片处理装置,该芯片处理装置包括上述的芯片分体定位装置,利用上述的芯片分体定位装置可以对芯片进行快速定位,提高工作效率。The present application also provides a chip processing device, which includes the above-mentioned chip split positioning device. The above-mentioned chip split positioning device can be used to quickly position the chip, thereby improving work efficiency.

请参阅图3至图7,本申请提供一种应用于基因测序仪的芯片座(即为图1中的芯片定位装置),包括内置测序芯片1(即为图1中的芯片200)的测序芯片平台2(即为图1中的基座110),还包括:压盖3(即为图1中的盖体150),通过轴座或铰链转动安装在测序芯片平台2上表面。Please refer to Figures 3 to 7. The present application provides a chip seat (i.e., the chip positioning device in Figure 1) applied to a gene sequencer, including a sequencing chip platform 2 (i.e., the base 110 in Figure 1) with a built-in sequencing chip 1 (i.e., the chip 200 in Figure 1), and also includes: a pressure cover 3 (i.e., the cover body 150 in Figure 1), which is rotatably installed on the upper surface of the sequencing chip platform 2 through an axle seat or a hinge.

芯片座包括至少两组压爪组件4,对称安装在压盖3的下表面,且与测序芯片1抵接,用于将测序芯片1压紧固定。The chip seat includes at least two groups of pressing claw assemblies 4, which are symmetrically mounted on the lower surface of the pressing cover 3 and abut against the sequencing chip 1 to press and fix the sequencing chip 1.

具体的,如图5至图7所示,压爪组件4包括压爪架41、转轴42和压爪43,压爪架41两侧均开设有通槽与转轴42转动连接,压爪43抵接在压爪架41与转轴42之间,且压爪43为“Z”字型结构设置,压爪43用于压紧测序芯片1。 Specifically, as shown in Figures 5 to 7, the pressure claw assembly 4 includes a pressure claw frame 41, a rotating shaft 42 and a pressure claw 43. Through grooves are provided on both sides of the pressure claw frame 41 to be rotatably connected to the rotating shaft 42. The pressure claw 43 abuts between the pressure claw frame 41 and the rotating shaft 42, and the pressure claw 43 is arranged in a "Z"-shaped structure. The pressure claw 43 is used to press the sequencing chip 1.

进一步的,压爪组件4还包括弹簧44,压爪43的一端用于压紧测序芯片1,压爪43的另一端通过弹簧44与压爪架41固定连接,用于为压爪43提供压力,将测序芯片1稳定压紧。Furthermore, the pressure claw assembly 4 also includes a spring 44. One end of the pressure claw 43 is used to press the sequencing chip 1. The other end of the pressure claw 43 is fixedly connected to the pressure claw frame 41 through the spring 44 to provide pressure for the pressure claw 43 to stably press the sequencing chip 1.

更进一步的,压爪组件4还包括支撑件45,压爪43置于支撑件45和转轴42之间,压爪43的中部抵接支撑件45,能够使压爪43旋转更加稳定,从而提高压爪43压持的稳定性。Furthermore, the pressing claw assembly 4 also includes a support member 45, and the pressing claw 43 is placed between the support member 45 and the rotating shaft 42. The middle part of the pressing claw 43 abuts against the support member 45, which can make the rotation of the pressing claw 43 more stable, thereby improving the stability of the pressing claw 43.

其中如图7,压爪43与支撑件45的抵接处具有弧形凸面,压爪43可沿弧形凸面旋转以适应测序芯片1的角度,能够小幅度移动,尤其是在压爪组件4位于压盖3具有两个或者数量更多时,在压紧测序芯片1时,多个压爪43能够同时与测序芯片1的上表面接触,更加服帖。As shown in FIG7 , the contact point between the pressure claw 43 and the support member 45 has an arc-shaped convex surface, and the pressure claw 43 can rotate along the arc-shaped convex surface to adapt to the angle of the sequencing chip 1 and can move slightly, especially when the pressure claw assembly 4 is located on the pressure cover 3 and has two or more pressure claws 43. When the sequencing chip 1 is pressed, multiple pressure claws 43 can contact the upper surface of the sequencing chip 1 at the same time, which is more compliant.

如图5和图6所示,压爪43的顶部开设限位槽46,转轴42穿过限位槽46与压爪架41转动连接,便于对压爪3进行限位,保证转动时的稳定性,从而提高压爪43压持测序芯片1的稳定性。As shown in Figures 5 and 6, a limiting groove 46 is opened on the top of the pressing claw 43, and the rotating shaft 42 passes through the limiting groove 46 and is rotatably connected to the pressing claw frame 41, so as to limit the pressing claw 3 and ensure the stability during rotation, thereby improving the stability of the pressing claw 43 in pressing the sequencing chip 1.

进一步的,压爪43与测序芯片1的接触面为柔性结构,柔性结构为橡胶垫、海绵垫和聚氨酯泡沫之一,避免压爪43与测序芯片1之间产生刮擦,从而对测序芯片1进行保护。Furthermore, the contact surface between the pressure claw 43 and the sequencing chip 1 is a flexible structure, and the flexible structure is one of a rubber pad, a sponge pad and a polyurethane foam, so as to avoid scratches between the pressure claw 43 and the sequencing chip 1, thereby protecting the sequencing chip 1.

如图3和图4所示,该芯片座还包括至少两组芯片定位块5和芯片框6(即为图1中的第二限位结构130),芯片定位块5安装在测序芯片平台2顶部的外围,芯片框6设置于测序芯片1的外围且位于芯片定位块5之间形成的安装区域内,能够对测序芯片1进行定位,从而提高检测的精准度。As shown in Figures 3 and 4, the chip seat also includes at least two groups of chip positioning blocks 5 and a chip frame 6 (i.e., the second limiting structure 130 in Figure 1). The chip positioning blocks 5 are installed on the periphery of the top of the sequencing chip platform 2, and the chip frame 6 is arranged on the periphery of the sequencing chip 1 and is located in the installation area formed between the chip positioning blocks 5, which can position the sequencing chip 1, thereby improving the accuracy of detection.

如图3所示,测序芯片1的顶部设置沿其长度方向排布的多组流道7,流道7的两侧分别开设沿测序芯片1厚度方向的流体口8,流体口8与测序芯片平台2内的流道口9连通,便于测试的液体流通。As shown in FIG3 , a plurality of flow channels 7 arranged along the length direction are provided on the top of the sequencing chip 1 , and fluid ports 8 are respectively provided on both sides of the flow channels 7 along the thickness direction of the sequencing chip 1 , and the fluid ports 8 are connected to the flow channel ports 9 in the sequencing chip platform 2 to facilitate the flow of the test liquid.

如图4所示,测序芯片平台2还包括密封结构11,密封结构11位于流道口9和流体口8之间,用于密封连接流道口9和流体口8,密封结构11为密封垫或填充密封胶,避免测试的液体流通时出现漏液,提高密封程度。As shown in FIG4 , the sequencing chip platform 2 further includes a sealing structure 11, which is located between the flow channel port 9 and the fluid port 8 and is used to seal and connect the flow channel port 9 and the fluid port 8. The sealing structure 11 is a sealing gasket or a filling sealant to prevent leakage when the test liquid circulates and improve the sealing degree.

本实施例的工作原理为:当使用时,首先将测序芯片1与芯片框6组装后放置在测序芯片平台2上表面的内部,并通过位于四角的芯片定位块5进行固定,保证放置位置的准确,也确保检测的精准度。随后将压盖3翻转在测序芯片平台2的上表面,压盖3同步带动压爪组件4移动,直至压爪43紧贴在测序芯片1的上表面对测序芯片1夹紧固定,通过弹簧44的弹力配合转轴42和支撑件45形成杠杆原理,使压爪43的一端给予测序芯片1一定的压紧力,保持整个压紧机构平稳工作,对测序芯片1的边缘位置夹紧定位,压爪3与测序芯片1对应接触的底面通过密封软垫在下压时避免对测序芯片1产生刮擦,从而提供保护。The working principle of this embodiment is as follows: when in use, first assemble the sequencing chip 1 and the chip frame 6 and place them inside the upper surface of the sequencing chip platform 2, and fix them by the chip positioning blocks 5 located at the four corners to ensure the accuracy of the placement and the accuracy of the detection. Then, the pressure cover 3 is turned over on the upper surface of the sequencing chip platform 2, and the pressure cover 3 drives the pressure claw assembly 4 to move synchronously until the pressure claw 43 is tightly attached to the upper surface of the sequencing chip 1 to clamp and fix the sequencing chip 1. The elastic force of the spring 44 cooperates with the rotating shaft 42 and the support 45 to form a lever principle, so that one end of the pressure claw 43 gives a certain clamping force to the sequencing chip 1, keeps the entire clamping mechanism working smoothly, clamps and positions the edge of the sequencing chip 1, and the bottom surface of the pressure claw 3 corresponding to the contact with the sequencing chip 1 is prevented from scratching the sequencing chip 1 through the sealing cushion when pressing down, thereby providing protection.

进一步的,测序芯片1通过弹簧44和压爪43的配合竖直向下压动密封结构11,使密封结构11将流体口8与流道口9形成密封,避免后面的测序反应工作液体通过时出现漏液,同时对测序芯片1进行定位,对其内部测序芯片1和内部组件进行防护,方便携带和多场地使用。Furthermore, the sequencing chip 1 presses the sealing structure 11 vertically downward through the cooperation of the spring 44 and the pressure claw 43, so that the sealing structure 11 forms a seal between the fluid port 8 and the flow channel port 9, thereby preventing leakage when the subsequent sequencing reaction working liquid passes through. At the same time, the sequencing chip 1 is positioned, and the sequencing chip 1 and internal components are protected, which is convenient for carrying and use in multiple locations.

在本申请提供的方案中,通过在压盖组件的底部设置多个压爪组件,能够将测序芯片进行紧压,保证测序芯片的平面度和紧密性,避免出现漏液;进一步的,能够对测序芯片进行定位,对其内部测序芯片和内部组件进行防护,方便携带和多场地使用。In the solution provided in the present application, by providing a plurality of pressure claw assemblies at the bottom of the pressure cover assembly, the sequencing chip can be tightly pressed to ensure the flatness and tightness of the sequencing chip and avoid leakage; further, the sequencing chip can be positioned and the internal sequencing chip and internal components can be protected, making it convenient to carry and use in multiple locations.

请参阅图8~图13,本实施例提供了一种用于基因测序仪的芯片外框装置,该芯片外框装置用于对测序芯片20(即为图1中的芯片以及图3中的测序芯片1)进行固定,以使测序芯片20稳定安装在基因测序仪上,以提高图像采集的清晰度。包括芯片外框10(即为图1中的第二限位结构130以及图3中的芯片框6)、密封垫30、密封块50(即为图4中的密封结构11)和芯片平台40(即为图1中的基座110以及图3中的测序芯 片平台2),所述芯片外框10为大体呈框矩形的框体,芯片外框10的内部具有用于容纳和固定测序芯片20的芯片槽,所述芯片槽上设置有用于对测序芯片20进行固定的第一固定机构,通过第一固定机构的设置,使得测序芯片20能够稳定的安装在芯片槽内,同时使得测序芯片20在前后、左右、上下方向上得以稳定限位,进而提高其安装固定性。Please refer to Figures 8 to 13. This embodiment provides a chip frame device for a gene sequencer, which is used to fix a sequencing chip 20 (i.e., the chip in Figure 1 and the sequencing chip 1 in Figure 3) so that the sequencing chip 20 is stably installed on the gene sequencer to improve the clarity of image acquisition. The chip frame device includes a chip frame 10 (i.e., the second limiting structure 130 in Figure 1 and the chip frame 6 in Figure 3), a sealing gasket 30, a sealing block 50 (i.e., the sealing structure 11 in Figure 4), and a chip platform 40 (i.e., the base 110 in Figure 1 and the sequencing chip 1 in Figure 3). The chip platform 2) includes a chip frame 10 which is a generally rectangular frame. The interior of the chip frame 10 is provided with a chip slot for accommodating and fixing the sequencing chip 20. The chip slot is provided with a first fixing mechanism for fixing the sequencing chip 20. Through the setting of the first fixing mechanism, the sequencing chip 20 can be stably installed in the chip slot, and at the same time, the sequencing chip 20 can be stably limited in the front-to-back, left-to-right, and up-and-down directions, thereby improving its installation fixity.

测序芯片20的内部开设置有多个横置且相互平行的流体槽202(即为图3中的流道7),测序芯片20的下端面开设有与所述流体槽202的两端连通的流体口201,所述密封垫30可拆卸安装在所述芯片外框10的底部,并与所述流体口201位置相互对应,用以提高流体口201处的密封性,所述密封垫30上设置有与所述流体口201对应并相互连通的流体圆孔301,以使流体槽202内的流体能够顺应流体口201流入到所述流体圆孔301内。The sequencing chip 20 is provided with a plurality of transverse and mutually parallel fluid grooves 202 (i.e., the flow channels 7 in FIG. 3 ), and the lower end surface of the sequencing chip 20 is provided with fluid ports 201 connected to both ends of the fluid grooves 202. The sealing gasket 30 is detachably mounted on the bottom of the chip outer frame 10 and corresponds to the position of the fluid ports 201 to improve the sealing performance at the fluid ports 201. The sealing gasket 30 is provided with fluid circular holes 301 corresponding to the fluid ports 201 and connected to each other, so that the fluid in the fluid grooves 202 can flow into the fluid circular holes 301 in accordance with the fluid ports 201.

所述芯片平台40作为基体,用于承载芯片外框10,并将安装有测序芯片20的芯片外框10通过该芯片平台40固定在基因测序仪上。所述芯片外框10与芯片平台40之间设置有第二固定机构,通过该第二固定机构的设置,使得芯片外框10能够稳定安装在芯片平台40上,从而提高整体稳定性,所述芯片平台40上设置有与所述密封垫30位置对应的密封块50,所述密封块50上开设有与所述流体圆孔301位置对应的流道口502,当测序芯片20以及芯片外框10固定安装在芯片平台40上时,使得流体槽202、流体口201、流体圆孔301和流道口502依次连通,使用时,液体由一侧的密封块经密封垫流入芯片内,并在芯片内反应后,由经流体槽朝向另一侧的密封垫、密封块依次流出。The chip platform 40 is used as a substrate to carry the chip frame 10, and the chip frame 10 with the sequencing chip 20 installed is fixed on the gene sequencer through the chip platform 40. A second fixing mechanism is provided between the chip frame 10 and the chip platform 40. Through the provision of the second fixing mechanism, the chip frame 10 can be stably installed on the chip platform 40, thereby improving the overall stability. The chip platform 40 is provided with a sealing block 50 corresponding to the position of the sealing gasket 30, and the sealing block 50 is provided with a flow channel opening 502 corresponding to the position of the fluid circular hole 301. When the sequencing chip 20 and the chip frame 10 are fixedly installed on the chip platform 40, the fluid groove 202, the fluid opening 201, the fluid circular hole 301 and the flow channel opening 502 are connected in sequence. When in use, the liquid flows into the chip from the sealing block on one side through the sealing gasket, and after reacting in the chip, it flows out in sequence from the sealing gasket and the sealing block on the other side through the fluid groove.

本实施例中,优选的,所述密封垫30上开设有插接槽303,所述密封块50上固定安装有与插接槽303匹配的插接凸台501,密封垫30固定安装在芯外外框底部,并共同安装在芯片平台40上,此时,插接槽303与插接凸台501相互卡合,从而提高密封垫30与密封块50之间的定位精确度,保证流体圆孔301与流道口502的精确对齐。In this embodiment, preferably, a plug-in groove 303 is opened on the sealing gasket 30, and a plug-in boss 501 matching the plug-in groove 303 is fixedly installed on the sealing block 50. The sealing gasket 30 is fixedly installed at the bottom of the core outer frame and installed together on the chip platform 40. At this time, the plug-in groove 303 and the plug-in boss 501 are engaged with each other, thereby improving the positioning accuracy between the sealing gasket 30 and the sealing block 50, and ensuring the precise alignment of the fluid circular hole 301 and the flow channel opening 502.

本实施例中,为了提高测序芯片20与芯片外框10之间的安装稳定性,所述第一固定机构具体包括上限位板104、下限位板105和限位凸台103,其中,所述上限位板104和下限位板105分别至少有一对,至少一对的上、下限位板105分别固定安装在所述芯片外框10的相对两侧内壁上且两对上、下限位板105对称分布,本实施例中,其中一对上、下限位板105固定安装在所述芯片外框10的前侧内壁,另一对上、下限位板105固定安装在所述芯片外框10的后侧内壁,上限位板104和下限位板105之间形成用于对测序芯片20进行上下限位的槽,安装时,测序芯片20的下端面承载于所述下限位板105上,其上端面抵触于所述上限位板104上,从而实现测序芯片20的上下位置固定。需要提醒的是,所述上、下限位板105可以是沿芯片外框10内侧壁连续延伸的板体,也可以是多个相互分离且间隔设置的板体,此处不作具体限定。In this embodiment, in order to improve the installation stability between the sequencing chip 20 and the chip frame 10, the first fixing mechanism specifically includes an upper limit plate 104, a lower limit plate 105 and a limit boss 103, wherein the upper limit plate 104 and the lower limit plate 105 are respectively at least one pair, and at least one pair of upper and lower limit plates 105 are respectively fixedly installed on the inner walls on the opposite sides of the chip frame 10 and the two pairs of upper and lower limit plates 105 are symmetrically distributed. In this embodiment, one pair of upper and lower limit plates 105 are fixedly installed on the front inner wall of the chip frame 10, and the other pair of upper and lower limit plates 105 are fixedly installed on the rear inner wall of the chip frame 10. A groove for upper and lower limit positioning of the sequencing chip 20 is formed between the upper limit plate 104 and the lower limit plate 105. During installation, the lower end surface of the sequencing chip 20 is supported on the lower limit plate 105, and the upper end surface thereof is in contact with the upper limit plate 104, thereby achieving the upper and lower position fixation of the sequencing chip 20. It should be noted that the upper and lower limit plates 105 may be plates extending continuously along the inner wall of the chip frame 10 , or may be a plurality of plates separated from each other and arranged at intervals, which is not specifically limited here.

所述限位凸台103固定安装在所述芯片外框10的内侧壁上,所述芯片外框10的每个内侧壁上设置有至少一个限位凸台103,限位凸台103上具有与所述测序芯片20的侧壁相抵触的接触面,所述接触面可以是平面、弧面或球面的一种,安装时,通过将测序芯片20的四个侧壁分别与限位凸台103上的接触面相抵触,从而实现对测序芯片20侧壁的多点限位,以实现其在前后、左右方向上的位置固定。The limiting boss 103 is fixedly mounted on the inner side wall of the chip outer frame 10. At least one limiting boss 103 is arranged on each inner side wall of the chip outer frame 10. The limiting boss 103 has a contact surface that conflicts with the side wall of the sequencing chip 20. The contact surface can be a plane, an arc surface or a spherical surface. During installation, the four side walls of the sequencing chip 20 are respectively in conflict with the contact surfaces on the limiting boss 103, thereby achieving multi-point limiting of the side wall of the sequencing chip 20 to achieve its position fixation in the front-back and left-right directions.

本实施例中,优选的,位于前侧的所述限位凸台103为弹性凸台102,所述弹性凸台102通过弹性片固定安装在所述芯片外框10的内壁,该弹性片与芯片外框10内壁大致平行,且具有朝向芯片槽内侧方向挤压的弹力,弹性凸台102固定安装在弹性片的端部。通过上述设置,使该弹性凸台102在自由状态下具有一定的过盈量,使得测序芯片20在安装时,在弹性凸台102的弹力作用下使测序芯片20朝向该弹性凸台102的相对侧进行挤压,保证测序芯片20前后向更加稳定。此外,该芯片处框位于弹性凸台102的一边具有弹性,安装时,芯片外框10的弹性边向外拉拽,并产生让位空间,测序芯片20的后侧卡入后侧的上、下限位板105之间,再将其前侧由该让位空间卡入位于前 侧的上、下限位板105之间即可。In this embodiment, preferably, the limiting boss 103 located on the front side is an elastic boss 102, and the elastic boss 102 is fixedly mounted on the inner wall of the chip outer frame 10 through an elastic sheet. The elastic sheet is roughly parallel to the inner wall of the chip outer frame 10 and has an elastic force that presses toward the inner side of the chip slot. The elastic boss 102 is fixedly mounted on the end of the elastic sheet. Through the above arrangement, the elastic boss 102 has a certain amount of interference in a free state, so that when the sequencing chip 20 is installed, the elastic force of the elastic boss 102 causes the sequencing chip 20 to be squeezed toward the opposite side of the elastic boss 102, ensuring that the sequencing chip 20 is more stable in the front and back directions. In addition, the side of the chip frame located on the elastic boss 102 is elastic. When installed, the elastic side of the chip outer frame 10 is pulled outward and a clearance space is generated. The rear side of the sequencing chip 20 is inserted between the upper and lower limiting plates 105 on the rear side, and then the front side is inserted into the front side through the clearance space. It can be between the upper and lower limit plates 105 on the side.

本实施例中,优选的,位于左侧的所述限位凸台103上具有一自上而下朝内侧倾斜的倾斜面,所述倾斜面的下端与该限位凸台103上的接触面过渡连接。当测序芯片20前后向卡入后,再将测序芯片20向右侧推进,其左则沿所述倾斜面向下按压,从而使测序芯片20的顺利扣入芯片槽内,进一步提高测序芯片20的安装便捷性。需要提醒的是,本实施例中,倾斜面设置在位于右侧的限位凸台103也可起到相同效果,此处不作具体限制。In this embodiment, preferably, the limiting boss 103 on the left side has an inclined surface that tilts inward from top to bottom, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss 103. After the sequencing chip 20 is inserted forward and backward, the sequencing chip 20 is pushed to the right, and the left side is pressed downward along the inclined surface, so that the sequencing chip 20 is smoothly buckled into the chip slot, further improving the installation convenience of the sequencing chip 20. It should be noted that in this embodiment, the inclined surface set on the limiting boss 103 on the right side can also achieve the same effect, and no specific limitation is made here.

本实施例中,密封垫30与芯片外框10之间为可拆卸连接,具体的,所述芯片外框10的底部固定设置有挂钩101,所述密封垫30上开设有用于使挂钩101卡入的挂孔302,密封垫30通过挂孔302卡接在芯片外框10底部的挂钩101处,从而实现二者的固定。In this embodiment, the sealing gasket 30 and the chip frame 10 are detachably connected. Specifically, a hook 101 is fixedly provided at the bottom of the chip frame 10, and a hanging hole 302 is opened on the sealing gasket 30 for the hook 101 to be inserted. The sealing gasket 30 is connected to the hook 101 at the bottom of the chip frame 10 through the hanging hole 302, thereby fixing the two.

本实施例中,所述芯片外框10与芯片平台40之间设置有第二固定机构,通过该第二固定机构的设置,使得芯片外框10能够稳定安装在芯片平台40上,从而提高整体稳定性,具体的,所述第二固定机构包括至少一个前后向定位基准401(即为图1中的第一限位件121)和至少一个左右向定位基准401(即为图1中的第二限位件122)以及定位元件402(即为图1中的执行结构140),所述定位基准401固定安装在所述芯片平台40上,所述芯片外框10上开设有与所述定位基准401对应配合的限位缺口107,芯片外框10在安装时,将其限位缺口107对准定位基准401,并使得定位基准401嵌入该限位缺口107内,从而实现芯片外框10与芯片平台40之间的在水平面上的定位。为了进一步使芯片外框10进行固定,所述定位元件402与芯片平台40可采用滑动式或按压式连接,并使其在缩回位置和定位位置之间移动切换,以定位元件402的滑动式连接为例,定位元件402滑动安装在芯片平台40上,定位元件402上设置有定位头402a,定位头402a可以是平面、弧面或球面,当定位元件402朝向芯片槽内侧滑动能够达到定位位置,向外侧滑动能够到达缩回位置,所述芯片外框10的外侧壁上具有用于供定位头402a卡入的定位槽106(即为图1中抵接面131所在的槽体),当定位元件402滑动至定位位置时,定位头402a卡入所述定位槽106内,从而实现芯片外框10的进一步固定。In this embodiment, a second fixing mechanism is arranged between the chip frame 10 and the chip platform 40. Through the arrangement of the second fixing mechanism, the chip frame 10 can be stably installed on the chip platform 40, thereby improving the overall stability. Specifically, the second fixing mechanism includes at least one front-to-back positioning reference 401 (i.e., the first limiting member 121 in FIG. 1 ) and at least one left-to-right positioning reference 401 (i.e., the second limiting member 122 in FIG. 1 ) and a positioning element 402 (i.e., the execution structure 140 in FIG. 1 ). The positioning reference 401 is fixedly installed on the chip platform 40. A limiting notch 107 corresponding to the positioning reference 401 is provided on the chip frame 10. When the chip frame 10 is installed, its limiting notch 107 is aligned with the positioning reference 401, and the positioning reference 401 is embedded in the limiting notch 107, thereby realizing the positioning between the chip frame 10 and the chip platform 40 on the horizontal plane. In order to further fix the chip frame 10, the positioning element 402 and the chip platform 40 can be connected by sliding or pressing, and can be moved and switched between the retracted position and the positioning position. Taking the sliding connection of the positioning element 402 as an example, the positioning element 402 is slidably installed on the chip platform 40, and a positioning head 402a is provided on the positioning element 402. The positioning head 402a can be a plane, an arc surface or a spherical surface. When the positioning element 402 slides toward the inside of the chip slot, it can reach the positioning position, and when it slides outward, it can reach the retracted position. The outer wall of the chip frame 10 has a positioning groove 106 (that is, the groove body where the abutment surface 131 in Figure 1 is located) for the positioning head 402a to be inserted into. When the positioning element 402 slides to the positioning position, the positioning head 402a is inserted into the positioning groove 106, thereby further fixing the chip frame 10.

本申请的芯片外框组件,其结构紧凑,通过第一固定机构将芯片外框与测序芯片进行固定,从而能够保证测序芯片在上下、左右、前后各个方向上得到良好的稳定效果,保证测序芯片图像采集的精确度和清晰度;通过第二固定机构以使芯片外框与芯片平台进行相互固定,进而保证芯片外框的整体具有较强的稳定性;The chip frame assembly of the present application has a compact structure. The chip frame and the sequencing chip are fixed by a first fixing mechanism, thereby ensuring that the sequencing chip has a good stability effect in all directions of up and down, left and right, and front and back, and ensuring the accuracy and clarity of the sequencing chip image acquisition; the chip frame and the chip platform are fixed to each other by a second fixing mechanism, thereby ensuring that the overall stability of the chip frame is strong;

本申请的芯片外框组件,通过将第一固定机构设置为上限位板、下限位板和限位凸台,并将至少两对上、下限位板固定安装在芯片外框的相对内壁上,以实现测序芯片的上下限位,通过在芯片外框的每个内侧壁上至少设置一个具有接触面的限位凸台,以使测序芯片的侧面进行限位,保证其在水平方向上固定限位;The chip frame assembly of the present application realizes upper and lower position limits of the sequencing chip by setting the first fixing mechanism as an upper limit plate, a lower limit plate and a limit boss, and fixing at least two pairs of upper and lower limit plates on the opposite inner walls of the chip frame. At least one limit boss with a contact surface is set on each inner side wall of the chip frame to limit the side of the sequencing chip, thereby ensuring that it is fixedly limited in the horizontal direction.

本申请的芯片外框组件,通过将其中一个限位凸台设置为弹性凸台,且该弹性凸台通过弹性片固定在芯片外框的侧壁,使该弹性凸台在自由状态下具有一定的过盈量,测序芯片在安装时,在弹性凸台的弹力作用下使测序芯片朝向该弹性凸台的相对侧进行挤压,保证测序芯片前后向更加稳定;此外,该芯片处框位于弹性凸台的一边具有弹性,安装时,芯片外框的弹性边向外拉拽,并产生让位空间,测序芯片的后侧卡入后侧的上、下限位板之间,再将其前侧由该让位空间卡入位于前侧的上、下限位板之间即可,便于安装;The chip frame assembly of the present application sets one of the limiting bosses as an elastic boss, and the elastic boss is fixed to the side wall of the chip frame by an elastic sheet, so that the elastic boss has a certain interference in a free state. When the sequencing chip is installed, the sequencing chip is squeezed toward the opposite side of the elastic boss under the elastic force of the elastic boss, ensuring that the sequencing chip is more stable in the front and back directions. In addition, the side of the chip frame located on the elastic boss is elastic. When installing, the elastic side of the chip frame is pulled outward and a clearance space is generated. The rear side of the sequencing chip is inserted between the upper and lower limiting plates on the rear side, and then the front side is inserted between the upper and lower limiting plates on the front side through the clearance space, which is convenient for installation.

本申请的芯片外框组件,通过在位于左侧的限位凸台上具有一自上而下朝内侧倾斜的倾斜面,倾斜面的下端与该限位凸台上的接触面过渡连接。当测序芯片前后向卡入后,再将测序芯片向右侧推进,其左则沿倾斜面向下按压,从而使测序芯片的顺利扣入芯片槽内,进一步提高测序芯片的安装便捷性。The chip frame assembly of the present application has an inclined surface that is inclined from top to bottom toward the inside on the limiting boss on the left side, and the lower end of the inclined surface is transitionally connected with the contact surface on the limiting boss. After the sequencing chip is inserted frontward and rearward, the sequencing chip is pushed to the right, and the left side is pressed downward along the inclined surface, so that the sequencing chip is smoothly buckled into the chip slot, further improving the convenience of installing the sequencing chip.

本申请实施例还提供了一种基因测序仪,该基因测序仪包括芯片平台,用于承载 芯片;The present application also provides a gene sequencer, which includes a chip platform for carrying chip;

第一限位结构,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿第一方向和第二方向运动;其中,所述第一方向和所述第二方向相互垂直;A first limiting structure, fixedly connected to the chip platform, used to abut against the chip to limit the movement of the chip along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other;

芯片外框,活动连接于所述芯片平台,所述芯片外框上设有芯片槽,所述芯片设置于芯片槽内,以限制所述芯片沿所述第一方向的相反方向和所述第二方向的相反方向运动;A chip outer frame, movably connected to the chip platform, the chip outer frame is provided with a chip slot, the chip is arranged in the chip slot, so as to limit the movement of the chip in a direction opposite to the first direction and a direction opposite to the second direction;

执行结构,连接于所述芯片平台并抵持于所述芯片外框,用于推动所述芯片外框沿所述第一方向和所述第二方向运动,以抵接于所述芯片;An execution structure, connected to the chip platform and abutting against the chip outer frame, used for pushing the chip outer frame to move along the first direction and the second direction to abut against the chip;

密封垫,可拆卸安装在所述芯片外框的底部;A sealing gasket, detachably mounted on the bottom of the chip frame;

所述芯片的内部开设置有多个横置且相互平行的流体槽,所述芯片的下端面开设有与所述流体槽的两端连通的流体口,所述密封垫上设置有流体圆孔,所述密封块上开设有的流道口,所述流体口、流体圆孔、流道口依次连通。具体可参考图1~图13中的相关描述,在此不再赘述。The chip is provided with a plurality of transverse and mutually parallel fluid grooves, the lower end surface of the chip is provided with a fluid port connected with both ends of the fluid groove, the sealing gasket is provided with a fluid circular hole, the sealing block is provided with a flow channel port, and the fluid port, the fluid circular hole, and the flow channel port are connected in sequence. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述芯片外框形成抵接面,所述抵接面由所述第一方向的相反方向朝向所述第二方向的相反方向倾斜;所述执行结构包括抵接件和弹性件;所述弹性件连接于所述芯片平台和所述抵接件,用于推动所述抵接件运动;所述抵接件抵接于所述抵接面以在所述弹性件的作用下推动芯片外框沿第一方向和第二方向运动。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific possible implementation scheme, the chip frame forms an abutment surface, and the abutment surface is inclined from the opposite direction of the first direction to the opposite direction of the second direction; the execution structure includes an abutment member and an elastic member; the elastic member is connected to the chip platform and the abutment member, and is used to push the abutment member to move; the abutment member abuts against the abutment surface to push the chip frame to move along the first direction and the second direction under the action of the elastic member. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述抵接件转动连接于所述芯片平台,所述抵接件的转动轴平行于所述第二方向。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific possible implementation method, the abutment member is rotatably connected to the chip platform, and the rotation axis of the abutment member is parallel to the second direction. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述弹性件的一端固定连接于所述芯片平台,所述弹性件的另一端固定连接于所述抵接件的一端,所述弹性件用于推动所述抵接件朝向靠近于所述芯片外框的方向转动。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, one end of the elastic member is fixedly connected to the chip platform, and the other end of the elastic member is fixedly connected to one end of the abutment member, and the elastic member is used to push the abutment member to rotate toward the direction close to the chip frame. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述抵接件上形成按压部,所述按压部设置于所述抵接件背离于所述弹性件的一侧,所述按压部用于接收外力,并在外力的作用下朝向远离于所述芯片外框的方向转动。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific possible implementation scheme, a pressing portion is formed on the abutment member, and the pressing portion is arranged on a side of the abutment member away from the elastic member, and the pressing portion is used to receive an external force and rotate in a direction away from the chip frame under the action of the external force. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述第一限位结构包括:第一限位件,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿所述第一方向运动;第二限位件,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿所述第二方向运动。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, the first limiting structure includes: a first limiting member fixedly connected to the chip platform and used to abut against the chip to limit the movement of the chip along the first direction; a second limiting member fixedly connected to the chip platform and used to abut against the chip to limit the movement of the chip along the second direction. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述芯片外框为环状,所述芯片外框内部形成用于容纳所述芯片的空腔;所述芯片外框具有第一内壁和第二内壁,所述第一内壁用于抵接于所述芯片,以限制所述芯片沿所述第一方向的相反方向运动;所述第二内壁用于抵接于所述芯片,以限制所述芯片沿所述第二方向的相反方向运动。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific possible implementation, the chip outer frame is annular, and a cavity for accommodating the chip is formed inside the chip outer frame; the chip outer frame has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述芯片外框形成开孔,所述开孔连通于所述空腔,所述开孔用于容纳所述第一限位件和所述第二限位件。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, the chip frame forms an opening, the opening is connected to the cavity, and the opening is used to accommodate the first stopper and the second stopper. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,还包括:盖体,转动连接于所述芯片平台,用于在和所述芯片平台靠近的状态下按压所述芯片。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, it further includes: a cover body, rotatably connected to the chip platform, for pressing the chip when close to the chip platform. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,在所述盖体的下表面对称安装至少两组压爪组件,且所述至少两组压爪组件在所述盖体处于关合状态时与所述芯片抵接,用于将所述芯片压紧固定。具体可参考图1~图13中的相关描述,在此不再赘述。 In a specific implementation scheme, at least two groups of pressure claw assemblies are symmetrically installed on the lower surface of the cover, and the at least two groups of pressure claw assemblies abut against the chip when the cover is in a closed state, so as to press and fix the chip. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述压爪组件包括压爪架、转轴和压爪,所述压爪架与所述转轴转动连接,所述压爪抵接在所述压爪架与所述转轴之间,所述压爪用于压紧所述芯片。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述压爪组件还包括弹簧,所述压爪的一端用于压紧所述芯片,所述压爪的另一端通过所述弹簧与所述压爪架固定连接。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, the pressure claw assembly further includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述压爪组件还包括支撑件,所述压爪置于所述支撑件和所述转轴之间,所述压爪的中部抵接所述支撑件。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific embodiment, the pressure claw assembly further includes a support member, the pressure claw is disposed between the support member and the rotating shaft, and the middle portion of the pressure claw abuts against the support member. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述压爪与所述支撑件的抵接处具有弧形凸面,所述压爪可沿所述弧形凸面旋转以适应所述芯片的角度。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific embodiment, the contact point between the pressure claw and the support member has an arc-shaped convex surface, and the pressure claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述压爪的顶部开设限位槽,所述转轴穿过所述限位槽与所述压爪架转动连接。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation method, a limiting groove is provided on the top of the pressing claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressing claw frame. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述芯片槽上设置有用于对芯片进行固定的第一固定机构;所述第一固定机构包括上限位板和下限位板,所述上限位板和下限位板分别至少有一对,至少一对的上、下限位板分别固定安装在所述芯片外框的相对两侧内壁上,所述芯片容置于上限位板和下限位板之间形成的槽内。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific possible implementation, the chip slot is provided with a first fixing mechanism for fixing the chip; the first fixing mechanism includes an upper limit plate and a lower limit plate, and the upper limit plate and the lower limit plate are at least one pair, and the at least one pair of upper and lower limit plates are respectively fixedly mounted on the inner walls of the opposite sides of the chip outer frame, and the chip is accommodated in the groove formed between the upper limit plate and the lower limit plate. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述第一固定机构还包括限位凸台,所述限位凸台固定安装在所述芯片外框的内侧壁上,所述芯片外框的每个内侧壁上设置有至少一个限位凸台,限位凸台上具有与所述芯片的侧壁相抵触的接触面。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, the first fixing mechanism further includes a limiting boss, which is fixedly mounted on the inner side wall of the chip outer frame, and each inner side wall of the chip outer frame is provided with at least one limiting boss, which has a contact surface that conflicts with the side wall of the chip. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,所述接触面为是平面、弧面或球面的一种。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific possible implementation, the contact surface is a plane, a curved surface or a spherical surface. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,位于前侧的所述限位凸台为弹性凸台,所述弹性凸台通过弹性片固定安装在所述芯片外框的内壁上,并具有朝向芯片槽内侧方向挤压的弹力。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, the limiting boss located at the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip outer frame through an elastic sheet and has an elastic force to squeeze toward the inner side of the chip slot. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在一个具体的可实施方案中,位于左侧的所述限位凸台上具有一自上而下朝内侧倾斜的倾斜面,所述倾斜面的下端与该限位凸台上的接触面过渡连接。具体可参考图1~图13中的相关描述,在此不再赘述。In a specific implementation scheme, the limiting boss on the left side has an inclined surface that tilts inward from top to bottom, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss. For details, please refer to the relevant descriptions in Figures 1 to 13, which will not be repeated here.

在上述技术方案中,通过芯片、芯片外框以及芯片平台的配合,实现了对芯片的准确固定。In the above technical solution, accurate fixation of the chip is achieved through the cooperation of the chip, the chip frame and the chip platform.

以上所述仅为本申请的优选实施例而已,并不用于限制本申请,对于本基因测序领域的技术人员来说,本申请可以有各种更改和变化。凡在本申请的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本申请的保护范围之内。 The above description is only a preferred embodiment of the present application and is not intended to limit the present application. For technicians in the field of gene sequencing, the present application may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (48)

一种芯片定位装置,用于定位芯片于基因测序仪内,其特征在于:包括:A chip positioning device, used for positioning a chip in a gene sequencer, characterized by comprising: 基座,用于承载所述芯片;A base, used for carrying the chip; 第一限位结构,固定连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿第一方向和第二方向运动;其中,所述第一方向和所述第二方向相互垂直;A first limiting structure, fixedly connected to the base, used to abut against the chip to limit the chip from moving along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other; 第二限位结构,活动连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿所述第一方向的相反方向和所述第二方向的相反方向运动;a second limiting structure, movably connected to the base, and used to abut against the chip to limit the movement of the chip in a direction opposite to the first direction and in a direction opposite to the second direction; 执行结构,连接于所述基座并抵持于所述第二限位结构,用于推动所述第二限位结构沿所述第一方向和所述第二方向运动,以抵接于所述芯片。The execution structure is connected to the base and abuts against the second limiting structure, and is used to push the second limiting structure to move along the first direction and the second direction to abut against the chip. 如权利要求1所述的芯片定位装置,其特征在于:所述第二限位结构形成抵接面,所述抵接面由所述第一方向的相反方向朝向所述第二方向的相反方向倾斜;The chip positioning device according to claim 1, characterized in that: the second limiting structure forms an abutment surface, and the abutment surface is inclined from a direction opposite to the first direction toward a direction opposite to the second direction; 所述执行结构包括抵接件和弹性件;所述弹性件连接于所述基座和所述抵接件,用于推动所述抵接件运动;所述抵接件抵接于所述抵接面以在所述弹性件的作用下推动第二限位结构沿第一方向和第二方向运动。The execution structure includes an abutment member and an elastic member; the elastic member is connected to the base and the abutment member to push the abutment member to move; the abutment member abuts against the abutment surface to push the second limiting structure to move along the first direction and the second direction under the action of the elastic member. 如权利要求2所述的芯片定位装置,其特征在于:所述抵接件转动连接于所述基座,所述抵接件的转动轴平行于所述第二方向。The chip positioning device according to claim 2 is characterized in that: the abutment member is rotatably connected to the base, and the rotation axis of the abutment member is parallel to the second direction. 如权利要求3所述的芯片定位装置,其特征在于:所述弹性件的一端固定连接于所述基座,所述弹性件的另一端固定连接于所述抵接件的一端,所述弹性件用于推动所述抵接件朝向靠近于所述第二限位结构的方向转动。The chip positioning device as described in claim 3 is characterized in that: one end of the elastic member is fixedly connected to the base, the other end of the elastic member is fixedly connected to one end of the abutment member, and the elastic member is used to push the abutment member to rotate in a direction close to the second limiting structure. 如权利要求4所述的芯片定位装置,其特征在于:所述抵接件上形成按压部,所述按压部设置于所述抵接件背离于所述弹性件的一侧,所述按压部用于接收外力,并在外力的作用下朝向远离于所述第二限位结构的方向转动。The chip positioning device as described in claim 4 is characterized in that: a pressing portion is formed on the abutment member, and the pressing portion is arranged on a side of the abutment member away from the elastic member, and the pressing portion is used to receive external force and rotate in a direction away from the second limiting structure under the action of the external force. 如权利要求1所述的芯片定位装置,其特征在于:所述第一限位结构包括:第一限位件,固定连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿所述第一方向运动;The chip positioning device according to claim 1, characterized in that: the first limiting structure comprises: a first limiting member fixedly connected to the base and used to abut against the chip to limit the movement of the chip along the first direction; 第二限位件,固定连接于所述基座,用于抵接于所述芯片,以限制所述芯片沿所述第二方向运动。The second limiting member is fixedly connected to the base and is used to abut against the chip to limit the movement of the chip along the second direction. 如权利要求6所述的芯片定位装置,其特征在于:所述第二限位结构为环状,所述第二限位结构内部形成用于容纳所述芯片的空腔;所述第二限位结构具有第一内壁和第二内壁,所述第一内壁用于抵接于所述芯片,以限制所述芯片沿所述第一方向的相反方向运动;所述第二内壁用于抵接于所述芯片,以限制所述芯片沿所述第二方向的相反方向运动。The chip positioning device as described in claim 6 is characterized in that: the second limiting structure is annular, and a cavity for accommodating the chip is formed inside the second limiting structure; the second limiting structure has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction. 如权利要求7所述的芯片定位装置,其特征在于:所述第二限位结构形成开孔,所述开孔连通于所述空腔,所述开孔用于容纳所述第一限位件和所述第二限位件。The chip positioning device according to claim 7 is characterized in that: the second limiting structure forms an opening, the opening is connected to the cavity, and the opening is used to accommodate the first limiting member and the second limiting member. 如权利要求1~8任一项所述的芯片定位装置,其特征在于:还包括:盖体,转动连接于所述基座,用于在和所述基座靠近的状态下按压所述芯片。The chip positioning device according to any one of claims 1 to 8 is characterized in that it also includes: a cover body, rotatably connected to the base, and used to press the chip when it is close to the base. 如权利要求9所述的芯片定位装置,其特征在于:在所述盖体的下表面对称安装至少两组压爪组件,且所述至少两组压爪组件在所述盖体在和所述基座靠近的状态下与所述芯片抵接,用于将所述芯片压紧固定。The chip positioning device as described in claim 9 is characterized in that: at least two groups of pressure claw assemblies are symmetrically installed on the lower surface of the cover body, and the at least two groups of pressure claw assemblies are in contact with the chip when the cover body is close to the base, so as to press and fix the chip. 如权利要求10所述的芯片定位装置,其特征在于:所述压爪组件包括压爪架、转轴和压爪,所述压爪架与所述转轴转动连接,所述压爪抵接在所述压爪架与所述转轴之间,所述压爪用于压紧所述芯片。The chip positioning device as described in claim 10 is characterized in that: the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip. 如权利要求11所述的芯片定位装置,其特征在于:所述压爪组件还包括弹簧,所述压爪的一端用于压紧所述芯片,所述压爪的另一端通过所述弹簧与所述压爪架固定连接。 The chip positioning device as described in claim 11 is characterized in that: the pressure claw assembly also includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring. 如权利要求12所述的芯片定位装置,其特征在于:所述压爪组件还包括支撑件,所述压爪置于所述支撑件和所述转轴之间,所述压爪的中部抵接所述支撑件。The chip positioning device as described in claim 12 is characterized in that: the pressure claw assembly also includes a support member, the pressure claw is placed between the support member and the rotating shaft, and the middle part of the pressure claw abuts against the support member. 如权利要求13所述的芯片定位装置,其特征在于:所述压爪与所述支撑件的抵接处具有弧形凸面,所述压爪可沿所述弧形凸面旋转以适应所述芯片的角度。The chip positioning device as described in claim 13 is characterized in that: the contact point between the pressure claw and the support member has an arc-shaped convex surface, and the pressure claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip. 如权利要求14所述的芯片定位装置,其特征在于:所述压爪的顶部开设限位槽,所述转轴穿过所述限位槽与所述压爪架转动连接。The chip positioning device as described in claim 14 is characterized in that: a limiting groove is opened on the top of the pressing claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressing claw frame. 如权利要求11~15任一项所述的芯片定位装置,其特征在于:所述压爪与所述芯片的接触面为柔性结构,所述柔性结构为橡胶垫、海绵垫和聚氨酯泡沫之一。The chip positioning device according to any one of claims 11 to 15 is characterized in that the contact surface between the pressure claw and the chip is a flexible structure, and the flexible structure is one of a rubber pad, a sponge pad and a polyurethane foam. 如权利要求10所述的芯片定位装置,其特征在于:所述芯片的内部设置沿其长度方向排布的多组流道,所述流道的两侧分别开设沿所述芯片厚度方向的流体口,所述流体口与所述基座内的流道口连通。The chip positioning device as described in claim 10 is characterized in that: a plurality of groups of flow channels arranged along the length direction of the chip are arranged inside the chip, and fluid ports along the thickness direction of the chip are respectively opened on both sides of the flow channels, and the fluid ports are connected to the flow channel ports in the base. 一种用于基因测序仪的芯片外框装置,其特征在于:包括芯片外框、芯片及密封垫,所述芯片外框上设有芯片槽,所述芯片设置于芯片槽内,所述芯片槽上设置有用于对芯片进行固定的第一固定机构;A chip frame device for a gene sequencer, characterized in that it comprises a chip frame, a chip and a sealing gasket, wherein the chip frame is provided with a chip slot, the chip is arranged in the chip slot, and the chip slot is provided with a first fixing mechanism for fixing the chip; 所述密封垫可拆卸安装在所述芯片外框的底部;The sealing gasket is detachably mounted on the bottom of the chip frame; 所述芯片的内部开设置有多个横置且相互平行的流体槽,所述芯片的下端面开设有与所述流体槽的两端连通的流体口,所述密封垫上设置有流体圆孔,所述流体口、流体圆孔依次连通。The chip is provided with a plurality of transverse and mutually parallel fluid grooves inside, the lower end surface of the chip is provided with a fluid port connected with both ends of the fluid grooves, the sealing gasket is provided with a fluid circular hole, and the fluid port and the fluid circular hole are connected in sequence. 如权利要求18所述的用于基因测序仪的芯片外框装置,其特征在于:所述密封垫上开设有用于与所述基因测序仪的插接凸台卡合的插接槽。The chip frame device for a gene sequencer as described in claim 18 is characterized in that: the sealing gasket is provided with a plug-in groove for engaging with the plug-in boss of the gene sequencer. 如权利要求18所述的用于基因测序仪的芯片外框装置,其特征在于:所述第一固定机构包括上限位板和下限位板,所述上限位板和下限位板分别至少有一对,至少一对的上、下限位板分别固定安装在所述芯片外框的相对两侧内壁上,所述芯片容置于上限位板和下限位板之间形成的槽内。The chip frame device for a gene sequencer as described in claim 18 is characterized in that: the first fixing mechanism includes an upper limit plate and a lower limit plate, and there are at least one pair of upper limit plates and lower limit plates respectively, and at least one pair of upper and lower limit plates are respectively fixedly installed on the inner walls on opposite sides of the chip frame, and the chip is accommodated in a groove formed between the upper limit plate and the lower limit plate. 如权利要求20所述的用于基因测序仪的芯片外框装置,其特征在于:所述第一固定机构还包括限位凸台,所述限位凸台固定安装在所述芯片外框的内侧壁上,所述芯片外框的每个内侧壁上设置有至少一个限位凸台,限位凸台上具有与所述芯片的侧壁相抵触的接触面。The chip frame device for a gene sequencer as described in claim 20 is characterized in that: the first fixing mechanism also includes a limiting boss, and the limiting boss is fixedly mounted on the inner wall of the chip frame, and at least one limiting boss is arranged on each inner wall of the chip frame, and the limiting boss has a contact surface that conflicts with the side wall of the chip. 如权利要求21所述的用于基因测序仪的芯片外框装置,其特征在于:所述接触面为是平面、弧面或球面的一种。The chip frame device for a gene sequencer as described in claim 21 is characterized in that the contact surface is a plane, a curved surface or a spherical surface. 如权利要求21所述的用于基因测序仪的芯片外框装置,其特征在于:位于前侧的所述限位凸台为弹性凸台,所述弹性凸台通过弹性片固定安装在所述芯片外框的内壁上,并具有朝向芯片槽内侧方向挤压的弹力。The chip frame device for a gene sequencer as described in claim 21 is characterized in that the limiting boss located on the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip frame by an elastic sheet and has an elastic force that squeezes toward the inner side of the chip slot. 如权利要求21所述的用于基因测序仪的芯片外框装置,其特征在于:位于左侧的所述限位凸台上具有一自上而下朝内侧倾斜的倾斜面,所述倾斜面的下端与该限位凸台上的接触面过渡连接。The chip frame device for a gene sequencer as described in claim 21 is characterized in that: the limiting boss located on the left side has an inclined surface inclined from top to bottom toward the inside, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss. 如权利要求18所述的用于基因测序仪的芯片外框装置,其特征在于:所述芯片外框的底部固定设置有挂钩,所述密封垫上开设有用于使挂钩卡入的挂孔,密封垫通过挂孔卡接在芯片外框底部的挂钩处。The chip frame device for a gene sequencer as described in claim 18 is characterized in that a hook is fixedly provided at the bottom of the chip frame, and a hanging hole for the hook to be inserted is opened on the sealing gasket, and the sealing gasket is connected to the hook at the bottom of the chip frame through the hanging hole. 如权利要求18所述的用于基因测序仪的芯片外框装置,其特征在于:所述芯片外框上开设有与位于所述基因测序仪上的定位基准对应配合的限位缺口,所述定位基准嵌入所述限位缺口内。The chip frame device for a gene sequencer as described in claim 18 is characterized in that: a limiting notch corresponding to a positioning reference located on the gene sequencer is opened on the chip frame, and the positioning reference is embedded in the limiting notch. 如权利要求26所述的用于基因测序仪的芯片外框装置,其特征在于:所述芯片外框的外侧壁上具有用于与所述基因测序仪上的定位元件定位配合的定位槽,当定位元件处于缩回位置时,所述定位元件与定位槽分离。The chip frame device for a gene sequencer as described in claim 26 is characterized in that: the outer wall of the chip frame has a positioning groove for positioning and cooperating with the positioning element on the gene sequencer, and when the positioning element is in the retracted position, the positioning element is separated from the positioning groove. 一种基因测序仪,其特征在于:包括: A gene sequencer, characterized in that it comprises: 芯片平台,用于承载芯片;Chip platform, used to carry the chip; 第一限位结构,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿第一方向和第二方向运动;其中,所述第一方向和所述第二方向相互垂直;A first limiting structure, fixedly connected to the chip platform, used to abut against the chip to limit the movement of the chip along a first direction and a second direction; wherein the first direction and the second direction are perpendicular to each other; 芯片外框,活动连接于所述芯片平台,所述芯片外框上设有芯片槽,所述芯片设置于芯片槽内,以限制所述芯片沿所述第一方向的相反方向和所述第二方向的相反方向运动;A chip outer frame, movably connected to the chip platform, the chip outer frame is provided with a chip slot, the chip is arranged in the chip slot, so as to limit the movement of the chip in a direction opposite to the first direction and a direction opposite to the second direction; 执行结构,连接于所述芯片平台并抵持于所述芯片外框,用于推动所述芯片外框沿所述第一方向和所述第二方向运动,以抵接于所述芯片;An execution structure, connected to the chip platform and abutting against the chip outer frame, used for pushing the chip outer frame to move along the first direction and the second direction to abut against the chip; 密封垫,可拆卸安装在所述芯片外框的底部;A sealing gasket, detachably mounted on the bottom of the chip frame; 所述芯片平台上设置有与所述密封垫位置对应的密封块;A sealing block corresponding to the position of the sealing pad is arranged on the chip platform; 所述芯片的内部开设置有多个横置且相互平行的流体槽,所述芯片的下端面开设有与所述流体槽的两端连通的流体口,所述密封垫上设置有流体圆孔,所述密封块上开设有的流道口,所述流体口、流体圆孔、流道口依次连通。The chip is provided with a plurality of transverse and mutually parallel fluid grooves inside, the lower end surface of the chip is provided with a fluid port connected with the two ends of the fluid groove, the sealing gasket is provided with a fluid circular hole, the sealing block is provided with a flow channel opening, and the fluid port, the fluid circular hole and the flow channel opening are connected in sequence. 如权利要求28所述的基因测序仪,其特征在于:所述芯片外框形成抵接面,所述抵接面由所述第一方向的相反方向朝向所述第二方向的相反方向倾斜;The gene sequencer according to claim 28, characterized in that: the chip frame forms a contact surface, and the contact surface is inclined from a direction opposite to the first direction toward a direction opposite to the second direction; 所述执行结构包括抵接件和弹性件;所述弹性件连接于所述芯片平台和所述抵接件,用于推动所述抵接件运动;所述抵接件抵接于所述抵接面以在所述弹性件的作用下推动芯片外框沿第一方向和第二方向运动。The execution structure includes an abutment member and an elastic member; the elastic member is connected to the chip platform and the abutment member to push the abutment member to move; the abutment member abuts against the abutment surface to push the chip frame to move along the first direction and the second direction under the action of the elastic member. 如权利要求29所述的基因测序仪,其特征在于:The gene sequencer according to claim 29, characterized in that: 所述抵接件转动连接于所述芯片平台,所述抵接件的转动轴平行于所述第二方向。The abutment member is rotatably connected to the chip platform, and a rotation axis of the abutment member is parallel to the second direction. 如权利要求30所述的基因测序仪,其特征在于:The gene sequencer according to claim 30, characterized in that: 所述弹性件的一端固定连接于所述芯片平台,所述弹性件的另一端固定连接于所述抵接件的一端,所述弹性件用于推动所述抵接件朝向靠近于所述芯片外框的方向转动。One end of the elastic member is fixedly connected to the chip platform, and the other end of the elastic member is fixedly connected to one end of the abutment member. The elastic member is used to push the abutment member to rotate toward a direction close to the chip outer frame. 如权利要求31所述的基因测序仪,其特征在于:The gene sequencer according to claim 31, characterized in that: 所述抵接件上形成按压部,所述按压部设置于所述抵接件背离于所述弹性件的一侧,所述按压部用于接收外力,并在外力的作用下朝向远离于所述芯片外框的方向转动。A pressing portion is formed on the abutting member, and the pressing portion is arranged on a side of the abutting member away from the elastic member. The pressing portion is used to receive external force and rotate in a direction away from the chip frame under the action of the external force. 如权利要求28所述的基因测序仪,其特征在于:所述第一限位结构包括:The gene sequencer according to claim 28, wherein the first limiting structure comprises: 第一限位件,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿所述第一方向运动;A first limiting member, fixedly connected to the chip platform, and used to abut against the chip to limit the movement of the chip along the first direction; 第二限位件,固定连接于所述芯片平台,用于抵接于所述芯片,以限制所述芯片沿所述第二方向运动。The second limiting member is fixedly connected to the chip platform and is used for abutting against the chip to limit the movement of the chip along the second direction. 如权利要求33所述的基因测序仪,其特征在于:The gene sequencer according to claim 33, characterized in that: 所述芯片外框为环状,所述芯片外框内部形成用于容纳所述芯片的空腔;所述芯片外框具有第一内壁和第二内壁,所述第一内壁用于抵接于所述芯片,以限制所述芯片沿所述第一方向的相反方向运动;所述第二内壁用于抵接于所述芯片,以限制所述芯片沿所述第二方向的相反方向运动。The chip frame is annular, and a cavity for accommodating the chip is formed inside the chip frame; the chip frame has a first inner wall and a second inner wall, the first inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the first direction; the second inner wall is used to abut against the chip to limit the movement of the chip in the opposite direction of the second direction. 如权利要求34所述的基因测序仪,其特征在于:The gene sequencer according to claim 34, characterized in that: 所述芯片外框形成开孔,所述开孔连通于所述空腔,所述开孔用于容纳所述第一限位件和所述第二限位件。The chip frame forms an opening, the opening is connected to the cavity, and the opening is used to accommodate the first limiting member and the second limiting member. 如权利要求28~35任一项所述的基因测序仪,其特征在于:还包括:The gene sequencer according to any one of claims 28 to 35, characterized in that it also includes: 盖体,转动连接于所述芯片平台,用于在和所述芯片平台靠近的状态下按压所述芯片。The cover body is rotatably connected to the chip platform and is used for pressing the chip when the cover body is close to the chip platform. 如权利要求36所述的基因测序仪,其特征在于:在所述盖体的下表面对称安装至少两组压爪组件,且所述至少两组压爪组件在所述盖体在和所述芯片平台靠近的 状态下与所述芯片抵接,用于将所述芯片压紧固定。The gene sequencer as claimed in claim 36 is characterized in that: at least two groups of pressure claw assemblies are symmetrically installed on the lower surface of the cover body, and the at least two groups of pressure claw assemblies are symmetrically installed on the lower surface of the cover body when the cover body is close to the chip platform. The chip is in contact with the chip in this state to press and fix the chip. 如权利要求37所述的基因测序仪,其特征在于:所述压爪组件包括压爪架、转轴和压爪,所述压爪架与所述转轴转动连接,所述压爪抵接在所述压爪架与所述转轴之间,所述压爪用于压紧所述芯片。The gene sequencer as described in claim 37 is characterized in that: the pressure claw assembly includes a pressure claw frame, a rotating shaft and a pressure claw, the pressure claw frame is rotatably connected to the rotating shaft, the pressure claw abuts between the pressure claw frame and the rotating shaft, and the pressure claw is used to press the chip. 如权利要求38所述的基因测序仪,其特征在于:所述压爪组件还包括弹簧,所述压爪的一端用于压紧所述芯片,所述压爪的另一端通过所述弹簧与所述压爪架固定连接。The gene sequencer as described in claim 38 is characterized in that: the pressure claw assembly also includes a spring, one end of the pressure claw is used to press the chip, and the other end of the pressure claw is fixedly connected to the pressure claw frame through the spring. 如权利要求39所述的基因测序仪,其特征在于:所述压爪组件还包括支撑件,所述压爪置于所述支撑件和所述转轴之间,所述压爪的中部抵接所述支撑件。The gene sequencer as described in claim 39 is characterized in that: the pressure claw assembly also includes a support member, the pressure claw is placed between the support member and the rotating shaft, and the middle part of the pressure claw abuts against the support member. 如权利要求40所述的基因测序仪,其特征在于:所述压爪与所述支撑件的抵接处具有弧形凸面,所述压爪可沿所述弧形凸面旋转以适应所述芯片的角度。The gene sequencer as described in claim 40 is characterized in that the contact point between the pressure claw and the support member has an arc-shaped convex surface, and the pressure claw can rotate along the arc-shaped convex surface to adapt to the angle of the chip. 如权利要求41所述的基因测序仪,其特征在于:所述压爪的顶部开设限位槽,所述转轴穿过所述限位槽与所述压爪架转动连接。The gene sequencer as described in claim 41 is characterized in that a limiting groove is opened on the top of the pressure claw, and the rotating shaft passes through the limiting groove and is rotatably connected to the pressure claw frame. 如权利要求28~42任一项所述的基因测序仪,其特征在于:所述芯片槽上设置有用于对芯片进行固定的第一固定机构;所述第一固定机构包括上限位板和下限位板,所述上限位板和下限位板分别至少有一对,至少一对的上、下限位板分别固定安装在所述芯片外框的相对两侧内壁上,所述芯片容置于上限位板和下限位板之间形成的槽内。The gene sequencer as described in any one of claims 28 to 42 is characterized in that: a first fixing mechanism for fixing the chip is arranged on the chip slot; the first fixing mechanism includes an upper limit plate and a lower limit plate, and the upper limit plate and the lower limit plate are at least one pair respectively, and the at least one pair of upper and lower limit plates are respectively fixedly installed on the inner walls on both sides of the opposite sides of the chip frame, and the chip is accommodated in the groove formed between the upper limit plate and the lower limit plate. 如权利要求43所述的基因测序仪,其特征在于:所述第一固定机构还包括限位凸台,所述限位凸台固定安装在所述芯片外框的内侧壁上,所述芯片外框的每个内侧壁上设置有至少一个限位凸台,限位凸台上具有与所述芯片的侧壁相抵触的接触面。The gene sequencer as described in claim 43 is characterized in that: the first fixing mechanism also includes a limiting boss, and the limiting boss is fixedly installed on the inner side wall of the chip frame, and at least one limiting boss is arranged on each inner side wall of the chip frame, and the limiting boss has a contact surface that conflicts with the side wall of the chip. 如权利要求44所述的基因测序仪,其特征在于:所述接触面为是平面、弧面或球面的一种。The gene sequencer as described in claim 44 is characterized in that the contact surface is a plane, a curved surface or a spherical surface. 如权利要求44所述的基因测序仪,其特征在于:位于前侧的所述限位凸台为弹性凸台,所述弹性凸台通过弹性片固定安装在所述芯片外框的内壁上,并具有朝向芯片槽内侧方向挤压的弹力。The gene sequencer as described in claim 44 is characterized in that the limiting boss located on the front side is an elastic boss, which is fixedly mounted on the inner wall of the chip frame by an elastic sheet and has an elastic force that squeezes toward the inner side of the chip slot. 如权利要求44所述的基因测序仪,其特征在于:位于左侧的所述限位凸台上具有一自上而下朝内侧倾斜的倾斜面,所述倾斜面的下端与该限位凸台上的接触面过渡连接。The gene sequencer as described in claim 44 is characterized in that: the limiting boss located on the left side has an inclined surface inclined inward from top to bottom, and the lower end of the inclined surface is transitionally connected to the contact surface on the limiting boss. 如权利要求28所述的基因测序仪,其特征在于:所述芯片外框的底部固定设置有挂钩,所述密封垫上开设有用于使挂钩卡入的挂孔,密封垫通过挂孔卡接在芯片外框底部的挂钩处。 The gene sequencer as described in claim 28 is characterized in that a hook is fixedly provided at the bottom of the chip frame, and a hanging hole for the hook to be inserted is opened on the sealing gasket, and the sealing gasket is connected to the hook at the bottom of the chip frame through the hanging hole.
PCT/CN2024/099091 2023-06-13 2024-06-13 Chip positioning apparatus, chip outer frame apparatus for gene sequencer, and gene sequencer Pending WO2024255812A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020257040035A KR20260004486A (en) 2023-06-13 2024-06-13 Chip positioning device, chip outer frame device for gene sequencer and gene sequencer

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
CN202310699027.3A CN116536145A (en) 2023-06-13 2023-06-13 Chip outer frame device for gene sequencer
CN202310699027.3 2023-06-13
CN202322038680.3U CN220531663U (en) 2023-07-28 2023-07-28 Chip split positioning device and chip processing device
CN202322038680.3 2023-07-28
CN202323165477.9 2023-11-22
CN202323165477.9U CN221397857U (en) 2023-11-22 2023-11-22 Be applied to chip carrier of gene sequencer

Publications (1)

Publication Number Publication Date
WO2024255812A1 true WO2024255812A1 (en) 2024-12-19

Family

ID=93851377

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2024/099091 Pending WO2024255812A1 (en) 2023-06-13 2024-06-13 Chip positioning apparatus, chip outer frame apparatus for gene sequencer, and gene sequencer

Country Status (2)

Country Link
KR (1) KR20260004486A (en)
WO (1) WO2024255812A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119589266A (en) * 2024-12-30 2025-03-11 惠州亿纬锂能股份有限公司 Welding jig and welding equipment

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211029703U (en) * 2019-09-30 2020-07-17 苏州联讯仪器有限公司 Positioning device for laser chip
CN212649615U (en) * 2020-07-27 2021-03-02 欧菲微电子技术有限公司 Camera module testing and fixing device
CN217438181U (en) * 2022-06-10 2022-09-16 郑州思昆生物工程有限公司 Gene sequencer and sequencing chip loading device thereof
CN217895611U (en) * 2022-06-10 2022-11-25 郑州思昆生物工程有限公司 Gene sequencer and sequencing chip positioning and compressing device thereof
CN217933765U (en) * 2022-08-01 2022-11-29 深圳超盈智能科技有限公司 Clamping mechanism for testing electronic chip
CN218170226U (en) * 2022-06-10 2022-12-30 郑州思昆生物工程有限公司 Gene sequencer and sequencing chip positioning device thereof
CN218698093U (en) * 2022-11-21 2023-03-24 无锡市宝御达机械设备制造有限公司 Chip positioning tool and equipment
CN116536145A (en) * 2023-06-13 2023-08-04 郑州思昆生物工程有限公司 Chip outer frame device for gene sequencer
CN220514226U (en) * 2023-07-28 2024-02-23 郑州思昆生物工程有限公司 Chip linkage positioning device and chip processing device
CN220531663U (en) * 2023-07-28 2024-02-27 郑州思昆生物工程有限公司 Chip split positioning device and chip processing device
CN221028367U (en) * 2023-10-08 2024-05-28 郑州思昆生物工程有限公司 Leveling device, clamp and gene sequencer

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN211029703U (en) * 2019-09-30 2020-07-17 苏州联讯仪器有限公司 Positioning device for laser chip
CN212649615U (en) * 2020-07-27 2021-03-02 欧菲微电子技术有限公司 Camera module testing and fixing device
CN217438181U (en) * 2022-06-10 2022-09-16 郑州思昆生物工程有限公司 Gene sequencer and sequencing chip loading device thereof
CN217895611U (en) * 2022-06-10 2022-11-25 郑州思昆生物工程有限公司 Gene sequencer and sequencing chip positioning and compressing device thereof
CN218170226U (en) * 2022-06-10 2022-12-30 郑州思昆生物工程有限公司 Gene sequencer and sequencing chip positioning device thereof
CN217933765U (en) * 2022-08-01 2022-11-29 深圳超盈智能科技有限公司 Clamping mechanism for testing electronic chip
CN218698093U (en) * 2022-11-21 2023-03-24 无锡市宝御达机械设备制造有限公司 Chip positioning tool and equipment
CN116536145A (en) * 2023-06-13 2023-08-04 郑州思昆生物工程有限公司 Chip outer frame device for gene sequencer
CN220514226U (en) * 2023-07-28 2024-02-23 郑州思昆生物工程有限公司 Chip linkage positioning device and chip processing device
CN220531663U (en) * 2023-07-28 2024-02-27 郑州思昆生物工程有限公司 Chip split positioning device and chip processing device
CN221028367U (en) * 2023-10-08 2024-05-28 郑州思昆生物工程有限公司 Leveling device, clamp and gene sequencer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119589266A (en) * 2024-12-30 2025-03-11 惠州亿纬锂能股份有限公司 Welding jig and welding equipment

Also Published As

Publication number Publication date
KR20260004486A (en) 2026-01-08

Similar Documents

Publication Publication Date Title
WO2024255812A1 (en) Chip positioning apparatus, chip outer frame apparatus for gene sequencer, and gene sequencer
US6208508B1 (en) Space-saving docking station for vertically supporting an opened notebook computer
JP3076665U (en) LCD screen device
US8605452B2 (en) Chip card holding mechanism and portable electronic device
US20070235625A1 (en) Mounting apparatus for storage device
JP2011077495A (en) Support mechanism and portable electronic device using the same
CN216883642U (en) Chip dismounting clamp and movable chip rack
JP4053772B2 (en) Small migration tank clamp for slab gel plate assembly
CN220350061U (en) Positioning mechanism for film sticking device and film sticking device
WO2025020736A1 (en) Positioning mechanism, film pasting apparatus and film pasting method therefor
CN115813505B (en) Ultrasonic extracorporeal probe puncture bracket with adjustable clamping distance
CN214313591U (en) Chip card fixtures and electronic equipment
CN211577813U (en) HDD Carrier device free of tool disassembly
CN215093100U (en) Self-locking structure and box body with same
CN116536145A (en) Chip outer frame device for gene sequencer
US11224327B2 (en) Sponge fixing mechanism for sponge mop
JP3964345B2 (en) Game machine
CN110676643B (en) Electric power connecting plug
TWI679521B (en) Computer mechanism and adjustable fixing frame
CN219994829U (en) Camera supporting device and cradle head
CN223115037U (en) Clamping device and assembling device
CN117020871B (en) Polishing device for loudspeaker box net cover
CN117206852B (en) Product assembling device
JP2005162263A (en) Lid opening/closing mechanism for wafer transportation container
CN218698183U (en) LCD installation tool

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24822760

Country of ref document: EP

Kind code of ref document: A1

WWE Wipo information: entry into national phase

Ref document number: 202547117386

Country of ref document: IN

ENP Entry into the national phase

Ref document number: 1020257040035

Country of ref document: KR

Free format text: ST27 STATUS EVENT CODE: A-0-1-A10-A15-NAP-PA0105 (AS PROVIDED BY THE NATIONAL OFFICE)

WWP Wipo information: published in national office

Ref document number: 202547117386

Country of ref document: IN

NENP Non-entry into the national phase

Ref country code: DE