WO2025002902A1 - Dispositif de refroidissement configure pour refroidir un module electronique - Google Patents
Dispositif de refroidissement configure pour refroidir un module electronique Download PDFInfo
- Publication number
- WO2025002902A1 WO2025002902A1 PCT/EP2024/066888 EP2024066888W WO2025002902A1 WO 2025002902 A1 WO2025002902 A1 WO 2025002902A1 EP 2024066888 W EP2024066888 W EP 2024066888W WO 2025002902 A1 WO2025002902 A1 WO 2025002902A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- cover
- cooling device
- fluid
- enclosure
- dielectric fluid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20236—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures by immersion
Definitions
- the present invention relates in particular to a cooling device configured to cool an electronic module.
- the present invention aims in particular to further improve the thermal regulation, in particular the cooling, of an electronic module.
- the invention thus relates to a cooling device configured to cool an electronic module comprising an electronic card on which a plurality of electronic components are mounted, the cooling device comprising:
- an enclosure configured to receive the electronic card and the electronic components, and to be filled with a dielectric fluid intended to immerse the electronic components, the enclosure comprising in particular at least one member for holding the electronic card, a cover configured to close the enclosure,
- dielectric fluid distributor configured to distribute dielectric fluid into the enclosure in the form of at least one jet of dielectric fluid, the distributor being in particular connected to the cover.
- a "dielectric fluid jet” is a flow of dielectric fluid that is at a higher speed than the dielectric fluid that fills the enclosure, outside of this jet. This jet makes it possible to locally create a speed differential that allows the jet to better cool the electronic components opposite the jet.
- the fluid distributor according to the invention is configured to distribute dielectric fluid without a drastic change in pressure losses, unlike spray systems. Spray systems require pressures of several bars (in any case, at least 1 bar) and the distributor according to the invention makes it possible in particular to generate only a few tens of millibars, or even a hundred millibars at most.
- the components are completely immersed, in particular without air or gas resulting from a phase change of dielectric fluid.
- the cooling of the electronic components is done by direct contact with the dielectric cooling fluid. This significantly improves the cooling capacity by the fluid, in particular compared to a conventional system using a plate within which cooling fluid circulates.
- the dielectric fluid dispenser is configured to generate a jet of dielectric fluid on only a portion of the electronic module, on a given area.
- the dielectric fluid dispenser is configured to generate a plurality of jets of dielectric fluid.
- the distributor is supplied with dielectric fluid by at least one tube formed on the cover.
- the cover comprises a fluid outlet pipe configured to evacuate fluid having circulated in the enclosure.
- the fluid inlet and outlet pipes extend perpendicular to a main wall of the cover.
- Other orientations are possible, for example the pipes could be inclined relative to the main wall of the cover.
- the pipes are integrated on the side walls of the housing.
- these fluid inlet and outlet pipes communicate with the enclosure through orifices made on the cover.
- the fluid inlet and outlet pipes are made in one piece with the cover.
- the cover includes at least one channel configured to supply dielectric fluid to the dispenser.
- the cover comprises two plates, in particular made of metal such as aluminum, assembled together to form the dielectric fluid channel(s).
- the plates are brazed together.
- one of the plates is stamped to form the channel(s) and the other plate is flat.
- the fluid jet distributor is formed by orifices made on one of these plates.
- the cover is made of plastic, in particular by injection.
- the cover comprises a plurality of dielectric fluid supply channels configured to supply dielectric fluid to the dispenser.
- the cover comprises at least two fluid supply channels, each channel opening onto one of the jet distributors.
- these distributors are arranged in parallel.
- the supply channels of the cover are supplied by a fluid inlet pipe made for example on the cover.
- a fluid outlet for example on one side of the enclosure, is provided to evacuate the fluid distributed by these distributors.
- the cover has a single feed channel for the dispenser.
- the supply channel comprises a main section and branched sections which start from this main section and which each open onto an orifice distributing electrical fluid in the form of jets.
- the branched sections are arranged on one side only of the main section so as to generate jets on a single area to be cooled of the electronic module.
- the branched sections are arranged on two opposite sides of the main section so that these branched sections make it possible to cool two separate areas of the electronic module.
- these branched sections are arranged, for example, in the manner of fish bones.
- the cover comprises an evacuation for evacuating dielectric fluid having circulated in the enclosure.
- this evacuation comprises at least one fluid outlet orifice formed on the cover.
- this fluid discharge connects to a discharge channel formed on the cover.
- the discharge channel may comprise a main section to which branched sections are connected and the fluid is discharged via orifices at one end of these branched sections. The fluid flows in these branched sections then join in the main section and are then discharged from the cover via an outlet pipe.
- the fluid outlet(s) in the cover form areas with a higher flow rate, making it possible to cool the electronic components which are placed opposite this or these fluid outlet(s).
- the distributor is supplied with dielectric fluid by a conduit extending into the enclosure.
- the conduit comprises an orifice configured to generate the jet in the enclosure.
- this or these conduits are connected to fluid inlet and outlet connectors which can be placed on a side wall of the enclosure or on the cover.
- the conduit is a tube, for example a metal tube, in particular extruded.
- the conduit is assembled with the cover, for example by brazing or welding or gluing.
- cover and the conduit(s) may be made in one piece, for example by injection molding a plastic material.
- the conduit comprises branches for bringing the fluid to several orifices to generate several jets.
- the cover comprises a main wall surrounded by a rim raised relative to this main wall, so that when the cover is assembled with the enclosure, the main wall sinks further into the enclosure than the raised edge of the cover.
- the main wall of the cover is located as close as possible to the electronic card and electronic components.
- the distributor comprises one or more outlet orifices for generating the leak jet(s) in the enclosure.
- the orifice(s) have an oblong shape, or alternatively circular or any other shape.
- the orifices of a single distributor may be identical or, alternatively, have different dimensions and orientations within a single group of orifices linked to the same distributor.
- oblong-shaped orifices may be arranged in a longitudinally aligned manner.
- oblong-shaped orifices may be arranged in a parallel manner along their long side.
- each outlet orifice is surrounded by a collar allowing the fluid to be channeled towards the electronic component(s) to be targeted.
- the collar is made on the cover.
- the collar is made at the outlet of the conduit.
- the collar and the associated orifice have an oblong shape.
- the collar is in the form of a lip which surrounds the orifice.
- the cover comprises at least one divergent placed on the outlet orifice.
- the divergent is configured to distribute the fluid over the electronic components.
- the divergent has a flare that opens towards the component(s) to be cooled, forming a hot zone.
- the divergent is inserted on the outlet orifice on the cover.
- the divergent is inserted at the end of a conduit when the dielectric fluid is supplied through a conduit.
- the divergent is made of plastic, in particular by injection.
- the divergent is made of metal, for example anodized aluminum to avoid short circuits.
- the divergent comprises a crenellated end configured to wedge the divergent on the electronic card of the electronic module.
- a crenellated end configured to wedge the divergent on the electronic card of the electronic module.
- the invention thus makes it possible to generate a greater fluid flow on electronic components requiring greater cooling.
- the distributor comprises a distribution nozzle configured to allow high pressure distribution of fluid towards the electronic components to be cooled.
- the nozzle thus makes it possible to generate a high level of turbulence making it possible to improve the heat exchange coefficient.
- the distribution nozzle(s) may be dedicated to a single electronic component or may be used to cool multiple electronic components in an area to be cooled.
- the nozzle comprises a single orifice or several orifices.
- the channel(s) formed on the cover or the conduit(s) may comprise means for disturbing the fluid, in particular flow disruptors (also called “Dimples” in English).
- the disruptors comprise bosses formed inside the channels or inside the conduits.
- the disruptors are present near the outlet orifice of the channel or conduit.
- the disruptors can be produced by stamping on one of the plates of the cover.
- the disruptors can be formed by injection.
- the disruptors are on side and/or upper and/or lower walls of the channel.
- the disruptors may have different shapes, for example a chevron shape, a circular shape, an oblong shape, a polygonal shape for example square or rectangle.
- the invention also relates to a system comprising an electronic module and a cooling device as described above, configured to cool the electronic module.
- the cooling device comprises one or more fluid distributors or outlets configured to cool preferred areas of the electronic module.
- the zones to be cooled in a preferential manner comprise in particular transistors, in particular of the MOSFET type.
- the electronic module is part of a DCDC converter, in particular for a motor vehicle.
- the invention thus makes it possible to cool in a preferential manner the areas which tend to heat up the most, in particular areas on the electronic card which group the transistors.
- Such transistors in the case of a DCDC converter can generate more than half of the total heat loss.
- the invention makes it possible to concentrate the cooling power mainly on the hot areas of the electronic card by increasing the flow rate of dielectric fluid which circulates in these areas.
- the invention thus makes it possible to achieve differentiated cooling levels depending on the areas which have different cooling needs.
- the enclosure comprises a member for holding the electronic card, this holding member being for example a hollow column, for example threaded, allowing the card to be fixed there, for example using a screw.
- Figure 1 is a schematic representation of a system according to an exemplary embodiment of the invention, with an electronic module in an enclosure of a cooling device;
- Figure 2 is a side view of the system of Figure 1;
- FIG. 3 Figure 3 is a perspective view, from above, of the cover of the cooling device illustrated in Figures 1 and 2;
- Figure 4 is a perspective view, from below, of the cover of the cooling device illustrated in Figures 1 and 2;
- Figure 5 is a perspective representation of a cover according to another embodiment
- Figure 6 is a perspective representation, from below, of the cover of Figure 5;
- Figure 7 is a perspective representation of a divergent for a cover according to another embodiment
- Figure 8 is a sectional representation of the divergent of Figure 7;
- Figure 9 is a side view of a cover according to an exemplary embodiment of the invention, with nozzles.
- Figures 1 and 2 show a system 1 comprising an electronic module 2 and a cooling device 3 according to an exemplary embodiment of the invention, configured to cool the electronic module.
- the electronic module 2 is part of a DCDC converter, in particular for a motor vehicle.
- the electronic module 2 comprises an electronic card 4 on which are mounted a plurality of electronic components 5, including MOSFET type transistors present in zones 6.
- Zones 6 are to be cooled in a preferential manner because MOSFET type transistors tend to heat up more than other components. Such transistors in the case of a DCDC converter can generate more than half of the total heat loss.
- the cooling device 3 comprises an enclosure 10 configured to receive the electronic card 4 and the electronic components 5, and to be filled with a dielectric fluid intended to immerse the electronic components 5.
- the enclosure comprises holding members 11 for the electronic card 4.
- the enclosure 10 is for example a single piece, made of plastic or metal, and is in the form of a tank.
- the holding members 11 of the electronic card comprise hollow columns, for example threaded, allowing the card to be fixed there, for example using screws.
- the cooling device 3 further comprises a cover 14 configured to close the enclosure 10, and a dielectric fluid distributor 20 configured to distribute dielectric fluid into the enclosure 10 in the form of jets of dielectric fluid.
- the fluid distributor 20 is configured to preferentially cool one of the zones 6 of the electronic module 2.
- the cover 14 comprises a channel 17 configured to supply dielectric fluid to the distributor 20.
- the cover 14 may comprise two plates 16, in particular made of metal such as aluminum, assembled, by brazing, together to form the channel 17.
- One of the plates 16 is stamped to form the channel and the other plate is generally flat.
- the fluid jet distributor 20 is formed by orifices 18 made on one of these plates 16.
- the cover 14 has a single supply channel.
- This channel 17 is supplied with fluid by an inlet pipe 19.
- the supply channel 17 comprises a main section 21 and branched sections 22 (here three in number) which start from this main section 21 and which each open onto an orifice 18 distributing electrical fluid in the form of jets.
- the branched sections 22 are arranged on one side only of the main section 21 so as to generate jets on a single zone 6 to be cooled of the electronic module.
- the branched sections 22 could be arranged on two opposite sides of the main section 21 so that these sections branched 22 allow two separate zones 6 of the electronic module to be cooled. The two cooled zones 6 are thus cooled by parallel fluid flows.
- the branched sections 22 are arranged, for example, in the manner of fish bones.
- Figure 6 shows the orifices 18 which produce jets towards two zones 6 to be cooled.
- the fluid supply is via an inlet pipe 19, and the fluid outlet 25 is formed on the cover, directly connected to an outlet pipe not shown.
- the outlet is formed by the pipe, and not by a channel made by two assembled plates of the cover.
- the cover 14 has an outlet 25 for evacuating dielectric fluid that has circulated in the enclosure 10.
- Arrows F1 and F2 illustrate in FIG. 3 respectively the direction of entry (into the distributor 20) and the direction of exit of the fluid (through the outlet 25).
- the exhaust 25 has a fluid outlet orifice 26 formed on the cover 14.
- This fluid evacuation 25 connects to an evacuation channel 27 formed on the cover 14.
- the discharge channel 27 comprises a main section 28 to which branched sections 29 are connected and the fluid exits via orifices 30 at one end of these branched sections 29, as visible in FIGS. 3 and 4.
- the fluid flows in these branched sections 29 then join in the main section 28 to then be evacuated from the cover 14 via an outlet pipe 31.
- the orifices 18 and 30 have an oblong shape. Any other suitable shape is possible.
- the groups of orifices 18, respectively 30, may be identical or, alternatively, have different dimensions and orientations within the same group of orifices.
- the oblong-shaped orifices 30 are arranged aligned in the longitudinal direction.
- the oblong-shaped orifices 18 are arranged parallel along their long side, or in a slightly oblique manner.
- Each orifice 18, 30 is surrounded by a collar 37, in the form of a lip, making it possible to channel the fluid towards the electronic components 5 to be targeted, as can be seen in FIG. 4.
- the collar 37 is made on the cover 14.
- the channels 17 and 27 formed on the cover 14 may comprise means for disturbing the fluid, in particular flow disruptors (also called “Dimples” in English). These disruptors 33 comprise bosses formed inside the channels 17 and 27, and are present near the inlet or outlet orifice.
- the disruptors can be made by stamping on one of the plates 16 of the cover, and can have different shapes, for example a chevron shape, a circular shape, an oblong shape, a polygonal shape for example square or rectangle.
- the cover 14 comprises a main wall 34 surrounded by a raised rim 35 relative to this main wall 34, such that when the cover 14 is assembled with the enclosure 10, the main wall 34 sinks further into the enclosure 10 than the raised rim 35 of the cover.
- the main wall 24 of the cover is located as close as possible to the electronic card 4 and the electronic components 5, as illustrated in FIG. 2 in particular.
- the cover 14 comprises a divergent part 40 placed on the fluid outlet orifice 18.
- the divergent 40 is configured to distribute the fluid over the electronic components 5.
- the divergent 40 has a flare which opens towards the components 40 to be cooled forming the hot zone 6.
- the divergent 40 is inserted on the outlet orifice 18 on the cover 14.
- the divergent 40 is made of plastic, in particular by injection.
- the divergent is made of metal, for example anodized aluminum to avoid short circuits.
- the divergent 40 comprises a crenellated end 41 configured to wedge the divergent on the electronic card 4 of the electronic module. [140] By adjusting the width and number of notches of this notched end 41, it is possible to adjust the pressure loss for each zone to be cooled.
- the distributor comprises a distribution nozzle 50 configured to allow high-pressure distribution of fluid to the electronic components 5 to be cooled.
- the nozzle 50 thus makes it possible to generate a high level of turbulence making it possible to improve the heat exchange coefficient.
- the distribution nozzle(s) 50 may be dedicated to a single electronic component or may allow several electronic components to be cooled in a zone 6 to be cooled.
- the distributor is supplied with dielectric fluid by a conduit extending into the enclosure.
- This conduit is separate from the cover.
- the conduit comprises an orifice configured to generate the jet in the enclosure.
- conduits are connected to fluid inlet and outlet connectors which can be placed on a side wall of the enclosure 10 or on the cover 14.
- the conduit is for example a metal tube, in particular extruded.
- the conduit is assembled with the cover, for example by brazing or welding or gluing.
- the cooling device comprises a dielectric fluid evacuation facing, in particular above, a zone 6 to be cooled in a preferred manner, and a fluid distributor on one side of the enclosure 10.
- This fluid distributor may be facing a zone 6 to be cooled in a preferred manner, or as a variant, be facing a zone with components without the need for preferred cooling.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR2306644A FR3150391A1 (fr) | 2023-06-26 | 2023-06-26 | Dispositif de refroidissement configuré pour refroidir un module électronique |
| FRFR2306644 | 2023-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| WO2025002902A1 true WO2025002902A1 (fr) | 2025-01-02 |
Family
ID=88207295
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/EP2024/066888 Pending WO2025002902A1 (fr) | 2023-06-26 | 2024-06-18 | Dispositif de refroidissement configure pour refroidir un module electronique |
Country Status (2)
| Country | Link |
|---|---|
| FR (1) | FR3150391A1 (fr) |
| WO (1) | WO2025002902A1 (fr) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6052284A (en) * | 1996-08-06 | 2000-04-18 | Advantest Corporation | Printed circuit board with electronic devices mounted thereon |
| JP2000349480A (ja) * | 1999-06-02 | 2000-12-15 | Advantest Corp | 発熱素子冷却装置 |
| US20080101013A1 (en) * | 2006-10-25 | 2008-05-01 | Nelson David F | Power module having self-contained cooling system |
-
2023
- 2023-06-26 FR FR2306644A patent/FR3150391A1/fr active Pending
-
2024
- 2024-06-18 WO PCT/EP2024/066888 patent/WO2025002902A1/fr active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6052284A (en) * | 1996-08-06 | 2000-04-18 | Advantest Corporation | Printed circuit board with electronic devices mounted thereon |
| JP2000349480A (ja) * | 1999-06-02 | 2000-12-15 | Advantest Corp | 発熱素子冷却装置 |
| US20080101013A1 (en) * | 2006-10-25 | 2008-05-01 | Nelson David F | Power module having self-contained cooling system |
Also Published As
| Publication number | Publication date |
|---|---|
| FR3150391A1 (fr) | 2024-12-27 |
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