WO2025013178A1 - Modulateur optique et boîtier de modulateur optique - Google Patents

Modulateur optique et boîtier de modulateur optique Download PDF

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Publication number
WO2025013178A1
WO2025013178A1 PCT/JP2023/025473 JP2023025473W WO2025013178A1 WO 2025013178 A1 WO2025013178 A1 WO 2025013178A1 JP 2023025473 W JP2023025473 W JP 2023025473W WO 2025013178 A1 WO2025013178 A1 WO 2025013178A1
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Prior art keywords
pair
optical
optical modulator
resistors
electrical
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PCT/JP2023/025473
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English (en)
Japanese (ja)
Inventor
雅之 高橋
清史 菊池
百合子 川村
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NTT Inc
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Nippon Telegraph and Telephone Corp
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Priority to PCT/JP2023/025473 priority Critical patent/WO2025013178A1/fr
Priority to JP2025532268A priority patent/JPWO2025013178A1/ja
Publication of WO2025013178A1 publication Critical patent/WO2025013178A1/fr
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 

Definitions

  • This disclosure relates to optical modulators and optical modulator packages.
  • Mach-Zehnder optical modulators have low wavelength dependency, are essentially free of wavelength chirp components, and are fast, so they are widely used in optical communications, from medium- and long-distance optical communications using coherent systems to IMDD (direct modulation with direct detection) systems of several hundred meters.
  • IMDD direct modulation with direct detection
  • a Mach-Zehnder optical modulator is structured so that light incident on the input optical waveguide is split into two optical waveguides (arm optical waveguides) with an intensity ratio of approximately 1:1, and the split light is propagated a certain distance before being recombined and output.
  • the phase of the two lights By changing the phase of the two lights using a phase modulation region provided in the two branched optical waveguides, it is possible to change the interference conditions of the light when combined and modulate the intensity or phase of the output light.
  • the materials constituting the optical waveguide in the phase modulation region include dielectrics such as LiNbO3 and semiconductors such as InP, GaAs, and Si (silicon).
  • the phase of the light propagating through the optical waveguide is changed by inputting a modulating electrical signal to an electrode arranged near the optical waveguide and applying a voltage to the optical waveguide.
  • a modulating electrical signal to an electrode arranged near the optical waveguide and applying a voltage to the optical waveguide.
  • V ⁇ half-wave voltage
  • One non-limiting objective of this disclosure is to enable performance measurement (or characteristic testing) of a single optical modulator having a termination resistor.
  • An optical modulator includes a pair of optical waveguides that guide each of the light beams branched from the input light, a pair of electrodes that correspond to the pair of optical waveguides and to which a modulating electrical signal for modulating the input light is input, and a pair of termination resistors that correspond to the pair of electrodes and are not electrically connected to each other.
  • FIG. 1 is a schematic top view showing a configuration example of a Mach-Zehnder optical modulator (MZM).
  • MZM Mach-Zehnder optical modulator
  • FIG. 3 is a diagram showing a schematic diagram of an example of an MZM package including the MZM 100 shown in FIG. 2.
  • 1A to 1C are diagrams illustrating an example of an MZM package including an MZM according to a first modified example of the first embodiment; 11 is a diagram showing a schematic diagram of an example of an MZM package including an MZM according to a second modification of the first embodiment;
  • FIG. 13 is a schematic top view showing a configuration example of an MZM according to a second embodiment.
  • FIG. 13 is a diagram illustrating an example of an MZM package including an MZM according to a second embodiment.
  • FIG. 13 is a schematic top view showing a configuration example of an MZM according to a third embodiment.
  • FIG. 13 is a diagram illustrating an example of an MZM package including an MZM according to a third embodiment.
  • V ⁇ One of the performance indices of a Mach-Zehnder optical modulator (MZM) is the half-wave voltage, denoted as V ⁇ .
  • the half-wave voltage V ⁇ is the voltage for changing the phase of light by ⁇ , and the smaller the half-wave voltage V ⁇ , the less voltage (or power) required to drive the optical modulator. Since there is an upper limit to the voltage amplitude of the drive circuit that provides the modulated electrical signal to the optical modulator, if the half-wave voltage V ⁇ is larger than the voltage amplitude of the drive circuit, a sufficient amount of phase change or sufficient intensity modulation cannot be obtained, and the quality of the transmission signal may deteriorate.
  • the half-wave voltage V ⁇ can vary from wafer lot to wafer lot or chip to chip due to process variations. Therefore, when mass-producing communication modules that include MZMs, it may be necessary to perform a characteristic test of the half-wave voltage V ⁇ in advance.
  • Non-Patent Document 1 as shown in FIG. 1, for example, a termination resistor 700 is connected between traveling-wave electrodes 601 and 602 provided for optical waveguides 501 and 502 that form two parallel arms constituting an MZM 500.
  • the optical waveguides that form the arms may be conveniently referred to as “arm waveguides,” and the traveling-wave electrodes may be conveniently referred to as “arm electrodes.”
  • Mounting pads 601a and 602a are provided at one end of each of the traveling wave electrodes 601 and 602, which are electrically connected to a driving circuit (not shown), and a modulated electrical signal is applied from the driving circuit (not shown) to each of the traveling wave electrodes 601 and 602 via the mounting pads 601a and 602a.
  • the termination resistor 700 is connected between the traveling wave electrodes 601 and 602, so a direct current (DC) bias is not applied to only the traveling wave electrode corresponding to one of the two arms. This prevents DC measurements, such as the measurement of the half-wave voltage V ⁇ , and prevents, for example, characteristic testing of individual chips in the wafer state.
  • DC direct current
  • a structure is described in which the termination resistor is divided for each arm electrode, and the division of the termination resistor is released when the MZM is mounted on a package substrate (or a module substrate).
  • An example of a structure in which the division is released is a structure in which resistors provided individually for the arm electrodes are electrically connected (in other words, short-circuited) when the MZM is mounted on a package substrate to form a termination resistor.
  • resistors provided individually for the arm electrodes are electrically connected (in other words, short-circuited) when the MZM is mounted on a package substrate to form a termination resistor.
  • no termination resistor is formed between the arm electrodes at the stage before the MZM is mounted on a package substrate, making it possible to measure the characteristics of the MZM alone, for example, to measure the half-wave voltage V ⁇ .
  • first embodiment for example, in flip chip (FC) mounting, a structure is described in which wiring provided on a package substrate and a mounting pad of an MZM are electrically connected by a bump, and resistors provided for each arm electrode are electrically connected to form a termination resistor.
  • FC flip chip
  • the MZM 100 is a schematic top view showing an example of the configuration of a Mach-Zehnder optical modulator (MZM) 100 according to the first embodiment.
  • the MZM 100 illustratively includes an optical circuit board 101, and, as examples of optical circuits formed on the optical circuit board 101, an input optical waveguide 110a, a branching coupler 111a, optical waveguides 112a and 112b corresponding to the two arm waveguides, a multiplexing coupler 111b, and an output optical waveguide 110b.
  • light input to input optical waveguide 110a is branched into two at branching coupler 111a, and the two branched lights propagate through arm waveguides 112a and 112b, respectively, and are input to multiplexing coupler 111b.
  • Multiplexing coupler 111b combines the light input from each of arm waveguides 112a and 112b, and outputs the combined light to output optical waveguide 110b.
  • MZM 100 illustratively includes traveling-wave electrodes 120a and 120b provided corresponding to arm waveguides 112a and 112b, electrical pads 130a and 130b connected to one end of traveling-wave electrodes 120a and 120b, termination resistors 150a and 150b connected to the other end of traveling-wave electrodes 120a and 120b, and electrical pads 140a and 140b connected to the other end of termination resistors 150a and 150b.
  • the "electrical pads” may be referred to as "mounting pads.”
  • Mounting pads 130a and 130b are each electrically connected to a drive circuit (not shown), and a modulated electrical signal is provided from the drive circuit to traveling wave electrodes 120a and 120b via mounting pads 130a and 130b.
  • the phase of the light that is split into two by the splitting coupler 111a and propagates through each of the arm waveguides 112a and 112b changes, and the optical interference conditions in the multiplexing coupler 111b change.
  • the intensity or phase of the light output from the multiplexing coupler 111b to the output optical waveguide 110b is modulated.
  • a semiconductor material such as Si, InP, or GaAs, or a dielectric material such as LiNbO3 may be used, for example.
  • the termination resistors 150a and 150b are electrically isolated from each other (in other words, insulated) on the optical circuit board 101.
  • the mounting pads 140a and 140b are electrically connected to each other via bump connections during FC mounting, for example, so that the other ends of the termination resistors 150a and 150b are electrically connected to each other (in other words, short-circuited).
  • termination resistors 150a and 150b form a termination resistor between traveling-wave electrodes 120a and 120b in conjunction with bump connection during FC implementation. Therefore, the resistance value of each of termination resistors 150a and 150b has a resistance value that is, for example, a division of the intended resistance value of the termination resistor connected between traveling-wave electrodes 120a and 120b.
  • the termination resistors 150a and 150b that are insulated from each other on the optical circuit board 101 will be referred to as partial termination resistors (or split termination resistors) 150a and 150b, respectively.
  • the pair of partial termination resistors 150a and 150b may be referred to as partial termination resistor pair 150 for convenience.
  • the termination resistor formed by shorting the partial termination resistors 150a and 150b by bump connection in FC mounting will be referred to as composite termination resistor 150ab for convenience.
  • the electrical connection between the mounting pads 140a and 140b can be formed, for example, by bump-connecting each of the mounting pads 140a and 140b to electrical wiring provided on the package substrate 201 (described later in FIG. 3).
  • FIG. 3 is a schematic diagram showing an example of an MZM package (or MZM module) including the MZM 100 shown in FIG. 2.
  • FIG. 3 shows, as an example, an optical circuit board 101 including the MZM 100 FC-mounted on a package board 201. Because of the FC mounting, the optical circuit board 101 and the package board 201 are bump-connected with their surfaces on which the optical circuit or electrical wiring is provided facing each other, as shown in the lower part of FIG. 3, for example.
  • the A-A cross section or B-B cross section shown in the upper part of Figure 3 corresponds to the structure shown in the lower part of Figure 3.
  • a set of components is distinguished from each other by adding "a” or "b” to the reference symbol "120", for example, "120a” and "120b", in the upper part of Figure 3, the addition of "a” and "b” is omitted in the lower part of Figure 3, and a set of components is shown without distinction from each other.
  • This method of notating symbols is the same in the following explanations and drawings used.
  • the pair of mounting pads 130a and 130b may be referred to as mounting pad pair 130, and the pair of mounting pads 140a and 140b may be referred to as mounting pad pair 140.
  • the package substrate 201 has, for example, on its upper surface, electrical wiring 210a and 210b to which an electrical modulation signal is provided from the drive circuit, and electrical wiring 220 having a length capable of electrically connecting between the mounting pad pair 140 on the optical circuit board 101.
  • Two bumps 230 are provided on the top of each of the electrical wirings 210a and 210b during FC mounting, allowing electrical connection to the mounting pad pair 130 on the optical circuit board 101.
  • two bumps 240 are provided on the top of each of both ends of the electrical wiring 220 during FC mounting, which enable electrical connection with the mounting pad pair 140 on the optical circuit board 101.
  • the optical circuit board 101 is connected to the package substrate 201 by two bumps 230 and two bumps 240, for example, with the surface on which the MZM 100 is provided facing downward. With this connection, the mounting pad pair 130 of the optical circuit board 101 is electrically connected to the electrical wiring 210a and 210b, respectively, via the bumps 230.
  • the mounting pad pair 140 connected to the partial termination resistor pair 150 is connected to the electrical wiring 220 via the bump 240, thereby shorting the partial termination resistor pair 150 and forming a composite termination resistor 150ab.
  • the composite termination resistor 150ab is connected between the traveling wave electrodes 120a and 120b.
  • the MZM 100 (optical circuit board 101) is FC mounted on the package board 201
  • the partial termination resistors 150a and 150b provided individually for the traveling-wave electrodes 120a and 120b are electrically connected, and a composite termination resistor 150ab is formed between the traveling-wave electrodes 120a and 120b.
  • the mounting pad pairs 140 of the MZM 100 may be electrically connected by wire bonding to electrically connect the partial termination resistor pairs 150 to form the composite termination resistor 150ab.
  • FIG. 4 is a schematic diagram showing an example of an MZM package (or MZM module) including an MZM 100 according to variant 1 of the first embodiment.
  • FIG. 4 exemplarily shows an optical circuit board 101 including an MZM 100 FU-mounted on a package board 201a. Because of the FU mounting, the optical circuit board 101 is mounted on the top of the package board 201a with the surface on which the MZM 100 is mounted facing up, as shown in the lower part of FIG. 4.
  • the upper part of Figure 4 shows an example of the optical circuit board 101 provided on the top of the package substrate 201a, as viewed from directly above.
  • the cross section taken along the line A-A or the line B-B shown in the upper part of Figure 4 corresponds to the structure shown in the lower part of Figure 4.
  • the reference symbols 250a, 250b, and 260 indicate electric wires, which are conveniently and diagrammatically represented by curved lines so that it is easy to visually and intuitively grasp that they are electric wires. Therefore, the top view and the cross-sectional view taken along the line A-A in FIG. 4 may be inaccurate when focusing on the electric wires, but are merely for the convenience of explanation.
  • the package substrate 201a does not need to be provided with electrical wiring 210a, 210b, and 220 that is electrically connected to the mounting pad pair 130 and the mounting pad pair 140, respectively, as illustrated in FIG. 3.
  • the mounting pad pairs 130 are electrically connected, for example to the driver circuitry, by bonding of individual electrical wires 250a and 250b. Additionally, the mounting pad pairs 140 to which the partial termination resistor pairs 150 are connected are electrically connected by bonding of electrical wires 260.
  • the mounting pad pair 140 is electrically connected by the electrical wire 260, and the partial termination resistor pair 150 is electrically connected to form the composite termination resistor 150ab. This connects the composite termination resistor 150ab between the traveling wave electrodes 120a and 120b.
  • the partial termination resistors 150a and 150b are electrically isolated (or insulated) from each other, so it is permissible to apply a DC bias to one of the traveling wave electrodes 120a and 120b of the MZM100. Therefore, as in the first embodiment described above, it is possible to measure the characteristics of the MZM100 alone.
  • FIG. 5 is a diagram showing a schematic example of an MZM package (or an MZM module) including an MZM 100 according to the second modification of the first embodiment.
  • Fig. 5 shows, as an example, an optical circuit board 101 including an MZM 100 FC-mounted on a package board 201.
  • Fig. 5 follows the notation of the configuration examples shown in the upper and lower parts of Fig. 3, and the cross section taken along the line A-A or the cross section taken along the line B-B shown in the upper part of Fig. 5 corresponds to the structure shown in the lower part of Fig. 5.
  • the configuration illustrated in FIG. 5 differs from the configuration illustrated in FIG. 3 of the first embodiment in that, instead of electrical wiring 220 for electrically connecting (in other words, short-circuiting) the mounting pad pair 140a and 140b in the package substrate 201b, individual electrical wiring 270a and 270b are provided for each of the mounting pads 140a and 140b.
  • Electrical wiring 270a and 270b are not electrically connected to each other in package substrate 201b.
  • Each of electrical wiring 270a and 270b illustratively has a bump 240 at one end and the other end is connected to via 270c embedded in package substrate 201b, and can be electrically connected to an external device (e.g., an external power supply terminal, not shown) through via 270c.
  • an external device e.g., an external power supply terminal, not shown
  • MZM 100 can receive power (e.g., application of DC) through an external power supply terminal. Also, by electrically connecting mounting pads 140a and 140b via bump 240, electrical wiring 270a, 270b, and the external power supply terminal, partial termination resistors 150a and 150b are shorted, and composite termination resistor 150ab is formed.
  • Such a structure according to Modification 2 is useful, for example, when using a drive circuit called an open collector type or open drain type that does not have a sending end resistor and operates by receiving a drive current from a signal output terminal, in a form in which the signal output terminal of the drive circuit is connected to MZM100 via mounting pads 130a and 130b.
  • the signal output terminal of the drive circuit connected to mounting pads 130a and 130b is connected to an external power supply terminal through MZM100, and can operate by receiving a drive current.
  • Second Embodiment Fig. 6 is a schematic top view showing a configuration example of the MZM 100A according to the second embodiment.
  • the MZM 100A shown in Fig. 6 is different from the configuration shown in Fig. 2 of the first embodiment in, for example, the following two points.
  • the other configurations may be understood to be equivalent or similar to those of the first embodiment.
  • a pair of mounting pads 141a and 141b and a pair of mounting pads 142a and 142b are additionally provided behind the pair of mounting pads 140a and 140b (to the right of the paper in FIG. 6).
  • adjustment resistors 161a, 161b, 162a, and 162b are additionally provided to electrically connect the mounting pads 140a-141a, the mounting pads 140b-141b, the mounting pads 141a-142a, and the mounting pads 141b-142b, respectively. Some or all of the adjustment resistors 161a, 161b, 162a, and 162b may have the same resistance value or different resistance values.
  • mounting pad pair 140 the pair of mounting pads 141a and 141b and the pair of mounting pads 142a and 142b may be referred to as mounting pad pair 141 and mounting pad pair 142, respectively, for convenience.
  • mounting pads 140a-141a and mounting pads 140b-141b when there is no need to distinguish between mounting pads 140a-141a and mounting pads 140b-141b, they may be referred to as mounting pads 140-141 for convenience.
  • adjustment resistor 161a and 161b they may be referred to as adjustment resistor 161
  • adjustment resistor 162a and 162b when there is no need to distinguish between adjustment resistors 162a and 162b, they may be referred to as adjustment resistor 162.
  • mounting pad pair 141 and mounting pad pair 142 are added to mounting pad pair 140, thereby increasing the number of candidate positions for bump connection during FC mounting.
  • the number of candidate positions for bump connection capable of electrically connecting partial termination resistors 150a and 150b increases from one position where mounting pad pair 140 is provided in the first embodiment (FIG. 3) to three different positions where each of the three mounting pad pairs 140 to 142 is provided.
  • adjustment resistors 161 and 162 are electrically connected in series between mounting pads 140-141 and between mounting pads 141-142, respectively. Therefore, by selecting one of the three candidate positions for the bump connection, it is possible to vary the resistance value of composite termination resistor 150ab when partial termination resistors 150a and 150b are short-circuited.
  • the resistance value of the composite termination resistor 150ab corresponds to the sum of the resistance value of each of the partial termination resistor pairs 150 and the resistance value of each of the two adjustment resistors 161a and 161b.
  • the resistance value of the composite termination resistor 150ab is the sum of the resistance value of each of the partial termination resistor pairs 150 and the resistance values of each of the four adjustment resistors 161a, 161b, 162a, and 162b.
  • FIG. 7 is a schematic diagram showing an example of an MZM package (or an MZM module) including an MZM 100A according to the second embodiment.
  • FIG. 7 shows, as an example, an optical circuit board 101 including an MZM 100A FC-mounted on a package board 201.
  • FIG. 7 follows the notation of the configuration examples shown in the upper and lower parts of FIG. 3, and the A-A cross section or B-B cross section shown in the upper part of FIG. 7 corresponds to the structure shown in the lower part of FIG. 7.
  • the package substrate 201 illustrated in FIG. 7 differs from the configuration illustrated in FIG. 3 in that it additionally includes electrical wiring 221 and 222 that can electrically connect between the additional mounting pads 141a-141b and between the additional mounting pads 142a-142b during bump connection.
  • electrical wiring 220, 221, and 222 capable of short-circuiting between the first row mounting pad pairs 140, the second row mounting pad pairs 141, and the third row mounting pad pairs 142 are arranged in parallel at different positions on the package substrate 201.
  • the partial termination resistors 150a and 150b are short-circuited by the corresponding one of the electrical wirings 220, 221, and 222 to form a composite termination resistor 150ab.
  • the spacing between the electrical wirings 220, 221, and 222 arranged in parallel on the package substrate 201 may be the same or different.
  • one of the different mounting pad pairs 140, 141, and 142 on the optical circuit board 101 is selectively short-circuited to the corresponding electrical wiring 220, 221, or 222 on the package board 201 by a bump connection.
  • the electrical connection path (in other words, the electrical path or short-circuit path) between the partial termination resistors 150a and 150b can be selectively set to either a path that does not include the adjustment resistors 161 and 162, or a path that includes some or all of the adjustment resistors 161 and 162, by selecting the bump connection position.
  • the termination resistance value can be adjusted by selecting a short-circuit path. Therefore, even if there is an impedance mismatch between the characteristic impedance of the traveling wave electrodes 120a and 120b in the MZM 100 and the composite termination resistor 150ab, the impedance mismatch can be compensated for, and the quality of the transmitted modulated signal light can be improved.
  • adjustment resistors 161a, 161b, 162a, and 162b are provided between mounting pads 140a and 141a, between mounting pads 140b and 141b, between mounting pads 141a and 142a, and between mounting pads 141b and 142b.
  • adjustment resistors 161 or 162 may be provided only in some of the spaces between the four mounting pads.
  • the positions of three different mounting pad pairs 140, 141, and 142 on the optical circuit board 101 are set as candidate bump connection positions, and three short-circuit path candidates that can obtain different composite termination resistance values are shown.
  • two short-circuit path candidates or four or more short-circuit path candidates that can obtain different composite termination resistance values may be specified depending on the number of candidate bump connection positions.
  • the second embodiment described above may also be implemented in combination with, for example, Modification 1 of the first embodiment (see FIG. 4).
  • at least one of the mounting pad pairs 140 to 142 may be selectively short-circuited by wire bonding of the electrical wire 250 instead of the electrical wiring 220, 221, or 222.
  • FIG. 8 is a schematic top view showing a configuration example of an MZM 100B according to the third embodiment.
  • the MZM 100B shown in Fig. 8 is different from the configuration shown in Fig. 2 of the first embodiment in that it has mounting pads 145a and 145b instead of the mounting pads 140a and 140b.
  • the pair of mounting pads 145a and 145b may be referred to as a mounting pad pair 145 for convenience.
  • mounting pads 145a and 145b each have a size that is larger in length in the direction along the longitudinal direction of traveling wave electrodes 120a and 120b than mounting pads 140a and 140b shown in FIG. 2.
  • FIG. 9 is a diagram showing a schematic example of an MZM package (or MZM module) including an MZM 100B according to the third embodiment, and shows, by way of example, an optical circuit board 101 including an MZM 100B FC-mounted on a package board 201.
  • FIG. 9 follows the notation of the configuration examples shown in the upper and lower parts of FIG. 3, FIG. 5, and FIG. 7, respectively, and the A-A cross section or B-B cross section shown in the upper part of FIG. 9 corresponds to the structure shown in the lower part of FIG. 9.
  • the package substrate 201 illustrated in FIG. 9 differs from the configuration illustrated in FIG. 3 in that it has electrical wiring 231, 232, and 233 having adjustment resistors 151, 152, and 153 instead of electrical wiring 220.
  • the mounting pad pair 145 is common to these adjustment resistors 151 to 153 and electrical wiring 231 to 233.
  • the resistance values of the adjustment resistors 151 to 153 may be the same or different in part or in whole. Note that some or all of the electrical wiring 231 to 233 may also serve as adjustment resistors, and some or all of the adjustment resistors 151 to 153 may not be provided separately.
  • the electrical wiring 231-233 is provided on the package substrate 201 with a size and arrangement that allows electrical connection between the mounting pad pairs 145 by bump connections at different positions in the longitudinal direction of the mounting pad pairs 145 during FC mounting of the optical circuit board 101.
  • the electrical wirings 231 to 233 are arranged in parallel at positions where the longitudinal distances of the mounting pad pairs 145 in a plan view relative to the partial termination resistor pair 150 are different in an area on the package substrate 201 that corresponds to each of the mounting pad pairs 145 when the optical circuit board 101 is FC mounted.
  • the partial termination resistor pair 150 is short-circuited by an electrical path that includes a corresponding one of the adjustment resistors 151-153, forming a composite termination resistor 150ab.
  • the spacing between the electrical wirings 231-233 arranged in parallel on the package substrate 201 may be the same or different.
  • the partial termination resistor pair 150 is short-circuited by an electrical path including the adjustment resistor 151.
  • the partial termination resistor pair 150 is short-circuited by an electrical path including the adjustment resistor 152.
  • the partial termination resistor pair 150 is short-circuited by an electrical path including the adjustment resistor 153.
  • the mounting pad pair 145 is common to the electrical wirings 231 to 233, and the bump connection target for the mounting pad pair 145 is selected to be one of the electrical wirings 231 to 233. This allows the short-circuit path between the partial termination resistor pair 150 to be set as a path that additionally includes one of the adjustment resistors 151 to 153.
  • any one of the multiple electrical wirings 231-233 may be an electrical wiring that does not have an adjustment resistor.
  • the mounting pad pair 145 can be short-circuited by bump connection of the electrical wiring 231, thereby short-circuiting the partial termination resistor pair 150 via a path that does not include an adjustment resistor.
  • the termination resistance value can be adjusted by selecting the short-circuit path between the partial termination resistor pair 150, so that the impedance mismatch can be compensated for and the quality of the transmitted modulated signal light can be improved.
  • the mounting pad pair 145 is common to the electrical wiring 231-233 and the adjustment resistors 151-153, and it is not necessary to provide the adjustment resistors 161 and 162 between the mounting pad pairs of the optical circuit board 101 as in the second embodiment.
  • the adjustment resistors 151-153 can be formed separately for the electrical wiring 231-233 in the package board 201, which can improve the manufacturability of the optical circuit board 101 and the package board 201, and thus the manufacturability of the package including the MZM 100B, for example.
  • the positions of three different electrical wirings 231-233 in the optical circuit board 101 are set as candidates for bump connection positions, and three short-circuit path candidates that can obtain different composite termination resistance values are shown.
  • two short-circuit path candidates or four or more short-circuit path candidates that can obtain different composite termination resistance values may be specified depending on the number of candidates for bump connection positions.
  • This disclosure is useful for technologies that use optical circuits, such as optical communication systems or optical information processing systems.
  • MZM Mach-Zehnder Optical Modulator
  • Optical circuit board 110a Input optical waveguide 110b Output optical waveguide 111a Branching coupler 111b Wave-combining coupler 112a, 112b Optical waveguide 120a, 120b Traveling wave electrode 130a, 130b, 140a, 140b, 141a, 141b, 142a, 142b, 145a, 145b Electrical pad 150a, 150b Termination resistor 151 to 153, 161a, 161b, 162a, 162b Adjustment resistor 201, 201a, 201b Package substrate 210a, 210b, 220 to 222, 231 to 233, 270a, 270b Electrical wiring 230, 240 Bump 250a, 250b, 260 Electrical wire 270c Via

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  • Physics & Mathematics (AREA)
  • Nonlinear Science (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)

Abstract

L'invention concerne un modulateur optique (100) comprenant : une paire de guides d'ondes optiques (112a, 112b) qui guident chacun des faisceaux de lumière obtenus en amenant la lumière d'entrée à se ramifier ; une paire d'électrodes (120a, 120b) qui sont disposées en correspondance avec les guides d'ondes optiques (112a, 112b), respectivement, et dans lesquelles un signal électrique de modulation pour moduler la lumière d'entrée est entré ; et une paire de résistances de terminaison (150a, 150b) qui sont disposées en correspondance avec les électrodes (120a, 120b), respectivement et ne sont pas électriquement connectées l'une à l'autre.
PCT/JP2023/025473 2023-07-10 2023-07-10 Modulateur optique et boîtier de modulateur optique Ceased WO2025013178A1 (fr)

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PCT/JP2023/025473 WO2025013178A1 (fr) 2023-07-10 2023-07-10 Modulateur optique et boîtier de modulateur optique
JP2025532268A JPWO2025013178A1 (fr) 2023-07-10 2023-07-10

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JP2004287116A (ja) * 2003-03-24 2004-10-14 Hitachi Ltd 光送信装置
JP2005159938A (ja) * 2003-11-28 2005-06-16 Nippon Telegr & Teleph Corp <Ntt> 光クロック再生装置及び光クロック再生方法
JP2016537691A (ja) * 2013-11-25 2016-12-01 フラウンホファー‐ゲゼルシャフト・ツア・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ 電気光学変調器装置
US20170194308A1 (en) * 2016-01-04 2017-07-06 Infinera Corporation Photonic integrated circuit package
US11177219B1 (en) * 2020-09-16 2021-11-16 Hewlett Packard Enterprise Development Lp Photonic integrated circuit with integrated optical transceiver front-end circuitry for photonic devices and methods of fabricating the same

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004037695A (ja) * 2002-07-02 2004-02-05 Sumitomo Osaka Cement Co Ltd 光変調器
JP2004287116A (ja) * 2003-03-24 2004-10-14 Hitachi Ltd 光送信装置
JP2005159938A (ja) * 2003-11-28 2005-06-16 Nippon Telegr & Teleph Corp <Ntt> 光クロック再生装置及び光クロック再生方法
JP2016537691A (ja) * 2013-11-25 2016-12-01 フラウンホファー‐ゲゼルシャフト・ツア・フェルデルング・デア・アンゲヴァンテン・フォルシュング・エー・ファウ 電気光学変調器装置
US20170194308A1 (en) * 2016-01-04 2017-07-06 Infinera Corporation Photonic integrated circuit package
US11177219B1 (en) * 2020-09-16 2021-11-16 Hewlett Packard Enterprise Development Lp Photonic integrated circuit with integrated optical transceiver front-end circuitry for photonic devices and methods of fabricating the same

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