WO2025036850A3 - Composition de désassemblage, son utilisation pour désassembler une structure collée et procédé de désassemblage associé - Google Patents

Composition de désassemblage, son utilisation pour désassembler une structure collée et procédé de désassemblage associé Download PDF

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Publication number
WO2025036850A3
WO2025036850A3 PCT/EP2024/072624 EP2024072624W WO2025036850A3 WO 2025036850 A3 WO2025036850 A3 WO 2025036850A3 EP 2024072624 W EP2024072624 W EP 2024072624W WO 2025036850 A3 WO2025036850 A3 WO 2025036850A3
Authority
WO
WIPO (PCT)
Prior art keywords
disassembly
disassembling
composition
bonded structure
carbonates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2024/072624
Other languages
English (en)
Other versions
WO2025036850A2 (fr
Inventor
Sophie FRANCESCHI
Emile Perez
Alexandre CORDINIER
Nicolas MISTOU
Philippe PONTEINS
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Expleo France
Centre National de la Recherche Scientifique CNRS
Universite de Toulouse
Original Assignee
Expleo France
Centre National de la Recherche Scientifique CNRS
Universite Toulouse III Paul Sabatier
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Expleo France, Centre National de la Recherche Scientifique CNRS, Universite Toulouse III Paul Sabatier filed Critical Expleo France
Publication of WO2025036850A2 publication Critical patent/WO2025036850A2/fr
Publication of WO2025036850A3 publication Critical patent/WO2025036850A3/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J11/00—Recovery or working-up of waste materials
    • C08J11/04—Recovery or working-up of waste materials of polymers
    • C08J11/06—Recovery or working-up of waste materials of polymers without chemical reactions
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2300/00—Characterised by the use of unspecified polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2483/00—Presence of polysiloxane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
  • Processing Of Solid Wastes (AREA)

Abstract

L'invention se rapporte à une composition de désassemblage comprenant : - un ou plusieurs carbonates organiques choisis parmi les carbonates de dialkyle et les carbonates d'alkylène, - une solution aqueuse de peroxyde d'hydrogène H2O2, - un ou plusieurs acides organiques choisis parmi les acides monocarboxyliques comprenant au moins 10 atomes de carbone et les acides polycarboxyliques, et - un ou plusieurs agents gélifiants. L'invention se rapporte également à l'utilisation de cette composition pour le désassemblage d'une structure comprenant au moins deux éléments solidarisés entre eux au moyen d'un joint de colle ainsi qu'à un procédé de désassemblage d'une telle structure.
PCT/EP2024/072624 2023-08-11 2024-08-09 Composition de désassemblage, son utilisation pour désassembler une structure collée et procédé de désassemblage associé Pending WO2025036850A2 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FRFR2308656 2023-08-11
FR2308656A FR3152027B1 (fr) 2023-08-11 2023-08-11 Composition de désassemblage, son utilisation pour désassembler une structure collée et procédé de désassemblage associé

Publications (2)

Publication Number Publication Date
WO2025036850A2 WO2025036850A2 (fr) 2025-02-20
WO2025036850A3 true WO2025036850A3 (fr) 2025-04-17

Family

ID=89321969

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2024/072624 Pending WO2025036850A2 (fr) 2023-08-11 2024-08-09 Composition de désassemblage, son utilisation pour désassembler une structure collée et procédé de désassemblage associé

Country Status (2)

Country Link
FR (1) FR3152027B1 (fr)
WO (1) WO2025036850A2 (fr)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030130150A1 (en) * 2000-05-31 2003-07-10 Kneafsey Brendan J Semi- solid compositions for removing cured product
US20120073610A1 (en) * 2010-09-27 2012-03-29 Fujifilm Corporation Cleaning agent for semiconductor substrate, cleaning method using the cleaning agent, and method for producing semiconductor element
WO2023222975A1 (fr) * 2022-05-20 2023-11-23 Expleo France Utilisation d'une composition pour recycler un materiau a base de resine epoxyde, procede de recyclage et composition associes

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030130150A1 (en) * 2000-05-31 2003-07-10 Kneafsey Brendan J Semi- solid compositions for removing cured product
US20120073610A1 (en) * 2010-09-27 2012-03-29 Fujifilm Corporation Cleaning agent for semiconductor substrate, cleaning method using the cleaning agent, and method for producing semiconductor element
WO2023222975A1 (fr) * 2022-05-20 2023-11-23 Expleo France Utilisation d'une composition pour recycler un materiau a base de resine epoxyde, procede de recyclage et composition associes

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
ANONYMOUS: "https://www.prevestdenpro.com/product/citrogen-gel/", 3 August 2021 (2021-08-03), pages 1 - 2, XP093147778, Retrieved from the Internet <URL:https://www.prevestdenpro.com/product/citrogen-gel/> [retrieved on 20240403] *
ANONYMOUS: "Loctite Glue Remover, Effective Adhesive Remover for Correcting Badly Bonded Items, Practical Sticker Remover for a Range of Surfaces, 1 x 5g : Amazon.co.uk: DIY & Tools", 24 November 2021 (2021-11-24), pages 1 - 8, XP093147782, Retrieved from the Internet <URL:https://www.amazon.co.uk/Loctite-High-Quality-Effective-Correcting-Practical/dp/B0001P0DKG?th=1> [retrieved on 20240403] *

Also Published As

Publication number Publication date
FR3152027B1 (fr) 2026-05-01
WO2025036850A2 (fr) 2025-02-20
FR3152027A1 (fr) 2025-02-14

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DPE1 Request for preliminary examination filed after expiration of 19th month from priority date (pct application filed from 20040101)
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