WO2025077097A1 - Module optique - Google Patents

Module optique Download PDF

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Publication number
WO2025077097A1
WO2025077097A1 PCT/CN2024/080989 CN2024080989W WO2025077097A1 WO 2025077097 A1 WO2025077097 A1 WO 2025077097A1 CN 2024080989 W CN2024080989 W CN 2024080989W WO 2025077097 A1 WO2025077097 A1 WO 2025077097A1
Authority
WO
WIPO (PCT)
Prior art keywords
optical
optical fiber
lens
light
receiving chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/080989
Other languages
English (en)
Chinese (zh)
Inventor
申世超
张洪浩
叶莹
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hisense Broadband Multimedia Technology Co Ltd
Original Assignee
Hisense Broadband Multimedia Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from CN202322727455.0U external-priority patent/CN220983577U/zh
Priority claimed from CN202311316680.3A external-priority patent/CN119805679A/zh
Application filed by Hisense Broadband Multimedia Technology Co Ltd filed Critical Hisense Broadband Multimedia Technology Co Ltd
Publication of WO2025077097A1 publication Critical patent/WO2025077097A1/fr
Anticipated expiration legal-status Critical
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements

Definitions

  • the present disclosure relates to the technical field of optical fiber communication, and in particular to an optical module.
  • optical communication technology optical modules are tools for realizing the mutual conversion of optical and electrical signals, and are one of the key components in optical communication equipment.
  • the transmission rate of optical modules is required to be continuously improved.
  • multiple transmission channels are set in the optical module, that is, the transmission capacity is improved by multi-channel design in the optical module.
  • the transmission optical signal output by the optical module includes multiple wavelengths
  • the receiving optical signal input to the optical module includes multiple wavelengths.
  • the optical devices include:
  • a demultiplexing component has an optical input port, and the demultiplexing component is optically coupled to the second optical fiber; the received optical signal transmitted by the second optical fiber enters the demultiplexing component from the optical input port; the demultiplexing component is configured to split the received optical signal and redirect the light beam transmitted along the extension direction of the second optical fiber;
  • the lens array is located below the light output end of the demultiplexing component, and the lens array is located above the light receiving chip array; the optical axis of the array lens is not perpendicular to the photosensitive surface of the light receiving chip array.
  • an optical module comprising:
  • the third optical device includes an optical fiber fixing part and a lens array; the optical fiber fixing part is fixedly connected to the end of the second optical fiber, and a second lens mounting surface is arranged at the bottom of the optical fiber fixing part, and the second lens mounting surface is an inclined surface; the top of the lens array is connected to the second lens mounting surface, and the lens array is located below the end of the second optical fiber, so that the optical axis of the lens array is not perpendicular to the photosensitive surface of the light receiving chip array.
  • FIG1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present disclosure.
  • FIG2 is a partial structural diagram of a host computer provided according to some embodiments of the present disclosure.
  • FIG3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • FIG4 is an exploded view of an optical module provided according to some embodiments of the present disclosure.
  • FIG5 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure.
  • FIG20 is a second schematic diagram of a partial structure of a second light receiving component provided according to some embodiments of the present disclosure.
  • FIG21 is a first structural schematic diagram of another second optical device provided according to some embodiments of the present disclosure.
  • FIG. 27 is a cross-sectional view of a third light receiving component provided according to some embodiments of the present disclosure.
  • information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module.
  • the information processing device directly connected to the optical module is called the host computer of the optical module.
  • the host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network.
  • the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional/bidirectional electrical signal connection.
  • the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103.
  • the host computer 100 generates a second electrical signal based on the third electrical signal.
  • the second electrical signal from the host computer 100 is transmitted to the optical module 200.
  • the optical module 200 converts the second electrical signal into a second optical signal.
  • the optical module 200 transmits the second optical signal into the optical fiber 101.
  • the second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.
  • FIG. 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure.
  • FIG. 4 is an exploded view of an optical module provided according to some embodiments of the present disclosure.
  • the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400, and a light receiving component 500.
  • the present disclosure is not limited thereto.
  • the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.
  • the housing comprises an upper housing 201 and a lower housing 202 .
  • the upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 .
  • the outer contour of the housing is generally a square body.
  • the direction of the connection line of the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200.
  • the opening 204 is located at the end of the optical module 200 (the right end of FIG. 3 ), and the opening 205 is also located at the end of the optical module 200 (the left end of FIG. 3 ).
  • the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200.
  • the opening 204 is an electrical interface, and the gold finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the test host; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and/or the optical receiving component 500 in the optical module 200.
  • the assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components.
  • the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components.
  • the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.
  • the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit component that matches the cage 106 of the test host.
  • the snap-fit component of the unlocking component 600 fixes the optical module 200 in the cage 106;
  • the snap-fit component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit component and the test host, so as to release the snap-fit fixed connection between the optical module 200 and the test host, so that the optical module 200 can be pulled out of the cage 106.
  • the circuit board 300 includes circuit traces, electronic components and chips, etc.
  • the electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding.
  • the electronic components may include capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFET).
  • the chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers (LA), clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.
  • MCU microcontroller units
  • TIA transimpedance amplifiers
  • LA limiting amplifiers
  • CDR clock and data recovery chips
  • DSP digital signal processing
  • the circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins.
  • the circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106.
  • the gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in FIG. 4), or can be set on the surfaces of the upper and lower sides of the circuit board 300 to provide more pins.
  • the gold finger is configured to establish an electrical connection with the test host to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.
  • the light emitting component 400 and/or the light receiving component 500 are located on the side of the circuit board 300 away from the gold finger. In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors. In some embodiments, the light emitting component and/or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.
  • FIG5 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure.
  • the optical emitting component 400 is embedded in the connection circuit board 300, and the optical receiving component 500 is arranged on the circuit board 300;
  • a first optical fiber 401 is arranged at one end of the optical emitting component 400, and a first optical fiber adapter 402 is arranged at one end of the first optical fiber 401;
  • a second optical fiber 501 is arranged at one end of the optical receiving component 500, and a second optical fiber adapter 502 is arranged at one end of the second optical fiber 501;
  • the first optical fiber adapter 402 and the second optical fiber adapter 502 are fixed at the optical port of the optical module.
  • An optical fiber adapter 402 and a second optical fiber adapter 502 are used to connect an external optical fiber.
  • the optical signal generated by the optical emitting component 400 is transmitted to the first optical fiber adapter 402 through the first optical fiber 401, and is coupled to the external optical fiber through the first optical fiber adapter 402; the optical signal from the external optical fiber is coupled to the second optical fiber 501 through the second optical fiber adapter 502, and is transmitted to the optical receiving component 500 through the second optical fiber 501.
  • the optical receiving component 500 receives the optical signal and converts the received optical signal into an electrical signal.
  • the optical emission component 400 includes an emission cavity, and an optical emission chip array, a lens array, and an optical multiplexing component are arranged inside the emission cavity.
  • the optical emission chip array emits multiple optical signals
  • the lens array collimates the multiple optical signals
  • the optical multiplexing component combines the collimated multiple optical signals into one optical signal, and transmits the optical fiber to the outside.
  • the optical emission chip array includes four optical emission chips
  • the corresponding lens array includes four collimating lenses.
  • the optical emission chip array emits four optical signals (each optical signal has a wavelength), and the four optical signals enter the optical multiplexing component, and are combined into one optical signal by the optical multiplexing component, and then the one optical signal is transmitted to the outside of the optical module through the first optical fiber 401.
  • FIG. 6 is a schematic diagram of the internal structure of the first optical receiving component provided according to some embodiments of the present disclosure
  • FIG. 7 is a schematic diagram of the internal structure of the first optical receiving component provided according to some embodiments of the present disclosure
  • FIG. 8 is a schematic diagram of the internal structure of the first optical receiving component provided according to some embodiments of the present disclosure.
  • an optical receiving chip array 310 and a transimpedance amplifier 320 are provided on the circuit board 300, and the optical receiving chip array 310 and the transimpedance amplifier 320 are electrically connected to the circuit board 300 respectively; the optical receiving chip array 310 and the transimpedance amplifier 320 are located in the accommodating cavity formed by the protective cover 510 and the circuit board 300.
  • the optical receiving chip array 310 may include two or more optical receiving chips, such as the optical receiving chip array 310 may include four optical receiving chips.
  • the optical receiving chip array 310 includes a first optical receiving chip, a second optical receiving chip, a third optical receiving chip and a fourth optical receiving chip, and the first optical receiving chip, the second optical receiving chip, the third optical receiving chip and the fourth optical receiving chip share a substrate.
  • the optical receiving chip array 310 and the transimpedance amplifier 320 may not be directly set on the circuit board 300.
  • the optical receiving chip array 310 and the transimpedance amplifier 320 may be set in a light receiving cavity and electrically connected to the circuit board 300 through an electrical connector, a flexible electrical connection board, etc.
  • FIG9 is a schematic diagram of a structure of a demultiplexing component provided according to some embodiments of the present disclosure
  • FIG10 is a schematic diagram of a structure of a demultiplexing component provided according to some embodiments of the present disclosure
  • FIG11 is a schematic diagram of a structure of a demultiplexing component provided according to some embodiments of the present disclosure.
  • the first optical device 520 may include a demultiplexing component and a lens array 522 , wherein the demultiplexing component may include a demultiplexing substrate 521 , and the lens array 522 may be disposed at the bottom of the demultiplexing substrate 521 .
  • One side of the demultiplexing substrate 521 may include a reflective surface 5211, the other side of the demultiplexing substrate 521 may include a turning surface 5212, and the bottom of the demultiplexing substrate 521 includes a bottom surface 5214; the reflective surface 5211 and the turning surface 5212 are configured to realize the reflection transmission of the received optical signal in the demultiplexing substrate 521, and the bottom surface 5214 can transmit the received optical signal reflected by the turning surface 5212.
  • a light inlet 5213 is provided on the reflective surface 5211, and the light inlet 5213 is used to input the received optical signal into the demultiplexing substrate 521.
  • the lens array 522 is located below the turning surface 5212, and the lens array 522 includes two or more lenses, such as the lens array 522 includes four lenses.
  • the demultiplexing substrate 521 is a straight prism structure
  • the reflective surface 5211 is perpendicular to the bottom surface 5214
  • the angle between the turning surface 5212 and the bottom surface 5214 is less than 90°, so as to control the space occupied by the assembly of the demultiplexing substrate 521 in the optical module.
  • the angle between the turning surface 5212 and the bottom surface 5214 is 45-48°, which can ensure that the distance between the position of the received optical signal transmitted from the bottom surface 5214 and the reflective surface 5211 is within a small range.
  • the tilt angle of the light incident end face may be 5°-10°.
  • the tilt angle of the light incident end face may be 10°-12°.
  • Figure 12 is a top view of a demultiplexing component provided according to some embodiments of the present disclosure
  • Figure 13 is a side view of a demultiplexing component provided according to some embodiments of the present disclosure
  • Figure 14 is a front view of a demultiplexing component provided according to some embodiments of the present disclosure
  • Figures 12-14 show a beam splitting optical path diagram of a received optical signal, which includes four wavelengths of ⁇ 1, ⁇ 2, ⁇ 3 and ⁇ 4. As shown in FIGS.
  • the first optical device 520 provided in the embodiment of the present disclosure can not only realize beam splitting according to the wavelength of the received optical signal, but also change the transmission direction of the optical signal, that is, the first optical device 520 provided in the present disclosure integrates the functions of beam splitting and changing the transmission of the received optical signal. And compared with the received optical signal input in the horizontal direction in some embodiments, the received optical signal after beam splitting is output in the horizontal direction, and needs to be converged and turned by a focusing lens, a turning prism, etc., and then transmitted to the optical receiving chip. There are many devices involved, and the optical path coupling is difficult. Therefore, the first optical device 520 provided in the present disclosure increases the integration of the demultiplexing component and simplifies the difficulty of optical path coupling.
  • a high-reflection film is disposed on the turning surface 5212 to help improve the reflectivity of the turning surface 5212 .
  • the first optical device 520 provided in the embodiment of the present disclosure is not limited to being used in the first optical receiving component provided in the above embodiment.
  • the optical receiving component 500 includes an optical receiving cavity, and a receiving cavity is provided on the optical receiving cavity.
  • the optical receiving chip, the first optical device 520, etc. are arranged in the receiving cavity to carry the optical receiving chip, the first optical device 520, etc. through the optical receiving cavity.
  • FIG16 is a partial structural schematic diagram of the second optical receiving component provided according to some embodiments of the present disclosure.
  • the second optical receiving component includes a second optical device 560 and an optical receiving chip array 310, the light input end of the second optical device 560 is connected to the second optical fiber 501, the light output end of the second optical device 560 is located above the optical receiving chip array 310, and the optical receiving chip array 310 is arranged on the circuit board 300.
  • the received optical signal transmitted through the second optical fiber 501 is input to the second optical device 560, and is transmitted to the optical receiving chip array 310 after the second optical device 560 changes the transmission direction.
  • the second optical fiber 501 can be configured to transmit received optical signals including different wavelengths, and the second optical device 560 transmits the received optical signals of different wavelengths to the corresponding optical receiving chips in the optical receiving chip array 310.
  • the second optical fiber 501 may be configured to transmit received optical signals of four different wavelengths
  • the optical receiving chip array 310 includes four optical receiving chips
  • the second optical device 560 transmits the received optical signals of four different wavelengths to corresponding optical receiving chips.
  • the second optical fiber 501 may include one optical fiber, so that the second optical receiving component receives a beam of received optical signals through the second optical fiber 501.
  • the embodiments of the present disclosure are not limited to the second optical fiber 501 including one optical fiber; the second optical fiber 501 may also include two optical fibers.
  • the second optical fiber 501 includes two optical fibers, each of which is used to transmit received optical signals of four different wavelengths, and the optical receiving chip array 310 includes eight optical receiving chips, and each four of them receive received optical signals of four wavelengths transmitted by one optical fiber.
  • FIG. 17 is a schematic diagram of the structure of a second optical device provided according to some embodiments of the present disclosure
  • FIG. 18 is a schematic diagram of the structure of a second optical device provided according to some embodiments of the present disclosure
  • FIG. 19 is a schematic diagram of the decomposition of a second optical device provided according to some embodiments of the present disclosure.
  • the second optical device 560 includes a first optical fiber fixing portion 561, a demultiplexing component, a first support plate 563, and a lens array 522.
  • the demultiplexing component may include an AWG 562.
  • AWG562 and the first support plate 563 are located at the other end of the first optical fiber fixing portion 561, and AWG562 and the first support plate 563 are respectively connected to the first optical fiber fixing portion 561;
  • the second optical fiber 501 is optically coupled to the AWG562, so that the light receiving optical signal transmitted by the second optical fiber 501 is coupled to the AWG562;
  • the first support plate 563 is located below the AWG562, so that the first support plate 563 supports and connects the AWG562.
  • the other end of the first optical fiber fixing portion 561 is provided with a first connection surface 5611, which is a flat end surface formed at the end of the first optical fiber fixing portion 561; the first connection surface 5611 connects the light input end of the AWG 562 and one end of the first support plate 563.
  • the second optical fiber 501 is inserted into the first optical fiber fixing portion 561, and the first connection surface 5611 is flush with the end surface of the second optical fiber 501.
  • the first support plate 563 is bonded and fixed to the AWG 562.
  • a first fixed support surface 5631 is provided on the top of the first support plate 563
  • a first overflow glue groove 5632 is provided on the first fixed support surface 5631.
  • the first fixed support surface 5631 is bonded to the bottom of the AWG 562 by glue, and the AWG 562 covers the top of the first overflow glue groove 5632.
  • the first overflow glue groove 5632 is close to one end of the first support plate 563 connected to the lens array 522 to prevent glue from overflowing and contaminating the light output end of the AWG 562.
  • a first lens mounting surface 5633 is disposed at the bottom of the first support plate 563 , and the first lens mounting surface 5633 is disposed at the edge of the other end of the first support plate 563 ; the top of the lens array 522 is connected to the first lens mounting surface 5633 .
  • FIG. 21 is a schematic diagram of the structure of another second optical device provided according to some embodiments of the present disclosure
  • FIG. 22 is a schematic diagram of the structure of another second optical device provided according to some embodiments of the present disclosure.
  • the second optical device 560 in the second optical device 560, two second optical fibers 501 are connected to the first optical fiber fixing portion 561, so that the second optical receiving component 500b can receive two beams of received optical signals, each of which includes multiple wavelength optical signals.
  • the lens array 522 includes more lenses
  • the optical receiving chip array 310 includes more optical receiving chips.
  • a reflective end face 5011 is provided at the end of the optical fiber in the second optical fiber 501, and the reflective end face 5011 is configured to reflect the received optical signal, so as to reflect and transmit the received optical signal transmitted by the second optical fiber 501 to the lens array 522.
  • the end of the second optical fiber 501 is embedded with a connected optical fiber fixture 571, and the reflective end face 5011 is exposed outside the optical fiber fixture 571, and the reflective end face 5011 is located above the lens array 522.
  • a lens mounting surface is provided at the top edge of the optical fiber fixing member 571 .
  • the lens mounting surface is an inclined surface.
  • the top of the lens array 522 is connected to the lens mounting surface so as to suspend the lens array 522 below the reflective end surface 5011 .
  • the inclination angle of the reflective end surface 5011 can be 48°-50°.
  • the optical fiber fixing member 571 includes a second optical fiber fixing portion 5711, a second supporting plate 5712, and an upper cover plate 5713.
  • the second optical fiber fixing portion 5711 is fixedly connected to the end of the second optical fiber 501 to fix and support the end of the second optical fiber 501.
  • the end of the optical fiber in the second optical fiber 501 extends from one end of the second optical fiber fixing portion 5711 to the other end of the second optical fiber fixing portion 5711.
  • the second supporting plate 5712 is connected to the second optical fiber fixing portion 5711, and the second supporting plate 5712 supports the end of the second optical fiber 501, so that multiple optical fibers in the second optical fiber 501 are arranged side by side and evenly spaced from each other; the upper cover plate 5713 covers and connects the second optical fiber fixing portion 5711 and the second supporting plate 5712, so that the second supporting plate 5712 and the upper cover plate 5713 wrap the end of the second optical fiber 501, so that multiple optical fibers in the second optical fiber 501 are arranged side by side in the optical fiber fixing member 571.
  • the top support of the second optical fiber fixing part 5711 is connected to the upper cover plate 5713, and the side of the second optical fiber fixing part 5711 is connected to the second support plate 5712.
  • the top of the second optical fiber fixing part 5711 is provided with a second connection surface 5711a, and the side of the second optical fiber fixing part 5711 is provided with a third connection surface 5711b; the second connection surface 5711a is supported and connected to one end of the bottom of the upper cover plate 5713, and the third connection surface 5711b is connected to the end of the second support plate 5712.
  • the top of the third connection surface 5711b is lower than the second connection surface 5711a, so that the second optical fiber 501 passing through the second optical fiber fixing part 5711 is located on the top surface of the second support plate 5712, so as to fix each optical fiber in the second optical fiber 501.
  • the first assembly surface 5713a and the second assembly surface 5713b of the upper cover plate 5713 are located higher than the second assembly surface 5713b, and a step is formed between the first assembly surface 5713a and the second assembly surface 5713b; the first assembly surface 5713a is assembled and connected to the second optical fiber fixing portion 5711, and the second assembly surface 5713b is assembled and connected to the second support plate 5712.
  • the first assembly surface 5713a is assembled and connected to the second connection surface 5711a
  • the second assembly surface 5713b is assembled and connected to the top of the second support plate 5712.
  • the second support plate 5712 is bonded and fixed to the upper cover plate 5713.
  • a second fixed support surface 5712a is provided on the top of the second support plate 5712
  • a second overflow glue groove 5712b is provided on the second fixed support surface 5712a;
  • the second fixed support surface 5712a is bonded to the upper cover plate 5713 by glue, and the upper cover plate 5713 covers the second overflow glue groove 5712b, and the second overflow glue groove 5712b can prevent the glue from contaminating the end face of the optical fiber in the second optical fiber 501.
  • the second overflow glue groove 5712b is close to one end of the second support plate 5712 connected to the lens array 522, and is used to prevent the glue from overflowing and contaminating the reflective end face 5011 of the optical fiber in the second optical fiber 501.
  • the second lens mounting surface 5712c is an inclined surface, so that the normal line of the second lens mounting surface 5712c is not perpendicular to the extension direction of the second optical fiber 501.
  • the inclination angle of the second lens mounting surface 5712c is 5-10°, such as 8°.
  • the inclination angle of the second lens mounting surface 5712c can be 5°-8°.
  • Fig. 27 is a cross-sectional view of a third optical receiving component provided according to some embodiments of the present disclosure, and a transmission optical path of a received optical signal is shown in Fig. 27.
  • the received optical signal inputted by the optical fiber in the second optical fiber 501 is transmitted to the reflective end surface 5011, and the received optical signal reflected by the reflective end surface 5011 is incident on the second support plate 5712 and transmitted to the second lens mounting surface 5712c, refracted by the second lens mounting surface 5712c and transmitted to the lens array 522, and converged by the corresponding lenses in the lens array 522 and transmitted to the corresponding optical receiving chips of the optical receiving chip array 310.
  • the second support plate 5712 can both support and fix the optical fiber in the second optical fiber 501 and install the lens array 522, so as to facilitate the arrangement of the lens array 522 below the reflective end face 5011 of the optical fiber in the second optical fiber 501, thereby ensuring the assembly accuracy between the reflective end face 5011 of the optical fiber in the second optical fiber 501 and the lens array 522, so as to ensure the coupling efficiency of the received light signal reflected by the reflective end face 5011 of the optical fiber in the second optical fiber 501 to the optical receiving chip array.
  • an inclined second lens mounting surface 5712c is provided on the second support plate 5712 for mounting the lens array 522, so that the optical axis of the lens array 522 is not perpendicular to the photosensitive surface of the light receiving chip, thereby preventing the light signal reflected by the photosensitive surface of the light receiving chip from returning to the lens array 522 along the original path, thereby reducing the return loss caused by the reflected light signal; and the inclined second lens mounting surface 5712c can make the optical axis of the received light signal reflected by the reflecting end surface 5011 parallel to the optical axis of the lens array 522, thereby increasing the coupling efficiency of the received light signal reflected by the reflecting end surface 5011 to the lens array 522, thereby ensuring the coupling efficiency of the received light signal to the light receiving chip array 310.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)

Abstract

L'invention concerne un module optique (200), comprenant : une carte de circuit imprimé (300) ; un composant de réception de lumière (500), qui est disposé sur la carte de circuit imprimé (300), et comprend un réseau de puces de réception de lumière (310) et un dispositif optique (520), le réseau de puces de réception de lumière (310) étant électriquement connecté à la carte de circuit imprimé (300), le dispositif optique (520) étant situé au-dessus du réseau de puces de réception de lumière (310), et le réseau de puces de réception de lumière (310) comprenant une première puce de réception de lumière et une seconde puce de réception de lumière ; et une seconde fibre optique (502), qui est connectée au dispositif optique (520). Le dispositif optique (520) comprend : un ensemble de démultiplexage, qui a une entrée de lumière (5213), l'ensemble de démultiplexage étant couplé optiquement et connecté à la seconde fibre optique (502), un signal lumineux entrant dans l'ensemble de démultiplexage par l'intermédiaire de l'entrée de lumière (5213), et l'ensemble de démultiplexage étant configuré pour effectuer une division de faisceau sur le signal lumineux, et rediriger des faisceaux lumineux qui sont transmis dans la direction d'extension de la seconde fibre optique (502) ; et un réseau de lentilles (522), qui est situé au-dessous d'une extrémité de sortie de lumière de l'ensemble de démultiplexage, le réseau de lentilles (522) étant situé au-dessus du réseau de puces de réception de lumière (310), et l'axe optique du réseau de lentilles (522) n'étant pas perpendiculaire à une surface photosensible du réseau de puces de réception de lumière (310).
PCT/CN2024/080989 2023-10-11 2024-03-11 Module optique Pending WO2025077097A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
CN202322727455.0U CN220983577U (zh) 2023-10-11 2023-10-11 一种光模块
CN202322727455.0 2023-10-11
CN202311316680.3 2023-10-11
CN202311316680.3A CN119805679A (zh) 2023-10-11 2023-10-11 一种光模块及光器件

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WO2025077097A1 true WO2025077097A1 (fr) 2025-04-17

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Citations (8)

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