WO2025197764A1 - Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée - Google Patents

Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée

Info

Publication number
WO2025197764A1
WO2025197764A1 PCT/JP2025/009773 JP2025009773W WO2025197764A1 WO 2025197764 A1 WO2025197764 A1 WO 2025197764A1 JP 2025009773 W JP2025009773 W JP 2025009773W WO 2025197764 A1 WO2025197764 A1 WO 2025197764A1
Authority
WO
WIPO (PCT)
Prior art keywords
electromagnetic wave
wave shielding
shielding film
protective layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/009773
Other languages
English (en)
Japanese (ja)
Inventor
憲治 上農
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tatsuta Electric Wire and Cable Co Ltd
Original Assignee
Tatsuta Electric Wire and Cable Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tatsuta Electric Wire and Cable Co Ltd filed Critical Tatsuta Electric Wire and Cable Co Ltd
Priority to JP2025539953A priority Critical patent/JPWO2025197764A1/ja
Publication of WO2025197764A1 publication Critical patent/WO2025197764A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields

Definitions

  • the present invention relates to an electromagnetic wave shielding film and a shielded printed wiring board.
  • Switched printed wiring boards printed wiring boards with electromagnetic shielding film attached (hereinafter simply referred to as “shielded printed wiring boards”) to block electromagnetic waves generated internally and electromagnetic waves entering from the outside.
  • Patent Document 1 discloses an electromagnetic wave shielding sheet comprising a conductive layer and an insulating layer, the insulating layer containing a thermosetting resin, a curing agent, and a black colorant, and the black colorant having an average primary particle diameter of 20 to 100 nm.
  • a foldable phone In a foldable phone, a flexible printed circuit board with an electromagnetic wave shielding film attached is also placed on the movable part.
  • a foldable phone has a structure in which the movable part can be bent nearly 180 degrees.
  • Conventional electromagnetic wave shielding films have poor resistance to repeated bending at such moving parts, and cracks tend to occur in the protective layer of the electromagnetic wave shielding film when the film is bent. Cracks in the protective layer make it easier for cracks to appear in the shielding layer, which causes a problem of reduced shielding performance.
  • the present invention was made to solve the above problems, and its object is to provide an electromagnetic wave shielding film that does not develop cracks in the protective layer even when repeatedly bent, and whose shielding performance is not easily reduced.
  • the electromagnetic wave shielding film of the present invention is an electromagnetic wave shielding film in which a protective layer, a shielding layer, and an adhesive layer are laminated in this order, and is characterized in that the ratio (hardness/Young's modulus) of the hardness of the protective layer (hereinafter also simply referred to as “hardness of the protective layer”) to the Young's modulus of the protective layer (hereinafter also simply referred to as "Young's modulus of the protective layer”) measured by a nanoindentation test in accordance with ISO 14577 is 0.05 to 0.10.
  • the protective layer has appropriate elasticity and hardness, making it less likely to crack even when the electromagnetic wave shielding film is bent at a steep angle.
  • the protective layer preferably contains a particulate filler.
  • the particulate filler can adjust the hardness and Young's modulus of the protective layer.
  • the particulate filler preferably includes inorganic particles and/or resin particles.
  • the inorganic particles preferably contain at least one type selected from the group consisting of carbon, silica, and alumina. These particulate fillers are suitable for adjusting the hardness and Young's modulus of the protective layer.
  • the weight ratio of the particulate filler in the protective layer is preferably 2 to 22 wt %. If the weight percentage of the particulate filler is less than 2 wt %, the protective layer becomes too soft. If the weight percentage of the particulate filler exceeds 22 wt %, the protective layer becomes too hard.
  • the protective layer preferably contains at least one resin selected from the group consisting of polyimide resin, acrylic resin, epoxy resin, polyester resin, polyamideimide resin, and urethane resin. These resins have sufficient insulating properties and are suitable materials for protecting the shielding layer and adhesive layer. Furthermore, if the protective layer contains these resins, cracks are less likely to occur in the protective layer when the electromagnetic wave shielding film is bent at a steep angle.
  • the adhesive layer is preferably a conductive adhesive layer.
  • the adhesive layer is a conductive adhesive layer, it is possible to electrically connect the shielding layer of the electromagnetic wave shielding film and the ground circuit of the printed wiring board. In this case, the electromagnetic wave shielding film has good shielding performance.
  • the conductive adhesive layer is preferably an anisotropic conductive adhesive layer.
  • the conductive adhesive layer has anisotropic conductivity, the transmission characteristics of high frequency signals transmitted through the signal circuits of the printed wiring board are improved compared to when the conductive adhesive layer has isotropic conductivity.
  • the shielded printed wiring board of the present invention is a shielded printed wiring board including a flexible printed wiring board having a base film, a printed circuit arranged on the base film, and a coverlay arranged to cover the printed circuit, and an electromagnetic wave shielding film arranged on the coverlay side of the flexible printed wiring board, wherein the electromagnetic wave shielding film is the electromagnetic wave shielding film of the present invention.
  • the electromagnetic wave shielding film of the present invention is less likely to develop cracks in the protective layer even when bent at a steep angle. Therefore, even if the shielded printed wiring board of the present invention provided with the electromagnetic wave shielding film of the present invention is bent at a steep angle, cracks are unlikely to occur in the protective layer of the electromagnetic wave shielding film.
  • the present invention makes it possible to provide an electromagnetic wave shielding film that does not develop cracks in the protective layer even when repeatedly folded, and whose shielding performance is not easily reduced.
  • FIG. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • FIG. 2 is a cross-sectional view that schematically shows an example of a cross section of a shielded printed wiring board in which the electromagnetic wave shielding film of the present invention is used.
  • FIG. 3 is an enlarged photograph (10x) of the protective layer, which is the standard for "no cracks occurring in the protective layer" in the evaluation of the bending property test of the electromagnetic wave shielding film.
  • FIG. 4 is an enlarged photograph (10x magnification) of the protective layer, which is the criterion for "cracks occurring in the protective layer" in the evaluation of the bending property test of the electromagnetic wave shielding film.
  • FIG. 1 is a cross-sectional view schematically showing an example of the electromagnetic wave shielding film of the present invention.
  • the electromagnetic wave shielding film 10 shown in FIG. 1 is formed by laminating a protective layer 40, a shielding layer 30, and an adhesive layer 20 in this order.
  • the ratio of the hardness of the protective layer to the Young's modulus (hardness/Young's modulus) measured by a nanoindentation test in accordance with ISO 14577 is 0.05 to 0.10.
  • the ratio is preferably 0.05 to 0.09, and more preferably 0.06 to 0.08.
  • the protective layer has appropriate elasticity and hardness, and cracks are unlikely to occur in the protective layer even when the electromagnetic wave shielding film is bent at a steep angle.
  • the hardness of the protective layer 40 is preferably 0.05 to 0.80 GPa, more preferably 0.15 to 0.70 GPa, even more preferably 0.20 to 0.60 GPa, even more preferably 0.22 to 0.56 GPa, and particularly preferably 0.27 to 0.44 GPa. If the hardness of the protective layer is less than 0.05 GPa, the protective layer becomes soft and easily deformed. Therefore, when the electromagnetic wave shielding film is repeatedly bent, the protective layer is likely to become thin in parts. Cracks are likely to occur in such thinned parts of the protective layer. If the hardness of the protective layer exceeds 0.80 GPa, the toughness of the protective layer will be low, and cracks will be more likely to occur in the protective layer when the electromagnetic wave shielding film is bent at a steep angle.
  • the Young's modulus of the protective layer 40 is preferably 3.0 to 6.5 GPa, more preferably 3.25 to 6.25 GPa, and even more preferably 3.5 to 5.5 GPa. If the Young's modulus of the protective layer is less than 3.0 GPa, the protective layer becomes soft and easily deformed. Therefore, when the electromagnetic wave shielding film is repeatedly folded, the protective layer is likely to become thin in parts. Cracks are likely to occur in such thinned parts of the protective layer. If the Young's modulus of the protective layer exceeds 6.5 GPa, the toughness of the protective layer will be reduced, and cracks will be more likely to occur in the protective layer when the electromagnetic wave shielding film is bent at a steep angle.
  • the hardness and Young's modulus of the protective layer 40 can be adjusted by adding particulate filler, selecting the material that makes up the protective layer 40, adjusting the degree of polymerization of the resin that makes up the protective layer, etc., as described below.
  • the protective layer 40 preferably contains a particulate filler.
  • the particulate filler can adjust the hardness and Young's modulus of the protective layer 40 .
  • the particulate filler preferably contains inorganic particles and/or resin particles.
  • Materials constituting the inorganic particles include carbon, silica, and alumina.
  • materials that make up the resin particles include acrylic and urethane. These particulate fillers are suitable for adjusting the hardness and Young's modulus of the protective layer.
  • the average particle size of the particulate filler is preferably 0.05 to 5.0 ⁇ m.
  • the shape of the particulate filler is not particularly limited and may be spherical, rod-like, flat, etc., or may be irregular.
  • the weight percentage of the particulate filler in the protective layer 40 is preferably 2 to 22 wt %, and more preferably 4 to 20 wt %. If the weight percentage of the particulate filler is less than 2 wt %, the protective layer becomes too soft. If the weight percentage of the particulate filler exceeds 22 wt %, the protective layer becomes too hard.
  • the protective layer 40 preferably contains at least one resin selected from the group consisting of polyimide resin, acrylic resin, epoxy resin, polyester resin, polyamide-imide resin, and urethane resin. Of these, it is more preferable that the protective layer 40 contains a polyimide resin. These resins have sufficient insulating properties and are suitable materials for protecting the shield layer 30 and the adhesive layer 20 . Furthermore, if the protective layer 40 contains these resins, cracks are less likely to occur in the protective layer 40 when the electromagnetic wave shielding film 10 is bent at a steep angle.
  • the thickness of the protective layer 40 is preferably 1 to 15 mm, and more preferably 3 to 8 mm. If the thickness of the protective layer is less than 1 ⁇ m, it is too thin, so that the strength is weak and it becomes easily damaged. If the thickness of the protective layer exceeds 15 ⁇ m, the protective layer becomes too thick and difficult to bend, making it difficult to arrange the electromagnetic wave shielding film on a flexible printed wiring board that can be bent at a sharp angle.
  • the protective layer 40 may contain, as needed, curing accelerators, tackifiers, antioxidants, pigments, dyes, plasticizers, UV absorbers, defoamers, leveling agents, flame retardants, viscosity adjusters, anti-blocking agents, etc.
  • the shielding layer 30 may be made of any material that can shield electromagnetic waves, and may be made of, for example, a metal layer or a conductive resin material. It is preferable that the shielding layer be a metal layer.
  • the material of the metal layer is not particularly limited, but may be nickel, copper, silver, tin, gold, palladium, aluminum, chromium, titanium, zinc, or an alloy containing two or more of these metals. Of these, copper is preferred.
  • the material and thickness of the metal layer may be appropriately selected depending on the required electromagnetic wave shielding effect and resistance to repeated bending and sliding.
  • the thickness of the metal layer is preferably 0.1 ⁇ m or more.
  • the thickness of the metal layer is preferably 8 ⁇ m or less.
  • the metal layer can be formed by electrolytic plating, electroless plating, sputtering, electron beam evaporation, vacuum evaporation, CVD, metal organic, etc.
  • the metal layer can also be formed from metal foil, metal nanoparticles, scale-like metal particles, etc.
  • the adhesive layer 20 may be made of any material as long as it has the function of adhering the electromagnetic wave shielding film 10 to a flexible printed wiring board, but it is preferable that the adhesive layer 20 contain an adhesive resin as an adhesive component.
  • adhesive resins examples include thermoplastic resins such as styrene-based resins, vinyl acetate-based resins, polyester-based resins, polyethylene-based resins, polypropylene-based resins, imide-based resins, amide-based resins, and acrylic-based resins, and thermosetting resins such as phenol-based resins, epoxy-based resins, urethane-based resins, melamine-based resins, and alkyd-based resins.
  • the adhesive layer 20 may contain one of these resins alone, or may contain two or more of these resins.
  • the adhesive layer 20 is preferably a conductive adhesive layer.
  • the shielding layer 30 of the electromagnetic wave shielding film 10 can be electrically connected to the ground circuit of the printed wiring board. In this case, the electromagnetic wave shielding film 10 has good shielding performance.
  • the conductive adhesive layer may be an isotropically conductive adhesive layer or an anisotropically conductive adhesive layer, but is preferably an anisotropically conductive adhesive layer.
  • the conductive adhesive layer has anisotropic conductivity, the transmission characteristics of high frequency signals transmitted through the signal circuits of the printed wiring board are improved compared to when the conductive adhesive layer has isotropic conductivity.
  • the adhesive layer 20 When the adhesive layer 20 is a conductive adhesive layer, the adhesive layer 20 contains a conductive filler.
  • the conductive filler is not particularly limited, but may be silver powder, copper powder, nickel powder, solder powder, aluminum powder, silver-coated copper powder obtained by silver-plating copper powder, fine particles of polymer particles or glass beads coated with metal, or the like. Among these, copper powder or silver-coated copper powder, which is inexpensively available, is preferable from the viewpoint of economy.
  • the shape of the conductive filler is not particularly limited, and can be appropriately selected from spherical, flake, scale, dendrite, rod, fiber, etc. Among these, the flake shape is preferred. If the conductive filler is a flake-shaped conductive filler, the conductive filler also bends when the electromagnetic wave shielding film 10 is bent, making it easier for the conductive filler particles to maintain contact with each other, and as a result, the conductivity of the conductive adhesive layer is less likely to decrease.
  • the weight ratio of the conductive filler contained in the conductive adhesive layer is preferably 10 to 80% by weight.
  • the weight ratio of the conductive filler contained in the conductive adhesive layer is preferably 5 to 40% by weight, and more preferably 10 to 35% by weight.
  • the thickness of the adhesive layer 20 is not particularly limited and can be set appropriately as needed, but is preferably 0.5 to 30.0 ⁇ m. If the thickness of the adhesive layer is less than 0.5 ⁇ m, it becomes difficult to obtain good adhesion. If the thickness of the adhesive layer exceeds 30.0 ⁇ m, the entire electromagnetic wave shielding film becomes thick and difficult to handle.
  • the electromagnetic wave shielding film 10 exhibits the effect that cracks are unlikely to occur in the protective layer even when bent at a steep angle. Therefore, the electromagnetic wave shielding film 10 is suitable for use in electronic devices that are bent at sharp angles. More specifically, it is suitable for applications in which the radius of curvature at the folded portion when the electromagnetic wave shielding film 10 is folded is 0.5 to 5 mm.
  • the shielded printed wiring board described below will be described as one in which the adhesive layer of the electromagnetic wave shielding film is a conductive adhesive layer.
  • FIG. 2 is a cross-sectional view that schematically shows an example of a cross section of a shielded printed wiring board in which the electromagnetic wave shielding film of the present invention is used.
  • the shielded printed wiring board 1 shown in FIG. 2 includes a flexible printed wiring board 50 and an electromagnetic wave shielding film 10 .
  • the flexible printed wiring board 50 includes a base film 51 , a printed circuit 52 disposed on the base film 51 , and a coverlay 53 disposed to cover the printed circuit 52 .
  • the printed circuit 52 includes a ground circuit 52a.
  • the coverlay 53 also has an opening 53a that exposes the ground circuit 52a.
  • the adhesive layer 20 is disposed so as to be in contact with the coverlay 53 .
  • the adhesive layer 20 fills the opening 53a and is in contact with the ground circuit 52a. If the adhesive layer 20 is a conductive adhesive layer, the ground circuit 52a and the shielding layer 30 are electrically connected, thereby improving the shielding performance of the electromagnetic wave shielding film 10.
  • the shielded printed wiring board 1 has high bending resistance. For this reason, it is preferable that the shielded printed wiring board 1 be placed in the movable part of an electronic device that has a movable part that can move from 0 to 180 degrees.
  • Examples of electronic devices with such moving parts include foldable phones, tablets, and laptops.
  • both the base film 51 and the coverlay 53 are made of engineering plastic.
  • resins such as polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimideamide, polyetherimide, and polyphenylene sulfide (PPS).
  • the printed circuit 52 can be made of ordinary circuit materials such as copper.
  • the base film 51 and printed circuit 52 may be bonded with an adhesive, or they may be joined without adhesive, similar to the so-called adhesiveless copper-clad laminate.
  • the coverlay 53 may also be made by bonding multiple flexible insulating films together with an adhesive, or may be formed by a series of techniques including coating a photosensitive insulating resin, drying, exposing, developing, and heat treating.
  • the electromagnetic wave shielding film 10 can be attached to the flexible printed wiring board 50 by a conventionally known method. For example, it is preferable to place the electromagnetic wave shielding film 10 on the flexible printed wiring board 50 so that the adhesive layer 20 of the electromagnetic wave shielding film 10 contacts the coverlay 53 of the flexible printed wiring board 50, and then perform thermocompression bonding under conditions of 150 to 200°C, 2 to 5 MPa, and 1 to 60 minutes.
  • the shielded printed wiring board 1 has been described as having a conductive adhesive layer 20 and an opening 53 a in the coverlay 53 of the flexible printed wiring board 50 .
  • the adhesive layer 20 does not need to be electrically conductive.
  • the coverlay does not need to have an opening.
  • the present invention (1) is an electromagnetic wave shielding film in which a protective layer, a shielding layer, and an adhesive layer are laminated in this order, and is characterized in that the ratio of the hardness of the protective layer to the Young's modulus (hardness/Young's modulus) measured by a nanoindentation test in accordance with ISO 14577 is 0.05 to 0.10.
  • the present invention (2) is an electromagnetic wave shielding film according to the present invention (1), in which the protective layer contains a particulate filler.
  • the present invention (3) is an electromagnetic wave shielding film according to the present invention (2), in which the particulate filler contains inorganic particles and/or resin particles.
  • the present invention (4) is an electromagnetic wave shielding film according to the present invention (3), in which the inorganic particles contain at least one type selected from the group consisting of carbon, silica, and alumina.
  • the present invention (5) is an electromagnetic wave shielding film according to any one of the present inventions (2) to (4), in which the weight proportion of the particulate filler in the protective layer is 2 to 22 wt %.
  • the present invention (6) is an electromagnetic wave shielding film according to any one of the present inventions (1) to (5), wherein the protective layer contains at least one resin selected from the group consisting of polyimide resin, acrylic resin, epoxy resin, polyester resin, polyamideimide resin, and urethane resin.
  • the present invention (7) provides a flexible printed wiring board including a base film, a printed circuit disposed on the base film, and a coverlay disposed to cover the printed circuit; and an electromagnetic wave shielding film arranged on the coverlay side of the flexible printed wiring board, wherein the electromagnetic wave shielding film is the electromagnetic wave shielding film according to any one of present inventions (1) to (6).
  • Example 1 A protective layer-forming composition was prepared by mixing carbon particles (average particle size: 0.1 ⁇ m) with a polyimide resin, so that the protective layer-forming composition contained 4 wt % of the carbon particles.
  • the protective layer-forming composition was applied to the transfer film and heated at 150°C for 3 minutes in an electric oven to create a protective layer 5 ⁇ m thick.
  • a rolled copper foil with a thickness of 2 ⁇ m was formed on top of the protective layer.
  • This rolled copper foil functions as a shielding layer.
  • the conductive adhesive composition contained 20 wt% copper particles.
  • a conductive adhesive composition was applied onto the copper layer to form an adhesive layer with a thickness of 5 ⁇ m.
  • This adhesive layer was an anisotropic conductive adhesive layer.
  • Electromagnetic wave shielding films according to Examples 2 to 6 and Comparative Examples 1 to 10 were produced in the same manner as in Example 1, except that the type of resin used in the protective layer and the content of carbon particles were changed as shown in Tables 1 and 2.
  • the test sample is folded 180° in a mountain fold, and then returned to a flat state. Thereafter, the test sample is folded 180° in a valley fold, and then returned to a flat state. This process is referred to as "one folding cycle.”
  • the surface of the protective layer of the test sample was observed under a microscope at 10x magnification to check whether cracks had occurred. This operation was repeated to evaluate the bending resistance of the electromagnetic wave shielding films according to each of the Examples and Comparative Examples.
  • the evaluation criteria are as follows: ⁇ : No cracks were observed in the protective layer after 30 bending cycles.
  • x Cracks occurred in the protective layer within 30 bending cycles.
  • the evaluation results are shown in Tables 1 and 2.
  • FIGS. 3 and 4 photographs that serve as a criterion for determining whether or not cracks have occurred in the protective layer are shown in FIGS. 3 and 4.
  • FIG. FIG. 3 is an enlarged photograph (10x) of the protective layer, which is the standard for "no cracks occurring in the protective layer" in the evaluation of the bending property test of the electromagnetic wave shielding film.
  • FIG. 4 is an enlarged photograph (10x magnification) of the protective layer, which is the criterion for "cracks occurring in the protective layer" in the evaluation of the bending property test of the electromagnetic wave shielding film.
  • Shielded printed wiring board 10 Electromagnetic wave shielding film 20 Adhesive layer 30 Shielding layer 40 Protective layer 50 Flexible printed wiring board 51 Base film 52 Printed circuit 52a Ground circuit 53 Coverlay 53a Opening

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)

Abstract

Le but de la présente invention est de fournir un film de protection contre les ondes électromagnétiques dans lequel une fissure n'est pas générée dans une couche de protection même si le film est plié de manière répétée, et la performance de protection n'est pas sensible à la détérioration. Ce film de blindage contre les ondes électromagnétiques selon la présente invention est obtenu par stratification séquentielle d'une couche de protection, d'une couche de blindage et d'une couche adhésive, et est caractérisé en ce que le rapport (dureté/module de Young) de la dureté sur le module de Young de la couche de protection telle que mesurée par un test de nano-indentation conforme à la norme ISO 14577 est compris entre 0,05 et 0,10.
PCT/JP2025/009773 2024-03-21 2025-03-14 Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée Pending WO2025197764A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025539953A JPWO2025197764A1 (fr) 2024-03-21 2025-03-14

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2024045136 2024-03-21
JP2024-045136 2024-03-21

Publications (1)

Publication Number Publication Date
WO2025197764A1 true WO2025197764A1 (fr) 2025-09-25

Family

ID=97139623

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2025/009773 Pending WO2025197764A1 (fr) 2024-03-21 2025-03-14 Film de blindage contre les ondes électromagnétiques et carte de circuit imprimé blindée

Country Status (3)

Country Link
JP (1) JPWO2025197764A1 (fr)
TW (1) TW202539349A (fr)
WO (1) WO2025197764A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009241458A (ja) * 2008-03-31 2009-10-22 Kimoto & Co Ltd ハードコートフィルム及び樹脂成型品
WO2010061851A1 (fr) * 2008-11-28 2010-06-03 株式会社 きもと Feuille possédant un film de revêtement et procédé de fabrication de celle-ci
WO2022181570A1 (fr) * 2021-02-24 2022-09-01 タツタ電線株式会社 Film de protection contre les ondes électromagnétiques
JP2023092119A (ja) * 2021-12-21 2023-07-03 凸版印刷株式会社 液晶デバイス用透明基材、調光シート、及び調光装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009241458A (ja) * 2008-03-31 2009-10-22 Kimoto & Co Ltd ハードコートフィルム及び樹脂成型品
WO2010061851A1 (fr) * 2008-11-28 2010-06-03 株式会社 きもと Feuille possédant un film de revêtement et procédé de fabrication de celle-ci
WO2022181570A1 (fr) * 2021-02-24 2022-09-01 タツタ電線株式会社 Film de protection contre les ondes électromagnétiques
JP2023092119A (ja) * 2021-12-21 2023-07-03 凸版印刷株式会社 液晶デバイス用透明基材、調光シート、及び調光装置

Also Published As

Publication number Publication date
TW202539349A (zh) 2025-10-01
JPWO2025197764A1 (fr) 2025-09-25

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