WO2026000177A1 - Substrat d'affichage et son procédé de fabrication, et appareil d'affichage - Google Patents

Substrat d'affichage et son procédé de fabrication, et appareil d'affichage

Info

Publication number
WO2026000177A1
WO2026000177A1 PCT/CN2024/101329 CN2024101329W WO2026000177A1 WO 2026000177 A1 WO2026000177 A1 WO 2026000177A1 CN 2024101329 W CN2024101329 W CN 2024101329W WO 2026000177 A1 WO2026000177 A1 WO 2026000177A1
Authority
WO
WIPO (PCT)
Prior art keywords
light
substrate
layer
partition
emitting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2024/101329
Other languages
English (en)
Chinese (zh)
Inventor
李柳青
董水浪
曹占锋
卢鑫泓
杨少鹏
李国腾
李春
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
Original Assignee
BOE Technology Group Co Ltd
Beijing BOE Technology Development Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BOE Technology Group Co Ltd, Beijing BOE Technology Development Co Ltd filed Critical BOE Technology Group Co Ltd
Priority to PCT/CN2024/101329 priority Critical patent/WO2026000177A1/fr
Priority to CN202480001219.5A priority patent/CN121844737A/zh
Publication of WO2026000177A1 publication Critical patent/WO2026000177A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details

Definitions

  • This disclosure relates to the field of display technology, and in particular to a display substrate, a method for preparing the substrate, and a display device thereof.
  • Micro-light-emitting diodes are light-emitting diodes with dimensions on the micrometer scale. Due to their small size, Micro LEDs can be used as pixels on display panels, and display substrates made using Micro LEDs are called Micro LED display substrates. In Micro LED products, the technology shrinks the size of existing LEDs to below 100 ⁇ m, approximately 1% of the current LED size, and then uses mass transfer technology to transfer these micrometer-sized Micro LEDs onto a driving substrate, thereby forming Micro LED displays of various sizes. Optimizing the related structures of display products to improve display resolution is one of the important research topics for researchers.
  • a display substrate comprising:
  • the driving circuit layer is located on the substrate.
  • a light-emitting device layer located on the side of the driving circuit layer away from the substrate, includes a plurality of light-emitting devices arranged in an array along a first direction and a second direction.
  • Each light-emitting device includes a first electrode on the driving circuit layer, a light-emitting functional portion located on the side of the first electrode away from the substrate, and a second electrode located on the side of the light-emitting functional portion away from the substrate.
  • the light-emitting device layer includes at least one light-emitting unit, which includes at least two light-emitting devices and a connecting electrode. The at least two light-emitting devices and the connecting electrode are connected in series.
  • a conductive layer is located on the side of the plurality of light-emitting devices away from the substrate.
  • the conductive layer includes at least one conductive portion, the orthographic projection of which onto the substrate is perpendicular to the light-emitting unit.
  • the orthographic projections on the substrate at least partially overlap, and the conductive portion includes at least two first conductive portions spaced apart;
  • the second electrode of one light-emitting device is electrically connected to the first electrode of the other light-emitting device through the first conductive part; and in the connecting electrode and the light-emitting device electrically connected to the connecting electrode, the connecting electrode is electrically connected to the second electrode of the light-emitting device through the first conductive part;
  • the display substrate further includes a partition portion, and at least one partition portion is provided between two adjacent first conductive electronic portions.
  • the partition portion includes a first partition portion, wherein at least one first partition portion is provided between two adjacent first conductive sub-parts in the conductive portion;
  • the partition includes a second partition, and at least one second partition is present between two adjacent conductive parts.
  • the first electrode of one light-emitting device has an epitaxial portion extending beyond the edge of the light-emitting functional portion, and the epitaxial portion is electrically connected to the second electrode of the other light-emitting device through the first conductive portion.
  • At least a portion of the first partition is located on the side of the epitaxial portion away from the substrate, and the size of the first partition is greater than or equal to the size of the epitaxial portion along the extending direction of the first partition.
  • the partition portion has a first surface away from the substrate and a second surface close to the substrate, wherein the orthographic projection of the second surface on the substrate is within the orthographic projection of the first surface on the substrate.
  • the display substrate further includes a cover layer located between the plurality of light-emitting devices and the conductive layer.
  • the cover layer includes a plurality of covering portions, each covering at least a portion of the surface of the plurality of light-emitting devices.
  • the covering portion includes a first opening that exposes at least a portion of the second electrode of the light-emitting device, and the first conductive portion is electrically connected to the second electrode of the light-emitting device through the first opening;
  • the partition portion is located in the covering layer.
  • a partition portion is provided between two adjacent first conductive parts, the partition portion being integrally connected to an adjacent cover portion and to an adjacent other cover portion.
  • the covering portions are spaced apart, and two adjacent first conductive portions are disconnected at the partition portions.
  • one of the partition portions is connected to the adjacent covering portion as an integral structure, and the other partition portion is spaced apart from the adjacent covering portion; and/or
  • One of the partition portions is integrally connected to the adjacent cover portion, and the other partition portion is integrally connected to the adjacent cover portion; and/or
  • One of the partition portions is spaced apart from the adjacent covering portion, and the other partition portion is spaced apart from the adjacent covering portion.
  • the conductive portion further includes a second conductive sub-portion located between two spaced-apart partition portions, wherein the second conductive sub-portion is disconnected from two adjacent first conductive sub-portions at the two partition portions respectively.
  • a partition is provided between two adjacent first conductive parts, the partition being spaced apart from two adjacent covering parts, and the two adjacent first conductive parts being located on both sides of the partition.
  • the cover layer includes a passivation layer, the passivation layer including a first passivation sub-layer located on the side of the plurality of light-emitting devices away from the substrate and a second passivation sub-layer located on the side of the first passivation sub-layer away from the substrate, the partition portion including a first partition portion and a second partition portion located on the side of the first partition portion away from the substrate, the first partition portion being located in the first passivation sub-layer, the second partition portion being located in the second passivation sub-layer, and the orthographic projection of the first partition portion on the substrate being located within the orthographic projection of the second partition portion on the substrate.
  • the cover layer includes an organic protective layer
  • the partition portion is located in the organic protective layer
  • the partition portion has an inverted trapezoidal cross-sectional shape along a direction perpendicular to the substrate.
  • connection electrode is located on the side of the driving circuit layer away from the substrate, and the connection electrode is spaced apart from the adjacent light-emitting device.
  • the connecting electrode is located on the same layer as the first electrode.
  • connection electrode is located on the side of the conductive layer away from the substrate, the connection electrode is electrically connected to the first conductive part, and the connection electrode is on the substrate.
  • the orthographic projection of the light-emitting functional part overlaps at least partially with the orthographic projection of the light-emitting functional part on the substrate.
  • the display substrate further includes at least one auxiliary electrode, which is electrically connected to the connecting electrode, and the orthographic projection of the auxiliary electrode on the substrate does not overlap with the orthographic projection of the light-emitting functional part on the substrate.
  • the at least one light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the light-emitting device emits light of a third color;
  • the display substrate further includes a color conversion layer, which is located on the side of the conductive layer away from the substrate, or the color conversion layer is located on the side of the substrate away from the light-emitting device layer; and
  • the color conversion layer includes a first color conversion part and a second color conversion part.
  • the orthographic projection of the first color conversion part on the substrate at least partially overlaps with the orthographic projection of the first light-emitting unit on the substrate.
  • the first color conversion part is used to convert third color light into first color light.
  • the orthographic projection of the second color conversion part on the substrate at least partially overlaps with the orthographic projection of the second light-emitting unit on the substrate.
  • the second color conversion part is used to convert third color light into second color light.
  • the cover layer includes a reflective layer
  • the reflective layer includes a plurality of reflective portions
  • the plurality of reflective portions cover at least a portion of the sidewalls of the plurality of light-emitting devices
  • the light-emitting devices emit third color light
  • the reflective portions reflect the third color light and transmit first color light and second color light.
  • the partition is located in the reflective layer.
  • the reflective layer includes at least two first reflective sublayers and at least two second reflective sublayers, the at least two first reflective sublayers and the at least two second reflective sublayers being arranged alternately in a direction away from the substrate, and the refractive index of the first reflective sublayers being less than the refractive index of the second reflective sublayers;
  • the partition includes at least two first partition sub-parts and at least two second partition sub-parts, wherein the at least two first partition sub-parts are respectively located in the at least two first reflective sub-layers, and the at least two second partition sub-parts are respectively located in the two second reflective sub-layers; and
  • the orthographic projection of the first partition sub-part on the substrate is located within the orthographic projection of the second partition sub-part on the substrate, or the orthographic projection of the second partition sub-part on the substrate is located within the orthographic projection of the first partition sub-part on the substrate.
  • the display substrate further includes a planarization layer located on the side of the conductive layer away from the reflective layer, the planarization layer having a second opening that exposes at least a portion of a first conductive portion electrically connected only to a second electrode of the light-emitting device; and
  • connection electrode is located on the side of the planarization layer away from the substrate, and the connection electrode is electrically connected to the first conductive part through the second opening.
  • the at least one light-emitting unit includes a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the light-emitting device emits light of a third color;
  • the display substrate further includes a color conversion layer, the color conversion layer being located on the side of the substrate away from the light-emitting device layer;
  • the color conversion layer includes a first color conversion section, a second color conversion section, and a light-transmitting section.
  • the orthographic projection of the first color conversion section on the substrate at least partially overlaps with the orthographic projection of the first light-emitting unit on the substrate.
  • the first color conversion section is used to convert third-color light into first-color light.
  • the orthographic projection of the second color conversion section on the substrate at least partially overlaps with the orthographic projection of the second light-emitting unit on the substrate.
  • the second color conversion section is used to convert third-color light into second-color light.
  • the orthographic projection of the light-transmitting section on the substrate at least partially overlaps with the orthographic projection of the third light-emitting unit on the substrate.
  • the light-transmitting section is used to transmit third-color light.
  • the substrate has a plurality of grooves on the side away from the light-emitting device layer, the plurality of grooves including a first groove, wherein at least a portion of the first color conversion portion is embedded in the first groove;
  • the plurality of grooves includes a second groove, and at least a portion of the second color conversion portion is embedded in the second groove; and/or
  • the plurality of grooves includes a third groove, and at least a portion of the light-transmitting portion is embedded in the third groove.
  • At least a portion of the groove is provided with a metal reflective portion, the metal reflective portion being located between the substrate and the color conversion layer, the metal reflective portion covering at least a portion of the sidewall of the groove.
  • the display substrate further includes a semi-transparent and semi-reflective layer located on the side of the color conversion layer away from the substrate, wherein the semi-transparent and semi-reflective layer transmits a first color light and a second color light and reflects a third color light;
  • the orthographic projection of the semi-transparent and semi-reflective layer onto the substrate and the first color conversion part onto the substrate The orthographic projections on the substrate at least partially overlap; and/or
  • the orthographic projection of the semi-transparent and semi-reflective layer on the substrate at least partially overlaps with the orthographic projection of the second color conversion part on the substrate.
  • the at least two light-emitting devices are arranged along the first direction, and the first partition extends along the second direction;
  • At least two light-emitting devices are arranged along the second direction, and the first partition extends along the first direction.
  • At least two of the light-emitting devices are arranged along the first direction and at least two of the light-emitting devices are arranged along the second direction;
  • the first partition extends along the second direction;
  • the first partition extends along the first direction.
  • the shape of the orthographic projection of the light-emitting device on the substrate is circular, elliptical, rectangular, or rounded rectangular.
  • a method for preparing a display substrate comprising the following steps:
  • a driving circuit layer is formed on the substrate.
  • a light-emitting device layer is formed on the side of the driving circuit layer away from the substrate.
  • the light-emitting device layer includes a plurality of light-emitting devices arranged in an array along a first direction and a second direction.
  • Each light-emitting device includes a first electrode located on the driving circuit layer, a light-emitting functional part located on the side of the first electrode away from the substrate, and a second electrode located on the side of the light-emitting functional part away from the substrate.
  • the light-emitting device layer includes at least one light-emitting unit, and the light-emitting unit includes at least two light-emitting devices and a connecting electrode.
  • a partition is formed on the side of the driving circuit layer away from the substrate.
  • a conductive layer is formed on the side of the light-emitting device layer and the partition portion away from the substrate.
  • the conductive layer includes at least one conductive portion, the orthographic projection of which on the substrate at least partially coincides with the orthographic projection of the light-emitting unit on the substrate.
  • the conductive portion includes at least two spaced-apart first conductive sub-parts, with at least one partition portion between adjacent first conductive sub-parts.
  • the second electrode of one light-emitting device is electrically connected to the first electrode of the other light-emitting device through the first conductive sub-parts.
  • the connecting electrode is electrically connected to the second electrode of the light-emitting device through the first conductive part.
  • a display device comprising a display substrate as described in any of the preceding claims.
  • Figure 1 schematically shows a plan view of a display substrate according to some embodiments of the present disclosure.
  • Figure 2A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure.
  • Figure 2B schematically shows the cross-sectional view taken along BB’ in Figure 2A.
  • Figure 2C schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to other embodiments of the present disclosure.
  • Figure 3A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure.
  • Figure 3B schematically shows the cross-sectional view taken along CC’ in Figure 3A.
  • Figure 5A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure.
  • Figure 5B schematically shows the cross-sectional view taken along DD’ in Figure 5A.
  • Figure 6B schematically shows the cross-sectional view taken along EE’ in Figure 6A.
  • Figure 7 schematically shows a cross-sectional view of a display substrate taken along MM’ in Figure 1 according to some embodiments of the present disclosure.
  • Figure 8B shows a cross-sectional view of the alternating silicon oxide and niobium oxide films after etching at the first opening, characterized by scanning electron microscopy.
  • Figure 8C shows a cross-sectional view of the alternating silicon oxide and niobium oxide films after etching at the second opening, characterized by scanning electron microscopy.
  • Figure 9 schematically shows a cross-sectional view of a display substrate taken along MM’ in Figure 1 according to some embodiments of the present disclosure.
  • Figure 10A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure.
  • Figure 10B schematically shows an enlarged view of a display substrate located in region A2 of Figure 1 according to some embodiments of the present disclosure.
  • Figure 10C schematically shows an enlarged view of a display substrate located in region A3 of Figure 1 according to some embodiments of the present disclosure.
  • Figure 10D schematically shows a cross-sectional view taken along FF’ in Figure 10A.
  • Figure 11 schematically illustrates a flowchart of a method for fabricating a display substrate according to an embodiment of the present disclosure.
  • Figures 12A-12I schematically illustrate the formation process of a display substrate according to some embodiments of the present disclosure.
  • Figures 13A-13K schematically illustrate the formation process of a display substrate according to some embodiments of the present disclosure.
  • connection can refer to a physical connection, an electrical connection, a communication connection, and/or a fluid connection.
  • the X-axis, Y-axis, and Z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense.
  • the X-axis, Y-axis, and Z-axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other.
  • “at least one of X, Y, and Z” and “at least one selected from the group consisting of X, Y, and Z” can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z such as XYZ, XY, YZ, and XZ.
  • the term “and/or” includes any and all combinations of one or more of the listed related items.
  • first may be used herein to describe various components, members, elements, regions, layers, and/or parts
  • these components, members, elements, regions, layers, and/or parts should not be limited by these terms. Rather, these terms are used to distinguish one component, member, element, region, layer, and/or part from another.
  • first component, first member, first element, first region, first layer, and/or first part discussed below may be referred to as a second component, second member, second element, second region, second layer, and/or second part without departing from the teachings of this disclosure.
  • spatial relation terms such as “above,” “below,” “left,” “right,” etc., may be used herein to describe the relationship between one element or feature and another element or feature as shown in the figure. It should be understood that spatial relation terms are intended to cover other orientations of the device in use or operation besides those described in the figure. For example, if the device in the figure were inverted, an element described as “below” or “under” other elements or features would be oriented “above” or “on top” other elements or features.
  • the terms “substantially,” “approximately,” “approximately,” “roughly,” and other similar terms are used as terms of approximation rather than as terms of degree, and they are intended to account for inherent deviations in measured or calculated values that would be recognized by one of ordinary skill in the art. Taking into account factors such as process variations, measurement problems, and errors associated with the measurement of a particular quantity (i.e., limitations of the measurement system), “approximately” as used herein includes stated values and indicates that a particular value is within an acceptable range of deviation for one of ordinary skill in the art. For example, “approximately” may mean within one or more standard deviations, or within ⁇ 30%, ⁇ 20%, ⁇ 10%, ⁇ 5% of the stated value.
  • the same layer refers to a layer structure formed by using the same film deposition process to create a specific pattern, and then using the same photomask to pattern that film layer in a single patterning process.
  • a single patterning process may include multiple exposures and development steps.
  • the pattern in the layered structure formed by etching or etching processes can be continuous or discontinuous. That is, multiple elements, components, structures and/or parts located in the "same layer” are made of the same material and formed by the same patterning process. Typically, multiple elements, components, structures and/or parts located in the "same layer" have approximately the same thickness.
  • the terms “height” or “thickness” refer to the dimensions along the surface of each film layer disposed perpendicular to the display substrate, i.e., the dimensions along the light-emitting direction of the display substrate, or the dimensions along the normal direction of the display device.
  • the term "transistor” can refer to a bipolar junction transistor (BJT), a thin-film transistor (TFT), a field-effect transistor (FET), or other devices with similar characteristics.
  • BJT bipolar junction transistor
  • TFT thin-film transistor
  • FET field-effect transistor
  • the first terminal can be the drain
  • the second terminal can be the source
  • the first terminal can be the source
  • the second terminal can be the drain.
  • Figure 1 schematically shows a plan view of a display substrate according to some embodiments of the present disclosure.
  • Figure 2A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure.
  • Figure 2A only schematically shows the first electrode of the light-emitting device, the second electrode of the light-emitting device, the connecting electrode, the conductive layer, the first and third openings of the cover layer, and the partition portion.
  • Figure 2B schematically shows the cross-sectional view taken along BB’ in Figure 2A.
  • the display substrate includes a substrate 100, a driving circuit layer 200, a light-emitting device layer 300, and a conductive layer 400.
  • the driving circuit layer 200 is located on the substrate 100
  • the light-emitting device layer 300 is located on the side of the driving circuit layer 200 away from the substrate 100 and is electrically connected to the driving circuit layer 200
  • the conductive layer 400 is located on the side of the light-emitting device layer 300 away from the substrate 100 and is electrically connected to the light-emitting device layer 300.
  • the light-emitting device layer 300 includes a plurality of light-emitting devices 310, which are arranged in an array along a first direction X and a second direction Y.
  • Each light-emitting device 310 includes a first electrode 311 located on the driving circuit layer 200, a light-emitting functional portion 312 located on the side of the first electrode 311 away from the substrate 100, and a second electrode 313 located on the side of the light-emitting functional portion 312 away from the substrate 100.
  • the light-emitting device layer 300 includes at least one light-emitting unit 300G, which includes at least two light-emitting devices 310 and a connecting electrode 320. Each light-emitting device 310 in the light-emitting unit 300G and the connecting electrode 320 are connected in series.
  • the conductive layer 400 includes at least one conductive portion 410, the orthographic projection of the conductive portion 410 on the substrate 100 at least partially coincides with the orthographic projection of the light-emitting unit 300G on the substrate 100, and the conductive portion 410 and the light-emitting unit 300G are...
  • the light unit 300G is electrically connected to realize the series connection between each light-emitting device 310 in the light-emitting unit 300G and a connecting electrode 320.
  • the conductive portion 410 includes at least two first conductive portions 411 spaced apart.
  • the second electrode 313 of one light-emitting device 310 is electrically connected to the first electrode 311 of the other light-emitting device 310 through the first conductive portions 411.
  • the connecting electrode 320 and the light-emitting device 310 electrically connected to the connecting electrode 320 the connecting electrode 320 is electrically connected to the second electrode 313 of the light-emitting device 310 through the first conductive portions 411. That is, through the bridging of the first conductive portions 410, each light-emitting device 310 and the connecting electrode 320 are connected in series.
  • the display substrate further includes a partition portion 500, with at least one partition portion 500 between two adjacent first conductive portions 411.
  • the formed conductive layer 400 is partitioned into a plurality of spaced-apart first conductive portions 411. Therefore, a conductive layer 400 with a predetermined pattern can be formed using only a thin film deposition process without performing a patterning process, saving fabrication steps and reducing the manufacturing cost of the display substrate.
  • the spacing between two adjacent first conductive portions 411 separated by the partition portion 500 can be significantly reduced, that is, the spacing between adjacent light-emitting devices 310 can be narrowed, thereby improving the resolution of the display substrate.
  • the light-emitting device 310 can be a micro light-emitting diode (Micro LED), and the light-emitting functional part 312 includes a first semiconductor part 3121 located on the first electrode 311, a light-emitting part 3122 located on the side of the first semiconductor part 3121 away from the first electrode 311, and a second semiconductor part 3123 located on the side of the light-emitting part 3122 away from the substrate 100.
  • the light-emitting device 310 can be a micro light-emitting diode (Micro LED)
  • the light-emitting functional part 312 includes a first semiconductor part 3121 located on the first electrode 311, a light-emitting part 3122 located on the side of the first semiconductor part 3121 away from the first electrode 311, and a second semiconductor part 3123 located on the side of the light-emitting part 3122 away from the substrate 100.
  • one of the first semiconductor portion 3121 and the second semiconductor portion 3123 is an N-type semiconductor portion, and the other is a P-type semiconductor portion.
  • the material of the N-type semiconductor portion may include N-type gallium nitride
  • the material of the P-type semiconductor portion may include P-type gallium nitride.
  • the light-emitting part 3122 may include a multiple quantum well (MQW) structure, which may be a periodic structure of alternating gallium nitride (GaN) and indium gallium nitride (InGaN), but is not limited thereto.
  • MQW multiple quantum well
  • the partition portion 500 includes a first partition portion 510.
  • the conductive portion 410 at least one first partition portion 510 is provided between two adjacent first conductive sub-parts 411.
  • the formed conductive portion 410 is naturally partitioned into at least two by the first partition portion 510.
  • the partition portion 500 includes a second partition portion 520, and at least one second partition portion 520 is provided between two adjacent conductive portions 410.
  • the second partition portion 520 By providing the second partition portion 520 at the interval position of the adjacent conductive portions 410, the formed conductive layer 400 is naturally partitioned into at least two conductive portions 410 by the second partition portion 520.
  • the first electrode 311 of one light-emitting device 310 has an epitaxial portion 3111 extending beyond the edge of the light-emitting functional portion 312.
  • the orthographic projection of the epitaxial portion 3111 on the substrate 100 does not overlap with the orthographic projection of the light-emitting functional portion 312 of the light-emitting device 310 on the substrate 100.
  • the epitaxial portion 3111 is electrically connected to the second electrode 313 of the other light-emitting device 310 through the first conductive electronic portion 411, thereby realizing the series connection of the two adjacent light-emitting devices 310.
  • the first partition portion 510 is located on the side of the epitaxial portion 3111 away from the substrate 100.
  • the size H1 of the first partition portion 510 is greater than or equal to the size H2 of the epitaxial portion 3111, so as to ensure that the first partition portion 510 completely isolates two adjacent first conductive electronic portions 411.
  • the extending direction of the first partition portion 510 should be understood as the extending direction of the edge of the conductive portion 410 formed by being partitioned by the first partition portion 510.
  • the partition portion 500 has a first surface away from the substrate 100 and a second surface close to the substrate 100, wherein the orthographic projection of the second surface on the substrate 100 is within the orthographic projection of the first surface on the substrate 100. That is, the sidewall of the partition portion 500 has an undercut structure, which can achieve a better partitioning effect, allowing the conductive layer 400 to be disconnected at the sidewall of the partition portion 500.
  • the display substrate further includes a cover layer 600, which is located between a plurality of light-emitting devices 310 and a conductive layer 400.
  • the cover layer 600 includes a plurality of cover portions 610 spaced apart, each of which covers at least a portion of the surface of the plurality of light-emitting devices 310.
  • Each cover portion 610 has a first opening K1 that exposes at least a portion of the second electrode 313 of the light-emitting device 310.
  • a first conductive portion 411 is electrically connected to the second electrode 313 of the light-emitting device 310 through the first opening K1.
  • connection electrode 320 is located between the drive circuit layer 200 and the cover layer 600, and the connection electrode 320 is electrically connected to the drive circuit layer 200.
  • the electrode 320 is spaced apart from the adjacent light-emitting device 310.
  • a cover layer 600 covers at least a portion of the surface of the connecting electrode 320.
  • the cover layer 600 has a third opening K3, which exposes at least a portion of the connecting electrode 320.
  • one end of the first conductive part 411 is electrically connected to the connecting electrode 320 through the third opening K3, and the other end of the first conductive part 411 is electrically connected to the second electrode 313 of the light-emitting device 310 through the first opening K1.
  • the connecting electrode 320 and the first electrode 311 are located on the same layer, that is, the connecting electrode 320 and the first electrode 311 are formed by the same thin film deposition process and patterning process, which can simplify the preparation process of the display substrate.
  • the shape of the orthographic projection of the light-emitting device 310 on the substrate 100 is circular, elliptical, rectangular, or rounded rectangular.
  • the orthographic projection of the light-emitting device on the substrate 100 is circular.
  • FIG2A schematically shows the first electrode 311 and the third electrode 313 of the light-emitting device.
  • the orthographic projection of the first electrode 311 on the substrate 100 is circular, and the orthographic projection of the third electrode 313 on the substrate 100 is circular.
  • Figure 2C schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to other embodiments of the present disclosure.
  • the orthographic projection of the light-emitting device on the substrate 100 is rectangular.
  • FIG2C schematically shows the first electrode 311 and the third electrode 313 of the light-emitting device.
  • the orthographic projection of the first electrode 311 on the substrate 100 is rectangular, and the orthographic projection of the third electrode 313 on the substrate 100 is rectangular. This arrangement can increase the light-emitting area of the light-emitting device 310.
  • Figure 3A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure, wherein Figure 3A only schematically shows the first electrode of the light-emitting device, the second electrode of the light-emitting device, the conductive layer, the first opening of the cover layer, and the partition portion.
  • Figure 3B schematically shows the cross-sectional view taken along CC’ in Figure 3A.
  • the connecting electrode 320 is located on the side of the conductive layer 400 away from the substrate 100.
  • the connecting electrode 320 is electrically connected to the first conductive part 411.
  • the orthographic projection of the connecting electrode 320 on the substrate 100 at least partially overlaps with the orthographic projection of the light-emitting functional part 312 on the substrate 100. This arrangement can narrow the distance between adjacent light-emitting units 300G, further improving the resolution of the display substrate.
  • the light-emitting device 310 can be configured to emit light from the second electrode.
  • the light is emitted from the side of the 313.
  • the material of the connecting electrode 320 can be a transparent conductive material to avoid the connecting electrode 320 blocking the light emission of the light-emitting device 310.
  • the material of the connecting electrode 320 can include indium tin oxide.
  • the multiple connecting electrodes 320 in the multiple light-emitting units 300G can be interconnected to form a grid-like electrode structure. This grid-like electrode structure can be electrically connected to the driving circuit layer 200 in the peripheral area of the display substrate.
  • the display substrate further includes at least one auxiliary electrode 910, which is electrically connected to the connecting electrode 320.
  • the orthographic projection of the auxiliary electrode 910 on the substrate 100 does not overlap with the orthographic projection of the light-emitting functional part 312 on the substrate 100.
  • the auxiliary electrode 910 may include a metal material with high resistivity.
  • the material of the auxiliary electrode 910 may include at least one of titanium, aluminum, chromium, platinum, gold, silver, and copper.
  • the auxiliary electrode 910 may have a titanium/aluminum/titanium stacked structure, or a chromium/platinum/gold stacked structure.
  • the auxiliary electrode 910 is connected in parallel with the connecting electrode 320, which helps to reduce the voltage drop generated by the connecting electrode 320 when transmitting voltage signals, thereby improving the display uniformity of the display substrate.
  • the partition portion 500 is located in the cover layer 600, that is, the partition portion 500 and the cover portion 610 are formed by the same thin film deposition process and patterning process, which can simplify the manufacturing process of the display substrate.
  • a partition portion 500 is provided between two adjacent first conductive parts 411.
  • the partition portion 500 is connected to an adjacent cover portion 610 as an integral structure, and is spaced apart from another adjacent cover portion 610.
  • the two adjacent first conductive parts 411 are disconnected at the partition portion 500. This configuration can narrow the distance between adjacent light-emitting units 300G, further improving the resolution of the display substrate.
  • integrated structure refers to a structure formed by two (or more) structures through the same deposition process and patterned through the same patterning process, which are connected to each other and may be made of the same or different materials.
  • a first partition portion 510 is provided between the two light-emitting devices 310.
  • the first partition portion 510 is located on the extension portion 3111 of the first electrode 311 of one light-emitting device 310, and the partition portion 500 is connected to the covering portion 610 covering the light-emitting device 310 as an integral structure.
  • the extension portion 3111 protrudes towards the other light-emitting device 310 relative to the first partition portion 510.
  • the portion of the extension portion 3111 that protrudes from the first partition portion 510 is electrically connected to the second electrode 313 of the other light-emitting device 310 through the first conductive electronic portion 411.
  • the two first conductive parts 411 which are electrically connected to the two light-emitting devices 310 respectively, are disconnected at the first partition part 510.
  • At least one light-emitting device 310 of one light-emitting unit 300G is adjacent to at least one light-emitting device 310 of the other light-emitting unit 300G.
  • a second partition 520 is provided between the two light-emitting devices 310 that are adjacent to each other and located in the two light-emitting units 300G.
  • the second partition 520 is connected to the covering part 610 covering one of the light-emitting devices 310 as an integral structure, and is spaced apart from the covering part 610 covering the other light-emitting device 310.
  • the two first conductive electronic parts 411 that are electrically connected to the two light-emitting devices 310 respectively are disconnected at the second partition 520.
  • two spacer portions 500 are provided between two adjacent first conductive parts 411, and the two adjacent first conductive parts 411 are separated at the interval of the two spacer portions 500.
  • One spacer portion 500 is connected to the adjacent covering part 610 as an integral structure, while the other spacer portion 500 is spaced apart from the adjacent covering part 610.
  • Providing two spacer portions 500 between two adjacent first conductive parts 411 can further improve the isolation effect.
  • Figure 4 schematically shows a cross-sectional view of a display substrate taken along NN’ in Figure 1 according to some embodiments of the present disclosure.
  • connection electrode 320 of one light-emitting unit 300G is adjacent to at least one light-emitting device 310 of the other light-emitting unit 300G.
  • a second partition 520 is provided between the connection electrode 320 and the light-emitting device 310 of the two light-emitting units 300G respectively.
  • the second partition 520 can be connected to the covering part 610 covering the light-emitting device 310 as an integral structure.
  • the first conductive part 411 electrically connected to the connection electrode 320 is disconnected from the first conductive part 411 electrically connected to the light-emitting device 310 at the side wall of the second partition 520.
  • two first partition portions 510 are provided between the two light-emitting devices 310, spaced apart.
  • the two first partition portions 510 are located on the extension portion 3111 of the first electrode 311 of one light-emitting device 310, and one partition portion 500 is integrally connected to the covering portion 610 covering the light-emitting device 310, while the other partition portion 500 is spaced apart from the covering portion 610 covering the other light-emitting device 310.
  • the extension portion 3111 protrudes towards the other light-emitting device 310 relative to the two first partition portions 510, and the protruding portion of the extension portion 3111 is electrically connected to the second electrode 313 of the other light-emitting device 310 via a first conductive portion 411.
  • the two first conductive portions 411 respectively electrically connected to the two light-emitting devices 310, are located on the extension portion 3111 of the first electrode 311 of the second electrode 310.
  • the first partition 510 is broken at the interval position.
  • two spacers 500 are provided between two adjacent first conductive parts 411, and the two adjacent first conductive parts 411 are disconnected at the interval position of the two spacers 500.
  • the connecting electrode 320 of one light-emitting unit 300G is adjacent to at least one light-emitting device 310 of the other light-emitting unit 300G.
  • Two second partition portions 520 are provided between the connecting electrode 320 and the light-emitting device 310 of the two light-emitting units 300G respectively.
  • One second partition portion 520 is connected to the covering portion 610 covering the connecting electrode 320 as an integral structure, and the other second partition portion 520 is connected to the covering portion 610 covering the light-emitting device 310 as an integral structure.
  • the first conductive part 411 electrically connected to the connecting electrode 320 and the first conductive part 411 electrically connected to the light-emitting device 310 are disconnected at the interval position of the two second partition portions 520.
  • the conductive portion 410 further includes a second conductive sub-portion 412, which is located between two spaced-apart portions 500.
  • the second conductive sub-portion 412 is disconnected from the two adjacent first conductive sub-portions 411 at the two spaced-apart portions 500. Since the conductive layer 400 is formed only by a thin film deposition process, a portion of the film layer is deposited between the two spaced-apart portions 500, forming the second conductive sub-portion 412.
  • the second conductive sub-portion 412 is spaced from the adjacent first conductive sub-portions 411, and even if the second conductive sub-portion 412 is not removed by a patterning process, no display defects will occur.
  • Figure 5A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure, wherein Figure 5A only schematically shows the first electrode of the light-emitting device, the second electrode of the light-emitting device, the conductive layer, the first opening of the cover layer, and the partition portion.
  • Figure 5B schematically shows the cross-sectional view taken along DD’ in Figure 5A.
  • a partition 500 is provided between two adjacent first conductive parts 411, and the partition 500 and two adjacent covering parts 610 are respectively spaced apart, with the two adjacent first conductive parts 411 located on both sides of the partition 500.
  • a first partition portion 510 is provided between the two light-emitting devices 310.
  • the first partition portion 510 and two covering portions 610 covering the two light-emitting devices 310 are respectively spaced apart.
  • the first partition portion 510 is located on the extension portion 3111 of the first electrode 311 of one light-emitting device 310.
  • the extension portion 3111 is located relative to the first electrode 311 of the first light-emitting device 310.
  • a partition portion 510 protrudes towards another light-emitting device 310.
  • the portion of the extension portion 3111 that protrudes from the first partition portion 510 is electrically connected to the second electrode 313 of the other light-emitting device 310 via a first conductive portion 411.
  • the two first conductive portions 411 that are electrically connected to the two light-emitting devices 310 respectively are disconnected at the first partition portion 510, and the two first conductive portions 411 are respectively located on both sides of the first partition portion 510.
  • At least one light-emitting device 310 of one light-emitting unit 300G is adjacent to at least one light-emitting device 310 of the other light-emitting unit 300G.
  • a second partition portion 520 is provided between the two light-emitting devices 310 arranged adjacently and respectively located in the two light-emitting units 300G.
  • the second partition portion 520 is spaced apart from two covering portions 610 covering the two light-emitting devices 310.
  • Two first conductive parts 411 that are electrically connected to the two light-emitting devices 310 are disconnected at the second partition portion 520, and the two first conductive parts 411 are respectively located on both sides of the second partition portion 520.
  • the conductive portion 410 further includes a third conductive sub-portion 413.
  • the third conductive sub-portion 413 is located on the side of the partition portion 500 away from the substrate 100, and the third conductive sub-portion 413 is disconnected from the two adjacent first conductive sub-portions 411 at the sidewall of the partition portion 500. Since the conductive layer 400 is formed only by a thin film deposition process, a portion of the film layer is deposited on the side of the partition portion 500 away from the substrate 100, thus forming the third conductive sub-portion 413.
  • the third conductive sub-portion 413 is spaced apart from the adjacent first conductive sub-portions 411, and even if the third conductive sub-portion 413 is not removed by a patterning process, no display defects will occur.
  • Figure 6A schematically shows an enlarged view of a display substrate located in region A1 of Figure 1 according to some embodiments of the present disclosure, wherein Figure 6A only schematically shows the first electrode of the light-emitting device, the second electrode of the light-emitting device, the conductive layer, the first opening of the cover layer, and the partition portion.
  • Figure 6B schematically shows the cross-sectional view taken along EE’ in Figure 6A.
  • two spacer portions 500 are provided between two adjacent first conductive parts 411.
  • the two adjacent first conductive parts 411 are separated at the interval of the two spacer portions 500.
  • One spacer portion 500 is spaced apart from the adjacent covering part 610, and the other spacer portion 500 is spaced apart from the adjacent covering part 610.
  • two first partition portions 510 are provided between the two light-emitting devices 310 at a distance.
  • the two first partition portions 510 are located on the extension portion 3111 of the first electrode 311 of one light-emitting device 310, and are closer to one partition portion 500 of the light-emitting device 310 and the covering portion 610 covering the light-emitting device 310.
  • the first light-emitting device 310 is separated from the second light-emitting device 310 by a partition 500.
  • An extension portion 3111 protrudes from the second light-emitting device 310 relative to the two first partition portions 510, and the protruding portion of the extension portion 3111 is electrically connected to the second electrode 313 of the second light-emitting device 310 via a first conductive portion 411.
  • the two first conductive portions 411 which are respectively electrically connected to the two light-emitting devices 310, are disconnected at the interval between the two first partition portions 510.
  • the two first conductive portions 411 are located on opposite sides of the two first partition portions 510.
  • Two first conductive portions 411 which are electrically connected to the two light-emitting devices 310 respectively, are disconnected at the spaced positions of the second partition portions 520.
  • the two first conductive portions 411 are located on opposite sides of the two second partition portions 520 respectively.
  • the cover layer 600 includes a passivation layer PVX
  • the passivation layer PVX includes a first passivation sublayer PVX1 located on the side of the plurality of light-emitting devices 310 away from the substrate 100 and a second passivation sublayer PVX2 located on the side of the first passivation sublayer PVX1 away from the substrate 100.
  • the partition portion 500 includes a first partition sub-portion 500a and a second partition sub-portion 500b located on the side of the first partition sub-portion 500a away from the substrate 100.
  • the first partition sub-portion 500a is located in the first passivation sublayer PVX1
  • the second partition sub-portion 500b is located in the second passivation sublayer PVX2.
  • the orthographic projection of the first partition sub-portion 500a on the substrate 100 is located within the orthographic projection of the second partition sub-portion 500b on the substrate 100.
  • the first partition sub-part 500a is away from the connected portion.
  • the edge of the cover portion 610 is recessed relative to the second partition portion 500b.
  • the edge of the first partition portion 500a near the adjacent first partition portion 510 is recessed relative to the second partition portion 500b. That is, a "convex" shaped groove is formed between two adjacent first partition portions 510.
  • the edge of the first partition sub-part 500a on the side closer to the other first partition portion 510 is recessed relative to the second partition sub-part 500b. That is, a "convex" groove is formed between the two adjacent second partition portions 520.
  • the cover layer 600 includes a passivation layer PVX and an organic protective layer OC located on the side of the passivation layer PVX away from the substrate 100, and the partition portion 500 is located in the organic protective layer OC.
  • the passivation layer PVX and the organic protective layer OC have a first opening K1, the first opening K1 exposing at least a portion of the second electrode 313 of the light-emitting device 310, and the first conductive electronic portion 411 is electrically connected to the second electrode 313 of the light-emitting device 310 through the first opening K1.
  • the cross-sectional shape of the partition portion 500 along the direction perpendicular to the substrate 100 is an inverted trapezoid.
  • a passivation layer PVX on one light-emitting device 310 extends from the side of the light-emitting functional portion 312 to the epitaxial portion 3111 of the first electrode 311.
  • the passivation layer PVX covers a portion of the epitaxial portion 3111, and a first partition portion 510 is located on the side of the passivation layer PVX away from the substrate 100.
  • the portion of the epitaxial portion 3111 not covered by the passivation layer PVX is electrically connected to the second electrode 313 of the other light-emitting device 310 through a first conductive electronic portion 411.
  • Figure 7 schematically shows a cross-sectional view of a display substrate taken along MM’ in Figure 1 according to some embodiments of the present disclosure.
  • At least one light-emitting unit 300G includes a first light-emitting unit 301G, a second light-emitting unit 302G, and a third light-emitting unit 303G.
  • the light-emitting device 310 is configured to emit third-color light toward the second electrode 313 side.
  • the display substrate also includes a color conversion layer 700, which is located on the side of the conductive layer 400 away from the substrate 100.
  • the color conversion layer 700 includes a first color conversion portion 710, a second color conversion portion 720, and a light-transmitting portion 730.
  • the orthographic projection of the first color conversion portion 710 on the substrate 100 at least partially overlaps with the orthographic projection of the first light-emitting unit 301G on the substrate 100.
  • the first color conversion portion 710 is used to convert the third-color light into first-color light.
  • the orthographic projection of the second color conversion portion 720 on the substrate 100 at least partially overlaps with the orthographic projection of the second light-emitting unit 302G on the substrate 100.
  • the dichromatic conversion unit 720 is used to convert the third color light into the second color light.
  • the orthographic projection of the light-transmitting unit 730 on the substrate 100 at least partially overlaps with the orthographic projection of the third light-emitting unit 303G on the substrate 100.
  • the light-transmitting unit 730 allows the third color light to be transmitted.
  • the first color is red
  • the second color is green
  • the third color is blue. That is, the light-emitting device 310 in the first light-emitting unit 301G is part of the red sub-pixel, the light-emitting device 310 in the second light-emitting unit 302G is part of the green sub-pixel, and the light-emitting device 310 in the third light-emitting unit 303G is part of the blue sub-pixel, thereby achieving color display.
  • the first color conversion unit 710 includes a quantum dot material that emits red light when irradiated with blue light
  • the second color conversion unit 720 includes a quantum dot material that emits green light when irradiated with blue light.
  • the light-emitting device is configured to emit a third color light toward the first electrode side, and the color conversion layer is located on the side of the substrate away from the light-emitting device layer.
  • the display substrate further includes a planarization layer PLN located between the conductive layer 400 and the color conversion layer 700.
  • the material of the planarization layer PLN includes organic adhesives that can withstand temperatures above 300°C, and the thickness of the planarization layer PLN is 1-5 ⁇ m.
  • the display substrate further includes a color filter layer CF located on the side of the color conversion layer 700 away from the substrate 100.
  • the color filter layer CF includes a first color filter portion CF1, a second color filter portion CF2, and a third color filter portion CF3.
  • the first color filter portion CF1 is located on the side of the first color conversion portion 710 away from the substrate 100
  • the second color filter portion CF2 is located on the side of the second color conversion portion 720 away from the substrate 100
  • the third color filter portion CF3 is located on the side of the light-transmitting portion 730 away from the substrate 100.
  • the display substrate further includes a black matrix layer BM, the black matrix layer BM being filled with a color conversion layer 700, and a spacer region in the color filter layer CF.
  • the display substrate further includes a protective cover plate CG located on the side of the color filter layer CF away from the substrate 100.
  • Figure 8A schematically shows a cross-sectional view of a display substrate taken along MM’ in Figure 1 according to some embodiments of the present disclosure.
  • the cover layer 600 includes a reflective layer REF
  • the reflective layer REF includes a plurality of reflective portions REFa
  • the plurality of reflective portions REFa cover at least a portion of the sidewalls of a plurality of light-emitting devices 310
  • the light-emitting devices 310 emit third-color light
  • the reflective portions REFa reflect the third-color light and The light emits both a first color light and a second color light.
  • the reflective layer REF has a distributed Bragg reflector (DBR) structure.
  • This DBR structure is a periodic structure formed by alternating layers of two materials with different refractive indices, with the optical thickness of each alternating layer being one-quarter of the central reflection wavelength. By designing the DBR materials and structure, selective reflection of light in specific wavelength bands can be achieved.
  • the reflective layer REF includes at least two first reflective sublayers REF1 and at least two second reflective sublayers REF2, which are alternately arranged along a direction away from the substrate 100.
  • the refractive index of the first reflective sublayer REF1 is less than the refractive index of the second reflective sublayer REF2.
  • the material of the first reflective sublayer REF1 includes at least one of silicon oxide, aluminum oxide, and magnesium fluoride
  • the material of the second reflective sublayer REF2 includes at least one of niobium oxide, titanium dioxide, titanium pentoxide, and silicon nitride.
  • the material of the first reflective sublayer REF1 includes silicon oxide
  • the material of the second reflective sublayer REF2 includes niobium oxide.
  • other low-refractive-index materials and high-refractive-index materials can also be selected according to the wavelength of the reflected light, and this disclosure does not limit this.
  • the cover layer 600 further includes a passivation layer PVX located between the reflective layer REF and the light-emitting device 310.
  • the passivation layer PVX and the reflective layer REF have a first opening K1.
  • the first opening K1 exposes at least a portion of the second electrode 313 of the light-emitting device 310.
  • the first conductive part 411 is electrically connected to the second electrode 313 of the light-emitting device 310 through the first opening K1.
  • the first conductive electronic portion 411 covers at least a portion of the sidewall of the light-emitting device 310.
  • the first conductive electronic portion 411 includes a metallic material with high reflectivity.
  • the composite reflective structure formed by stacking the first conductive electronic portion 411 and the reflective portion REFa has high reflectivity, which can further improve the light extraction efficiency of the light-emitting device 310.
  • the first conductive electronic portion 411 has a Ti/Al/Ti stacked film structure with a thickness of 50/1000/100 angstroms or a TiN/Al/Ti stacked film structure with a thickness of 50/1000/100 angstroms.
  • the partition portion 500 is located in the reflective layer REF.
  • the partition portion 500 includes at least two first partition sub-parts 500a and at least two second partition sub-parts 500b.
  • the at least two first partition sub-parts 500a are respectively located in at least two first reflective sub-layers REF1
  • the at least two second partition sub-parts 500b are respectively located in two second reflective sub-layers REF2.
  • the orthographic projection of the first partition sub-part 500a on the substrate 100 is located at the second partition sub-part.
  • the second partition sub-part 500b is within the orthogonal projection on the substrate 100, or the orthogonal projection of the second partition sub-part 500b on the substrate 100 is located within the orthogonal projection of the first partition sub-part 500a on the substrate 100.
  • the material of the first reflective sublayer REF1 includes silicon oxide
  • the material of the second reflective sublayer REF2 includes niobium oxide.
  • the etching rate of the first reflective sublayer REF1 can be adjusted to be less than that of the second reflective sublayer REF2, thereby causing the edge of the second partition sub-part 500b to be recessed relative to the first partition sub-part 500a, that is, the orthographic projection of the second partition sub-part 500b on the substrate 100 is located within the orthographic projection of the first partition sub-part 500a on the substrate 100.
  • first partition portions 510 between two first conductive electronic portions 411 that are electrically connected to the two light-emitting devices 310 respectively, and both first partition portions 510 are located in the reflective layer REF.
  • the maximum distance between the two first partition portions 510 is D1
  • the maximum diameter of the first opening K1 in the reflective layer REF is D2.
  • the inventors have found that when the size difference between D1 and D2 is large, for example, D1 ⁇ 1/2*D2, by adjusting the etching process parameters, the sidewall of the formed first partition portion 510 can have an undercut structure, and the reflective portion REFa located at the first opening K1 can have a smooth sidewall structure.
  • the maximum distance D1 between the two first partition portions 510 is the distance between the two second partition sub-parts 500b located in the same second reflective sub-layer REF2; when the edge of the first partition sub-part 500a is recessed relative to the second partition sub-part 500b, the maximum distance D1 between the two first partition portions 510 is the distance between the two first partition sub-parts 500a located in the same first reflective sub-layer REF1.
  • the cross-sectional shape of the first opening K1 in the reflective layer REF is approximately an inverted trapezoid, and the maximum aperture D2 of the first opening K1 in the reflective layer REF is the aperture of the first opening K1 on the side away from the substrate 100.
  • Figure 8B shows a cross-sectional view of the alternating silicon oxide and niobium oxide films after etching at the first opening, characterized by scanning electron microscopy.
  • Figure 8C shows a cross-sectional view of the alternating silicon oxide and niobium oxide films after etching at the second opening, characterized by scanning electron microscopy.
  • Alternating silicon oxide and niobium oxide films are deposited on a glass substrate, and a photoresist layer is formed on the film layer by photolithography.
  • the photoresist layer has a first opening with a diameter of 0.4 ⁇ m and a second opening with a diameter of 10 ⁇ m.
  • the lower film layer is subjected to a dry etching process under the cover of the photoresist layer.
  • the etched substrate was characterized under a scanning electron microscope.
  • the etching at the first opening was then analyzed.
  • the cross-sectional morphology of the film is shown in Figure 8B. It can be seen that the edge of the niobium oxide film is significantly recessed compared to the edge of the silicon oxide film, i.e., an undercut structure is formed.
  • the cross-sectional morphology of the film after etching at the second opening is shown in Figure 8C. It can be seen that the edge of the niobium oxide film is smoothly connected to the silicon oxide film, without forming an undercut structure.
  • At least one light-emitting device 310 of one light-emitting unit 300G is adjacent to at least one light-emitting device 310 of the other light-emitting unit 300G.
  • Two second partition portions 520 are provided between the two light-emitting devices 310 that are adjacent to each other and located in the two light-emitting units 300G respectively.
  • the maximum distance between the two second partition portions 520 is substantially equal to the maximum distance between the two first partition portions 510.
  • the display substrate further includes a planarization layer PLN located on the side of the conductive layer 400 away from the reflective layer REF.
  • the planarization layer PLN has a second opening K2, which exposes at least a portion of the first conductive portion 411 electrically connected only to the second electrode 313 of the light-emitting device 310.
  • a connection electrode 320 is located on the side of the planarization layer PLN away from the substrate 100, and the connection electrode 320 is electrically connected to the first conductive portion 411 through the second opening K2.
  • the material of the connecting electrode 320 includes a metal material with low resistivity, for example, the material of the connecting electrode 320 includes at least one of molybdenum, copper and aluminum.
  • the display substrate further includes an encapsulation layer EPL, which is located on the side of the connection electrode 320 away from the substrate 100.
  • the encapsulation layer EPL may include at least one inorganic film layer, the material of which includes at least one of SiO, SiN, and SiCN.
  • the encapsulation layer EPL has a stacked film structure of SiO/SiN/SiCN.
  • At least one light-emitting unit 300G includes a first light-emitting unit 301G, a second light-emitting unit 302G and a third light-emitting unit 303G, and the light-emitting device 310 is configured to emit a third color light toward the first electrode 311 side.
  • the display substrate also includes a color conversion layer 700, which is located on the side of the substrate 100 away from the light-emitting device layer 300.
  • the color conversion layer 700 includes a first color conversion part 710, a second color conversion part 720, and a light-transmitting part 730.
  • the orthographic projection of the first color conversion part 710 on the substrate 100 at least partially overlaps with the orthographic projection of the first light-emitting unit 301G on the substrate 100.
  • the first color conversion part 710 is used to convert third-color light into first-color light.
  • the orthographic projection of the second color conversion part 720 on the substrate 100 at least partially overlaps with the orthographic projection of the second light-emitting unit 302G on the substrate 100.
  • the second color conversion part 720 is used to convert third-color light into second-color light.
  • the orthographic projection of the light-transmitting part 730 on the substrate 100 overlaps with the orthographic projection of the third light-emitting unit 303G on the substrate 100. At least partially overlapping, the light-transmitting part 730 allows the transmission of a third color of light.
  • the first color is red
  • the second color is green
  • the third color is blue. That is, the light-emitting device 310 in the first light-emitting unit 301G is part of the red sub-pixel, the light-emitting device 310 in the second light-emitting unit 302G is part of the green sub-pixel, and the light-emitting device 310 in the third light-emitting unit 303G is part of the blue sub-pixel, thereby achieving color display.
  • the display substrate further includes a black matrix layer BM, which fills the spaced regions in the color conversion layer 700.
  • the display substrate further includes a semi-transparent and semi-reflective layer 800 located on the side of the color conversion layer 700 away from the substrate 100.
  • the semi-transparent and semi-reflective layer 800 transmits first color light and second color light and reflects third color light.
  • the orthographic projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 overlaps at least partially with the orthographic projection of the first color conversion unit 710 on the substrate 100.
  • the semi-transparent and semi-reflective layer 800 reflects any third color light that may be present in the light emitted by the first light-emitting unit 301G, and only allows the first color light converted by the first color conversion unit 710 to be emitted, thereby improving the color purity of the light emitted by the first light-emitting unit 301G.
  • the orthographic projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 and the orthographic projection of the second color conversion unit 720 on the substrate 100 at least partially overlap.
  • the semi-transparent and semi-reflective layer 800 reflects any third color light that may exist in the light emitted by the second light-emitting unit 302G, and only allows the second color light converted by the second color conversion unit 720 to be emitted, thereby improving the color purity of the light emitted by the second light-emitting unit 302G.
  • the orthogonal projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 covers the orthogonal projection of the first color conversion part 710 on the substrate 100
  • the orthogonal projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 covers the orthogonal projection of the second color conversion part 720 on the substrate 100
  • the orthogonal projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 does not overlap with the orthogonal projection of the light-transmitting part 730 on the substrate 100.
  • the semi-transparent and semi-reflective layer 800 can have a distributed Bragg reflector structure, that is, the structure of the semi-transparent and semi-reflective layer 800 is similar to the structure of the reflective layer REF, both being periodic structures formed by alternating arrangements of two materials with different refractive indices. By designing the materials and structure of the semi-transparent and semi-reflective layer 800, selective reflection of third-color light can be achieved.
  • the surface of the semi-transparent and semi-reflective layer 800 away from the substrate 100 is substantially flush with the surface of the light-transmitting portion 730 away from the substrate 100.
  • a buffer layer BUF and a protective cover plate CG are also provided on the side of the semi-transparent and semi-reflective layer 800 away from the substrate 100.
  • Figure 9 schematically shows a cross-sectional view of a display substrate taken along MM’ in Figure 1 according to some embodiments of the present disclosure.
  • the substrate 100 has a plurality of grooves G on the side away from the light-emitting device layer 300.
  • the plurality of grooves G includes a first groove G1. At least a portion of the first color conversion part 710 is embedded in the first groove G1.
  • This arrangement can reduce the distance between the light-emitting device 310 located in the first light-emitting unit 301G and the first color conversion part 710, thereby improving the light color crosstalk problem between the light-emitting device 310 located in the first light-emitting unit 301G and the light-emitting device 310 located in the adjacent second light-emitting unit 302G or third light-emitting unit 303G.
  • the depth of the first groove G1 along the direction perpendicular to the substrate 100 is substantially equal to the thickness of the first color conversion portion 710 along the direction perpendicular to the substrate 100, and the surface of the first color conversion portion 710 is substantially flush with the surface of the substrate 100.
  • the plurality of grooves G include a second groove G2, and at least a portion of the second color conversion part 720 is embedded in the second groove G2.
  • This arrangement can reduce the distance between the light-emitting device 310 located in the second light-emitting unit 302G and the second color conversion part 720, thereby improving the light color crosstalk problem between the light-emitting device 310 located in the second light-emitting unit 302G and the light-emitting device 310 located in the adjacent first light-emitting unit 301G or third light-emitting unit 303G.
  • the depth of the second groove G2 along the direction perpendicular to the substrate 100 is substantially equal to the thickness of the second color conversion portion 720 along the direction perpendicular to the substrate 100, and the surface of the second color conversion portion 720 is substantially flush with the surface of the substrate 100.
  • the plurality of grooves G includes a third groove G3, and at least a portion of the light-transmitting portion 730 is embedded in the third groove G3.
  • At least a portion of the groove G is provided with a metal reflective portion 920.
  • the metal reflective portion 920 is located between the substrate 100 and the color conversion layer 700.
  • the metal reflective portion 920 covers at least a portion of the sidewall of the groove G.
  • the metal reflective portion 920 can reflect and recover the light emitted to the area where the adjacent light-emitting unit 300G is located, further improving the light color crosstalk problem between adjacent light-emitting units 300G.
  • the metal reflective portion 920 extends from the sidewall of the groove G to the bottom surface of the groove G, and the orthographic projection of the metal reflective portion 920 on the substrate 100 does not overlap with the orthographic projection of the light-emitting functional portion 312 on the substrate 100.
  • the metal reflective part 920 is provided in the first groove G1, the second groove G2 and the third groove G3.
  • the material of the metal reflective portion 920 includes silver.
  • the display substrate further includes a semi-transparent and semi-reflective layer 800 located on the side of the color conversion layer 700 away from the substrate 100.
  • the semi-transparent and semi-reflective layer 800 transmits first color light and second color light and reflects third color light.
  • the orthographic projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 overlaps at least partially with the orthographic projection of the first color conversion unit 710 on the substrate 100.
  • the semi-transparent and semi-reflective layer 800 reflects any third color light that may be present in the light emitted by the first light-emitting unit 301G, and only allows the first color light converted by the first color conversion unit 710 to be emitted, thereby improving the color purity of the light emitted by the first light-emitting unit 301G.
  • the orthographic projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 and the orthographic projection of the second color conversion unit 720 on the substrate 100 at least partially overlap.
  • the semi-transparent and semi-reflective layer 800 reflects any third color light that may exist in the light emitted by the second light-emitting unit 302G, and only allows the second color light converted by the second color conversion unit 720 to be emitted, thereby improving the color purity of the light emitted by the second light-emitting unit 302G.
  • the orthogonal projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 covers the orthogonal projection of the first color conversion part 710 on the substrate 100
  • the orthogonal projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 covers the orthogonal projection of the second color conversion part 720 on the substrate 100
  • the orthogonal projection of the semi-transparent and semi-reflective layer 800 on the substrate 100 does not overlap with the orthogonal projection of the light-transmitting part 730 on the substrate 100.
  • the semi-transparent and semi-reflective layer 800 can have a distributed Bragg reflector structure, that is, the structure of the semi-transparent and semi-reflective layer 800 is similar to the structure of the reflective layer REF, both being periodic structures formed by alternating arrangements of two materials with different refractive indices. By designing the materials and structure of the semi-transparent and semi-reflective layer 800, selective reflection of third-color light can be achieved.
  • the surface of the semi-transparent and semi-reflective layer 800 away from the substrate 100 is substantially flush with the surface of the light-transmitting portion 730 away from the substrate 100.
  • a buffer layer BUF and a protective cover plate CG are also provided on the side of the semi-transparent and semi-reflective layer 800 away from the substrate 100.
  • Figure 10A schematically shows an enlarged view of a display substrate according to some embodiments of the present disclosure located in region A1 of Figure 1, wherein Figure 10A only schematically shows the first electrode of the light-emitting device and the light-emitting device.
  • Figure 10B schematically shows an enlarged view of a display substrate located in region A2 of Figure 1 according to some embodiments of the present disclosure, wherein Figure 10B only schematically shows the first electrode of the light-emitting device, the second electrode of the light-emitting device, the first opening of the cover layer, the first conductive part, and the first partition part.
  • Figure 10C schematically shows an enlarged view of a display substrate located in region A3 of Figure 1 according to some embodiments of the present disclosure, wherein Figure 10C only schematically shows the first electrode of the light-emitting device, the second electrode of the light-emitting device, the first opening of the cover layer, the first conductive part, and the first partition part.
  • Figure 10D schematically shows a cross-sectional view taken along FF’ in Figure 10A.
  • At least one light-emitting unit 300G at least two light-emitting devices 310 are arranged along a first direction X, and a first partition portion 510 extends along a second direction Y.
  • the light-emitting unit 300G includes four light-emitting devices 310, which are arranged along the first direction X and connected in series, and the first partition portion 510 extends along the second direction Y.
  • At least one light-emitting unit 300G at least two light-emitting devices 310 are arranged along the second direction Y, and a first partition portion 510 extends along the first direction X.
  • the light-emitting unit 300G includes four light-emitting devices 310, which are arranged along the second direction Y and connected in series, and the first partition portion 510 extends along the first direction X.
  • At least two light-emitting devices 310 are arranged along a first direction X and at least two light-emitting devices 310 are arranged along a second direction Y; wherein, between two adjacent light-emitting devices 310 along the first direction X, a first partition portion 510 extends along the second direction Y; between two adjacent light-emitting devices 310 along the second direction Y, the first partition portion 510 extends along the first direction X.
  • the light-emitting unit 300G includes four light-emitting devices 310, arranged in a 2-row ⁇ 2-column configuration.
  • the first electrode 311 of the light-emitting device 310 in the first row and first column is electrically connected to the second electrode 313 of the light-emitting device 310 in the first row and second column via a first conductive part 411.
  • the first electrode 311 of the light-emitting device 310 in the first row and second column is electrically connected to the second electrode 313 of the light-emitting device 310 in the second row and second column via a first conductive part 411.
  • the first electrode 311 of the light-emitting device 310 in the second row and second column is electrically connected to the second electrode 313 of the light-emitting device 310 in the second row and first column via a first conductive part 411, thereby achieving a series connection of the four light-emitting devices 310.
  • a first partition 510 extends along the second direction Y between the light-emitting devices 310 in the first row and first column and the light-emitting devices 310 in the first row and second column. Between the light-emitting device 310 located in the first column of the second row and the light-emitting device 310 located in the second column of the second row, the first partition portion 510 extends along the second direction Y. The first partition portion 510 extends along the first direction X between the light-emitting device 310 located in the first row and second column and the light-emitting device 310 located in the second row and second column.
  • Figure 11 schematically illustrates a flowchart of a method for fabricating a display substrate according to an embodiment of the present disclosure.
  • the method for preparing a display substrate includes the following steps S10 to S40.
  • step S10 a driving circuit layer is formed on the substrate.
  • a light-emitting device layer is formed on the side of the driving circuit layer away from the substrate.
  • the light-emitting device layer includes a plurality of light-emitting devices arranged in an array along a first direction and a second direction.
  • Each light-emitting device includes a first electrode located on the driving circuit layer, a light-emitting functional part located on the side of the first electrode away from the substrate, and a second electrode located on the side of the light-emitting functional part away from the substrate.
  • the light-emitting device layer includes at least one light-emitting unit, and the light-emitting unit includes at least two light-emitting devices and a connecting electrode.
  • step S30 a partition is formed on the side of the driving circuit layer away from the substrate.
  • a conductive layer is formed on the side of the light-emitting device layer and the partition portion away from the substrate.
  • the conductive layer includes at least one conductive portion.
  • the orthographic projection of the conductive portion on the substrate at least partially overlaps with the orthographic projection of the light-emitting unit on the substrate.
  • the conductive portion includes at least two first conductive sub-parts spaced apart. There is at least one partition portion between two adjacent first conductive sub-parts.
  • the second electrode of one light-emitting device is electrically connected to the first electrode of the other light-emitting device through the first conductive sub-part.
  • the connecting electrode is electrically connected to the second electrode of the light-emitting device through the first conductive sub-part.
  • Figures 12A-12I schematically illustrate the formation process of a display substrate according to some embodiments of the present disclosure.
  • a driving circuit layer 200 is formed on a substrate 100, and a first bonding layer BL1 is formed on the side of the driving circuit layer 200 away from the substrate 100, thereby obtaining a driving backplate.
  • the first bonding layer BL1 can be formed by a physical vapor deposition process, and the first bonding layer BL1 includes a stacked film of titanium/aluminum/titanium/indium tin oxide.
  • the light-emitting diode epitaxial wafer includes an epitaxial substrate SUB, a first buffer layer BUF1 on the epitaxial substrate SUB, a second semiconductor layer SEL2 on the side of the first buffer layer BUF1 away from the epitaxial substrate SUB, a light-emitting layer LUM on the side of the second semiconductor layer SEL2 away from the epitaxial substrate SUB, and a first semiconductor layer SEL1 on the side of the light-emitting layer LUM away from the epitaxial substrate SUB.
  • a second bonding layer BL2 is formed on the side of the first semiconductor layer SEL1 away from the epitaxial substrate SUB.
  • the epitaxial substrate SUB can be a silicon-based substrate or a sapphire substrate
  • the material of the second semiconductor layer SEL2 includes N-type gallium nitride
  • the light-emitting layer LUM includes multiple quantum wells
  • the material of the second semiconductor layer SEL2 includes P-type gallium nitride.
  • the second bonding layer BL2 is an indium tin oxide film, an indium zinc oxide film, or a tin/platinum/gold stacked film.
  • the first bonding layer BL1 on the driving backplane is bonded to the second bonding layer BL2 on the epitaxial wafer of the light-emitting diode, and the first bonding layer BL1 and the second bonding layer BL2 are bonded together to form the bonding layer BL.
  • the epitaxial substrate SUB and the first buffer layer BUF1 are removed, and the second semiconductor layer SEL2 is thinned across its entire surface. Then, a second electrode layer 313a is formed on the side of the thinned second semiconductor layer SEL2 away from the substrate 100. Finally, the second electrode layer 313a is subjected to thermal annealing.
  • the epitaxial substrate SUB can be removed by chemical-mechanical planarization (CMP) and wet etching processes.
  • CMP chemical-mechanical planarization
  • the first buffer layer BUF1 can be removed by chemical mechanical polishing or dry etching, and the second semiconductor layer SEL2 can be thinned across the entire surface.
  • the thickness of the thinned second semiconductor layer SEL2 is 0.5um-2um.
  • the second electrode layer 313a is an indium tin oxide film layer, and the thickness of the second electrode layer 313a is 0.1-0.3 ⁇ m.
  • the second electrode layer 313a, the second semiconductor layer SEL2, the light-emitting layer LUM, and the first semiconductor layer SEL1 are patterned to form a plurality of first semiconductor portions 3121, a plurality of light-emitting portions 3122 located on the side of the plurality of first semiconductor portions 3121 away from the substrate 100, a plurality of second semiconductor portions 3123 located on the side of the plurality of light-emitting portions 3122 away from the substrate 100, and a plurality of second electrodes 313 located on the side of the plurality of second semiconductor portions 3123 away from the substrate 100.
  • the connected first semiconductor portions 3121, light-emitting portions 3122, and second semiconductor portions 3123 constitute a light-emitting functional portion 312.
  • the orthographic projection of the light-emitting functional part 312 onto the substrate 100 can be circular, elliptical, or rectangular.
  • the dimension of the orthographic projection of the light-emitting functional part 312 onto the substrate 100 along the first direction X or the second direction Y is 2-20 ⁇ m.
  • the spacing between two adjacent light-emitting functional parts 312 is 2-20 ⁇ m.
  • the angle between the sidewall of the light-emitting part 3122 and the bottom surface is 60-80°.
  • the bonding layer BL is patterned to form multiple first electrodes 311 and multiple connecting electrodes 320.
  • the multiple first electrodes 311 are located on the side of the multiple first semiconductor portions 3121 near the substrate 100.
  • the multiple first electrodes 311, multiple light-emitting portions 3122, and multiple second electrodes 313 constitute multiple light-emitting devices 310.
  • the multiple light-emitting devices 310 and the multiple connecting electrodes 320 constitute multiple light-emitting units 300G. As part of the light-emitting unit 300G, it includes at least two light-emitting devices 310 and a connecting electrode 320.
  • the first electrode 311 of one light-emitting device 310 has an extension portion 3111 extending beyond the edge of the light-emitting functional portion 312.
  • the orthographic projection of the extension portion 3111 on the substrate 100 does not overlap with the orthographic projection of the light-emitting functional portion 312 of the light-emitting device 310 on the substrate 100.
  • the passivation portion PVXa has a first opening K1 and a third opening K3.
  • the first opening K1 exposes at least a portion of the second electrode 313 of the light-emitting device 310, and the third opening K3 exposes at least a portion of the connecting electrode 320.
  • the plurality of partition portions 500 include a plurality of first partition portions 510 and a plurality of second partition portions 520.
  • first partition portions 510 are provided between two adjacent light-emitting devices 310 in a light-emitting unit 300G, and a "U-shaped" groove is formed between the two first partition portions 510.
  • second partition portions 520 are provided between the connecting electrode 320 of one light-emitting unit 300G and an adjacent light-emitting device 310 in another light-emitting unit 300G, and a "U-shaped" groove is formed between the two second partition portions 520.
  • the step of forming the passivation layer PVX may specifically include the following:
  • a first passivation material layer is formed on the side of the plurality of light-emitting devices 310 away from the substrate 100, and a second passivation material layer is formed on the side of the first passivation material layer away from the substrate 100.
  • forming the first passivation material layer includes: first forming a silicon oxide layer with a thickness of 500 angstroms by atomic layer deposition, and then forming a silicon oxide layer with a thickness of 0.3-0.6 ⁇ m by chemical vapor deposition.
  • the first passivation material layer and the second passivation material layer are patterned and dry etched to form a passivation layer PVX.
  • the passivation layer PVX includes a first passivation sublayer PVX1 obtained by patterning the first passivation material layer and a second passivation sublayer PVX2 obtained by patterning the second passivation material layer.
  • two patterning processes and two dry etching processes are performed on the first passivation material layer and the second passivation material layer, respectively.
  • a first opening K1 and a third opening K3 are formed.
  • the first passivation sublayer is formed at the first opening K1 and the third opening K3.
  • the edge of PVX1 is smoothly connected to the edge of the second passivation sublayer PVX2.
  • a "convex" groove is formed between two adjacent first partition portions 510 and between two adjacent second partition portions 520. That is, at the "convex" groove, the edge of the second passivation sublayer PVX2 protrudes more than the edge of the first passivation sublayer PVX1.
  • a passivation layer PVX with the above morphology can be formed in one etching process.
  • a conductive layer 400 is formed on the side of the plurality of partition portions 500 away from the substrate 100.
  • the conductive layer 400 is partitioned into a plurality of conductive portions 410 by a plurality of second partition portions 520.
  • the conductive portions 410 are partitioned into at least two first conductive portions 411 by at least one first partition portion 510.
  • the conductive layer 400 also includes a second conductive portion 412 located between two adjacent first partition portions 510 and a second conductive portion 412 located between two adjacent second partition portions 520.
  • two adjacent light-emitting devices 310 are connected in series through the first conductive portions 411.
  • the epitaxial portion 3111 of the first electrode 311 of one light-emitting device 310 is electrically connected to the second electrode 313 of another light-emitting device 310 through the first conductive portion 411.
  • the connecting electrode 320 is electrically connected to the second electrode 313 of the adjacent light-emitting device 310 through the first conductive portion 411.
  • a conductive layer 400 is formed by a physical vapor deposition process.
  • the material of the conductive layer 400 includes indium tin oxide, and the thickness of the conductive layer 400 is 0.1-0.2 ⁇ m.
  • a planarization layer PLN is formed on the side of the conductive layer 400 away from the substrate 100.
  • a protective cover plate CG is provided, and a black matrix layer BM is formed on the protective cover plate CG.
  • the black matrix layer BM has multiple openings.
  • a color filter layer CF is formed within the multiple openings of the black matrix layer BM.
  • the color filter layer CF includes a first color filter portion CF1, a second color filter portion CF2, and a third color filter portion CF3.
  • a color conversion layer 700 is formed on the side of the color filter layer CF away from the protective cover plate CG.
  • the color conversion layer 700 includes a first color conversion portion 710, a second color conversion portion 720, and a light-transmitting portion 730.
  • the first color conversion portion 710 is located on the first color filter portion CF1
  • the second color conversion portion 720 is located on the second color filter portion CF2
  • the light-transmitting portion 730 is located on the third color filter portion CF3. This yields a color filter substrate.
  • the color filter substrate is assembled with the substrate shown in Figure 12H, and then a packaging process is performed to prepare the display substrate.
  • Figures 13A-13K schematically illustrate the formation process of a display substrate according to some embodiments of the present disclosure.
  • a driving circuit layer 200 is formed on a substrate 100, and a first bonding layer BL1 is formed on the side of the driving circuit layer 200 away from the substrate 100, thus obtaining a driving backplate.
  • the first bonding layer BL1 is an indium tin oxide film or an indium zinc oxide film.
  • the light-emitting diode epitaxial wafer includes an epitaxial substrate SUB, a first buffer layer BUF1 on the epitaxial substrate SUB, a second semiconductor layer SEL2 on the side of the first buffer layer BUF1 away from the epitaxial substrate SUB, a light-emitting layer LUM on the side of the second semiconductor layer SEL2 away from the epitaxial substrate SUB, and a first semiconductor layer SEL1 on the side of the light-emitting layer LUM away from the epitaxial substrate SUB.
  • a second bonding layer BL2 is formed on the side of the first semiconductor layer SEL1 away from the epitaxial substrate SUB.
  • the epitaxial substrate SUB can be a silicon-based substrate or a sapphire substrate
  • the material of the second semiconductor layer SEL2 includes N-type gallium nitride
  • the light-emitting layer LUM includes multiple quantum wells
  • the material of the second semiconductor layer SEL2 includes P-type gallium nitride.
  • the second bonding layer BL2 is an indium tin oxide film or an indium zinc oxide film.
  • the first bonding layer BL1 on the driving backplane is bonded to the second bonding layer BL2 on the epitaxial wafer of the light-emitting diode, and the first bonding layer BL1 and the second bonding layer BL2 are bonded together to form the bonding layer BL.
  • the epitaxial substrate SUB and the first buffer layer BUF1 are removed, and the second semiconductor layer SEL2 is thinned across its entire surface. Then, a second electrode layer 313a is formed on the side of the thinned second semiconductor layer SEL2 away from the substrate 100. Finally, the second electrode layer 313a is subjected to thermal annealing.
  • the second electrode layer 313a is an indium tin oxide film layer, and the thickness of the second electrode layer 313a is 0.1-0.3 ⁇ m.
  • the second electrode layer 313a, the second semiconductor layer SEL2, the light-emitting layer LUM, and the first semiconductor layer SEL1 are patterned to form a plurality of first semiconductor portions 3121, a plurality of light-emitting portions 3122 located on the side of the plurality of first semiconductor portions 3121 away from the substrate 100, a plurality of second semiconductor portions 3123 located on the side of the plurality of light-emitting portions 3122 away from the substrate 100, and a plurality of second electrodes 313 located on the side of the plurality of second semiconductor portions 3123 away from the substrate 100.
  • the connected first semiconductor portions 3121, light-emitting portions 3122, and second semiconductor portions 3123 constitute a light-emitting functional portion 312.
  • the bonding layer BL is patterned to form a plurality of first electrodes 311.
  • the plurality of first electrodes 311 are located on the side of the plurality of first semiconductor portions 3121 near the substrate 100.
  • An electrode 311, a plurality of light-emitting portions 3122, and a plurality of second electrodes 313 constitute a plurality of light-emitting devices 310.
  • the plurality of light-emitting devices 310 constitute a part of a plurality of light-emitting units 300G, and the light-emitting unit 300G includes at least two light-emitting devices 310.
  • the first electrode 311 of one light-emitting device 310 has an extension portion 3111 extending beyond the edge of the light-emitting functional portion 312, and the orthographic projection of the extension portion 3111 on the substrate 100 does not overlap with the orthographic projection of the light-emitting functional portion 312 of the light-emitting device 310 on the substrate 100.
  • a capping layer 600 is formed on the side of the plurality of light-emitting devices 310 away from the substrate 100.
  • the capping layer 600 includes a passivation layer PVX located on the side of the plurality of light-emitting devices 310 away from the substrate 100 and a reflective layer REF located on the side of the passivation layer PVX away from the substrate 100.
  • the capping layer 600 includes a plurality of covering portions 610 and a plurality of partition portions 500.
  • the covering portions 610 are located between the passivation layer PVX and the reflective layer REF, and the partition portions 500 are located in the reflective layer REF.
  • the covering portions 610 cover at least a portion of the surface of the light-emitting devices 310, and the covering portion 610 has a first opening K1 that exposes at least a portion of the second electrode 313 of the light-emitting device 310.
  • the plurality of partition portions 500 include a plurality of first partition portions 510 and a plurality of second partition portions 520.
  • first partition portions 510 between two adjacent light-emitting devices 310 in a light-emitting unit 300G, and the opposing sides of the two first partition portions 510 have undercut structures.
  • second partition portions 520 between a light-emitting device 310 in one light-emitting unit 300G and an adjacent light-emitting device 310 in another light-emitting unit 300G, and the opposing sides of the two second partition portions 520 have undercut structures.
  • the step of forming the passivation layer PVX may specifically include the following:
  • a passivation material layer is formed on the side of the plurality of light-emitting devices 310 away from the substrate 100. At least two first reflective material layers and at least two second reflective material layers are formed on the side of the passivation material layer away from the substrate 100. The at least two first reflective material layers and the at least two second reflective material layers are arranged alternately in a direction away from the substrate 100. The refractive index of the first reflective material layer is less than the refractive index of the second reflective material layer.
  • forming a passivation material layer includes: first forming a silicon oxide layer with a thickness of 500 angstroms by atomic layer deposition, and then forming a silicon oxide layer with a thickness of 0.2-0.3 ⁇ m by chemical vapor deposition.
  • the material of the first reflective material layer includes at least one of silicon oxide, aluminum oxide and magnesium fluoride
  • the material of the second reflective material layer includes at least one of niobium oxide, titanium dioxide, titanium pentoxide and silicon nitride.
  • the passivation material layer, at least two first reflective material layers, and the at least two second reflective material layers are subjected to...
  • the process involves patterning and dry etching to form a passivation layer PVX and a reflective layer REF.
  • the reflective layer REF includes a first reflective sublayer REF1 patterned from a first reflective material layer and a second reflective sublayer REF2 patterned from a second reflective material layer.
  • the edge of the first reflective sublayer REF1 and the edge of the second reflective sublayer REF2 smoothly connected at the first opening K1 in a single etching process.
  • the edge of the first reflective sublayer REF1 protrudes more than the edge of the second reflective sublayer REF2, or the edge of the second reflective sublayer REF2 protrudes more than the edge of the first reflective sublayer REF1.
  • a conductive layer 400 is formed on the side of the plurality of partition portions 500 away from the substrate 100.
  • the conductive layer 400 is partitioned into a plurality of conductive portions 410 by a plurality of second partition portions 520.
  • the conductive portions 410 are partitioned into at least two first conductive portions 411 by at least one first partition portion 510.
  • the conductive layer 400 also includes a second conductive portion 412 located between two adjacent first partition portions 510 and a second conductive portion 412 located between two adjacent second partition portions 520.
  • a light-emitting unit 300G two adjacent light-emitting devices 310 are connected in series through the first conductive portions 411, that is, the epitaxial portion 3111 of the first electrode 311 of one light-emitting device 310 is electrically connected to the second electrode 313 of another light-emitting device 310 through the first conductive portion 411.
  • a conductive layer 400 is formed by physical vapor deposition.
  • the conductive layer 400 has a Ti/Al/Ti stacked film structure with a thickness of 50/1000/100 angstroms or a TiN/Al/Ti stacked film structure with a thickness of 50/1000/100 angstroms.
  • a planarization layer PLN is formed on the side of the conductive layer 400 away from the substrate 100.
  • the planarization layer PLN has a second opening K2, which exposes at least a portion of the first conductive sub-part 411 that is electrically connected only to the second electrode 313 of the light-emitting device 310.
  • connection electrode 320 is formed on the side of the planarization layer PLN away from the substrate 100, and an encapsulation layer EPL is formed on the side of the connection electrode 320 away from the substrate 100.
  • the connection electrode 320 is electrically connected to the first conductive part 411 through the second opening K2.
  • a protective cover plate CG is provided, and a second buffer layer BUF2 is formed on the protective cover plate CG; a black matrix layer BM is formed on the side of the second buffer layer BUF2 away from the protective cover plate CG, the black matrix layer BM having multiple openings; a semi-transparent and semi-reflective layer 800 is formed within some of the openings of the black matrix layer BM; a color conversion layer 700 is formed on the side of the semi-transparent and semi-reflective layer 800 away from the protective cover plate CG, the color conversion layer 700 being located on the black matrix layer.
  • the color filter substrate is obtained by including a first color conversion section 710, a second color conversion section 720 and a light-transmitting section 730 in the multiple openings of the BM.
  • the color filter substrate is assembled with the substrate shown in Figure 13J, and then a packaging process is performed to prepare the display substrate.
  • the display device may include any device or product with display functionality.
  • the display device may be a smartphone, mobile phone, e-book reader, desktop computer (PC), laptop PC, netbook PC, personal digital assistant (PDA), portable multimedia player (PMP), digital audio player, mobile medical device, camera, wearable device (e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch), television set, etc.
  • PDA personal digital assistant
  • PMP portable multimedia player
  • digital audio player digital audio player
  • mobile medical device camera
  • wearable device e.g., head-mounted device, electronic clothing, electronic bracelet, electronic necklace, electronic accessory, electronic tattoo, or smartwatch
  • television set etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

L'invention concerne un substrat d'affichage. Le substrat d'affichage comprend : un substrat de base ; une couche de circuit d'attaque ; une couche de dispositif électroluminescent, qui comprend une pluralité de dispositifs électroluminescents, chacun des dispositifs électroluminescents comprenant une première électrode, une partie fonctionnelle électroluminescente et une seconde électrode, la couche de dispositif électroluminescent comprenant au moins une unité électroluminescente, chaque unité électroluminescente comprenant au moins deux dispositifs électroluminescents et une électrode de connexion, et les au moins deux dispositifs électroluminescents et l'électrode de connexion étant connectés séquentiellement en série ; et une couche conductrice, qui comprend une partie conductrice, la partie conductrice comprenant au moins deux premières sous-parties conductrices réparties à intervalles. Dans chaque unité électroluminescente, parmi deux dispositifs électroluminescents adjacents et électriquement connectés, la seconde électrode d'un dispositif électroluminescent est électriquement connectée à la première électrode de l'autre dispositif électroluminescent au moyen d'une première sous-partie conductrice, et parmi l'électrode de connexion et le dispositif électroluminescent connecté électriquement à l'électrode de connexion, l'électrode de connexion est électriquement connectée à la seconde électrode du dispositif électroluminescent au moyen d'une première sous-partie conductrice. Le substrat d'affichage comprend en outre une partie de séparation, et au moins une partie de séparation est disposée entre chaque paire de premières sous-parties conductrices adjacentes.
PCT/CN2024/101329 2024-06-25 2024-06-25 Substrat d'affichage et son procédé de fabrication, et appareil d'affichage Pending WO2026000177A1 (fr)

Priority Applications (2)

Application Number Priority Date Filing Date Title
PCT/CN2024/101329 WO2026000177A1 (fr) 2024-06-25 2024-06-25 Substrat d'affichage et son procédé de fabrication, et appareil d'affichage
CN202480001219.5A CN121844737A (zh) 2024-06-25 2024-06-25 显示基板及其制备方法与显示装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/CN2024/101329 WO2026000177A1 (fr) 2024-06-25 2024-06-25 Substrat d'affichage et son procédé de fabrication, et appareil d'affichage

Publications (1)

Publication Number Publication Date
WO2026000177A1 true WO2026000177A1 (fr) 2026-01-02

Family

ID=98220362

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2024/101329 Pending WO2026000177A1 (fr) 2024-06-25 2024-06-25 Substrat d'affichage et son procédé de fabrication, et appareil d'affichage

Country Status (2)

Country Link
CN (1) CN121844737A (fr)
WO (1) WO2026000177A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113728440A (zh) * 2020-03-25 2021-11-30 京东方科技集团股份有限公司 显示基板和显示装置
CN113921570A (zh) * 2020-07-10 2022-01-11 三星显示有限公司 显示设备
US20220328611A1 (en) * 2020-03-23 2022-10-13 Boe Technology Group Co., Ltd. Display substrate, method of manufacturing the same, and display device
CN116209312A (zh) * 2021-11-30 2023-06-02 京东方科技集团股份有限公司 显示基板及其制作方法和显示装置
WO2023123280A1 (fr) * 2021-12-30 2023-07-06 厦门市芯颖显示科技有限公司 Panneau d'affichage, appareil d'affichage et procédé de fabrication d'un panneau d'affichage

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220328611A1 (en) * 2020-03-23 2022-10-13 Boe Technology Group Co., Ltd. Display substrate, method of manufacturing the same, and display device
CN113728440A (zh) * 2020-03-25 2021-11-30 京东方科技集团股份有限公司 显示基板和显示装置
CN113921570A (zh) * 2020-07-10 2022-01-11 三星显示有限公司 显示设备
CN116209312A (zh) * 2021-11-30 2023-06-02 京东方科技集团股份有限公司 显示基板及其制作方法和显示装置
WO2023123280A1 (fr) * 2021-12-30 2023-07-06 厦门市芯颖显示科技有限公司 Panneau d'affichage, appareil d'affichage et procédé de fabrication d'un panneau d'affichage

Also Published As

Publication number Publication date
CN121844737A (zh) 2026-04-10

Similar Documents

Publication Publication Date Title
CN114725150B (zh) Micro-LED器件及微显示屏
CN110783441B (zh) 发光装置
CN109920813B (zh) 制造发光器件封装的方法
CN113725249B (zh) 一种芯片结构、制作方法和显示装置
US20240407201A1 (en) Display substrate and preparation method therefor, and display apparatus
US11581462B2 (en) Display device with metal layer with uneven surface
CN111341943A (zh) 用于制造oled微型显示器的像素的方法
CN114144887A (zh) 改进型有机发光二极管（oled）显示器、设备、系统和方法
CN109962060A (zh) 发光器件封装和使用发光器件封装的显示设备
CN114141934B (zh) 显示面板及其制作方法
CN110504280A (zh) 显示阵列
JP7765624B2 (ja) Ｍｉｃｒｏ－ＬＥＤチップおよびその作製方法ならびに応用
CN118867093B (zh) 微型光电子芯片及其制造方法与应用
CN215815879U (zh) Led芯片结构、显示模组及电子设备
WO2026000177A1 (fr) Substrat d'affichage et son procédé de fabrication, et appareil d'affichage
WO2025246650A1 (fr) Substrat d'affichage et dispositif d'affichage
CN107689383A (zh) 显示装置及其制造方法
CN120113371A (zh) 发光装置、显示装置的制造方法和图像显示装置
WO2023176539A1 (fr) Dispositif électroluminescent, procédé de production de dispositif électroluminescent et dispositif d'affichage d'image
TW202329492A (zh) 發光元件及其應用之顯示裝置
WO2025111922A9 (fr) Substrat d'affichage et procédé de fabrication associé, panneau d'affichage et dispositif d'affichage
US20260047259A1 (en) Display substrate, display panel, and method of manufacturing the display substrate
WO2025059853A9 (fr) Ensemble électroluminescent, son procédé de fabrication, puce électroluminescente et substrat d'affichage
WO2026000178A1 (fr) Substrat d'affichage et son procédé de préparation, et appareil d'affichage
CN121240700A (zh) 显示面板及其制备方法和显示装置

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 24943786

Country of ref document: EP

Kind code of ref document: A1