WO2026007791A1 - Module frontal d'équipement pour essai de dureté de plaquettes - Google Patents

Module frontal d'équipement pour essai de dureté de plaquettes

Info

Publication number
WO2026007791A1
WO2026007791A1 PCT/CN2025/103761 CN2025103761W WO2026007791A1 WO 2026007791 A1 WO2026007791 A1 WO 2026007791A1 CN 2025103761 W CN2025103761 W CN 2025103761W WO 2026007791 A1 WO2026007791 A1 WO 2026007791A1
Authority
WO
WIPO (PCT)
Prior art keywords
wafer
platform
adsorption
efem
hardness testing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/103761
Other languages
English (en)
Chinese (zh)
Inventor
刘泽洋
杨帆
邵先情
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Micson Industrial Automation Co Ltd
Original Assignee
Shanghai Micson Industrial Automation Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Micson Industrial Automation Co Ltd filed Critical Shanghai Micson Industrial Automation Co Ltd
Publication of WO2026007791A1 publication Critical patent/WO2026007791A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/00584—Control arrangements for automatic analysers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N35/0099—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor comprising robots or similar manipulators
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N35/00—Automatic analysis not limited to methods or materials provided for in any single one of groups G01N1/00 - G01N33/00; Handling materials therefor
    • G01N2035/00178—Special arrangements of analysers
    • G01N2035/00188—Special arrangements of analysers the analyte being in the solid state

Definitions

  • This application relates to the technical field of chip testing equipment, and in particular to an EFEM device for wafer hardness testing.
  • wafers are the key substrate for chip manufacturing, and their performance directly affects the quality of the final chip.
  • the requirements for various performance indicators of wafers are becoming increasingly stringent, with hardness being a crucial factor.
  • the industry primarily uses a hardness tester to press the wafer against the probe.
  • this application provides an EFEM device for wafer hardness testing.
  • This application provides an equipment front end module (EFEM) for wafer hardness testing, including a wafer transfer machine and a wafer hardness tester, which are arranged side by side and have interconnected window channels.
  • the wafer transfer machine includes a loadport mechanism for loading wafer cassettes and a robotic arm mechanism for transporting wafers.
  • the wafer hardness tester includes a hardness tester for performing hardness testing on wafers, a moving platform, and a support platform mounted on the moving platform for fixing wafers.
  • the moving platform is configured to drive the support platform to move in a horizontal plane.
  • the wafer cassette is placed on the loadport mechanism, which performs the mapping operation.
  • the robotic arm automatically picks up the wafer and moves it from the window channel towards the wafer hardness tester.
  • a moving component moves the carrier platform closer to the robotic arm mechanism to receive the wafer. After the wafer is placed on the carrier platform, the moving component moves the carrier platform closer to the hardness tester for hardness testing. This process is automated and requires no manual intervention, thereby improving testing efficiency and the accuracy of test results.
  • an air flotation platform is provided below the mobile platform to prevent vibrations from other mechanisms from being transmitted to the mobile platform.
  • the spacing between the air flotation platform and the wafer hardness tester can be configured.
  • the air flotation platform and the wafer hardness tester are spaced apart, further blocking the transmission of vibration.
  • the support platform includes an adsorption device, which includes a disc-shaped adsorption platform with adsorption holes. Multiple sets of adsorption holes are arranged radially along the adsorption platform.
  • a vacuum pump generates negative pressure in the adsorption holes, thereby enabling the adsorption and fixation of wafers. Furthermore, multiple sets of adsorption holes are arranged radially along the adsorption platform, each set equipped with a vacuum pump. By controlling the operation of different vacuum pumps, the adsorption platform can adsorb and fix wafers of different sizes.
  • the adsorption platform is provided with a conversion component, which includes a conversion element.
  • the conversion element is a cylindrical rod-shaped structure and is rotatably connected to the inside of the adsorption platform.
  • the conversion element has a connecting cavity inside and a connecting hole communicating with the connecting cavity.
  • Multiple sets of connecting holes are provided corresponding to the adsorption holes.
  • the multiple sets of connecting holes are spaced apart in the circumference of the conversion element. Rotating the conversion element can make different sets of connecting holes communicate with the adsorption holes.
  • the rotating conversion component allows the connecting holes at different positions on the component to connect with their corresponding adsorption holes. This ensures that the negative pressure pump is always connected to the connecting cavity.
  • different sets of adsorption holes can adsorb the wafers, thereby achieving the adsorption and fixation of wafers of different sizes. This simplifies the equipment structure and reduces equipment costs.
  • the conversion component is divided along its own length to form multiple splicing rods, which correspond to multiple sets of adsorption holes.
  • the conversion component is divided into multiple independently rotatable splicing rods, which allows the operator to make one or two sets of adsorption holes work, or two sets of adsorption holes in different positions work, providing the operator with more options for adsorbing wafers and making it easier for the operator to fix the wafers.
  • the conversion assembly also includes multiple control components, each of which includes a cylindrical connecting tube. One end of the connecting tube is connected to the splicing rod, and the other end extends to the outside of the adsorption platform.
  • the multiple connecting tubes are nested together.
  • the cylindrical connecting cylinders are interlocked, allowing each cylinder to rotate independently.
  • the connecting cylinders extend outside the adsorption platform, allowing operators to adjust the rotation of the splicing rod from outside the platform, facilitating the adjustment of the connecting hole position.
  • multiple control components also include a torsion ring, which is sleeved on the end of the connecting cylinder away from the adsorption platform.
  • the torsion ring is provided with an on/off assembly for connecting or disconnecting adjacent torsion rings.
  • adjacent torsion rings can be connected through the on/off assembly, allowing multiple torsion rings to be interconnected and thus rotate synchronously to facilitate the rotation of multiple splicing rods.
  • the connection between adjacent torsion rings can be disconnected through the on/off assembly.
  • the switching assembly includes a plug rod and a reset member.
  • the torsion ring has a socket.
  • the plug rod slides in the socket along the length of the connecting cylinder. Sliding the plug rod away from the torsion ring allows it to enter the socket on an adjacent torsion ring.
  • the reset member is used to keep the plug rod moving towards the torsion ring.
  • the insertion rod is moved outward from the insertion hole, and the insertion rod is inserted into the insertion hole of the adjacent torsion ring. Then, the insertion rod on the adjacent torsion ring continues to move, and so on, to achieve rapid connection between multiple torsion rings.
  • the number of on/off components corresponding to the splicing rods can be set to multiple sets, and the multiple sets of on/off components are evenly spaced around the rotation axis of the splicing rods.
  • the wafer transfer machine and the wafer hardness tester are placed side by side and have a window channel, which allows the robotic arm to transport the wafer from the wafer transfer machine to the wafer hardness tester for hardness testing. This process does not require human intervention, thus improving wafer testing efficiency.
  • the air flotation platform exists as an independent stand, embedded within the overall equipment, and its position is independent of the equipment, with no interaction between them. This reduces the transmission of vibrations generated by the movement of other mechanisms on the equipment to the air flotation platform, thereby avoiding affecting the test results of the hardness tester.
  • Figure 1 is a schematic diagram of the overall structure of the first embodiment of this application.
  • Figure 2 is a schematic diagram of the structure of the wafer transfer machine according to the first embodiment of this application.
  • Figure 3 is a schematic diagram of the structure of the wafer hardness testing machine according to the first embodiment of this application.
  • Figure 4 is a schematic diagram of the adsorption platform according to the second embodiment of this application.
  • Figure 5 is a schematic diagram of the conversion component structure according to the second embodiment of this application.
  • Figure 6 is an enlarged view of part A in Figure 5 of the second embodiment of this application.
  • FIG. 7 is a schematic diagram of the control component structure of the second embodiment of this application.
  • Figure reference numerals 1. Wafer transfer machine; 11. Loadport mechanism; 12. Wafer aligner calibrator; 13. OCR camera; 14. Robotic arm mechanism; 15. Flexible pad; 16. Window channel; 2. Wafer hardness tester; 21. Air flotation platform; 22. Moving platform; 221. X-axis motion mechanism; 222. Y-axis motion mechanism; 223. Z-axis motion mechanism; 23. Hardness tester; 24. Bearing platform; 241. Adsorption platform; 242. Adsorption hole; 3. Embedding hole; 4. Conversion assembly; 41. Conversion component; 411. Splicing rod; 412. Outer ring; 413.
  • This application discloses an EFEM device for wafer hardness testing.
  • an EFEM device for wafer hardness testing includes two independent devices: a wafer transfer machine 1 and a wafer hardness tester 2.
  • the wafer transfer machine 1 is used to transfer wafer cassettes and calibrate wafer positions, while the wafer hardness tester 2 is used to test wafer hardness.
  • Both devices have identical window channels 16 on their housings, allowing the interiors of the two devices to communicate with each other, facilitating smooth wafer transfer after assembly.
  • the wafer transfer machine 1 and the wafer hardness tester 2 are designed with equal height and width.
  • the operation of the wafer transfer machine 1 and the wafer hardness tester 2 is controlled by a PLC program. After the wafer is positioned by the wafer transfer machine 1, it transports the wafer to the designated position on the wafer hardness tester 2, where the wafer hardness tester 2 performs hardness testing. This process requires no manual intervention, thereby improving testing efficiency and accuracy.
  • the wafer transfer machine 1 includes a loadport mechanism 11 for loading wafer cassettes, a wafer aligner 12 for calibrating wafers, an OCR camera 13 for reading codes, and a robotic arm mechanism 14 for transporting wafers.
  • the OCR camera 13 can move vertically to accommodate wafers of different sizes. In this embodiment, the lifting of the OCR camera 13 is directly driven by a cylinder.
  • the operator places the wafer cassette on the loadport mechanism 11, which performs a mapping operation.
  • the robotic arm mechanism 14 transports the wafer to the wafer aligner 12 for calibration, while the OCR camera 13 reads the codes on the wafer.
  • the wafer can then be transported to the wafer hardness tester 2 by the robotic arm mechanism 14 for wafer hardness testing.
  • a flexible pad 15 is laid around the robotic arm mechanism 14 to prevent the wafer from falling to the ground after it separates from the robotic arm mechanism 14 under special circumstances, thereby reducing the wafer breakage rate.
  • the wafer hardness tester 2 includes an air flotation platform 21, a moving platform 22, and a hardness tester 23.
  • the moving platform 22 and the hardness tester 23 are mounted on the air flotation platform 21.
  • a support platform 24 for fixing the wafer is provided on the moving platform 22.
  • the robotic arm mechanism 14 places the wafer on the support platform 24, where it is fixed, and then the hardness tester 23 tests the wafer hardness.
  • the air flotation platform 21 serves as a vibration isolation device; the model can be ZTP09-06(-K). This reduces the possibility of inaccurate wafer hardness test results due to vibrations transmitted to the wafer from the equipment.
  • the mobile platform 22 is further composed of an X-axis motion mechanism 221, a Y-axis motion mechanism 222, and a Z-axis motion mechanism 223. These motion mechanisms are all mounted on the air-bearing platform 21 to ensure the stability and accuracy of the test.
  • the X, Y, and Z axes all adopt a gear and synchronous belt transmission method and are precisely controlled by servo motors, thereby achieving high-precision movement of the mobile platform 22. This allows the carrying platform 24 to approach or move away from the robotic arm mechanism 14, pick up the wafer, and move the wafer below the hardness tester 23.
  • the X-axis motion mechanism 221, Y-axis motion mechanism 222, and Z-axis motion mechanism 223 can also be linear modules.
  • the carrier platform 24 is rotatably connected to the movable platform 22 to facilitate adjustment of the position of the carrier platform 24. It is limited by a pin locking mechanism (i.e., a pin slidably connected to the movable platform 22 is inserted into a corresponding limiting hole on the carrier platform 24) to improve the stability of the wafer inspection process.
  • a pin locking mechanism i.e., a pin slidably connected to the movable platform 22 is inserted into a corresponding limiting hole on the carrier platform 24
  • Multiple pin locking mechanisms can be evenly arranged around the rotation axis of the carrier platform 24.
  • the X-axis motion mechanism 221 is mounted on the Z-axis motion mechanism 223, and the Y-axis motion mechanism 222 is mounted on the X-axis motion mechanism 221.
  • the support platform 24 includes a rotating plate and an adsorption device. The rotating plate is rotatably connected to the Y-axis motion mechanism 222, and the adsorption device is mounted on the rotating plate for adsorbing wafers. This achieves a rotatable connection between the support platform 24 and the moving platform 22.
  • the adsorption device includes an adsorption mechanism and an adsorption platform 241.
  • the adsorption platform 241 has a disk-shaped structure and is used to place the wafer.
  • Multiple sets of adsorption holes 242 are formed on the adsorption platform 241, arranged radially along the platform.
  • Each set of adsorption holes 242 includes three rows of evenly spaced adsorption holes 242 arranged around the axis of the platform. Each row includes multiple adsorption holes 242 arranged radially along the platform.
  • the adsorption mechanism is configured with two units corresponding to the two sets of adsorption holes 242, and is used to generate negative pressure inside the adsorption holes 242.
  • the adsorption mechanism (not shown in the figures) can be a vacuum pump connected to the adsorption holes 242.
  • a lifting cylinder is provided below the adsorption platform 241, fixedly connected to a rotating plate, and its piston rod is connected to the platform 241.
  • the moving platform 22 moves the adsorption platform 241 closer to the robotic arm mechanism 14, and then the lifting cylinder moves the adsorption platform 241 up to approach the wafer.
  • the wafer is then adsorbed by the vacuum suction cup, completing the wafer pick-up.
  • a support is installed below the air flotation platform 21.
  • An embedding hole 3 is provided on the machine base of the wafer hardness tester 2.
  • the support is embedded in the embedding hole 3 and supported on the ground.
  • the gap between the support and the machine base of the wafer hardness tester 2 is set to prevent the vibration of the wafer hardness tester 2 and other mechanisms from being transmitted to the air flotation platform 21, thereby improving the accuracy of the wafer hardness test results.
  • the implementation principle of an EFEM device for wafer hardness testing is as follows: the robotic arm mechanism 14 and the moving platform 22 cooperate with each other to realize the transfer of wafers from the wafer transfer machine 1 to the wafer hardness tester 2, realize automatic wafer calibration and automatic wafer hardness testing, thereby improving the efficiency and accuracy of wafer testing.
  • the difference between this embodiment and Embodiment 1 lies in the structure of the adsorption platform 241.
  • the adsorption mechanism is configured as a set.
  • a conversion component 4 is provided on the adsorption platform 241.
  • multiple sets of adsorption holes 242 are defined as the first hole group, the second hole group, the third hole group, ..., the Nth hole group.
  • the conversion component 4 is used to connect the adsorption mechanism to any one of the hole groups. This simplifies the equipment structure and reduces equipment costs.
  • the conversion assembly 4 includes a conversion element 41, which is cylindrical in shape and arranged along the direction of the multiple sets of adsorption holes 242, i.e., radially along the adsorption platform 241.
  • a rotating cavity 43 is provided on the adsorption platform 241, and the conversion element 41 is rotatably connected to the rotating cavity 43 around its own axis, with the sidewall of the conversion element 41 fitting against the sidewall of the rotating cavity 43.
  • a connecting cavity 42 is provided inside the conversion element 41.
  • Two sets of connecting holes 45 are provided on the sidewall of the conversion element 41 corresponding to the two sets of adsorption holes 242 and radially along the adsorption platform 241.
  • the connecting holes 45 communicate with the interior of the connecting cavity 42, and the two sets of connecting holes 45 are located on different generatrices of the conversion element 41. That is, under normal conditions, only one set of connecting holes 45 can communicate with the adsorption holes 242, while the other set of connecting holes 45 is staggered with the adsorption holes 242.
  • a negative pressure chamber 46 is provided below the adsorption platform 241.
  • the adsorption mechanism communicates with the negative pressure chamber 46 to generate negative pressure within the chamber.
  • One side of the connecting chamber 42 is connected to the negative pressure chamber 46, generating negative pressure within the connecting chamber 42, which in turn generates negative pressure in the adsorption holes 242 to achieve wafer adsorption.
  • rotating the conversion component 41 allows the connecting holes 45 at different positions to align with the adsorption holes 242, thereby enabling the adsorption of wafers of different sizes.
  • the conversion member 41 includes an inner ring 413 and an outer ring 412.
  • the outer ring 412 is sleeved outside the inner ring 413 and spaced apart from the inner ring 413 to form a connecting cavity 42.
  • a sealing plate 414 is welded to the side of the conversion member 41 away from the negative pressure cavity 46 to seal the end of the connecting cavity 42 away from the negative pressure cavity 46, and at the same time to achieve a fixed connection between the inner ring 413 and the outer ring 412.
  • a long strip rib plate arranged along the length direction of the conversion member 41 can be provided between the inner ring 413 and the outer ring 412, with the two sides of the rib plate welded to the inner ring 413 and the outer ring 412 respectively.
  • the conversion component 41 is divided along its length to form multiple splicing rods 411 corresponding to multiple sets of adsorption holes 242.
  • the relative positions of the connecting holes 45 on the conversion component 41 can be changed, thereby allowing multiple sets of connecting holes 45 to connect with multiple sets of adsorption holes 242 simultaneously, or allowing a single set of connecting holes 45 to connect with a single set of adsorption holes 242, providing workers with more ways to fix wafers.
  • the conversion assembly 4 also includes control components 44.
  • Multiple control components 44 are provided corresponding to the splicing rods 411, used to drive the splicing rods 411 to rotate.
  • Multiple control components 44 are provided corresponding to the splicing rods 411.
  • Each control component 44 includes a connecting cylinder 441 and a torque ring 442.
  • the connecting cylinder 441 has a cylindrical structure and is coaxially arranged with the splicing rods 411. One end of the connecting cylinder 441 is welded to the splicing rod 411, and the other end extends to the outside of the adsorption platform 241.
  • the connecting cylinder 441 furthest from the negative pressure chamber 46 is sleeved on the outside of the connecting cylinder 441 closest to the negative pressure chamber 46.
  • Multiple control components 44 are sequentially defined as the first control component 44, the second control component 44, the third control component 44, ..., the Nth control component 44, along the radial direction of the adsorption platform 241 from the side furthest from the negative pressure chamber 46 to the side furthest from the negative pressure chamber 46.
  • splicing rods 411 in this direction are sequentially defined as the first splicing rod 411, the second splicing rod 411, the third splicing rod 411, ..., the Nth splicing rod 411.
  • One end of the connecting sleeve 441 of the first control component 44 is coaxially welded to the splicing rod 411 furthest from the negative pressure chamber 46, and the other end extends to the outside of the adsorption platform 241.
  • the connecting sleeve 441 of the second control component 44 passes through the connecting sleeve 441 and the first splicing rod 411 of the first control component 44, and is coaxially welded to the second splicing rod 411, and so on, to complete the connection between the connecting sleeve 441 of the Nth control component 44 and the Nth splicing rod 411.
  • Torque ring 442 is sleeved on the end of connecting cylinder 441 away from negative pressure chamber 46, and the outer walls of multiple torque rings 442 are flush. Rotating torque ring 442 can drive connecting cylinder 441 to rotate, thereby driving splicing rod 411 to rotate, thus realizing the adjustment of the rotation of splicing rod 411.
  • a switching component 5 is provided on the torsion ring 442.
  • the switching component 5 includes a rod 51.
  • the torsion ring 442 has a through hole 53 extending along its own axis.
  • the rod 51 slides through the through hole 53 in a direction parallel to the axis of the torsion ring 442. Both ends of the rod 51 are flush with the end faces of the torsion ring 442. Moving the rod 51 away from the adsorption platform 241 allows it to be inserted into the through hole 53 on an adjacent torsion ring 442, thus driving the rods 51 on the adjacent torsion rings 442 to move.
  • This process connects multiple torsion rings 442, allowing workers to simultaneously rotate multiple splicing rods 411, further providing a way for workers to adjust the splicing rods 411.
  • the on/off assembly 5 also includes a reset member 52, which is used to apply a force to the insertion rod 51 to move the insertion rod 51 toward the adsorption platform 241, so that the insertion rod 51 can automatically reset after the worker stops applying force to the insertion rod 51, thereby disconnecting the connection between the multiple torsion rings 442.
  • a reset member 52 which is used to apply a force to the insertion rod 51 to move the insertion rod 51 toward the adsorption platform 241, so that the insertion rod 51 can automatically reset after the worker stops applying force to the insertion rod 51, thereby disconnecting the connection between the multiple torsion rings 442.
  • the connecting holes 45 on the multiple splicing rods 411 are evenly spaced along the circumference of the splicing rods 411. Therefore, in this embodiment, multiple sets of on/off components 5 are evenly spaced along the circumference of the torsion rings 442.
  • there are three splicing rods 411 and the included angle between the connecting holes 45 on two adjacent splicing rods 411 is 120°. Therefore, in this embodiment, three sets of on/off components 5 are arranged along the circumference of the torsion rings 442, so that the on/off components 5 on two adjacent torsion rings 442 can correspond regardless of whether the connecting hole 45 is connected to the adsorption hole 242.
  • the simultaneous connection of multiple insertion rods 51 to adjacent torsion rings 442 can improve the stability of the torsion rings 442 after connection.
  • a control mechanism 6 is provided on the adsorption platform 241, located between the torsion ring 442 and the adsorption platform 241.
  • the control mechanism 6 is used to move the insertion rod 51.
  • the control mechanism 6 includes a control ring 61 rotatably connected to the adsorption platform 241.
  • the control ring 61 has a cylindrical structure, with one end rotatably connected to the adsorption platform 241 around its own axis, and the other end abutting against the torsion ring 442.
  • Three control rods 62 are provided on the control ring 61 corresponding to the insertion rod 51.
  • the control rods 62 are slidably connected to the control ring 61. Sliding the control rods 62 allows them to be inserted into the insertion holes 53, thus moving the insertion rod 51. In this state, rotating the control ring 61 can drive multiple torsion rings 442 to rotate synchronously.
  • the control mechanism 6 further includes a linkage ring 63, which is located on the side of the control lever 62 away from the torque ring 442.
  • the linkage ring 63 is sleeved on the control ring 61 and can slide in a direction parallel to the sliding direction of the control lever 62.
  • the end of the control lever 62 near the linkage ring 63 is welded to the linkage ring 63. Moving the linkage ring 63 can drive multiple control levers 62 to move, facilitating the adjustment of the positions of multiple control levers 62 by the operator.
  • the control mechanism 6 further includes a snap-fit assembly 64, which includes a snap-fit ring 641 and a snap-fit rod 642.
  • the snap-fit rod 642 is radially welded to the outer wall of the linkage ring 63.
  • the snap-fit ring 641 is sleeved on the control ring 61 and is located on the side of the linkage ring 63 away from the adsorption platform 241.
  • the snap-fit ring 641 has a snap-fit groove 643, which includes a circumferential portion and an axial portion, both of which are rectangular grooves.
  • the axial portion is arranged along the axial direction of the connecting ring, and the circumferential portion is arranged along the circumference of the snap-fit ring 641.
  • the ends of the axial portion and the circumferential portion are connected to each other to form an L-shaped groove.
  • An opening is provided on the side of the axial portion near the adsorption platform 241. Moving the linkage ring 63 towards the snap-fit ring 641 can drive the snap-fit rod 642 into the axial portion.
  • rotating the locking ring 641 allows the locking rod 642 to enter the circumferential part, thereby limiting the movement of the linkage ring 63. This allows the operator to control multiple torque rings 442 simultaneously without continuously applying force to the linkage ring 63, making it convenient for the operator to rotate multiple torque rings 442.
  • the locking assembly 64 also includes an elastic element 65, which is used to maintain the positive rotation tendency of the locking ring 641.
  • the elastic element 65 is a spiral spring, with one end welded to the control ring 61 and the other end welded to the locking ring 641. Under the action of the elastic element 65, the locking rod 642 can be stably positioned in the circumferential portion, improving the stability of the limiting of the linkage ring 63.
  • a guide slope 66 is provided on the side wall of the axial portion near the circumferential portion.
  • the guide slope 66 is inclined in a direction parallel to the sliding direction of the linkage ring 63, from the side away from the adsorption platform 241 to the side near the adsorption platform 241 and away from the axial portion.
  • the linkage ring 63 moves towards the locking ring 641
  • the locking ring 641 rotates automatically under the action of the guide slope 66, guiding the locking rod 642 into the axial portion.
  • the elastic element 65 drives the locking ring 641 to rotate automatically, causing the locking rod 642 to enter the circumferential portion.
  • the adsorption platform 241 is equipped with a locking assembly 7 for limiting the rotation of the splicing rod 411.
  • the locking assembly 7 includes a limiting rod 71, and a sliding groove is formed on the side wall of the rotating cavity 43.
  • the limiting rod 71 is slidably connected to the sliding groove along the radial direction of the conversion member 41.
  • a limiting groove 73 is formed on the outer side wall of the outer ring 412 corresponding to the limiting rod 71.
  • the sliding limiting rod 71 can be inserted into the limiting groove 73, thereby limiting the rotation of the conversion member 41 and improving the stability of the connection between the connecting hole 45 and the adsorption hole 242.
  • the locking assembly 7 also includes a compression member 72, which is used to keep the limiting rod 71 moving towards the splicing rod 411.
  • the compression member 72 is a compression spring, which is located in the sliding groove and is welded to the limiting rod 71 at one end and to the side wall of the sliding groove at the other end.
  • a spherical surface is provided at one end of the limiting rod 71 near the splicing rod 411, so that when the splicing rod 411 is subjected to sufficient force, the limiting rod 71 can disengage from the limiting groove 73 under the action of the spherical surface, making it convenient for the operator to rotate the splicing rod 411, and at the same time, it can be stably in a certain state when there is no external force.
  • a bevel gear set 8 is provided on the adsorption platform 241.
  • the bevel gear set 8 includes a large bevel gear ring 81 rotatably sleeved on the outside of the adsorption platform 241 and a small bevel gear 82 fixedly sleeved on the control ring 61.
  • the small bevel gear 82 meshes with the large bevel gear ring 81, so that the large bevel gear ring 81 can synchronously drive the multiple small bevel gears 82 to rotate, thereby realizing the synchronous adjustment of the rotation of multiple conversion components 41.
  • the implementation principle of the EFEM device for wafer hardness testing in this application embodiment is as follows: by rotating the conversion component 41, the negative pressure chamber 46 can be connected with the adsorption holes 242 at different positions, thereby realizing the adsorption of wafers with different gears. At the same time, there is no need to set up multiple adsorption mechanisms, which simplifies the equipment structure and reduces the equipment cost.

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  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Robotics (AREA)
  • Engineering & Computer Science (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)

Abstract

La présente invention se rapporte au domaine des testeurs de puces, et concerne en particulier un module frontal d'équipement pour essai de dureté de plaquettes, comprenant une machine de transfert de plaquettes et une machine d'essai de dureté de plaquettes, la machine de transfert de plaquettes et la machine d'essai de dureté de plaquettes étant placées côte à côte, et la machine de transfert de plaquettes et la machine d'essai de dureté de plaquettes étant pourvues de canaux de transparence communiquant entre eux ; la machine de transfert de plaquettes comprend un mécanisme de chargement pour charger des cassettes de plaquettes et un mécanisme de manipulation pour manipuler les plaquettes ; et la machine d'essai de dureté de plaquettes comprend un duromètre pour effectuer des essais de dureté sur les plaquettes, une plateforme mobile et une plateforme de support montée sur la plateforme mobile et utilisée pour fixer les plaquettes, la plateforme mobile étant étant en mesure d'entraîner la plateforme de support à se déplacer dans un plan horizontal. La présente demande a pour effet d'améliorer l'efficacité des essais de plaquettes.
PCT/CN2025/103761 2024-07-05 2025-06-26 Module frontal d'équipement pour essai de dureté de plaquettes Pending WO2026007791A1 (fr)

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