WO2026009882A1 - Matériau de liaison par frittage en forme de feuille - Google Patents

Matériau de liaison par frittage en forme de feuille

Info

Publication number
WO2026009882A1
WO2026009882A1 PCT/JP2025/023596 JP2025023596W WO2026009882A1 WO 2026009882 A1 WO2026009882 A1 WO 2026009882A1 JP 2025023596 W JP2025023596 W JP 2025023596W WO 2026009882 A1 WO2026009882 A1 WO 2026009882A1
Authority
WO
WIPO (PCT)
Prior art keywords
metal
sheet
bonding material
shaped
material according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/JP2025/023596
Other languages
English (en)
Japanese (ja)
Inventor
圭祐 熊谷
光市 武田
信邦 深江
香織 宮原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nihon Superior Sha Co Ltd
Tomoegawa Corp
Original Assignee
Nihon Superior Sha Co Ltd
Tomoegawa Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nihon Superior Sha Co Ltd, Tomoegawa Corp filed Critical Nihon Superior Sha Co Ltd
Publication of WO2026009882A1 publication Critical patent/WO2026009882A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/05—Metallic powder characterised by the size or surface area of the particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
    • B22F1/102—Metallic powder coated with organic material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
    • B22F7/08—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools with one or more parts not made from powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof

Definitions

  • the present invention relates to a sheet-shaped sintered bonding material and electrical equipment, electronic equipment, semiconductor components, and heat dissipation components that use the sheet-shaped sintered bonding material.
  • a known method for joining semiconductor chips and heat dissipation components to lead frames and insulated circuit boards involves placing a sheet of joining material, rather than a paste, between the substrate and the semiconductor chip or heat dissipation component and sintering the material to achieve this, as this method does not require a printing process and makes joining easier, regardless of the size of the semiconductor chip or heat dissipation component.
  • the bonding material is known, for example, as a heating bonding material (Patent Document 1), which has a metal layer formed from a bulk metal material and metal bonding layers laminated on both sides of the metal layer by coating or supporting, and the bulk material is a metal element selected from copper, silver, gold, platinum, and palladium, or an alloy composed of at least two or more metals selected from copper, silver, platinum, and palladium, and the bulk material is a foil, metal mesh, or porous metal body, and the metal layer is coated with a polymer dispersant and formed into a film from a dispersion solution in which metal fine particles made of at least one type selected from the group consisting of metal elements, alloys, and metal compounds are dispersed in an organic solvent, and the average primary particle size of the metal fine particles is 5 to 500 nm.
  • the sheet-like bonding material is formed from a layer of polymer dispersant coated on a metal layer or a bonding layer in which metal nanoparticles are dispersed.
  • the sheet-like bonding material has no tackiness, so the substrate and electronic components such as semiconductor chips to be bonded move to a location other than their original position (so-called misalignment).
  • misalignment if the substrate product is sintered as is, it will not be able to exhibit the desired performance such as electrical conductivity and thermal conductivity, causing it to become defective and reducing productivity.
  • Tackiness refers to the ability of a material to stick to an adherend (attachment surface) in a short time when lightly touched, and refers to the property of having a sticky or tacky surface. In this invention, it refers to the property of utilizing the adhesiveness and stickiness of the sheet-shaped sintered bonding material to bond and fix components to be joined (joining components) that make up electrical equipment, electronic devices, semiconductor components, heat dissipation components, etc., by contacting or applying pressure at room temperature or when heated.
  • the present invention solves the above-mentioned problems by specifically providing a sheet-shaped sintered bonding material that has excellent tackiness to bonding materials that make up electrical equipment, electronic devices, semiconductor components, heat dissipation components, etc., and that allows various components to be stably fixed in the desired position due to this tackiness, preventing problems caused by misalignment and contributing to improved productivity.
  • the present invention also provides a sheet-shaped sintered bonding material, as well as bonding portions, electrical equipment, electronic devices, semiconductor components, and heat dissipation components that use this sheet-shaped sintered bonding material.
  • the first embodiment of the present invention includes a metal layer made of a plate-shaped or foil-shaped metal, and adhesive layers having tackiness, each containing metal nanoparticles and a solvent, on both sides of the metal layer;
  • the metal nanoparticles are composite metal nanoparticles in which an organic coating layer made of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms is formed around a metal core having an average particle size of 1 to 200 nm and made of an aggregate of metal atoms.
  • the solvent may include one or more highly viscous solvents.
  • the content of the highly viscous solvent in the adhesive layer may be 0.1 to 20.0% by mass.
  • the metal layer may have a thickness of 10 to 1000 ⁇ m, and the adhesive layer may have a thickness of 20 to 100 ⁇ m.
  • the metal atoms constituting the metal nanoparticles may be a single metal such as copper, gold, platinum, palladium, or silver, or a composite thereof.
  • the adhesive layers on both sides of the metal layer may be capable of fixing the joining member to the sheet-shaped sintered joining material after mounting the joining member to the sheet-shaped sintered joining material.
  • the adhesive layer may include metal nanoparticles, a filler, a solvent, and a dispersant.
  • the metal layer may be a metal layer whose both surfaces or one surface thereof is surface-treated with one or more metals selected from the group consisting of copper, gold, silver, platinum and palladium, or composites thereof.
  • a second embodiment of the present invention is a joint bonded using the sheet-shaped sintered bonding material, or an electrical device, electronic device, semiconductor component, or heat dissipation component that uses the joint.
  • the sheet-shaped sintered bonding material of the present invention has superior tackiness to the components (bonding members) to be bonded that make up electrical equipment, electronic devices, semiconductor components, heat dissipation components, etc.
  • the tacky sheet-shaped sintered bonding material firmly adheres and fixes the bonding members to the sheet-shaped bonding material in the pre-bonding process, preventing defects due to misalignment. Since the bonding members do not move during the process, handling and productivity such as yield can be improved, and electrical equipment, electronic devices, semiconductor components, heat dissipation components, etc. with the desired performance can be efficiently manufactured.
  • Test Example 3 the temporarily bonded samples obtained in Test Example 1 were baked and bonded, and then the samples were embedded in resin, polished, and the bonded cross sections were observed. This is an SEM photograph showing the results.
  • the sheet-shaped sintered bonding material of the present invention comprises a metal layer made of a plate-shaped or foil-shaped metal;
  • the bonding material has adhesive layers having tackiness, containing metal nanoparticles and a solvent, on both sides of the metal layer.
  • the plate-like or foil-like metal constituting the metal layer refers to a metal member having a thickness of 10 ⁇ m or more.
  • the plate-like or foil-like metal preferably has a uniform thickness, but does not necessarily have to have a uniform thickness.
  • the plate- or foil-like metal may have holes formed therein, as in a punched metal, if necessary.
  • holes are present or the metal is a mesh, there are no limitations on the size or number of the holes, and in the case of a mesh, there are no limitations on the thickness of the metal wire or the size of the openings in the mesh, as long as the effects of the present invention are achieved.
  • the foil- or plate-like metal does not need to be solid, and may be made of woven wire metal or short metal fibers, depending on the application.
  • the thickness of the metal layer is preferably 10 to 1000 ⁇ m, more preferably 10 to 100 ⁇ m, even more preferably 20 to 70 ⁇ m, and particularly preferably 20 to 50 ⁇ m.
  • the area of the metal layer is not particularly limited and can be adjusted appropriately depending on the area of components required for joining in electrical equipment, electronic devices, semiconductor components, heat dissipation components, etc.
  • Materials for the metal layer include, but are not limited to, iron, copper, silver, gold, aluminum, nickel, platinum, palladium, alloys of two or more of these, and stainless steel.
  • Either or both surfaces of the metal layer may be surface-treated with one or more metals selected from the group consisting of copper, gold, silver, platinum and palladium, or composites thereof.
  • the surface treatment include dry plating such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), wet plating such as electroplating and electroless plating, chemical conversion treatment (fermite), anodizing treatment (alumite), hot-dip galvanization, sputtering, etc., and can be appropriately selected within the range in which the effects of the present invention are achieved.
  • PVD physical vapor deposition
  • CVD chemical vapor deposition
  • wet plating such as electroplating and electroless plating
  • chemical conversion treatment fermite
  • anodizing treatment alumite
  • hot-dip galvanization hot-dip galvanization
  • sputtering etc.
  • the thickness of the thin film is not particularly limited.
  • a layer (adhesive layer) of a desired thickness is formed on both sides of the metal layer, and when the surface of this adhesive layer is brought into contact with or pressurized by a joining member that constitutes an electrical device, an electronic device, a semiconductor component, a heat dissipation component, etc. at room temperature or when heated, these joining members can be adhered at the desired position and fixed so as not to move.
  • a joining member that constitutes an electrical device, an electronic device, a semiconductor component, a heat dissipation component, etc. at room temperature or when heated
  • these joining members can be adhered at the desired position and fixed so as not to move.
  • the above-mentioned process of mounting a joining member while contacting or applying pressure at room temperature or at elevated temperature is referred to as "mounting."
  • the heating temperature is not particularly limited as long as it is a temperature at which the adhesive layer exhibits tackiness.
  • the degree of contact and pressure is not particularly limited as long as the surface of the adhesive layer can be adhered to the surface of the joining member without moving.
  • An example of a bonding method for bonding an object to be bonded to a substrate includes the following steps: First step: The sheet-like sintered bonding material of the present invention is attached to a predetermined position on a substrate. Second step: Then, a member to be joined, such as a chip, is mounted on the sheet-like sintered joining material of the present invention. Third step: After mounting the bonding member, the substrate, the sheet-like sintered bonding material of the present invention, and the objects to be bonded are temporarily fixed together by applying desired pressure and heat. The temporary fixing allows the sheet-like sintered bonding material of the present invention to exhibit tackiness, and this provides the excellent effect of preventing displacement of the bonded objects during subsequent handling and other processes.
  • the tackiness may be "hot tackiness,” in which adhesiveness develops when heated even if the material has no tackiness at room temperature.
  • the sheet-shaped sintered bonding material can be easily handled even if it has no tackiness at room temperature.
  • the sheet-shaped sintered joining material that has been adhered and fixed (also called temporary joining) to the joining member as described above can also be peeled off if necessary.
  • the presence or absence of tackiness is determined by, for example, placing a 10mm x 10mm sheet-shaped sintered bonding material on a 50mm x 50mm, 1mm thick metal plate of copper, aluminum, etc., and then placing another 10mm x 10mm, 1mm thick metal plate of copper, aluminum, etc. on top of that, and applying pressure at room temperature or while heating as described above. If the plate does not fall off when turned upside down, it is evaluated as having tackiness or hot tackiness.
  • the sheet-shaped sintered bonding material of the present invention has tackiness as described above, and thus can stably fix various parts at desired positions.
  • the strength of this fixing is not particularly limited as long as it does not cause the components to move away from their original positions (misalignment). For example, when a shear test piece conforming to JIS Z 3198-5 is made using the sheet-like sintered bonding material of the present invention and the shear strength is measured, if the strength is 0.01 MPa or more, the components constituting electrical equipment, electronic equipment, semiconductor parts, and heat dissipation parts can be stably fixed.
  • the metal nanoparticles contained in the adhesive layer are composite metal nanoparticles in which an organic coating layer made of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms is formed around a metal core made of an aggregate of metal atoms with an average particle size of 1 to 200 nm.
  • the metal atoms that make up the metal nanoparticles may be a single metal such as copper, gold, platinum, palladium, or silver, or a composite thereof.
  • Aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms include, but are not limited to, saturated fatty acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, and lauric acid; dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, fumaric acid, and maleic acid; and tricarboxylic acids such as aconitic acid.
  • saturated fatty acids such as formic acid, acetic acid, propionic acid, butyric acid, valeric acid, caproic acid, enanthic acid, caprylic acid, pelargonic acid, capric acid, and lauric acid
  • dicarboxylic acids such as oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, fumaric
  • the particle size of the metal nanoparticles can be determined by, for example, measuring the diameter under an electron microscope and calculating the average particle size.
  • the metal nanoparticles can be produced based on methods described in, for example, Patent No. 4680313, Patent No. 5256281, Patent No. 5306322, and Patent No. 5398935.
  • the two adhesive layers formed on the surface of the metal layer may contain the same metal nanoparticles, or may contain metal nanoparticles of different types or sizes.
  • the metal nanoparticles contained in one adhesive layer may be of one type, or may be a mixture of two or more types.
  • the two adhesive layers may contain only composite silver nanoparticles, or one adhesive layer may contain composite silver nanoparticles and the other adhesive layer may contain composite metal nanoparticles other than silver, or one adhesive layer may contain composite silver nanoparticles and the other adhesive layer may contain composite silver nanoparticles and composite metal nanoparticles other than silver.
  • composite metal nanoparticles made of the same material may contain particles of two or more different sizes.
  • the solvent contained in the adhesive layer is a highly viscous solvent that exhibits tackiness due to the inclusion of the metal nanoparticles, and therefore evaporates easily during sintering, which has the advantage of reducing the occurrence of voids in the bonding layer formed by sintering the metal nanoparticles.
  • the highly viscous solvent is not limited as long as it does not inhibit the sintering of the metal nanoparticles, and examples thereof include terpenes, polyols, etc.
  • terpenes include terpineol, Tersorb THA90, and isobornylcyclohexanol.
  • polyols include ethylene glycol, glycerin, triethanolamine, and polyols containing fine particles of polyethylene glycol, styrene-acrylonitrile copolymer, polyurea, and the like, and among these, isobornylcyclohexanol is preferred.
  • the highly viscous solvent used as the solvent may be one type or a mixture of two or more types.
  • the content of the highly viscous solvent in the adhesive layer is preferably 0.1 to 20.0% by mass, and more preferably 0.1 to 5.0% by mass.
  • the content of the highly viscous solvent can be calculated, for example, by subtracting the amount of solvent volatilized during drying from the content of the highly viscous solvent in a paste containing metal nanoparticles and a solvent used to form an adhesive layer.
  • a low-viscosity solvent may be used in addition to the high-viscosity solvent to adjust the viscosity.
  • the low-viscosity solvent may be any solvent that can adjust the viscosity when mixed with the high-viscosity solvent, and there are no particular restrictions on the type or content.
  • the adhesive layer may contain a filler and a dispersant.
  • the filler is not particularly limited as long as it can be used in conductive pastes, etc., and examples thereof include particulate metal fillers of one or more types selected from gold, silver, copper, platinum, and palladium.
  • the dispersant is not particularly limited as long as it can be used in conductive pastes and the like, and examples thereof include saturated fatty acids having 4 to 18 carbon atoms, such as butanoic acid, hexanoic acid, octanoic acid, decanoic acid, lauric acid, myristic acid, pentadecylic acid, palmitic acid, and stearic acid; unsaturated fatty acids having 14 to 18 carbon atoms, such as myristoleic acid, palmitoleic acid, oleic acid, elaidic acid, linoleic acid, and linolenic acid; aliphatic amines, such as octylamine, laurylamine, oleylamine, myristylamine, and dodecyldimethylamine; tertiary amines, such as didodecyldimethylamine and trioctylamine; aromatic amines, such as naphthalenediamine;
  • the adhesive layer may also contain a binder such as a solid solvent or a polymer.
  • a binder such as a solid solvent or a polymer.
  • the type and amount of the binder such as the solid solvent or polymer, as long as the adhesive layer can exhibit the desired effect.
  • composition of the metal nanoparticles, filler, and dispersant in the adhesive layer there are no particular limitations on the composition of the metal nanoparticles, filler, and dispersant in the adhesive layer, as long as the content is such that the joining member can be fixed after mounting, depending on the type of material of each component.
  • the thickness of the adhesive layer may be adjusted depending on the purpose of sintering and is not particularly limited. However, from the viewpoint of easily fixing bonding members constituting, for example, electrical equipment, electronic equipment, semiconductor parts, heat dissipation parts, etc., at desired positions, the thickness is preferably 20 to 100 ⁇ m, more preferably 20 to 70 ⁇ m.
  • the thickness of the adhesive layer provided on one side of the metal layer may be constant or may have thin and thick portions, as long as the effects of the present invention are obtained. For example, the thickness may be gradually increased from one direction to the other.
  • the thicknesses of the adhesive layers provided on both sides of the metal layer may be the same or different, as long as the effects of the present invention can be obtained.
  • the sheet-shaped sintered bonding material of the present invention firmly bonds and fixes the bonding members, so that as long as the adhesive layer thickness is within the above-mentioned range, the bonding strength will not decrease and a certain sufficient strength can be exerted.
  • the sheet-shaped sintered bonding material of the present invention can be produced, for example, by adhering a mixture containing the metal nanoparticles and the solvent, and if necessary the filler and dispersant, to both sides of a plate- or foil-shaped metal that will become the metal layer using a known method to form an adhesive layer, and, if necessary, drying the adhesive layer until the solvent content reaches the desired amount.
  • the method for mixing the metal nanoparticles with the solvent is not particularly limited, as long as it allows mixing of the metal nanoparticles.
  • Methods for applying the mixture to both sides of a metal plate or foil include, but are not limited to, screen printing, spray coating, roll coating, spin coating, dispensing, and inkjet methods.
  • the adhesive layers on both sides of the metal layer contain metal nanoparticles, resulting in excellent physical properties such as electrical conductivity, thermal conductivity, bonding characteristics, and bonding reliability.
  • the sheet-shaped sintered bonding material of the present invention obtained in the manner described above can be used to bond various components (bonding members) that constitute electrical equipment, electronic equipment, semiconductor components, or heat dissipation components.
  • the components to be joined are not particularly limited as long as they are components that make up electrical equipment, electronic devices, semiconductor components, or heat dissipation components.
  • the joining method may be the same as that of conventional sheet-like joining materials.
  • one adhesive layer of the sheet-like sintered bonding material of the present invention is adhered to the surface of the member A to be joined, and then another member B to be joined is adhered to the other adhesive layer to combine components with a laminated structure consisting of member A, sheet-like sintered bonding material, and member B.
  • the metal nanoparticles contained in the adhesive layer are sintered, and a metal sintered product is formed and bonded.
  • the sintering conditions such as temperature and time are not particularly limited as long as the temperature allows the metal nanoparticles used to be fired.
  • the part after bonding has a layered structure of component A - bonding layer made of sintered metal nanoparticles - metal layer - bonding layer made of sintered metal nanoparticles - component B. Both bonding layers have a uniform thickness and few voids, allowing components A and B to be firmly bonded together without misalignment. Furthermore, the part has a bonding layer made of uniform metal nanoparticles, and there is very little void or crack occurrence in the bonding layer or bonding interface, which can contribute to the creation of highly reliable bonds and completed parts.
  • Metal paste 1 (Commercially available product, a paste-like composition containing composite silver nanoparticles (average particle size of metal cores: 1 to 200 nm, material of the organic coating layer covering the metal cores: aliphatic carboxylic acid having 1 to 10 or 12 carbon atoms), solvent (isobornylcyclohexanol), filler (silver-coated copper filler with a particle size of 5 ⁇ m), and dispersant (linoleic acid).
  • Metal paste 1 copper foil, thickness: 30 ⁇ m
  • Example 1 [Method for manufacturing sheet-shaped sintered bonding material 1] Using the materials shown in Table 1, a sheet-shaped sintered bonding material 1 was produced. That is, the metal paste 1 was applied to both sides of the metal foil 1 so that the thickness of the adhesive layer after drying would be 50 ⁇ m, and the resulting mixture was placed in a high-temperature incubator set at 100° C. and dried for 20 minutes. The total thickness was 130 ⁇ m and the solvent content was 2% by mass. The coating method used was screen printing, a #120 metal mesh (opening ratio 41%, wire diameter 23 ⁇ m, mesh thickness 41 ⁇ m), and a squeegee with A hardness 80.
  • a baking device upper and lower pulse heat unit bonding device manufactured by Nippon Avionics Co., Ltd.
  • test piece B was held so that test piece A was facing downwards, and it was confirmed that the bonded state was maintained and test piece A did not peel off or fall off even when it was gently shaken up and down and side to side.
  • Test Example 2 Evaluation of Sheet-like Bonding Material Samples: (2) Measurement of Shear Strength Shear strength was measured in accordance with JIS Z 3198-5. Specifically, the test piece prepared in Test Example 1 was used as a No. 2 shear test piece in accordance with JIS Z 3198-5, and the shear strength was measured using a TENSILON strength tester manufactured by A&D Co., Ltd., and a shear strength of 0.1 MPa (2 N) was confirmed. It was also confirmed by optical microscopy that there were no voids on the fracture surface of the sample for which the shear strength was measured. Therefore, it is clear that the sheet-shaped sintered joining material of the present invention has excellent tackiness to the joining members, and this tackiness allows various parts to be stably fixed in desired positions in a temporarily joined state.
  • Test Example 3 Confirmation of Bonding Strength
  • the temporarily bonded samples obtained in Test Example 1 were bonded using a baking device (upper and lower pulse heat unit bonding device) manufactured by Nippon Avionics Co., Ltd., at a temperature of 300°C, a pressure of 10 MPa, and a holding time of 180 seconds.
  • Examples 2 to 4 Three types of sheet-shaped sintered bonding materials were produced in the same manner as in Example 1, except that the thicknesses of bonding layers 1 and 2 after drying were changed as shown in Table 2.
  • test piece A and test piece B were temporarily bonded in the same manner as in Test Example 1, except that the sheet-like sintered bonding materials obtained in Examples 2 to 4 were used.
  • the sheet-like sintered bonding materials obtained in Examples 2 to 4 were used for the three types of temporarily bonded materials obtained, even when test piece B was held with test piece A facing downwards and gently shaken up and down and side to side, the bonded state was maintained and test piece A did not peel off or fall off, confirming that all of the sheet-like sintered bonding materials obtained in Examples 2 to 4 had tackiness.
  • the three types of temporarily bonded articles were bonded using a baking device (upper and lower pulse heat unit bonding device) manufactured by Nippon Avionics Co., Ltd., at a temperature of 300°C, a pressure of 10 MPa, a bonding time of 180 seconds, and a holding time of 150 seconds.
  • An arbitrary portion of the resulting sheet-like bonded product was selected and cut out as a No. 2 shear test piece in accordance with JIS Z 3198-5, and the shear strength was measured using a TENSILON strength tester manufactured by A&D Co., Ltd., and the average value was calculated.
  • Table 2 The results are shown in Table 2.

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Composite Materials (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

La présente invention concerne : un matériau de liaison par frittage en forme de feuille comprenant une couche métallique qui est composée d'un métal en forme de feuille ou en forme de feuil, et des couches adhésives, sur les deux surfaces de la couche métallique, qui comprennent des nanoparticules métalliques et un solvant et qui sont collantes, les nanoparticules métalliques étant des nanoparticules métalliques composites dans lesquelles une couche de revêtement organique composée d'un ou plusieurs acides carboxyliques aliphatiques ayant 1 à 10 ou 12 atomes de carbone est formée autour d'un noyau métallique composé d'un agrégat d'atomes métalliques et ayant un diamètre moyen de particule de 1 à 200 nm ; une partie de liaison dans laquelle le matériau de liaison par frittage en forme de feuille et les éléments de liaison sont liés ; et un dispositif électrique, un dispositif électronique, un composant semi-conducteur ou un composant de dissipation de chaleur utilisant la partie de liaison.
PCT/JP2025/023596 2024-07-01 2025-07-01 Matériau de liaison par frittage en forme de feuille Pending WO2026009882A1 (fr)

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JP2024-106385 2024-07-01

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WO2011114543A1 (fr) * 2010-03-15 2011-09-22 Ｄｏｗａエレクトロニクス株式会社 Matériau de liaison et procédé de liaison utilisant celui-ci
JP2018181605A (ja) * 2017-04-13 2018-11-15 ニホンハンダ株式会社 金属製部材接合用シート、金属製部材の接合方法および金属製部材接合体
JP2023038748A (ja) * 2021-09-07 2023-03-17 株式会社応用ナノ粒子研究所 金属ナノ粒子並びに第二の金属粒子を主成分とする接合剤を付着させた加熱接合材、及び電子機器の接合方法

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
JP2007214340A (ja) * 2006-02-09 2007-08-23 Hitachi Ltd 金属超微粒子使用接合材及びそれを用いた半導体装置
WO2011114543A1 (fr) * 2010-03-15 2011-09-22 Ｄｏｗａエレクトロニクス株式会社 Matériau de liaison et procédé de liaison utilisant celui-ci
JP2018181605A (ja) * 2017-04-13 2018-11-15 ニホンハンダ株式会社 金属製部材接合用シート、金属製部材の接合方法および金属製部材接合体
JP2023038748A (ja) * 2021-09-07 2023-03-17 株式会社応用ナノ粒子研究所 金属ナノ粒子並びに第二の金属粒子を主成分とする接合剤を付着させた加熱接合材、及び電子機器の接合方法

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