WO2026010185A1 - Dispositif électronique comprenant une structure étanche à l'eau - Google Patents

Dispositif électronique comprenant une structure étanche à l'eau

Info

Publication number
WO2026010185A1
WO2026010185A1 PCT/KR2025/007859 KR2025007859W WO2026010185A1 WO 2026010185 A1 WO2026010185 A1 WO 2026010185A1 KR 2025007859 W KR2025007859 W KR 2025007859W WO 2026010185 A1 WO2026010185 A1 WO 2026010185A1
Authority
WO
WIPO (PCT)
Prior art keywords
electronic device
speaker
rib
waterproof structure
plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/KR2025/007859
Other languages
English (en)
Korean (ko)
Inventor
김동희
김용관
백승철
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Samsung Electronics Co Ltd
Original Assignee
Samsung Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR1020240105298A external-priority patent/KR20260004157A/ko
Application filed by Samsung Electronics Co Ltd filed Critical Samsung Electronics Co Ltd
Priority to US19/252,418 priority Critical patent/US20260003404A1/en
Publication of WO2026010185A1 publication Critical patent/WO2026010185A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • G06F1/1684—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675
    • G06F1/1688—Constructional details or arrangements related to integrated I/O peripherals not covered by groups G06F1/1635 - G06F1/1675 the I/O peripheral being integrated loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/023—Screens for loudspeakers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/11—Transducers incorporated or for use in hand-held devices, e.g. mobile phones, PDA's, camera's
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS
    • H04R2499/00—Aspects covered by H04R or H04S not otherwise provided for in their subgroups
    • H04R2499/10—General applications
    • H04R2499/15—Transducers incorporated in visual displaying devices, e.g. televisions, computer displays, laptops

Definitions

  • the present disclosure relates to electronic devices.
  • one embodiment relates to an electronic device including a waterproof structure.
  • An electronic device can refer to any device that performs a specific function based on the program installed on it, such as home appliances, electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, audio/video devices, desktop/laptop computers, or car navigation systems. For example, these electronic devices can output stored information as audio or video.
  • a single electronic device such as a mobile communication terminal, can be equipped with various functions. For example, in addition to communication functions, entertainment functions such as games, multimedia functions such as music/video playback, communication and security functions such as mobile banking, or functions such as schedule management and electronic wallets are being integrated into a single electronic device. These electronic devices are becoming smaller so that users can conveniently carry them.
  • an electronic device includes a housing including a side wall and a speaker hole formed in the side wall, a speaker disposed within the housing and configured to output sound through the speaker hole, and a waterproof structure disposed between an inner surface of the side wall and the speaker, wherein the waterproof structure includes a rigid body disposed between the speaker and the inner surface, the rigid body including a plate, a first opening formed in the plate, a first rib protruding from the plate, and a second rib protruding from the plate and spaced apart from the first rib, a first adhesive member disposed between the rigid body and the inner surface, the first adhesive member including an adhesive material, an elastic member disposed between the rigid body and the speaker, the elastic member including an elastic material, and a mesh at least partially accommodated in the elastic member, wherein the speaker hole includes a first portion and a second portion facing the first portion, and a first distance between the first rib and the second rib may be greater than a second distance between the first portion and the second portion.
  • an electronic device includes a housing including a side wall and at least one speaker hole formed in the side wall, a speaker disposed within the housing and configured to output sound through the speaker hole, and a waterproof structure disposed between an inner surface of the side wall and the speaker, wherein the waterproof structure may include a rigid body disposed between the speaker and the inner surface, the rigid body including a plate and at least one first opening formed in the plate, a first adhesive member disposed between the rigid body and the inner surface, the first adhesive member including an adhesive material, an elastic member disposed between the rigid body and the speaker, the elastic member including an elastic material, and a mesh at least partially accommodated in the elastic member.
  • FIG. 1 is a block diagram illustrating an electronic device within a network environment according to one embodiment.
  • FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment.
  • FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment.
  • FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment.
  • FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment.
  • FIG. 6 is a partial perspective view showing a speaker and waterproof structure according to one embodiment.
  • Figure 7 is an exploded perspective view of a waterproof structure according to one embodiment.
  • Figure 8 is a cross-sectional view of a waterproof structure according to one embodiment.
  • FIG. 9 is a cross-sectional view of an electronic device taken along line A-A' of FIG. 2, according to one embodiment.
  • FIGS. 10, 11, 12, 13, 14, 15, and 16 are drawings illustrating various views illustrating a manufacturing process of a waterproof structure according to one embodiment.
  • FIGS. 17, 18, and 19 are perspective views illustrating a rigid body according to one embodiment.
  • FIG. 20 is a plan view illustrating a speaker hole according to one embodiment.
  • FIG. 21 is a plan view illustrating a speaker hole according to one embodiment.
  • Figure 22 is an exploded perspective view of a waterproof structure according to one embodiment.
  • Fig. 23 is a cross-sectional view of a waterproof structure according to one embodiment.
  • Fig. 24 is a cross-sectional view of a waterproof structure according to one embodiment.
  • FIG. 25 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 26 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 27 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 28 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 29 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 30 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 31 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 32 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 1 is a block diagram of an electronic device (101) within a network environment (100), according to one embodiment.
  • an electronic device (101) may communicate with an electronic device (102) via a first network (198) (e.g., a short-range wireless communication network), or may communicate with at least one of an electronic device (104) or a server (108) via a second network (199) (e.g., a long-range wireless communication network).
  • the electronic device (101) may communicate with the electronic device (104) via the server (108).
  • the electronic device (101) may include a processor (120), a memory (130), an input module (150), an audio output module (155), a display module (160), an audio module (170), a sensor module (176), an interface (177), a connection terminal (178), a haptic module (179), a camera module (180), a power management module (188), a battery (189), a communication module (190), a subscriber identification module (196), or an antenna module (197).
  • the electronic device (101) may have at least one of these components (e.g., the connection terminal (178)) omitted, or one or more other components added. In one embodiment, some of these components (e.g., the sensor module (176), the camera module (180), or the antenna module (197)) may be integrated into one component (e.g., the display module (160)).
  • the processor (120) may, for example, execute software (e.g., a program (140)) to control at least one other component (e.g., a hardware or software component) of the electronic device (101) connected to the processor (120) and perform various data processing or calculations.
  • the processor (120) may store a command or data received from another component (e.g., a sensor module (176) or a communication module (190)) in a volatile memory (132), process the command or data stored in the volatile memory (132), and store the resulting data in a non-volatile memory (134).
  • the processor (120) may include a main processor (121) (e.g., a central processing unit or an application processor) or a secondary processor (123) (e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor)) that may operate independently or together therewith.
  • a main processor (121) e.g., a central processing unit or an application processor
  • a secondary processor (123) e.g., a graphics processing unit, a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor
  • the secondary processor (123) may be configured to use less power than the main processor (121) or to be specialized for a given function.
  • the secondary processor (123) may be implemented separately from the main processor (121) or as a part thereof.
  • the processor (120) may include various processing circuits and/or multiple processors.
  • processor may include various processing circuits including at least one processor, wherein one or more of the at least one processor may be individually and/or collectively configured to perform various functions described in the present disclosure in a distributed manner.
  • processor any processor capable of performing various functions described in the present disclosure.
  • processors include, but are not limited to, situations where one processor performs some of the recited functions and other processor(s) perform other parts of the recited functions, and situations where a single processor can perform all of the recited functions.
  • the at least one processor may comprise a combination of processors that perform the various recited/disclosed functions, for example, in a distributed manner. At least one processor may execute program instructions to achieve or perform various functions.
  • the auxiliary processor (123) may control at least a portion of functions or states associated with at least one component (e.g., a display module (160), a sensor module (176), or a communication module (190)) of the electronic device (101), for example, on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state.
  • the auxiliary processor (123) e.g., an image signal processor or a communication processor
  • the auxiliary processor (123) may include a hardware structure specialized for processing artificial intelligence models.
  • the artificial intelligence models may be generated through machine learning. This learning can be performed, for example, in the electronic device (101) itself where the artificial intelligence model is executed, or can be performed through a separate server (e.g., server (108)).
  • the learning algorithm can include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above.
  • the artificial intelligence model can include a plurality of artificial neural network layers.
  • the artificial neural network can be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), deep Q-networks, or a combination of two or more of the above, but is not limited to the examples described above.
  • the artificial intelligence model can additionally or alternatively include a software structure.
  • the memory (130) can store various data used by at least one component (e.g., processor (120) or sensor module (176)) of the electronic device (101).
  • the data can include, for example, software (e.g., program (140)) and input data or output data for commands related thereto.
  • the memory (130) can include volatile memory (132) or non-volatile memory (134).
  • the program (140) may be stored as software in the memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).
  • the input module (150) can receive commands or data to be used in a component of the electronic device (101) (e.g., a processor (120)) from an external source (e.g., a user) of the electronic device (101).
  • the input module (150) can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).
  • the audio output module (155) can output audio signals to the outside of the electronic device (101).
  • the audio output module (155) can include, for example, a speaker or a receiver.
  • the speaker can be used for general purposes, such as multimedia playback or recording playback.
  • the receiver can be used to receive incoming calls. In one embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.
  • the display module (160) can visually provide information to an external party (e.g., a user) of the electronic device (101).
  • the display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling the device.
  • the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of a force generated by the touch.
  • the audio module (170) can convert sound into an electrical signal, or vice versa, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150), output sound through the sound output module (155), or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphone) directly or wirelessly connected to the electronic device (101).
  • an external electronic device e.g., electronic device (102)
  • speaker or headphone directly or wirelessly connected to the electronic device (101).
  • the sensor module (176) can detect the operating status (e.g., power or temperature) of the electronic device (101) or the external environmental status (e.g., user status) and generate an electrical signal or data value corresponding to the detected status.
  • the sensor module (176) can include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the interface (177) may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device (101) with an external electronic device (e.g., the electronic device (102)).
  • the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD card interface Secure Digital Card
  • connection terminal (178) may include a connector through which the electronic device (101) may be physically connected to an external electronic device (e.g., electronic device (102)).
  • the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).
  • the haptic module (179) can convert electrical signals into mechanical stimuli (e.g., vibration or movement) or electrical stimuli that a user can perceive through tactile or kinesthetic sensations.
  • the haptic module (179) can include, for example, a motor, a piezoelectric element, or an electrical stimulation device.
  • the camera module (180) can capture still images and videos.
  • the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.
  • the power management module (188) can manage power supplied to the electronic device (101).
  • the power management module (188) can be implemented, for example, as at least a part of a power management integrated circuit (PMIC).
  • PMIC power management integrated circuit
  • a battery (189) may power at least one component of the electronic device (101).
  • the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.
  • the communication module (190) may support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel.
  • the communication module (190) may operate independently from the processor (120) (e.g., application processor) and may include one or more communication processors that support direct (e.g., wired) communication or wireless communication.
  • the communication module (190) may include a wireless communication module (192) (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module (194) (e.g., a local area network (LAN) communication module, or a power line communication module).
  • a wireless communication module (192) e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module
  • GNSS global navigation satellite system
  • wired communication module (194) e.g., a local area network (LAN) communication module, or a power line communication module.
  • the corresponding communication module can communicate with an external electronic device (104) via a first network (198) (e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network (199) (e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)).
  • a first network (198) e.g., a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)
  • a second network (199) e.g., a long-range communication network such as a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)
  • a computer network e.g., a
  • the wireless communication module (192) can verify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) by using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module (196).
  • subscriber information e.g., an international mobile subscriber identity (IMSI)
  • the wireless communication module (192) can support 5G networks and next-generation communication technologies following the 4G network, such as NR access technology (new radio access technology).
  • the NR access technology can support high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and connection of multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency communications)).
  • eMBB enhanced mobile broadband
  • mMTC massive machine type communications
  • URLLC ultra-reliable and low-latency communications
  • the wireless communication module (192) can support, for example, a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate.
  • a high-frequency band e.g., mmWave band
  • the wireless communication module (192) can support various technologies for securing performance in a high-frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large scale antenna.
  • the wireless communication module (192) can support various requirements specified in the electronic device (101), an external electronic device (e.g., the electronic device (104)), or a network system (e.g., the second network (199)).
  • the wireless communication module (192) can support a peak data rate (e.g., 20 Gbps or more) for eMBB realization, a loss coverage (e.g., 164 dB or less) for mMTC realization, or a U-plane latency (e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC realization.
  • a peak data rate e.g., 20 Gbps or more
  • a loss coverage e.g., 164 dB or less
  • U-plane latency e.g., 0.5 ms or less for downlink (DL) and uplink (UL), or 1 ms or less for round trip
  • the antenna module (197) can transmit or receive signals or power to or from an external device (e.g., an external electronic device).
  • the antenna module (197) may include an antenna including a radiator including a conductor or a conductive pattern formed on a substrate (e.g., a PCB).
  • the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as the first network (198) or the second network (199), may be selected from the plurality of antennas, for example, by the communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device via the selected at least one antenna.
  • another component e.g., a radio frequency integrated circuit (RFIC)
  • RFIC radio frequency integrated circuit
  • the antenna module (197) may form a mmWave antenna module.
  • the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent a first side (e.g., a bottom side) of the printed circuit board and capable of supporting a designated high-frequency band (e.g., a mmWave band), and a plurality of antennas (e.g., an array antenna) disposed on or adjacent a second side (e.g., a top side or a side side) of the printed circuit board and capable of transmitting or receiving signals in the designated high-frequency band.
  • a first side e.g., a bottom side
  • a plurality of antennas e.g., an array antenna
  • At least some of the above components can be interconnected and exchange signals (e.g., commands or data) with each other via a communication method between peripheral devices (e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
  • peripheral devices e.g., a bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)).
  • commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) via a server (108) connected to a second network (199).
  • Each of the external electronic devices (102 or 104) may be the same or a different type of device as the electronic device (101).
  • all or part of the operations executed in the electronic device (101) may be executed in one or more of the external electronic devices (102, 104, or 108). For example, when the electronic device (101) is to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device (101) may, instead of or in addition to executing the function or service itself, request one or more external electronic devices to perform the function or at least a part of the service.
  • One or more external electronic devices that receive the request may execute at least a portion of the requested function or service, or an additional function or service related to the request, and transmit the result of the execution to the electronic device (101).
  • the electronic device (101) may process the result as is or additionally and provide it as at least a portion of a response to the request.
  • cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used, for example.
  • the electronic device (101) may provide an ultra-low latency service by using distributed computing or mobile edge computing, for example.
  • the external electronic device (104) may include an Internet of Things (IoT) device.
  • the server (108) may be an intelligent server utilizing machine learning and/or a neural network.
  • the external electronic device (104) or the server (108) may be included in the second network (199).
  • the electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.
  • An electronic device may take various forms.
  • the electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, a home appliance, or the like.
  • a portable communication device e.g., a smartphone
  • a computer device e.g., a laptop, a desktop, a tablet, or the like.
  • first,” “second,” or “first” or “second” may be used merely to distinguish one component from another, and do not limit the components in any other respect (e.g., importance or order).
  • a component e.g., a first component
  • another e.g., a second component
  • the component can be connected to the other component directly (e.g., wired), wirelessly, or through a third component.
  • module may include a unit implemented by hardware, software, firmware, or a combination thereof, and may be used interchangeably with terms such as logic, logic block, component, or circuit.
  • a module may be an integral component, or a minimum unit or part of such a component that performs one or more functions.
  • a module may be implemented in the form of an application-specific integrated circuit (ASIC).
  • ASIC application-specific integrated circuit
  • One embodiment may be implemented as software (e.g., a program (140)) including one or more instructions stored in a storage medium (e.g., an internal memory (136) or an external memory (138)) readable by a machine (e.g., an electronic device (101)).
  • a processor e.g., a processor (120)
  • the machine may call at least one instruction among the one or more instructions stored from the storage medium and execute it. This enables the machine to operate to perform at least one function according to the at least one called instruction.
  • the one or more instructions may include code generated by a compiler or code executable by an interpreter.
  • the machine-readable storage medium may be provided in the form of a non-transitory storage medium.
  • a 'non-transitory' storage medium simply means that it is a tangible device and does not contain signals (e.g. electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently or temporarily on the storage medium.
  • the method according to one embodiment may be provided as included in a computer program product.
  • the computer program product may be traded as a product between a seller and a buyer.
  • the computer program product may be distributed in the form of a machine-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or may be distributed online (e.g., downloaded or uploaded) through an application store (e.g., Play StoreTM) or directly between two user devices (e.g., smart phones).
  • an application store e.g., Play StoreTM
  • at least a portion of the computer program product may be temporarily stored or temporarily generated in a machine-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or an intermediary server.
  • each component e.g., a module or a program of the above-described components may include one or more entities, and some of the entities may be separated and placed in other components.
  • one or more components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added.
  • a plurality of components e.g., a module or a program
  • the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration.
  • the operations performed by a module, program, or other component may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.
  • FIG. 2 is a perspective view showing the front of an electronic device according to one embodiment.
  • FIG. 3 is a perspective view showing the rear side of an electronic device according to one embodiment.
  • FIGS. 2 and 3 may be combined with the embodiments of FIG. 1 or the embodiments of FIGS. 4 to 32.
  • an electronic device (101) may include a housing (210) that includes a first side (or front side) (210A), a second side (or back side) (210B), and a side surface (210C) that surrounds a space between the first side (210A) and the second side (210B).
  • the housing (210) may also refer to a structure that forms a portion of the first side (210A) of FIG. 2 , the second side (210B), and the side surface (210C) of FIG. 3 .
  • the first side (210A) may be formed by a front plate (202) that is at least partially transparent (e.g., a glass plate or a polymer plate including various coating layers).
  • the second side (210B) may be formed by a substantially opaque back plate (211).
  • the rear plate (211) may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the foregoing materials.
  • the side surface (210C) may be formed by a side structure (or “side bezel structure”) (218) that is coupled to the front plate (202) and the rear plate (211) and comprises a metal and/or polymer.
  • the rear plate (211) and the side structure (218) may be formed integrally and comprise the same material (e.g., a metal material such as aluminum).
  • the front plate (202) may include a seamlessly extending region(s) that curves toward the back plate (211) at least along a portion of an edge.
  • the front plate (202) (or the back plate (211)) may include only one of the curved extending regions toward the back plate (211) (or the front plate (202)) at one edge of the first surface (210A).
  • the front plate (202) or the back plate (211) may be substantially flat.
  • the front plate (202) or the back plate (211) may not include a curved extending region.
  • the thickness of the electronic device (101) in the portion that includes the curved extending region may be smaller than that of the other portions.
  • the electronic device (101) may include at least one of a display (220), an audio module (203, 207, 214), a sensor module (204, 219), a camera module (205, 212, 213), a key input device (216, 217), a light emitting element (206), and a connector hole (208, 209).
  • the electronic device (101) may omit at least one of the components (e.g., the key input device (216, 217) or the light emitting element (206)) or may additionally include other components.
  • the display (220) may be visually visible, for example, through a substantial portion of the front plate (202). In one embodiment, at least a portion of the display (220) may be visually visible through the front plate (202) forming the first surface (210A) or through a portion of a side surface (210C). In one embodiment, the edge of the display (220) may be formed to be substantially the same as an adjacent outer shape of the front plate (202). In one embodiment (not shown), the distance between the outer edge of the display (220) and the outer edge of the front plate (202) may be formed to be substantially the same in order to expand the area over which the display (220) is visually visible.
  • a recess or opening is formed in a portion of a screen display area of the display (220), and the electronic device (101) may include at least one of an audio module (214), a sensor module (204), a camera module (205), and a light-emitting element (206) aligned with the recess or opening.
  • the display (220) may include at least one of an audio module (214), a sensor module (204), a camera module (205), a fingerprint sensor, and a light-emitting element (206) on a rear surface of the screen display area.
  • the display (220) may be coupled to or disposed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and/or a digitizer capable of detecting a magnetic field-type stylus pen.
  • the camera module (205) may be configured to capture images of the front of the display (220) through a camera opening formed in the display (220).
  • the camera module (205) may be covered by the front plate (202).
  • the camera module (205) may not be visually exposed through the display (220) and may include a hidden under-display camera (UDC).
  • the under-display camera may be configured to capture images of external objects through the camera opening of the display (220).
  • the audio module (203, 207, 214) may include a microphone hole (203) and a speaker hole (214, 2012).
  • a microphone for acquiring external sound through the microphone hole (203) may be placed inside the housing (210), and in one embodiment, multiple microphones may be placed to detect the direction of the sound.
  • the speaker hole (214, 2012) may include a call receiver hole (214) and an external speaker hole (2012).
  • the speaker hole (214, 2012) and the microphone hole (203) may be implemented as a single hole, or a speaker may be included without the speaker hole (214, 2012) (e.g., a piezo speaker).
  • the external speaker hole (2012) may form a passage that transmits or outputs sound generated from a speaker (e.g., speaker (400) of FIG. 6) disposed inside the housing (210) to the outside of the electronic device (101).
  • a speaker e.g., speaker (400) of FIG. 6
  • the external speaker hole (2012) may be formed in a lower side wall (2011) of the electronic device (101) that forms at least a portion of the side surface (210C) (e.g., a side wall facing the -Y direction in FIGS. 2 to 3), but is not limited thereto.
  • the lower side wall (2011) may be defined and/or referred to as a side wall (2011).
  • the external speaker hole (2012) is illustrated as being formed in the side wall (2011) facing the -Y direction, but is not limited thereto and may be formed in another side wall facing a different direction.
  • the side wall (2011) may form at least a portion of an edge of the electronic device (101).
  • the sensor module (204, 219) can generate an electrical signal or data value corresponding to an internal operating state of the electronic device (101) or an external environmental state.
  • the sensor module (204, 219) may include, for example, a first sensor module (204) (e.g., a proximity sensor) and/or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface (210A) of the housing (210), and/or a third sensor module (219) and/or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface (210B) of the housing (210).
  • the fingerprint sensor may be disposed on not only the first surface (210A) (e.g., the display (220)) of the housing (210), but also the second surface (210B) or the side surface (210C).
  • the electronic device (101) may further include, for example, at least one of a gesture sensor, a gyro sensor, a pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.
  • the camera modules (205, 212, 213) may include a first camera device (205) disposed on a first surface (210A) of the electronic device (101), a second camera device (212) disposed on a second surface (210B), and/or a flash (213).
  • the camera devices (205, 212) may include one or more lenses, an image sensor, and/or an image signal processor.
  • the flash (213) may include, for example, a light-emitting diode or a xenon lamp.
  • two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (101).
  • the flash (213) may emit infrared light, and infrared light emitted by the flash (213) and reflected by a subject may be received via the third sensor module (219).
  • the electronic device (101) or the processor of the electronic device (101) can detect depth information of the subject based on the point in time when infrared rays are received from the third sensor module (219).
  • the key input devices (216, 217) may be disposed on one surface of the housing (210).
  • the key input devices (216, 217) may be disposed on a side surface (210C) of the housing (210).
  • the electronic device (101) may not include some or all of the above-mentioned key input devices (216, 217), and the key input devices that are not included may be implemented in another form, such as soft keys, on the display (220).
  • the key input devices (216, 217) may include a sensor module disposed on a second surface (210B) of the housing (210).
  • the key input device (216, 217) may be defined and/or referred to as a side key, a key input module, or a button assembly.
  • the key input device (216, 217) may include a volume key (216) or a power key (217).
  • the volume key (216) may be a key that can adjust the intensity of an audio signal output from the electronic device (101).
  • the volume key (216) may have an elongated shape when viewed from the side of the electronic device (101) (e.g., when viewed from the +X direction to the -X direction in FIGS. 2 and 3). Since the volume key (216) is provided in an elongated shape, a key input for volume up may be possible on one side of the volume key (216), and a key input for volume down may be possible on the other side of the volume key (216).
  • the volume key (216) when viewed from the side of the electronic device (101), the volume key (216) may visually appear as a single member, but the volume key (216) may provide two key input points.
  • the volume key (216) may be configured to adjust the intensity of an acoustic signal, but is not limited thereto, and may provide scroll up-down control, text size control, or other key input functions.
  • the power key (217) may be separated from the volume key (216).
  • the power key (217) may be configured to control the on-off of the electronic device (101) or to control the standby mode and the activation mode of the electronic device (101).
  • the light emitting element (206) may be disposed, for example, on the first surface (210A) of the housing (210).
  • the light emitting element (206) may provide, for example, status information of the electronic device (101) in the form of light.
  • the light emitting element (206) may provide a light source that is linked to the operation of, for example, the camera module (205).
  • the light emitting element (206) may include, for example, a light emitting diode (LED), an infrared (IR) LED, and a xenon lamp.
  • the connector holes (208, 209) may include a first connector hole (208) that can accommodate a connector (e.g., a USB connector) for transmitting and receiving power and/or data with an external electronic device, and/or a second connector hole (e.g., an earphone jack) (209) that can accommodate a connector for transmitting and receiving audio signals with an external electronic device.
  • a connector e.g., a USB connector
  • a second connector hole e.g., an earphone jack
  • FIG. 4 is an exploded perspective view showing the front of an electronic device according to one embodiment.
  • FIG. 5 is an exploded perspective view showing the rear side of an electronic device according to one embodiment.
  • FIGS. 4 to 5 may be combined with the embodiments of FIGS. 1 to 3, or the embodiments of FIGS. 6 to 32.
  • an electronic device (101) may include a side structure (310), a first support member (311) (e.g., a bracket), a front plate (320) (e.g., the front plate (202) of FIG. 2 ), a display (330) (e.g., the display (220) of FIG.
  • the electronic device (101) includes a plurality of printed circuit boards (341, 343), the electronic device (101) can electrically connect different printed circuit boards by including at least one flexible connection member (345).
  • the printed circuit boards (341, 343) can include a first circuit board (341) positioned above (e.g., in the +Y-axis direction) the battery (350) and a second circuit board (343) positioned below (e.g., in the -Y-axis direction), and the flexible connection member (345) can electrically connect the first circuit board (341) and the second circuit board (343).
  • the electronic device (101) may omit at least one of the components (e.g., the first support member (311) or the second support member (360)) or may additionally include other components. At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIGS. 1 to 3, and any redundant description will be omitted below.
  • the electronic device (101) may include a housing (301) (e.g., housing (210) of FIGS. 2 and 3).
  • the housing (301) may include a first support member (311) and a side structure (311) (e.g., the side structure (218) or side (210C) of FIGS. 2 and 3).
  • a side structure e.g., the side structure (218) or side (210C) of FIGS. 2 and 3.
  • the housing (301) may include a side wall (3011) (e.g., a side wall facing the -Y direction in FIGS. 4 and 5) that includes a speaker hole (3012) (e.g., an external speaker hole (2012) in FIGS. 2 and 3).
  • a side wall (3011) e.g., a side wall facing the -Y direction in FIGS. 4 and 5
  • a speaker hole (3012) e.g., an external speaker hole (2012) in FIGS. 2 and 3.
  • the first support member (311) may be provided in at least a portion in a flat shape.
  • the first support member (311) may be disposed within the electronic device (101) and connected to the side structure (310), or may be formed integrally with the side structure (310).
  • the first support member (311) may be formed of, for example, a metallic material and/or a non-metallic (e.g., a polymer) material.
  • the side structure (310) or a portion of the first support member (311) may function as an antenna.
  • the first support member (311) may include a front side (311a) and a rear side (311b) opposite to the front side (311a).
  • the front side (311a) may be defined and/or referred to as a first surface (311a) or a front surface (311a).
  • the rear side (311b) may be defined and/or referred to as a second surface (311b) or a rear surface (311b).
  • the front side (311a) may face the display (330).
  • the back side (311b) may face the back plate (380).
  • a display (330) may be coupled to a front surface (311a) of a first support member (311), and a printed circuit board (341, 343) may be coupled to a rear surface (311b) of the first support member (311).
  • a processor, a memory, and/or an interface may be mounted on the printed circuit board (341, 343).
  • the processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communication processor.
  • the first support member (311) and the side structure (310) may be combined to be referred to as a front case or housing (301).
  • the housing (301) may be generally understood as a structure for accommodating, protecting, or arranging a printed circuit board (341, 343) or a battery (350).
  • the housing (301) may be understood as including structures that can be visually or tactilely perceived by a user in the appearance of the electronic device (101), for example, a side structure (310), a front plate (320), and/or a rear plate (380).
  • the 'front or rear surface of the housing (301)' may refer to the first surface (210A) of FIG. 2 or the second surface (210B) of FIG. 3.
  • the first support member (311) is positioned between the front plate (320) (e.g., the first side (210A) of FIG. 2) and the back plate (380) (e.g., the second side (210B) of FIG. 3) and may function as a structure for positioning electrical/electronic components such as printed circuit boards (341, 343) or camera assemblies (307).
  • the memory may include, for example, volatile memory (e.g., volatile memory (132) of FIG. 1) or non-volatile memory (e.g., non-volatile memory (134) of FIG. 1).
  • volatile memory e.g., volatile memory (132) of FIG. 1
  • non-volatile memory e.g., non-volatile memory (134) of FIG. 1.
  • the interface may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, and/or an audio interface.
  • HDMI high definition multimedia interface
  • USB universal serial bus
  • SD secure digital
  • the interface may electrically or physically connect the electronic device (101) to an external electronic device, and may include, for example, a USB connector, an SD card/multimedia card (MMC) connector, or an audio connector.
  • MMC multimedia card
  • the second support member (360) may include, for example, an upper support member (360a) and a lower support member (360b).
  • the upper support member (360a) may be arranged to surround a printed circuit board (341, 343) (e.g., the first circuit board (341)) together with a portion of the first support member (311).
  • the upper support member (360a) of the second support member (360) may be arranged to face the first support member (311) with the first circuit board (341) interposed therebetween.
  • the lower support member (360b) of the second support member (360) may be arranged to face the first support member (311) with the second circuit board (343) interposed therebetween.
  • Circuit devices implemented in the form of integrated circuit chips (e.g., processors, communication modules, or memories) or various electrical/electronic components may be placed on the circuit boards (341, 343), and according to an embodiment, the circuit boards (341, 343) may be provided with an electromagnetic shielding environment from the second support member (360).
  • the lower support member (360b) may be utilized as a structure on which electrical/electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card/MMC connector, or an audio connector) may be placed.
  • electrical/electronic components such as a speaker module, an interface (e.g., a USB connector, an SD card/MMC connector, or an audio connector) may be placed on an additional printed circuit board (not shown).
  • the lower support member (360b) may be placed to surround an additional circuit board together with another part of the first support member (311).
  • An interface arranged on an additional circuit board or lower support member (360b) not shown may be arranged corresponding to the audio module (207) or connector hole (208, 209) of FIG. 2.
  • the battery (350) is a device for supplying power to at least one component of the electronic device (101), and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (350) may be disposed substantially on the same plane as, for example, the printed circuit board (341, 343). The battery (350) may be disposed integrally within the electronic device (101), or may be disposed detachably from the electronic device (101).
  • the antenna may include a conductive pattern implemented on the surface of the second support member (360), for example, through a laser direct structuring process.
  • the antenna may include a printed circuit pattern formed on the surface of a thin film, and the thin film-type antenna may be disposed between the back plate (380) and the battery (350).
  • the antenna may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna.
  • the antenna may, for example, perform short-range communication with an external device or wirelessly transmit and receive power required for charging.
  • another antenna structure may be formed by the side structure (310) and/or a portion or combination of the first support member (311).
  • the camera assembly (307) may include at least one camera module. Inside the electronic device (101), the camera assembly (307) (or at least one camera module) may receive at least a portion of light incident through an optical hole or camera window (312, 313, 319). In one embodiment, the camera assembly (307) may be disposed on the first support member (311) at a location adjacent to the printed circuit board (341, 343). In one embodiment, the camera module(s) of the camera assembly (307) may be generally aligned with one of the camera windows (312, 313, 319) and may be at least partially wrapped around the second support member (360) (e.g., the upper support member (360a)).
  • the electronic device (101) may include a flexible connection member (345).
  • the flexible connection member (345) may include a flexible flat cable (FFC), a flexible printed circuit board (FPCB), or a board to board connector (B2B connector).
  • FFC flexible flat cable
  • FPCB flexible printed circuit board
  • B2B connector board to board connector
  • the flexible connecting member (345) is at least partially bendable.
  • the flexible connecting member (345) may be configured to be at least partially folded or unfolded.
  • the flexible connecting member (345) can electrically connect a first circuit board (341) (e.g., a main circuit board) and at least one electrical component.
  • a first circuit board (341) e.g., a main circuit board
  • at least one electrical component can include, for example, a second circuit board (343) (e.g., a sub circuit board).
  • the at least one electrical component is not limited thereto and can include various electrical components (e.g., an antenna, a speaker, a battery, a display, or a sensor).
  • the flexible connecting member (345) may be configured to transmit power or an electrical signal from the first circuit board (341) to at least one electrical component.
  • the flexible connecting member (345) may be configured to transmit power or an electrical signal from the at least one electrical component to the first circuit board (341).
  • the electrical signal may include a control signal, a power signal, or a communication signal.
  • the electronic device (101) may include a key input device (316, 317) (e.g., the key input device (216, 217) of FIG. 2).
  • the key input device (316, 317) may include a volume key (316) (e.g., the volume key (216) of FIG. 2) or a power key (e.g., the power key (217) of FIG. 2).
  • the volume key (316) may be disposed on one surface of the housing (301).
  • the volume key (316) may be disposed on a portion of a lateral surface of the housing (301) (e.g., the lateral structure (310) of FIG. 4), but is not limited thereto.
  • the volume key (316) may include a haptic module (e.g., the haptic module (179) of FIG. 1).
  • the haptic module may include a piezo actuator.
  • the piezo actuator may be configured to provide a mechanical stimulus (e.g., vibration or movement) that is perceptible to the user through a tactile or kinesthetic sense when the user presses or touches the volume key (316).
  • the volume key (316) may have an elongated shape when viewed from the side of the electronic device (101) (e.g., when viewed from the +X direction to the -X direction in FIG. 4).
  • the volume key (316) may be spaced apart from the power key (317).
  • the electronic device (101) may include a speaker (390) (e.g., the sound output module (155) or audio module (170) of FIG. 1).
  • the speaker (390) may be configured to output sound to the outside of the electronic device (101) through a speaker hole (3012) formed in a side wall (3011).
  • the speaker (390) may be configured to convert an electrical signal into sound and output the sound to the outside of the electronic device (101).
  • the speaker (390) may include a diaphragm, a magnet, or a voice coil.
  • sound generated from the speaker (390) can be output to the outside of the electronic device (101) through the speaker hole (3012) (e.g., the external speaker hole (3012) of FIG. 2).
  • the speaker hole (3012) e.g., the external speaker hole (3012) of FIG. 2.
  • the speaker (390) may include a speaker component or a speaker enclosure.
  • the speaker (390) may be positioned adjacent to an inner surface of the side wall (3011) (e.g., a surface facing the interior of the electronic device (101)).
  • the speaker (390) may be positioned on the rear surface (311b) of the first support member (311).
  • FIG. 6 is a partial perspective view showing a speaker and waterproof structure according to one embodiment.
  • FIG. 6 can be combined with the embodiments of FIGS. 1 to 5, or the embodiments of FIGS. 7 to 32.
  • the configurations of the embodiment of FIG. 6 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 5, or the configurations of the embodiments of FIGS. 7 to 32.
  • an electronic device (101) (e.g., the electronic device (101) of FIGS. 2 to 5) may include a housing (301) (e.g., the housing (301) of FIGS. 4 and 5).
  • the housing (301) may include a first support member (311) and a side structure (310).
  • the side structure (310) may include a side wall (3011) (e.g., side wall (2011) of FIGS. 2 and 3 or side wall (3011) of FIGS. 4 and 5).
  • the side wall (3011) may include an outer surface (3011b) facing the exterior of the electronic device (101) and an inner surface (3011a) facing the interior space of the electronic device (101).
  • the inner surface (3011a) may be defined as at least a portion of the entire inner surface of the side wall (3011) on which the waterproof structure (500) is mounted, but is not limited thereto.
  • the housing (301) may include a speaker hole (3012) formed in the side wall (3011) (e.g., the speaker hole (3012) of FIGS. 4 and 5).
  • a speaker hole (3012) may be formed penetrating from the inner surface (3011a) to the outer surface (3011b).
  • the speaker hole (3012) may form a passage for transmitting sound generated from a speaker (400) (e.g., speaker (390) of FIGS. 4 and 5) to the outside of the electronic device (101).
  • the speaker hole (3012) when looking at the inner surface (3011a), may have an elongated shape.
  • the speaker hole (3012) may be formed or extended elongated along the width direction of the electronic device (101) (e.g., the X-axis direction of FIG. 6).
  • a waterproof structure (500) may be placed between the speaker (400) and the inner surface (3011a).
  • the waterproof structure (500) may be arranged between the inner surface (3011a) and the speaker (400) to block external liquid from flowing into the internal space of the electronic device (101) through the space between the inner surface (3011a) and the speaker (400).
  • the waterproof structure (500) may seal the space between the inner surface (3011a) and the speaker (400).
  • the waterproof structure (500) can form a passage that transmits sound generated from the speaker (400) to the speaker hole (3012).
  • the waterproof structure (500) may include a mesh (e.g., mesh (530) of FIG. 7) to block external foreign substances from entering the speaker (400).
  • a mesh e.g., mesh (530) of FIG. 7 to block external foreign substances from entering the speaker (400).
  • the speaker (400) may be disposed on the rear surface (311b) of the first support member (311) (e.g., the surface facing the -Z direction in FIG. 6). At least a portion of the speaker (400) may be in close contact with the waterproof structure (500).
  • the speaker (400) may be configured to be aligned with the speaker hole (3012) and output sound to the outside of the electronic device (101) through the speaker hole (3012).
  • the housing (301) may include a stepped portion (3013) formed to be recessed from the inner surface (3011a).
  • the stepped portion (3013) may be formed along the periphery of the speaker hole (3012).
  • the stepped portion (3013) may be formed around the periphery of the speaker hole (3012).
  • the step portion (3013) may be formed at the boundary between the inner surface (3011a) and the speaker hole (3012).
  • a portion of the waterproof structure (500) may be disposed in the step portion (3013) so that slip of the waterproof structure (500) may be limited and/or reduced.
  • Figure 7 is an exploded perspective view of a waterproof structure according to one embodiment.
  • Figure 8 is a cross-sectional view of a waterproof structure according to one embodiment.
  • FIG. 9 is a cross-sectional view of an electronic device taken along line A-A' of FIG. 2, according to one embodiment.
  • FIGS. 7, 8 and 9 can be combined with the embodiments of FIGS. 1 to 6, or the embodiments of FIGS. 10 to 32.
  • the configurations of the embodiments of FIGS. 7 to 9 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 6, or the configurations of the embodiments of FIGS. 10 to 32.
  • an electronic device (101) may include a waterproof structure (500) (e.g., the waterproof structure (500) of FIG. 6).
  • the waterproof structure (500) may be disposed between an inner surface (3011a) of a side wall (3011) (e.g., the inner surface (3011a) of FIG. 6) and a speaker (400) (e.g., the speaker (400) of FIG. 6).
  • the waterproof structure (500) may include a rigid body (510), a first adhesive member (520), a mesh (530), and an elastic member (540).
  • FIGS. 7 and 8 coordinate systems that are perpendicular to each other are illustrated in FIGS. 7 and 8.
  • the V-axis direction of FIGS. 7 and 8 may be defined as the height direction or thickness direction of the waterproof structure (500).
  • the H-axis direction of FIGS. 7 and 8 may be defined as the width direction of the waterproof structure (500).
  • the coordinate system illustrated in FIG. 9 may have substantially the same direction as the coordinate systems of FIGS. 2 to 6.
  • the rigid body (510) may include a hard material (e.g., stainless steel).
  • the rigid body (510) may be placed between the speaker (400) and the inner surface (3011a) of the side wall (3011).
  • the rigid body (510) may include a plate (511), a first opening (512), and at least one rib (513).
  • the plate (511) may form the overall body of the rigid body (510).
  • the plate (511) may have an overall loop shape as the first opening (512) is formed.
  • the first opening (512) may be formed through the plate (511).
  • the first opening (512) may include a hole.
  • the first opening (512) may form at least a portion of a sound path or acoustic path through which sound generated from the speaker (400) is transmitted.
  • the first opening (512) may have an elongated shape to correspond to the speaker hole (3012).
  • At least one rib (513) may protrude from an inner edge of the plate (511).
  • the at least one rib (513) may protrude or extend from an inner edge of the plate (511) defining the first opening (512) toward the speaker hole (3012).
  • the at least one rib (513) may be formed by bending at least a portion of the plate (511).
  • At least one rib (513) may include a first rib (5131) and a second rib (5132).
  • the first rib (5131) may protrude toward the speaker hole from at least a portion of the inner edge of the plate (511).
  • the second rib (5132) may protrude toward the speaker hole from another portion of the inner edge of the plate (511).
  • the second rib (5132) may face the first rib (5131).
  • the second rib (5132) may be parallel to the first rib (5131).
  • the second rib (5132) may be spaced apart from the first rib (5131).
  • the second rib (5132) may be spaced apart from the first rib (5131) by a first distance (d1) (e.g., a distance in the H-axis direction of FIG. 8).
  • the first distance (d1) may be defined as, but is not limited to, a shortest distance between the first rib (5131) and the second rib (5132).
  • the first distance (d1) may be defined as a minimum distance between the first rib (5131) and the second rib (5132).
  • the first distance (d1) may be defined as a vertical distance between the first rib (5131) and the second rib (5132).
  • the first adhesive member (520) may include an adhesive material.
  • the first adhesive member (520) may include a waterproof tape or a double-sided tape.
  • the first adhesive member (520) may be disposed between the rigid body (510) and the inner surface (3011a) of the side wall (3011).
  • the first adhesive member (520) may be disposed on the lower surface of the plate (511) (e.g., the surface facing the -V direction in FIGS. 7 and 8).
  • the first adhesive member (520) may be configured to be disposed between the lower surface of the plate (511) and the inner surface (3011a) of the side wall (3011) to adhere the waterproof structure (500) to the inner surface of the side wall.
  • the first adhesive member (520) may include a second opening (522).
  • the second opening (522) may include a hole.
  • the second opening (522) may be positioned correspondingly to the first opening (512).
  • the second opening (522) may be aligned with the first opening (512).
  • the first rib (5131) and the second rib (5132) may be positioned to penetrate the second opening (522).
  • the inner edge of the first adhesive member (520) may be spaced apart from the first rib (5131) and the second rib (5132).
  • a gap e.g., gap (501) of FIG. 8 may be formed between at least a portion of the inner edge of the first adhesive member (520) and the first rib (5131). Additionally, a gap may also be formed between another portion of the inner edge of the first adhesive member (520) and the second rib (5132).
  • an elastic member (540) may be disposed between the rigid body (510) and the speaker (400).
  • the elastic member (540) may be disposed between an upper surface of the plate (511) (e.g., a surface facing the +V direction of FIGS. 7 and 8) and the speaker (400).
  • the elastic member (540) may be defined and/or referred to as a sealing member.
  • the elastic member (540) may include an elastic material.
  • the elastic member (540) may be elastically deformable. For example, at least a portion of the elastic member (540) may be in close contact with the enclosure (410) of the speaker (400) when the speaker (400) is assembled to the electronic device (101).
  • the elastic member (540) may include an elastically deformable material.
  • the elastic material of the elastic member (540) may include at least one of a synthetic resin material, a polymer material, or a polymer material.
  • the elastic material of the elastic member (540) may include at least one of rubber, silicone, and polymer, but is not limited thereto.
  • the elastic member (540) may be in close contact with the enclosure (410) of the speaker (400) and may include various elastically deformable materials.
  • the mesh (530) can be at least partially accommodated in an elastic member (540).
  • the mesh (530) may include a sound mesh made of a breathable material.
  • the mesh (530) may limit and/or reduce foreign substances from entering the speaker (400).
  • the mesh (530) may form a passage that transmits sound generated from the speaker (400) to the outside of the electronic device (101).
  • the mesh (530) may be formed by intersecting a plurality of lines.
  • the plurality of lines e.g., metal lines
  • the mesh (530) may include a plurality of holes formed by the arrangement of the plurality of lines in a lattice structure. The size of the plurality of holes may be designed to vary depending on acoustic or vibration-proofing performance.
  • At least a portion (531) of the mesh (530) can be accommodated in the elastic member (540). Another portion (532) of the mesh member (530) can be positioned to be exposed through an opening of the elastic member (540) (e.g., a third opening (5412) of the first elastic portion (541)).
  • the elastic member (540) may include a first elastic portion (541) and a second elastic portion (543).
  • the first elastic portion (541) may be configured to accommodate at least a portion (531) of the mesh (530).
  • the first elastic portion (541) may include a third opening (5412).
  • the third opening (5412) may include a hole formed through the first elastic portion (541).
  • the third opening (5412) may be positioned to correspond with the first opening (512) and/or the second opening (522).
  • the third opening (5412) may be aligned with the first opening (512) and/or the second opening (522).
  • another portion (532) of the mesh (530) may be exposed through the third opening (5412).
  • the other portion (532) of the mesh (530) may block and/or limit foreign matter from entering the speaker (400).
  • the second elastic portion (543) may be configured to surround the first elastic portion (541). At least a portion of the second elastic portion (543) may be configured to contact the speaker (400).
  • the second elastic portion (543) may include a fourth opening (5432).
  • the fourth opening (5432) may include a hole formed through the second elastic portion (543).
  • the fourth opening (5432) may be positioned to correspond with the third opening (5412).
  • the fourth opening (5432) may be aligned with the third opening (5412).
  • sound generated from a diaphragm of a speaker (400) may be transmitted to a speaker hole (3012) through a conduit (402) formed in a speaker enclosure (410), openings (512, 522, 5412, 5432) of a waterproof structure (500), and another portion (532) of a mesh (530).
  • the speaker enclosure (410) may form at least a portion of the exterior of the speaker (400).
  • the speaker enclosure (410) may accommodate a speaker component or a speaker unit.
  • the speaker enclosure (410) may be defined as an acoustic housing.
  • the second elastic portion (543) may include a first cover portion (5431), a second cover portion (5433), and a protrusion (5434).
  • the first cover portion (5431) may be configured to cover an upper surface (e.g., a surface facing the +V direction of FIG. 8) of the first elastic portion (541).
  • the second cover portion (5433) may extend from an outer edge of the first cover portion (5431).
  • the second cover portion (5433) may cover an outer side surface (5413) of the first elastic portion (541).
  • an edge (530a) (e.g., an outer edge) of the mesh (530) may be covered by a second cover portion (5433).
  • a second cover portion (5433) For example, at least a portion of the edge (530a) of the mesh (530) may be exposed through an outer surface (5413) of the first elastic portion (541).
  • the edge (530a) of the mesh (530) is covered by the second cover portion (5433)
  • the inflow of liquid along the edge (530a) of the mesh (530) into the interior of the electronic device (101) may be blocked and/or reduced.
  • the protrusion (5434) may protrude from the first cover portion (5431).
  • the protrusion (5434) may be in close contact with the speaker enclosure (410).
  • the protrusion (5434) may be in close contact with the speaker enclosure (410) and may be elastically deformed. Accordingly, the space between the speaker (400) and the waterproof structure (500) may be sealed, thereby limiting and/or reducing sound generated from the speaker (400) from leaking into the interior of the electronic device (101).
  • the plate (511) of the rigid body (510) may be placed on the lower surface (e.g., the surface facing the -V direction of FIG. 8) of the first elastic portion (541).
  • the plate (511) may be placed in a recess sunken from the lower surface (541) of the first elastic portion (541).
  • an edge (511a) (e.g., an outer edge) of the plate (511) may be covered by at least a portion (5411) of the first elastic portion (541).
  • At least a portion of the plate (511) may be disposed between the first elastic portion (541) and the first adhesive member (520).
  • the side wall (3011) may include an inner surface (3011a) and an outer surface (3011b).
  • the inner surface (3011a) may face the inside of the electronic device (101), and the outer surface (3011b) may face the outside of the electronic device (101).
  • the inner surface (3011a) may be inclined relative to the outer surface (3011b).
  • the inner surface (3011a) may not be parallel to the outer surface (3011b).
  • the speaker hole (3012) may be formed penetrating from the inner surface (3011a) to the outer surface (3011b).
  • a stepped portion (3013) may be formed along the periphery of the speaker hole (3012).
  • the stepped portion (3013) may be formed at a boundary between the inner surface (3011a) and the speaker hole (3012).
  • the stepped portion (3013) may be formed at a point where an end of the inner surface of the side wall (3011) defining the speaker hole (3012) intersects the inner surface (3011a).
  • the stepped portion (3013) may be recessed so as to be stepped from the inner surface (3011a).
  • the step portion (3013) may have a first rib (5131) and a second rib (5132) of the rigid body (510) disposed thereon.
  • the first rib (5131) may be positioned on at least a portion (30131) of the step portion (3013).
  • the second rib (5132) may be positioned on another portion (30132) of the step portion (3013).
  • the waterproof structure (500) when the speaker (400) is assembled to the electronic device (101) or when the speaker (400) moves inside the electronic device (101) due to an external impact, the waterproof structure (500) may be subjected to a force in a sliding direction (e.g., in the s1 direction of FIG. 9) with respect to the inner surface (3011a).
  • the first rib (5131) when slip occurs in the waterproof structure (500), the first rib (5131) may be caught on at least a portion (30131) of the step portion (3013). Accordingly, the amount or distance by which the waterproof structure (500) slips may be limited and/or reduced. As the slip of the waterproof structure (500) is limited, deformation of the mesh (530) or deformation of the first adhesive member (520) may be limited and/or prevented.
  • the second adhesive member (520) may be covered by the first rib (5131) and the second rib (5132).
  • the second adhesive member (520) may not be visually exposed to the user through the speaker hole (3012).
  • the speaker hole (3012) may include a first portion (3012a) (e.g., the first portion (3012a) of FIG. 20 ) and a second portion (3012b) (e.g., the second portion (3012b) of FIG. 20 ) facing the first portion (3012a).
  • the first portion (3012a) and the second portion (3012b) may be defined as a portion of an inner circumferential surface of a side wall (3011) defining the speaker hole (3012).
  • a second distance (d2) between the first portion (3012a) and the second portion (3012b) may be defined as, but is not limited to, a shortest distance between the first portion (3012a) and the second portion (3012b).
  • the second distance (d2) may be defined as the minimum distance between the first portion (3012a) and the second portion (3012b).
  • the second distance (d2) may be defined as the vertical distance between the first rib (5131) and the second rib (5132).
  • the first distance (d1) between the first rib (5131) and the second rib (5132) may be greater than the second distance (d2) between the first portion (3012a) and the second portion (3012b).
  • the direction of the first distance (d1) may be different from the direction of the second distance (d2), but is not limited thereto.
  • the direction of the first distance (d1) and the direction of the second distance (d2) may be substantially the same direction.
  • the ribs (5131, 5132) may not be visually exposed to the user through the speaker hole (3012).
  • the rigid body (510) may be painted black. By painting the rigid body (510) black, the visual identification of the rigid body (510) from the inside of the speaker hole (3012) may be limited and/or reduced.
  • the rigid body (510) may have substantially the same color as the sidewall (3011). By having the rigid body (510) have substantially the same color as the sidewall (3011), the visual identification of the rigid body (510) from the inside of the speaker hole (3012) may be limited and/or reduced.
  • the mesh (530) may be at least partially accommodated and secured to the elastic member (540). Accordingly, the waterproof structure (500) may not require a separate tape for securing the mesh (530) to the elastic member (540), and the overall thickness of the waterproof structure (500) (e.g., the thickness in the V-axis direction of FIG. 8) may be thinner.
  • FIG. 10, FIG. 11, FIG. 12, FIG. 13, FIG. 14, FIG. 15, and FIG. 16 illustrate various views illustrating a manufacturing process of a waterproof structure according to one embodiment.
  • FIGS. 10 to 16 can be combined with the embodiments of FIGS. 1 to 9, or the embodiments of FIGS. 17 to 32.
  • the configurations of the embodiments of FIGS. 10 to 16 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 9, or the configurations of the embodiments of FIGS. 17 to 32.
  • a manufacturing process of a waterproof structure may include a process (21) of aligning a plurality of rigid bodies (51001) on a mold lower plate (11).
  • the manufacturing process of the waterproof structure may include a process (22) of covering a mold upper plate (12) on top of a plurality of rigid bodies (51001) aligned on a mold lower plate (11), and then injecting a first rubber layer (54111) into the rigid bodies (51001).
  • the rigid bodies (51001) and the first rubber layer (54111) may be insert-molded.
  • the manufacturing process of the waterproof structure may include a process (23) of separating the mold lower plate (11) and the mold upper plate (12) from the insert-molded rigid bodies (51001) and the first rubber layer (54111).
  • the manufacturing process of the waterproof structure may include a process (24) of aligning insert-molded rigid bodies (51001) and a first rubber layer (54111) on a mold lower plate (13) and covering them with a large-area mesh (53001).
  • the manufacturing process of the waterproof structure may include a process (25) of covering a mold top plate (14) on top of the mesh (53001) while the first rubber layer (54111) is covered by a large-area mesh (53001), and then injecting a second rubber layer (54112) into the mesh (53001).
  • the mesh (53001) and the second rubber layer (54112) may be insert-molded.
  • the manufacturing process of the waterproof structure may include a process (27) of forming a plurality of parts through a cutting jig for the injected product.
  • the plurality of parts may include, but are not limited to, a mesh (530) (e.g., the mesh (530) of FIG. 7), a first elastic part (541) (e.g., the first elastic part (541) of FIG. 7), and a rigid body (510) (e.g., the rigid body (510) of FIG. 7), respectively.
  • a third opening e.g., the third opening (5412) of FIG.
  • first elastic part (541) and the mesh (530) may form one part.
  • a waterproof structure (500) as shown in FIG. 8 can be manufactured.
  • FIGS. 17, 18, and 19 are perspective views illustrating a rigid body according to one embodiment.
  • FIGS. 17 to 19 can be combined with the embodiments of FIGS. 1 to 16, or the embodiments of FIGS. 20 to 32.
  • the configurations of the embodiments of FIGS. 17 to 19 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 16, or the configurations of the embodiments of FIGS. 20 to 32.
  • a rigid body (510) (e.g., the rigid body (510) of FIGS. 7 and 8) may include a plate (511) (e.g., the plate (511) of FIGS. 7 and 8), a first opening (512) (e.g., the first opening (512) of FIGS. 7 and 8), and at least one rib (513) (e.g., at least one rib (513) of FIGS. 7 and 8).
  • the at least one rib (513) may protrude from an inner edge or inner border of the plate (511).
  • At least one rib (513) may include a first rib (5131) and a second rib (5132).
  • the first rib (5131) may face the second rib (5132).
  • the first rib (5131) may be parallel to the second rib (5132).
  • the first rib (5131) may face the second rib (5132).
  • At least one rib (513) may include a first rib (5133) and a second rib (5134).
  • the first rib (5133) may face the second rib (5134).
  • the first rib (5133) may be parallel to the second rib (5134).
  • the first rib (5133) may not face the second rib (5134).
  • the first rib (5133) may be arranged to be staggered with respect to the second rib (5134).
  • At least one rib (513) may include one rib (5135).
  • FIG. 21 is a plan view illustrating a speaker hole according to one embodiment.
  • FIGS. 20 and 21 can be combined with the embodiments of FIGS. 1 to 19, or the embodiments of FIGS. 22 to 32.
  • the configurations of the embodiments of FIGS. 20 and 21 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 19, or the configurations of the embodiments of FIGS. 22 to 32.
  • a housing (301) (e.g., housing (301) of FIG. 6) may include a side wall (3011) (e.g., side wall (3011) of FIG. 6) and at least one speaker hole (3012, 30121) formed in the side wall (3011) (e.g., speaker hole (3012) of FIG. 6).
  • the number of speaker holes (3012) may be one, but is not limited thereto.
  • the speaker hole (3012) When looking at the outer surface of the side wall (3011) (e.g., the outer surface (3011b) of FIG. 9) (e.g., when looking at the surface facing the -Y direction of FIG. 20), the speaker hole (3012) may have an elongated shape.
  • the speaker hole (3012) may include a first portion (3012a) and a second portion (3012b) facing the first portion (3012a).
  • the width (t1) of the speaker hole (3012) (e.g., the width in the X-axis direction of FIG. 20) may be greater than the height (t2) of the speaker hole (3012) (e.g., the height in the Y-axis direction of FIG. 20).
  • the speaker hole (3012) may be aligned with a waterproof structure (e.g., waterproof structure (500) of FIG. 6) disposed inside the housing (301).
  • a waterproof structure e.g., waterproof structure (500) of FIG. 6
  • the speaker holes (30121) may be aligned with a waterproof structure (e.g., a waterproof structure (500) of FIG. 6) disposed inside the housing (301).
  • a waterproof structure e.g., a waterproof structure (500) of FIG. 6
  • Fig. 23 is a cross-sectional view of a waterproof structure according to one embodiment.
  • FIGS. 22 and 23 can be combined with the embodiments of FIGS. 1 to 21, or the embodiments of FIGS. 24 to 32.
  • the configurations of the embodiments of FIGS. 22 and 23 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 21, or the configurations of the embodiments of FIGS. 24 to 32.
  • a waterproof structure (500) may include a rigid body (510), a first adhesive member (520), a mesh (530), an elastic member (540), and a second adhesive member (550).
  • the rigid body (510) may include a plate (511).
  • the rigid body (510) may include at least one rib (513) including a first rib (5131) and a second rib (5132).
  • the elastic member (540) may be formed integrally.
  • the elastic member (540) may include a protrusion (5434).
  • the second adhesive member (550) may include an adhesive material.
  • the second adhesive member (550) may include a double-sided tape or bond.
  • the second adhesive member (550) may be accommodated in the elastic member (540).
  • the second adhesive member (550) may be positioned between the mesh (530) and the plate (511).
  • the second adhesive member (550) may be configured to secure the mesh (530) and the plate (511) to each other.
  • Fig. 24 is a cross-sectional view of a waterproof structure according to one embodiment.
  • FIG. 25 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 26 is a cross-sectional view of an electronic device according to one embodiment.
  • FIGS. 24 to 26 can be combined with the embodiments of FIGS. 1 to 23, or the embodiments of FIGS. 27 to 32.
  • the configurations of the embodiments of FIGS. 24 to 26 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 23, or the configurations of the embodiments of FIGS. 27 to 32.
  • a waterproof structure (500) (e.g., the waterproof structure (500) of FIGS. 6 to 9) may include a rigid body (510), a first adhesive member (520), a mesh (530), and an elastic member (540).
  • the elastic member (540) may include a first elastic portion (541) and a second elastic portion (543).
  • the rigid body (510) may include a plate (5111).
  • the rigid body (510) may not include at least one rib.
  • the rigid body (510) does not include at least one rib, the design freedom for the size of the first adhesive member (520) can be increased.
  • a housing (301) (e.g., housing (301) of FIG. 9) may include a side wall (3011) including an inner surface (3011a) and an outer surface (3011b), and a speaker hole (3012) formed in the side wall (3011).
  • the housing (301) may include at least one protruding portion (3016) protruding from the inner surface (3011a).
  • the at least one protruding portion (3016) may protrude from a boundary between the inner surface (3011a) and the inner surface of the speaker hole (3012).
  • the at least one protruding portion (3016) may limit and/or reduce the amount by which the first adhesive member (520) slips when the waterproof structure (500) slips in the sliding direction (s1). Accordingly, deformation of the waterproof structure (500) may be limited and/or prevented.
  • At least one protruding portion (3016) may extend along the width direction of the electronic device (101) (e.g., the X-axis direction of FIG. 25).
  • the housing (301) may include protruding portions (3016, 3017) protruding from the inner surface (3011a).
  • the protruding portions (3016, 3017) may protrude from the boundary between the inner surface (3011a) and the inner surface of the speaker hole (3012).
  • One (3016) of the protruding portions (3016, 3017) may limit and/or reduce the amount by which the first adhesive member (520) slips when the waterproof structure (500) slips in the sliding direction (s1). Accordingly, deformation of the waterproof structure (500) may be limited and/or prevented.
  • the protruding portions (3016, 3017) may be positioned in the second opening of the first adhesive member (520) (e.g., the second opening (522) of FIG.
  • the protruding portions (3016, 3017) may include a plurality of protruding portions, but are not limited thereto.
  • the housing (301) may include a single protruding portion in the shape of a loop formed along the periphery of the speaker hole (3012).
  • FIGS. 27 and 28 can be combined with the embodiments of FIGS. 1 to 26, or the embodiments of FIGS. 29 to 32.
  • the configurations of the embodiments of FIGS. 27 and 28 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 26, or the configurations of the embodiments of FIGS. 29 to 32.
  • the waterproof structure (500) may include a rigid body (5101, 5102) (e.g., the rigid body (510) of FIGS. 7 to 9), a first adhesive member (520), a mesh (5301, 5302) (e.g., the mesh (530) of FIGS. 7 to 9), and an elastic member (5401, 5402) (e.g., the elastic member (540) of FIGS. 7 to 9).
  • the rigid body (5101) and the mesh (5301) may be formed by insert injection into the speaker enclosure (410).
  • the speaker enclosure (410) may limit and/or reduce sliding of the waterproof structure (500) relative to the inner surface (3011a) of the side wall (3011) when slipping occurs in the waterproof structure (500).
  • the ribs (5131, 5132) of the rigid body (5102) e.g., the ribs (5131, 5132) of FIGS. 7 and 8) may limit slipping of the waterproof structure (500).
  • the rigid body (5102) may be formed by insert injection into the speaker enclosure (410).
  • the speaker enclosure (410) may limit and/or reduce sliding of the waterproof structure (500) relative to the inner surface (3011a) of the side wall (3011) when slipping occurs in the waterproof structure (500).
  • the ribs (5131, 5132) of the rigid body (5102) e.g., the ribs (5131, 5132) of FIGS. 7 and 8) may limit slipping of the waterproof structure (500).
  • the first adhesive member (520) may include a first adhesive portion (5201) and a second adhesive portion (5202).
  • the first adhesive portion (5201) may be positioned between the mesh (5302) and the elastic member (5402). In one embodiment, the second adhesive portion (5202) may be positioned between the mesh (5302) and the inner surface (3011a).
  • the mesh (5302) can be positioned between the first adhesive portion (5201) and the second adhesive portion (5202).
  • FIG. 30 is a cross-sectional view of an electronic device according to one embodiment.
  • FIGS. 29 and 30 can be combined with the embodiments of FIGS. 1 to 28, or the embodiments of FIGS. 31 to 32.
  • the configurations of the embodiments of FIGS. 29 and 30 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 28, or the configurations of the embodiments of FIGS. 31 to 32.
  • an electronic device (101) may include a housing (1301) (e.g., the housing (301) of FIGS. 4 to 6) that includes a side wall (1311) (e.g., the side wall (3011) of FIGS. 4 to 6).
  • the electronic device (101) may include a display (1330) (e.g., display (330) of FIGS. 4 and 5), a back plate (1380) (e.g., back plate (380) of FIGS. 4 and 5), a speaker (1400) (e.g., speaker (390) of FIGS. 4 and 5, or speaker (400) of FIG. 6), or a waterproof structure (1500) (e.g., waterproof structure (500) of FIG. 6).
  • a display (1330) e.g., display (330) of FIGS. 4 and 5
  • a back plate (1380) e.g., back plate (380) of FIGS. 4 and 5
  • a speaker (1400) e.g., speaker (390) of FIGS. 4 and 5, or speaker (400) of FIG. 6
  • a waterproof structure (1500) e.g., waterproof structure (500) of FIG. 6
  • the speaker (1400) may include a speaker enclosure (1410) and a speaker component (1420) housed in the speaker enclosure (1410).
  • the waterproof structure (1500) may include a rigid body (1510), a first adhesive member (1520), a first mesh (1530), an elastic member (1540), a second mesh (1560), and a bracket (1570).
  • the second mesh (1560) may be arranged in the speaker hole (1312) to block foreign matter from entering the speaker (1400).
  • the bracket (1570) may be bonded to the inner surface of the side wall (1311) via the first adhesive member (1520).
  • the bracket (1570) may form at least a portion of the acoustic path.
  • the elastic member (1540) can be positioned between the rigid body (1510) and the bracket (1570).
  • the first mesh (1530) may be positioned within the speaker enclosure (1410).
  • the first mesh (1530) may include a membrane configured to block liquid from entering the speaker component (1420).
  • the rigid body (1510) may include a first rib (1511) and a second rib (1512).
  • the first rib (1511) and the second rib (1512) may be configured to cover the outer surface of the elastic member (1540).
  • the rigid body (1510) may include a first rib (1513) and a second rib (1514).
  • the first rib (1513) and the second rib (1514) may be configured to cover the inner surface of the elastic member (1540).
  • FIG. 31 is a cross-sectional view of an electronic device according to one embodiment.
  • FIG. 32 is a cross-sectional view of an electronic device according to one embodiment.
  • FIGS. 31 and 32 can be combined with the embodiments of FIGS. 1 to 30.
  • the configurations of the embodiments of FIGS. 31 and 32 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 30.
  • the waterproof structure (500) may include a rigid body (5104, 5105) (e.g., the rigid body (5104, 5105) of FIGS. 7 to 9), and a first adhesive member (520).
  • the rigid body (5104, 5105) may include a plate (5114, 5115).
  • the rigid body (5104, 5105) may include a first rib (51314, 51315) and a second rib (51324, 51325) protruding from a plate (5114, 5115).
  • the first rib (51314, 51315) and the second rib (51324, 51325) may be configured to engage the step portions (30131, 30132) to limit and/or prevent slipping of the waterproof structure (500).
  • the rigid body (5104, 5105) may include a plurality of first openings (5124, 5125) formed in the plate (5114, 5115).
  • the plurality of first openings (5124, 5125) may be configured to block foreign substances of relatively large size from entering the speaker (400) from the outside of the electronic device (101).
  • the waterproof structure (500) may include a mesh (530) (e.g., the mesh (530) of FIGS. 7 to 9).
  • the size of the plurality of first openings (5124) of the rigid body (5104) may be larger than the size of the plurality of microscopic holes formed in the mesh (530).
  • an elastic member (540) may be included.
  • the elastic member (540) may include a first elastic portion (541) and a second elastic portion (543).
  • the waterproof structure (500) may not include a mesh.
  • the elastic member (5405) may be formed integrally.
  • the elastic member (5405) may be formed through insert injection with the rigid body (5105).
  • An electronic device may include a speaker for providing sound to a user.
  • the speaker may be positioned within a housing of the electronic device and output sound to the outside of the electronic device.
  • a speaker hole may be formed in the housing for outputting sound generated from the speaker to the outside.
  • the electronic device may include a waterproof structure to limit or prevent external foreign substances and/or liquids from entering the interior of the electronic device through the speaker hole.
  • an electronic device can be provided that can limit and/or reduce deformation of a waterproof structure through a waterproof structure including a rigid body having a hard material.
  • an electronic device with improved design quality can be provided by limiting deformation of a mesh or tape of a waterproof structure.
  • a waterproof structure and an electronic device including the same can be provided to improve sound performance output from a speaker.
  • an electronic device can be provided in which slippage of the waterproof structure is limited and the rigidity of the waterproof structure is improved.
  • an electronic device (101) may include a housing (301) including a side wall (3011) and a speaker hole (3012) formed in the side wall (3011).
  • the electronic device (101) may include a speaker (400) disposed within the housing (301) and configured to output sound through the speaker hole (3012).
  • the electronic device (101) may include a waterproof structure (500) disposed between the inner surface (3011a) of the side wall (3011) and the speaker (400).
  • the waterproof structure (500) may include a rigid body (510) disposed between the speaker (400) and the inner surface (3011a), the rigid body including a plate (511), a first opening (512) formed in the plate (511), a first rib (5131) protruding from the plate (511), and a second rib (5132) protruding from the plate (511) and spaced apart from the first rib (5131).
  • the waterproof structure (500) may include a first adhesive member (520) disposed between the rigid body (510) and the inner surface (3011a) and including an adhesive material.
  • the waterproof structure (500) may include an elastic member (540) disposed between the rigid body (510) and the speaker (400) and including an elastic material.
  • the waterproof structure (500) may include a mesh (530) at least partially accommodated in the elastic member (540).
  • the speaker hole (3012) may include a first portion (3012a) and a second portion (3012b) facing the first portion (3012a).
  • the first distance between the first rib (5131) and the second rib (5132) may be greater than the second distance between the first portion (3012a) and the second portion (3012b).
  • the first adhesive member (520) may include a second opening (522) positioned corresponding to the first opening (512).
  • the first rib (5131) and the second rib (5132) may be arranged to penetrate the second opening (522).
  • the first rib (5131) and the second rib (5132) may protrude from the plate (511) toward the speaker hole (3012).
  • the inner edge of the first adhesive member (520) may be spaced apart from the first rib (5131) and the second rib (5132).
  • the housing (301) may further include a stepped portion (3013) that is stepped from the inner surface (3011a) of the side wall (3011).
  • the step portion (3013) may be formed along the periphery of the speaker hole (3012).
  • the first rib (5131) and the second rib (5132) may be arranged in the step portion (3013).
  • the first rib (5131) may be parallel to the second rib (5132).
  • the elastic material may include rubber.
  • the elastic member (540) may include a first elastic portion (541) that accommodates at least a portion (531) of the mesh (530).
  • the elastic member (540) may include a second elastic portion (543) configured to surround the first elastic portion (541) and contact the speaker (400).
  • the first elastic portion (541) may include a third opening (5412) positioned corresponding to the first opening (512).
  • another portion (532) of the mesh (530) may be positioned to be exposed through the third opening (5412).
  • At least a portion of the plate (511) may be disposed between the first adhesive member (520) and the first elastic portion (541).
  • the edge (530a) of the mesh (530) may be configured to be covered by the second elastic portion (543).
  • the plate (511) may be placed on the lower surface of the first elastic portion (541).
  • the second elastic portion (543) may include a first cover portion (5431) configured to cover an upper surface of the first elastic portion (541).
  • the second elastic portion (543) may be configured to cover the outer surface of the first elastic portion (541).
  • the speaker hole (3012) when looking at the outer surface (3011b) of the side wall (3011), the speaker hole (3012) may have an elongated shape.
  • the inner surface (3011a) of the side wall (3011) may be inclined with respect to the outer surface (3011b) of the side wall (3011).
  • the waterproof structure (500) may further include a second adhesive member (550) disposed between the mesh (530) and the plate (511) and including an adhesive material.
  • the second adhesive member (550) can be accommodated in the elastic member (540).
  • an electronic device (101) may include a housing (301) including a side wall (3011) and at least one speaker hole (3012) formed in the side wall (3011).
  • the electronic device (101) may include a speaker (400) disposed within the housing (301) and configured to output sound through the speaker hole (3012).
  • the electronic device (101) may include a waterproof structure (500) disposed between the inner surface (3011a) of the side wall (3011) and the speaker (400).
  • the waterproof structure (500) may include a rigid body (510) disposed between the speaker (400) and the inner surface (3011a), the rigid body including a plate (511) and at least one first opening (512) formed in the plate (511).
  • the waterproof structure (500) may include a first adhesive member (520) disposed between the rigid body (510) and the inner surface (3011a) and including an adhesive material.
  • the waterproof structure (500) may include an elastic member (540) disposed between the rigid body (510) and the speaker (400) and including an elastic material.
  • the waterproof structure (500) may include a mesh (530) at least partially accommodated in the elastic member (540).
  • the rigid body (510) may include at least one rib (513) extending from the plate (511) toward the speaker hole (3012).
  • the housing (301) may include a plurality of speaker holes (30121).
  • the housing (301) may include at least one protruding portion (3016, 3017) protruding from the inner surface (3011a) toward the waterproof structure (500).
  • the rigid body (5104) may include a plurality of first openings (5124).

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Telephone Set Structure (AREA)

Abstract

Est divulgué un dispositif électronique comprenant : un boîtier comprenant un trou de haut-parleur formé dans une paroi latérale ; un haut-parleur (400) disposé à l'intérieur du boîtier ; et une structure étanche à l'eau disposée entre la surface interne de la paroi latérale et le haut-parleur, la structure étanche à l'eau comprenant : un corps rigide qui est disposé entre le haut-parleur et la surface interne, et qui comprend une plaque, une première ouverture formée dans la plaque, une première nervure faisant saillie à partir de la plaque, et une seconde nervure faisant saillie à partir de la plaque et étant espacée de la première nervure ; un premier élément adhésif disposé entre le corps rigide et la surface interne ; un élément élastique disposé entre le corps rigide et le haut-parleur ; et un maillage au moins partiellement logé dans l'élément élastique, le trou de haut-parleur comprend une première partie et une seconde partie faisant face à la première partie, et une première distance entre la première nervure et la seconde nervure peut être supérieure à une seconde distance entre la première partie et la seconde partie.
PCT/KR2025/007859 2024-07-01 2025-06-10 Dispositif électronique comprenant une structure étanche à l'eau Pending WO2026010185A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
US19/252,418 US20260003404A1 (en) 2024-07-01 2025-06-27 Electronic device including waterproofing structure

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
KR10-2024-0086253 2024-07-01
KR20240086253 2024-07-01
KR10-2024-0105298 2024-08-07
KR1020240105298A KR20260004157A (ko) 2024-07-01 2024-08-07 방수 구조를 포함하는 전자 장치

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US19/252,418 Continuation US20260003404A1 (en) 2024-07-01 2025-06-27 Electronic device including waterproofing structure

Publications (1)

Publication Number Publication Date
WO2026010185A1 true WO2026010185A1 (fr) 2026-01-08

Family

ID=98318860

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2025/007859 Pending WO2026010185A1 (fr) 2024-07-01 2025-06-10 Dispositif électronique comprenant une structure étanche à l'eau

Country Status (2)

Country Link
US (1) US20260003404A1 (fr)
WO (1) WO2026010185A1 (fr)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180013613A (ko) * 2016-07-29 2018-02-07 삼성전자주식회사 전자 장치
KR20190057286A (ko) * 2016-10-17 2019-05-28 엘지전자 주식회사 이동 단말기
KR20190127184A (ko) * 2018-05-03 2019-11-13 삼성전자주식회사 전자장치의 관로 구조 및 이를 포함하는 전자장치
CN113132830A (zh) * 2019-12-31 2021-07-16 荣耀终端有限公司 一种扬声器及电子设备
KR20230012172A (ko) * 2021-07-15 2023-01-26 삼성전자주식회사 방수 구조물을 포함하는 전자 장치

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20180013613A (ko) * 2016-07-29 2018-02-07 삼성전자주식회사 전자 장치
KR20190057286A (ko) * 2016-10-17 2019-05-28 엘지전자 주식회사 이동 단말기
KR20190127184A (ko) * 2018-05-03 2019-11-13 삼성전자주식회사 전자장치의 관로 구조 및 이를 포함하는 전자장치
CN113132830A (zh) * 2019-12-31 2021-07-16 荣耀终端有限公司 一种扬声器及电子设备
KR20230012172A (ko) * 2021-07-15 2023-01-26 삼성전자주식회사 방수 구조물을 포함하는 전자 장치

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