WO2026037704A1 - Procédé de fabrication d'un élément de micro-miroir et système micro-électro-mécanique - Google Patents

Procédé de fabrication d'un élément de micro-miroir et système micro-électro-mécanique

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Publication number
WO2026037704A1
WO2026037704A1 PCT/EP2025/072641 EP2025072641W WO2026037704A1 WO 2026037704 A1 WO2026037704 A1 WO 2026037704A1 EP 2025072641 W EP2025072641 W EP 2025072641W WO 2026037704 A1 WO2026037704 A1 WO 2026037704A1
Authority
WO
WIPO (PCT)
Prior art keywords
mirror substrate
mirror
coating
reflective
micro
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/EP2025/072641
Other languages
German (de)
English (en)
Inventor
Sebastian Strobel
Katharina BROCH
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Carl Zeiss SMT GmbH
Original Assignee
Carl Zeiss SMT GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carl Zeiss SMT GmbH filed Critical Carl Zeiss SMT GmbH
Publication of WO2026037704A1 publication Critical patent/WO2026037704A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29D—PRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D11/00—Producing optical elements, e.g. lenses or prisms
    • B29D11/00596—Mirrors
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/0891—Ultraviolet [UV] mirrors
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70075—Homogenization of illumination intensity in the mask plane by using an integrator, e.g. fly's eye lens, facet mirror or glass rod, by using a diffusing optical element or by beam deflection
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70058—Mask illumination systems
    • G03F7/70091—Illumination settings, i.e. intensity distribution in the pupil plane or angular distribution in the field plane; On-axis or off-axis settings, e.g. annular, dipole or quadrupole settings; Partial coherence control, i.e. sigma or numerical aperture [NA]
    • G03F7/70116—Off-axis setting using a programmable means, e.g. liquid crystal display [LCD], digital micromirror device [DMD] or pupil facets
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/08—Mirrors
    • G02B5/09—Multifaceted or polygonal mirrors, e.g. polygonal scanning mirrors; Fresnel mirrors

Definitions

  • the invention relates to a method for manufacturing at least one micromirror element, such as can be used in micro-electro-mechanical systems, in particular for use in semiconductor technology equipment, and to a corresponding micro-electro-mechanical system.
  • semiconductor technology equipment refers to equipment used for the production or testing of microstructured devices or the components required for their production.
  • An example of such equipment is a projection exposure system for photolithography.
  • Photolithography is used to manufacture microstructured components, such as integrated circuits.
  • the projection exposure system used comprises an illumination system and a projection system.
  • the image of a mask (also called a reticulum) illuminated by the illumination system is projected in a reduced size by means of the projection system onto a substrate, for example a silicon wafer, coated with a photosensitive layer and arranged in the image plane of the projection system, in order to transfer the mask structure onto the photosensitive coating of the substrate.
  • a substrate for example a silicon wafer
  • a photosensitive layer coated with a photosensitive layer and arranged in the image plane of the projection system, in order to transfer the mask structure onto the photosensitive coating of the substrate.
  • two faceted mirrors are usually arranged in the beam path between the actual exposure radiation source and the mask to be illuminated.
  • the faceted mirror that is closer to the source of the light source in the beam path is often a so-called field faceted mirror, the other a so-called pupil faceted mirror.
  • MEMS mirror array namely a mirror array made of micro-electro-mechanical systems (MEMS).
  • MEMS Micro-electro-mechanical systems
  • a MEMS essentially comprises a basic structure on which movable elements are arranged that can be controlled relative to the basic structure.
  • Mirror elements can each be moved individually relative to one
  • the mirror elements are mounted on a common basic structure.
  • At least one actuator is provided for each mirror element, allowing it to be adjusted along a predefined degree of freedom.
  • the mirror elements are pivotable about two axes perpendicular to each other and parallel to the base, and sufficient actuators are provided to allow the mirror elements to pivot independently about these axes.
  • Sensors can also be provided for the individual mirror elements to determine their position relative to the base, thus enabling monitoring of the mirrors' alignment.
  • a particularly advantageous embodiment for the mirrors of a MEMS mirror array is described in DE 10 2015 204 874 A1.
  • a method for producing a micromirror or a MEMS mirror array comprising a plurality of such micromirrors is disclosed - together with further details of a possible embodiment of the micromirror - in DE 10 2015 220 018 Al .
  • the object of the present invention is to provide a method for manufacturing at least one micromirror element and a micro-electro-mechanical system in which the challenges known from the prior art no longer occur or only occur to a lesser extent.
  • the invention relates to a method for manufacturing at least one micromirror element for use in micro-electro-mechanical systems, in particular for semiconductor technology equipment, comprising the steps:
  • the invention further relates to a micro-electro-mechanical system, in particular for equipment for semiconductor technology, comprising a micro-electro-mechanically movable element at least with respect to a basic structure in at least one degree of freedom by at least one actuator, wherein the micro-electro-mechanically movable element comprises a micro-mirror element produced according to the invention.
  • a micro-electro-mechanical system in particular for equipment for semiconductor technology, comprising a micro-electro-mechanically movable element at least with respect to a basic structure in at least one degree of freedom by at least one actuator, wherein the micro-electro-mechanically movable element comprises a micro-mirror element produced according to the invention.
  • a “micromirror element” is the single element of a micro-electro-mechanically adjustable micromirror that forms the actual reflecting mirror surface.
  • the micromirror element comprises at least the structural element forming the surface in question.
  • other elements such as connecting elements or elements required for the formation of actuators and/or sensors in the final use in a micro-electro-mechanical system, may also be formed onto the micromirror element, particularly on the side facing away from the reflecting mirror surface.
  • a micromirror element, its structural element, and/or its mirror surface can typically have dimensions of 5 mm x 5 mm, 2 mm x 2 mm, or 1 mm x 1 mm.
  • a “reflective coating” is a coating that reflects radiation incident on the micromirror element during its subsequent proper use. Since radiation at wavelengths for which structural elements made of known materials are regularly not reflective or only insufficiently reflective is used, particularly in semiconductor technology systems, it is known to achieve or ensure sufficient reflection by means of a suitable coating.
  • the reflective coating can be adapted to the wavelength expected for the intended application and, for example, reflect radiation in the EUV range with a wavelength of 13.5 nm.
  • a surface is “irreversibly formed” when, after completion of the forming process, the surface retains the formed shape. fundamentally, it retains this state permanently. In particular, there is neither an elastic recovery of even parts of the structure forming the surface, nor can the surface be returned to its flat original state by simple measures such as applying a force and/or changing the temperature.
  • a coating is considered “curable” if the strength of a material—in particular its hardness and toughness—can be increased by suitable measures tailored to the material, such as irradiation with UV light or temporary heating. It is also possible for a material to “cure itself” under ordinary ambient conditions, for example, by drying.
  • the method according to the invention starts with a planar mirror substrate that is flat on both sides, in order to create one or more micromirror elements with an arbitrarily shaped mirror surface – i.e., the surface intended for reflection and, in particular, suitably coated.
  • the invention does not rely on stresses statically introduced into a micromirror, which are intended to keep the micromirror permanently in a stress state that produces the desired curvature, but in which the release of internal stresses, e.g., due to temperature fluctuations, leads to deviations from the desired curvature.
  • the provided planar mirror substrate preferably has a thickness of 1 mm or less, more preferably of 500 pm or less, and particularly preferably of 100 pm or less.
  • the thickness of the provided planar mirror substrate is often too small to reliably incorporate cooling channels for the passage of cooling fluid or similar substances before or after the shaping process. Furthermore, the supply and drainage of cooling fluid to and from a mirror substrate can be challenging.
  • the provided mirror substrate is preferably free of cooling channels, even after carrying out the method according to the invention.
  • a predetermined shape is then applied, at least on the side of the mirror substrate intended to be reflective.
  • the shape of the side intended to be reflective may also appear on the other side of the mirror substrate, usually as a negative.
  • the side of the mirror substrate not intended to be reflective may remain flat.
  • a reflective coating is applied to at least the side of the mirror substrate intended to be reflective.
  • the coating must be selected to be reflective with respect to the incident radiation expected when using the micromirror element.
  • the reflective coating is applied before or after the desired shape has been applied.
  • the surface to be provided with a shape can be formed by plastically deforming the mirror substrate or a coating applied thereon, preferably a curable one.
  • the shaping can be achieved, in particular, by imprinting a negative die of the desired shape.
  • the desired shape is thus introduced by pressing in a suitable die.
  • the force required for the imprinting depends on the desired shape and the material properties of the mirror substrate or the coating applied thereon.
  • the desired shape can generally be pressed in with manageable force before the final curing, whereby subsequent curing ensures that the imprinted shape is permanently and irreversibly retained.
  • the desired predefined shape is achieved by spatially resolved ablation of the provided mirror substrate or a coating applied to it.
  • spatially resolved ablation in this context means that for every point in the plane of the initial surface of the mirror substrate or a coating applied to it, the required material removal is determined by the predefined shape and is selectively removed.
  • grayscale lithography is known for the production of 3D structures on surfaces.
  • the desired structure is formed onto the surface to be shaped using a lacquer, and then the lacquer is removed by etching until no lacquer remains. In areas with no lacquer or only a thin lacquer layer, the material beneath the lacquer is also removed, thus transferring the initial shape of the lacquer into the underlying material.
  • irreversible deformation can be achieved through an additive manufacturing process.
  • material can be applied to the mirror substrate in such a targeted manner that the desired shape is achieved on the mirror substrate after the application process is complete.
  • the application of material can be carried out directly on the mirror substrate, e.g., spatially resolved.
  • the side of the coating element intended for attachment to the mirror substrate is preferably designed to be flat.
  • the attachment can be achieved, for example, by a fabric bond.
  • the filling material is preferably curable, and the curing can take place completely or partially while the cavity is still formed by the mold or a membrane that may be removed later.
  • Irreversible deformation can also be achieved by permanently connecting the mirror substrate to a support structure, whereby the mirror substrate is deformed by bending.
  • the support structure has, for example, a plurality of connection points not lying in a plane, to which the mirror substrate is permanently attached, for example, by a fabric closure.
  • the mirror substrate With sufficient stiffness and suitable design of the support structure, the mirror substrate, and in particular its side intended to reflect and regularly facing away from the support structure, acquires the desired shape.
  • a reversible transformation of the mirror substrate is also possible.
  • the reversible transformation of the mirror substrate can be initially set, for example, using clamping elements, and then permanently maintained.
  • monitoring and/or readjustment during the use of the micromirror element can also take place.
  • an active, controllable layer is applied to the mirror substrate to introduce a predetermined shape, which, when appropriately controlled, causes a reversible deformation of the mirror substrate.
  • the active layer can preferably be thermally, piezoelectrically, or inductively adjustable.
  • the desired shape can be achieved by targeted, and optionally spatially resolved, changes in temperature, an applied voltage, or an alternating magnetic field.
  • an actively controllable layer an actively controllable structure can also be provided.
  • a membrane is arranged on the reflective side of the provided mirror substrate, which can be selectively deformed by means of at least one actuator arranged on the mirror substrate.
  • a membrane can be stretched between several points, at least one of which can be adjusted, e.g. piezoelectrically.
  • micromirror element for use in micro-electro-mechanical systems
  • the specified shape for the reflective side of the provided mirror substrate can be any free form in which the correspondingly shaped surface no longer lies exclusively in a plane.
  • the shape can include a curvature such that the radiation incident in the region of curvature is focused and/or dispersed.
  • the shape in this region can be spherical or aspherical. If the surface of a micromirror is concave-spherically shaped, it is a concave mirror with a concave reflective surface in the form of a spherical surface with a constant radius of curvature in all directions.
  • the mirror substrate can preferably be attached to a structure which is micro-electro-mechanically movable relative to a basic structure in at least one degree of freedom by at least one actuator to form an electro-mechanically movable element.
  • the micro-electro-mechanical system is characterized in that at least one electro-mechanically movable element comprises a micromirror element produced according to the invention.
  • the micro-electro-mechanical system can be a MEMS mirror array in which the individual micromirrors are produced using the method according to the invention.
  • Figure 1 a schematic representation of a projection exposure system for photolithography comprising a micro-electro-mechanical system according to the invention
  • Figure 2 a schematic representation of the micro-electro-mechanical system according to the invention from Figure 1;
  • Figures 3-9 schematic representation of different manufacturing processes of the micromirror elements from Figure 2.
  • Figure 1 shows a projection exposure system 1 for photolithography as an example of a system for semiconductor technology in a schematic meridional section.
  • the projection exposure system 1 comprises an illumination system 10 and a projection system 20.
  • the illumination system 10 comprises an exposure radiation source 13, which, in the illustrated embodiment, emits illumination radiation comprising at least useful light in the EUV range, i.e., in particular with a wavelength between 5 nm and 30 nm.
  • the exposure radiation source 13 can be a plasma source, for example, an LPP source (Laser Produced Plasma, plasma generated using a laser) or a DPP source (Gas Discharge Produced Plasma, plasma generated by gas discharge). It can also be a synchrotron-based radiation source.
  • the exposure radiation source 13 can also be a
  • FELs Free-electron lasers
  • the illumination radiation emanating from the light source 13 is first focused in a collector 14.
  • the collector 14 can be a collector with one or more ellipsoidal and/or hyperboloid reflective surfaces.
  • the at least one reflective surface of the collector 14 can be illuminated with grazing incidence (Gl), i.e., with angles of incidence greater than 45°, or with normal incidence (NI), i.e., with angles of incidence less than 45°.
  • Gl grazing incidence
  • NI normal incidence
  • the collector 14 can be structured and/or coated, on the one hand, to optimize its reflectivity for the useful radiation and, on the other hand, to suppress stray light.
  • the illumination radiation propagates through an intermediate focus in an intermediate focal plane 15.
  • the intermediate focal plane 15 can, in principle, be used for the separation – including structural separation – of the illumination system 10 into a radiation source module, comprising the exposure radiation source 13 and the collector 14, and the illumination optics 16 described below. With such a separation, the radiation source module and the illumination optics 16 then together form a modularly constructed illumination system 10.
  • the illumination optics 16 comprise a deflecting mirror 17.
  • the deflecting mirror 17 can be a planar deflecting mirror or, alternatively, a mirror with a beam-shaping effect in addition to the mere deflection effect.
  • the deflecting mirror 17 can be designed as a spectral filter, which The useful wavelength of the illumination radiation separates it from unwanted light of a different wavelength.
  • the deflecting mirror 17 deflects the radiation originating from the exposure radiation source 13 onto a first faceted mirror 18. Provided the first faceted mirror
  • the first faceted mirror 18 comprises a plurality of micromirrors 18' that can be individually pivoted about two axes perpendicular to each other for the controllable formation of facets, each of which is preferably equipped with an orientation sensor (not shown) for determining the orientation of the micromirror 18'.
  • the first faceted mirror 18 is thus a microelectromechanical system (MEMS system), as described, for example, in DE 10 2008 009 600 A1.
  • a second faceted mirror 19 is arranged downstream of the first faceted mirror 18, resulting in a double-faceted system, the basic principle of which is also referred to as a honeycomb condenser (fly's eye integrator). If the second faceted mirror 19 is arranged in a pupil plane of the illumination optics 16 – as in the illustrated embodiment – it is also referred to as a pupil faceted mirror.
  • the second faceted mirror 19 is arranged in a pupil plane of the illumination optics 16 – as in the illustrated embodiment – it is also referred to as a pupil faceted mirror.
  • 19 can also be arranged at a distance from a pupil plane of the illumination optics 16, whereby the combination of the first and the second faceted mirrors 18, 19 results in a specular reflector, as is used, for example, in the
  • the second faceted mirror 19 need not be composed of pivotable micromirrors, but can instead comprise individual facets formed from one or a manageable number of mirrors that are significantly larger than micromirrors, and which are either fixed or tiltable only between two defined end positions.
  • a microelectromechanical system comprising a plurality of micromirrors 19' that are individually pivotable about two axes perpendicular to each other, each preferably comprising an orientation sensor.
  • the individual facets of the first faceted mirror 18 are imaged onto the object field 11, although this is regularly only an approximate image.
  • the second faceted mirror 19 can be the last beam-forming or even the last mirror for the illumination radiation in the beam path before the object field 11.
  • Each of the facets of the second faceted mirror 19 is assigned to exactly one of the facets of the first faceted mirror 18 to form an illumination channel for illuminating the object field 11. This can result in illumination according to Köhler's principle.
  • the facets of the first faceted mirror 18 are each imaged superimposed on an associated facet of the second faceted mirror 19 to illuminate the object field 11.
  • the illumination of the object field 11 is as homogeneous as possible. It preferably exhibits a uniformity error of less than 2%. Field uniformity can be achieved by superimposing different illumination channels.
  • the intensity distribution in the entrance pupil of the projection system 20 described below can also be adjusted. This intensity distribution is also referred to as the illumination setting.
  • the pupil faceted mirror 19 can be arranged tilted relative to a pupil plane of the projection system 20, as described, for example, in DE 10 2017 220 586 A1.
  • the second faceted mirror 19 is arranged in a surface conjugated to the entrance pupil of the projection system 20. Deflection mirror 17 and the two faceted mirrors 18, 19 are each tilted relative to the object plane 12 and relative to each other.
  • a transmission optic comprising one or more mirrors can be provided in the beam path between the second faceted mirror 19 and the object field 11.
  • the transmission optic can, in particular, comprise one or two mirrors for normal incidence (NI mirrors, normal incidence mirrors) and/or one or two mirrors for grazing incidence (Gl mirrors, grazing incidence mirrors).
  • NI mirrors normal incidence
  • Gl mirrors grazing incidence mirrors
  • different positions of the entrance pupil for the tangential and sagittal beam paths of the projection system 20 described below can be taken into account.
  • the object field 11 in the reticulum plane 12 is transferred to the image field 21 in the image plane 22.
  • the projection system 20 comprises a plurality of mirrors Mi, which are numbered according to their arrangement in the beam path of the projection exposure system 1.
  • the mirrors Mi are optical elements 25.
  • the projection system 20 comprises six mirrors Mx to M6 as optical elements 25. Alternatives with four, eight, ten, twelve, or any other number of mirrors Mi are also possible.
  • the penultimate mirror M5 and the last mirror M6 each have an aperture for the illumination radiation, making the projection system 20 a double-obscured optical system.
  • the projection system 20 has an image-side numerical aperture that is greater than 0.3 and can also be greater than 0.6, for example, 0.7 or 0.75.
  • the reflective surfaces of the mirrors Mi can be designed as freeform surfaces without an axis of rotational symmetry.
  • the reflective surfaces of the mirrors Mi can also be designed as aspherical surfaces with exactly one axis of rotational symmetry of the reflective surface shape.
  • the mirrors Mi just like the mirrors of the illumination optics 16, can have highly reflective coatings for the illumination radiation. These reflective coatings can be multilayer- Coatings, especially those with alternating layers of molybdenum and silicon, may be designed.
  • the projection system 20 has a large object-image offset in the y-direction between a y-coordinate of a center of the object field 11 and a y-coordinate of the center of the image field 21.
  • This object-image offset in the y-direction can be approximately as large as a z-distance between the object plane 12 and the image plane 22.
  • the projection system 20 can, in particular, be anamorphic, i.e., it has, in particular, different image scales ⁇ x , ⁇ y in the x and y directions.
  • An image scale ⁇ of 0.25 corresponds to a reduction in the ratio of 4:1, while an image scale ⁇ of 0.125 results in a reduction in the ratio of 8:1.
  • a positive sign for the image scale ⁇ indicates an image without image inversion, a negative sign an image with image inversion.
  • magnification scales are also possible. Magnification scales ⁇ x and ⁇ y with the same sign and absolutely identical in the x and y directions are also possible.
  • the number of intermediate image planes in the x- and y-directions in the beam path between the object field 11 and the image field 21 can be the same or different, depending on the design of the projection system 20. Examples of projection systems 20 with different numbers of such intermediate images in the x- and y-directions are known from US 2018/0074303 Al. [0066]
  • the projection system 20 can in particular have a homocentric entrance pupil. This can be accessible. However, it can also be inaccessible.
  • a reticle 30 (also called a mask) arranged in the object field 11 is exposed by the illumination system 10 and transferred to the image plane 21 by the projection system 20.
  • the reticle 30 is held by a reticle holder 31.
  • the reticle holder 31 can be moved, in particular in a scan direction, by means of a reticle displacement drive 32.
  • the scan direction is in the y-direction.
  • the reticule 30 can have an aspect ratio between 1:1 and 1:3, preferably between 1:1 and 1:2, and particularly preferably 1:1 or 1:2.
  • the reticule 30 can be substantially rectangular and is preferably 5 to 7 inches (12.70 to 17.78 cm) long and wide, more preferably 6 inches (15.24 cm) long and wide.
  • the reticule 30 can be 5 to 7 inches (12.70 to 17.78 cm) long and
  • a structure on the reticulum 30 is imaged onto a photosensitive layer of a wafer 35 arranged in the image plane 22 within the image field 21.
  • the wafer 35 is held by a wafer holder 36.
  • the wafer holder 36 can be displaced, in particular along the y-direction, via a wafer transfer drive 37.
  • the displacement of the reticulum 30 via the reticulum transfer drive 32 and of the wafer 35 via the wafer transfer drive 37 can be synchronized with each other.
  • FIG. 2 shows a sectional view through a part of a micro-electro-mechanical system 100.
  • the micro-electro-mechanical system 100 comprises a basic structure 101 on which a plurality of elements 103 are arranged to be movable, namely pivotable about two degrees of freedom.
  • Actuators 102 are provided for the individual movement of each of the elements 103, namely for pivoting about the two degrees of freedom, so that each of the elements 103 is a micro-electro-mechanical movable element 103.
  • the element 103 comprises a flat base plate 104, via which the connection to the base structure 101 is made and on which parts of the actuators 102 are also arranged.
  • a micromirror 200 is arranged on the upper side of the base plate 104 of each of the micro-electro-mechanically movable elements 103.
  • the micromirror 200 comprises a planar mirror substrate 210, which—as explained below—is flat on both sides at the beginning of the micromirror 200's manufacture.
  • a reflective coating 220 is applied to the side 215 of the mirror substrate 210 that is intended to be reflective and faces away from the base plate 104 in the state of use.
  • This same side 215 also has a shape that is specified such that the micromirror 200 achieves the desired properties in the course of the micro-electro-mechanical system 100. exhibits optical properties.
  • side 215 of the micromirror 200 is concave-spherically shaped.
  • FIGs 3 to 9 illustrate various manufacturing processes by which micromirrors 200, as shown in Figure 2, can be produced.
  • the design of the micromirrors 200 may well differ from the embodiment shown in Figure 2.
  • the essential point is initially only that the reflective side of the mirror substrate 210 has the specified shape at the end of the manufacturing process or that it can be produced directly. Any necessary adjustments to the elements 103 (see Figure 2) for attaching the respective micromirrors 210 to them are within the scope of expert knowledge.
  • the application of the reflective coating 220 (see Figure 2) is not shown, at least not graphically. In these manufacturing processes, this coating 220 can be applied in various process steps. For the sake of clarity, the reflective coating 220 has been omitted from Figures 3 to 7.
  • micromirrors 200 are first formed on the basis of a common mirror substrate 210, without this being explained separately below, before the micromirrors 200 are then suitably separated at the end of the manufacturing process.
  • Figure 3 shows a first manufacturing process according to the invention in two variants. On the left On the left side of Figure 3, the method is shown without, on the right side with an additional coating 211 on the mirror substrate 210.
  • a planar mirror substrate 210 is provided, which is flat on both sides, especially on the side 215 to be shaped.
  • the side 215 in question is provided with a coating 211 made of a material that is inherently dimensionally stable but can still be plastically deformed with minimal force.
  • the coating 211 can be cured, for example, by UV irradiation, which gives the coating 211 a high stiffness.
  • a negative die 300 of the specified shape is provided.
  • the die 300 comprises the negative mold for a plurality of micromirrors 200.
  • the negative die 300 is used to introduce the shape directly into the mirror substrate 210 (see Figure 3b, left) or into the coating 211 located on the mirror substrate 210 (see Figure 3b, right).
  • the force required for the irreversible shaping is achieved through the direct plastic deformation of the mirror substrate.
  • the temperature of 210 is usually very high, but can be reduced somewhat by temporarily increasing the temperature of the mirror substrate 210. During the plastic deformation of the coating
  • the required force is usually more manageable, since the final stiffness of the material to be formed before the coating 211 hardens is less than the desired or required stiffness in the hardened state.
  • the negative die 300 can be removed (see Figure 3c).
  • the coating 211 is then cured, for example, by irradiation with UV light. It is also conceivable to cure the coating 211 while the negative die 300 is still in contact with it (see Figure 3b, right). In this case, it is only necessary to ensure that the energy required for curing can be supplied to the coating 211. If the coating 211 cures by heat, it may be sufficient to heat the negative die 300. If curing only occurs when the coating 211 is exposed to radiation of a specific wavelength, e.g., UV radiation, the negative die 300 can be designed to be transparent to this radiation.
  • a specific wavelength e.g., UV radiation
  • the mirror substrate 210 and, if applicable, the coating 211 applied thereto are separated to create micromirror elements 200 that can be arranged on micro-electro-mechanically movable elements 103 of a micro-electro-mechanical system 100 (see Figure 2).
  • the reflective coating 220 can, in principle, be applied at any of the process steps shown in Figure 3. However, it is preferred that the reflective coating be applied after the removal of the negative die 300 (Figure 3c) and any curing process (Figure 3d), but before separation (Figure 3e).
  • Figure 4 shows another manufacturing process for a micromirror element 200 in which the desired shape for the reflecting side 215 is also introduced irreversibly.
  • a three-dimensional lacquer layer 310 is applied by photolithographic means according to the known grayscale lithography process.
  • the shape of this lacquer layer corresponds to the ultimately desired shape (see Figure 4b).
  • the lacquer layer 310 is removed from the mirror substrate 210 by an etching process (see Figure 4c), whereby the shape of the lacquer layer 310 is transferred to the mirror substrate 210 (see Figure 4d).
  • This is a spatially resolved ablation of the mirror substrate 210, and thus a subtractive processing of the mirror substrate 210. In other possible methods, spatially resolved ablation is achieved, for example, by a shadow mask or active control.
  • the mirror substrate 210 is separated (see Figure 4d).
  • the reflective coating 220 can be applied to the mirror substrate 210, in particular before or after singulation.
  • a negative mold 320 with the desired shape is first placed in the mold ( Figure 5a), into which a coating material 211 is introduced and, if necessary, cured ( Figure 5b).
  • a mirror substrate 210 with a flat surface on both sides is provided and bonded to the coating 210 still in the negative mold 320 ( Figure 5c).
  • a separate adhesive can be used for this purpose.
  • the coating material 211 if it is brought into contact with the mirror substrate 210 before it has completely cured, forms a bond with the mirror substrate 210 during further curing.
  • the coating 211 is separated to obtain the desired micromirrors 200.
  • release and/or non-stick layers can be provided between the mold 320 and the coating material.
  • the reflective coating 220 can be applied, in particular, after removal of the negative mold 320. It should be noted that, contrary to the illustration in Figure 5, the mold can also be removed before the coating 211 is bonded to the mirror substrate 210.
  • a cavity 331 is created by suitable tensioning of a membrane 330, the wall of which has the desired shape on the side facing away from the mirror substrate 210 ( Figure 6b).
  • a negative mold similar to the one from Figure 5 can also be used to create the cavity 331.
  • the cavity 331 is then filled with a suitable curable material 212 (Figure 6c).
  • a suitable curable material 212 Figure 6c
  • the membrane 330 can be provided directly with a reflective coating 220 (not shown in Figure 6) or the membrane 330 itself can form the reflective coating.
  • the membrane 330 can be provided with a suitable reflective coating 220 (not shown in Figure 6) at any point during the process shown.
  • the membrane 330 is to be removed after additive processing of the mirror substrate 210, this is preferably done after the material 212 has completely cured ( Figure 6d, right).
  • the reflective coating 220 can only be usefully applied after the membrane 330 has been removed, but possibly before the individual micromirrors 200 have been separated ( Figure 6e, right).
  • a support structure 340 is provided in addition to the planar mirror substrate 210.
  • the support structure 240 has a plurality of support points 341 provided for permanent connection with the mirror substrate 210 ( Figure 7a ).
  • the mirror substrate 340 is then connected to the support structure 340 in such a way that it is materially bonded to each of the support points 341 ( Figure 7b). With a suitable arrangement and design of the individual support points 341, a deformation of the mirror substrate 210 can then occur which corresponds to the specified shape.
  • the reflective coating 220 is preferably applied only after the connection between the mirror substrate 210 and the support structure 340 has been completely established ( Figure 7c).
  • the predetermined shape is only indirectly introduced by creating the possibility of reversible reshaping during the later use of the micromirror element 200.
  • an actively controllable layer 350 is provided (Figure 8a ), which, when appropriately controlled, provides a reversible Deformation of the mirror substrate 210 and the reflective coating 220 arranged on it is caused ( Figure 8b).
  • an actively controllable layer 350 By suitable design and control of the actively controllable layer 350, a predetermined shape can be achieved, whereby the control can even include a control loop to achieve the predetermined shape with lasting precision.
  • the actively controllable layer 350 can be arranged on the side of the mirror substrate 210 facing away from the reflective coating 220 (see Figure 8, left). However, it is also possible to provide the actively controllable layer 350 between the mirror substrate 210 and the reflective coating 220 (see Figure 8, right).
  • the actively controllable layer 350 can be controlled electrically or thermally.
  • spatially resolved control can also be provided, with which the shaping of the mirror substrate 210 can be controlled locally.
  • the side in question is formed by appropriately attaching a membrane 360 to the flat, planar mirror substrate 210, wherein the membrane 360 already has the predetermined shape in its initial state.
  • the membrane 360 is supported at one point by an actuator element 361, which can act on the membrane 360 in at least one degree of freedom.
  • the actuator element 361 can be a piezoelectric element. which allows the distance between membrane 360 and mirror substrate 210 to be changed at precisely this point.
  • the membrane 360 itself can be influenced by electrical and/or magnetic fields.
  • the corresponding fields can be generated separately from the micromirror element 200 and enable targeted deformation of the membrane 360.
  • the membrane 360 itself can form a reflective coating 220 of the mirror substrate 210 or can be provided with a suitable coating 220.

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Ophthalmology & Optometry (AREA)
  • Mechanical Engineering (AREA)
  • Optical Elements Other Than Lenses (AREA)

Abstract

L'invention concerne un procédé de fabrication d'au moins un élément de micro-miroir (200), tel qu'il peut être utilisé dans des systèmes micro-électro-mécaniques (100), en particulier pour une utilisation dans des installations destinées à la technologie des semi-conducteurs (1), ainsi qu'un système micro-électro-mécanique (100) comprenant des éléments de micro-miroir (200) correspondants. Le procédé comprend les étapes qui consistent à : fournir un substrat de miroir (210) plan des deux côtés ; introduire une forme prédéfinie au moins sur la face (215) prévue comme réfléchissante du substrat de miroir (210) fourni ; et appliquer un revêtement (220) réfléchissant au moins sur la face (215) prévue comme réfléchissante du substrat de miroir (210) fourni.
PCT/EP2025/072641 2024-08-12 2025-08-06 Procédé de fabrication d'un élément de micro-miroir et système micro-électro-mécanique Pending WO2026037704A1 (fr)

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