WO2026051702A1 - Transducteur ultrasonore - Google Patents

Transducteur ultrasonore

Info

Publication number
WO2026051702A1
WO2026051702A1 PCT/CN2025/114297 CN2025114297W WO2026051702A1 WO 2026051702 A1 WO2026051702 A1 WO 2026051702A1 CN 2025114297 W CN2025114297 W CN 2025114297W WO 2026051702 A1 WO2026051702 A1 WO 2026051702A1
Authority
WO
WIPO (PCT)
Prior art keywords
sound
ultrasonic transducer
absorbing layer
transducer according
piezoelectric ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
PCT/CN2025/114297
Other languages
English (en)
Chinese (zh)
Inventor
王春迪
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hangzhou Microimage Software Co Ltd
Original Assignee
Hangzhou Microimage Software Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hangzhou Microimage Software Co Ltd filed Critical Hangzhou Microimage Software Co Ltd
Publication of WO2026051702A1 publication Critical patent/WO2026051702A1/fr
Pending legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0644—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using a single piezoelectric element

Definitions

  • This application relates to the field of transducer technology, and more particularly to an ultrasonic transducer.
  • An ultrasonic transducer is a device capable of energy conversion. It is usually made of piezoelectric ceramics. That is, an ultrasonic transducer can convert energy between electrical signals and mechanical vibrations by utilizing the piezoelectric effect of piezoelectric ceramics. For example, when an ultrasonic transducer is used as a transmitter, its energy conversion mode is electrical energy ⁇ mechanical vibration ⁇ sound wave. When an ultrasonic transducer is used as a receiver, its energy conversion mode is sound wave ⁇ mechanical vibration ⁇ electrical energy.
  • This application provides an ultrasonic transducer that provides a first sound-absorbing layer on the connecting surface of the acoustic wedge reflection zone.
  • This first sound-absorbing layer can absorb at least the sound waves emitted in the forward direction by the piezoelectric ceramic and reflected by the first surface, preventing the sound waves from being repeatedly reflected inside the acoustic wedge.
  • This application provides an ultrasonic transducer, the ultrasonic transducer comprising:
  • An acoustic wedge includes a first surface and a second surface disposed opposite to each other, the second surface being inclined at a predetermined angle relative to the first surface; a piezoelectric ceramic disposed on the second surface; a housing for encapsulating the acoustic wedge to encapsulate the second surface within the housing; and a backing for accommodating space between the housing and the second surface.
  • the acoustic wedge includes a connecting surface for connecting the first surface and the second surface, the connecting surface being provided with a first sound-absorbing layer, the first sound-absorbing layer being at least for absorbing sound waves emitted from the piezoelectric ceramic and reflected by the first surface.
  • the connecting surface includes a sidewall portion perpendicular to the first surface and a planar portion parallel to the first surface; wherein the first sound-absorbing layer extends along the planar portion and the sidewall portion respectively from the ridge line where the planar portion and the sidewall portion meet.
  • the extension length of the first sound-absorbing layer on the planar portion and the sidewall portion at least covers the positions reached by a beam of sound emitted at a half-beam angle from both ends of the piezoelectric ceramic after being reflected by the first surface.
  • the connecting surface is provided with a first groove, the first groove being used to support the first sound-absorbing layer.
  • the thickness of the first sound-absorbing layer is consistent with half the wavelength of the sound wave propagating therein.
  • the first sound-absorbing layer is formed by bonding and curing a first porous sound-absorbing material with epoxy resin.
  • the first porous sound-absorbing material comprises porous sound-absorbing cork.
  • a second sound-absorbing layer is provided on the side of the piezoelectric ceramic facing away from the second surface.
  • the thickness of the second sound-absorbing layer is consistent with half the wavelength of the sound wave propagating therein.
  • the second sound-absorbing layer is formed by bonding and curing a second porous sound-absorbing material with epoxy resin.
  • the second porous sound-absorbing material comprises porous sound-absorbing cork.
  • the second surface of the acoustic wedge is provided with a second groove, and the piezoelectric ceramic is disposed in the second groove.
  • the backing is formed by mixing epoxy resin and tungsten powder and then curing it.
  • the mass ratio of the epoxy resin to the tungsten powder is between 1:1 and 1:1.5.
  • the outer casing is provided with a filling hole for filling the mixture that, after curing, forms the backing.
  • This application provides an ultrasonic transducer, which includes an acoustic wedge and a housing encapsulating the acoustic wedge.
  • the acoustic wedge includes a first surface and a second surface disposed opposite to each other.
  • the second surface is encapsulated inside the housing.
  • the second surface which is inclined relative to the first surface, is provided with piezoelectric ceramics.
  • a backing is provided in the accommodating space between the second surface and the housing. Then, in this application embodiment, a first sound-absorbing layer is provided on the connecting surface of the second surface of the acoustic wedge at the end farther from the first surface.
  • the sound waves emitted by the piezoelectric ceramic will be emitted from the second surface from inside the acoustic wedge to the first surface.
  • some sound waves will be emitted through the first surface, and some sound waves will be reflected back into the acoustic wedge by the first surface and reflected to the connecting surface connecting the second surface and the first surface.
  • the first sound-absorbing layer can absorb the part of the sound waves reflected to the connecting surface, preventing them from being repeatedly reflected inside the acoustic wedge.
  • Figure 1 is a schematic diagram of the acoustic wedge structure described in an embodiment of this application.
  • Figure 2 is a cross-sectional view of the ultrasonic transducer described in the embodiment of this application.
  • Figure 3 is a schematic diagram of the structure of the piezoelectric ceramic that emits sound waves at a half-beam angle in the embodiment of this application.
  • FIG. 4 is a schematic diagram of the ultrasonic transducer described in the embodiment of this application.
  • 10-Acoustic wedge 11-First surface, 12-Second surface, 13-Connecting surface, 14-First groove, 15-Second groove 131 - Side wall portion, 132 - Planar portion, 20-Piezoelectric ceramics, 30 - Outer shell, 31 - Filling hole, 40-backing, 50 - First sound-absorbing layer 60 - Second sound-absorbing layer 70-Cable, M - Half beam angle, X - First direction.
  • the ultrasonic transducer of the related technology typically includes an acoustic wedge, a housing encapsulating the acoustic wedge, and a backing filled between the acoustic wedge and the housing.
  • the acoustic wedge includes a first surface and a second surface disposed opposite to each other, wherein the second surface is inclined at a predetermined angle to the first surface.
  • the second surface is used to bond piezoelectric ceramics, thereby enabling the second surface to provide an incident angle for the sound waves emitted by the piezoelectric ceramics, such that it is between a first critical angle and a second critical angle.
  • the piezoelectric ceramic vibrates, the positive sound waves it emits pass through the inside of the acoustic wedge and are emitted to the first surface. Part of the sound waves are emitted through the first surface and part of them are reflected back into the acoustic wedge. The sound waves reflected back into the acoustic wedge will be repeatedly reflected inside the acoustic wedge, which will have an adverse effect on the emission excitation of the piezoelectric ceramic.
  • this application provides an ultrasonic transducer.
  • the ultrasonic transducer can effectively absorb the sound waves reflected back into the sound wedge by the first surface by setting a first sound-absorbing layer in the reflection area of the sound wedge, and prevent them from being repeatedly reflected inside the sound wedge. This can effectively eliminate the adverse effects on the emission excitation caused by the repeated reflection of some sound waves inside the sound wedge.
  • FIG. 1 is a schematic diagram of the acoustic wedge structure
  • Figure 2 is a cross-sectional schematic diagram of the ultrasonic transducer structure.
  • an ultrasonic transducer includes an acoustic wedge 10, a piezoelectric ceramic 20, a housing 30, a backing 40, and a first sound-absorbing layer 50.
  • the acoustic wedge 10 includes a first surface 11 and a second surface 12 disposed opposite to each other, with the second surface 12 inclined relative to the first surface 11 at a predetermined angle.
  • the piezoelectric ceramic 20 is disposed on the second surface 12.
  • the housing 30 is used to encapsulate the acoustic wedge 10 on which the piezoelectric ceramic 20 is disposed (the acoustic wedge and the piezoelectric ceramic constitute the acoustic sensing part), so as to encapsulate the second surface 12 inside the housing 30.
  • the backing 40 is disposed in the accommodating space between the housing 30 and the second surface 12.
  • the acoustic wedge 10 includes a connecting surface 13 for connecting the first surface 11 and the second surface 12.
  • the connecting surface 13 is provided with a first sound-absorbing layer 50, which is at least used to absorb sound waves emitted by the piezoelectric ceramic 20 and reflected by the first surface 11.
  • the acoustic wedge is made of polyetheretherketone (PEEK).
  • PEEK material has high temperature resistance, high abrasion resistance, and high sound transmission performance.
  • the acoustic wedge is, for example, in the form of an irregular block, and includes a first surface, for example, disposed perpendicular to a first direction; wherein, it is understood that when the ultrasonic transducer is used as a transmitter, the first surface is the emitting surface for emitting sound waves, and when the ultrasonic transducer is used as a receiver, the first surface is the receiving surface for receiving sound waves.
  • the acoustic wedge also includes a second surface disposed opposite to the first surface.
  • the second surface is inclined at a predetermined angle to the first surface. That is, referring to Figure 1, at one end of the ultrasonic transducer (the left end in Figure 1), the second surface is closer to the first surface, and at the other end of the ultrasonic transducer (the right end in Figure 1), the second surface is farther from the first surface.
  • the second surface is provided with piezoelectric ceramics, which are, for example, bonded to the second surface.
  • the tilt of the second surface relative to the first surface provides an incident angle for the sound waves emitted by the piezoelectric ceramics to the first surface.
  • this incident angle is related to the predetermined angle mentioned above.
  • the incident angle can cause the sound waves passing through the first surface to be emitted along the first direction X (i.e., perpendicular to the first surface). Of course, they can also be emitted at other angles relative to the first surface.
  • the purpose of the second surface being tilted at a predetermined angle relative to the first surface is to make the sound waves passing through the first surface emitted at a certain angle.
  • the outer shell encapsulates the acoustic wedge along the first direction X and encapsulates the second surface inside the outer shell. Then, the mixture is filled into the inner shell. When the mixture solidifies, it forms a backing. That is, the backing is located in the accommodating space between the outer shell and the second surface.
  • the acoustic wedge also includes a connecting surface that connects the second surface and the first surface. Then, in this embodiment, a first sound-absorbing layer is provided on the connecting surface.
  • the first sound-absorbing layer can at least absorb the sound waves emitted by the piezoelectric ceramic and reflected by the first surface, preventing them from being repeatedly reflected inside the acoustic wedge.
  • this embodiment can eliminate the above-mentioned adverse effects by setting a first sound-absorbing layer on the connecting surface.
  • the connecting surface connects the second surface and the first surface at one end of the acoustic wedge.
  • the first sound-absorbing layer can be disposed on the connecting surface in an area that can be irradiated by sound waves reflected by the first surface.
  • the connecting surface is typically right-angled as shown in Figure 1 or Figure 2.
  • the connecting surface can also be other shapes according to actual needs, and this embodiment does not limit this.
  • This application provides an ultrasonic transducer, which includes an acoustic wedge and a housing encapsulating the acoustic wedge.
  • the acoustic wedge includes a first surface and a second surface disposed opposite to each other.
  • the second surface is encapsulated inside the housing.
  • the second surface which is inclined relative to the first surface, is provided with piezoelectric ceramics.
  • a backing is provided in the accommodating space between the second surface and the housing. Then, in this application embodiment, a first sound-absorbing layer is provided on the connecting surface of the second surface of the acoustic wedge at the end farther from the first surface.
  • the sound waves emitted by the piezoelectric ceramic will be emitted from the second surface to the first surface. Among them, some sound waves will be emitted through the first surface, and some sound waves will be reflected back into the acoustic wedge by the first surface and reflected to the connecting surface connecting the second surface and the first surface. Then, in this embodiment, by setting a first sound-absorbing layer on the connecting surface, the first sound-absorbing layer can absorb the part of the sound waves reflected to the connecting surface, preventing them from being repeatedly reflected inside the acoustic wedge. This solves the technical problem in related ultrasonic transducers where the repeated reflection of some of the sound waves emitted by the piezoelectric ceramic inside the acoustic wedge has an adverse effect on its emission excitation.
  • the connecting surface 13 includes a sidewall portion 131 that is perpendicular to the first surface 11 and a planar portion 132 that is parallel to the first surface 11; wherein, the first sound-absorbing layer 50 extends along the planar portion 132 and the sidewall portion 131 respectively from the ridge line where the planar portion 132 and the sidewall portion 131 meet.
  • the acoustic wedge is, for example, in an irregular block shape, wherein, at the end of the acoustic wedge that is farther away from the first surface than the second surface, the connecting surface may include two parts, one part being a sidewall portion perpendicular to the first surface, and the other part being a planar portion opposite to and parallel to the first surface, the planar portion being connected to the second surface.
  • a right-angle structure is formed at the junction of the planar portion and the sidewall portion, and then the first sound-absorbing layer can extend from the ridge line where the planar portion and the sidewall portion meet, respectively, along the planar portion and the sidewall portion.
  • the first sound-absorbing layer 50 extends at least to the positions reached by a beam of sound emitted at half-beam angle M from the upper and lower ends of the piezoelectric ceramic 20 after being reflected by the first surface 11.
  • the ultrasonic energy is greatest along the extension of its central axis (i.e., the normal) (perpendicular to the surface of the piezoelectric ceramic), and the sound wave energy gradually weakens in other directions outwards.
  • the angle between the extension of the central axis of the piezoelectric ceramic and the point where the energy intensity is reduced by half (-3dB) is called the half-beam angle.
  • the extension length of the first sound-absorbing layer in the planar portion and the sidewall portion can be set as follows:
  • the first sound-absorbing layer should at least cover point A along the ridge line where the planar portion meets the sidewall portion and along the length of the planar portion.
  • the first sound-absorbing layer should at least cover point B along the ridge line where the planar portion meets the sidewall portion and along the length of the sidewall portion.
  • the area covered by the first sound-absorbing layer should at least include the reflection area that can be reflected by the sound waves emitted by the piezoelectric ceramic at a half-beam angle.
  • the coverage of the first sound-absorbing layer in the direction perpendicular to the X direction and the cable 70 is the dimension of the transducer along that direction.
  • the connecting surface 13 is provided with a first groove 14, which is used to support the first sound-absorbing layer 50.
  • a first groove can be provided on the connecting surface of the acoustic wedge, and then the first sound-absorbing layer is disposed in the first groove.
  • the first groove should be provided at least on the sidewall portion of the acoustic wedge, and the depth of the first groove should be consistent with the thickness of the first sound-absorbing layer.
  • the flat part mentioned above since it does not directly contact the outer shell, may or may not have a groove.
  • the thickness of the first sound-absorbing layer 50 is consistent with half the wavelength of the sound wave propagating within it, and the first sound-absorbing layer 50 is formed by bonding and curing porous sound-absorbing material with epoxy resin.
  • the thickness of the first sound-absorbing layer can be consistent with half the wavelength of the sound wave propagating within it.
  • the first sound-absorbing layer can effectively absorb the reflected sound waves inside the sound wedge, which is equivalent to increasing the transmittance of the sound waves through the sidewall of the sound wedge, and preventing the sound waves reflected by the first surface from forming interference waves inside the sound wedge.
  • the first sound-absorbing layer can be formed by bonding porous sound-absorbing material with epoxy resin and then curing it.
  • the porous sound-absorbing material can increase the attenuation of sound wave vibration and easily absorb sound waves.
  • the porous sound-absorbing material includes, for example, porous sound-absorbing cork, that is, porous sound-absorbing cork or wood chips can be bonded and cured with epoxy resin to form a first sound-absorbing layer 50.
  • the first sound-absorbing layer made of porous sound-absorbing cork, can not only absorb reflected sound waves, but also has a certain degree of elasticity, serving as a buffer layer between the outer shell and the sound wedge.
  • the piezoelectric ceramic 20 has a second sound-absorbing layer 60 on the side facing away from the second surface 12; wherein the thickness of the second sound-absorbing layer 60 is consistent with the half wavelength of the sound wave propagating within it, and the second sound-absorbing layer 60 is formed by bonding and curing a porous sound-absorbing material with epoxy resin; the porous sound-absorbing material includes porous sound-absorbing cork.
  • the backing in an ultrasonic transducer serves two purposes. One is to absorb the sound waves emitted from the piezoelectric ceramic in the opposite direction, reducing inherent noise. The other is to match the piezoelectric ceramic, absorbing excess vibration energy and allowing the vibration of the piezoelectric ceramic to decay as quickly as possible after no signal input, thereby increasing the bandwidth of the signal receiving probe.
  • a second sound-absorbing layer is provided between the piezoelectric ceramic and the backing, as shown in Figure 2.
  • the second sound-absorbing layer can be the same as the first sound-absorbing layer mentioned above, both of which are formed by bonding and curing porous sound-absorbing cork with epoxy resin.
  • the second sound-absorbing layer can effectively absorb the back-sound waves emitted by the piezoelectric ceramic, preventing them from propagating into the sound wedge through the backing.
  • the second sound-absorbing layer has a certain degree of elasticity, so when there is no signal input to the piezoelectric ceramic, it can also accelerate the attenuation of the vibration of the piezoelectric ceramic, that is, it also has a good suppression effect on the tailing effect of the piezoelectric ceramic, thereby greatly increasing the transmitted echo signal. For example, after measurement, the echo signal can be increased from 4.25V to 9.7V.
  • a second groove 15 can be provided on the second surface 12 of the acoustic wedge 10, and then the piezoelectric ceramic 20 is disposed in the second groove 15.
  • the backing 40 is formed by mixing epoxy resin and tungsten powder and then curing it.
  • the backing can be formed by mixing tungsten powder and epoxy resin and then curing it.
  • the mixture of tungsten powder and epoxy resin forms a high acoustic impedance material.
  • the back-facing sound waves of the piezoelectric ceramic will be scattered multiple times when they encounter tungsten powder particles in the backing, thereby consuming the energy of the sound waves and accelerating the attenuation of the sound waves.
  • the mass ratio of epoxy resin to tungsten powder can be between 1:1 and 1:1.5.
  • the housing 30 may be milled from stainless steel. Referring to FIG4, the housing 30 is provided with a filling hole 31 for filling the mixture that forms the backing 40 after curing.
  • the cable 70 connecting the piezoelectric ceramic extends from the housing.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)

Abstract

La présente invention concerne un transducteur ultrasonore, comprenant un coin acoustique et un corps qui encapsule le coin acoustique, le coin acoustique comprenant une première surface et une seconde surface disposées l'une en face de l'autre, la seconde surface étant encapsulée à l'intérieur du corps ; des céramiques piézoélectriques sont disposées sur la seconde surface, qui est inclinée par rapport à la première surface ; et un support est disposé dans un espace de réception entre la seconde surface et le boîtier. Dans le coin acoustique, une première couche d'absorption acoustique est disposée sur une surface de liaison à l'extrémité de la seconde surface à l'opposé de la première surface.
PCT/CN2025/114297 2024-09-05 2025-08-13 Transducteur ultrasonore Pending WO2026051702A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN202411247733.5 2024-09-05
CN202411247733.5A CN119098376A (zh) 2024-09-05 2024-09-05 超声换能器

Publications (1)

Publication Number Publication Date
WO2026051702A1 true WO2026051702A1 (fr) 2026-03-12

Family

ID=93712867

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/CN2025/114297 Pending WO2026051702A1 (fr) 2024-09-05 2025-08-13 Transducteur ultrasonore

Country Status (2)

Country Link
CN (1) CN119098376A (fr)
WO (1) WO2026051702A1 (fr)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119098376A (zh) * 2024-09-05 2024-12-10 杭州微影软件有限公司 超声换能器
CN120790469B (zh) * 2025-09-09 2025-12-09 汇中仪表股份有限公司 超声波换能器

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2204048Y (zh) * 1994-06-30 1995-07-26 北京燕山石油化工公司建筑安装工程公司 奥氏体钢探伤用的检测和成象探头
CN2226305Y (zh) * 1995-04-29 1996-05-01 武进县鸣凰电子器材厂 超声波自动轮轴探伤探头
JP2001330662A (ja) * 2000-05-19 2001-11-30 Mitsubishi Cable Ind Ltd 超音波プローブ
CN202141698U (zh) * 2011-06-14 2012-02-08 浙江省特种设备检验研究院 一种用于厚壁筒形件周向超声检测的曲面线聚焦探头装置
CN119098376A (zh) * 2024-09-05 2024-12-10 杭州微影软件有限公司 超声换能器

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT3481284T (pt) * 2016-07-07 2021-10-14 Univ California Implantes utilizando retrodifusão ultrassónica para detetar sinais eletrofisiológicos
CN206557164U (zh) * 2017-03-03 2017-10-13 湖南五凌电力科技有限公司 一种焊缝超声波检测换能器
CN107796879A (zh) * 2017-11-29 2018-03-13 辽宁红阳检测有限公司 一种多角度周向检测超声波斜探头
CN208653557U (zh) * 2018-08-20 2019-03-26 大唐环境产业集团股份有限公司 一种用于复合管道流量检测的超声波传感器

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2204048Y (zh) * 1994-06-30 1995-07-26 北京燕山石油化工公司建筑安装工程公司 奥氏体钢探伤用的检测和成象探头
CN2226305Y (zh) * 1995-04-29 1996-05-01 武进县鸣凰电子器材厂 超声波自动轮轴探伤探头
JP2001330662A (ja) * 2000-05-19 2001-11-30 Mitsubishi Cable Ind Ltd 超音波プローブ
CN202141698U (zh) * 2011-06-14 2012-02-08 浙江省特种设备检验研究院 一种用于厚壁筒形件周向超声检测的曲面线聚焦探头装置
CN119098376A (zh) * 2024-09-05 2024-12-10 杭州微影软件有限公司 超声换能器

Also Published As

Publication number Publication date
CN119098376A (zh) 2024-12-10

Similar Documents

Publication Publication Date Title
WO2026051702A1 (fr) Transducteur ultrasonore
US4528652A (en) Ultrasonic transducer and attenuating material for use therein
CN103026183B (zh) 用于在流体介质中使用的超声波换能器
JP5789618B2 (ja) 超音波探触子
US5664456A (en) Ultrasonic transducer
CN108332846B (zh) 一种水泥混凝土结构中埋入式超声传感器
CN109073431B (zh) 应用于超声流量测量装置或超声料位测量装置的超声换能器
JP6172533B2 (ja) 超音波送受波器およびそれを備えた超音波流量計
CN102798670A (zh) 用于超声换能器的多部件式安装装置
JP5358078B2 (ja) 超音波探触子
CN108451544B (zh) 超声成像诊断阵列探头和其制造方法及其设备
CN112638264B (zh) 超声波换能器、超声波探头以及超声波检测装置
JP4161004B2 (ja) 超音波受波器
JP4193582B2 (ja) 超音波センサ
SU1738376A1 (ru) Ультразвуковой пьезопреобразователь Марьина
CN215932137U (zh) 一种超声波传感器
JP4704447B2 (ja) 音響整合体、超音波送受波器および超音波流量計
CN107533135A (zh) 用于在主方向上发送声学信号和/或从主方向接收声学信号的设备
JP2007134767A (ja) 超音波探触子
JP7603570B2 (ja) 金属音響整合層及びトランスデューサ
KR102334802B1 (ko) 임피던스 매칭 부재 및 상기 임피던스 매칭 부재를 사용하는 초음파 트랜스듀서
KR20070071216A (ko) 스펀지를 이용한 먼지 차단 구조의 진동 제어형 초음파거리 센서
CN109212026A (zh) 一种基于表面波的固体声检测装置
JPH04238496A (ja) 超音波センサ
JPS6360697A (ja) 超音波送受信装置