ZA742941B - A cooling assembly for use with a semiconductor component - Google Patents

A cooling assembly for use with a semiconductor component

Info

Publication number
ZA742941B
ZA742941B ZA00742941A ZA742941A ZA742941B ZA 742941 B ZA742941 B ZA 742941B ZA 00742941 A ZA00742941 A ZA 00742941A ZA 742941 A ZA742941 A ZA 742941A ZA 742941 B ZA742941 B ZA 742941B
Authority
ZA
South Africa
Prior art keywords
semiconductor component
cooling assembly
cooling
assembly
semiconductor
Prior art date
Application number
ZA00742941A
Other languages
English (en)
Inventor
M Prei
G Glimm
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19732324370 external-priority patent/DE2324370C3/de
Application filed by Siemens Ag filed Critical Siemens Ag
Publication of ZA742941B publication Critical patent/ZA742941B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/611—Bolts or screws
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/231—Arrangements for cooling characterised by their places of attachment or cooling paths
    • H10W40/237—Arrangements for cooling characterised by their places of attachment or cooling paths attached to additional arrangements for cooling
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/60—Securing means for detachable heating or cooling arrangements, e.g. clamps
    • H10W40/625—Clamping parts not primarily conducting heat
ZA00742941A 1973-05-14 1974-05-08 A cooling assembly for use with a semiconductor component ZA742941B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19732324370 DE2324370C3 (de) 1973-05-14 Halbleiterbaustein

Publications (1)

Publication Number Publication Date
ZA742941B true ZA742941B (en) 1975-05-28

Family

ID=5880926

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA00742941A ZA742941B (en) 1973-05-14 1974-05-08 A cooling assembly for use with a semiconductor component

Country Status (7)

Country Link
JP (1) JPS5421074B2 (de)
AT (1) AT327323B (de)
BE (1) BE814391A (de)
CH (1) CH570701A5 (de)
FR (1) FR2230077B3 (de)
NL (1) NL7406110A (de)
ZA (1) ZA742941B (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3215192A1 (de) * 1982-04-23 1983-10-27 Siemens AG, 1000 Berlin und 8000 München Einspannvorrichtung fuer scheibenfoermige halbleiter-bauelemente

Also Published As

Publication number Publication date
FR2230077B3 (de) 1977-03-11
BE814391A (fr) 1974-08-16
AT327323B (de) 1976-01-26
DE2324370B2 (de) 1975-12-11
JPS5421074B2 (de) 1979-07-27
CH570701A5 (de) 1975-12-15
NL7406110A (de) 1974-11-18
FR2230077A1 (de) 1974-12-13
DE2324370A1 (de) 1974-11-28
ATA361674A (de) 1975-04-15
JPS5019366A (de) 1975-02-28

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