ZA82368B - Integrated circuit chip carrier - Google Patents

Integrated circuit chip carrier

Info

Publication number: ZA82368B
Authority: ZA; South Africa
Prior art keywords: integrated circuit; circuit chip; chip carrier; carrier; integrated
Prior art date: 1981-02-09

Application number

ZA82368A

Other languages

English (en)

Inventor

Francis Nihal Sinnadurai

Anthony James Cook

Keith William Gurnett

Original Assignee

British Telecomm

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1981-02-09

Filing date

1982-01-20

Publication date

1983-01-26

1982-01-20 Application filed by British Telecomm filed Critical British Telecomm

1983-01-26 Publication of ZA82368B publication Critical patent/ZA82368B/xx

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
- H10W70/69—Insulating materials thereof
- H10W70/695—Organic materials
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
- H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
- H10W70/65—Shapes or dispositions of interconnections
- H10W70/657—Shapes or dispositions of interconnections on sidewalls or bottom surfaces of the package substrates, interposers or redistribution layers
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

ZA82368A 1981-02-09 1982-01-20 Integrated circuit chip carrier ZA82368B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
GB8103840		1981-02-09

Publications (1)

Publication Number	Publication Date
ZA82368B true ZA82368B (en)	1983-01-26

Family

ID=10519540

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ZA82368A ZA82368B (en)	1981-02-09	1982-01-20	Integrated circuit chip carrier

Country Status (8)

Country	Link
US (2)	US4448306A (fr)
EP (1)	EP0058068B1 (fr)
AU (1)	AU559141B2 (fr)
CA (1)	CA1183280A (fr)
DE (1)	DE3280266D1 (fr)
IE (1)	IE56411B1 (fr)
NZ (1)	NZ199549A (fr)
ZA (1)	ZA82368B (fr)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA1183280A (fr) *	1981-02-09	1985-02-26	Francis N. Sinnadurai	Substrat pour puce de circuit integre
FR2521350B1 (fr) *	1982-02-05	1986-01-24	Hitachi Ltd	Boitier porteur de puce semi-conductrice
AU598253B2 (en) *	1986-05-07	1990-06-21	Digital Equipment Corporation	System for detachably mounting semi-conductors on conductor substrates
US5131535A (en) *	1986-06-27	1992-07-21	Symtek Systems, Inc.	Electrical device transport medium
US4837050A (en) *	1986-09-30	1989-06-06	Asahi Chemical Research Laboratory Co., Ltd.	Method for producing electrically conductive circuits on a base board
US4681221A (en) *	1986-10-30	1987-07-21	International Business Machines Corporation	Holder for plastic leaded chip carrier
US4931906A (en) *	1988-03-25	1990-06-05	Unitrode Corporation	Hermetically sealed, surface mountable component and carrier for semiconductor devices
DE3931634A1 (de) *	1989-09-22	1991-04-04	Telefunken Electronic Gmbh	Halbleiterbauelement
US5148265A (en)	1990-09-24	1992-09-15	Ist Associates, Inc.	Semiconductor chip assemblies with fan-in leads
US7198969B1 (en)	1990-09-24	2007-04-03	Tessera, Inc.	Semiconductor chip assemblies, methods of making same and components for same
FR2675632B1 (fr) *	1991-04-18	1997-04-30	Texas Instruments France	Dispositif de conditionnement de circuits integres
US5483421A (en) *	1992-03-09	1996-01-09	International Business Machines Corporation	IC chip attachment
US5246129A (en) *	1992-03-13	1993-09-21	Illinois Tool Works, Inc.	Shipping tray and cover strip
US5203452A (en) *	1992-03-13	1993-04-20	Illinois Tool Works, Inc.	Shipping tray
JP3541491B2 (ja) *	1994-06-22	2004-07-14	セイコーエプソン株式会社	電子部品
JP2688664B2 (ja) *	1994-09-07	1997-12-10	シノン電気産業株式会社	半導体デバイス用トレー
US5832600A (en) *	1995-06-06	1998-11-10	Seiko Epson Corporation	Method of mounting electronic parts
US5938956A (en) *	1996-09-10	1999-08-17	Micron Technology, Inc.	Circuit and method for heating an adhesive to package or rework a semiconductor die
US6426484B1 (en)	1996-09-10	2002-07-30	Micron Technology, Inc.	Circuit and method for heating an adhesive to package or rework a semiconductor die
US6229323B1 (en)	1998-04-23	2001-05-08	Micron Technology, Inc.	Automated multi-chip module handler, method of module handling, and module magazine
JP3877454B2 (ja)	1998-11-27	2007-02-07	三洋電機株式会社	半導体装置の製造方法
US7112305B2 (en) *	2001-01-31	2006-09-26	Agilent Technologies, Inc.	Automation-optimized microarray package
US20040105244A1 (en) *	2002-08-06	2004-06-03	Ilyas Mohammed	Lead assemblies with offset portions and microelectronic assemblies with leads having offset portions
USD523404S1 (en) *	2005-05-27	2006-06-20	Danville Automation Holdings Llc	Portion of a funnel plate
USD557225S1 (en) *	2005-05-27	2007-12-11	Danville Automation Holdings Llc	Funnel plate
USD522471S1 (en) *	2005-05-27	2006-06-06	Danville Automation Holdings Llc	Funnel plate
USD522979S1 (en) *	2005-05-27	2006-06-13	Danville Automation Holdings Llc	Funnel plate
USD557668S1 (en) *	2005-05-27	2007-12-18	Danville Automation Holdings Llc	Funnel plate
JP6485776B2 (ja) *	2016-05-31	2019-03-20	大口マテリアル株式会社	多列型半導体装置用配線部材及びその製造方法
JP6485777B2 (ja) *	2016-05-31	2019-03-20	大口マテリアル株式会社	多列型半導体装置用配線部材及びその製造方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3349481A (en) *	1964-12-29	1967-10-31	Alpha Microelectronics Company	Integrated circuit sealing method and structure
US3441853A (en) *	1966-06-21	1969-04-29	Signetics Corp	Plug-in integrated circuit package and carrier assembly and including a test fixture therefor
US3454154A (en) *	1968-05-07	1969-07-08	Us Air Force	Integrated circuit carrier
US3673543A (en) *	1970-04-27	1972-06-27	Thomas & Betts Corp	Micro-circuit pack receptacle
US4099615A (en) *	1974-08-22	1978-07-11	Amp, Incorporated	Carrier strip mounted electrical components
US3940849A (en) *	1974-09-09	1976-03-02	Minter Jerry B	Method for handling connectors
US4026412A (en) *	1974-09-26	1977-05-31	Henson Richard D	Electronic circuit carrier and test fixture
GB1515160A (en) *	1975-11-28	1978-06-21	Plessey Co Ltd	Electrically integrated circuit package protectors
JPS5384681A (en) *	1976-12-29	1978-07-26	Mitsumi Electric Co Ltd	Method of producing leadless package
JPS53114067A (en) *	1977-03-15	1978-10-05	Tokyo Shibaura Electric Co	Electronic part device and method of producing same
US4227298A (en) *	1978-09-05	1980-10-14	Motorola, Inc.	Method for interconnecting photovoltaic devices
US4223368A (en) *	1978-09-14	1980-09-16	Dattilo Donald P	Electrostatic discharge protection device
FR2439438A1 (fr) *	1978-10-19	1980-05-16	Cii Honeywell Bull	Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux
US4329642A (en) *	1979-03-09	1982-05-11	Siliconix, Incorporated	Carrier and test socket for leadless integrated circuit
CA1183280A (fr) *	1981-02-09	1985-02-26	Francis N. Sinnadurai	Substrat pour puce de circuit integre

1982
- 1982-01-19 CA CA000394439A patent/CA1183280A/fr not_active Expired
- 1982-01-20 ZA ZA82368A patent/ZA82368B/xx unknown
- 1982-01-21 AU AU79709/82A patent/AU559141B2/en not_active Expired
- 1982-01-22 NZ NZ199549A patent/NZ199549A/en unknown
- 1982-01-25 US US06/342,358 patent/US4448306A/en not_active Expired - Lifetime
- 1982-02-04 IE IE247/82A patent/IE56411B1/en not_active IP Right Cessation
- 1982-02-08 DE DE8282300596T patent/DE3280266D1/de not_active Expired - Lifetime
- 1982-02-08 EP EP82300596A patent/EP0058068B1/fr not_active Expired - Lifetime
1983
- 1983-12-20 US US06/563,622 patent/US4595096A/en not_active Expired - Lifetime

Also Published As

Publication number	Publication date
AU559141B2 (en)	1987-02-26
IE820247L (en)	1982-08-09
US4595096A (en)	1986-06-17
AU7970982A (en)	1982-08-19
IE56411B1 (en)	1991-07-31
EP0058068B1 (fr)	1990-10-31
EP0058068A3 (en)	1982-09-08
US4448306A (en)	1984-05-15
DE3280266D1 (de)	1990-12-06
EP0058068A2 (fr)	1982-08-18
CA1183280A (fr)	1985-02-26
NZ199549A (en)	1985-01-31

Publication	Publication Date	Title
ZA82368B (en)	1983-01-26	Integrated circuit chip carrier
GB8412674D0 (en)	1984-06-27	Integrated circuit chip carrier
DE3279013D1 (en)	1988-10-13	Semiconductor integrated circuit
DE3367699D1 (en)	1987-01-02	Chip carrier
DE3177003D1 (en)	1989-04-13	Electronic circuit chip carrier
GB2101819B (en)	1985-02-20	Integrated circuit carrier connector
GB8500176D0 (en)	1985-02-13	Semiconductor integrated circuit
GB8405827D0 (en)	1984-04-11	Semiconductor chip carrier
MY8600598A (en)	1986-12-31	Single piece carrier for integrated circuit devices
GB2107517B (en)	1985-09-04	Integrated circuit carrier assembly
DE3278601D1 (en)	1988-07-07	Carrier for integrated circuit
GB2091459B (en)	1985-09-11	Semiconductor integrated circuit
GB8721779D0 (en)	1987-10-21	Integrated circuit chip carrier
DE3272424D1 (en)	1986-09-11	Semiconductor integrated circuit
GB2074788B (en)	1985-02-27	Semiconductor integrated circuit
GB2091036B (en)	1985-06-26	Integrated circuit carrier assembly
DE3275613D1 (en)	1987-04-09	Semiconductor circuit
DE3264963D1 (en)	1985-09-05	Semiconductor integrated circuit
JPS57169275A (en)	1982-10-18	Single chip integrated circuit
GB2137805B (en)	1987-01-28	Chip carrier
GB2084397B (en)	1984-11-14	Semiconductor integrated circuit
JPS57207358A (en)	1982-12-20	Circuit with semiconductor integrated circuit
GB2149581B (en)	1987-05-28	Mounted integrated circuit chip carrier
GB2133929B (en)	1986-07-02	Semiconductor integrated circuit
DE3270106D1 (en)	1986-04-30	Semiconductor chip carrier