ZA892041B - Low toxicity alloy compositions for joining and sealing - Google Patents

Low toxicity alloy compositions for joining and sealing

Info

Publication number
ZA892041B
ZA892041B ZA892041A ZA892041A ZA892041B ZA 892041 B ZA892041 B ZA 892041B ZA 892041 A ZA892041 A ZA 892041A ZA 892041 A ZA892041 A ZA 892041A ZA 892041 B ZA892041 B ZA 892041B
Authority
ZA
South Africa
Prior art keywords
joining
sealing
low toxicity
alloy compositions
toxicity alloy
Prior art date
Application number
ZA892041A
Other languages
English (en)
Inventor
Kay Louise Tucker
Louise Tucker Kay
Ulysses Ma
Ma Ulysses
Original Assignee
Cookson Group Plc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cookson Group Plc filed Critical Cookson Group Plc
Publication of ZA892041B publication Critical patent/ZA892041B/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • B23K35/362—Selection of compositions of fluxes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0227—Rods or wires
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering or brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • B23K35/025—Pastes, creams or slurries
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/36—Selection of non-metallic compositions, e.g. coatings or fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Ceramic Products (AREA)
  • Powder Metallurgy (AREA)
ZA892041A 1988-03-31 1989-03-17 Low toxicity alloy compositions for joining and sealing ZA892041B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB888807730A GB8807730D0 (en) 1988-03-31 1988-03-31 Low toxicity soldering compositions

Publications (1)

Publication Number Publication Date
ZA892041B true ZA892041B (en) 1990-03-28

Family

ID=10634456

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA892041A ZA892041B (en) 1988-03-31 1989-03-17 Low toxicity alloy compositions for joining and sealing

Country Status (8)

Country Link
US (1) US4929423A (de)
EP (1) EP0336575A1 (de)
JP (1) JPH0270033A (de)
KR (1) KR890014205A (de)
AU (1) AU606791B2 (de)
CA (1) CA1299470C (de)
GB (1) GB8807730D0 (de)
ZA (1) ZA892041B (de)

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JPH04220196A (ja) * 1990-07-19 1992-08-11 Aisin Seiki Co Ltd 亜鉛メツキ鋼板フレームの接合方法
JP2505921B2 (ja) * 1990-09-25 1996-06-12 株式会社日立製作所 半導体装置及びそれ用はんだ合金
GB9103018D0 (en) * 1991-02-13 1991-03-27 Lancashire Fittings Ltd Lead free soft solder for stainless steel
ES2036452B1 (es) * 1991-06-12 1995-12-16 Electro Materiales Klk S A Metodo de conexion de cables electricos sobre superficies de acero y placa de molde-crisol para llevar a cabo dicho metodo.
US5287037A (en) * 1991-12-03 1994-02-15 General Electric Company Metal ferrules for hermetically sealing electric lamps
US5320272A (en) * 1993-04-02 1994-06-14 Motorola, Inc. Tin-bismuth solder connection having improved high temperature properties, and process for forming same
US5330712A (en) * 1993-04-22 1994-07-19 Federalloy, Inc. Copper-bismuth alloys
JPH0825050B2 (ja) * 1993-06-08 1996-03-13 日本アルミット株式会社 無含鉛半田合金
US5411703A (en) * 1993-06-16 1995-05-02 International Business Machines Corporation Lead-free, tin, antimony, bismtuh, copper solder alloy
US5368814A (en) * 1993-06-16 1994-11-29 International Business Machines, Inc. Lead free, tin-bismuth solder alloys
US5328660A (en) * 1993-06-16 1994-07-12 International Business Machines Corporation Lead-free, high temperature, tin based multi-component solder
US5393489A (en) * 1993-06-16 1995-02-28 International Business Machines Corporation High temperature, lead-free, tin based solder composition
US5344607A (en) * 1993-06-16 1994-09-06 International Business Machines Corporation Lead-free, high tin, ternary solder alloy of tin, bismuth, and indium
NL9302056A (nl) * 1993-11-26 1995-06-16 Billiton Witmetaal Kogel en het gebruik van een Sn-legering daarvoor.
US5439639A (en) * 1994-01-05 1995-08-08 Sandia Corporation Tin-silver-bismuth solders for electronics assembly
US5435857A (en) * 1994-01-06 1995-07-25 Qualitek International, Inc. Soldering composition
DE19538992A1 (de) * 1995-04-28 1996-10-31 Hewlett Packard Co Wismut-Zinn-Lötmittel-Verbindungen mit verbesserten mechanischen Eigenschaften
CN1040303C (zh) * 1995-06-30 1998-10-21 三星电机株式会社 通用无铅焊料
JP3220635B2 (ja) * 1996-02-09 2001-10-22 松下電器産業株式会社 はんだ合金及びクリームはんだ
US6371361B1 (en) * 1996-02-09 2002-04-16 Matsushita Electric Industrial Co., Ltd. Soldering alloy, cream solder and soldering method
US5985212A (en) * 1996-12-12 1999-11-16 H-Technologies Group, Incorporated High strength lead-free solder materials
EP0977900A4 (de) 1997-04-22 2001-06-13 Ecosolder Internat Pty Ltd Bleifreies lot
US5833921A (en) * 1997-09-26 1998-11-10 Ford Motor Company Lead-free, low-temperature solder compositions
JP2000153388A (ja) * 1998-09-14 2000-06-06 Murata Mfg Co Ltd はんだ付け物品
JP2000094181A (ja) * 1998-09-24 2000-04-04 Sony Corp はんだ合金組成物
US6197253B1 (en) 1998-12-21 2001-03-06 Allen Broomfield Lead-free and cadmium-free white metal casting alloy
US6365097B1 (en) * 1999-01-29 2002-04-02 Fuji Electric Co., Ltd. Solder alloy
JP3074649B1 (ja) * 1999-02-23 2000-08-07 インターナショナル・ビジネス・マシーンズ・コーポレ−ション 無鉛半田粉末、無鉛半田ペースト、およびそれらの製造方法
GB9915954D0 (en) * 1999-07-07 1999-09-08 Multicore Solders Ltd Solder alloy
JP3753168B2 (ja) * 1999-08-20 2006-03-08 千住金属工業株式会社 微小チップ部品接合用ソルダペースト
DE19953670A1 (de) * 1999-11-08 2001-05-23 Euromat Gmbh Lotlegierung
WO2002009936A1 (en) * 2000-07-31 2002-02-07 Honeywell International Inc. Lead-free alloys with improved wetting properties
JP2002124756A (ja) * 2000-10-18 2002-04-26 Nitto Denko Corp 回路基板および回路基板の端子部の接続構造
US20040241039A1 (en) * 2000-10-27 2004-12-02 H-Technologies Group High temperature lead-free solder compositions
TW592872B (en) * 2001-06-28 2004-06-21 Senju Metal Industry Co Lead-free solder alloy
GB2380964B (en) 2001-09-04 2005-01-12 Multicore Solders Ltd Lead-free solder paste
US7282175B2 (en) 2003-04-17 2007-10-16 Senju Metal Industry Co., Ltd. Lead-free solder
US20050100474A1 (en) * 2003-11-06 2005-05-12 Benlih Huang Anti-tombstoning lead free alloys for surface mount reflow soldering
US20060104855A1 (en) * 2004-11-15 2006-05-18 Metallic Resources, Inc. Lead-free solder alloy
GB2421030B (en) 2004-12-01 2008-03-19 Alpha Fry Ltd Solder alloy
CA2502747A1 (en) * 2005-03-30 2006-09-30 David Wai-Yin Dl Leung Pb-free solder alloy compositions comprising essentially tin, silver, copper and phosphorus
US7335269B2 (en) * 2005-03-30 2008-02-26 Aoki Laboratories Ltd. Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P)
CN1301179C (zh) * 2005-05-11 2007-02-21 郴州金箭焊料有限公司 无铅焊料及制造方法
CN100352596C (zh) * 2005-07-22 2007-12-05 沈阳工业大学 一种含混合稀土的无铅软钎料及其制备方法
EP1749616A1 (de) * 2005-08-05 2007-02-07 Grillo-Werke AG Verfahren zum Lichtbogen- oder Strahllöten/-schweissen von Werkstücken gleicher oder verschiedener Metalle oder Metalllegierungen mit Zusatzwerkstoffen aus Sn-Basis-Legierungen; Draht bestehend aus einer Zinn-Basis-Legierung
US7749336B2 (en) * 2005-08-30 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of tin-indium solders
US20070071634A1 (en) * 2005-09-26 2007-03-29 Indium Corporation Of America Low melting temperature compliant solders
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US20070172381A1 (en) * 2006-01-23 2007-07-26 Deram Brian T Lead-free solder with low copper dissolution
JP5266235B2 (ja) 2006-10-17 2013-08-21 フライズ・メタルズ・インコーポレイテッド 電気装置において電気的接続を設ける方法
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JP5230974B2 (ja) * 2007-07-25 2013-07-10 新日鉄住金マテリアルズ株式会社 ハンダ合金、ハンダボール及びハンダバンプを有する電子部材
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US9050651B2 (en) * 2011-06-14 2015-06-09 Ingot Metal Company Limited Method for producing lead-free copper—bismuth alloys and ingots useful for same
CN102699563A (zh) * 2012-06-23 2012-10-03 浙江亚通焊材有限公司 一种低银无铅软钎料
KR20160003078A (ko) 2013-05-03 2016-01-08 허니웰 인터내셔날 인코포레이티드 무연 솔더 접속을 위한 리드 프레임 구조체
KR20160121562A (ko) 2014-02-20 2016-10-19 허니웰 인터내셔날 인코포레이티드 무연 솔더 조성물
CN104439751A (zh) * 2014-12-24 2015-03-25 深圳市亿铖达工业有限公司 新型低熔点无铅焊料
JP6011709B1 (ja) * 2015-11-30 2016-10-19 千住金属工業株式会社 はんだ合金
EP3414039B1 (de) * 2016-02-11 2023-06-14 Celestica International LP Wärmebehandlung zur vorbehandlung oder restauration einer schweissnaht
CN107354329A (zh) * 2017-06-06 2017-11-17 西安交通大学 ZChSnSb11‑6改善摩擦学性能和β相细化的方法
CN107365923A (zh) * 2017-07-18 2017-11-21 西安交通大学 ZChSnSb11‑6的β相晶粒形状尖角的钝化的方法
NL2020406B1 (nl) * 2018-02-09 2019-08-19 Inteco B V Werkwijze en inrichting voor het vervaardigen van warmtewisselende elementen, en elemten als zodanig
JP6936926B1 (ja) 2021-03-10 2021-09-22 千住金属工業株式会社 はんだ合金、はんだ粉末、はんだペースト、およびはんだ継手
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US736712A (en) * 1903-04-09 1903-08-18 Ricardo Fortun Solder for aluminium.
CH80998A (fr) * 1918-08-09 1920-01-02 Gustave Ferriere Soudure pour l'aluminium
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DE3730764C1 (de) * 1987-09-12 1988-07-14 Demetron Verwendung von Legierungen aus Zinn und/oder Blei als Weichlote zum Aufbringen von Halbleitern auf metallische Traeger
US4806309A (en) * 1988-01-05 1989-02-21 Willard Industries, Inc. Tin base lead-free solder composition containing bismuth, silver and antimony

Also Published As

Publication number Publication date
CA1299470C (en) 1992-04-28
KR890014205A (ko) 1989-10-23
GB8807730D0 (en) 1988-05-05
AU606791B2 (en) 1991-02-14
JPH0270033A (ja) 1990-03-08
AU3167289A (en) 1989-10-05
EP0336575A1 (de) 1989-10-11
US4929423A (en) 1990-05-29

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