ZA90154B - A single atmosphere for firing copper compatible thick film materials - Google Patents

A single atmosphere for firing copper compatible thick film materials

Info

Publication number: ZA90154B
Authority: ZA; South Africa
Prior art keywords: thick film; film materials; single atmosphere; copper compatible; firing copper
Prior art date: 1989-02-03

Application number

ZA90154A

Other languages

English (en)

Inventor

Satish S Tamhankar

S Tamhankar Satish

Mark J Kirschner

J Kirschner Mark

Original Assignee

Boc Group Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1989-02-03

Filing date

1990-01-09

Publication date

1990-12-28

1990-01-09 Application filed by Boc Group Inc filed Critical Boc Group Inc

1990-12-28 Publication of ZA90154B publication Critical patent/ZA90154B/xx

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/01—Manufacture or treatment
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W42/00—Arrangements for protection of devices
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
- H10W70/01—Manufacture or treatment
- H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
- H10W70/098—Applying pastes or inks, e.g. screen printing
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/01—Manufacture or treatment
- H10W72/013—Manufacture or treatment of die-attach connectors

ZA90154A 1989-02-03 1990-01-09 A single atmosphere for firing copper compatible thick film materials ZA90154B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US30642989A	1989-02-03	1989-02-03

Publications (1)

Publication Number	Publication Date
ZA90154B true ZA90154B (en)	1990-12-28

Family

ID=23185246

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
ZA90154A ZA90154B (en)	1989-02-03	1990-01-09	A single atmosphere for firing copper compatible thick film materials

Country Status (6)

Country	Link
EP (1)	EP0381430A3 (fr)
JP (1)	JP2601554B2 (fr)
KR (1)	KR900013575A (fr)
AU (1)	AU625722B2 (fr)
CA (1)	CA2007199C (fr)
ZA (1)	ZA90154B (fr)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2000124157A (ja) *	1998-08-10	2000-04-28	Vacuum Metallurgical Co Ltd	Ｃｕ薄膜の形成法
US8053867B2 (en)	2008-08-20	2011-11-08	Honeywell International Inc.	Phosphorous-comprising dopants and methods for forming phosphorous-doped regions in semiconductor substrates using phosphorous-comprising dopants
US7951696B2 (en)	2008-09-30	2011-05-31	Honeywell International Inc.	Methods for simultaneously forming N-type and P-type doped regions using non-contact printing processes
US8518170B2 (en)	2008-12-29	2013-08-27	Honeywell International Inc.	Boron-comprising inks for forming boron-doped regions in semiconductor substrates using non-contact printing processes and methods for fabricating such boron-comprising inks
US8324089B2 (en)	2009-07-23	2012-12-04	Honeywell International Inc.	Compositions for forming doped regions in semiconductor substrates, methods for fabricating such compositions, and methods for forming doped regions using such compositions
US8629294B2 (en)	2011-08-25	2014-01-14	Honeywell International Inc.	Borate esters, boron-comprising dopants, and methods of fabricating boron-comprising dopants
US8975170B2 (en)	2011-10-24	2015-03-10	Honeywell International Inc.	Dopant ink compositions for forming doped regions in semiconductor substrates, and methods for fabricating dopant ink compositions

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US4234367A (en) *	1979-03-23	1980-11-18	International Business Machines Corporation	Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
JPS59995A (ja) *	1982-06-16	1984-01-06	富士通株式会社	銅導体多層構造体の製造方法
JPS60149191A (ja) *	1984-01-17	1985-08-06	株式会社日立製作所	Ｌｓｉ実装基板の製造方法
US4622240A (en) *	1985-11-12	1986-11-11	Air Products And Chemicals, Inc.	Process for manufacturing thick-film electrical components
JPS6369786A (ja) *	1986-09-09	1988-03-29	電気化学工業株式会社	メタライズ層をもつた窒化アルミニウム基板の製法
CA1274430A (fr) *	1986-10-14	1990-09-25	E. I. Du Pont De Nemours And Company	Methode de cuisson sous atmosphere controlee
US4772488A (en) *	1987-03-23	1988-09-20	General Electric Company	Organic binder removal using CO2 plasma

1990
- 1990-01-05 CA CA002007199A patent/CA2007199C/fr not_active Expired - Fee Related
- 1990-01-09 ZA ZA90154A patent/ZA90154B/xx unknown
- 1990-01-25 AU AU48836/90A patent/AU625722B2/en not_active Ceased
- 1990-01-30 EP EP19900300930 patent/EP0381430A3/fr not_active Withdrawn
- 1990-02-02 KR KR1019900001275A patent/KR900013575A/ko not_active Withdrawn
- 1990-02-03 JP JP2025008A patent/JP2601554B2/ja not_active Expired - Lifetime

Also Published As

Publication number	Publication date
KR900013575A (ko)	1990-09-06
JP2601554B2 (ja)	1997-04-16
EP0381430A2 (fr)	1990-08-08
AU625722B2 (en)	1992-07-16
CA2007199A1 (fr)	1990-08-03
JPH02277282A (ja)	1990-11-13
AU4883690A (en)	1990-08-09
EP0381430A3 (fr)	1991-05-02
CA2007199C (fr)	1993-05-18

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