ZA9811119B - Integrated circuit header assembly and method for making same - Google Patents

Integrated circuit header assembly and method for making same

Info

Publication number
ZA9811119B
ZA9811119B ZA9811119A ZA9811119A ZA9811119B ZA 9811119 B ZA9811119 B ZA 9811119B ZA 9811119 A ZA9811119 A ZA 9811119A ZA 9811119 A ZA9811119 A ZA 9811119A ZA 9811119 B ZA9811119 B ZA 9811119B
Authority
ZA
South Africa
Prior art keywords
spacer
header
thermal expansion
die assembly
integrated circuit
Prior art date
Application number
ZA9811119A
Other languages
English (en)
Inventor
William L Robbins
Original Assignee
Draper Lab Charles S
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Draper Lab Charles S filed Critical Draper Lab Charles S
Publication of ZA9811119B publication Critical patent/ZA9811119B/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills

Landscapes

  • Wire Bonding (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Credit Cards Or The Like (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
ZA9811119A 1997-12-05 1998-12-04 Integrated circuit header assembly and method for making same ZA9811119B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/986,259 US6281572B1 (en) 1997-12-05 1997-12-05 Integrated circuit header assembly

Publications (1)

Publication Number Publication Date
ZA9811119B true ZA9811119B (en) 1999-06-09

Family

ID=25532241

Family Applications (1)

Application Number Title Priority Date Filing Date
ZA9811119A ZA9811119B (en) 1997-12-05 1998-12-04 Integrated circuit header assembly and method for making same

Country Status (8)

Country Link
US (1) US6281572B1 (de)
EP (1) EP1038317B1 (de)
AT (1) ATE409962T1 (de)
AU (1) AU1530499A (de)
DE (1) DE69840075D1 (de)
TW (1) TW430953B (de)
WO (1) WO1999030367A1 (de)
ZA (1) ZA9811119B (de)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050046016A1 (en) * 2003-09-03 2005-03-03 Ken Gilleo Electronic package with insert conductor array
TWI222733B (en) * 2003-12-22 2004-10-21 Ali Corp Wire bonding package
US7199345B1 (en) * 2004-03-26 2007-04-03 Itt Manufacturing Enterprises Inc. Low profile wire bond for an electron sensing device in an image intensifier tube
US7012328B2 (en) * 2004-05-14 2006-03-14 Intevac, Inc. Semiconductor die attachment for high vacuum tubes
US7607560B2 (en) * 2004-05-14 2009-10-27 Intevac, Inc. Semiconductor die attachment for high vacuum tubes
JP3756169B2 (ja) * 2004-07-26 2006-03-15 シャープ株式会社 光受信装置
IL165948A0 (en) * 2004-12-23 2006-01-15 Rafael Armament Dev Authority Chip packaging
EP1734583A1 (de) * 2005-06-14 2006-12-20 Photonis-DEP B.V. Elektronenbombartierder Bildaufnahmesensor und sein Herstellungsverfahren
EP1734584A1 (de) * 2005-06-14 2006-12-20 Photonis-DEP B.V. Elektronenbeschossene Bildsensorvorrichtung, sowie eine solche Bildsensoranordnung
US7589420B2 (en) * 2006-06-06 2009-09-15 Hewlett-Packard Development Company, L.P. Print head with reduced bonding stress and method
JP4490406B2 (ja) 2006-10-11 2010-06-23 浜松ホトニクス株式会社 固体撮像装置
US8283756B2 (en) * 2007-08-20 2012-10-09 Infineon Technologies Ag Electronic component with buffer layer
US9734977B2 (en) 2015-07-16 2017-08-15 Intevac, Inc. Image intensifier with indexed compliant anode assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4044374A (en) * 1976-01-19 1977-08-23 Texas Instruments Incorporated Semiconductor device header suitable for vacuum tube applications
US4400870A (en) * 1980-10-06 1983-08-30 Texas Instruments Incorporated Method of hermetically encapsulating a semiconductor device by laser irradiation
US4604519A (en) * 1983-05-13 1986-08-05 Rca Corporation Intensified charge coupled image sensor having an improved CCD support
US5264726A (en) * 1989-07-21 1993-11-23 Nec Corporation Chip-carrier
FR2677808B1 (fr) * 1991-06-14 1997-06-27 Thomson Composants Militaires Dispositif de fixation d'un senseur ccd sur un tube intensificateur d'image.
US5315155A (en) * 1992-07-13 1994-05-24 Olin Corporation Electronic package with stress relief channel
GB2288286A (en) * 1994-03-30 1995-10-11 Plessey Semiconductors Ltd Ball grid array arrangement
JP2616565B2 (ja) * 1994-09-12 1997-06-04 日本電気株式会社 電子部品組立体

Also Published As

Publication number Publication date
WO1999030367A1 (en) 1999-06-17
EP1038317B1 (de) 2008-10-01
US6281572B1 (en) 2001-08-28
AU1530499A (en) 1999-06-28
TW430953B (en) 2001-04-21
ATE409962T1 (de) 2008-10-15
EP1038317A4 (de) 2006-10-25
DE69840075D1 (de) 2008-11-13
EP1038317A1 (de) 2000-09-27

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