AR063473A1 - Composicion adhesiva de silicona y metodo de preparacion de la misma - Google Patents
Composicion adhesiva de silicona y metodo de preparacion de la mismaInfo
- Publication number
- AR063473A1 AR063473A1 ARP070104600A ARP070104600A AR063473A1 AR 063473 A1 AR063473 A1 AR 063473A1 AR P070104600 A ARP070104600 A AR P070104600A AR P070104600 A ARP070104600 A AR P070104600A AR 063473 A1 AR063473 A1 AR 063473A1
- Authority
- AR
- Argentina
- Prior art keywords
- silicon
- adhesive composition
- silicone adhesive
- transition metal
- same preparation
- Prior art date
Links
- 239000000203 mixture Substances 0.000 title abstract 3
- 238000002360 preparation method Methods 0.000 title 1
- 239000013464 silicone adhesive Substances 0.000 title 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 4
- 229910052710 silicon Inorganic materials 0.000 abstract 3
- 239000010703 silicon Substances 0.000 abstract 3
- 125000003342 alkenyl group Chemical group 0.000 abstract 2
- 239000000945 filler Substances 0.000 abstract 2
- 239000011159 matrix material Substances 0.000 abstract 2
- 239000002245 particle Substances 0.000 abstract 2
- 229920000642 polymer Polymers 0.000 abstract 2
- 229910052723 transition metal Inorganic materials 0.000 abstract 2
- 150000003624 transition metals Chemical class 0.000 abstract 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract 1
- 239000003054 catalyst Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 229910052739 hydrogen Inorganic materials 0.000 abstract 1
- 239000001257 hydrogen Substances 0.000 abstract 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 abstract 1
- 229920001296 polysiloxane Polymers 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/54—Inorganic substances
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Una composicion de material térmico de interfase que incluye una mezcla de una matriz de polímero y un relleno térmico conductivo que tienen partículas que tienen un diámetro de partícula máximo no mayor de alrededor de 25 micrones, en donde la matriz de polímero incluye un organopolisiloxano que tiene por lo menos dos grupos alquenilos unidos con silicio por molécula, un organohidrogenopolisiloxano que tiene por lo menos dos átomos de silicio unidos con hidrogeno por molécula y un catalizador de hidrosiliacion que comprende un metal de transicion en donde le metal de transicion está presente en una cantidad de desde alrededor de 10 a alrededor de 20 ppm de peso basada en el peso del compuesto que no sea de relleno y la relacion molar de los átomos de hidrogeno unidos a través de silicio con los grupos alquenilos unidos a través del silicio está en un rango de desde alrededor de 1 a alrededor de 2. También se provee un método.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/566,102 US20070219312A1 (en) | 2006-03-17 | 2006-12-01 | Silicone adhesive composition and method for preparing the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AR063473A1 true AR063473A1 (es) | 2009-01-28 |
Family
ID=39760245
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ARP070104600A AR063473A1 (es) | 2006-12-01 | 2007-10-17 | Composicion adhesiva de silicona y metodo de preparacion de la misma |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US20070219312A1 (es) |
| EP (1) | EP2094805A2 (es) |
| JP (1) | JP2010511738A (es) |
| KR (1) | KR20090086425A (es) |
| CN (1) | CN101627077A (es) |
| AR (1) | AR063473A1 (es) |
| CL (1) | CL2007002527A1 (es) |
| TW (1) | TW200831628A (es) |
| WO (1) | WO2008111953A2 (es) |
Families Citing this family (60)
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| US20070099006A1 (en) * | 2005-11-02 | 2007-05-03 | Ers Company | Highly compliant bonding compound and structure |
| JP5377846B2 (ja) * | 2007-11-09 | 2013-12-25 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 熱硬化性シリコーンゴム組成物 |
| US7808099B2 (en) * | 2008-05-06 | 2010-10-05 | International Business Machines Corporation | Liquid thermal interface having mixture of linearly structured polymer doped crosslinked networks and related method |
| US8278408B2 (en) * | 2008-07-22 | 2012-10-02 | Denki Kagaku Kogyo Kabushiki Kaisha | Resin composition |
| JP5534837B2 (ja) * | 2010-01-28 | 2014-07-02 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| WO2011125753A1 (ja) | 2010-04-02 | 2011-10-13 | 株式会社カネカ | 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード |
| TWI522423B (zh) * | 2010-08-31 | 2016-02-21 | 道康寧東麗股份有限公司 | 聚矽氧烷組合物及其硬化物 |
| JP6300218B2 (ja) | 2010-12-31 | 2018-03-28 | サムスン エスディアイ カンパニー, リミテッドSamsung Sdi Co., Ltd. | 封止材用透光性樹脂組成物、該透光性樹脂を含む封止材および電子素子 |
| KR101866299B1 (ko) * | 2011-01-26 | 2018-06-12 | 다우 실리콘즈 코포레이션 | 고온 안정성 열 전도성 재료 |
| CN102408869B (zh) * | 2011-08-04 | 2013-07-24 | 绵阳惠利电子材料有限公司 | 无卤阻燃电子电器用加成型有机硅灌封胶 |
| JP5912600B2 (ja) * | 2011-09-16 | 2016-04-27 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| TWI532815B (zh) * | 2012-01-20 | 2016-05-11 | 先鋒材料科技股份有限公司 | 導熱、絕緣、耐燃及耐高溫之黏著劑及其組合物 |
| JP2013159671A (ja) * | 2012-02-02 | 2013-08-19 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| CN103378022B (zh) * | 2012-04-13 | 2016-06-08 | 普罗旺斯科技(深圳)有限公司 | 散热片及其制造方法 |
| JP2014065900A (ja) * | 2012-09-07 | 2014-04-17 | Dow Corning Toray Co Ltd | 硬化性シリコーン組成物およびその硬化物 |
| CN102924925B (zh) * | 2012-09-28 | 2014-08-06 | 四川科立鑫新材料有限公司 | 一种高导热单组份硅橡胶的制备方法 |
| KR20140075865A (ko) * | 2012-12-07 | 2014-06-20 | 삼성정밀화학 주식회사 | 태양전지 모듈용 접착 조성물, 이로부터 형성된 태양전지 모듈용 접착부재 및 이를 구비한 태양전지 모듈 |
| TW201439264A (zh) * | 2012-12-20 | 2014-10-16 | 道康寧公司 | 製造電子裝置的方法 |
| CN103030976B (zh) * | 2012-12-27 | 2015-05-13 | 成都拓利化工实业有限公司 | 一种单组份加热固化液体硅橡胶及其制备方法 |
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| CN103408937B (zh) * | 2013-07-30 | 2015-06-03 | 深圳德邦界面材料有限公司 | 一种粘性或非粘性的导热界面材料及其制备方法 |
| CN103725250B (zh) * | 2013-12-30 | 2016-08-17 | 成都拓利科技股份有限公司 | 一种固化液体密封硅橡胶 |
| KR20160122172A (ko) | 2014-02-13 | 2016-10-21 | 허니웰 인터내셔날 인코포레이티드 | 압축성 열전도 재료 |
| CN106661331B (zh) * | 2014-03-06 | 2020-10-23 | 汉高股份有限及两合公司 | 单晶氧化铝填充的管芯粘结膏 |
| WO2015156257A1 (ja) * | 2014-04-07 | 2015-10-15 | 日本ゼオン株式会社 | 熱伝導性感圧接着性積層シートの製造方法、熱伝導性感圧接着性積層シート、及び、電子機器 |
| WO2015156254A1 (ja) * | 2014-04-07 | 2015-10-15 | 日本ゼオン株式会社 | 熱伝導性感圧接着性積層シートの製造方法、熱伝導性感圧接着性積層シート、及び、電子機器 |
| CN104178080B (zh) * | 2014-09-01 | 2015-11-18 | 烟台德邦先进硅材料有限公司 | 一种高强度igbt大功率模块封装硅胶及其封装工艺 |
| WO2016049477A1 (en) * | 2014-09-26 | 2016-03-31 | Momentive Performance Materials Inc. | Lamination composite of boron nitride in paper for transformer insulation |
| WO2016054781A1 (en) * | 2014-10-09 | 2016-04-14 | Henkel (China) Company Limited | An organopolysiloxane prepolymer and a curable organopolysiloxane composition comprising the same |
| ES2914973T3 (es) | 2015-03-05 | 2022-06-20 | Henkel Ag & Co Kgaa | Adhesivo termoconductor |
| WO2017011453A1 (en) * | 2015-07-13 | 2017-01-19 | Laird Technologies, Inc. | Thermal management and/or emi mitigation materials with custom colored exterior surfaces |
| CN106467668B (zh) * | 2015-08-19 | 2021-07-30 | 广东生益科技股份有限公司 | 一种有机硅树脂铝基覆铜板及其制备方法 |
| EP3426746B1 (en) | 2016-03-08 | 2021-07-14 | Honeywell International Inc. | Phase change material |
| TWI738743B (zh) * | 2016-03-23 | 2021-09-11 | 美商道康寧公司 | 金屬-聚有機矽氧烷 |
| CN105860540A (zh) * | 2016-05-11 | 2016-08-17 | 强新正品(苏州)环保材料科技有限公司 | 一种增强型导热硅胶片的制备方法 |
| KR101645374B1 (ko) | 2016-06-23 | 2016-08-04 | 대흥특수화학(주) | 실리콘을 주성분으로 하는 접착제 및 그의 제조방법 |
| US10501671B2 (en) * | 2016-07-26 | 2019-12-10 | Honeywell International Inc. | Gel-type thermal interface material |
| FR3060601B1 (fr) * | 2016-12-20 | 2018-12-07 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Composition adhesive et son utilisation dans l'electronique |
| CN106833510A (zh) * | 2017-01-11 | 2017-06-13 | 宁波聚力新材料科技有限公司 | 新能源高导热低比重有机硅灌封胶 |
| CN107446355A (zh) * | 2017-07-26 | 2017-12-08 | 苏州鸿凌达电子科技有限公司 | 一种双组份导热凝胶及其制备方法 |
| US11041103B2 (en) | 2017-09-08 | 2021-06-22 | Honeywell International Inc. | Silicone-free thermal gel |
| CN111094499B (zh) * | 2017-09-29 | 2022-10-28 | 美国陶氏有机硅公司 | 导热组合物 |
| KR102498951B1 (ko) | 2018-01-11 | 2023-02-15 | 다우 실리콘즈 코포레이션 | 전자 구성요소 상에 열 전도성 조성물을 도포하는 방법 |
| US11072706B2 (en) * | 2018-02-15 | 2021-07-27 | Honeywell International Inc. | Gel-type thermal interface material |
| CN108949056B (zh) * | 2018-07-17 | 2020-12-25 | 德阳中碳新材料科技有限公司 | 一种导热界面材料的制备方法及其产品 |
| WO2020198288A1 (en) * | 2019-03-25 | 2020-10-01 | Lord Corporation | Moldable silicone elastomers having selective primerless adhesion |
| US11373921B2 (en) | 2019-04-23 | 2022-06-28 | Honeywell International Inc. | Gel-type thermal interface material with low pre-curing viscosity and elastic properties post-curing |
| CN111234724A (zh) * | 2020-03-10 | 2020-06-05 | 安徽富印新材料有限公司 | 一种高导热胶黏带 |
| CN115698222A (zh) * | 2020-06-05 | 2023-02-03 | 电化株式会社 | 二液固化型导热性润滑脂用组合物、导热性润滑脂及电子设备 |
| CN111961255B (zh) * | 2020-08-27 | 2021-12-14 | 深圳先进电子材料国际创新研究院 | 一种导热凝胶及其制备方法 |
| US20220064381A1 (en) * | 2020-09-03 | 2022-03-03 | Illinois Tool Works Inc. | Silicone potting composition and uses thereof |
| US12300568B2 (en) | 2021-05-27 | 2025-05-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | High efficiency heat dissipation using discrete thermal interface material films |
| KR20240032952A (ko) * | 2021-07-14 | 2024-03-12 | 다우 실리콘즈 코포레이션 | 열 전도성 실리콘 조성물 |
| CN114015412A (zh) * | 2021-10-21 | 2022-02-08 | 纳派化学(上海)有限公司 | 一种高导热有机硅脂及其制备方法 |
| JP2023112673A (ja) * | 2022-02-01 | 2023-08-14 | 旭化成ワッカーシリコーン株式会社 | 熱伝導性シリコーン組成物および該組成物を使用する熱伝導性部材の製造方法 |
| KR102810630B1 (ko) * | 2022-07-20 | 2025-05-22 | 주식회사 케이씨씨실리콘 | 습기경화형 실록산 조성물 |
| CN115287037B (zh) * | 2022-08-16 | 2023-08-22 | 西卡(江苏)工业材料有限公司 | 一种环保型单组分有机硅高导热胶黏剂及其制备方法和应用 |
| CN115806800B (zh) * | 2022-11-17 | 2024-01-16 | 烟台德邦科技股份有限公司 | 一种半导体芯片围框粘接有机硅密封胶及其制备方法 |
| CN116606608B (zh) * | 2023-05-23 | 2024-04-05 | 江西天永诚高分子材料有限公司 | 一种导热填料、包含其的双组份有机硅灌封胶及其制备方法 |
| CN118459912B (zh) * | 2024-05-17 | 2025-01-24 | 上海交通大学 | 一种聚合物基复合材料热界面材料及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0297559A (ja) * | 1988-10-03 | 1990-04-10 | Toshiba Silicone Co Ltd | 熱伝導性シリコーン組成物 |
| JP3676544B2 (ja) * | 1997-08-05 | 2005-07-27 | ジーイー東芝シリコーン株式会社 | 難燃性放熱性シート用シリコーンゲル組成物および難燃性放熱性シリコーンシート |
| JP3444199B2 (ja) * | 1998-06-17 | 2003-09-08 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及びその製造方法 |
| US6169155B1 (en) * | 1999-01-14 | 2001-01-02 | Dow Corning Corporation | Silicone gel composition and silicone gel produced therefrom |
| JP3580358B2 (ja) * | 2000-06-23 | 2004-10-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| JP3580366B2 (ja) * | 2001-05-01 | 2004-10-20 | 信越化学工業株式会社 | 熱伝導性シリコーン組成物及び半導体装置 |
| DE10204893A1 (de) * | 2002-02-06 | 2003-08-14 | Ge Bayer Silicones Gmbh & Co | Selbsthaftende additionsvernetzende Silikonkautschukmischungen, ein Verfahren zu deren Herstellung, Verfahren zur Herstellung von Verbund-Formteilen und deren Verwendung |
| JP4565491B2 (ja) * | 2003-04-15 | 2010-10-20 | 東レ・ダウコーニング株式会社 | 熱伝導性付加硬化型液状シリコーンゴム組成物 |
| DE602004024049D1 (de) * | 2003-04-15 | 2009-12-24 | Dow Corning Toray Co Ltd | Wärmeleitende, additionsvernetzende, flüssige silikonkautschukmischung und beschichtete fixierwalze |
| US20050049350A1 (en) * | 2003-08-25 | 2005-03-03 | Sandeep Tonapi | Thin bond-line silicone adhesive composition and method for preparing the same |
| JP4557136B2 (ja) * | 2004-05-13 | 2010-10-06 | 信越化学工業株式会社 | 熱伝導性シリコーンゴム組成物及び成型品 |
-
2006
- 2006-12-01 US US11/566,102 patent/US20070219312A1/en not_active Abandoned
-
2007
- 2007-08-28 TW TW096131872A patent/TW200831628A/zh unknown
- 2007-08-30 EP EP07873954A patent/EP2094805A2/en not_active Withdrawn
- 2007-08-30 CN CN200780050337A patent/CN101627077A/zh active Pending
- 2007-08-30 JP JP2009539239A patent/JP2010511738A/ja active Pending
- 2007-08-30 WO PCT/US2007/019111 patent/WO2008111953A2/en not_active Ceased
- 2007-08-30 KR KR1020097011333A patent/KR20090086425A/ko not_active Withdrawn
- 2007-08-30 CL CL200702527A patent/CL2007002527A1/es unknown
- 2007-10-17 AR ARP070104600A patent/AR063473A1/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| EP2094805A2 (en) | 2009-09-02 |
| WO2008111953A2 (en) | 2008-09-18 |
| JP2010511738A (ja) | 2010-04-15 |
| KR20090086425A (ko) | 2009-08-12 |
| TW200831628A (en) | 2008-08-01 |
| CN101627077A (zh) | 2010-01-13 |
| CL2007002527A1 (es) | 2008-02-15 |
| US20070219312A1 (en) | 2007-09-20 |
| WO2008111953A3 (en) | 2009-08-27 |
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