AT321996B - Anordnung zur kontaktierung von halbleiterbauelementen - Google Patents

Anordnung zur kontaktierung von halbleiterbauelementen

Info

Publication number
AT321996B
AT321996B AT370971A AT370971A AT321996B AT 321996 B AT321996 B AT 321996B AT 370971 A AT370971 A AT 370971A AT 370971 A AT370971 A AT 370971A AT 321996 B AT321996 B AT 321996B
Authority
AT
Austria
Prior art keywords
arrangement
conductor components
semi
contacting
contacting semi
Prior art date
Application number
AT370971A
Other languages
English (en)
Original Assignee
Siemens Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag filed Critical Siemens Ag
Application granted granted Critical
Publication of AT321996B publication Critical patent/AT321996B/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/464—Additional interconnections in combination with leadframes
    • H10W70/466—Tape carriers or flat leads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00—Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10—Containers or parts thereof
    • H10W76/12—Containers or parts thereof characterised by their shape
    • H10W76/161—Containers comprising no base
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/072—Connecting or disconnecting of bump connectors
    • H10W72/07231—Techniques
    • H10W72/07236—Soldering or alloying
AT370971A 1970-05-14 1971-04-29 Anordnung zur kontaktierung von halbleiterbauelementen AT321996B (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2023680A DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben

Publications (1)

Publication Number Publication Date
AT321996B true AT321996B (de) 1975-04-25

Family

ID=5771149

Family Applications (1)

Application Number Title Priority Date Filing Date
AT370971A AT321996B (de) 1970-05-14 1971-04-29 Anordnung zur kontaktierung von halbleiterbauelementen

Country Status (8)

Country Link
JP (1) JPS55905B1 (de)
AT (1) AT321996B (de)
CA (1) CA938737A (de)
CH (1) CH524247A (de)
DE (1) DE2023680C3 (de)
GB (1) GB1307038A (de)
NL (1) NL7106597A (de)
SE (1) SE365652B (de)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger
JPS63193496U (de) * 1987-05-30 1988-12-13

Also Published As

Publication number Publication date
CA938737A (en) 1973-12-18
GB1307038A (en) 1973-02-14
DE2023680B2 (de) 1974-12-19
DE2023680A1 (de) 1971-11-25
DE2023680C3 (de) 1975-07-24
CH524247A (de) 1972-06-15
SE365652B (de) 1974-03-25
JPS55905B1 (de) 1980-01-10
NL7106597A (de) 1971-11-16

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Legal Events

Date Code Title Description
ELJ Ceased due to non-payment of the annual fee