JPS55905B1 - - Google Patents

Info

Publication number
JPS55905B1
JPS55905B1 JP3235971A JP3235971A JPS55905B1 JP S55905 B1 JPS55905 B1 JP S55905B1 JP 3235971 A JP3235971 A JP 3235971A JP 3235971 A JP3235971 A JP 3235971A JP S55905 B1 JPS55905 B1 JP S55905B1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3235971A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS55905B1 publication Critical patent/JPS55905B1/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40Leadframes
    • H10W70/464Additional interconnections in combination with leadframes
    • H10W70/466Tape carriers or flat leads
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04Apparatus for manufacture or treatment
    • H10P72/0446Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W76/00Containers; Fillings or auxiliary members therefor; Seals
    • H10W76/10Containers or parts thereof
    • H10W76/12Containers or parts thereof characterised by their shape
    • H10W76/161Containers comprising no base
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00Interconnections or connectors in packages
    • H10W72/071Connecting or disconnecting
    • H10W72/072Connecting or disconnecting of bump connectors
    • H10W72/07231Techniques
    • H10W72/07236Soldering or alloying

Landscapes

  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Die Bonding (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP3235971A 1970-05-14 1971-05-14 Pending JPS55905B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2023680A DE2023680C3 (de) 1970-05-14 1970-05-14 Anordnung zur Kontaktierung von Halbleiterbauelementen und Verfahren zur Herstellung derselben

Publications (1)

Publication Number Publication Date
JPS55905B1 true JPS55905B1 (de) 1980-01-10

Family

ID=5771149

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3235971A Pending JPS55905B1 (de) 1970-05-14 1971-05-14

Country Status (8)

Country Link
JP (1) JPS55905B1 (de)
AT (1) AT321996B (de)
CA (1) CA938737A (de)
CH (1) CH524247A (de)
DE (1) DE2023680C3 (de)
GB (1) GB1307038A (de)
NL (1) NL7106597A (de)
SE (1) SE365652B (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193496U (de) * 1987-05-30 1988-12-13

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2431987C2 (de) * 1974-07-03 1983-09-01 Siemens AG, 1000 Berlin und 8000 München Verfahren zum Verbinden eines mit höckerförmigen Anschlußelektroden versehenen Halbleiterbauelements mit einem Träger

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193496U (de) * 1987-05-30 1988-12-13

Also Published As

Publication number Publication date
CA938737A (en) 1973-12-18
GB1307038A (en) 1973-02-14
AT321996B (de) 1975-04-25
DE2023680B2 (de) 1974-12-19
DE2023680A1 (de) 1971-11-25
DE2023680C3 (de) 1975-07-24
CH524247A (de) 1972-06-15
SE365652B (de) 1974-03-25
NL7106597A (de) 1971-11-16

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