AT377885B - METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS - Google Patents

METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS

Info

Publication number: AT377885B
Authority: AT; Austria
Prior art keywords: determining; layer thickness; thickness; layer
Prior art date: 1978-07-19

Application number

AT0497279A

Other languages

German (de)

Other versions

ATA497279A (en

Original Assignee

Kollmorgen Tech Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1978-07-19

Filing date

1979-07-18

Publication date

1985-05-10

1979-07-18 Application filed by Kollmorgen Tech Corp filed Critical Kollmorgen Tech Corp

1984-09-15 Publication of ATA497279A publication Critical patent/ATA497279A/en

1985-05-10 Application granted granted Critical

1985-05-10 Publication of AT377885B publication Critical patent/AT377885B/en

Links

Classifications

- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
- G01B7/06—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness for measuring thickness
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor

Landscapes

Physics & Mathematics (AREA)
General Physics & Mathematics (AREA)
Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Investigating Or Analyzing Materials By The Use Of Electric Means (AREA)
Measurement Of Resistance Or Impedance (AREA)
Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
Length Measuring Devices By Optical Means (AREA)

AT0497279A 1978-07-19 1979-07-18 METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS AT377885B (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US92607478A	1978-07-19	1978-07-19

Publications (2)

Publication Number	Publication Date
ATA497279A ATA497279A (en)	1984-09-15
AT377885B true AT377885B (en)	1985-05-10

Family

ID=25452709

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AT0497279A AT377885B (en)	1978-07-19	1979-07-18	METHOD AND DEVICE FOR DETERMINING THE LAYER THICKNESS

Country Status (11)

Country	Link
JP (1)	JPS5923363B2 (en)
AT (1)	AT377885B (en)
AU (1)	AU3884378A (en)
BR (1)	BR7805509A (en)
CH (1)	CH640343A5 (en)
DE (1)	DE2929567C2 (en)
FR (1)	FR2431679A1 (en)
GB (1)	GB2027212B (en)
IT (1)	IT7949804A0 (en)
NL (1)	NL7904876A (en)
SE (1)	SE448784B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US5495178A (en) *	1992-11-10	1996-02-27	Cheng; David	Method and apparatus for measuring film thickness
US5691648A (en) *	1992-11-10	1997-11-25	Cheng; David	Method and apparatus for measuring sheet resistance and thickness of thin films and substrates
CN108712830B (en) *	2018-05-30	2021-02-26	广东天承科技股份有限公司	Palladium-free electroless copper plating process for circuit boards

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3365663A (en) *	1962-06-29	1968-01-23	Shin Mitsubishi Jukogyo Kk	Thickness measuring instrument for electro-conductive objects and associated methods
US4042880A (en) *	1974-01-07	1977-08-16	Unit Process Assemblies, Inc.	Electrode assembly for measuring the effective thickness of thru-hole plating circuit board workpieces
JPS5262045A (en) *	1975-11-17	1977-05-23	Oki Electric Ind Co Ltd	Measuring thickness of non-electrolytic copper plating of through-hole substrate

1978
- 1978-08-11 AU AU38843/78A patent/AU3884378A/en active Pending
- 1978-08-24 BR BR7805509A patent/BR7805509A/en unknown
- 1978-08-25 JP JP53104312A patent/JPS5923363B2/en not_active Expired
1979
- 1979-06-21 NL NL7904876A patent/NL7904876A/en not_active Application Discontinuation
- 1979-07-16 GB GB7924748A patent/GB2027212B/en not_active Expired
- 1979-07-16 SE SE7906144A patent/SE448784B/en not_active IP Right Cessation
- 1979-07-18 FR FR7918577A patent/FR2431679A1/en active Granted
- 1979-07-18 CH CH670379A patent/CH640343A5/en not_active IP Right Cessation
- 1979-07-18 AT AT0497279A patent/AT377885B/en active
- 1979-07-19 DE DE2929567A patent/DE2929567C2/en not_active Expired
- 1979-07-19 IT IT7949804A patent/IT7949804A0/en unknown

Also Published As

Publication number	Publication date
AU3884378A (en)	1980-02-14
DE2929567A1 (en)	1980-01-31
ATA497279A (en)	1984-09-15
JPS5923363B2 (en)	1984-06-01
SE7906144L (en)	1980-01-20
DE2929567C2 (en)	1983-10-13
IT7949804A0 (en)	1979-07-19
FR2431679A1 (en)	1980-02-15
SE448784B (en)	1987-03-16
NL7904876A (en)	1980-01-22
GB2027212B (en)	1983-05-05
JPS5517489A (en)	1980-02-06
FR2431679B1 (en)	1983-06-17
GB2027212A (en)	1980-02-13
CH640343A5 (en)	1983-12-30
BR7805509A (en)	1980-03-11

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