JPS5262045A - Measuring thickness of non-electrolytic copper plating of through-hole substrate - Google Patents

Measuring thickness of non-electrolytic copper plating of through-hole substrate

Info

Publication number
JPS5262045A
JPS5262045A JP13722175A JP13722175A JPS5262045A JP S5262045 A JPS5262045 A JP S5262045A JP 13722175 A JP13722175 A JP 13722175A JP 13722175 A JP13722175 A JP 13722175A JP S5262045 A JPS5262045 A JP S5262045A
Authority
JP
Japan
Prior art keywords
copper plating
electrolytic copper
measuring thickness
hole substrate
current
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13722175A
Other languages
Japanese (ja)
Other versions
JPS5728082B2 (en
Inventor
Seiji Arakawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP13722175A priority Critical patent/JPS5262045A/en
Publication of JPS5262045A publication Critical patent/JPS5262045A/en
Publication of JPS5728082B2 publication Critical patent/JPS5728082B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

PURPOSE: To enable quick and exact measurement of the thickness of plating by applying a current to the through-hole copper plating layer of the substrate a current changing in value linearly, and detecting the amount of the current at the time when the plating layer is melted by Joule heat.
COPYRIGHT: (C)1977,JPO&Japio
JP13722175A 1975-11-17 1975-11-17 Measuring thickness of non-electrolytic copper plating of through-hole substrate Granted JPS5262045A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13722175A JPS5262045A (en) 1975-11-17 1975-11-17 Measuring thickness of non-electrolytic copper plating of through-hole substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13722175A JPS5262045A (en) 1975-11-17 1975-11-17 Measuring thickness of non-electrolytic copper plating of through-hole substrate

Publications (2)

Publication Number Publication Date
JPS5262045A true JPS5262045A (en) 1977-05-23
JPS5728082B2 JPS5728082B2 (en) 1982-06-15

Family

ID=15193604

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13722175A Granted JPS5262045A (en) 1975-11-17 1975-11-17 Measuring thickness of non-electrolytic copper plating of through-hole substrate

Country Status (1)

Country Link
JP (1) JPS5262045A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929567A1 (en) * 1978-07-19 1980-01-31 Kollmorgen Tech Corp METHOD AND DEVICE FOR THE AUTOMATIC DETERMINATION OF THICKNESS
CN110307776A (en) * 2019-08-06 2019-10-08 无锡市帕尔斯仪器有限公司 A kind of thickness measuring method of hole face copper integration measuring thickness device and five terminal micrometer resistance

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2929567A1 (en) * 1978-07-19 1980-01-31 Kollmorgen Tech Corp METHOD AND DEVICE FOR THE AUTOMATIC DETERMINATION OF THICKNESS
CN110307776A (en) * 2019-08-06 2019-10-08 无锡市帕尔斯仪器有限公司 A kind of thickness measuring method of hole face copper integration measuring thickness device and five terminal micrometer resistance
CN110307776B (en) * 2019-08-06 2024-03-26 无锡市帕尔斯仪器有限公司 Hole surface copper integrated thickness measuring device and thickness measuring method of five-terminal micro-resistor

Also Published As

Publication number Publication date
JPS5728082B2 (en) 1982-06-15

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