AT501653A5 - Substrat-reinigungsverfahren, substrat-reinigungsvorrichtung und computer-lesbares aufzeichnungsmedium - Google Patents

Substrat-reinigungsverfahren, substrat-reinigungsvorrichtung und computer-lesbares aufzeichnungsmedium Download PDF

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Publication number
AT501653A5
AT501653A5 AT0939904A AT93992004A AT501653A5 AT 501653 A5 AT501653 A5 AT 501653A5 AT 0939904 A AT0939904 A AT 0939904A AT 93992004 A AT93992004 A AT 93992004A AT 501653 A5 AT501653 A5 AT 501653A5
Authority
AT
Austria
Prior art keywords
substrate cleaning
computer
recording medium
readable recording
cleaning device
Prior art date
Application number
AT0939904A
Other languages
English (en)
Other versions
AT501653B1 (de
AT501653A2 (de
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AT501653A2 publication Critical patent/AT501653A2/de
Publication of AT501653A5 publication Critical patent/AT501653A5/de
Application granted granted Critical
Publication of AT501653B1 publication Critical patent/AT501653B1/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/02—Cleaning by the force of jets or sprays
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B23/00—Record carriers not specific to the method of recording or reproducing; Accessories, e.g. containers, specially adapted for co-operation with the recording or reproducing apparatus ; Intermediate mediums; Apparatus or processes specially adapted for their manufacture
    • G11B23/50—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges
    • G11B23/505—Reconditioning of record carriers; Cleaning of record carriers ; Carrying-off electrostatic charges of disk carriers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0408—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor
AT0939904A 2003-11-18 2004-11-12 Substrat-reinigungsverfahren, substrat-reinigungsvorrichtung und computer-lesbares aufzeichnungsmedium AT501653B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003387728 2003-11-18
PCT/JP2004/016842 WO2005050724A1 (ja) 2003-11-18 2004-11-12 基板洗浄方法、基板洗浄装置およびコンピュータ読み取り可能な記録媒体

Publications (3)

Publication Number Publication Date
AT501653A2 AT501653A2 (de) 2006-10-15
AT501653A5 true AT501653A5 (de) 2010-02-15
AT501653B1 AT501653B1 (de) 2010-04-15

Family

ID=34616168

Family Applications (1)

Application Number Title Priority Date Filing Date
AT0939904A AT501653B1 (de) 2003-11-18 2004-11-12 Substrat-reinigungsverfahren, substrat-reinigungsvorrichtung und computer-lesbares aufzeichnungsmedium

Country Status (7)

Country Link
US (2) US7927429B2 (de)
JP (1) JP4040063B2 (de)
KR (1) KR100772469B1 (de)
CN (1) CN100423205C (de)
AT (1) AT501653B1 (de)
TW (1) TWI242808B (de)
WO (1) WO2005050724A1 (de)

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JP4527660B2 (ja) 2005-06-23 2010-08-18 東京エレクトロン株式会社 基板処理方法及び基板処理装置
JP4680044B2 (ja) * 2005-11-24 2011-05-11 東京エレクトロン株式会社 液処理方法、液処理装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
US7914626B2 (en) 2005-11-24 2011-03-29 Tokyo Electron Limited Liquid processing method and liquid processing apparatus
JP4607755B2 (ja) * 2005-12-19 2011-01-05 東京エレクトロン株式会社 基板洗浄方法、基板洗浄装置、制御プログラム、およびコンピュータ読取可能な記憶媒体
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JP5143498B2 (ja) 2006-10-06 2013-02-13 東京エレクトロン株式会社 基板処理方法、基板処理装置、プログラムならびに記録媒体
JP5166802B2 (ja) * 2007-09-13 2013-03-21 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
JP5192206B2 (ja) * 2007-09-13 2013-05-08 株式会社Ｓｏｋｕｄｏ 基板処理装置および基板処理方法
CN101391254B (zh) * 2007-09-17 2010-04-21 中芯国际集成电路制造(上海)有限公司 晶片清洗方法
JP4940123B2 (ja) * 2007-12-21 2012-05-30 東京エレクトロン株式会社 基板処理装置および基板処理方法
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JP5538102B2 (ja) 2010-07-07 2014-07-02 株式会社Ｓｏｋｕｄｏ 基板洗浄方法および基板洗浄装置
JP5889537B2 (ja) * 2011-03-23 2016-03-22 ファスフォードテクノロジ株式会社 ダイボンダ
JP5789400B2 (ja) * 2011-04-12 2015-10-07 東京エレクトロン株式会社 液処理方法及び液処理装置
TWI566311B (zh) * 2011-06-27 2017-01-11 聯華電子股份有限公司 半導體機台與其操作方法
JP2013201418A (ja) * 2012-02-24 2013-10-03 Ebara Corp 基板処理方法
CN102580941A (zh) * 2012-02-27 2012-07-18 上海集成电路研发中心有限公司 提高晶圆清洁度的清洗方法及清洗甩干设备
JP5926086B2 (ja) 2012-03-28 2016-05-25 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
JP6250924B2 (ja) 2012-10-02 2017-12-20 株式会社荏原製作所 基板洗浄装置および研磨装置
US9079304B2 (en) * 2012-10-31 2015-07-14 Semes Co., Ltd. Transfer unit, method for controlling the transfer unit, and apparatus and method for treating substrate using the transfer unit
JP6007925B2 (ja) * 2013-05-28 2016-10-19 東京エレクトロン株式会社 基板洗浄装置、基板洗浄方法及び記憶媒体
TWI597770B (zh) 2013-09-27 2017-09-01 斯克林集團公司 基板處理裝置及基板處理方法
JP6308910B2 (ja) * 2013-11-13 2018-04-11 東京エレクトロン株式会社 基板洗浄方法、基板洗浄システムおよび記憶媒体
JP6064875B2 (ja) * 2013-11-25 2017-01-25 東京エレクトロン株式会社 液処理装置、液処理方法及び記憶媒体
US9793143B2 (en) * 2014-01-06 2017-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor processing apparatus and method of operating the same
JP6386769B2 (ja) * 2014-04-16 2018-09-05 株式会社荏原製作所 基板乾燥装置、制御プログラム、及び基板乾燥方法
JP2015211137A (ja) * 2014-04-25 2015-11-24 キヤノン株式会社 半導体素子の製造方法及び洗浄処理システム
CN106507684B (zh) 2014-06-16 2020-01-10 Asml荷兰有限公司 光刻设备、转移衬底的方法和器件制造方法
KR102231022B1 (ko) * 2014-07-14 2021-03-25 세메스 주식회사 기판 처리 장치 및 기판 처리 방법
JP6454245B2 (ja) * 2014-10-21 2019-01-16 東京エレクトロン株式会社 基板液処理方法及び基板液処理装置並びに基板液処理プログラムを記憶したコンピュータ読み取り可能な記憶媒体
KR20160057966A (ko) 2014-11-14 2016-05-24 가부시끼가이샤 도시바 처리 장치, 노즐 및 다이싱 장치
JP6545511B2 (ja) * 2015-04-10 2019-07-17 株式会社東芝 処理装置
KR102549285B1 (ko) 2015-11-14 2023-06-28 도쿄엘렉트론가부시키가이샤 묽은 tmah을 사용하여 마이크로전자 기판을 처리하는 방법
JP6690717B2 (ja) * 2016-08-22 2020-04-28 東京エレクトロン株式会社 塗布方法、塗布装置及び記憶媒体
JP6975953B2 (ja) * 2016-12-28 2021-12-01 ヒューグル開発株式会社 異物除去装置及び異物除去方法
WO2020105394A1 (ja) * 2018-11-21 2020-05-28 オルガノ株式会社 採水ディスペンサー及び純水製造装置
CN112859548B (zh) * 2019-11-27 2024-03-26 长鑫存储技术有限公司 显影装置及其显影方法
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KR102615758B1 (ko) * 2021-05-10 2023-12-19 세메스 주식회사 기판 처리 장치 및 방법
CN120243517A (zh) * 2025-03-25 2025-07-04 苏州芯钛半导体科技有限公司 一种半导体非匀速清洗装置

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Also Published As

Publication number Publication date
KR100772469B1 (ko) 2007-11-02
CN1883035A (zh) 2006-12-20
TW200524029A (en) 2005-07-16
TWI242808B (en) 2005-11-01
WO2005050724A1 (ja) 2005-06-02
AT501653B1 (de) 2010-04-15
KR20060034640A (ko) 2006-04-24
JP4040063B2 (ja) 2008-01-30
AT501653A2 (de) 2006-10-15
CN100423205C (zh) 2008-10-01
US8113221B2 (en) 2012-02-14
US7927429B2 (en) 2011-04-19
US20070131256A1 (en) 2007-06-14
JPWO2005050724A1 (ja) 2007-06-14
US20110155193A1 (en) 2011-06-30

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