AT513202A3 - Chip-Auswerfer und Verfahren zur Chipentfernung - Google Patents

Chip-Auswerfer und Verfahren zur Chipentfernung

Info

Publication number
AT513202A3
AT513202A3 ATA50414/2012A AT504142012A AT513202A3 AT 513202 A3 AT513202 A3 AT 513202A3 AT 504142012 A AT504142012 A AT 504142012A AT 513202 A3 AT513202 A3 AT 513202A3
Authority
AT
Austria
Prior art keywords
chip
ejector
removal
fixing unit
chip removal
Prior art date
Application number
ATA50414/2012A
Other languages
English (en)
Other versions
AT513202A2 (de
Original Assignee
Samsung Electro Mech
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Samsung Electro Mech filed Critical Samsung Electro Mech
Publication of AT513202A2 publication Critical patent/AT513202A2/de
Publication of AT513202A3 publication Critical patent/AT513202A3/de

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0442—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7412—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
    • H10P72/7414—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support the auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H10P72/742—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding involving stretching of the auxiliary support post dicing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/744—Details of chemical or physical process used for separating the auxiliary support from a device or a wafer
    • H10P72/7442—Separation by peeling
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Dicing (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Supply And Installment Of Electrical Components (AREA)

Abstract

Chip-Auswerfer (100; 200) mit einer Fixiereinheit (130) und mit wenigstens einer oder vorzugsweise mehreren Fördereinheiten (140; 141; 143; 145), die sich außerhalb der Fixiereinheit (130) befinden, und diemit einem Band (120), dasmit einer Seite an oberen Abschnitten der Fördereinheiten (141; 143; 145) befestigt ist, und auf dessen anderer Seite ein Chip (110) befestigt ist, nach unten fallend bewegt werden, um den Chip (110) vom Band (120) zu trennen.
ATA50414/2012A 2012-07-25 2012-09-28 Chip-Auswerfer und Verfahren zur Chipentfernung AT513202A3 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020120081465A KR101397750B1 (ko) 2012-07-25 2012-07-25 칩 이젝터 및 이를 이용한 칩 탈착 방법

Publications (2)

Publication Number Publication Date
AT513202A2 AT513202A2 (de) 2014-02-15
AT513202A3 true AT513202A3 (de) 2017-03-15

Family

ID=49993720

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50414/2012A AT513202A3 (de) 2012-07-25 2012-09-28 Chip-Auswerfer und Verfahren zur Chipentfernung

Country Status (4)

Country Link
US (1) US20140027049A1 (de)
JP (1) JP5464532B2 (de)
KR (1) KR101397750B1 (de)
AT (1) AT513202A3 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20140107982A (ko) * 2013-02-28 2014-09-05 삼성전자주식회사 다이 이젝터 및 다이 분리 방법
CN104505357B (zh) * 2015-01-15 2017-05-17 成都先进功率半导体股份有限公司 一种不良半导体芯片去除装置
KR101791787B1 (ko) * 2016-05-27 2017-10-30 세메스 주식회사 이젝터 핀 조립체 및 이를 포함하는 다이 이젝팅 장치
JP6637397B2 (ja) * 2016-09-12 2020-01-29 ファスフォードテクノロジ株式会社 半導体製造装置および半導体装置の製造方法
KR102032025B1 (ko) * 2017-09-22 2019-10-14 주식회사 야스 효과적인 기판 탈부착 구조의 점착 척과 탈착 장치
TWI641070B (zh) * 2018-01-09 2018-11-11 Powertech Technology Inc. 晶片頂針裝置
JP7217605B2 (ja) * 2018-09-21 2023-02-03 ファスフォードテクノロジ株式会社 半導体製造装置、突上げ治具および半導体装置の製造方法
US11062923B2 (en) * 2018-09-28 2021-07-13 Rohinni, LLC Apparatus to control transfer parameters during transfer of semiconductor devices
KR102617347B1 (ko) * 2018-10-04 2023-12-26 삼성전자주식회사 다이 이젝터 및 상기 다이 이젝터를 포함하는 다이 공급 장치
DE102018127123A1 (de) 2018-10-30 2020-04-30 Osram Opto Semiconductors Gmbh Transferwerkzeug und Verfahren zum Transferieren von Halbleiterchips
KR102105948B1 (ko) * 2019-01-21 2020-04-29 제너셈(주) 패키지 픽커 모듈 및 패키지 이송 장치
KR102700207B1 (ko) 2019-03-12 2024-08-28 삼성전자주식회사 칩 이젝팅 장치
WO2021100185A1 (ja) * 2019-11-21 2021-05-27 ボンドテック株式会社 部品実装システム、部品供給装置および部品実装方法
CN113594079B (zh) * 2020-04-30 2024-01-16 先进科技新加坡有限公司 用于将电子元件从粘性载体分离的顶出器单元
KR102635493B1 (ko) * 2020-11-04 2024-02-07 세메스 주식회사 본딩 설비에서 다이를 이송하기 위한 장치 및 방법
US11764098B2 (en) 2021-04-16 2023-09-19 Asmpt Singapore Pte. Ltd. Detaching a die from an adhesive tape by air ejection
JP7542505B2 (ja) 2021-09-22 2024-08-30 株式会社東芝 半導体製造装置及びその使用方法
JP7645768B2 (ja) * 2021-10-26 2025-03-14 三菱電機株式会社 半導体製造装置および半導体装置の製造方法
US12557583B2 (en) 2022-05-11 2026-02-17 Samsung Electronics Co., Ltd. Chip peeling apparatus and chip peeling method
JP7787014B2 (ja) * 2022-05-11 2025-12-16 三星電子株式会社 チップ剥離装置及びチップ剥離方法
JP7805272B2 (ja) * 2022-10-13 2026-01-23 三菱電機株式会社 ピックアップステージ

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138277A (ja) * 1998-11-02 2000-05-16 Anam Semiconductor Inc 半導体チップユニットのウェ―ハからのピックアップ方法及びピックアップシステム
US20030075271A1 (en) * 2001-10-23 2003-04-24 Fujitsu Limited Method and device of peeling semiconductor device using annular contact members
US20050062301A1 (en) * 2002-11-11 2005-03-24 Cheol-Joon Yoo Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
KR20090085262A (ko) * 2008-02-04 2009-08-07 에스티에스반도체통신 주식회사 역피라미드 방식의 반도체 칩 접착 장비 및 그 작동방법
EP2184765A1 (de) * 2008-11-05 2010-05-12 Esec AG Chip-Auswerfer
WO2010054957A1 (de) * 2008-11-12 2010-05-20 Esec Ag Verfahren zum ablösen und entnehmen eines halbleiterchips von einer folie
JP2010212509A (ja) * 2009-03-11 2010-09-24 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
US20100252205A1 (en) * 2009-04-02 2010-10-07 Man Wai Chan Device for thin die detachment and pick-up

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000353710A (ja) * 1999-06-14 2000-12-19 Toshiba Corp ペレットピックアップ装置および半導体装置の製造方法
JP5214421B2 (ja) * 2008-12-04 2013-06-19 キヤノンマシナリー株式会社 剥離装置及び剥離方法

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000138277A (ja) * 1998-11-02 2000-05-16 Anam Semiconductor Inc 半導体チップユニットのウェ―ハからのピックアップ方法及びピックアップシステム
US20030075271A1 (en) * 2001-10-23 2003-04-24 Fujitsu Limited Method and device of peeling semiconductor device using annular contact members
US20050062301A1 (en) * 2002-11-11 2005-03-24 Cheol-Joon Yoo Method and apparatus for picking up a semiconductor chip, method and apparatus for removing a semiconductor chip from a dicing tape, and a method of forming a perforated dicing tape
KR20090085262A (ko) * 2008-02-04 2009-08-07 에스티에스반도체통신 주식회사 역피라미드 방식의 반도체 칩 접착 장비 및 그 작동방법
EP2184765A1 (de) * 2008-11-05 2010-05-12 Esec AG Chip-Auswerfer
WO2010054957A1 (de) * 2008-11-12 2010-05-20 Esec Ag Verfahren zum ablösen und entnehmen eines halbleiterchips von einer folie
JP2010212509A (ja) * 2009-03-11 2010-09-24 Shibaura Mechatronics Corp 半導体チップのピックアップ装置及びピックアップ方法
US20100252205A1 (en) * 2009-04-02 2010-10-07 Man Wai Chan Device for thin die detachment and pick-up

Also Published As

Publication number Publication date
JP2014027246A (ja) 2014-02-06
AT513202A2 (de) 2014-02-15
US20140027049A1 (en) 2014-01-30
JP5464532B2 (ja) 2014-04-09
KR101397750B1 (ko) 2014-05-21
KR20140015851A (ko) 2014-02-07

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Legal Events

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REJ Rejection

Effective date: 20170815