AT517796A3 - Spannfutter, insbesondere zur Verwendung in einem Maskenausrichtgerät - Google Patents
Spannfutter, insbesondere zur Verwendung in einem MaskenausrichtgerätInfo
- Publication number
- AT517796A3 AT517796A3 ATA9453/2013A AT94532013A AT517796A3 AT 517796 A3 AT517796 A3 AT 517796A3 AT 94532013 A AT94532013 A AT 94532013A AT 517796 A3 AT517796 A3 AT 517796A3
- Authority
- AT
- Austria
- Prior art keywords
- chuck
- planar substrate
- plate
- upper plate
- distance
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/50—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for positioning, orientation or alignment
- H10P72/57—Mask-wafer alignment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7023—Aligning or positioning in direction perpendicular to substrate surface
- G03F9/703—Gap setting, e.g. in proximity printer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
- H10P72/722—Details of electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
Das Spannfutter zum Ausrichten eines ersten ebenen Substrats, z.B. einer Scheibe, parallel zu einem zweiten ebenen Substrat, z.B. einer Maske, weist auf: eine obere Platte, die eine Oberseite zur Anordnung des ersten ebenen Substrats aufweist, eine untere Platte, mindestens einen Abstandsmesssensor, der konfiguriert ist, einen Abstand zwischen der Oberseite der oberen Platte und einer Oberfläche des zweiten ebenen Substrats zu messen, und mindestens drei lineare Stellglieder in Kontakt mit der oberen Platte und der unteren Platte. Das Verfahren zum Einstellen eines Spalts zwischen einem ersten ebenen Substrat, z.B. einer Scheibe, auf einer oberen Platte eines Spannfutters, und einem zweiten ebenen Substrat, z.B. einer Maske, insbesondere mittels des Spannfutters weist die Schritte auf: Messen der Dicke des ersten ebenen Substrats an mindestens einem Punkt; Messen des Abstands zwischen einer Oberfläche des zweiten ebenen Substrats und der Oberseite der oberen Platte durch mindestens einen Abstandsmesssensor des Spannfutters; und Justieren der Schrägstellung zwischen einer Oberseite des ersten ebenen Substrats oder des Spannfutters und der Oberfläche des zweiten ebenen Substrats mittels mindestens dreierlinearer Stellglieder des Spannfutters, vorzugsweise in Kombination mit mindestens drei gefederte Lagern des Spannfutters.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| EP13150260.1A EP2752870A1 (de) | 2013-01-04 | 2013-01-04 | Aufnahmevorrichtung, insbesondere zur Verwendung in einer Vorrichtung zum Ausrichten von Masken |
| PCT/EP2013/075513 WO2014106557A1 (en) | 2013-01-04 | 2013-12-04 | Chuck, in particular for use in a mask aligner |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| AT517796A2 AT517796A2 (de) | 2017-04-15 |
| AT517796A3 true AT517796A3 (de) | 2017-11-15 |
| AT517796B1 AT517796B1 (de) | 2022-07-15 |
Family
ID=47631258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ATA9453/2013A AT517796B1 (de) | 2013-01-04 | 2013-12-04 | Chuck, insbesondere zur Verwendung in einem Maskenausrichtgerät |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US9824909B2 (de) |
| EP (1) | EP2752870A1 (de) |
| JP (1) | JP6285957B2 (de) |
| KR (1) | KR102169866B1 (de) |
| CN (1) | CN104885209B (de) |
| AT (1) | AT517796B1 (de) |
| DE (1) | DE112013003869B4 (de) |
| SG (1) | SG11201503066YA (de) |
| TW (1) | TWI604506B (de) |
| WO (1) | WO2014106557A1 (de) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11270902B2 (en) * | 2017-03-09 | 2022-03-08 | Ev Group E. Thallner Gmbh | Electrostatic substrate holder |
| WO2019192681A1 (en) * | 2018-04-03 | 2019-10-10 | Applied Materials, Inc. | Apparatus, system and method for aligning a substrate |
| TWI699608B (zh) * | 2019-03-15 | 2020-07-21 | 日月光半導體製造股份有限公司 | 用於組裝光學裝置之設備 |
| KR102328561B1 (ko) * | 2020-04-10 | 2021-11-22 | (주)드림솔 | 웨이퍼 정 위치 측정 장치 및 이를 이용한 웨이퍼 이송 로봇 암 교정 방법 |
| KR102396431B1 (ko) * | 2020-08-14 | 2022-05-10 | 피에스케이 주식회사 | 기판 처리 장치 및 기판 반송 방법 |
| TWI789706B (zh) * | 2021-02-19 | 2023-01-11 | 台灣積體電路製造股份有限公司 | 後電填充模組及用於後電填充模組的校準方法 |
| DE102021127226B3 (de) | 2021-10-20 | 2022-12-22 | Jenaer Antriebstechnik Gmbh | Vorrichtung mit einem beweglichen Tischsystem sowie Verfahren zu dessen Kalibrierung und Betrieb |
| CN114859666B (zh) * | 2022-02-25 | 2024-06-14 | 魅杰光电科技(上海)有限公司 | 全场式曝光设备以及全场式曝光方法 |
| CN114815521B (zh) * | 2022-05-07 | 2022-11-04 | 魅杰光电科技(上海)有限公司 | 一种楔形误差补偿装置及其相应的补偿楔形误差的方法 |
| CN116880137A (zh) * | 2023-07-31 | 2023-10-13 | 苏州天准科技股份有限公司 | 一种掩膜支撑装置和非接触式曝光设备 |
| WO2025201791A2 (en) * | 2024-03-28 | 2025-10-02 | Asml Netherlands B.V. | Deformation measurement of a clamped object with an integrated optics near-field sensor |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0722122A1 (de) * | 1995-01-10 | 1996-07-17 | Ushiodenki Kabushiki Kaisha | Verfahren und Vorrichtung zur Einstellung des Abstandes zwischen eine Werkstuck und einer Maske |
| JPH11194501A (ja) * | 1997-12-26 | 1999-07-21 | Dainippon Printing Co Ltd | プロキシミティー露光装置、およびプロキシミティー露光装置におけるギャップ調整方法 |
| KR20000021291A (ko) * | 1998-09-28 | 2000-04-25 | 윤종용 | 웨이퍼 로딩 핀 |
| US20020063221A1 (en) * | 2000-11-28 | 2002-05-30 | Sumitomo Heavy Industries, Ltd. | Gap adjustment apparatus and gap adjustment method for adjusting gap between two objects |
| JP2004233398A (ja) * | 2003-01-28 | 2004-08-19 | Dainippon Printing Co Ltd | 露光方法及び露光装置 |
| WO2011098604A2 (de) * | 2010-02-15 | 2011-08-18 | Suss Microtec Lithography Gmbh | Verfahren und vorrichtung zum aktiven keilfehlerausgleich zwischen zwei im wesentlichen zueinander parallel positionierbaren gegenständen |
Family Cites Families (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2035610B (en) * | 1978-10-20 | 1983-03-23 | Hitachi Ltd | Wafer projection aligner |
| JPS56164551U (de) * | 1980-05-08 | 1981-12-07 | ||
| JPS58103136A (ja) * | 1981-12-16 | 1983-06-20 | Nippon Kogaku Kk <Nikon> | 基板の傾き設定装置 |
| JPS62254426A (ja) | 1986-04-28 | 1987-11-06 | Hitachi Ltd | 平行出し装置 |
| JPH0628222B2 (ja) * | 1986-05-28 | 1994-04-13 | 株式会社日立製作所 | プロキシミテイ方式の露光装置 |
| JP2799575B2 (ja) * | 1988-09-30 | 1998-09-17 | キヤノン株式会社 | 露光方法 |
| JP2720202B2 (ja) * | 1989-07-05 | 1998-03-04 | 日立電子エンジニアリング株式会社 | 基板露光装置におけるギャップ制御方法 |
| JP3197010B2 (ja) * | 1990-03-05 | 2001-08-13 | 株式会社東芝 | 間隔設定方法及び間隔設定装置 |
| JP2860857B2 (ja) * | 1993-04-01 | 1999-02-24 | 日立電子エンジニアリング株式会社 | 基板露光装置 |
| JP4025049B2 (ja) | 2001-10-10 | 2007-12-19 | 住友重機械工業株式会社 | ギャップ調節装置 |
| JP2004022655A (ja) * | 2002-06-13 | 2004-01-22 | Canon Inc | 半導体露光装置及びその制御方法、並びに半導体デバイスの製造方法 |
| JP2005310989A (ja) * | 2004-04-20 | 2005-11-04 | Hitachi High-Tech Electronics Engineering Co Ltd | 基板及びフォトマスクの受け渡し方法、並びに基板及びフォトマスクの受け渡し装置 |
| US7466420B2 (en) * | 2006-02-16 | 2008-12-16 | Searete Llc | Plasmon tomography |
| JP2007281079A (ja) * | 2006-04-04 | 2007-10-25 | Canon Inc | 光学要素駆動装置及び基板露光装置 |
| JPWO2007116752A1 (ja) * | 2006-04-05 | 2009-08-20 | 株式会社ニコン | ステージ装置、露光装置、ステージ制御方法、露光方法、およびデバイス製造方法 |
| US7800735B2 (en) * | 2006-04-21 | 2010-09-21 | Kla-Tencor Technologies Corporation | Z-stage with dynamically driven stage mirror and chuck assembly |
| KR20080058568A (ko) * | 2006-12-22 | 2008-06-26 | 세메스 주식회사 | 리프트 핀 및 이를 갖는 기판 처리 장치 |
| JP5150949B2 (ja) * | 2007-06-18 | 2013-02-27 | Nskテクノロジー株式会社 | 近接スキャン露光装置及びその制御方法 |
| IL183692A0 (en) * | 2007-06-05 | 2007-09-20 | Nova Measuring Instr Ltd | Apparatus and method for substrates handling |
| TWI478271B (zh) * | 2007-08-10 | 2015-03-21 | 尼康股份有限公司 | Substrate bonding device and substrate bonding method |
| US8139219B2 (en) * | 2008-04-02 | 2012-03-20 | Suss Microtec Lithography, Gmbh | Apparatus and method for semiconductor wafer alignment |
-
2013
- 2013-01-04 EP EP13150260.1A patent/EP2752870A1/de not_active Withdrawn
- 2013-12-04 WO PCT/EP2013/075513 patent/WO2014106557A1/en not_active Ceased
- 2013-12-04 AT ATA9453/2013A patent/AT517796B1/de active
- 2013-12-04 JP JP2015551147A patent/JP6285957B2/ja active Active
- 2013-12-04 US US14/427,893 patent/US9824909B2/en active Active
- 2013-12-04 SG SG11201503066YA patent/SG11201503066YA/en unknown
- 2013-12-04 DE DE112013003869.2T patent/DE112013003869B4/de active Active
- 2013-12-04 KR KR1020157009306A patent/KR102169866B1/ko active Active
- 2013-12-04 CN CN201380067778.8A patent/CN104885209B/zh active Active
- 2013-12-17 TW TW102146663A patent/TWI604506B/zh active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0722122A1 (de) * | 1995-01-10 | 1996-07-17 | Ushiodenki Kabushiki Kaisha | Verfahren und Vorrichtung zur Einstellung des Abstandes zwischen eine Werkstuck und einer Maske |
| JPH11194501A (ja) * | 1997-12-26 | 1999-07-21 | Dainippon Printing Co Ltd | プロキシミティー露光装置、およびプロキシミティー露光装置におけるギャップ調整方法 |
| KR20000021291A (ko) * | 1998-09-28 | 2000-04-25 | 윤종용 | 웨이퍼 로딩 핀 |
| US20020063221A1 (en) * | 2000-11-28 | 2002-05-30 | Sumitomo Heavy Industries, Ltd. | Gap adjustment apparatus and gap adjustment method for adjusting gap between two objects |
| JP2004233398A (ja) * | 2003-01-28 | 2004-08-19 | Dainippon Printing Co Ltd | 露光方法及び露光装置 |
| WO2011098604A2 (de) * | 2010-02-15 | 2011-08-18 | Suss Microtec Lithography Gmbh | Verfahren und vorrichtung zum aktiven keilfehlerausgleich zwischen zwei im wesentlichen zueinander parallel positionierbaren gegenständen |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6285957B2 (ja) | 2018-02-28 |
| TW201434073A (zh) | 2014-09-01 |
| KR102169866B1 (ko) | 2020-10-27 |
| JP2016503965A (ja) | 2016-02-08 |
| SG11201503066YA (en) | 2015-05-28 |
| EP2752870A1 (de) | 2014-07-09 |
| KR20150102935A (ko) | 2015-09-09 |
| CN104885209B (zh) | 2018-06-26 |
| DE112013003869T5 (de) | 2015-06-03 |
| US9824909B2 (en) | 2017-11-21 |
| TWI604506B (zh) | 2017-11-01 |
| WO2014106557A1 (en) | 2014-07-10 |
| AT517796A2 (de) | 2017-04-15 |
| US20150294890A1 (en) | 2015-10-15 |
| CN104885209A (zh) | 2015-09-02 |
| AT517796B1 (de) | 2022-07-15 |
| DE112013003869B4 (de) | 2021-04-01 |
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