AT519587A3 - Saugvorrichtung für einen Endeffektor, Endeffektor zum Halten von Substraten sowie Verfahren zur Herstellung eines Endeffektors - Google Patents

Saugvorrichtung für einen Endeffektor, Endeffektor zum Halten von Substraten sowie Verfahren zur Herstellung eines Endeffektors Download PDF

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Publication number
AT519587A3
AT519587A3 ATA50059/2018A AT500592018A AT519587A3 AT 519587 A3 AT519587 A3 AT 519587A3 AT 500592018 A AT500592018 A AT 500592018A AT 519587 A3 AT519587 A3 AT 519587A3
Authority
AT
Austria
Prior art keywords
end effector
producing
suction device
channel
holding substrates
Prior art date
Application number
ATA50059/2018A
Other languages
English (en)
Other versions
AT519587B1 (de
AT519587A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT519587A2 publication Critical patent/AT519587A2/de
Publication of AT519587A3 publication Critical patent/AT519587A3/de
Application granted granted Critical
Publication of AT519587B1 publication Critical patent/AT519587B1/de

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3206—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrate being handled substantially vertically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • B25J15/0683—Details of suction cup structure, e.g. grooves or ridges
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J19/00—Accessories fitted to manipulators, e.g. for monitoring, for viewing; Safety devices combined with or specially adapted for use in connection with manipulators
    • B25J19/007—Means or methods for designing or fabricating manipulators
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3212—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips or lead frames
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7602—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a robot blade or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S901/00—Robots
    • Y10S901/30—End effector
    • Y10S901/40—Vacuum or mangetic

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

Eine Saugvorrichtung (14) für einen Endeffektor (10) zum Halten von Substraten hat einen Grundkörper (28), der einen Durchgangskanal (36) und eine Kontaktfläche (38) aufweist, und eine Dichtlippe (30). Die Kontaktfläche weist einen Rand (39) und wenigstens eine Vertiefung (40) auf, wobei der Durchgangskanal (36) in die wenigstens eine Vertiefung (40) mündet und wobei die wenigstens eine Vertiefung (40) vor dem Rand (39) der Kontaktfläche (38) endet. Der Grundkörper (28) hat einen Basisabschnitt (32) und einen Befestigungsabschnitt (34), der an den Basisabschnitt (32) angrenzt. Im Befestigungsabschnitt (34) ist wenigstens ein Verbindungskanal (44) vorgesehen, der mit dem Durchgangskanal (36) fluidisch verbunden ist und der sich vom Rand des Befestigungsabschnittes (34) aus erstreckt. Ferner sind ein Endeffektor (10) und ein Verfahren zur Herstellung eines Endeffektors (10) gezeigt
ATA50059/2018A 2017-01-27 2018-01-24 Saugvorrichtung für einen Endeffektor, Endeffektor zum Halten von Substraten sowie Verfahren zur Herstellung eines Endeffektors AT519587B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2018243A NL2018243B1 (en) 2017-01-27 2017-01-27 Suction apparatus for an end effector, end effector for holding substrates and method of producing an end effector

Publications (3)

Publication Number Publication Date
AT519587A2 AT519587A2 (de) 2018-08-15
AT519587A3 true AT519587A3 (de) 2020-02-15
AT519587B1 AT519587B1 (de) 2021-10-15

Family

ID=62843388

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50059/2018A AT519587B1 (de) 2017-01-27 2018-01-24 Saugvorrichtung für einen Endeffektor, Endeffektor zum Halten von Substraten sowie Verfahren zur Herstellung eines Endeffektors

Country Status (9)

Country Link
US (1) US10259124B2 (de)
JP (1) JP2018157194A (de)
KR (1) KR102344555B1 (de)
CN (1) CN108364903A (de)
AT (1) AT519587B1 (de)
DE (1) DE102018100856A1 (de)
NL (1) NL2018243B1 (de)
SG (1) SG10201800716YA (de)
TW (1) TWI710438B (de)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3657537A1 (de) * 2018-11-23 2020-05-27 ATOTECH Deutschland GmbH Endeffektor für plattenförmige substrate
WO2021016389A1 (en) * 2019-07-22 2021-01-28 Rorze Automation, Inc. Systems and methods for horizontal wafer packaging
PL3772089T3 (pl) * 2019-07-30 2021-10-25 Semsysco Gmbh Urządzenie do manipulowania podłożem do płytek półprzewodnikowych
US20230321758A1 (en) 2022-03-25 2023-10-12 Ii-Vi Delaware, Inc. Laser-roughened reaction-bonded silicon carbide for wafer contact surface
EP4273911A1 (de) * 2022-05-03 2023-11-08 Werner Lieb GmbH Haltevorrichtung und verfahren zum halten und/oder transportieren von werkstücken und/oder bauteilen, optional mit werkzeugfrei auswechselbaren saugerelementen
US12348002B2 (en) 2022-05-31 2025-07-01 Ii-Vi Delaware, Inc. Current load-controlled laser driver
US12337467B2 (en) * 2022-12-09 2025-06-24 Formfactor, Inc. Wafer-handling end effectors configured to selectively lift a wafer from an upper surface of the wafer, probe systems that include the wafer-handling end effectors, and methods of utilizing the wafer-handling end effectors
US20250073924A1 (en) * 2023-03-13 2025-03-06 Shanghai Flexiv Robotics Technology Co., Ltd. Adhesion device and robot

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
US20150255322A1 (en) * 2014-03-06 2015-09-10 Cascade Microtech, Inc. Wafer-handling end effectors

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05267433A (ja) * 1992-03-19 1993-10-15 Nec Kyushu Ltd 吸着パッド
JPH07273499A (ja) * 1994-03-30 1995-10-20 Matsushita Electric Ind Co Ltd パネル保持装置
JP3200285B2 (ja) * 1994-06-29 2001-08-20 キヤノン株式会社 基板搬送装置
JP2002184835A (ja) 2000-12-13 2002-06-28 Ando Electric Co Ltd 吸着パッド
US6942265B1 (en) * 2002-10-23 2005-09-13 Kla-Tencor Technologies Corporation Apparatus comprising a flexible vacuum seal pad structure capable of retaining non-planar substrates thereto
US20050110292A1 (en) * 2002-11-26 2005-05-26 Axcelis Technologies, Inc. Ceramic end effector for micro circuit manufacturing
US7641247B2 (en) * 2002-12-17 2010-01-05 Applied Materials, Inc. End effector assembly for supporting a substrate
KR101019469B1 (ko) 2003-01-29 2011-03-07 미쓰보시 다이야몬도 고교 가부시키가이샤 진공흡착 헤드
US7055875B2 (en) * 2003-07-11 2006-06-06 Asyst Technologies, Inc. Ultra low contact area end effector
CN102369088B (zh) * 2009-03-31 2015-03-25 Ats自动化加工系统公司 由弹簧稳定的真空抓持器组件
US8801069B2 (en) * 2010-02-26 2014-08-12 Brooks Automation, Inc. Robot edge contact gripper
JP5345167B2 (ja) * 2011-03-18 2013-11-20 東京エレクトロン株式会社 基板保持装置
JP2014176914A (ja) 2013-03-14 2014-09-25 Nippon Electric Glass Co Ltd 吸着パッド及び吸着装置
JP5861677B2 (ja) * 2013-07-08 2016-02-16 株式会社安川電機 吸着構造、ロボットハンドおよびロボット
NL2014625B1 (en) * 2015-04-13 2017-01-06 Suss Microtec Lithography Gmbh Wafer treating device and sealing ring for a wafer treating device.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4131267A (en) * 1978-06-02 1978-12-26 Disco Kabushiki Kaisha Apparatus for holding workpiece by suction
US5226636A (en) * 1992-06-10 1993-07-13 International Business Machines Corporation Holding fixture for substrates
US20150255322A1 (en) * 2014-03-06 2015-09-10 Cascade Microtech, Inc. Wafer-handling end effectors

Also Published As

Publication number Publication date
JP2018157194A (ja) 2018-10-04
TW201831290A (zh) 2018-09-01
DE102018100856A1 (de) 2018-08-02
KR102344555B1 (ko) 2021-12-28
SG10201800716YA (en) 2018-08-30
US10259124B2 (en) 2019-04-16
KR20180088598A (ko) 2018-08-06
TWI710438B (zh) 2020-11-21
US20180215049A1 (en) 2018-08-02
AT519587B1 (de) 2021-10-15
CN108364903A (zh) 2018-08-03
NL2018243B1 (en) 2018-08-07
AT519587A2 (de) 2018-08-15

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