AT521734A3 - Randentlackungssystem und Verfahren zur Behandlung eines Substrats - Google Patents

Randentlackungssystem und Verfahren zur Behandlung eines Substrats Download PDF

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Publication number
AT521734A3
AT521734A3 ATA50814/2019A AT508142019A AT521734A3 AT 521734 A3 AT521734 A3 AT 521734A3 AT 508142019 A AT508142019 A AT 508142019A AT 521734 A3 AT521734 A3 AT 521734A3
Authority
AT
Austria
Prior art keywords
substrate
treating
arms
stripping system
edge stripping
Prior art date
Application number
ATA50814/2019A
Other languages
English (en)
Other versions
AT521734B1 (de
AT521734A2 (de
Original Assignee
Suss Microtec Lithography Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Suss Microtec Lithography Gmbh filed Critical Suss Microtec Lithography Gmbh
Publication of AT521734A2 publication Critical patent/AT521734A2/de
Publication of AT521734A3 publication Critical patent/AT521734A3/de
Application granted granted Critical
Publication of AT521734B1 publication Critical patent/AT521734B1/de

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/60—Cleaning only by mechanical processes
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/168—Finishing the coated layer, e.g. drying, baking, soaking
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/42—Stripping or agents therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0418—Apparatus for fluid treatment for etching
    • H10P72/0422—Apparatus for fluid treatment for etching for wet etching
    • H10P72/0424—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Coating Apparatus (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)

Abstract

Beschrieben ist ein Randwulstbeseitigungssystem (10) zur Behandlung eines Substrats (12), das einen Randwulstbeseitigungskopf (20) mit einem Hauptkörper (22) und zwei von dem Hauptkörper (22) hervorstehende Arme (24) umfasst. Die Arme (24) sind voneinander beabstandet und definieren dazwischen einen Aufnahmeraum (26) für die Unterbringung eines zu behandelnden Substrats (12). Die vorstehenden Arme (24) weisen jeweils eine Funktionsfläche (36) auf, die zueinander gewandt sind, und wobei die Funktionsflächen (36) jeweils mindestens einen Fluidauslass (38) aufweisen. Darüber hinaus ist ein Verfahren zur Behandlung eines Substrats (12) beschrieben.
ATA50814/2019A 2018-09-25 2019-09-24 Randentlackungssystem und Verfahren zur Behandlung eines Substrats AT521734B1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
NL2021701A NL2021701B1 (en) 2018-09-25 2018-09-25 Edge bead removal system and method of treating a substrate

Publications (3)

Publication Number Publication Date
AT521734A2 AT521734A2 (de) 2020-04-15
AT521734A3 true AT521734A3 (de) 2021-11-15
AT521734B1 AT521734B1 (de) 2022-06-15

Family

ID=64427162

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50814/2019A AT521734B1 (de) 2018-09-25 2019-09-24 Randentlackungssystem und Verfahren zur Behandlung eines Substrats

Country Status (8)

Country Link
US (1) US20200096867A1 (de)
JP (1) JP2020092252A (de)
KR (1) KR20200035364A (de)
CN (1) CN110941152A (de)
AT (1) AT521734B1 (de)
DE (1) DE102019125661A1 (de)
NL (1) NL2021701B1 (de)
TW (1) TWI824015B (de)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6967637B1 (ja) * 2020-07-30 2021-11-17 中外炉工業株式会社 縁部平坦化デバイスおよび該デバイスを含む塗工乾燥システム
WO2022031268A1 (en) * 2020-08-04 2022-02-10 Applied Materials, Inc. Apparatus for removing photoresist off of photomask
US12138732B2 (en) * 2020-12-14 2024-11-12 Applied Materials, Inc. Polishing system apparatus and methods for defect reduction at a substrate edge
US20220269177A1 (en) * 2021-02-23 2022-08-25 Tokyo Electron Limited Sensor technology integration into coating track
US12596305B2 (en) 2022-07-21 2026-04-07 Changxin Memory Technologies, Inc. Method, apparatus and system for processing semiconductor structure
CN117497435A (zh) * 2022-07-21 2024-02-02 长鑫存储技术有限公司 半导体结构的处理方法、处理装置及处理系统
DE102023126128A1 (de) * 2023-09-26 2025-03-27 Osiris International GmbH Entschichtungsvorrichtung und Verfahren zum Entschichten von unebenen Substraten

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6062288A (en) * 1997-04-28 2000-05-16 Tokyo Electron Limited Processing apparatus
WO2002049085A1 (en) * 2000-12-15 2002-06-20 K.C.Tech Co., Ltd. Apparatus for cleaning the edges of wafers
US20080081110A1 (en) * 2006-09-30 2008-04-03 Tokyo Electron Limited Apparatus and method for removing an edge bead of a spin-coated layer
US20090211604A1 (en) * 2008-02-22 2009-08-27 Tokyo Electron Limited System and Method For Removing Edge-Bead Material

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1131654A (ja) * 1997-07-14 1999-02-02 Dainippon Screen Mfg Co Ltd 基板の端縁処理装置
JPH11260702A (ja) * 1998-03-13 1999-09-24 Advanced Display Inc 基板端辺洗浄装置及びこれを用いた液晶表示装置の製造方法
US6453916B1 (en) * 2000-06-09 2002-09-24 Advanced Micro Devices, Inc. Low angle solvent dispense nozzle design for front-side edge bead removal in photolithography resist process
JP4043382B2 (ja) * 2003-02-28 2008-02-06 東京エレクトロン株式会社 塗布膜除去方法及びその装置
JP4734063B2 (ja) * 2005-08-30 2011-07-27 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法。
JP2008060302A (ja) * 2006-08-31 2008-03-13 Sokudo:Kk 基板処理装置
MY160582A (en) * 2009-09-22 2017-03-15 First Solar Inc System and method for tracking and removing coating from an edge of a substrate

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6062288A (en) * 1997-04-28 2000-05-16 Tokyo Electron Limited Processing apparatus
WO2002049085A1 (en) * 2000-12-15 2002-06-20 K.C.Tech Co., Ltd. Apparatus for cleaning the edges of wafers
US20080081110A1 (en) * 2006-09-30 2008-04-03 Tokyo Electron Limited Apparatus and method for removing an edge bead of a spin-coated layer
US20090211604A1 (en) * 2008-02-22 2009-08-27 Tokyo Electron Limited System and Method For Removing Edge-Bead Material

Also Published As

Publication number Publication date
TW202030775A (zh) 2020-08-16
US20200096867A1 (en) 2020-03-26
DE102019125661A1 (de) 2020-03-26
AT521734B1 (de) 2022-06-15
AT521734A2 (de) 2020-04-15
JP2020092252A (ja) 2020-06-11
KR20200035364A (ko) 2020-04-03
CN110941152A (zh) 2020-03-31
NL2021701B1 (en) 2020-05-07
TWI824015B (zh) 2023-12-01

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