AT519922A1 - SERS-Substrat - Google Patents
SERS-Substrat Download PDFInfo
- Publication number
- AT519922A1 AT519922A1 ATA195/2017A AT1952017A AT519922A1 AT 519922 A1 AT519922 A1 AT 519922A1 AT 1952017 A AT1952017 A AT 1952017A AT 519922 A1 AT519922 A1 AT 519922A1
- Authority
- AT
- Austria
- Prior art keywords
- nanowires
- gold
- silicon
- length
- silicon nanowires
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/65—Raman scattering
- G01N21/658—Raman scattering enhancement Raman, e.g. surface plasmons
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0402—Apparatus for fluid treatment
- H10P72/0418—Apparatus for fluid treatment for etching
- H10P72/0422—Apparatus for fluid treatment for etching for wet etching
- H10P72/0426—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/054—Nanosized particles
- B22F1/0547—Nanofibres or nanotubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/18—Non-metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C5/00—Alloys based on noble metals
- C22C5/02—Alloys based on gold
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/18—Metallic material, boron or silicon on other inorganic substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2998/00—Supplementary information concerning processes or compositions relating to powder metallurgy
- B22F2998/10—Processes characterised by the sequence of their steps
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F2999/00—Aspects linked to processes or compositions used in powder metallurgy
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y15/00—Nanotechnology for interacting, sensing or actuating, e.g. quantum dots as markers in protein assays or molecular motors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y40/00—Manufacture or treatment of nanostructures
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/42—Coating with noble metals
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/17—Systems in which incident light is modified in accordance with the properties of the material investigated
- G01N21/55—Specular reflectivity
- G01N21/552—Attenuated total reflection
- G01N21/553—Attenuated total reflection and using surface plasmons
- G01N21/554—Attenuated total reflection and using surface plasmons detecting the surface plasmon resonance of nanostructured metals, e.g. localised surface plasmon resonance
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
- G01N21/645—Specially adapted constructive features of fluorimeters
- G01N21/648—Specially adapted constructive features of fluorimeters using evanescent coupling or surface plasmon coupling for the excitation of fluorescence
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2201/00—Electrodes common to discharge tubes
- H01J2201/30—Cold cathodes
- H01J2201/304—Field emission cathodes
- H01J2201/30403—Field emission cathodes characterised by the emitter shape
- H01J2201/3043—Fibres
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/60—Wet etching
- H10P50/64—Wet etching of semiconductor materials
- H10P50/642—Chemical etching
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Nanotechnology (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
- Life Sciences & Earth Sciences (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Materials Engineering (AREA)
- Pathology (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Physical Vapour Deposition (AREA)
- Powder Metallurgy (AREA)
Abstract
Description
| Konzentration der Ätzlösung [mol/l] | Länge der Si-NWs [μm] |
| 0,03 | 0,45 |
| 0,06 | 1,25 |
| 0,12 | 5,13 |
| 0,24 | 11,07 |
| 0,36 | 12,24 |
| Länge der Si-NWs [μm] | Dicke der Edelmetallschicht [nm] | Edelmetall |
| 0,45 | 27 | Au |
| 0,45 | 54 | Au |
| 0,45 | 74 | Au |
| 0,45 | 45 + 6 | Ag + Au |
| 0,45 | 40 + 10 | Ag + Au |
| 0,45 | 20 + 25 + 5 | Au + Ag + Au |
| 0,45 | 20 + 20 + 10 | Au + Ag + Au |
| 1,25 | 6 | Au |
| 1,25 | 11 | Au |
| 1,25 | 25 | Au |
| 1,25 | 27 | Au |
| 1,25 | 49 | Au |
| 1,25 | 50 | Au |
| 1,25 | 75 | Au |
| 1,25 | 76 | Au |
| 1,25 | 100 | Au |
| 5,13 | 26 | Au |
| 5,13 | 51 | Au |
| 11,07 | 26 | Au |
| 11,07 | 51 | Au |
| 12,24 | 51 | Au |
| Beispiel | Länge der Si-NWs [μm] | Dicke der Edelmetallschicht [nm] | Edelmetalle) | Hotspots [%] |
| Vergleichsbeispiel 1 | 0,45 | 27 | Au | 0 |
| Beispiel 1 | 0,45 | 54 | Au | 36 |
| Beispiel 2 | 0,45 | 74 | Au | 12 |
| Vergleichsbeispiel 2 | 0,45 | 45 + 6 | Ag + Au | 0 |
| Vergleichsbeispiel 3 | 0,45 | 40 + 10 | Ag + Au | 0 |
| Vergleichsbeispiel 4 | 0,45 | 20 + 25 + 5 | Au + Ag + Au | 0 |
| Vergleichsbeispiel 5 | 0,45 | 20 + 20 + 10 | Au + Ag + Au | 0 |
| Vergleichsbeispiel 6 | 1,25 | 6 | Au | 0 |
| Vergleichsbeispiel 7 | 1,25 | 11 | Au | 0 |
| Beispiel 3 | 1,25 | 25 | Au | 20 |
| Beispiel 4 | 1,25 | 27 | Au | 12 |
| Beispiel 5 | 1,25 | 49 | Au | 20 |
| Beispiel 6 | 1,25 | 50 | Au | 30 |
| Vergleichsbeispiel 8 | 1,25 | 75 | Au | 0 |
| Vergleichsbeispiel 9 | 1,25 | 76 | Au | 0 |
| Vergleichsbeispiel 10 | 1,25 | 100 | Au | 0 |
| Vergleichsbeispiel 11 | 5,13 | 26 | Au | 0 |
| Beispiel 7 | 5,13 | 51 | Au | 4 |
| Vergleichsbeispiel 12 | 11,07 | 26 | Au | 0 |
| Beispiel 8 | 11,07 | 51 | Au | 4 |
| Vergleichsbeispiel 13 | 12,24 | 51 | Au | 0 |
Claims (10)
- PATENTANSPRÜCHE1. Verfahren zur Herstellung von edelmetallmodifizierten Silicium-Nanowires, umfassend einen Schritt des Erzeugens der Silicium-Nanowires in einem Siliciumwafer sowie einen Schritt des Aufbringens eines oder mehrerer Edelmetalle auf die Oberfläche der Nanowires, dadurch gekennzeichnet, dass mit Gold beschichtete Silicium-Nanowires hergestellt werden, indema) zunächst die Silicium-Nanowires im Siliciumwafer durch silberkatalysiertes chemisches Nassätzen unter Variation der Konzentration und/oder der Einwirkdauer einer Ätzlösung erzeugt werden, um die Länge der Nanowires zu steuern; undb) anschließend die erhaltenen Nanowires mit Gold als Edelmetall durch Sputtern beschichtet werden, wobei die Dauer der Sputterbeschichtung variiert wird, um die Dicke der erhaltenen Goldbeschichtung zu steuern.
- 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, dass Schritt a) unter Verwendung einer wässrigen Lösung von HF und H2O2 als Ätzlösung durchgeführt wird.
- 3. Verfahren nach Anspruch 1 oder 2, dadurch gekennzeichnet, dass in Schritt a) die Steuerung der Länge der Nanowires durch Variieren der Konzentration der Ätzlösung erfolgt.
- 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, dass in Schritt a) Silicium-Nanowires mit einer Länge < 1,8 μm erzeugt werden.
- 5. Verfahren nach Anspruch 4, dadurch gekennzeichnet, dass Silicium-Nanowires mit einer Länge < 1,5 μm erzeugt werden.
- 6. Verfahren nach Anspruch 5, dadurch gekennzeichnet, dass Silicium-Nanowires mit einer Länge zwischen 0,4 und 1,3 μm erzeugt werden.-11 11 / 16
- 7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, dass auf die Nanowires in Schritt b) eine Goldschicht mit einer Dicke zwischen 20 und 70 nm aufgesputtert wird.
- 8. Verfahren nach Anspruch 7, dadurch gekennzeichnet, dass eine Goldschicht mit einer Dicke zwischen 40 und 60 nm aufgesputtert wird.
- 9. Verfahren nach Anspruch 8, dadurch gekennzeichnet, dass eine Goldschicht mit einer Dicke von etwa 50 nm aufgesputtert wird.
- 10. Goldbeschichtete Silicium-Nanowires, erhalten durch ein Verfahren nach einem der Ansprüche 1 bis 9.Wien, am 1t Mai ZöVTechnische Universität Wien vertreten durch:Häupl & Ellmeyer KGPatentanwaltskanzlei-1212 / 16
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA195/2017A AT519922B1 (de) | 2017-05-11 | 2017-05-11 | SERS-Substrat |
| PCT/AT2018/060091 WO2018204963A1 (de) | 2017-05-11 | 2018-05-11 | Verfahren zur herstellung edelmetallmodifizierter silicium-nanowires |
| EP18732629.3A EP3622274A1 (de) | 2017-05-11 | 2018-05-11 | Verfahren zur herstellung edelmetallmodifizierter silicium-nanowires |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| ATA195/2017A AT519922B1 (de) | 2017-05-11 | 2017-05-11 | SERS-Substrat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| AT519922A1 true AT519922A1 (de) | 2018-11-15 |
| AT519922B1 AT519922B1 (de) | 2020-01-15 |
Family
ID=62684546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| ATA195/2017A AT519922B1 (de) | 2017-05-11 | 2017-05-11 | SERS-Substrat |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP3622274A1 (de) |
| AT (1) | AT519922B1 (de) |
| WO (1) | WO2018204963A1 (de) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111781191A (zh) * | 2020-07-20 | 2020-10-16 | 济南大学 | 基于sers机理的复合纳米阵列监测4-硝基苯硫酚 |
| CN114132890A (zh) * | 2021-11-29 | 2022-03-04 | 西安工业大学 | 一种制备有序硅纳米线阵列的方法 |
| CN114990494B (zh) * | 2022-05-27 | 2024-02-09 | 江苏师范大学 | 一种金纳米层包覆银纳米棒阵列的松塔结构sers基底及其制备方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100122725A1 (en) * | 2008-11-14 | 2010-05-20 | Buchine Brent A | Nanostructured Devices |
| US20130012022A1 (en) * | 2011-07-04 | 2013-01-10 | National Taiwan University Of Science And Technology | Method for fabricating silicon nanowire arrays |
| WO2013056186A1 (en) * | 2011-10-12 | 2013-04-18 | The Regents Of The University Of California | Semiconductor processing by magnetic field guided etching |
| US20140030873A1 (en) * | 2012-07-27 | 2014-01-30 | National Taiwan University Of Science And Technology | Method for fabricating patterned silicon nanowire array and silicon microstructure |
| WO2014120830A1 (en) * | 2013-01-30 | 2014-08-07 | Bandgap Engineering, Inc. | Necklaces of silicon nanowires |
| CN105039942A (zh) * | 2015-08-18 | 2015-11-11 | 西安交通大学 | 仙人掌结构的银枝晶/硅针尖纳米复合材料的制备方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7158219B2 (en) * | 2004-09-16 | 2007-01-02 | Hewlett-Packard Development Company, L.P. | SERS-active structures including nanowires |
| KR101195546B1 (ko) * | 2010-05-07 | 2012-10-29 | 국립대학법인 울산과학기술대학교 산학협력단 | 실리콘 나노 와이어의 제조방법 및 이를 이용한 리튬 이차 전지의 제조방법 |
-
2017
- 2017-05-11 AT ATA195/2017A patent/AT519922B1/de not_active IP Right Cessation
-
2018
- 2018-05-11 WO PCT/AT2018/060091 patent/WO2018204963A1/de not_active Ceased
- 2018-05-11 EP EP18732629.3A patent/EP3622274A1/de not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20100122725A1 (en) * | 2008-11-14 | 2010-05-20 | Buchine Brent A | Nanostructured Devices |
| US20130012022A1 (en) * | 2011-07-04 | 2013-01-10 | National Taiwan University Of Science And Technology | Method for fabricating silicon nanowire arrays |
| WO2013056186A1 (en) * | 2011-10-12 | 2013-04-18 | The Regents Of The University Of California | Semiconductor processing by magnetic field guided etching |
| US20140030873A1 (en) * | 2012-07-27 | 2014-01-30 | National Taiwan University Of Science And Technology | Method for fabricating patterned silicon nanowire array and silicon microstructure |
| WO2014120830A1 (en) * | 2013-01-30 | 2014-08-07 | Bandgap Engineering, Inc. | Necklaces of silicon nanowires |
| CN105039942A (zh) * | 2015-08-18 | 2015-11-11 | 西安交通大学 | 仙人掌结构的银枝晶/硅针尖纳米复合材料的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| AT519922B1 (de) | 2020-01-15 |
| EP3622274A1 (de) | 2020-03-18 |
| WO2018204963A1 (de) | 2018-11-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2295617B1 (de) | Verfahren zur Herstellung von flächigen Größen- oder Abstandsvariationen in Mustern von Nanostrukturen auf Oberflächen | |
| EP2516322A2 (de) | Verfahren zur herstellung von konusförmigen nanostrukturen auf substratoberflächen | |
| DE602004005652T2 (de) | Mikrostrukturkörper für die Raman-Spektroskopie und Verfahren zu dessen Herstellung | |
| DE69738218T2 (de) | Cvd-aufbringung von fruorcarbonpolymer-dünnschichten | |
| DE112011100503T5 (de) | Ein verfahren und eine vorrichtung zur vorbereitung eines substrats für eine molekulare detektion | |
| EP2931937B1 (de) | Verfahren zur herstellung von metall-nanopartikel-arrays | |
| AT519922B1 (de) | SERS-Substrat | |
| DE102010023490A1 (de) | Dreidimensionale metallbedeckte Nanostrukturen auf Substratoberflächen,Verfahren zu deren Erzeugung sowie deren Verwendung | |
| DE2546697A1 (de) | Verfahren zum elektrochemischen abscheiden eines materials auf einem halbleiterkoerper | |
| EP2501842B1 (de) | Verfahren zur räumlich aufgelösten vergrösserung von nanopartikeln auf einer substratoberfläche | |
| DE102015004114A1 (de) | Oberflächenverstärkendes plasmonisches Substrat | |
| DE102008048342B4 (de) | SERS-Substrat, Verfahren zu seiner Herstellung und Verfahren zum Detektieren eines Analyten mittels SERS | |
| DE102009019166B3 (de) | Verfahren zur Herstellung eines Referenzkörpers für Röntgenfluoreszenzuntersuchungen an Substraten und mit dem Verfahren hergestellter Referenzkörper | |
| DE102016121462A1 (de) | Strukturierte Keimschicht | |
| DE102008029385B4 (de) | Verfahren zur Herstellung von Seltenerdmetalloxidschichten und Übergangsmetalloxidschichten, Verwendung einer Vorrichtung zur Herstellung von Seltenerdmetalloxidschichten und Übergangsmetalloxidschichten sowie Verwendung eines Metallnitrats | |
| DE2526382C3 (de) | Kathodenzerstäubungsverf ahren zur Herstellung geätzter Strukturen | |
| DE19637220A1 (de) | Diamantbehandlung | |
| DE102016118440B4 (de) | Aktivierte 3-D-Nanooberfläche, Verfahren zu ihrer Herstellung und ihre Verwendung | |
| CH718265B1 (de) | Diamantabtastelement, insbesondere für eine Bildgebungsanwendung, und Verfahren für dessen Fertigung. | |
| CH703612B1 (de) | Verfahren zur Beschichtung von hydrophilen Festkörpern mit einer Goldschicht mit ausgedehnter Oberfläche sowie ein mit einer Goldschicht mit ausgedehnter Oberfläche beschichteter hydrophiler Festkörper. | |
| DE10239163A1 (de) | Vorrichtung und Verfahren zur Ausbildung von Gradientenschichten auf Substraten in einer Vakuumkammer | |
| DE102005011345A1 (de) | Verfahren zum Herstellen einer Nanostruktur auf einem Substrat | |
| DE102010024498B4 (de) | Verfahren zur Herstellung einer dreidimensionalen Struktur für die Medizintechnik | |
| DE102023122606A1 (de) | Optische Linse und Verfahren zum Ionenätzen einer gekrümmten Oberfläche eines Substrats | |
| Abdi et al. | Surface plasmon resonance of Ag nanoparticles in the vicinity of a high impedance surface |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| HA | Change or addition of new inventor |
Inventor name: ROLAND BITTNER, AT Effective date: 20200702 Inventor name: DANNY MUELLER, AT Effective date: 20200702 Inventor name: CHRISTIAN KNOLL, AT Effective date: 20200702 Inventor name: PETER WEINBERGER, AT Effective date: 20200702 Inventor name: BERNHARD LENDL, AT Effective date: 20200702 Inventor name: HELMUTH HOFFMANN, AT Effective date: 20200702 Inventor name: JOHANNES OFNER, AT Effective date: 20200702 |
|
| MM01 | Lapse because of not paying annual fees |
Effective date: 20240511 |