AT525487A5 - Harzlage, Prepreg, isolierendes Harzelement und Leiterplatte - Google Patents

Harzlage, Prepreg, isolierendes Harzelement und Leiterplatte Download PDF

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Publication number
AT525487A5
AT525487A5 ATA9183/2021A AT91832021A AT525487A5 AT 525487 A5 AT525487 A5 AT 525487A5 AT 91832021 A AT91832021 A AT 91832021A AT 525487 A5 AT525487 A5 AT 525487A5
Authority
AT
Austria
Prior art keywords
resin layer
equal
prepreg
circuit board
mpa
Prior art date
Application number
ATA9183/2021A
Other languages
English (en)
Other versions
AT525487A2 (de
AT525487B1 (de
Inventor
Aoki Tomoyuki
Yamauchi Akihiro
Saito Eiichiro
Original Assignee
Panasonic Ip Man Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Ip Man Co Ltd filed Critical Panasonic Ip Man Co Ltd
Publication of AT525487A2 publication Critical patent/AT525487A2/de
Publication of AT525487A5 publication Critical patent/AT525487A5/de
Application granted granted Critical
Publication of AT525487B1 publication Critical patent/AT525487B1/de

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/244—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B11/00—Making preforms
    • B29B11/14—Making preforms characterised by structure or composition
    • B29B11/16—Making preforms characterised by structure or composition comprising fillers or reinforcement
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2101/00—Use of unspecified macromolecular compounds as moulding material
    • B29K2101/10—Thermosetting resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0094—Condition, form or state of moulded material or of the material to be shaped having particular viscosity
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2463/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Reinforced Plastic Materials (AREA)

Abstract

Die vorliegende Offenbarung stellt eine Harzlage (3) bereit, die zum Bilden einer Isolierschicht verwendet werden kann, in der ein Leiter eingebettet ist, die es leichter macht, den Leiter in der Isolierschicht einzubetten, und die Wahrscheinlichkeit verringert, eine Abnahme in Formbarkeit zu verursachen. Eine Harzlage (3) gemäß der vorliegenden Offenbarung enthält ein ungehärtetes Produkt oder halbgehärtetes Produkt einer wärmehärtbaren Harzzusammensetzung (X1). Eine Schmelzviskosität der Harzlage ist gleich oder größer als 10 Pa･s und gleich oder kleiner als 2000 Pa ･ s, wenn mit einem Koka-Strömungstester unter einer Messbedingung gemessen, die 130°C und 1 MPa enthält, und ist gleich oder größer als 6 Pa･s und gleich oder kleiner als 1200 Pa･s, wenn mit dem Koka-Strömungstester unter einer Messbedingung gemessen, die 130°C und 4 MPa enthält.
ATA9183/2021A 2020-07-08 2021-07-07 Harzlage, Prepreg, isolierendes Harzelement und Leiterplatte AT525487B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020118010 2020-07-08
PCT/JP2021/025679 WO2022009937A1 (ja) 2020-07-08 2021-07-07 樹脂シート、プリプレグ、絶縁性樹脂材及びプリント配線板

Publications (3)

Publication Number Publication Date
AT525487A2 AT525487A2 (de) 2023-02-15
AT525487A5 true AT525487A5 (de) 2024-07-15
AT525487B1 AT525487B1 (de) 2025-01-15

Family

ID=79553241

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA9183/2021A AT525487B1 (de) 2020-07-08 2021-07-07 Harzlage, Prepreg, isolierendes Harzelement und Leiterplatte

Country Status (6)

Country Link
US (1) US12441856B2 (de)
JP (1) JP7766282B2 (de)
CN (1) CN115697660B (de)
AT (1) AT525487B1 (de)
DE (1) DE112021002573T5 (de)
WO (1) WO2022009937A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
PT119059A (pt) * 2023-11-20 2025-05-20 Univ De Coimbra Dispositivo para o isolamento de células a partir de explantes de tecidos

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Publication number Priority date Publication date Assignee Title
JPH09186457A (ja) * 1995-12-28 1997-07-15 Matsushita Electric Works Ltd 内層回路入り積層板の製造方法
JPH11279493A (ja) * 1998-03-31 1999-10-12 Hitachi Chem Co Ltd 接着剤シート、接着剤付き金属はく、金属はく張多層積層板、金属はく張積層板及びプリント配線板
JP2000095844A (ja) * 1998-09-25 2000-04-04 Matsushita Electric Works Ltd エポキシ樹脂組成物、プリプレグ及び積層板
JP2003253125A (ja) * 2001-01-31 2003-09-10 Sumitomo Bakelite Co Ltd 絶縁樹脂組成物及び絶縁樹脂シート並びにプリント配線板
JP2004059896A (ja) * 2002-06-03 2004-02-26 Matsushita Electric Works Ltd プリプレグ及びこのプリプレグを用いたプリント配線板の製造方法
JP2006066738A (ja) * 2004-08-27 2006-03-09 Matsushita Electric Works Ltd 多層プリント配線板用銅張り積層板、多層プリント配線板及び多層プリント配線板の製造方法
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Also Published As

Publication number Publication date
CN115697660A (zh) 2023-02-03
DE112021002573T5 (de) 2023-03-09
WO2022009937A1 (ja) 2022-01-13
AT525487A2 (de) 2023-02-15
AT525487B1 (de) 2025-01-15
JP7766282B2 (ja) 2025-11-10
US12441856B2 (en) 2025-10-14
CN115697660B (zh) 2026-02-06
US20230257540A1 (en) 2023-08-17
JPWO2022009937A1 (de) 2022-01-13

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