AT526324A5 - Harzzusammensetzung, Harzfilmelement, Leiterplatte und Verfahren zur Herstellung der Leiterplatte - Google Patents

Harzzusammensetzung, Harzfilmelement, Leiterplatte und Verfahren zur Herstellung der Leiterplatte Download PDF

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Publication number
AT526324A5
AT526324A5 ATA9090/2021A AT90902021A AT526324A5 AT 526324 A5 AT526324 A5 AT 526324A5 AT 90902021 A AT90902021 A AT 90902021A AT 526324 A5 AT526324 A5 AT 526324A5
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AT
Austria
Prior art keywords
resin
circuit board
printed circuit
resin layer
film member
Prior art date
Application number
ATA9090/2021A
Other languages
English (en)
Other versions
AT526324A2 (de
AT526324B1 (de
Inventor
Maeda Yohei
Saito Eiichiro
Yamauchi Akihiro
Original Assignee
Panasonic Ip Man Co Ltd
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Publication date
Application filed by Panasonic Ip Man Co Ltd filed Critical Panasonic Ip Man Co Ltd
Publication of AT526324A2 publication Critical patent/AT526324A2/de
Publication of AT526324A5 publication Critical patent/AT526324A5/de
Application granted granted Critical
Publication of AT526324B1 publication Critical patent/AT526324B1/de

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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5313—Phosphinic compounds, e.g. R2=P(:O)OR'
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/5399—Phosphorus bound to nitrogen
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/02—Flame or fire retardant/resistant
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0195—Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)

Abstract

Die vorliegende Offenbarung stellt eine Harzzusammensetzung bereit, die es leichter macht, wenn eine Harzschicht eines Harzfilmelements gebildet wird, der Harzschicht Flexibilität zu verleihen, und die die Wahrscheinlichkeit verringert, dass Komponenten in der Harzschicht aus der Harzschicht fließen, wenn eine Stapel, der die Harzschicht enthält, heißgepresst wird. Eine Harzzusammensetzung beinhaltet eine Harzkomponente (A) und ein phosphorhaltiges Flammschutzmittel (B). Die Harzkomponente (A) beinhaltet an Epoxidharz (a1), dessen Viskosität bei 25°C gleich oder kleiner als 50000 MPa･s ist. Der Anteil des Epoxidharzes (a1) an der Harzkomponente (A) ist gleich oder größer als 20 Masseprozent. Das phosphorhaltige Flammschutzmittel (B) enthält ein phosphorhaltiges Flammschutzmittel (B1), das weder schmilzt noch sich bei einer Temperatur unter 150°C thermisch zersetzt.
ATA9090/2021A 2020-04-06 2021-04-05 Harzzusammensetzung, Harzfilmelement, Leiterplatte und Verfahren zur Herstellung der Leiterplatte AT526324B1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020068545 2020-04-06
PCT/JP2021/014453 WO2021206041A1 (ja) 2020-04-06 2021-04-05 樹脂組成物、樹脂フィルム材、プリント配線板及びプリント配線板の製造方法

Publications (3)

Publication Number Publication Date
AT526324A2 AT526324A2 (de) 2023-12-15
AT526324A5 true AT526324A5 (de) 2024-07-15
AT526324B1 AT526324B1 (de) 2025-08-15

Family

ID=78023154

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA9090/2021A AT526324B1 (de) 2020-04-06 2021-04-05 Harzzusammensetzung, Harzfilmelement, Leiterplatte und Verfahren zur Herstellung der Leiterplatte

Country Status (6)

Country Link
US (1) US20230151204A1 (de)
JP (1) JP7759622B2 (de)
CN (1) CN115335453A (de)
AT (1) AT526324B1 (de)
DE (1) DE112021000908T5 (de)
WO (1) WO2021206041A1 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161629A (ja) * 2007-12-28 2009-07-23 Toto Kasei Co Ltd 新規リン含有難燃性樹脂、それを含有するエポキシ樹脂組成物及びその硬化物
JP2012219232A (ja) * 2011-04-13 2012-11-12 Taiyo Ink Mfg Ltd 難燃性熱硬化性樹脂組成物、その硬化物及びそれを用いたプリント配線板
JP2013231094A (ja) * 2012-04-27 2013-11-14 Toray Ind Inc 難燃性接着剤組成物
EP3309190A1 (de) * 2015-06-11 2018-04-18 Mitsubishi Chemical Corporation Epoxidharzzusammensetzung, formkörper, prepreg, faserverstärkter verbundwerkstoff und struktur
EP3447090A1 (de) * 2016-04-25 2019-02-27 Kaneka Corporation Wärmehärtende harzzusammensetzung, gehärtete folie und verfahren zu ihrer herstellung sowie flexible leiterplatte mit gehärteter folie und verfahren zur herstellung davon

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JP2002284963A (ja) * 2001-03-26 2002-10-03 Nippon Kayaku Co Ltd 難燃性エポキシ樹脂組成物及びその用途
JP2003037362A (ja) 2001-07-24 2003-02-07 Matsushita Electric Works Ltd 多層プリント配線板の製造方法
JP2007005640A (ja) * 2005-06-24 2007-01-11 Three M Innovative Properties Co 回路基板の相互接続方法
US20080200084A1 (en) * 2007-02-16 2008-08-21 Angus Richard O Compositions for thin circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
JP5412057B2 (ja) * 2008-06-03 2014-02-12 三菱エンジニアリングプラスチックス株式会社 樹脂組成物及びこれを用いた電気絶縁部品
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Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009161629A (ja) * 2007-12-28 2009-07-23 Toto Kasei Co Ltd 新規リン含有難燃性樹脂、それを含有するエポキシ樹脂組成物及びその硬化物
JP2012219232A (ja) * 2011-04-13 2012-11-12 Taiyo Ink Mfg Ltd 難燃性熱硬化性樹脂組成物、その硬化物及びそれを用いたプリント配線板
JP2013231094A (ja) * 2012-04-27 2013-11-14 Toray Ind Inc 難燃性接着剤組成物
EP3309190A1 (de) * 2015-06-11 2018-04-18 Mitsubishi Chemical Corporation Epoxidharzzusammensetzung, formkörper, prepreg, faserverstärkter verbundwerkstoff und struktur
EP3447090A1 (de) * 2016-04-25 2019-02-27 Kaneka Corporation Wärmehärtende harzzusammensetzung, gehärtete folie und verfahren zu ihrer herstellung sowie flexible leiterplatte mit gehärteter folie und verfahren zur herstellung davon

Also Published As

Publication number Publication date
JPWO2021206041A1 (de) 2021-10-14
JP7759622B2 (ja) 2025-10-24
US20230151204A1 (en) 2023-05-18
WO2021206041A1 (ja) 2021-10-14
AT526324A2 (de) 2023-12-15
DE112021000908T5 (de) 2022-11-24
CN115335453A (zh) 2022-11-11
AT526324B1 (de) 2025-08-15

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