AT528141A1 - Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung - Google Patents

Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung

Info

Publication number
AT528141A1
AT528141A1 ATA50274/2024A AT502742024A AT528141A1 AT 528141 A1 AT528141 A1 AT 528141A1 AT 502742024 A AT502742024 A AT 502742024A AT 528141 A1 AT528141 A1 AT 528141A1
Authority
AT
Austria
Prior art keywords
electrolyte bath
ions
coating
palladium
bath according
Prior art date
Application number
ATA50274/2024A
Other languages
German (de)
English (en)
Original Assignee
Iwg Ing W Garhoefer Ges M B H
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Iwg Ing W Garhoefer Ges M B H filed Critical Iwg Ing W Garhoefer Ges M B H
Priority to ATA50274/2024A priority Critical patent/AT528141A1/de
Priority to CN202510365626.0A priority patent/CN120719350A/zh
Priority to EP25166353.0A priority patent/EP4624636A3/fr
Publication of AT528141A1 publication Critical patent/AT528141A1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/567—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/04—Alloys based on a platinum group metal
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
    • C25D3/14—Electroplating: Baths therefor from solutions of nickel or cobalt from baths containing acetylenic or heterocyclic compounds
    • C25D3/18—Heterocyclic compounds
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/50—Electroplating: Baths therefor from solutions of platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/627—Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Mechanical Engineering (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
ATA50274/2024A 2024-03-28 2024-03-28 Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung AT528141A1 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
ATA50274/2024A AT528141A1 (de) 2024-03-28 2024-03-28 Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung
CN202510365626.0A CN120719350A (zh) 2024-03-28 2025-03-26 用于沉积钯锡合金的电解质浴
EP25166353.0A EP4624636A3 (fr) 2024-03-28 2025-03-26 Bain électrolytique pour le dépôt d'un alliage palladium-étain

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ATA50274/2024A AT528141A1 (de) 2024-03-28 2024-03-28 Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung

Publications (1)

Publication Number Publication Date
AT528141A1 true AT528141A1 (de) 2025-10-15

Family

ID=95065842

Family Applications (1)

Application Number Title Priority Date Filing Date
ATA50274/2024A AT528141A1 (de) 2024-03-28 2024-03-28 Elektrolytbad zur Abscheidung einer Palladium-Zinn-Legierung

Country Status (3)

Country Link
EP (1) EP4624636A3 (fr)
CN (1) CN120719350A (fr)
AT (1) AT528141A1 (fr)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0916747A1 (fr) * 1997-11-15 1999-05-19 AMI Doduco GmbH Bain électrolytique pour le dépÔt de palladium et d'alliages de palladium
DE19803818A1 (de) * 1997-11-15 1999-05-27 Doduco Gmbh Elektrolytisches Bad zum Abscheiden von Palladium und von Legierungen des Palladiums
WO2009135505A1 (fr) * 2008-05-07 2009-11-12 Umicore Galvanotechnik Gmbh Bains d'électrolyte au pd et au pd-ni
EP3964610A1 (fr) * 2020-09-08 2022-03-09 IWG Ing. W. Garhöfer Gesellschaft m. b. H. Bain d'électrodéposition pour revêtements palladium-ruthénium

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SU418568A1 (fr) * 1972-04-10 1974-03-05
CH572989A5 (fr) 1973-04-27 1976-02-27 Oxy Metal Industries Corp
ES2118316T3 (es) * 1993-04-07 1998-09-16 Atotech Deutschland Gmbh Separacion electrolitica del paladio o de aleaciones de paladio.
JP3007056B2 (ja) 1997-01-24 2000-02-07 株式会社ビクトリア Ｐｄ−Ｓｎ系合金メッキ液及びメッキ部材
FR2807422B1 (fr) 2000-04-06 2002-07-05 Engelhard Clal Sas Sel complexe de palladium et son utilisation pour ajuster la concentration en palladium d'un bain electrolytique destine au depot de palladium ou d'un de ses alliages

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0916747A1 (fr) * 1997-11-15 1999-05-19 AMI Doduco GmbH Bain électrolytique pour le dépÔt de palladium et d'alliages de palladium
DE19803818A1 (de) * 1997-11-15 1999-05-27 Doduco Gmbh Elektrolytisches Bad zum Abscheiden von Palladium und von Legierungen des Palladiums
WO2009135505A1 (fr) * 2008-05-07 2009-11-12 Umicore Galvanotechnik Gmbh Bains d'électrolyte au pd et au pd-ni
EP3964610A1 (fr) * 2020-09-08 2022-03-09 IWG Ing. W. Garhöfer Gesellschaft m. b. H. Bain d'électrodéposition pour revêtements palladium-ruthénium

Also Published As

Publication number Publication date
EP4624636A2 (fr) 2025-10-01
EP4624636A3 (fr) 2025-11-12
CN120719350A (zh) 2025-09-30

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