ATA14172001A - Verfahren und vorrichtung zur montage von halbleiterchips - Google Patents
Verfahren und vorrichtung zur montage von halbleiterchipsInfo
- Publication number
- ATA14172001A ATA14172001A AT0141701A AT14172001A ATA14172001A AT A14172001 A ATA14172001 A AT A14172001A AT 0141701 A AT0141701 A AT 0141701A AT 14172001 A AT14172001 A AT 14172001A AT A14172001 A ATA14172001 A AT A14172001A
- Authority
- AT
- Austria
- Prior art keywords
- semiconductor chips
- assembling semiconductor
- assembling
- chips
- semiconductor
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0446—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/071—Connecting or disconnecting
- H10W72/073—Connecting or disconnecting of die-attach connectors
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CH17682000 | 2000-09-12 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ATA14172001A true ATA14172001A (de) | 2004-08-15 |
| AT412519B AT412519B (de) | 2005-03-25 |
Family
ID=4566191
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT0141701A AT412519B (de) | 2000-09-12 | 2001-09-07 | Verfahren und vorrichtung zur montage von halbleiterchips |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US6648215B2 (de) |
| KR (1) | KR100773170B1 (de) |
| CN (1) | CN1190831C (de) |
| AT (1) | AT412519B (de) |
| HK (1) | HK1044628A1 (de) |
| SG (1) | SG98455A1 (de) |
| TW (1) | TWI270158B (de) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7441688B2 (en) * | 2003-11-04 | 2008-10-28 | Reactive Nanotechnologies | Methods and device for controlling pressure in reactive multilayer joining and resulting product |
| US6616031B2 (en) * | 2001-07-17 | 2003-09-09 | Asm Assembly Automation Limited | Apparatus and method for bond force control |
| DE10159974C1 (de) * | 2001-12-06 | 2003-10-23 | Infineon Technologies Ag | Halbleiterchip-Montageanlage mit einem Saugnippel zur Abnahme eines Halbleiterchips |
| US6956223B2 (en) | 2002-04-10 | 2005-10-18 | Applied Materials, Inc. | Multi-directional scanning of movable member and ion beam monitoring arrangement therefor |
| US7109157B2 (en) * | 2003-02-27 | 2006-09-19 | Lawnie Taylor | Methods and equipment for removing stains from fabrics using a composition comprising hydroxide and hypochlorite |
| US20040105750A1 (en) * | 2002-11-29 | 2004-06-03 | Esec Trading Sa, A Swiss Corporation | Method for picking semiconductor chips from a foil |
| US7628822B2 (en) * | 2005-04-08 | 2009-12-08 | Taylor Lawnie H | Formation of patterns of fades on fabrics |
| US7303111B2 (en) * | 2005-10-14 | 2007-12-04 | Asm Technology Singapore Pte. Ltd. | Lightweight bondhead assembly |
| DE102006020418A1 (de) * | 2006-04-26 | 2007-10-31 | Herrmann Ultraschalltechnik Gmbh & Co. Kg | Vorrichtung zum Bearbeiten von Werkstücken mittels Ultraschall |
| KR101508507B1 (ko) | 2008-07-11 | 2015-04-03 | 한미반도체 주식회사 | 비전검사장비의 픽커 유니트 |
| US8113411B2 (en) * | 2010-03-30 | 2012-02-14 | Flextronics Ap, Llc | Universal radio frequency shield removal |
| KR101521529B1 (ko) | 2010-06-14 | 2015-05-19 | 삼성테크윈 주식회사 | 부품 실장기 헤드 및 이를 이용한 부품 실장 방법 |
| US20120267423A1 (en) * | 2011-04-19 | 2012-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Methods and Apparatus for Thin Die Processing |
| JP2013197146A (ja) * | 2012-03-16 | 2013-09-30 | Renesas Electronics Corp | 半導体装置の製造方法及び半導体製造装置 |
| US9165902B2 (en) * | 2013-12-17 | 2015-10-20 | Kulicke And Soffa Industries, Inc. | Methods of operating bonding machines for bonding semiconductor elements, and bonding machines |
| KR102231293B1 (ko) | 2014-02-10 | 2021-03-23 | 삼성전자주식회사 | 다이 본딩 장치 |
| WO2017129171A1 (de) * | 2016-01-29 | 2017-08-03 | Jenoptik Optical Systems Gmbh | Verfahren und vorrichtung zum herauslösen eines mikro-chips aus einem wafer und aufbringen des mikro-chips auf ein substrat |
| KR102043646B1 (ko) * | 2019-07-02 | 2019-11-14 | 주식회사 경성금형 | 반도체칩 접합장치 |
| CN113764315B (zh) * | 2021-09-27 | 2024-06-11 | 深圳市东彦通信科技有限公司 | 一种粘接工装及粘接方法 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6441230A (en) * | 1987-08-06 | 1989-02-13 | Mitsubishi Electric Corp | Die-bonding device |
| US4875279A (en) * | 1987-08-21 | 1989-10-24 | E. I. Du Pont De Nemours And Company | Die attach pickup tools |
| US5144747A (en) * | 1991-03-27 | 1992-09-08 | Integrated System Assemblies Corporation | Apparatus and method for positioning an integrated circuit chip within a multichip module |
| JP2635889B2 (ja) | 1992-06-24 | 1997-07-30 | 株式会社東芝 | ダイボンディング装置 |
| US5688716A (en) * | 1994-07-07 | 1997-11-18 | Tessera, Inc. | Fan-out semiconductor chip assembly |
| JPH08162797A (ja) * | 1994-12-08 | 1996-06-21 | Matsushita Electric Ind Co Ltd | 電子部品実装装置 |
| US5673844A (en) * | 1995-12-29 | 1997-10-07 | Gte Laboratories Incorporated | Gas pressure adjustable diebonding apparatus and method |
| DE19613265C1 (de) * | 1996-04-02 | 1997-04-17 | Siemens Ag | Bauelement in stickstoffhaltigem Halbleitermaterial |
| JPH10340931A (ja) * | 1997-06-05 | 1998-12-22 | Toray Eng Co Ltd | チップボンディングツール |
| JP3955659B2 (ja) * | 1997-06-12 | 2007-08-08 | リンテック株式会社 | 電子部品のダイボンディング方法およびそれに使用されるダイボンディング装置 |
| JP3625646B2 (ja) * | 1998-03-23 | 2005-03-02 | 東レエンジニアリング株式会社 | フリップチップ実装方法 |
| JP3132496B2 (ja) * | 1999-01-25 | 2001-02-05 | 松下電器産業株式会社 | ダイボンディング装置 |
| US6284564B1 (en) * | 1999-09-20 | 2001-09-04 | Lockheed Martin Corp. | HDI chip attachment method for reduced processing |
-
2001
- 2001-08-28 KR KR1020010052028A patent/KR100773170B1/ko not_active Expired - Fee Related
- 2001-08-29 TW TW090121295A patent/TWI270158B/zh not_active IP Right Cessation
- 2001-09-03 SG SG200105435A patent/SG98455A1/en unknown
- 2001-09-07 AT AT0141701A patent/AT412519B/de not_active IP Right Cessation
- 2001-09-11 CN CNB011329270A patent/CN1190831C/zh not_active Expired - Fee Related
- 2001-09-12 US US09/951,097 patent/US6648215B2/en not_active Expired - Fee Related
-
2002
- 2002-08-23 HK HK02106198.5A patent/HK1044628A1/zh unknown
Also Published As
| Publication number | Publication date |
|---|---|
| TWI270158B (en) | 2007-01-01 |
| KR100773170B1 (ko) | 2007-11-02 |
| AT412519B (de) | 2005-03-25 |
| CN1344016A (zh) | 2002-04-10 |
| CN1190831C (zh) | 2005-02-23 |
| US20020030089A1 (en) | 2002-03-14 |
| SG98455A1 (en) | 2003-09-19 |
| US6648215B2 (en) | 2003-11-18 |
| KR20020020998A (ko) | 2002-03-18 |
| HK1044628A1 (zh) | 2002-11-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELJ | Ceased due to non-payment of the annual fee |