ATA25096A - Kühlkörper für elektrische und elektronische bauelemente - Google Patents
Kühlkörper für elektrische und elektronische bauelementeInfo
- Publication number
- ATA25096A ATA25096A AT0025096A AT25096A ATA25096A AT A25096 A ATA25096 A AT A25096A AT 0025096 A AT0025096 A AT 0025096A AT 25096 A AT25096 A AT 25096A AT A25096 A ATA25096 A AT A25096A
- Authority
- AT
- Austria
- Prior art keywords
- electrical
- heat sink
- electronic components
- electronic
- sink
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20454—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff with a conformable or flexible structure compensating for irregularities, e.g. cushion bags, thermal paste
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
- H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/251—Organics
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
- H10W40/258—Metallic materials
Landscapes
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Devices For Blowing Cold Air, Devices For Blowing Warm Air, And Means For Preventing Water Condensation In Air Conditioning Units (AREA)
- Details Of Measuring And Other Instruments (AREA)
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0025096A AT404532B (de) | 1996-02-13 | 1996-02-13 | Kühlkörper für elektrische und elektronische bauelemente |
| FR9700889A FR2744873A1 (fr) | 1996-02-13 | 1997-01-28 | Corps de refroidissement pour composants electriques ou electroniques |
| GB9701856A GB2310321A (en) | 1996-02-13 | 1997-01-30 | Deformable heat sink |
| DE19704549A DE19704549A1 (de) | 1996-02-13 | 1997-02-06 | Kühlkörper für elektrische und elektronische Bauelemente |
| IT97MI000270A IT1290293B1 (it) | 1996-02-13 | 1997-02-11 | Corpi raffreddanti per elementi da costurzione elettrici ed elettronici |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| AT0025096A AT404532B (de) | 1996-02-13 | 1996-02-13 | Kühlkörper für elektrische und elektronische bauelemente |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| ATA25096A true ATA25096A (de) | 1998-04-15 |
| AT404532B AT404532B (de) | 1998-12-28 |
Family
ID=3485550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT0025096A AT404532B (de) | 1996-02-13 | 1996-02-13 | Kühlkörper für elektrische und elektronische bauelemente |
Country Status (5)
| Country | Link |
|---|---|
| AT (1) | AT404532B (de) |
| DE (1) | DE19704549A1 (de) |
| FR (1) | FR2744873A1 (de) |
| GB (1) | GB2310321A (de) |
| IT (1) | IT1290293B1 (de) |
Families Citing this family (33)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19739591A1 (de) * | 1997-09-10 | 1999-03-11 | Wuerth Elektronik Gmbh & Co Kg | Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem |
| RU2208266C2 (ru) * | 1997-09-19 | 2003-07-10 | Адвансд Серамикс Корпорейшн | Высокогибкое теплопередающее устройство |
| WO1999014805A1 (en) * | 1997-09-19 | 1999-03-25 | Advanced Ceramics Corporation | Flexible heat transfer device and method |
| US6131651A (en) * | 1998-09-16 | 2000-10-17 | Advanced Ceramics Corporation | Flexible heat transfer device and method |
| DE69825153D1 (de) * | 1997-10-14 | 2004-08-26 | Matsushita Electric Industrial Co Ltd | Wärmeleitende einheit und wärmeverbindungsstruktur welche diese einheit verwendet |
| DE19854642C2 (de) * | 1998-11-26 | 2003-02-20 | Vacuumschmelze Gmbh | Bauelement mit verbesserter Wärmesenke |
| SE518446C2 (sv) * | 1999-06-14 | 2002-10-08 | Ericsson Telefon Ab L M | Anordning vid kylning av elektroniska komponenter |
| US6690578B2 (en) * | 2000-02-02 | 2004-02-10 | Rittal Gmbh & Co. Kg | Cooling device |
| DE10004474B4 (de) * | 2000-02-02 | 2006-04-13 | Rittal Gmbh & Co. Kg | Kühlvorrichtung |
| FR2811476B1 (fr) | 2000-07-07 | 2002-12-06 | Thomson Csf | Dispositif electronique avec encapsulant thermiquement conducteur |
| DE10033848A1 (de) * | 2000-07-12 | 2002-01-24 | Plg Elektronik Ingenieur Und D | Elektrisches Gerät |
| JP4268778B2 (ja) * | 2001-12-27 | 2009-05-27 | ポリマテック株式会社 | 発熱電子部品の冷却方法及びそれに用いる熱伝導性シート |
| GB2388473B (en) * | 2002-05-08 | 2005-09-21 | Sun Microsystems Inc | Compliant heat sink interface |
| DE10235047A1 (de) * | 2002-07-31 | 2004-02-12 | Endress + Hauser Gmbh + Co. Kg | Elektronikgehäuse mit integriertem Wärmeverteiler |
| WO2004103047A1 (fr) * | 2003-05-14 | 2004-11-25 | Chingyi Chen | Module de dissipation de la chaleur tres efficace et son procede de fabrication |
| DE102009056607B4 (de) | 2009-12-02 | 2014-11-13 | Amphenol-Tuchel Electronics Gmbh | Zellverbinderdeckel und Hochstromzellanordnung mit einem Zellverbinderdeckel |
| WO2013092535A1 (en) | 2011-12-21 | 2013-06-27 | Tyst Design Ved Iver Munk | A heat bus |
| DE102014200832A1 (de) * | 2014-01-17 | 2015-07-23 | Siemens Aktiengesellschaft | Flexibler Kühlkörper für unebene Kühlflächen |
| JP2016219599A (ja) * | 2015-05-20 | 2016-12-22 | 株式会社リコー | 電子機器および熱拡散体 |
| DE102016200156A1 (de) * | 2016-01-08 | 2017-07-13 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Kühlelement für mindestens einen mit elektronischen und/oder elektrischen Bauelementen bestückten Träger |
| AT521329B1 (de) * | 2018-06-12 | 2020-03-15 | Miba Ag | Akkumulator |
| EP3923689B1 (de) * | 2020-06-12 | 2024-04-24 | Aptiv Technologies AG | Kühlvorrichtung und verfahren zu deren herstellung |
| EP3955716B1 (de) | 2020-08-13 | 2024-07-31 | Aptiv Technologies AG | Kühlvorrichtung und verfahren zur herstellung davon |
| EP4025024B1 (de) | 2021-01-04 | 2026-03-18 | Aptiv Technologies AG | Kühlvorrichtung und verfahren zur herstellung davon |
| DE102021209640A1 (de) * | 2021-09-01 | 2023-03-02 | Continental Automotive Technologies GmbH | Kühlvorrichtung, Kühlanordnung, Steuereinrichtung sowie Racksystem |
| GB2611028A (en) | 2021-09-17 | 2023-03-29 | Aptiv Tech Ltd | A method of fitting a cooling device to a circuit board and a circuit board cooling device |
| AT524582B1 (de) * | 2021-11-04 | 2022-07-15 | Miba Emobility Gmbh | Vorrichtung umfassend ein Elektronikbauteil |
| DE102022102564A1 (de) | 2022-02-03 | 2023-08-03 | Cariad Se | Kühlanordnung und Kühlvorrichtung zum Kühlen zumindest eines Bauteils auf einer Leiterplatte |
| DE102022207570A1 (de) | 2022-07-25 | 2024-01-25 | Robert Bosch Gesellschaft mit beschränkter Haftung | Kühlvorrichtung für eine zu kühlende Baugruppe in einem Fahrzeug |
| CN116171030B (zh) * | 2023-04-21 | 2023-07-04 | 深圳市中电熊猫展盛科技有限公司 | 一种水冷式室内照明智能控制电源及水冷方法 |
| US20250107046A1 (en) * | 2023-09-25 | 2025-03-27 | Microsoft Technology Licensing, Llc | Systems and methods for thermal management of electronic devices |
| DE102023212844A1 (de) * | 2023-12-18 | 2025-06-18 | Zf Friedrichshafen Ag | Kühlvorrichtung sowie Steuergerät mit einer solchen Kühlvorrichtung |
| DE102024118779B4 (de) | 2024-07-02 | 2026-01-22 | Audi Aktiengesellschaft | Kühlvorrichtung, und Kraftfahrzeug mit einer Kühlvorrichtung |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3654521A (en) * | 1971-01-13 | 1972-04-04 | Gen Electric | Electronic card module thermal clip |
| US4092697A (en) * | 1976-12-06 | 1978-05-30 | International Business Machines Corporation | Heat transfer mechanism for integrated circuit package |
| DE2903685A1 (de) * | 1979-01-31 | 1980-08-14 | Siemens Ag | Kuehlvorrichtung zur kuehlung von elektrischen bauelementen, insbesondere von integrierten bausteinen |
| US4538675A (en) * | 1982-04-01 | 1985-09-03 | Planning Research Corporation | Retention and cooling of plug-in electronic modules in a high shock and vibration environment |
| EP0128154B1 (de) * | 1982-12-16 | 1986-10-22 | Hasler AG | Mit wärmeleitfähiger paste oder flüssigkeit gefüllter flachbeutel |
| US4531146A (en) * | 1983-07-14 | 1985-07-23 | Cutchaw John M | Apparatus for cooling high-density integrated circuit packages |
| JP2569003B2 (ja) * | 1986-03-20 | 1997-01-08 | 株式会社日立製作所 | 熱伝導装置 |
| US4997032A (en) * | 1987-09-25 | 1991-03-05 | Minnesota Mining And Manufacturing Company | Thermal transfer bag |
| GB2214719B (en) * | 1988-01-26 | 1991-07-24 | Gen Electric Co Plc | Housing for electronic device |
| US4938279A (en) * | 1988-02-05 | 1990-07-03 | Hughes Aircraft Company | Flexible membrane heat sink |
| DE58902852D1 (de) * | 1988-05-05 | 1993-01-14 | Siemens Nixdorf Inf Syst | Anordnung zur konvektiven kuehlung von elektronischen bauelementen, insbesondere von integrierten halbleiterschaltungen. |
| US5345107A (en) * | 1989-09-25 | 1994-09-06 | Hitachi, Ltd. | Cooling apparatus for electronic device |
| DE3935662C2 (de) * | 1989-10-26 | 1997-08-28 | Bosch Gmbh Robert | Auf einem Substrat angeordnete elektronische Schaltung |
| US5000256A (en) * | 1990-07-20 | 1991-03-19 | Minnesota Mining And Manufacturing Company | Heat transfer bag with thermal via |
| JPH04206555A (ja) * | 1990-11-30 | 1992-07-28 | Hitachi Ltd | 電子機器の冷却装置 |
| JP3017837B2 (ja) * | 1991-05-31 | 2000-03-13 | 株式会社日立製作所 | 電子機器装置 |
| JPH0590461A (ja) * | 1991-09-25 | 1993-04-09 | Hitachi Ltd | 電子装置 |
| DE4336961C2 (de) * | 1993-10-29 | 2000-07-06 | Kerafol Keramische Folien Gmbh | Flexible Wärmeübertragungsvorrichtung |
-
1996
- 1996-02-13 AT AT0025096A patent/AT404532B/de not_active IP Right Cessation
-
1997
- 1997-01-28 FR FR9700889A patent/FR2744873A1/fr not_active Withdrawn
- 1997-01-30 GB GB9701856A patent/GB2310321A/en not_active Withdrawn
- 1997-02-06 DE DE19704549A patent/DE19704549A1/de not_active Ceased
- 1997-02-11 IT IT97MI000270A patent/IT1290293B1/it active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| DE19704549A1 (de) | 1997-08-14 |
| IT1290293B1 (it) | 1998-10-22 |
| GB9701856D0 (en) | 1997-03-19 |
| GB2310321A (en) | 1997-08-20 |
| ITMI970270A1 (it) | 1998-08-11 |
| FR2744873A1 (fr) | 1997-08-14 |
| AT404532B (de) | 1998-12-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| ATA25096A (de) | Kühlkörper für elektrische und elektronische bauelemente | |
| DE69528897D1 (de) | Elektrische bauelemente | |
| ATE282249T1 (de) | Kühlkörper für elektronische bauelemente | |
| DE59504639D1 (de) | Verkapselung für elektronische bauelemente | |
| DE69821779D1 (de) | Kühlmodul für elektronische bauelemente | |
| DE69400127D1 (de) | Wärmeaustauscher für elektronische Bauteile und elektrische Apparate | |
| DE69909252D1 (de) | Bestückungsvorrichtung für elektronische bauteile | |
| DE69710714D1 (de) | Elektronische bauteile bestückungsvorrichtung | |
| DE69728742D1 (de) | Elektronisches Kühlgerät | |
| DE59700703D1 (de) | Geräteschrank für elektrische und elektronische systeme | |
| DE69706309D1 (de) | Zuführungseinrichtung und bestückungsvorrichtung für elektronische bauteile | |
| EP0843404A4 (de) | Elektrische schaltung | |
| DE69405209D1 (de) | Verbindungsvorrichtung für elektronische Halbleiter-Einheiter | |
| DE59700682D1 (de) | Abschirmgehäuse für elektronische Bauelemente | |
| DE10085150T1 (de) | Befestigungsverfahren und -vorrichtung für elektrische Komponenten | |
| NO985566D0 (no) | Anordning for kobling av elektriske kretser | |
| DE69827304D1 (de) | Elektronische baugruppe mit kühlelementen für elektronische bauelemente | |
| DE59806101D1 (de) | Gehäuse für elektrische bauelemente | |
| DE69912589D1 (de) | Gerät und geräteaufbau zur prüfung von elektronischen bausteinen | |
| DE69935633D1 (de) | Elektronische Vorrichtung und elektrischer Steckverbinder dafür | |
| DE69834701D1 (de) | Elektrische schaltung, halbleiter, elektronische vorrichtung und taktgenerator | |
| DE69811950D1 (de) | Elektronische überwachungsschaltung für elektrische spannung | |
| DE60023381D1 (de) | Bestückungskopf für elektronische Bauelemente und Bestückungsvorrichtung | |
| DE60018193D1 (de) | Befestigungsvorrichtung für elektrische bauelemente | |
| DE69707867D1 (de) | Schaltvorrichtung für elektrische Schaltungen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ELJ | Ceased due to non-payment of the annual fee | ||
| REN | Ceased due to non-payment of the annual fee |