FR2811476B1 - Dispositif electronique avec encapsulant thermiquement conducteur - Google Patents

Dispositif electronique avec encapsulant thermiquement conducteur

Info

Publication number: FR2811476B1
Authority: FR; France
Prior art keywords: electronic device; thermally conductive; conductive encapsulant; encapsulant; thermally
Prior art date: 2000-07-07
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

FR0008916A

Other languages

English (en)

Other versions

FR2811476A1 (fr

Inventor

Nicolas Guiragossian

Catherine Dupin

Christophe Venencie

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Thales SA

Original Assignee

Thomson CSF SA

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2000-07-07

Filing date

2000-07-07

Publication date

2002-12-06

2000-07-07 Application filed by Thomson CSF SA filed Critical Thomson CSF SA

2000-07-07 Priority to FR0008916A priority Critical patent/FR2811476B1/fr

2001-07-06 Priority to EP01984192A priority patent/EP1299907A1/fr

2001-07-06 Priority to PCT/FR2001/002187 priority patent/WO2002005346A1/fr

2001-07-06 Priority to US10/432,034 priority patent/US6924559B2/en

2002-01-11 Publication of FR2811476A1 publication Critical patent/FR2811476A1/fr

2002-12-06 Application granted granted Critical

2002-12-06 Publication of FR2811476B1 publication Critical patent/FR2811476B1/fr

2020-07-07 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/70—Fillings or auxiliary members in containers or in encapsulations for thermal protection or control
- H10W40/77—Auxiliary members characterised by their shape
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

FR0008916A 2000-07-07 2000-07-07 Dispositif electronique avec encapsulant thermiquement conducteur Expired - Fee Related FR2811476B1 (fr)

Priority Applications (4)

Application Number	Priority Date	Filing Date	Title
FR0008916A FR2811476B1 (fr)	2000-07-07	2000-07-07	Dispositif electronique avec encapsulant thermiquement conducteur
EP01984192A EP1299907A1 (fr)	2000-07-07	2001-07-06	Dispositif electronique avec encapsulant thermiquement conducteur
PCT/FR2001/002187 WO2002005346A1 (fr)	2000-07-07	2001-07-06	Dispositif electronique avec encapsulant thermiquement conducteur
US10/432,034 US6924559B2 (en)	2000-07-07	2001-07-06	Electronic device with heat conductive encasing device

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
FR0008916A FR2811476B1 (fr)	2000-07-07	2000-07-07	Dispositif electronique avec encapsulant thermiquement conducteur

Publications (2)

Publication Number	Publication Date
FR2811476A1 FR2811476A1 (fr)	2002-01-11
FR2811476B1 true FR2811476B1 (fr)	2002-12-06

Family

ID=8852261

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR0008916A Expired - Fee Related FR2811476B1 (fr)	2000-07-07	2000-07-07	Dispositif electronique avec encapsulant thermiquement conducteur

Country Status (4)

Country	Link
US (1)	US6924559B2 (fr)
EP (1)	EP1299907A1 (fr)
FR (1)	FR2811476B1 (fr)
WO (1)	WO2002005346A1 (fr)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US7288839B2 (en) *	2004-02-27	2007-10-30	International Business Machines Corporation	Apparatus and methods for cooling semiconductor integrated circuit package structures
CN102801253A (zh) *	2012-08-20	2012-11-28	常州新亚电机有限公司	一种电机与控制器组件
FR3049160B1 (fr) *	2016-03-15	2018-04-13	Aptiv Technologies Limited	Dispositif electronique et methode d'assemblage d'un tel dispositif
KR102603421B1 (ko) *	2019-01-22	2023-11-17	양쯔 메모리 테크놀로지스 씨오., 엘티디.	집적 회로 패키징 구조 및 그 제조 방법

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CA1102010A (fr) *	1977-08-12	1981-05-26	International Business Machines Corporation	Dissipateur thermique magnetique pour pastille a semiconducteur
JPS63107147A (ja) *	1986-10-24	1988-05-12	Hitachi Ltd	半導体装置
JPH02268458A (ja) *	1989-04-10	1990-11-02	Nec Corp	モールド封止型半導体集積回路
JPH0476944A (ja) *	1990-07-19	1992-03-11	Oki Electric Ind Co Ltd	半導体装置の放熱構造とその実装方法
JPH05109942A (ja) *	1991-10-14	1993-04-30	Oki Electric Ind Co Ltd	高放熱半導体装置の製造方法
AT404532B (de) *	1996-02-13	1998-12-28	Electrovac	Kühlkörper für elektrische und elektronische bauelemente
US5726079A (en) *	1996-06-19	1998-03-10	International Business Machines Corporation	Thermally enhanced flip chip package and method of forming
US6104093A (en) *	1997-04-24	2000-08-15	International Business Machines Corporation	Thermally enhanced and mechanically balanced flip chip package and method of forming
US5909056A (en) *	1997-06-03	1999-06-01	Lsi Logic Corporation	High performance heat spreader for flip chip packages
DE19739591A1 (de) *	1997-09-10	1999-03-11	Wuerth Elektronik Gmbh & Co Kg	Recyclingfähige Leiterplatte, bestehend aus einem Folien- und Trägersystem
JP3931936B2 (ja) *	1998-05-11	2007-06-20	セイコーエプソン株式会社	マイクロレンズアレイ基板及びその製造方法並びに表示装置
JP3882339B2 (ja) *	1998-05-27	2007-02-14	日本軽金属株式会社	集積回路モジュール用放熱板及びその製造方法

2000
- 2000-07-07 FR FR0008916A patent/FR2811476B1/fr not_active Expired - Fee Related
2001
- 2001-07-06 US US10/432,034 patent/US6924559B2/en not_active Expired - Fee Related
- 2001-07-06 EP EP01984192A patent/EP1299907A1/fr not_active Withdrawn
- 2001-07-06 WO PCT/FR2001/002187 patent/WO2002005346A1/fr not_active Ceased

Also Published As

Publication number	Publication date
FR2811476A1 (fr)	2002-01-11
WO2002005346A1 (fr)	2002-01-17
EP1299907A1 (fr)	2003-04-09
US20040026798A1 (en)	2004-02-12
US6924559B2 (en)	2005-08-02

Legal Events

Date	Code	Title	Description
2002-09-27	CD	Change of name or company name
2011-04-22	ST	Notification of lapse	Effective date: 20110331

Publication	Publication Date	Title
EP1174930A4 (fr)	2005-08-17	Dispositif de puce electroluminescent avec boitier
FR2809281B1 (fr)	2002-07-12	Dispositif electronique de puissance
EP1162532A4 (fr)	2009-11-04	Appareil electronique
EP1357598A4 (fr)	2007-10-10	Dispositif semi-conducteur et dispositif electronique portatif
EP1231640A4 (fr)	2008-10-08	Dispositif semi-conducteur
DE60138584D1 (de)	2009-06-18	Elektronisches Gerät mit Kartenschnittstelle
DE60317158D1 (de)	2007-12-13	Elektronische vorrichtung mit kommunikationsfähigkeit
EP1716643A4 (fr)	2007-01-31	Dispositif electronique a touche captant l'effort
FR2817658B1 (fr)	2009-07-17	Dispositif semi-conducteur
EP1550582A4 (fr)	2005-12-21	Dispositif electronique
EP0977297A4 (fr)	2000-02-16	Dispositif electronique
EP1670059A4 (fr)	2010-06-09	Circuit de protection de dispositif semi-conducteur et dispositif semi-conducteur correspondant
NO20022736D0 (no)	2002-06-07	Kretsinnkapsling med en integrert dobbelbrikke
EP1111496A4 (fr)	2004-12-08	Processeur electronique avec interface menu
EP1394864A4 (fr)	2010-09-29	Dispositif photoemetteur
FR2832241B1 (fr)	2004-04-09	Dispositif tracable par un identifiant electronique
EP0932250A4 (fr)	2004-04-07	Dispositif electronique
DE50103923D1 (de)	2004-11-04	Elektronik-anordnung
ITTO20010455A0 (it)	2001-05-17	Dispositivo elettronico.
EP1662657A4 (fr)	2007-01-03	Circuit recepteur, circuit d'interface et dispositif electronique
EP1349210A4 (fr)	2005-03-09	Puits thermique et dispositif electronique avec puits thermique
EP1583126A4 (fr)	2006-10-04	Raccord terminal de dispositif electronique
EP1668898A4 (fr)	2009-11-25	Dispositif electronique a structure d'encadrement
EP1851802A4 (fr)	2012-07-25	Circuit de protection de systeme electrique et/ou electronique au moyen d'un dispositif de transition metal-isolant abrupt et systeme electrique et/ou electronique comprenant ce circuit
EP1381088A4 (fr)	2004-07-07	Dispositif semi-conducteur