ATE109218T1 - Verfahren zur metallplattierung. - Google Patents

Verfahren zur metallplattierung.

Info

Publication number
ATE109218T1
ATE109218T1 AT87112337T AT87112337T ATE109218T1 AT E109218 T1 ATE109218 T1 AT E109218T1 AT 87112337 T AT87112337 T AT 87112337T AT 87112337 T AT87112337 T AT 87112337T AT E109218 T1 ATE109218 T1 AT E109218T1
Authority
AT
Austria
Prior art keywords
contact
residues
oxidant
board
neutralizes
Prior art date
Application number
AT87112337T
Other languages
English (en)
Inventor
Gary Morgan Wilkinson
Cheryl Ann Deckert
Jeffrey J Doubrava
Original Assignee
Shipley Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shipley Co filed Critical Shipley Co
Application granted granted Critical
Publication of ATE109218T1 publication Critical patent/ATE109218T1/de

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0055—After-treatment, e.g. cleaning or desmearing of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)
  • Superconductors And Manufacturing Methods Therefor (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AT87112337T 1986-09-25 1987-08-25 Verfahren zur metallplattierung. ATE109218T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/911,453 US4751106A (en) 1986-09-25 1986-09-25 Metal plating process

Publications (1)

Publication Number Publication Date
ATE109218T1 true ATE109218T1 (de) 1994-08-15

Family

ID=25430258

Family Applications (1)

Application Number Title Priority Date Filing Date
AT87112337T ATE109218T1 (de) 1986-09-25 1987-08-25 Verfahren zur metallplattierung.

Country Status (5)

Country Link
US (1) US4751106A (de)
EP (1) EP0261424B1 (de)
JP (1) JPS6389674A (de)
AT (1) ATE109218T1 (de)
DE (1) DE3750282T2 (de)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8613960D0 (en) * 1986-06-09 1986-07-16 Omi International Gb Ltd Treating laminates
ATA200888A (de) * 1987-08-11 1993-07-15 Schering Ag Konditionierungsmittel für gedruckte schaltungen
DE3816494A1 (de) * 1988-05-10 1989-11-16 Schering Ag Loesung und verfahren zum aetzen und aktivieren von isolierenden oberflaechen
IT1232863B (it) * 1989-06-27 1992-03-05 Alfachimici Spa Procedimento a ciclo ridotto per la fabbricazione di circuiti stampati, e composizione per la sua attuazione
US5213840A (en) * 1990-05-01 1993-05-25 Macdermid, Incorporated Method for improving adhesion to polymide surfaces
US5453401A (en) * 1991-05-01 1995-09-26 Motorola, Inc. Method for reducing corrosion of a metal surface containing at least aluminum and copper
US5328561A (en) * 1992-07-10 1994-07-12 Macdermid Incorporated Microetchant for copper surfaces and processes for using same
EP1054081B1 (de) * 1993-03-18 2006-02-01 ATOTECH Deutschland GmbH Sich selbstbeschleunigendes und sich selbst auffrischendes Verfahren zur Tauchbeschichtung ohne Formaldehyd, sowie die entsprechende Zusammensetzung
US6117250A (en) * 1999-02-25 2000-09-12 Morton International Inc. Thiazole and thiocarbamide based chemicals for use with oxidative etchant solutions
US6444140B2 (en) 1999-03-17 2002-09-03 Morton International Inc. Micro-etch solution for producing metal surface topography
US20040099637A1 (en) * 2000-06-16 2004-05-27 Shipley Company, L.L.C. Composition for producing metal surface topography
US20030178391A1 (en) * 2000-06-16 2003-09-25 Shipley Company, L.L.C. Composition for producing metal surface topography
TW529090B (en) * 2001-04-04 2003-04-21 Koninkl Philips Electronics Nv Back-end metallisation process
US6645557B2 (en) 2001-10-17 2003-11-11 Atotech Deutschland Gmbh Metallization of non-conductive surfaces with silver catalyst and electroless metal compositions
FR2839982B1 (fr) * 2002-05-22 2005-04-15 Centre Nat Rech Scient Composition de precurseur pour le depot de cuivre sur un support
JP2005223065A (ja) * 2004-02-04 2005-08-18 Seiko Epson Corp 配線基板の製造方法及び電子デバイスの製造方法
US7664983B2 (en) * 2004-08-30 2010-02-16 Symantec Corporation Systems and methods for event driven recovery management
KR20060128739A (ko) * 2005-06-10 2006-12-14 엔쏜 인코포레이티드 비-전도성 기판의 직접적인 금속화 방법
EP2379223A2 (de) 2008-12-22 2011-10-26 Basf Se Katalysatorformkörper und verfahren zur herstellung von maleinsäureanhydrid
DE102010012204B4 (de) * 2010-03-19 2019-01-24 MacDermid Enthone Inc. (n.d.Ges.d. Staates Delaware) Verbessertes Verfahren zur Direktmetallisierung von nicht leitenden Substraten
EP2444522B1 (de) * 2010-10-21 2017-04-05 Rohm and Haas Electronic Materials LLC Stabile Nanopartikel zur elektrofreien Plattierung
JP2012127003A (ja) 2010-12-15 2012-07-05 Rohm & Haas Electronic Materials Llc 銅層を均一にする電気めっき方法
JP2012256872A (ja) * 2011-05-12 2012-12-27 Rohm & Haas Electronic Materials Llc 誘電体への金属の接着促進
EP2853619A1 (de) * 2013-09-25 2015-04-01 ATOTECH Deutschland GmbH Verfahren zur Behandlung von vertieften Strukturen in dielektrischen Materialien für die Abstrichentfernung

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3011920A (en) * 1959-06-08 1961-12-05 Shipley Co Method of electroless deposition on a substrate and catalyst solution therefor
US3615736A (en) * 1969-01-06 1971-10-26 Enthone Electroless copper plating bath
US3720525A (en) * 1971-08-16 1973-03-13 Rca Corp Electroless copper plating solutions with accelerated plating rates
DE2418654A1 (de) * 1974-04-18 1975-11-06 Langbein Pfanhauser Werke Ag Verfahren zum stromlosen oberflaechenmetallisieren von kunststoffgegenstaenden und fuer die durchfuehrung des verfahrens geeignetes aktivierungsbad
JPS5178743A (ja) * 1974-12-30 1976-07-08 Hitachi Ltd Mudenkaidometsukieki
SU663753A1 (ru) * 1977-03-15 1979-05-25 Предприятие П/Я А-3611 Раствор дл химического меднени диэлектриков
US4450191A (en) * 1982-09-02 1984-05-22 Omi International Corporation Ammonium ions used as electroless copper plating rate controller
US4419183A (en) * 1983-01-18 1983-12-06 Shipley Company Inc. Etchant
US4481236A (en) * 1983-05-02 1984-11-06 General Motors Corporation Life extension of catalyst predip baths
US4554182A (en) * 1983-10-11 1985-11-19 International Business Machines Corporation Method for conditioning a surface of a dielectric substrate for electroless plating
US4515829A (en) * 1983-10-14 1985-05-07 Shipley Company Inc. Through-hole plating

Also Published As

Publication number Publication date
DE3750282T2 (de) 1995-02-16
EP0261424A2 (de) 1988-03-30
EP0261424B1 (de) 1994-07-27
DE3750282D1 (de) 1994-09-01
EP0261424A3 (en) 1988-09-28
JPS6389674A (ja) 1988-04-20
US4751106A (en) 1988-06-14

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Legal Events

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