ATE111676T1 - Vorrichtung zum behandeln von plattenförmigen gegenständen, insbesondere leiterplatten. - Google Patents

Vorrichtung zum behandeln von plattenförmigen gegenständen, insbesondere leiterplatten.

Info

Publication number
ATE111676T1
ATE111676T1 AT92110315T AT92110315T ATE111676T1 AT E111676 T1 ATE111676 T1 AT E111676T1 AT 92110315 T AT92110315 T AT 92110315T AT 92110315 T AT92110315 T AT 92110315T AT E111676 T1 ATE111676 T1 AT E111676T1
Authority
AT
Austria
Prior art keywords
treatment
circuit boards
plate
particular circuit
surge
Prior art date
Application number
AT92110315T
Other languages
English (en)
Inventor
Christian Schmid
Original Assignee
Schmid Gmbh & Co Geb
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Schmid Gmbh & Co Geb filed Critical Schmid Gmbh & Co Geb
Application granted granted Critical
Publication of ATE111676T1 publication Critical patent/ATE111676T1/de

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0621—In horizontal cells
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
    • B05B14/00—Arrangements for collecting, re-using or eliminating excess spraying material
    • B05B14/30—Arrangements for collecting, re-using or eliminating excess spraying material comprising enclosures close to, or in contact with, the object to be sprayed and surrounding or confining the discharged spray or jet but not the object to be sprayed
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/08—Apparatus, e.g. for photomechanical printing surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/04—Removal of gases or vapours ; Gas or pressure control
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C25D7/0685—Spraying of electrolyte
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F7/00—Constructional parts, or assemblies thereof, of cells for electrolytic removal of material from objects; Servicing or operating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0085—Apparatus for treatments of printed circuits with liquids not provided for in groups H05K3/02 - H05K3/46; conveyors and holding means therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrochemistry (AREA)
  • Sustainable Development (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Chemically Coating (AREA)
  • Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
AT92110315T 1991-06-26 1992-06-18 Vorrichtung zum behandeln von plattenförmigen gegenständen, insbesondere leiterplatten. ATE111676T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4121032A DE4121032A1 (de) 1991-06-26 1991-06-26 Vorrichtung zum behandeln von plattenfoermigen gegenstaenden, insbesondere leiterplatten

Publications (1)

Publication Number Publication Date
ATE111676T1 true ATE111676T1 (de) 1994-09-15

Family

ID=6434742

Family Applications (1)

Application Number Title Priority Date Filing Date
AT92110315T ATE111676T1 (de) 1991-06-26 1992-06-18 Vorrichtung zum behandeln von plattenförmigen gegenständen, insbesondere leiterplatten.

Country Status (5)

Country Link
US (1) US5335681A (de)
EP (1) EP0520324B1 (de)
AT (1) ATE111676T1 (de)
DE (2) DE4121032A1 (de)
ES (1) ES2060437T3 (de)

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CN102453915B (zh) * 2010-10-27 2014-03-12 富葵精密组件(深圳)有限公司 蚀刻装置及使用该蚀刻装置蚀刻基板的方法
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CN103639089A (zh) * 2013-11-14 2014-03-19 上海和辉光电有限公司 显影剂喷涂装置及方法
EP3072994B1 (de) * 2015-03-27 2018-08-08 ATOTECH Deutschland GmbH Überflutungsvorrichtung für eine horizontale galvanische oder nasschemische prozesslinie zur metallabscheidung auf einem substrat
CN104741333B (zh) * 2015-04-07 2017-04-05 合肥鑫晟光电科技有限公司 一种气流控制装置及其调节方法、基板清洗设备
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CN120885399B (zh) * 2025-10-10 2025-12-30 江苏荣进电子有限公司 一种卧式铜箔涂胶干燥生产线的涂布结构

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Also Published As

Publication number Publication date
DE59200493D1 (de) 1994-10-20
EP0520324A1 (de) 1992-12-30
US5335681A (en) 1994-08-09
DE4121032A1 (de) 1993-01-07
ES2060437T3 (es) 1994-11-16
EP0520324B1 (de) 1994-09-14

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